CN115148833B - Fpcb/fccl替代镀锡铜焊带作为光伏组件汇流条 - Google Patents
Fpcb/fccl替代镀锡铜焊带作为光伏组件汇流条 Download PDFInfo
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- CN115148833B CN115148833B CN202110337958.XA CN202110337958A CN115148833B CN 115148833 B CN115148833 B CN 115148833B CN 202110337958 A CN202110337958 A CN 202110337958A CN 115148833 B CN115148833 B CN 115148833B
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- 238000005219 brazing Methods 0.000 title claims abstract description 16
- 101001045744 Sus scrofa Hepatocyte nuclear factor 1-beta Proteins 0.000 title claims abstract 16
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 28
- 239000011889 copper foil Substances 0.000 claims abstract description 24
- 239000000463 material Substances 0.000 claims abstract description 10
- 239000002131 composite material Substances 0.000 claims abstract description 6
- 238000009713 electroplating Methods 0.000 claims description 3
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 claims description 3
- 238000000034 method Methods 0.000 claims description 2
- 238000004026 adhesive bonding Methods 0.000 claims 1
- 238000003825 pressing Methods 0.000 claims 1
- 239000011521 glass Substances 0.000 abstract description 8
- 229920000139 polyethylene terephthalate Polymers 0.000 abstract 2
- 239000005020 polyethylene terephthalate Substances 0.000 abstract 2
- -1 polyethylene terephthalate Polymers 0.000 abstract 1
- 239000002184 metal Substances 0.000 description 8
- 229910052751 metal Inorganic materials 0.000 description 8
- 239000000758 substrate Substances 0.000 description 7
- 238000010586 diagram Methods 0.000 description 4
- 239000011888 foil Substances 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 239000011368 organic material Substances 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/02002—Arrangements for conducting electric current to or from the device in operations
- H01L31/02005—Arrangements for conducting electric current to or from the device in operations for device characterised by at least one potential jump barrier or surface barrier
- H01L31/02008—Arrangements for conducting electric current to or from the device in operations for device characterised by at least one potential jump barrier or surface barrier for solar cells or solar cell modules
- H01L31/0201—Arrangements for conducting electric current to or from the device in operations for device characterised by at least one potential jump barrier or surface barrier for solar cells or solar cell modules comprising specially adapted module bus-bar structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0224—Electrodes
- H01L31/022408—Electrodes for devices characterised by at least one potential jump barrier or surface barrier
- H01L31/022425—Electrodes for devices characterised by at least one potential jump barrier or surface barrier for solar cells
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Sustainable Energy (AREA)
- Life Sciences & Earth Sciences (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Sustainable Development (AREA)
- Power Engineering (AREA)
- Photovoltaic Devices (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
Abstract
本发明公开了FPCB/FCCL替代镀锡铜焊带作为光伏组件汇流条，所述FPCB/FCCL由一种绝缘基材和导电层构成的复合材料，所述绝缘基材采用PI或PET做基材，导电层一般为铜箔。本发明柔性太阳能组件使用FPCB/FCCL替代镀锡铜焊带，大幅提高产品质和稳定性，FPCB/FCCL汇流条同样适用于双玻太阳能组件和单玻太阳能组件；所述的FPCB/FCCL铜箔，可以是FPCB/FCCL带线路，FPCB/FCCL全铜箔(不带线路)，或FPCB/FCCL铜箔部分带线路部分不带线路；所述的FPCB/FCCL铜箔的外形尺寸，可以根据使用场景定制外形，也可以根据电池的参数要求调节FPCB/FCCL铜箔大小。
Description
技术领域
本发明涉及光伏组件技术领域，尤其涉及FPCB/FCCL替代镀锡铜焊带作为光伏组件汇流条。
背景技术
传统的太阳能电池片汇流条使用的是镀锡铜焊带，虽然镀锡铜焊带具有柔软可卷曲的性能，但是用在柔性太阳能组件上时，由于柔性太阳能件的特性是可弯曲卷绕，镀锡铜焊带经过多次反复的卷绕或折弯等交变载荷的情况后容易变得疲劳脆弱，产生断裂，造成线路开路，无法把光伏组件发出的电流导出，使柔性组件的性能大幅降低。在此背景下发明了使用FPCB/FCCL来代替镀锡铜焊带作为光伏组件汇流条。
发明内容
针对上述问题，本发明提供了一种FPCB/FCCL替代镀锡铜焊带作为光伏组件汇流条。
为解决上述技术问题，本发明所采用的技术方案是：FPCB/FCCL替代镀锡铜焊带作为光伏组件汇流条，所述FPCB/FCCL由一种绝缘基材和导电层构成的复合材料，所述绝缘基材采用PI或PET做基材，导电层一般为铜箔。
进一步的，所述FPCB/FCCL基材可以制作成片状或条状等任意形状的导电线路。
进一步的，所述FPCB/FCCL基材可以做成FPCB(柔性印刷线路版)的形式。
进一步的，所述FPCB/FCCL包含且不限于PI或PET作为有机材料复合铜箔或其他金属箔。
进一步的，FPCB/FCCL上导电铜箔或其他金属可以用胶贴合，压合，电镀，PECVD，CVD等工艺结合成。
进一步的，FPCB/FCCL还可以根据使用的场景，太阳能电池组件电压电流相关参数的要求做成不同长短大小，各种定制的线路的形状；FPCB/FCCL汇流条的宽度及铜箔层的厚度，铜箔层是否电镀金属及金属厚度等，都可以按照太阳能电池组件电压电流的要求改变设计。
由上述对本发明结构的描述可知，和现有技术相比，本发明具有如下优点：
本发明柔性太阳能组件使用FPCB/FCCL替代镀锡铜焊带，大幅提高产品质和稳定性，FPCB/FCCL汇流条同样适用于双玻太阳能组件和单玻太阳能组件；所述的FPCB/FCCL铜箔，可以是FPCB/FCCL带线路，FPCB/FCCL全铜箔(不带线路)，或FPCB/FCCL铜箔部分带线路部分不带线路；所述的FPCB/FCCL铜箔的外形尺寸，可以根据使用场景定制外形，也可以根据电池的参数要求调节FPCB/FCCL铜箔大小。
附图说明
构成本申请的一部分的附图用来提供对本发明的进一步理解，本发明的示意性实施例及其说明用于解释本发明，并不构成对本发明的不当限定。在附图中：
图1为本发明FPCB/FCCL铜箔汇流条的焊接使用图；
图2为本发明FPCB/FCCL铜箔汇流条不带线路图；
图3为本发明FPCB/FCCL带线路图；
图4为本发明FPCB/FCCL部分带线路部分不带线路图。
具体实施方式
为了使本发明的目的、技术方案及优点更加清楚明白，以下结合附图及实施例，对本发明进行进一步详细说明。应当理解，此处所描述的具体实施例仅仅用以解释本发明，并不用于限定本发明。
实施例
参考图1-图4，FPCB/FCCL替代镀锡铜焊带作为光伏组件汇流条，所述FPCB/FCCL由一种绝缘基材和导电层构成的复合材料，所述绝缘基材采用PI或PET做基材，导电层一般为铜箔。PI(或PET)是一种柔性材料，富有弹性，可任意进行弯折、挠曲，更适用柔性太阳能组件这种需要重复挠曲的产品上，测试经过100万次以上风吹振动测试而各项指标基本无明显下降。与镀锡铜焊带相比，FPCB/FCCL还可以因为具有弹性特质而降低焊接点间的应力破坏，所以FPCB/FCCL作为光伏组件汇流条同样适用于非柔性的双玻太阳能组件和单玻太阳能组件，可提升产品的品质，增加产品的稳定性。FPCB/FCCL还可以根据使用的场景和电池参数要求定制线路的形状和大小，能符合更多的应用场景。
所述FPCB/FCCL基材可以制作成片状或条状等任意形状的导电线路。
所述FPCB/FCCL基材可以做成FPCB(柔性印刷线路版)的形式。
所述FPCB/FCCL包含且不限于PI或PET作为有机材料复合铜箔或其他金属箔。
FPCB/FCCL上导电铜箔或其他金属可以用胶贴合，压合，电镀，PECVD，CVD等工艺结合成。
FPCB/FCCL还可以根据使用的场景，太阳能电池组件电压电流相关参数的要求做成不同长短大小，各种定制的线路的形状；FPCB/FCCL汇流条的宽度及铜箔层的厚度，铜箔层是否电镀金属及金属厚度等，都可以按照太阳能电池组件电压电流的要求改变设计。
本发明柔性太阳能组件使用FPCB/FCCL替代镀锡铜焊带，大幅提高产品质和稳定性，FPCB/FCCL汇流条同样适用于双玻太阳能组件和单玻太阳能组件；所述的FPCB/FCCL铜箔，可以是FPCB/FCCL带线路，FPCB/FCCL全铜箔(不带线路)，或FPCB/FCCL铜箔部分带线路部分不带线路；所述的FPCB/FCCL铜箔的外形尺寸，可以根据使用场景定制外形，也可以根据电池的参数要求调节FPCB/FCCL铜箔大小。
以上所述仅为本发明的较佳实施例而已，并不用以限制本发明，凡在本发明的精神和原则之内所作的任何修改、等同替换和改进等，均应包含在本发明的保护范围之内。
Claims (3)
1.FPCB/FCCL替代镀锡铜焊带作为光伏组件汇流条，其特征在于：所述FPCB/FCCL由一种绝缘基材和导电层构成的复合材料，所述绝缘基材采用PI或PET做基材；所述导电层为导电铜箔，其中一部分带线路，一部分不带线路。
2.根据权利要求1所述FPCB/FCCL替代镀锡铜焊带作为光伏组件汇流条，其特征在于：所述FPCB/FCCL为片状或条状。
3.根据权利要求1或2所述FPCB/FCCL替代镀锡铜焊带作为光伏组件汇流条，其特征在于：所述FPCB/FCCL上的导电铜箔为用胶贴合、压合、电镀、PECVD或CVD工艺形成。
Priority Applications (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110337958.XA CN115148833B (zh) | 2021-03-30 | 2021-03-30 | Fpcb/fccl替代镀锡铜焊带作为光伏组件汇流条 |
| EP21210333.7A EP4068391B1 (en) | 2021-03-30 | 2021-11-24 | Fpcb/fccl replacing tinned-copper welding strip as photovoltaic module bus bar |
| ES21210333T ES2971917T3 (es) | 2021-03-30 | 2021-11-24 | FPCB/FCCL que sustituye la banda de soldadura de cobre estañado como la barra del bus del módulo fotovoltaico |
| US17/456,578 US11677034B2 (en) | 2021-03-30 | 2021-11-25 | FPCB/FCCL replacing tinned-copper welding strip as photovoltaic module bus bar |
| AU2021277609A AU2021277609B2 (en) | 2021-03-30 | 2021-11-29 | Fpcb/fccl replacing tinned-copper welding strip as photovoltaic module bus bar |
| PCT/CN2022/083101 WO2022206610A1 (zh) | 2021-03-30 | 2022-03-25 | Fpcb/fccl替代镀锡铜焊带作为光伏组件汇流条 |
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| CN202110337958.XA CN115148833B (zh) | 2021-03-30 | 2021-03-30 | Fpcb/fccl替代镀锡铜焊带作为光伏组件汇流条 |
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| CN115148833A CN115148833A (zh) | 2022-10-04 |
| CN115148833B true CN115148833B (zh) | 2024-05-28 |
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Country Status (6)
| Country | Link |
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| US (1) | US11677034B2 (zh) |
| EP (1) | EP4068391B1 (zh) |
| CN (1) | CN115148833B (zh) |
| AU (1) | AU2021277609B2 (zh) |
| ES (1) | ES2971917T3 (zh) |
| WO (1) | WO2022206610A1 (zh) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN212062449U (zh) * | 2019-09-10 | 2020-12-01 | 福建省辉锐电子技术有限公司 | 一种柔性可卷曲的硅基电池模组 |
| CN112490321A (zh) * | 2019-09-10 | 2021-03-12 | 福建省辉锐电子技术有限公司 | 一种fpcb焊带焊接方法 |
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| WO2009033215A1 (en) * | 2007-09-10 | 2009-03-19 | Dyesol Industries Pty Ltd | An array of solar cells |
| CN101488536B (zh) * | 2007-09-13 | 2010-08-04 | 胡玉海 | 太阳能光伏组件汇流带及汇流带组装太阳能板的方法 |
| US20120216849A1 (en) * | 2009-11-18 | 2012-08-30 | Lg Innotek Co., Ltd. | Solar Photovoltaic Device |
| KR101144935B1 (ko) * | 2011-11-11 | 2012-05-11 | (주)미르솔라 | 적층 구조로 형성된 pcb 타입의 태양전지 모듈용 버스바 |
| KR20130093876A (ko) | 2012-02-15 | 2013-08-23 | 김영상 | 태양광 ｐｖ 모듈에 사용되는 리본 및 버스 바아 그리고 이의 제조 방법 |
| US20140069479A1 (en) | 2012-09-11 | 2014-03-13 | Samsung Sdi Co., Ltd. | Photoelectric Device Module and Manufacturing Method Thereof |
| CN102983196A (zh) * | 2012-12-06 | 2013-03-20 | 乐叶光伏股份有限公司 | 一种太阳能电池组件 |
| US9685568B2 (en) * | 2014-03-12 | 2017-06-20 | Merlin Solar Technologies, Inc. | Photovoltaic module with flexible circuit |
| JP2016096309A (ja) * | 2014-11-17 | 2016-05-26 | シャープ株式会社 | フレキシブルプリント配線板、太陽電池モジュールおよび太陽光発電装置 |
| US10418933B2 (en) * | 2015-12-08 | 2019-09-17 | Alta Devices, Inc. | Versatile flexible circuit interconnection for flexible solar cells |
| CN106604538A (zh) | 2016-12-13 | 2017-04-26 | 苏州城邦达力材料科技有限公司 | 一种柔性线路板及其制备方法 |
| KR102187038B1 (ko) | 2018-12-21 | 2020-12-07 | (주)이녹스첨단소재 | 연성 동박 적층필름 |
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- 2021-03-30 CN CN202110337958.XA patent/CN115148833B/zh active Active
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- 2021-11-29 AU AU2021277609A patent/AU2021277609B2/en active Active
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN212062449U (zh) * | 2019-09-10 | 2020-12-01 | 福建省辉锐电子技术有限公司 | 一种柔性可卷曲的硅基电池模组 |
| CN112490321A (zh) * | 2019-09-10 | 2021-03-12 | 福建省辉锐电子技术有限公司 | 一种fpcb焊带焊接方法 |
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| Publication number | Publication date |
|---|---|
| EP4068391B1 (en) | 2024-01-03 |
| EP4068391A1 (en) | 2022-10-05 |
| ES2971917T3 (es) | 2024-06-10 |
| EP4068391C0 (en) | 2024-01-03 |
| AU2021277609B2 (en) | 2023-06-01 |
| AU2021277609A1 (en) | 2022-10-20 |
| CN115148833A (zh) | 2022-10-04 |
| US20220320352A1 (en) | 2022-10-06 |
| WO2022206610A1 (zh) | 2022-10-06 |
| US11677034B2 (en) | 2023-06-13 |
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