CN115206864A - Pick and place system with hybrid ejector - Google Patents

Pick and place system with hybrid ejector Download PDF

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Publication number
CN115206864A
CN115206864A CN202110956367.0A CN202110956367A CN115206864A CN 115206864 A CN115206864 A CN 115206864A CN 202110956367 A CN202110956367 A CN 202110956367A CN 115206864 A CN115206864 A CN 115206864A
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CN
China
Prior art keywords
semiconductor chip
polyimide film
chip
ejector
pick
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Pending
Application number
CN202110956367.0A
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Chinese (zh)
Inventor
杨海春
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Suzhou Dongyi Semiconductor Technology Co ltd
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Suzhou Dongyi Semiconductor Technology Co ltd
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Publication date
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Publication of CN115206864A publication Critical patent/CN115206864A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/10—Cleaning by methods involving the use of tools characterised by the type of cleaning tool
    • B08B1/12—Brushes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B5/00—Cleaning by methods involving the use of air flow or gas flow
    • B08B5/04—Cleaning by suction, with or without auxiliary action
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
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    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
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    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H—ELECTRICITY
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    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67333—Trays for chips
    • H—ELECTRICITY
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    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer
    • H01L2221/68386—Separation by peeling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer
    • H01L2221/68386—Separation by peeling
    • H01L2221/6839—Separation by peeling using peeling wedge or knife or bar

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The disclosed pick-and-place system with hybrid ejector includes: a work table on which an annular frame provided with a polyimide film and a semiconductor chip is fixedly placed, and which provides a work space for separating the semiconductor chip from the polyimide film in a state where the annular frame is fixedly placed; a frame supply part for loading the annular frame on the workbench and recovering the annular frame to be recovered after the work in the workbench is completed; a hybrid ejector unit disposed below the stage, and configured to pull down the polyimide film by vacuum pressure while the polyimide film is in close contact with a lower surface of the polyimide film, thereby separating the polyimide film from a remaining peripheral portion of the semiconductor chip except for a central portion thereof; a chip transfer part having an adsorption pickup for transferring the semiconductor chip having a contact area reduced by the hybrid ejector part by adsorbing and picking up the semiconductor chip; and an unloader unit having a tray, and the semiconductor chip is transferred and loaded on the tray by the chip transfer unit.

Description

Pick and place system with hybrid ejector
Technical Field
The present invention relates to a pick and place system having a hybrid ejector, and more particularly, to a pick and place system having a hybrid ejector, which comprises: the adsorption and pickup can be easily performed by more effectively separating the semiconductor chip from the Polyimide (PI) film of the ring frame after the deposition process.
Background
In recent years, with the explosive growth of the market for mobile devices such as 5G communication cellular phones and notebook computers, it is required to significantly reduce the size and weight of the devices by various methods, and as components of these methods, there are mainly methods of miniaturizing semiconductor chips and minimizing the space between semiconductor chips mounted on a Printed Circuit Board (PCB).
In this case, since the chips are arranged at a close distance from each other, the current and the signal flowing through the chips cause propagation interference with each other, which causes product defects such as improper operation or failure in operation of the device. As a representative method for preventing such a problem, a process of depositing a thin metal plate (Cu, au, AG), i.e., a shielding process (electromagnetic interference (EMI) shielding or Sputtering), i.e., a deposition process, under a vacuum environment is performed for a portion other than the mounting surface of the chip.
Since the deposition process needs to be performed on the upper face and 4 side faces other than the lower face on which the semiconductor package is disposed, the deposition process cannot be performed in a state where a plurality of semiconductor chips (semiconductor packages) are dense with each other, but the deposition needs to be performed in a state where a spaced distance between the semiconductor chips is secured after individualizing the plurality of semiconductor chips by a sawing process in order to deposit on the side faces of the semiconductor packages. For example, a plurality of semiconductor chips individualized by sawing are attached and loaded on a frame for deposition at a prescribed interval, and deposition is performed by putting the frame for deposition loaded with the plurality of individualized semiconductor chips at the prescribed interval into a deposition apparatus.
In this case, the frame for deposition may include: a ring frame having a central portion thereof penetrated; and a Polyimide (PI) film that is attached so as to cover the center of the through hole of the ring frame and to which a plurality of semiconductor chips are bonded at predetermined intervals on one surface.
That is, the deposition process may be performed by bonding a semiconductor chip on the surface of the polyimide film in the vacuum chamber, AND after the deposition process is performed in the above-described manner, in order to load the semiconductor chip on a tray (tray), a tube (tube), a TAPE, AND a REEL (TAPE AND REEL) in a pick AND place system (pick AND place system), a separation work of removing the chip from the polyimide film is first performed, AND in this case, since the strength AND adhesiveness of the polyimide film are very strong, the chip cannot be removed at all by a typical ejection (ejection) method, AND thus the ejection method cannot be applied.
Among them, the ejector-type chip separation is not suitable for a pick-and-place system in a post-deposition process of loading a plurality of chips onto a tray, a tube, or a braid and a reel after a deposition process, but is suitable for a pick-and-place system in a deposition preparation process in which an integrated type semiconductor chip loaded on a sawing frame is sawed and individualized for the deposition process, the individualized semiconductor chip is taken off from an Ultraviolet (UV) film of the sawing frame and sorted onto a polyimide film of the deposition frame at regular intervals, and since an adhesive layer of the UV film is hardened and adhesive force is weakened by irradiation of ultraviolet light or the like (UV LAMP), the individualized chip can be easily separated from the UV film while being pushed by a pin using a general ejector, so that the (picking) semiconductor chip can be easily picked up.
However, when the general pin method is applied to the pick-and-place system after the deposition process, as shown in fig. 1, even if the pins 12 of the ejector 10 push the semiconductor chip c attached to the polyimide film t, the entire lower surface of the semiconductor chip c remains attached to the polyimide film t as it is, due to the strong adhesiveness of the polyimide film, and thus the semiconductor chip c is not easily adsorbed and moved by the adsorption pickup 20, and the semiconductor chip c cannot be separated, so that it is practically difficult to apply the ejector to the pick-and-place system after the deposition process.
In order to solve such a problem, korean patent laid-open No. 10-1719168 discloses a pick-and-place system for a dicing frame manner, which includes separate pick-up modules that can separate and pick up materials such as semiconductor packages using the separate pick-up modules carried on the pick-and-place system.
As shown in fig. 2, the pick-and-place system disclosed in korean patent laid-open No. 10-1719168 strongly presses a film around a semiconductor chip using a pressing tool 30, and when the film is spaced apart from the chip, an infinite number of pyramidal protrusions at the lower end of the left side are arranged at the lower portion of the film corresponding to the arrangement of the chips in such a manner as to be adsorbed and removed by a picker 31, and when the pressing tool 30 is pressed from the upper portion, a supporting function is performed, thereby spacing the chips.
However, this method has the following problems: the cracking phenomenon of the semiconductor chip frequently occurs, the deposited film is peeled off, and since the manufacturing composition of the apparatus is high, the tool manufacturing cost rises by producing various types and sizes of chips.
Documents of the prior art
Patent document
Korean patent No. 10-1719168
Disclosure of Invention
The present invention is made to solve the above-mentioned conventional problems, and an object of the present invention is to provide a pick-and-place system having an improved hybrid ejector, as follows: as a pick-and-place system applied after the deposition process, it more effectively separates the semiconductor chip from the polyimide film of the ring frame without causing damage, so that it can be easily picked up.
It is also an object of the present invention to provide a pick and place system with an improved hybrid ejector as follows: the particle collecting part is configured to collect foreign substances such as particles from the semiconductor chips in the process of separating, picking up and transferring the semiconductor chips from the polyimide film, to improve collecting efficiency by collecting particles while scrubbing the semiconductor chips, and to produce higher quality semiconductor chips.
However, the object of the present invention is not limited thereto, and it is apparent that objects or effects that can be understood from the solution to the problem or the embodiment are included therein even if not explicitly mentioned.
A pick-and-place system with a hybrid ejector according to the present invention for achieving the above object, which is applied to a deposition process, feeds a ring frame having completed deposition, separates and picks up semiconductor chips from a polyimide film of the ring frame, and loads them on a tray, is characterized by comprising: a stage for fixing and placing a ring frame having a polyimide film attached to an edge and a semiconductor chip attached to the polyimide film, and providing a working space for separating the semiconductor chip from the polyimide film in a state where the ring frame is fixed and placed; a frame supply part for loading the annular frame on the workbench and withdrawing the annular frame to be withdrawn after the work in the workbench is finished; a hybrid ejector unit disposed below the stage, and configured to pull down the polyimide film by vacuum pressure in a state of being in close contact with a lower surface of the polyimide film, thereby separating the polyimide film from a remaining peripheral portion except a central portion of the semiconductor chip; a chip transfer part having an adsorption picker for transferring the semiconductor chip having a contact area reduced by the hybrid ejector part by adsorbing and picking up the semiconductor chip; and an unloader unit having a tray, and the semiconductor chip is transferred and loaded on the tray by the chip transfer unit.
An edge contact portion contacting closely to a lower surface of the polyimide film may be provided at a periphery of an upper end of the hybrid ejector, a vacuum chamber for deforming the polyimide film into a drawn-down form by a vacuum pressure may be formed inside the edge contact portion, an air suction hole for forming the vacuum pressure in the vacuum chamber by sucking air in the vacuum chamber may be provided at a bottom of the vacuum chamber, and a chip support pin may be protruded at a center of the vacuum chamber, the chip support pin supporting only a center portion of a semiconductor chip attached to an upper surface of the polyimide film in a state of contacting the polyimide film.
The hybrid ejector unit may deform the polyimide film in a downwardly bent state by a vacuum pressure formed in the vacuum chamber in a state where the edge contact portion and the chip support pin are in contact with the polyimide film, to be spaced apart from a remaining portion except a central portion of the semiconductor chip, thereby reducing a contact area of the polyimide film in surface contact with a lower portion of the semiconductor chip.
An ejector lift pin may be further provided at the center of the chip support pin, and the ejector lift pin may be drawn in or out according to a lifting operation, and when drawn out, may further reduce a contact area between the semiconductor chip and the polyimide film while lifting the semiconductor chip.
The semiconductor device may further include a particle collecting unit configured to brush, separate, collect, and remove particles from the semiconductor chip in a state where the semiconductor chip transferred by the transfer unit is temporarily stopped.
The particle collecting part may include: a brush part formed with a chip receiving hole for inserting and receiving a semiconductor chip, and having bristles implanted into an inner circumferential surface of the chip receiving hole to perform a scrubbing operation for separating particles from the semiconductor chip by vertical vibration; a chip fixing part closely attached and fixed to a lower part of the semiconductor chip, and fixing the semiconductor chip when the brush part performs a brushing work; and a suction cover surrounding the brush part for sucking and collecting the particles separated from the semiconductor chip.
The present invention may further include a chip collecting unit for sucking and collecting the semiconductor chip dropped on the stage.
According to the above, the present invention uses the hybrid ejector part to pull down and deform the polyimide film by vacuum pressure and separate the polyimide film from the remaining peripheral portion except the central portion of the semiconductor chip, so that the picker can pick up the semiconductor chip more easily and stably with a smaller suction force, thereby enabling an effective chip separation work without damage to the semiconductor chip.
Further, the present invention can further reduce the bonding area between the semiconductor chip and the polyimide film by drawing the ejector lift pins from the chip support pins and pushing the semiconductor chip as necessary according to the adhesive force of the polyimide film, thereby enabling an effective chip separation work even in the case of a polyimide film having a strong adhesive force.
Further, the present invention is also provided with a particle collecting part which is instantly stopped in the process of separating, picking up and transferring the semiconductor chips, separates particles from the semiconductor chips through a scrubbing operation, and sucks and collects the separated particles, thereby having an effect of mass-producing higher quality semiconductor chips and remarkably reducing a defective rate.
Drawings
Fig. 1 is a diagram illustrating an operating state of an ejector module of a conventional pick-and-place system.
Fig. 2 is a diagram showing a conventional compound picker (ping picker).
Fig. 3 is a conceptual diagram illustrating a pick and place system with a hybrid ejector according to an embodiment of the present invention.
Fig. 4 is a perspective view showing a partial structure of the pick-and-place system of the present invention.
Fig. 5 is a perspective view of the structure of fig. 4 viewed from another direction.
Fig. 6 is a perspective view schematically showing a hybrid ejector unit according to the present invention.
Fig. 7 is a diagram for explaining the operation of the hybrid ejector part of the present invention.
Fig. 8 is a diagram schematically showing a specific structure of the particle collecting section of the present invention.
FIG. 9 is a diagram schematically showing a chip collecting section according to the present invention.
Detailed Description
The above objects, other objects, features and advantages of the present invention can be easily understood by the following preferred embodiments in connection with the accompanying drawings. However, the present invention is not limited to the embodiments described herein but can be embodied in other forms. Rather, the embodiments described herein are provided so that this disclosure will be thorough and complete, and will fully convey the concept of the invention to those skilled in the art.
In the present specification, when it is mentioned that one structural element is located on another structural element, it means that it may be directly formed on another structural element, or a third structural element may be provided therebetween. In the drawings, the thickness of the constituent elements is exaggerated for effective explanation of the technical contents.
The embodiments described in this specification will be described with reference to cross-sectional and/or top views as idealized illustrations of the present invention. In the drawings, the thickness of films and regions is exaggerated for effective explanation of technical contents. Accordingly, the morphology of the illustrations may vary due to manufacturing techniques and/or tolerances. Accordingly, embodiments of the present invention are not limited to the specific form shown, but also include variations in form produced according to the manufacturing process. For example, the etched region shown at right angles may be arcuate or have a prescribed curvature. Thus, the regions illustrated in the drawings have properties, and the shapes of the regions illustrated in the drawings are intended to illustrate specific forms of regions of an element, and are not intended to limit the scope of the present invention. In the embodiments of the present specification, terms such as first, second, etc. are used to describe various structural elements, but these structural elements should not be limited by these terms. These terms are only used to distinguish one structural element from another structural element. The embodiments described and illustrated herein also include complementary embodiments thereof.
The terminology used in the description is for the purpose of describing the embodiments and is not intended to be limiting of the invention. In this specification, the singular forms include the plural forms unless the word clearly dictates otherwise. The use of "comprising" and/or "including" in the specification indicates the presence of the stated structural elements and does not preclude the presence or addition of one or more other structural elements.
In describing the following specific embodiments, various details are written to more particularly illustrate the invention and to aid understanding. However, readers having sufficient knowledge in the art to understand the present invention will recognize that the present invention may be utilized without these various particulars. It should be noted that in some instances, well known elements that are not germane to the present invention have not been described in detail in order to avoid obscuring the present invention.
Hereinafter, the pick-and-place system with the hybrid ejector of the present invention will be described with reference to fig. 3 to 9.
The pick-and-place system of the present invention is used to separate and transfer the semiconductor chip c, which is attached to the polyimide film t and has completed deposition, from the polyimide film t provided to the deposition ring frame p after completion of the deposition process, and to load it on a tray.
The pick and place system with hybrid ejector of the present invention comprises: a table 100 for fixedly placing the ring frame p; a frame supply part 200 for loading the ring frame p on the table 100; a hybrid ejector unit 300 for pulling down the polyimide film t by vacuum pressure in a state of being closely attached to a lower surface of the polyimide film t to separate the polyimide film t from a remaining peripheral portion except a central portion of the semiconductor chip c; a chip transfer part 400 having an adsorption picker for transferring the semiconductor chip c having a contact area that is effective by the hybrid ejector part 300 by adsorbing and picking the semiconductor chip c; and an unloader unit 500 having a tray 510, and the semiconductor chip c transferred by the chip transfer unit 400 is loaded on the tray 510.
The table 100 is displaced by the transfer rail 110, specifically, to a loading position for loading the ring frame p from the frame supply part 200 by moving to one side part of the transfer rail 110 and a separating and picking position for separating and picking up (picking) the semiconductor chip c from the polyimide film t by moving to the other side part of the transfer rail 110 through the hybrid ejector part 300 disposed at the lower part and the adsorption picker 412 disposed at the upper part.
When the stage 100 is waiting at the loading position, the frame supply part 200 supplies the ring frame p having the semiconductor chip c attached to the polyimide film t onto the stage 100 and fixedly places it.
The frame feeding part 200 includes a loader 210, a placing rail 220, a drawing-out grip 225, a first loop picker 230, and a second loop picker 240.
The cassette 212 having the ring frames p stacked in a stacked manner is mounted on the loader 210, and the loader 210 lifts and lowers the cassette 212 to draw out the ring frames p loaded on the cassette 212 through the drawing-out clamp 225 from the front.
The placing rails 220 are provided with a pair for placing the ring frame p, and the pair of placing rails 220 may be spaced by a spacing adjustment unit 222 to enable spacing adjustment, or an operation of narrowing the spacing can be performed to enable placing the ring frame p. In this case, the interval adjusting unit 222 includes: a moving guide rail 222a for sliding the pair of placing rails 222; a driving belt 222c that is wound around a pair of pulleys 222b provided on both sides of the moving guide rail 222a to rotate together with the rotation of the pair of pulleys 222b, and that fixes the side end portions of the pair of placing rails 220, respectively, and widens or narrows the interval between the pair of placing rails 220 in the rotational direction; and a driving motor connected to one of the pair of pulleys 222b to rotate the pulley. The driving belt 222c rotated by being wound around the both-side pulleys 222b is in a form of a two-row belt side-by-side arrangement, in which case the side portion of one placing rail 220 is caught and fixed by one of the two rows of belts, and the side portion of the remaining one placing rail 220 is caught and fixed by the remaining belt of the two rows of belts, whereby the interval between the pair of placing rails 220 is narrowed when the fixing belt 222c is rotated in one direction, and the interval between the pair of placing rails 220 can be widened to be distant from each other when the fixing belt 222c is rotated in the other direction.
The drawing holder 225 is connected to one side of the first loop pickup 230, is displaced in conjunction with the position control of the second loop pickup 230, is moved backward by holding the loop frame p inserted into the cassette 212, draws the loop frame p out of the cassette 212, and is released from the holding on the pair of mounting rails 220, thereby disposing the loop frame p on the pair of mounting rails 220.
The first ring picker 230 places and loads the ring frame p, which is picked and placed on the pair of placing rails 220, on the table 100 by sucking and picking it, and the first ring picker 230 may be vertically moved up and down by a first ring transfer robot 232 to be moved in a vertical direction.
The second ring picker 240 moves the ring frame p by sucking and picking it up which is placed on the pair of placing rails 220, or displaces the ring frame p which is placed on the table 100 and completes the chip separating work.
The second loop picker 240 is provided at a front end thereof with an extraction grip 225, and the second loop picker 240 is connected to the second loop transfer robots 242 and 244 to be displaceable, so that the second loop picker 240 and the extraction grip 225 are simultaneously interlocked to control positions thereof.
In order to move the second loop picker 240 in the x and z axis directions, as shown in fig. 3, the second loop transfer robots 242 and 244 may include: a front-rear transfer section 242 for moving the second loop picker 240 in the front-rear x-axis direction to face the placing rail 220 side; and an up-down transfer part 244 for vertically moving up and down the second loop picker 240 in the z-axis direction.
In the present invention, the frame supply part 200 may clamp and draw the ring frame p from the cassette 212 of the loader 210 drawing out the clamping part 225, place and arrange it on the placing rail 220, and the first ring picker 230 may adsorb and pick up the ring frame p on the placing rail 220, move to the upper part, and wait.
In this state, the separating work of the semiconductor chip c is completed, and in a state of being moved to the lower portion of the ring frame p of the table 110, the second ring picker 240 sucks and picks up the ring frame p by descending with respect to the ring frame p placed on the table 110 and required to be retracted, and then retreats from the placing rail 220 and waits as shown in fig. 3.
Then, the first ring picker 230 puts the picked-up ring frame p onto the empty table 110 by descending toward the table 110 side to thereby supply the ring frame p to perform work of separating the semiconductor chip c from the polyimide film t of the ring frame p, the second ring picker 240 puts the ring frame p being picked up and requiring retrieval onto the pair of placing rails 220, and the drawing grip 225 carries out retrieval by introducing the ring frame p requiring retrieval put on the placing rails 220 into the cassette 212.
As such, in the present invention, the first and second ring pickers 230 and 240 sequentially perform an operation of retrieving the ring frame p placed on the table 110, which needs to be retrieved, together with an operation of placing the ring frame p for the separation work of the semiconductor chips c on the table 110 for feeding, so that the ring frame p can be more efficiently fed and retrieved.
In a state where the ring frame p is fixedly placed on the table 110, the hybrid ejector part 300 performs the following membrane separation operation: in a state of being located at an upper position, that is, a separating and picking-up position, a vacuum pressure is formed in a state of being closely attached to a lower surface of the polyimide film t of the ring frame p placed on the stage 110, and the polyimide film t is pulled to be bent downward, thereby separating a part of the polyimide film t from the lower surface of the semiconductor chip c to reduce a contact area. Thereby, the pickup can be performed more easily and stably by the chip picker 412.
The hybrid ejector unit 300 can be moved up and down by the lifting robot, and the upper end of the hybrid ejector unit can be brought into close contact with the lower surface of the polyimide film t during lifting.
Referring to fig. 3 and 6, an edge close contact portion 310 closely contacting a lower surface of the polyimide film t is provided at a periphery of an upper end of the hybrid ejector 300, a vacuum chamber 312 is formed inside the edge close contact portion 310, an air suction hole 314 is provided at a bottom surface of the vacuum chamber 312, and the air suction hole 314 is connected to a suction motor (vacuum source) to suck air in the vacuum chamber 312 so that the vacuum chamber 312 is in a vacuum state. In this case, the edge contact portion 310 is larger in size than the semiconductor chip c, and contacts the lower surface of the polyimide film t in the peripheral region of the semiconductor chip c.
Fig. 6 shows the ejector 300 in a cylindrical shape, but the ejector may be in a square cylindrical shape, the vacuum chamber 312 may be in a square shape, and the edge contact portion 310 may be in a square edge shape corresponding to the above-described shape. In addition to the square column, it is needless to say that the shape may be various polygons.
A chip support pin 320 is formed to protrude from the hybrid ejector 300, and the chip support pin 320 protrudes upward from the center of the vacuum chamber 312 and supports the semiconductor chip c attached to the upper surface of the polyimide film t in a state of being in contact with the upper end of the polyimide film t. In this case, the chip support pins 320 support only the central portion of the semiconductor chip c.
In a state where the edge contact portion 310 and the chip support pins 320 are in contact with the lower surface of the polyimide film t, the hybrid ejector 300 draws air from the vacuum chamber 312 through the air suction hole 314 to generate a vacuum pressure in the vacuum chamber 312, and due to the vacuum pressure generated in the vacuum chamber 312, the polyimide film t attached to the remaining peripheral portion excluding the central portion of the semiconductor chip c is pulled down and deformed, as shown in fig. 7, thereby separating the polyimide film t from the remaining portion excluding the central portion of the semiconductor chip c. Thereby, the bonding area where the lower face of the semiconductor chip c is bonded to the polyimide film t is reduced, so that the semiconductor chip c can be completely separated from the polyimide film t with more ease by sucking and picking up the semiconductor chip c by the suction pickup 412.
That is, in the ejector part 300 of the present invention, the edge contact part 310 and the chip support pins 320 are closely attached to the lower surface of the polyimide film t, and the polyimide film t is separated and separated from all peripheral portions except the central portion of the lower surface of the semiconductor chip c by applying a vacuum pressure to the vacuum chamber 312, and in this state, the semiconductor chip c, which is attached to the polyimide film t only at the central portion of the lower surface of the semiconductor chip c by the suction pickup 412, can be more stably and easily separated from the polyimide film t.
On the other hand, an abutting inclined surface 322 may be provided on the upper outer peripheral surface of the chip support pin 320, and when the polyimide film t is drawn into the vacuum chamber 312 by the vacuum pressure of the vacuum chamber 312 and deformed in a curved manner, the abutting inclined surface 322 stably abuts the polyimide film t curved toward the lower portion of the vacuum chamber 312, and prevents the polyimide film t from being damaged such as torn.
In the present invention, a pin lifting hole 324 is formed through the center of the chip support pin 320, and an ejector lifting pin 330 for lifting and lowering the pin lifting hole 324 may be further provided.
The ejector lift pins 330 may be lifted by a driving member such as an air cylinder, and are drawn out of the pin lift holes 324 and protrude upward from the chip support pins 320 or are drawn into the inside of the pin lift holes 324.
When the above-described ejector lift pins 330 are drawn out and protrude to the upper portion higher than the chip support pins 320, the contact area between the semiconductor chip c and the polyimide film t can be further reduced while the semiconductor chip c is lifted by the ejector lift pins 330.
That is, as shown in fig. 7, when the ejector lift pins 330 protrude toward the upper portion of the chip support pin 320 in a state of being introduced into the chip support pin 320, the ejector lift pins 330 having a smaller diameter than the chip support pin 320 push the semiconductor chip c upward such that the adhesive area is further reduced than the adhesive area where the center portion of the semiconductor chip c is adhered to the polyimide film t before the ejector lift pins 330 are drawn out, whereby the semiconductor chip c can be more easily separated by adsorbing the pickup 412.
In this case, it is preferable that the upper ends of the ejector lift pins 330 are tapered to be wide at the bottom and narrow at the top, in order to minimize the area where the semiconductor chip c is bonded to the polyimide film t.
As described above, in the present invention, the ejector 300 significantly reduces the bonding area between the semiconductor chip c and the polyimide film t by the vacuum pressure, and in this state, the separation is performed by the suction pickup 412, so that the chip separation work can be performed more efficiently and easily.
The chip transfer part 400 suctions and transfers the semiconductor chip c, the contact area of which is reduced by the hybrid ejector part 300, and loads it on the tray 510 of the unloader part 500.
The chip transfer part 400 includes chip pickers 410, 440 displaced by a transfer robot 420 of the chip picker so as to suction pick up and transfer the semiconductor chip c separated from the polyimide film t and load it on a tray 510 of the unloader part 500. The chip pickers 410 are provided with a plurality of suction pickers 412 for picking up and transferring a plurality of semiconductor chips c, respectively.
In order to efficiently transfer and load the semiconductor chips c, the chip transfer part 400 of the present invention constitutes a pocket stage 430 having a plurality of loading slots 432, the plurality of loading slots 432 being used to temporarily load the semiconductor chips c between the table 100 and the unloader part 500, and the chip pickers 410 and 440 may include: a first chip picker 410 for temporarily loading the semiconductor chip c separated from the polyimide film t on the pocket stage 430 by suction picking and transferring the same; and a second chip picker 440 for picking up and transferring the semiconductor chip c loaded on the pocket stage 430 by suction and loading the semiconductor chip c on the tray 510.
On the other hand, as shown in fig. 1, an alignment vision camera 414 for position control may be provided at a side of the first chip picker 410.
The unloader section 500 is used to load the semiconductor chips c, which are subjected to the separation work of the semiconductor chips c from the polyimide film t of the ring frame p by the ejector section 300 and the chip transfer section 400, on the tray 510 to be supplied to the chip packaging process.
The unloader section 500 includes: a tray 510 for loading the semiconductor chips c transferred by the chip transfer part 400; a bin portion 520 for stacking and storing the trays 510; and a retrieve container 530 for retrieving the defective chip.
The unloader unit 500 may perform a visual inspection by the visual inspection unit 600 while being transferred by the chip transfer unit 400, and load the chip transfer unit 400, which has been visually inspected, on the tray 510.
In this case, the visual inspection section 600 includes: an upper vision part 610 for visually inspecting an upper surface of the semiconductor chip c; and a lower vision portion 620 for visually inspecting the lower surface of the semiconductor chip c.
The upper vision part 610 is disposed at an upper portion of the pocket stage 430, and is used to visually inspect an upper surface of the semiconductor chip c temporarily loaded in the loading slot 432 of the pocket stage 430, and the lower vision part 620 is disposed at a lower portion of the second chip picker 440 moving between the pocket stage 430 and the unloader part 500, and is used to visually inspect a lower surface of the semiconductor chip c sucked and picked up by the second chip picker 440.
In the present invention, when the semiconductor chip c is determined to be normal according to the result of the visual inspection by the visual inspection section 600, the chip transfer section 400 causes the second chip picker 440 to transfer and load the semiconductor chip c on the tray 510, and when the semiconductor chip c is determined to be abnormal according to the result of the visual inspection by the visual inspection section 600, the second chip picker 440 may transfer the semiconductor chip c to the recovery container 530 and recover the semiconductor chip c by releasing the pick-up.
On the other hand, referring to fig. 3 and 8, the present invention may further include a particle collecting part 700, the particle collecting part 700 being disposed between the table 100 and the pocket stage 430, for removing particles from the semiconductor chip c picked up and transferred by the first chip picker 410.
The chip transfer section 400 may instantaneously stop the first chip picker 410 on the particle collection section 700 in the process of picking up and transferring the semiconductor chip c from the polyimide film t on the table 100, and thus, in a state where the first chip picker 410 picking up the semiconductor chip c is stopped on the particle collection section 700, the particle collection section 700 may suck and remove foreign substances such as particles attached to the semiconductor chip c.
The particle collection part 700 may be moved up and down by the elevating and moving robot, and the particle collection part 700 may be lifted up toward the first chip picker 410 side to perform a dust collection operation in a state where the first chip picker 410 picking up the semiconductor chip c is stopped on the particle collection part 700.
The particle collecting part 700 includes: a brush part 710 having a plurality of chip receiving holes 711 for inserting and receiving the semiconductor chips c, the chip receiving holes 711 having bristles 712 on an inner circumferential surface thereof, the bristles 712 being brushed by the bristles 712 of the semiconductor chips c received in the chip receiving holes 711 by a vertical reciprocating motion such as vertical vibration while separating dust such as particles; a chip fixing part 720 having a chip supporting bar 722 closely fixing the semiconductor chip c at a lower portion thereof, for preventing the semiconductor chip c from being separated from the first chip picker 410 when the brush part 710 is scrubbed; and a suction cap 730 provided in a manner of surrounding the brush part 710, for sucking and collecting particles separated from the semiconductor chip c by the operation of the brush part 710.
In the present invention, the brush part 710 is connected to an eccentric vibration motor to perform a vertical vibration operation, and the brush part 710 may be vibrated at a high speed up and down according to the driving of the eccentric vibration motor, but is not limited thereto, and the brush part 710 may be certainly vibrated by various vibration generation units such as an ultrasonic vibrator in addition to the eccentric vibration motor.
Also, the suction cap 730 may be connected to a suction motor (suction source) of a dust collector or a dust collector to suck and collect particles separated from the semiconductor chip c by the brush part 710, in which case a collecting tub for collecting particles may be provided at a downstream side of the suction cap 730.
Although not shown, in the case where the particle collecting part 700 is provided with the brush part 710, the chip fixing part 720, the suction cap 730, and a body housing for forming an external appearance of the particle collecting part 700 may be further provided, in which case, the up-and-down position driving of the particle collecting part 700 may be performed by a lifting actuator such as a cylinder unit for lifting and lowering the body housing.
On the other hand, in the present invention, in the process of separating and picking up the semiconductor chip c from the polyimide film t on the table 100 by the ejector part 300 and the first chip picker 410, when the first chip picker 410 misses the semiconductor chip c due to an improper operation of the first chip picker 410 or the like to cause the semiconductor chip c to fall onto the table 100, if the semiconductor chip c falling onto the table 100 is not rapidly recovered, a lot of time may be consumed for the restart process.
Therefore, as shown in fig. 8, the present invention further includes a chip collecting unit 800, in which a suction nozzle 810 is provided at a side portion of the table 100, a connection passage of a suction motor 830 is formed by the suction nozzle 810, and a collecting tub 820 for collecting chips is provided in the connection passage.
The above-described chip recycle part 800 intermittently operates or, after the work of separating and picking up the semiconductor chips c from the ring frame p is completed, by controlling the sequence to perform the adsorption chip recycle operation by the chip recycle part 800, the process interruption time is minimized by rapidly recycling the semiconductor chips c dropped onto the table 100, and the process efficiency can be remarkably improved.
The present invention has been shown and described above with reference to the preferred embodiments for illustrating the principles of the invention, but is not limited to the structure and operation as shown and described. Rather, it will be apparent to those skilled in the art to which the present invention pertains that many changes and modifications can be made without departing from the spirit and scope of the invention as hereinafter claimed. Accordingly, all such suitable changes and modifications and equivalents may be resorted to as falling within the scope of the invention.

Claims (7)

1. A pick-and-place system having a hybrid ejector, which is applied to a ring frame for supplying a semiconductor chip, which has been deposited, to a tray after being separated from a polyimide film of the ring frame and picked up, after a deposition process, the pick-and-place system having the hybrid ejector, comprising:
a stage for fixing and placing a ring frame having a polyimide film attached to an edge and a semiconductor chip attached to the polyimide film, and providing a working space for separating the semiconductor chip from the polyimide film in a state where the ring frame is fixed and placed;
a frame supply part for loading the annular frame on the workbench and recovering the annular frame to be recovered after the work in the workbench is finished;
a hybrid ejector unit disposed below the stage, and configured to pull down the polyimide film by vacuum pressure in a state of being in close contact with a lower surface of the polyimide film, thereby separating the polyimide film from a remaining peripheral portion except a central portion of the semiconductor chip;
a chip transfer portion having an adsorption pickup for transferring the semiconductor chip by adsorbing and picking up the semiconductor chip whose contact area is reduced by the hybrid ejector portion; and
and an unloader unit having a tray, and the semiconductor chip is transferred and loaded on the tray by the chip transfer unit.
2. The pick-and-place system with hybrid ejector of claim 1,
an edge close contact portion closely contacting a lower surface of the polyimide film is provided at a peripheral portion of an upper end of the hybrid ejector portion, a vacuum chamber for deforming the polyimide film into a drawn-down form by vacuum pressure is formed inside the edge close contact portion, an air suction hole for forming vacuum pressure in the vacuum chamber by sucking air in the vacuum chamber is provided at a bottom portion of the vacuum chamber,
a chip support pin is provided in the center of the vacuum chamber, and the chip support pin supports only a central portion of a semiconductor chip attached to the upper surface of the polyimide film in a state of being in contact with the polyimide film.
3. The pick-and-place system with the hybrid ejector as claimed in claim 2, wherein the hybrid ejector unit deforms the polyimide film into a downwardly curved shape by a vacuum pressure formed in the vacuum chamber in a state where the edge contact portion and the chip support pin are in contact with the polyimide film, to be spaced apart from a remaining portion except a central portion of the semiconductor chip, thereby reducing a contact area of the polyimide film in surface contact with a lower portion of the semiconductor chip.
4. The pick-and-place system with the hybrid ejector as claimed in claim 3, wherein an ejector lift pin is further provided at a center of the chip supporting pin, the ejector lift pin being drawn in or out according to a lifting operation, when drawn out, to further reduce a contact area between the semiconductor chip and the polyimide film while lifting the semiconductor chip.
5. The pick-and-place system with the hybrid ejector according to claim 1, further comprising a particle collecting part that brushes, separates, collects, and removes particles from the semiconductor chip in a state where the semiconductor chip transferred by the transfer part is temporarily stopped.
6. The pick-and-place system with hybrid ejector of claim 5, wherein said particle collection section includes:
a brush part formed with a chip receiving hole for inserting and receiving a semiconductor chip, the brush being implanted into an inner circumferential surface of the chip receiving hole to perform a scrubbing operation for separating particles from the semiconductor chip by vertical vibration;
a chip fixing part closely attached to and fixed to a lower part of the semiconductor chip, for fixing the semiconductor chip when the brush part performs a brushing operation; and
and a suction cover surrounding the brush part for sucking and collecting particles separated from the semiconductor chip.
7. The pick-and-place system with hybrid ejector as in claim 1, further comprising a chip recovery section for sucking and recovering the semiconductor chips dropped on the table.
CN202110956367.0A 2021-04-09 2021-08-19 Pick and place system with hybrid ejector Pending CN115206864A (en)

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KR19990038969U (en) * 1998-04-01 1999-11-05 구자홍 Microchip Separator
JP2000195877A (en) * 1998-12-25 2000-07-14 Matsushita Electric Ind Co Ltd Method and apparatus for separating chip on dicing sheet
JP2004231250A (en) * 2003-01-31 2004-08-19 Matsushita Electric Ind Co Ltd Sheet peeler and sheet peeling method using the same
JP2012501539A (en) * 2008-09-01 2012-01-19 ネーデルランツ オルガニサティー フォール トゥーゲパストナトゥールヴェテンシャッペリーク オンデルズーク テーエンオー Pick and place machine
KR101489373B1 (en) * 2013-09-17 2015-02-12 주식회사 넥스트솔루션 Cleaning apparatus for test handler
KR101640533B1 (en) * 2015-04-06 2016-07-19 한미반도체 주식회사 Semiconductor Chip Pick-Up System
KR101719168B1 (en) 2016-05-12 2017-03-23 (주) 에스에스피 Detaching picker module within pick and place system for wafer ring frame type
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