CN115209655A - Display module and electronic device - Google Patents
Display module and electronic device Download PDFInfo
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- CN115209655A CN115209655A CN202210785860.5A CN202210785860A CN115209655A CN 115209655 A CN115209655 A CN 115209655A CN 202210785860 A CN202210785860 A CN 202210785860A CN 115209655 A CN115209655 A CN 115209655A
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- display panel
- display module
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- 238000005452 bending Methods 0.000 claims description 28
- 239000006260 foam Substances 0.000 claims description 25
- 229910052751 metal Inorganic materials 0.000 claims description 13
- 239000002184 metal Substances 0.000 claims description 13
- 239000000853 adhesive Substances 0.000 claims description 8
- 230000001070 adhesive effect Effects 0.000 claims description 8
- 230000003287 optical effect Effects 0.000 claims description 7
- 239000004642 Polyimide Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 229920001721 polyimide Polymers 0.000 description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- 229910002804 graphite Inorganic materials 0.000 description 3
- 239000010439 graphite Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000013003 hot bending Methods 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- 238000004904 shortening Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000003190 augmentative effect Effects 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 239000004984 smart glass Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/03—Covers
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The embodiment of the application discloses a display module and an electronic device, wherein the display module comprises a display panel, a cover plate and a circuit board, and a first conducting layer is arranged on the side surface of the display panel; the cover plate comprises a main body part, a bent part and a second conductive layer, the main body part is arranged on the light emergent side of the display panel, the bent part is connected with the main body part in a bent mode, the bent part is arranged on the side face of the display panel, the second conductive layer is arranged on one side, close to the display panel, of the bent part, and the second conductive layer is electrically connected with the first conductive layer; the circuit board is arranged on one side, far away from the main body part, of the display panel, and the circuit board is electrically connected with the second conducting layer, so that the technical problem that the display module is difficult to realize narrow-frame design can be solved.
Description
Technical Field
The application relates to the field of display, in particular to a display module and an electronic device.
Background
With the progress of science and technology, consumers are pursuing display products with exquisite experience, wherein narrow-bezel display screens increasingly attract the eyes of people. The narrow-frame display screen not only can obtain larger display area in limited space, but also can enable people to have an immersion feeling on pictures when watching.
As shown in fig. 1, the display module includes a display panel 1, a chip on film 2 and a cover plate 3, the chip on film 2 is usually bound to a frame of the display panel 1, and the frame of the display panel 1 is bent to the back side, so that the chip on film 2 is located on the back side of the display panel 1, thereby implementing a narrow frame design. However, in the course of research and practice on the prior art, the inventors of the present application found that the above-described narrow bezel scheme has the following problems: display panel 1 is after buckling, there is the region of buckling, the region of buckling is unable luminous, in order to shelter from this region, apron 3 need extend to the region of buckling, lead to the display area of display panel 1 and apron 3 to extend to the distance between the edge of the region of buckling unable the shortening, make the width that display module corresponds the frame (being the lower frame) of the region of buckling unable the shortening to with last frame, the same width of left frame and right frame, influence the holistic pleasing to the eye degree of display screen.
Therefore, a technical solution for further implementing the narrow bezel design is needed.
Disclosure of Invention
The embodiment of the application provides a display module and an electronic device, and the technical problem that the display module is difficult to realize narrow frame design can be solved.
The embodiment of the application provides a display module assembly, include:
the display panel is provided with a first conductive layer on the side surface;
the cover plate comprises a main body part, a bent part and a second conducting layer, the main body part is arranged on the light emitting side of the display panel, the bent part is connected with the main body part in a bent mode, the bent part is arranged on the side face of the display panel, the second conducting layer is arranged on one side, close to the display panel, of the bent part, and the second conducting layer is electrically connected with the first conducting layer; and
the circuit board is arranged on one side of the display panel, which is far away from the main body part, and the circuit board is electrically connected with the second conducting layer.
Optionally, in some embodiments of the present application, the first conductive layer includes a plurality of first conductive pads arranged at intervals, the second conductive layer includes a plurality of second conductive pads arranged at intervals, the circuit board is provided with a plurality of third conductive pads arranged at intervals, and the first conductive pads are electrically connected to the corresponding third conductive pads through the corresponding second conductive pads.
Optionally, in some embodiments of the present application, in a stacking direction of the main body portion and the display panel, a length of the second conductive pad is greater than a length of the first conductive pad.
Optionally, in some embodiments of the application, a sinking groove is disposed on one side of the bending portion close to the display panel, the second conductive layer is disposed in the sinking groove, and the surface of the second conductive layer close to the display panel is convexly disposed outside the sinking groove.
Optionally, in some embodiments of the application, a plurality of the sinking grooves are disposed on one side of the bending portion close to the display panel, and the sinking grooves correspond to the second conductive pads one to one; or,
one side of the bending part, which is close to the display panel, is provided with a plurality of sinking grooves, and a plurality of second conducting pads are arranged in the sinking grooves at intervals.
Optionally, in some embodiments of the present application, a thickness of the main body portion is greater than or equal to a thickness of the bending portion.
Optionally, in some embodiments of the present application, the display module further includes a polarizer and an optical adhesive, the polarizer is disposed on one side of the display panel close to the cover plate, and the optical adhesive is disposed between the cover plate and the polarizer.
Optionally, in some embodiments of the present application, the display module further includes a back plate and an ultra-clean foam assembly, the back plate is disposed on one side of the display panel away from the cover plate, and the ultra-clean foam assembly is disposed on one side of the back plate away from the display panel; the circuit board is arranged on one side, far away from the back plate, of the ultra-clean foam component.
Optionally, in some embodiments of the present application, the ultra-clean foam assembly includes a foam layer and a metal layer, the metal layer is disposed on one side of the back plate away from the cover plate, and the foam layer is disposed between the metal layer and the display panel.
The embodiment of the application further provides an electronic device, which comprises the display module.
The embodiment of the application adopts a display module and an electronic device, wherein a first conductive layer is arranged on the side surface of a display panel, the edge of a cover plate is bent to the side surface of the display panel to form a bent part provided with a second conductive layer, and the second conductive layer is connected with the first conductive layer and a circuit board on the back surface of the display panel; in addition, the edge of the cover plate is bent to form a bent part, so that the bent part of the cover plate can be close to the display area of the display panel as much as possible, and the frame of the display module is further reduced.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
FIG. 1 is a schematic cross-sectional view of a conventional display module;
fig. 2 is a schematic cross-sectional structural view of a first display module provided in an embodiment of the present application;
fig. 3 is a schematic plan view of a first conductive layer provided in an embodiment of the present application;
fig. 4 is a schematic plane distribution diagram of a second conductive layer provided in an embodiment of the present application;
FIG. 5 is a schematic diagram of a first conductive layer and a second conductive layer provided in an embodiment of the present application;
fig. 6 is a schematic cross-sectional structural view of a second display module provided in this application;
fig. 7 is a schematic cross-sectional structure diagram of a third display module provided in the embodiment of the present application;
FIG. 8 is a schematic cross-sectional structural view of an ultra-clean foam assembly provided in an embodiment of the present application;
fig. 9 is a schematic cross-sectional structural diagram of an electronic device provided in an embodiment of the present application.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application. Furthermore, it should be understood that the detailed description and specific examples, while indicating exemplary embodiments of the invention, are given by way of illustration and explanation only, and are not intended to limit the scope of the invention. In the present application, unless indicated to the contrary, the use of the directional terms "upper" and "lower" generally refer to the upper and lower positions of the device in actual use or operation, and more particularly to the orientation of the figures of the drawings; while "inner" and "outer" are with respect to the outline of the device.
The embodiment of the application provides a display module and an electronic device. The following are detailed below. It should be noted that the following description of the embodiments is not intended to limit the preferred order of the embodiments.
Referring to fig. 2, an embodiment of the present disclosure provides a display module 10, which includes a display panel 11, a first conductive layer 111 is disposed on a side surface of the display panel 11, and the first conductive layer 111 is made of a conductive material, which may be, but not limited to, a conductive silver paste or an anisotropic conductive adhesive. In this embodiment, the display panel 11 is provided with signal traces (not shown), and the first conductive layer 111 is electrically connected to the signal traces, so that the signal traces can transmit signals through the first conductive layer 111.
Specifically, the display module 10 further includes a cover 12, the cover 12 includes a main body 121, a bending portion 122, and a second conductive layer 123, and the main body 121 is disposed on the light emitting side of the display panel 11. The bent portion 122 is connected to the main body portion 121 in a bent manner, and an included angle between the bent portion 122 and the main body portion 121 may be, but is not limited to, 90 °. The bending portion 122 is disposed on a side surface of the display panel 11. The material of the second conductive layer 123 is a conductive material, and may be, but is not limited to, a conductive silver paste or an anisotropic conductive paste. The second conductive layer 123 is disposed on a side of the bending portion 122 close to the display panel 11, and the second conductive layer 123 is electrically connected to the first conductive layer 111, that is, the whole second conductive layer 123 is disposed on a surface of the bending portion 122 close to the display panel 11, and a part of the second conductive layer 123 contacts the first conductive layer 111, so that the second conductive layer 123 is electrically connected to the first conductive layer 111. The second conductive layer 123 may be used to transmit signals for the first conductive layer 111.
In this embodiment, the cover 12 is provided with a bending portion 122, the bending portion 122 is connected to one side of the main body portion 121, and the bending portion 122 is provided on a side surface of the display panel 11, however, depending on the selection of the actual situation and the specific requirement, the cover 12 may also be provided with two or more bending portions 122, and different bending portions 122 are connected to different sides of the main body portion 121, which is not limited herein.
Specifically, the display module 10 further includes a circuit board 13, and the circuit board 13 may be, but is not limited to, a flexible circuit board 13. The circuit board 13 is disposed on a side of the display panel 11 away from the main body portion 121, and the circuit board 13 is electrically connected to the second conductive layer 123. Specifically, one end of the second conductive layer 123 may contact the first conductive layer 111, and the other end of the second conductive layer 123 contacts the circuit board 13, so that the circuit board 13 is electrically connected to the first conductive layer 111 through the second conductive layer 123, and further transmits signals for signal routing of the display panel 11. In this embodiment, the circuit board 13 may be provided with a chip 132.
Under this structure, compared with the existing narrow frame design, the display panel 11 of the embodiment of the present application has no bending region, and the cover plate 12 can save the portion extending to the bending region, so that the edge of the cover plate 12 can contract inward, thereby reducing the frame 102 of the display module 10. In addition, the edge of the cover 12 is bent to form the bent portion 122, so that the bent portion 122 of the cover 12 can be as close to the display area 101 of the display panel 11 as possible, and the bezel 102 of the display module 10 is further reduced. In this embodiment, the bending portion 122 is located below the main body portion 121, so the lower frame of the display module 10 is smaller.
Specifically, referring to fig. 2 and fig. 3, the display panel 11 has a plurality of signal traces, the first conductive layer 111 includes a plurality of first conductive pads 1111 disposed at intervals, the signal traces correspond to the first conductive pads 1111 one to one, and each signal trace is connected to one of the first conductive pads 1111. Of course, the number of the first conductive pads 1111 connected to each signal trace may be appropriately adjusted according to the selection and the specific requirement of the actual situation, and is not limited herein.
Specifically, referring to fig. 2 to fig. 5, the second conductive layer 123 includes a plurality of second conductive pads 1231 disposed at intervals, the second conductive pads 1231 correspond to the first conductive pads 1111 one by one, and each of the second conductive pads 1231 is electrically connected to the corresponding first conductive pad 1111.
Specifically, referring to fig. 2 to 5, the circuit board 13 is provided with a plurality of third conductive pads 131 arranged at intervals, and the first conductive pad 1111 is electrically connected to the corresponding third conductive pad 131 through the corresponding second conductive pad 1231, so that the circuit board 13 is electrically connected to the first conductive pad 1111 through the third conductive pad 131 and the second conductive pad 1231, and further transmits signals for signal routing of the display panel 11. In this embodiment, the third conductive pads 131 correspond to the second conductive pads 1231 one by one, and each of the third conductive pads 131 is electrically connected to the corresponding second conductive pad 1231. In this structure, the first conductive pad 1111 is bonded to the second conductive pad 1231, and the second conductive pad 1231 is bonded to the third conductive pad 131, so that the circuit board 13 can be electrically connected to the array substrate of the display panel 11 only by two bonding processes.
It should be noted that, in the display module 10 according to the embodiment of the present application, the display panel 11 and the main body portion 121 of the cover 12 are stacked along the first direction Y, the bent portion 122 is disposed on the side surface of the display panel 11 along the second direction X, and the first conductive pads 1111 of the first conductive layer 111 are sequentially disposed at intervals along the third direction Z, where the first direction Y, the second direction X and the third direction Z intersect with each other.
Optionally, any two directions of the first direction Y, the second direction X and the third direction Z are perpendicular to each other. Of course, according to the selection of the actual situation and the specific requirement, the included angle between any two directions of the first direction Y, the second direction X, and the third direction Z may be properly adjusted, and is not limited herein.
Specifically, in the stacking direction of the main body portion 121 and the display panel 11, the length of the second conductive pad 1231 is greater than the length of the first conductive pad 1111, that is, the length of the second conductive pad 1231 in the first direction Y is greater than the length of the first conductive pad 1111 in the first direction Y, so that the second conductive pad 1231 can be simultaneously connected to the first conductive pad 1111 and the third conductive pad 131, and the first conductive pad 1111 is electrically connected to the corresponding third conductive pad 131 through the corresponding second conductive pad 1231.
Specifically, as shown in fig. 6, a sinking groove 1221 is disposed on one side of the bending portion 122 close to the display panel 11, the second conductive layer 123 is disposed in the sinking groove 1221, and the surface of the second conductive layer 123 close to the display panel 11 is protruded out of the sinking groove 1221, that is, the bottom of the second conductive layer 123 is embedded in the sinking groove 1221, and the top of the second conductive layer 123 is protruded out of the sinking groove 1221. Under this structure, the frame 102 of the display module 10 can be ensured to be unchanged on the basis of increasing the thickness of the second conductive layer 123, which can not only improve the voltage drop phenomenon of the second conductive layer 123, but also be beneficial to the narrow frame design of the display module 10. In this embodiment, the second conductive pad 1231 is disposed in the sinking groove 1221, and the surface of the second conductive pad 1231 close to the display panel 11 is protruded out of the sinking groove 1221, that is, the bottom of the second conductive pad 1231 is embedded in the sinking groove 1221, and the top of the second conductive pad 1231 is protruded out of the sinking groove 1221.
Specifically, a plurality of sinking grooves 1221 are disposed on one side of the bending portion 122 close to the display panel 11, the sinking grooves 1221 correspond to the second conductive pads 1231 one to one, and different second conductive pads 1231 are disposed in different sinking grooves 1221. Certainly, according to the selection of the actual situation and the specific requirement, the side of the bending portion 122 close to the display panel 11 is provided with a plurality of sinking grooves 1221, and a plurality of second conductive pads 1231 are spaced in one sinking groove 1221, that is, one sinking groove 1221 corresponds to a plurality of second conductive pads 1231, which can also improve the voltage drop phenomenon and implement the narrow frame design, and is not limited herein.
Specifically, as shown in fig. 7, the thickness D1 of the main body portion is greater than the thickness D2 of the bent portion. With this structure, the frame 102 of the display module 10 can be further reduced, which is beneficial to realizing the frameless design of the display module 10. In this embodiment, the molding process of the cover plate 12 may be injection molding or hot bending, specifically, the cover plate 12 having the main body portion 121 and the bending portion 122 is formed by injection molding, the main body portion 121 and the bending portion have different thicknesses, and the bending portion 122 is bent to one side of the main body portion 121 by hot bending. Of course, according to the selection and specific requirement of the actual situation, as shown in fig. 6, the thickness D1 of the main body portion may be equal to the thickness D2 of the bending portion, which is not limited herein.
Specifically, a sinking groove 1221 is disposed on one side of the bending portion 122 close to the display panel 11, the second conductive layer 123 is disposed in the sinking groove 1221, the surface of the second conductive layer 123 close to the display panel 11 is protruded outside the sinking groove 1221, and a thickness D1 of the main body portion is greater than or equal to a thickness D2 of the bending portion. With this structure, the voltage drop of the second conductive layer 123 can be improved, and the narrow frame (even no frame) design of the display module 10 is facilitated.
Specifically, the display module 10 further includes a polarizer 14 and an optical adhesive 15, the polarizer 14 is disposed on one side of the display panel 11 close to the cover plate 12, and the optical adhesive 15 is disposed between the cover plate 12 and the polarizer 14. In this structure, the polarizer 14 is attached to the display panel 11, and the cover plate 12 is adhered to the polarizer 14 through the optical adhesive 15.
Specifically, the display module 10 further includes a back plate 16 and an ultra Clean Foam (SCF) assembly 17, the back plate 16 is disposed on one side of the display panel 11 away from the cover plate 12, and the SCF assembly 17 is disposed on one side of the back plate 16 away from the display panel 11; the circuit board 13 is disposed on a side of the ultra clean foam assembly 17 remote from the backing plate 16. With this structure, the back plate 16 can support the display panel 11, and the ultra-clean foam component 17 can buffer the display panel.
Specifically, as shown in fig. 2, 6, 7 and 8, the ultra-clean foam assembly 17 includes a foam layer 171 and a metal layer 172, the foam layer 171 can play a role in buffering, the metal layer 172 can play a role in dissipating heat, the metal layer 172 is disposed on one side of the back plate 16 away from the cover plate 12, and the foam layer 171 is disposed between the metal layer 172 and the display panel 11. The metal layer 172 may be, but is not limited to, a copper layer.
Specifically, the ultra-clean foam assembly 17 further includes a polyimide layer 173, the polyimide layer 173 can reinforce to increase the reliability of the ultra-clean foam assembly 17, and the polyimide layer 173 is disposed between the foam layer 171 and the metal layer 172.
Specifically, the ultra-clean foam module 17 further includes a graphite layer 174, the graphite layer 174 can perform a reinforcing function to increase the reliability of the ultra-clean foam module 17, and the graphite layer 174 is disposed between the polyimide layer 173 and the metal layer 172.
Referring to fig. 9, an electronic device including the display module 10 is also provided in the embodiments of the present application. The electronic device may be a mobile terminal, such as a vehicle-mounted display, a smart phone, a tablet computer, a notebook computer, etc., or a wearable terminal, such as a smart watch, a smart bracelet, smart glasses, augmented reality equipment, etc., or a fixed terminal, such as a desktop computer, a television, etc. In this embodiment, the electronic device further includes a terminal body 20, the terminal body 20 is a housing, and the display module 10 is fixed on the terminal body 20.
The display module and the electronic device provided by the embodiment of the present application are described in detail above, and a specific example is applied to explain the principle and the implementation manner of the present application, and the description of the embodiment is only used to help understand the method and the core idea of the present application; meanwhile, for those skilled in the art, according to the idea of the present application, the specific implementation manner and the application scope may be changed, and in summary, the content of the present specification should not be construed as a limitation to the present application.
Claims (10)
1. A display module, comprising:
the display panel is provided with a first conductive layer on the side surface;
the cover plate comprises a main body part, a bent part and a second conducting layer, the main body part is arranged on the light emergent side of the display panel, the bent part is connected with the main body part in a bent mode, the bent part is arranged on the side face of the display panel, the second conducting layer is arranged on one side, close to the display panel, of the bent part, and the second conducting layer is electrically connected with the first conducting layer; and
the circuit board is arranged on one side of the display panel, which is far away from the main body part, and the circuit board is electrically connected with the second conducting layer.
2. The display module as claimed in claim 1, wherein the first conductive layer includes a plurality of first conductive pads disposed at intervals, the second conductive layer includes a plurality of second conductive pads disposed at intervals, the circuit board is provided with a plurality of third conductive pads disposed at intervals, and the first conductive pads are electrically connected to the corresponding third conductive pads through the corresponding second conductive pads.
3. The display module of claim 2, wherein the second conductive pad has a length greater than a length of the first conductive pad in a stacking direction of the main body and the display panel.
4. The display module according to claim 2, wherein a sunken groove is formed in one side of the bent portion adjacent to the display panel, the second conductive layer is disposed in the sunken groove, and a surface of the second conductive layer adjacent to the display panel is protruded out of the sunken groove.
5. The display module as claimed in claim 4, wherein the bending portion has a plurality of sinking grooves on a side thereof adjacent to the display panel, and the sinking grooves are in one-to-one correspondence with the second conductive pads; or,
one side of the bending part, which is close to the display panel, is provided with a plurality of sinking grooves, and a plurality of second conducting pads are arranged in the sinking grooves at intervals.
6. The display module according to any one of claims 1-5, wherein the thickness of the main body portion is greater than or equal to the thickness of the bending portion.
7. The display module according to any one of claims 1-5, wherein the display module further comprises a polarizer and an optical adhesive, the polarizer is disposed on a side of the display panel close to the cover plate, and the optical adhesive is disposed between the cover plate and the polarizer.
8. The display module according to any one of claims 1-5, wherein the display module further comprises a back plate and an ultra-clean foam component, the back plate is disposed on a side of the display panel away from the cover plate, and the ultra-clean foam component is disposed on a side of the back plate away from the display panel; the circuit board is arranged on one side, far away from the back plate, of the ultra-clean foam assembly.
9. The display module of claim 8, wherein the ultra-clean foam assembly comprises a foam layer and a metal layer, the metal layer is disposed on a side of the back plate away from the cover plate, and the foam layer is disposed between the metal layer and the display panel.
10. An electronic device, comprising the display module according to any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210785860.5A CN115209655A (en) | 2022-07-04 | 2022-07-04 | Display module and electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210785860.5A CN115209655A (en) | 2022-07-04 | 2022-07-04 | Display module and electronic device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115209655A true CN115209655A (en) | 2022-10-18 |
Family
ID=83578501
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210785860.5A Pending CN115209655A (en) | 2022-07-04 | 2022-07-04 | Display module and electronic device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN115209655A (en) |
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2022
- 2022-07-04 CN CN202210785860.5A patent/CN115209655A/en active Pending
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