CN115156723A - Laser marking device and marking machine - Google Patents

Laser marking device and marking machine Download PDF

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Publication number
CN115156723A
CN115156723A CN202210819591.XA CN202210819591A CN115156723A CN 115156723 A CN115156723 A CN 115156723A CN 202210819591 A CN202210819591 A CN 202210819591A CN 115156723 A CN115156723 A CN 115156723A
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CN
China
Prior art keywords
laser
marking
light
marking head
head
Prior art date
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Pending
Application number
CN202210819591.XA
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Chinese (zh)
Inventor
钟恒
颜昱昕
于泽樟
钟仕贤
李文强
杨建新
朱霆
盛辉
周学慧
张凯
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen Tete Semiconductor Equipment Co ltd
Original Assignee
Shenzhen Tete Semiconductor Equipment Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shenzhen Tete Semiconductor Equipment Co ltd filed Critical Shenzhen Tete Semiconductor Equipment Co ltd
Priority to CN202210819591.XA priority Critical patent/CN115156723A/en
Publication of CN115156723A publication Critical patent/CN115156723A/en
Pending legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/362—Laser etching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
    • B23K26/0673—Dividing the beam into multiple beams, e.g. multifocusing into independently operating sub-beams, e.g. beam multiplexing to provide laser beams for several stations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/007—Marks, e.g. trade marks

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)

Abstract

The invention relates to the technical field of laser marking, in particular to a laser marking device and a marking machine. Wherein, laser marking device includes the casing, the laser instrument, reflector component, beam splitter and mark head subassembly, be equipped with the installation cavity in the casing, the laser instrument is installed in installation cavity one side, reflector component includes first speculum, second mirror and third speculum, first speculum sets up in the light-emitting side of laser instrument, beam splitter sets up in first speculum one side, and divide into first light beam and second light beam with the reflected light beam of first speculum, mark head subassembly sets up in casing one side, mark head subassembly includes first mark head and second mark head, the second mirror corresponds first mark head setting, the third reflection is corresponding to second mark head setting, laser instrument transmission laser beam is via first speculum, beam splitter divides light to second mirror and third speculum, incide respectively to first mark head and second mark head. The technical scheme of the invention is beneficial to improving the applicability of the marking device.

Description

Laser marking device and marking machine
Technical Field
The invention relates to the technical field of laser marking, in particular to a laser marking device and a marking machine.
Background
In the IC industry, the way in which laser technology is applied to mark IC products is becoming more and more widespread. The laser marking technology can be used for manufacturing very fine marks on the surfaces of IC products and has very good durability. In the prior art, in order to improve marking efficiency, two marking heads are usually used for marking, a laser beam emitted from a laser reaches the two marking heads through a light splitting piece respectively to provide energy for laser marking, and parts (such as a beam expander, a field lens and the like) in an installation cavity are generally fixedly installed in the installation cavity in a fixed specification and cannot be replaced randomly, so that marking requirements of different precisions cannot be met.
Disclosure of Invention
The invention mainly aims to provide a laser marking device, aiming at realizing different marking precision.
In order to achieve the above object, the present invention provides a laser marking device, including:
the casing, be equipped with the installation cavity in the casing:
the laser is detachably arranged on one side of the installation cavity;
the reflector component comprises a first reflector, a second reflector and a third reflector, wherein the first reflector is arranged on the light emergent side of the laser;
the light splitting piece is arranged on one side of the first reflector and splits a reflected light beam of the first reflector into a first light beam and a second light beam; and
the marking head assembly is arranged on one side of the shell and comprises a first marking head and a second marking head, and the second reflecting mirror is arranged corresponding to the first marking head and is positioned on one side, far away from the first reflecting mirror, of the light splitting part; the third reflection is arranged corresponding to the second marking head, the third reflecting mirror is positioned on one side of the light splitting piece, which is far away from the second reflecting mirror, and the laser device emits laser beams which are split to the second reflecting mirror and the third reflecting mirror through the first reflecting mirror and the light splitting piece and are respectively incident to the first marking head and the second marking head.
In an embodiment of the present application, a beam expander assembly is further disposed in the mounting cavity, and the beam expander assembly includes:
the first beam expander is arranged at the light inlet of the first marking head and used for adjusting the diffusion angle of the first light beam;
the second beam expander is arranged at the light inlet of the second marking head and used for adjusting the diffusion angle of the second light beam; and
and the third beam expander is arranged at the light outlet of the laser and used for adjusting the quality of the laser beam.
In an embodiment of the present application, an optical path length of the first light beam propagating to the first marking head is equal to an optical path length of the second light beam propagating to the second marking head.
In an embodiment of the present application, an optical path length of the first light beam propagating from the beam splitter to the second mirror is defined as L1, and an optical path length of the first light beam propagating from the second mirror to the first marking head is defined as L2; and the optical path of the second light beam transmitted to the third reflector from the light splitting part is D1, and the optical path of the second light beam transmitted to the second marking head from the third reflector is D2, so that L1+ L2= D1+ D2.
In an embodiment of the present application, the light splitting element has a light splitting plane, and an incident angle of the laser beam incident on the light splitting plane is 6 degrees.
In an embodiment of the present application, an incident angle of the laser beam incident on the first mirror, an incident angle of the first beam incident on the second mirror, and an incident angle of the second beam incident on the third mirror are all 45 degrees.
In an embodiment of the present application, the reflection points of the first mirror, the beam splitter, and the second mirror are located on the same horizontal straight line, and the third mirror is located between the horizontal straight line and the second marking head.
In an embodiment of the present application, if the distance between the light splitting element and the first reflecting mirror is defined as S1, and the distance between the light splitting element and the second reflecting mirror is defined as S2, then S1> S2.
In an embodiment of the application, the first marking head and the second marking head are arranged side by side on a side of the mounting cavity away from the laser.
In an embodiment of this application, first marking head with the second marking head all includes scanning head and field lens, the laser beam passes through first scanning head adjustment deflection angle, passes through again the field lens forms the focus facula of even size and focuses on the product, marks the product.
The invention also provides a marking machine, which comprises a workbench and the laser marking device, wherein the laser marking device is arranged on the workbench, the workbench is provided with a bearing table for placing a workpiece to be machined, and the marking head assembly is arranged relative to the bearing table.
According to the technical scheme, the laser, the reflector component, the light splitting piece and the marking head component are reasonably arranged in the installation cavity, a laser beam emitted by the laser is reflected by the first reflector and then enters the light splitting piece, the light splitting piece divides the laser beam into the first light beam and the second light beam, and the first light beam and the second light beam respectively enter the first marking head and the second marking head through the reflection of the second reflector and the reflection of the third reflector to carry out laser marking. And the laser devices, the reflector component, the light splitting component and the marking head component with different specifications can be correspondingly replaced, so that the marking requirements with different precisions can be met, the applicability of the laser marking device is stronger, and the production and manufacturing cost is reduced.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
FIG. 1 is a schematic external view of a laser marking apparatus according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of an internal structure of an embodiment of a laser marking apparatus according to the present invention;
FIG. 3 is a top view of the internal structure of one embodiment of the laser marking apparatus of the present invention;
fig. 4 is a schematic view of the beam propagation of the laser marking device of the present invention.
The reference numbers illustrate:
Figure BDA0003743378470000031
Figure BDA0003743378470000041
the implementation, functional features and advantages of the objects of the present invention will be further explained with reference to the accompanying drawings.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that all the directional indicators (such as upper, lower, left, right, front, and rear … …) in the embodiment of the present invention are only used to explain the relative position relationship between the components, the motion situation, and the like in a specific posture (as shown in the drawing), and if the specific posture is changed, the directional indicator is changed accordingly.
In the present invention, unless otherwise expressly stated or limited, the terms "connected," "secured," and the like are to be construed broadly, and for example, "secured" may be a fixed connection, a removable connection, or an integral part; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
In addition, the descriptions related to "first", "second", etc. in the present invention are only for descriptive purposes and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, the meaning of "and/or" appearing throughout is to include three juxtapositions, exemplified by "A and/or B," including either the A or B arrangement, or both A and B satisfied arrangement. In addition, technical solutions between various embodiments may be combined with each other, but must be realized by a person skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination should not be considered to exist, and is not within the protection scope of the present invention.
Laser marking is a marking method in which a workpiece is irradiated locally with high-energy-density laser to vaporize a surface layer material or to undergo a chemical reaction of color change, thereby leaving a permanent mark. In the IC industry, the way in which laser technology is applied to mark IC products is becoming more and more widespread. In the prior art, in order to improve marking efficiency, two marking heads are usually used for marking, but the optical distances from the laser beams after light splitting to the two marking heads are not equal, so that energy difference exists between the two marking heads, and then the marking precision of the two marking heads is different, thereby affecting the marking quality.
In order to solve the above technical problem, referring to fig. 1 to 4, the present invention provides a laser marking device 100, which includes a housing 110, a laser 10, a mirror assembly 30, a beam splitter 50, and a marking head assembly 70, wherein an installation cavity is disposed in the housing 110, the laser 10 is detachably mounted on one side of the installation cavity, the mirror assembly 30 includes a first mirror 31, a second mirror 33, and a third mirror 35, the first mirror 31 is disposed on a light emitting side of the laser 10, the beam splitter 50 is disposed on one side of the first mirror 31 and splits a reflected light beam of the first mirror 31 into a first light beam and a second light beam, the marking head assembly 70 is disposed on one side of the housing 110, the marking head assembly 70 includes a first marking head 71 and a second marking head 73, the second mirror 33 is disposed corresponding to the first marking head 71 and is located on one side of the beam splitter 50 away from the first mirror 31; the third reflection is arranged corresponding to the second marking head 73, the third reflector 35 is arranged at the side of the light splitting piece 50, which is far away from the second reflector 33, and the laser 10 emits laser beams which are split to the second reflector 33 and the third reflector 35 through the first reflector 31 and the light splitting piece 50 and are respectively incident to the first marking head 71 and the second marking head 73. The laser beam emitted by the laser 10 is divided into the first beam and the second beam by the light splitter 50 with equal energy, and the optical paths of the first beam and the second beam respectively reaching the first marking head 71 and the second marking head 73 are equal, so that the marking error can be reduced, and the marking precision can be improved. The parts in the mounting cavity, such as the laser 10, the reflector assembly 30, the beam splitter 50, the marking head assembly 70 and the beam expander assembly 90, are detachably connected with the mounting plate, so that the parts with different specifications and models can be replaced conveniently, and different marking accuracies can be realized.
In an embodiment of the present application, referring to fig. 1 to 3, the housing 110 may have a substantially long box shape, a mounting cavity is disposed in the housing 110, a mounting plate (not shown) may be disposed at the bottom of the mounting cavity, and a plurality of threaded holes or through holes are formed in the mounting plate for mounting and fixing. The installation cavity can provide installation space for each part of the laser marking device 100. The laser 10 can be fixedly connected to one side of the mounting plate through the mounting seat, a mounting hole position can be formed in the mounting seat, the laser 10 can be sleeved in the mounting seat, and the mounting seat can be fixedly connected to the mounting plate through screws. The laser 10 is used for emitting a laser beam, the laser 10 and the marking head assembly 70 are respectively arranged at two ends of the housing 110, and a light outlet of the laser 10 faces the marking head assembly 70. First speculum 31 is installed in the light-emitting outlet play of laser instrument 10, and first speculum 31 also can be fixed in the mounting panel through the mount pad, can also set up the bolt on the mount pad, is convenient for change or adjusts first speculum 31, and the installation angle of first speculum 31 can be 45 degrees contained angles with the laser beam.
The laser beam reflected by the laser beam reaches the light splitting part 50, the light splitting part 50 may be a prism, a polarization beam splitter, a beam splitting cube or other light splitters, and the light splitting part 50 may be arranged opposite to the mirror surface of the first reflecting mirror 31, so that the reflected laser beam can directly enter the light splitting part 50, and energy loss caused by light path change is reduced. The light splitter 50 may be detachably and fixedly connected to the mounting plate by bolts, and the mounting height of the light splitter corresponds to the mounting height of the first reflective mirror.
The laser beam is divided into a first beam and a second beam after passing through the light splitting part 50, a part of the laser beam forms the first beam after being projected by the light splitting part 50, a part of the laser beam forms the second beam after being reflected by the light splitting part 50, the first beam is emitted to the second reflecting mirror 33, the second reflecting mirror 33 is arranged corresponding to the first marking head 71 and is positioned at one side of the light splitting part 50 departing from the first reflecting mirror 31, the installation mode of the second reflecting mirror 33 is the same as that of the first reflecting mirror 31, and the description is omitted. The first light beam is reflected by the second reflecting mirror 33 and then enters the first marking head 71, so as to provide a marking light source for the first marking head 71. The second light beam is emitted to the third reflector 35, the third reflector 35 is disposed corresponding to the second marking head 73 and located between the light splitter 50 and the first reflector 31, and the third reflector 35 is also mounted in the same manner as the first reflector 31.
It should be noted that the first marking head 71 and the second marking head 73 both include a scanning head (not shown) and a field lens (not shown), the scanning head is electrically connected to the control system of the laser marking device 100, the scanning head controls the deflection angle of the light beam through the control system after receiving the laser beam, and then the field lens focuses the laser beam on the product to mark the product. It should be understood that the scan head and field lens can be changed to different models to change the marking accuracy.
In an embodiment of the present application, a beam expander assembly 90 is further disposed in the mounting cavity, the beam expander assembly 90 includes a first beam expander 91, a second beam expander 93 and a third beam expander 95, the first beam expander 91 is disposed at the light entrance of the first marking head 71 and is used for adjusting the diffusion angle of the first light beam, the second beam expander 93 is disposed at the light entrance of the second marking head 73 and is used for adjusting the diffusion angle of the second light beam, the third beam expander 95 is disposed at the light exit of the laser 10, and the third beam expander 95 is used for adjusting the quality of the laser beam.
The first beam expander 91 and the second beam expander 93 can straighten the light paths of the split first light beam and the split second light beam, and the focusing effect is better. Different beam expanders can realize different marking accuracies, for example, the first beam expander 91 and the second beam expander 93 adopt 6 times of forward-mounted beam expanders, the third beam expander 95 adopts 6 times of inverted beam expanders and adopts 255 field lenses, and the line width of the marked characters can be 0.04mm-0.06mm; the first beam expander 91 and the second beam expander 93 adopt 2 times of forward-mounted beam expanders, the third beam expander 95 adopts 1-3 times of inverted beam expanders, and simultaneously adopts a 14-light spot integral scanning head with the diameter and a 180-field lens, the line width of the marked characters can be 0.03-0.05 mm, and the characters are thinner.
In an embodiment of the present application, an optical path length of the first light beam transmitted from the beam splitter 50 to the second reflector 33 is defined as L1, and an optical path length of the first light beam transmitted from the second reflector 33 to the first marking head 71 is defined as L2; the optical path of the second light beam from the light splitting element 50 to the third reflecting mirror 35 is D1, the optical path of the second light beam from the third reflecting mirror 35 to the second marking head 73 is D2, and L1+ L2= D1+ D2. It can be understood that, with this arrangement, the first marking head 7171 and the second marking head 7373 can mark the product at the same time, and the energy of the laser beam is equal during the transmission process, and the marking precision of the two marking heads is the same, so as to avoid affecting the marking quality.
In one embodiment of the present application, the light splitting element 50 has a light splitting surface, and the incident angle of the laser beam incident on the light splitting surface is 6 degrees. Therefore, the transmission error between the first light beam and the second light beam can be reduced, the time for the first light beam and the time for the second light beam to respectively reach the first marking head 71 and the second marking head 73 are equal, the energy loss in the transmission process is reduced, and the marking precision is prevented from being influenced.
In one embodiment of the present application, the incident angle of the laser beam incident on the first mirror 31, the incident angle of the first beam incident on the second mirror 33, and the incident angle of the second beam incident on the third mirror 35 are all 45 degrees. With such an arrangement, the exit direction of the laser beam is convenient to control, the setting of the deflection angle of the mirror assembly 30 and the calculation of the optical path are simpler and more convenient, and errors or deviations are not easy to occur.
In an embodiment of the present application, the reflection points of the first mirror 31, the beam splitter 50, and the second mirror 33 are located on the same horizontal straight line, and the third mirror 35 is located between the horizontal straight line and the second marking head 73. The reflecting points of the first reflecting mirror 31, the light splitting piece 50 and the second reflecting mirror 33 are kept concentric, so that the energy loss of the laser beam in the transmission process can be reduced, the transmission precision is high, and the marking precision is favorably improved. The reflection point of the third mirror 35 is shifted toward the second marking head 73, so as to ensure that the optical distances from the first light beam to the first marking head 71 and from the second light beam to the second marking head 73 are equal, and avoid affecting the marking quality.
In an embodiment of the present application, if the distance between the light splitting element 50 and the first reflecting mirror 31 is defined as S1, and the distance between the light splitting element 50 and the second reflecting mirror 33 is defined as S2, then S1> S2. Since the light splitting member 50 is not disposed between the first and second marking heads 71 and 73, in order for the first and second light beams to reach the first and second marking heads 71 and 73, respectively, at the same time, the distance between the light splitting member 50 and the first reflecting mirror 31 should be greater than the distance between the light splitting member 50 and the second reflecting mirror 33.
In an embodiment of the present application, the first marking head 71 and the second marking head 73 are disposed side by side on a side of the mounting cavity away from the laser 10. The first marking head 71 can receive the first light beam, output the first light beam to a product to be marked after performing corresponding processing on the first light beam, and further mark the product. Similarly, the second marking head 73 can receive the second light beam, output the second light beam to a product to be marked after performing corresponding processing on the second light beam, and mark the product. The first marking head 71 and the second marking head 73 can be arranged side by side, when in marking, the first marking head 71 and the second marking head 73 can respectively mark different parts of the same product, and can also respectively mark a plurality of products in different areas on one coming material, and the specific products marked according to actual needs can be set.
In an embodiment of the present application, the first marking head 71 and the second marking head 73 both include a scanning head and a field lens, and the laser beam first passes through the scanning head to adjust the deflection angle, and then passes through the field lens to form a uniform focused light spot and focus on the product, so as to mark the product. The scanning head is electrically connected with a control system of the laser marking device 100, the scanning head controls the deflection angle of the light beam through the control system after receiving the laser beam, and then the laser beam is focused on a product through the field lens to mark the product. It should be understood that the scan head and field lens can be changed to different models to change the marking accuracy.
The invention further provides a marking machine, which comprises a workbench and the laser marking device 100, the specific structure of the laser marking device 100 refers to the above embodiments, and the marking machine adopts all technical schemes of all the embodiments, so that the marking machine at least has all the beneficial effects brought by the technical schemes of the embodiments, and the details are not repeated herein. Wherein, the laser marking device 100 is arranged on the workbench, the workbench is provided with a bearing platform for placing a workpiece to be processed, and the marking head assembly 70 is arranged opposite to the bearing platform so as to mark the marking object.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention, and all equivalent structural changes made by using the contents of the present specification and the drawings, or any other related technical fields, which are directly or indirectly applied to the present invention, are included in the scope of the present invention.

Claims (10)

1. A laser marking device, characterized in that the laser marking device comprises:
the casing, be equipped with the installation cavity in the casing:
the laser is detachably arranged on one side of the installation cavity;
the reflector component comprises a first reflector, a second reflector and a third reflector, wherein the first reflector is arranged on the light emergent side of the laser;
the light splitting piece is arranged on one side of the first reflector and splits a reflected light beam of the first reflector into a first light beam and a second light beam; and
the marking head assembly is arranged on one side of the shell and comprises a first marking head and a second marking head, and the second reflecting mirror is arranged corresponding to the first marking head and is positioned on one side, far away from the first reflecting mirror, of the light splitting part; the third reflection is arranged corresponding to the second marking head, the third reflecting mirror is positioned on one side of the light splitting piece, which is far away from the second reflecting mirror, and the laser device emits laser beams which are split to the second reflecting mirror and the third reflecting mirror through the first reflecting mirror and the light splitting piece and are respectively incident to the first marking head and the second marking head.
2. The laser marking apparatus of claim 1, wherein a beam expander assembly is further disposed within the mounting cavity, the beam expander assembly comprising:
the first beam expander is arranged at the light inlet of the first marking head and used for adjusting the diffusion angle of the first light beam;
the second beam expander is arranged at the light inlet of the second marking head and used for adjusting the diffusion angle of the second light beam; and
and the third beam expander is arranged at the light outlet of the laser and used for adjusting the quality of the laser beam.
3. The laser marking apparatus according to claim 1, wherein an optical path length of the first beam propagating from the beam splitter to the second reflecting mirror is defined as L1, and an optical path length of the first beam propagating from the second reflecting mirror to the first marking head is defined as L2; and the optical path of the second light beam transmitted to the third reflector from the light splitting part is D1, and the optical path of the second light beam transmitted to the second marking head from the third reflector is D2, so that L1+ L2= D1+ D2.
4. The laser marking apparatus according to claim 3, wherein the light splitting member has a splitting plane, and an incident angle of the laser beam incident on the splitting plane is 6 degrees.
5. The laser marking apparatus of claim 4, wherein an incident angle of the laser beam incident on the first mirror, an incident angle of the first beam incident on the second mirror, and an incident angle of the second beam incident on the third mirror are each 45 degrees.
6. The laser marking apparatus as claimed in claim 5, wherein the reflection points of the first mirror, the beam splitter and the second mirror are located on a same horizontal straight line, and the third mirror is located between the horizontal straight line and the second marking head.
7. The laser marking device according to claim 6, wherein if the distance between the beam splitter and the first reflecting mirror is defined as S1 and the distance between the beam splitter and the second reflecting mirror is defined as S2, then S1> S2.
8. The laser marking apparatus as claimed in claim 1, wherein the first marking head and the second marking head are disposed side by side on a side of the mounting cavity remote from the laser.
9. The laser marking device according to claim 8, wherein the first marking head and the second marking head each include a scanning head and a field lens, and the laser beam passes through the scanning head to adjust a deflection angle and then passes through the field lens to form a uniform-sized focused light spot and is focused on a product to mark the product.
10. A marking machine, characterized by comprising a workbench and the laser marking device as claimed in any one of claims 1 to 9, wherein the laser marking device is arranged on the workbench, a bearing platform for placing a workpiece to be processed is arranged on the workbench, and the marking head assembly is arranged relative to the bearing platform.
CN202210819591.XA 2022-07-13 2022-07-13 Laser marking device and marking machine Pending CN115156723A (en)

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CN202210819591.XA CN115156723A (en) 2022-07-13 2022-07-13 Laser marking device and marking machine

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Publication number Priority date Publication date Assignee Title
CN117583740A (en) * 2024-01-16 2024-02-23 湖南家喻建材有限公司 Surface treatment device and process for aluminum alloy photovoltaic bracket oxidation procedure

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117583740A (en) * 2024-01-16 2024-02-23 湖南家喻建材有限公司 Surface treatment device and process for aluminum alloy photovoltaic bracket oxidation procedure
CN117583740B (en) * 2024-01-16 2024-04-16 湖南家喻建材有限公司 Surface treatment device and process for aluminum alloy photovoltaic bracket oxidation procedure

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