CN115145079B - Display device and manufacturing method thereof - Google Patents
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- CN115145079B CN115145079B CN202210756327.6A CN202210756327A CN115145079B CN 115145079 B CN115145079 B CN 115145079B CN 202210756327 A CN202210756327 A CN 202210756327A CN 115145079 B CN115145079 B CN 115145079B
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- 238000004519 manufacturing process Methods 0.000 title claims description 10
- 239000000758 substrate Substances 0.000 claims abstract description 144
- 238000007789 sealing Methods 0.000 claims abstract description 84
- 239000000853 adhesive Substances 0.000 claims description 279
- 230000001070 adhesive effect Effects 0.000 claims description 279
- 239000002184 metal Substances 0.000 claims description 43
- 239000000463 material Substances 0.000 claims description 37
- 239000002245 particle Substances 0.000 claims description 18
- 239000003292 glue Substances 0.000 claims description 12
- 238000000034 method Methods 0.000 claims description 12
- 239000011521 glass Substances 0.000 claims description 5
- 238000004806 packaging method and process Methods 0.000 claims description 3
- 239000000843 powder Substances 0.000 claims 1
- 238000002360 preparation method Methods 0.000 abstract description 5
- 230000000694 effects Effects 0.000 abstract 1
- 230000002349 favourable effect Effects 0.000 abstract 1
- 239000004973 liquid crystal related substance Substances 0.000 description 11
- 230000005611 electricity Effects 0.000 description 7
- 230000003068 static effect Effects 0.000 description 6
- 230000003287 optical effect Effects 0.000 description 4
- 239000003990 capacitor Substances 0.000 description 3
- 238000004891 communication Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 210000002858 crystal cell Anatomy 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 230000011218 segmentation Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1339—Gaskets; Spacers; Sealing of cells
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/841—Self-supporting sealing arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
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- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Optics & Photonics (AREA)
- Mathematical Physics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The embodiment of the application provides a display device and a preparation method of the display device, wherein the display device is provided with a display area and a non-display area which is arranged around at least part of the display area, and the display device comprises: the antenna comprises a first substrate, a frame sealing part and a second substrate, wherein the frame sealing part is arranged on the first substrate and positioned in a non-display area, the frame sealing part comprises a first conductive bonding part which is arranged around at least part of the display area, and the first conductive bonding part at least serves as an antenna; the second substrate is positioned at one side of the frame sealing part, which is away from the first substrate, and the second substrate is connected with the first substrate in a sealing way through the frame sealing part. In this application, be arranged in connecting the first conductive bonding portion in the frame sealing portion of first base plate and second base plate not only can play the effect of connecting first base plate and second base plate, can also be used as the antenna, can release the setting space of antenna in display panel, under the prerequisite that does not increase display panel size, be favorable to setting up more antennas in display panel.
Description
Technical Field
The present disclosure relates to the field of display technologies, and in particular, to a display device and a method for manufacturing the display device.
Background
Liquid crystal display (Liquid Crystal Display, LCD) panels, organic light emitting diode display (Organic Light Emitting Display, OLED) panels, and flat display panels such as display panels using light emitting diode (Light Emitting Diode, LED) devices have been widely used in various consumer electronic products such as mobile phones, televisions, personal digital assistants, digital cameras, notebook computers, and desktop computers, as a result of their advantages such as high image quality, power saving, thin body, and wide application range.
Various conductive signal lines, such as an antenna, a driving circuit, and an electrostatic discharge unit, are required to be disposed in the display panel, but at present, the display panel is developed towards a light and thin structure, and how to reasonably dispose the signal lines at the position of the display panel is a technical problem to be solved.
Disclosure of Invention
The embodiment of the application provides a display device and a preparation method of the display device, and aims to solve the problem of how to release the arrangement space of signal wires in a display panel.
Embodiments of a first aspect of the present application provide a display device having a display area and a non-display area disposed around at least a portion of the display area, the display device comprising:
a first substrate;
the frame sealing part is arranged on the first substrate and positioned in the non-display area, and comprises a first conductive bonding part which is arranged around at least part of the display area and at least used as an antenna;
the second substrate is positioned at one side of the frame sealing part, which is away from the first substrate, and is connected with the first substrate in a sealing way through the frame sealing part.
According to an embodiment of the first aspect of the present application, the first conductive adhesive portion is multiplexed into the antenna and the electrostatic discharge portion.
According to any one of the foregoing embodiments of the first aspect of the present application, the display device further includes a switch and a signal processing circuit, the first end of the switch opening is electrically connected to the first conductive adhesive portion, the second end of the switch opening is grounded, and the third end of the switch opening is electrically connected to the signal processing circuit.
According to any one of the foregoing embodiments of the first aspect of the present application, the frame sealing portion further includes a first insulating bonding portion and at least one second conductive bonding portion, the first conductive bonding portion and the second conductive bonding portion are distributed at intervals along a direction of the display area pointing to the non-display area, and the first conductive bonding portion is located at a side of the second conductive bonding portion facing to or facing away from the display area, and the second conductive bonding portion is connected to the low-level signal line.
According to any of the foregoing embodiments of the first aspect of the present application, the first conductive adhesive portion and the second conductive adhesive portion comprise a paste doped with conductive particles, and the first insulating adhesive portion comprises an insulating paste.
According to any one of the foregoing embodiments of the first aspect of the present application, the first conductive adhesive portion is plural, the plural first conductive adhesive portions are arranged along a direction from the display area to the non-display area, the frame sealing portion further includes a second insulating adhesive portion, a second insulating adhesive portion is disposed between adjacent first conductive adhesive portions, the plural first conductive adhesive portions are connected in series, and the first conductive adhesive portion is in a non-closed ring shape.
According to any of the foregoing embodiments of the first aspect of the present application, the first conductive adhesive portion includes a paste doped with conductive particles, and the second insulating adhesive portion includes an insulating paste.
According to any of the foregoing embodiments of the first aspect of the present application, the frame sealing portion further includes a third insulating adhesive portion and a third conductive adhesive portion, the first conductive adhesive portion is located at a side of the third conductive adhesive portion facing away from or toward the display area, the third conductive sub-packaging portion is suspended or connected to the dc voltage signal line, and the third insulating adhesive portion is located between the first conductive adhesive portion and the third conductive adhesive portion.
According to any one of the preceding embodiments of the first aspect of the present application, the first conductive adhesive portion and the third conductive adhesive portion comprise a glue material doped with conductive particles, and the third insulating adhesive portion comprises an insulating glue.
According to any of the foregoing embodiments of the first aspect of the present application, the first conductive adhesive portion is disposed around at least a portion of the display area.
According to any one of the foregoing embodiments of the first aspect of the present application, the first conductive adhesive portion includes a plurality of segments that are distributed at intervals in the circumferential direction of the display area, and a fourth insulating adhesive portion is provided between two adjacent segments in the circumferential direction.
According to any of the foregoing embodiments of the first aspect of the present application, the display panel further includes a binding area located on a side of the non-display area facing away from the display area;
the display device further comprises a first signal line layer, wherein the first signal line layer comprises a first signal line, and the first signal line is connected to the first conductive bonding part and extends to the binding area.
According to any one of the foregoing embodiments of the first aspect of the present application, the display device further includes a second signal line layer, which is located on a side of the first signal line layer facing the frame sealing portion, the second signal line layer including a second signal line for connecting the first conductive adhesive portion and the first signal line;
the number of the first conductive bonding parts is more than two, and the more than two first conductive bonding parts are connected in series or in parallel through the second signal lines.
According to any one of the foregoing embodiments of the first aspect of the present application, the first substrate includes a driving device layer and a pixel electrode layer located on a side of the driving device layer facing the second substrate, the driving device layer includes a first metal layer, a second metal layer, and a third metal layer, the first signal line layer is located on at least one of the first metal layer, the second metal layer, and the third metal layer, and the second signal line layer is located on at least one of the second metal layer, the third metal layer, and the pixel electrode layer.
According to any of the foregoing embodiments of the first aspect of the present application, the first substrate is an active light-emitting substrate, the second substrate is a package cover, and the frame sealing portion includes a glass frit material.
An embodiment of a second aspect of the present application provides a method for manufacturing a display device having a display area and a non-display area disposed around at least a portion of the display area, the method comprising:
providing a frame sealing part on the non-display area of the first substrate, wherein the frame sealing part comprises a first conductive bonding part arranged around at least part of the display area; the first conductive adhesive portion serves at least as an antenna;
the second substrate is arranged on one side of the frame sealing part, which is away from the first substrate, so that the second substrate is in sealing connection with the first substrate through the frame sealing part.
According to an embodiment of the second aspect of the present application,
the first conductive adhesive part comprises a glue material doped with conductive particles, and in the step of arranging the frame sealing part on the non-display area of the first substrate:
and forming a frame sealing part on the non-display area of the first substrate by using a conductive adhesive dripping part and an insulating adhesive dripping part which are arranged side by side along the direction of the display area to the non-display area, wherein the conductive adhesive dripping part is used for forming at least a first conductive bonding part on the non-display area of the first substrate, and the insulating adhesive dripping part is used for forming an insulating bonding part on the non-display area of the first substrate.
In the display panel provided by the embodiment of the application, the display panel comprises a first substrate, a second substrate and a frame sealing part positioned between the first substrate and the second substrate. The frame sealing part is provided with a first conductive adhesive part which is used at least as an antenna, that is, the display device can arrange at least part of the antenna in the frame sealing part for connecting the first substrate and the second substrate. The frame sealing part not only can play a role of connecting the first substrate and the second substrate, but also can be used as an antenna, can release the setting space of the antenna in the display panel, and is beneficial to setting more antennas in the display panel on the premise of not increasing the size of the display panel.
Drawings
Other features, objects and advantages of the present application will become more apparent upon reading the following detailed description of non-limiting embodiments, taken in conjunction with the accompanying drawings, in which like or similar reference characters designate like or similar features.
Fig. 1 is a schematic top view of a display device according to an embodiment of a first aspect of the present application;
FIG. 2 is a schematic view of a partial enlarged cross-sectional structure at A-A in FIG. 1;
fig. 3 is a circuit configuration diagram of a diverter switch provided in the present application;
FIG. 4 is a schematic view of a partial enlarged cross-sectional structure at A-A in FIG. 1 in another embodiment;
fig. 5 is a schematic top view of a display device according to another embodiment of the first aspect of the present application;
FIG. 6 is a cross-sectional view at A-A in FIG. 5;
fig. 7 is a schematic top view of a display device according to another embodiment of the first aspect of the present application;
fig. 8 is a schematic top view of a display device according to another embodiment of the first aspect of the present application;
fig. 9 is a schematic top view of a display device according to another embodiment of the first aspect of the present application;
FIG. 10 is a schematic view of a partially enlarged cross-sectional structure at B-B in FIG. 9 in one embodiment;
FIG. 11 is a schematic view of a partially enlarged cross-sectional structure at B-B in FIG. 9 in another embodiment;
FIG. 12 is a schematic view of a partially enlarged cross-sectional structure at B-B in FIG. 9 in yet another embodiment;
fig. 13 is a schematic flow chart of a method for manufacturing a display device according to an embodiment of the second aspect of the present application.
Reference numerals illustrate:
100. a first substrate; 110. a driving device layer; 111. a first metal layer; 112. a second metal layer; 113. a third metal layer; 120. a pixel electrode layer; 121. a pixel electrode;
200. sealing the frame part; 210. a first conductive adhesive portion; 211. segmentation; 220. a first insulating adhesive portion; 230. a second conductive adhesive portion; 240. a second insulating adhesive portion; 250. a third conductive adhesive portion; 260. a third insulating adhesive portion; 270. a fourth insulating adhesive portion;
300. a second substrate;
410. a first signal line; 420. a second signal line;
500. a pixel definition layer; 510. a pixel defining section; 520. a pixel opening;
600. a support column;
700. a change-over switch; 710. a first end; 720. a second end; 730. a third end;
800. a signal processing circuit;
AA. A display area; NA, non-display area; BA. Binding area.
Detailed Description
Features and exemplary embodiments of various aspects of the present application are described in detail below. In the following detailed description, numerous specific details are set forth in order to provide a thorough understanding of the present application. It will be apparent, however, to one skilled in the art that the present application may be practiced without some of these specific details. The following description of the embodiments is merely intended to provide a better understanding of the present application by showing an example of the present application. In the drawings and the following description, at least some well-known structures and techniques are not shown in order to avoid unnecessarily obscuring the present application; also, the dimensions of some of the structures may be exaggerated for clarity. Furthermore, the described features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.
In the description of the present application, it is to be noted that, unless otherwise indicated, the meaning of "plurality" is two or more; the terms "upper," "lower," "left," "right," "inner," "outer," and the like indicate an orientation or positional relationship merely for convenience of description and to simplify the description, and do not indicate or imply that the devices or elements being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus are not to be construed as limiting the present application. Furthermore, the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
The directional terms appearing in the following description are all directions shown in the drawings and do not limit the specific structure of the embodiments of the present application. In the description of the present application, it should also be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be directly connected or indirectly connected. The specific meaning of the terms in the present application can be understood as appropriate by one of ordinary skill in the art.
For better understanding of the present application, a display device and a method for manufacturing the display device according to an embodiment of the present application are described in detail below with reference to fig. 1 to 13.
Referring to fig. 1 and fig. 2 together, fig. 1 is a schematic top view of a display device according to an embodiment of the first aspect of the present application. Fig. 2 is a partial cross-sectional view at A-A in fig. 1.
As shown in fig. 1 and 2, a display device provided in an embodiment of a first aspect of the present application has a display area AA and a non-display area NA disposed around at least a portion of the display area AA, and the display device includes: a first substrate 100, a frame sealing portion 200, and a second substrate 300. The area where the frame sealing portion 200 is located is FA.
The frame sealing part 200 is disposed on the first substrate 100 and located in the non-display area NA, and the frame sealing part 200 includes a first conductive adhesive part 210 disposed around at least a portion of the display area AA, where the first conductive adhesive part 210 serves as at least an antenna; the second substrate 300 is located at a side of the frame sealing portion 200 away from the first substrate 100, and the second substrate 300 is hermetically connected to the first substrate 100 through the frame sealing portion 200.
In the display panel provided in the embodiment of the application, the display panel includes a first substrate 100, a second substrate 300, and a frame sealing portion 200 located between the first substrate 100 and the second substrate 300. The first conductive adhesive portion 210 is provided in the frame sealing portion 200, and the first conductive adhesive portion 210 serves at least as an antenna, that is, the display panel can provide at least part of the antenna in the frame sealing portion 200 for connecting the first substrate 100 and the second substrate 300. At least a portion of the frame sealing part 200 (or the first conductive adhesive part 210) can serve not only as a connection between the first substrate 100 and the second substrate 300, but also as an antenna, and can release the installation space of the antenna in the display panel, thereby facilitating the installation of more antennas in the display panel without increasing the size of the display panel. The use of the first conductive adhesive part 210 as an antenna can increase the thickness of the line of the antenna, thereby reducing the impedance of the antenna, facilitating the increase of the signal strength of the antenna, and the reduction of the voltage applied to the antenna, compared to an antenna in the form of a metal wire having a thinner thickness.
Optionally, the display device further includes a sub-pixel, and the sub-pixel may be disposed in the display area AA to implement a display function. The non-display area NA may be in a closed loop shape around the display area AA, or the non-display area NA may be disposed around a portion of the display area AA. Optionally, an edge of the non-display area NA away from the display area AA coincides with an edge of the area FA of the frame sealing portion 200 away from the display area AA.
The display device may include light emitting devices such as organic light emitting diodes (Organic Light Emitting Diode, OLED), liquid crystal displays (Liquid Crystal Display, LCD), micro light emitting diodes (Micro Light Emitting Diode, micro LEDs), and the like.
In some embodiments, the first substrate 100 may include a driving device layer, and the first substrate 100 may include a substrate, a driving circuit provided to the substrate, and the like. The second substrate 300 may be a package cover of the display device. For example, the second substrate 300 is a glass package cover plate. In some embodiments, optionally, the material of the frame sealing part 200 may include glass frit, filler and adhesive, and then the frame sealing part 200 is sintered and fixed by laser (ultraviolet light), so that the frame sealing part 200 can be sealed and adhered between the first substrate 100 and the second substrate 300, and the sealing part plays a role in packaging, so as to prevent the light emitting device from being damaged by intrusion of water and oxygen.
In other embodiments, the display device is a liquid crystal display device, the first substrate 100 and the second substrate 300 are encapsulated and connected by the frame sealing portion 200 to form a liquid crystal cell, and liquid crystal particles may be disposed between the first substrate 100 and the second substrate 300. In these alternative embodiments, optionally, the material of the frame sealing part 200 includes a glue material, and the first substrate 100 and the second substrate 300 are adhered to each other by the glue material. Optionally, the first substrate 100 is an array substrate, the second substrate 300 is a color film substrate, a liquid crystal layer is disposed between the first substrate 100 and the second substrate 300, the liquid crystal layer is located in the display area AA and located in the frame sealing portion 200, that is, the frame sealing portion 200 is disposed around the liquid crystal layer, and the liquid crystal layer is located in a closed space formed by enclosing the first substrate 100, the frame sealing portion 200 and the second substrate 300.
The first conductive adhesive portion 210 may be made of various materials, and optionally, the material of the first conductive adhesive portion 210 includes a glue material and conductive particles, that is, the first conductive adhesive portion 210 includes a glue material doped with conductive particles. The conductive particles are mixed in the paste so that the first conductive adhesive portion 210 can conduct electricity and can be adhered between the first substrate 100 and the second substrate 300. The adhesive material can be optical adhesive and other materials.
The first conductive adhesive portion 210 may be disposed in various manners, and the first conductive adhesive portion 210 may be multiplexed as an electrostatic discharge portion and/or an antenna. When the first conductive adhesive part 210 is multiplexed as the electrostatic discharge part, static electricity generated during the preparation or use of the display device can be discharged through the first conductive adhesive part 210, so as to improve the yield of the display device. When the first conductive adhesive part 210 is multiplexed as an antenna, the display device can transmit and receive antenna signals through the first conductive adhesive part 210 to realize signal transmission of the display device.
In some embodiments, the first conductive adhesive portion 210 is time multiplexed into an antenna and an electrostatic discharge portion. That is, at one time, the first conductive adhesive portion 210 can be reused as an antenna, and at another time, the first conductive adhesive portion 210 can be reused as an electrostatic discharge portion, and also functions as electromagnetic shielding, and can shield the influence of electromagnetic interference generated between the outside and the circuit structure in the display area AA. On the one hand, the function of the first conductive adhesive portion 210 can be enriched, and on the other hand, the structure of the display device can be simplified.
Referring to fig. 3, fig. 3 is a partial circuit diagram of a display device according to an embodiment of the first aspect of the present application.
Alternatively, as shown in fig. 3, the display device includes a switch 700 and a signal processing circuit 800, where a first end 710 of the switch 700 is electrically connected to the first conductive adhesive portion 210, a second end 720 of the switch 700 is grounded, a third end 730 of the switch 700 is electrically connected to the signal processing circuit 800, so that when the first end 710 and the second end 720 are connected, the first conductive adhesive portion 210 can be reused as an electrostatic discharge portion, and when the first end 710 and the third end 730 are connected, the first conductive adhesive portion 210 can be reused as an antenna.
In these embodiments, by adding a change-over switch 700 to the display device, when the first end 710 and the second end 720 are connected, the first conductive adhesive portion 210 is grounded, and the first conductive adhesive portion 210 can discharge static electricity. When the first end 710 and the third end 730 are connected, the first conductive adhesive part 210 and the signal processing circuit 800 are electrically connected, an antenna signal can be transmitted between the first conductive adhesive part 210 and the signal processing circuit 800, and the first conductive adhesive part 210 can be multiplexed as an antenna. The change-over switch 700 may include a relay or a switching tube, etc. The signal processing circuit 800 may be electrically connected to the control terminal of the switch 700 to control the on/off states of the switch 700 among the first terminal 710, the second terminal 720 and the third terminal 730.
The second terminal 720 being grounded includes a second terminal 720 ground line, or the second terminal 720 being connected to a power line, as long as the first conductive adhesive portion 210 can be multiplexed as an electrostatic discharge portion when the first terminal 710 and the second terminal 720 are turned on. For example, when the first conductive adhesive part 210 is multiplexed as the static electricity discharge part, the first conductive adhesive part 210 is optionally electrically connected to the power line in order to discharge static electricity, so that the first conductive adhesive part 210 can discharge static electricity through the power line. The power supply line may include, for example, a low-level power supply line having a voltage of, for example, -7V, by which positive charges generated on the electrostatic discharge portion can be neutralized. Alternatively, the power supply line may include, for example, a high-level power supply line having a voltage of, for example, 7V, and the negative charge generated in the electrostatic discharge portion can be neutralized by the high-level power supply line. Alternatively, the power line may comprise a ground power line.
Optionally, when the first conductive adhesive part 210 is multiplexed into an antenna, the antenna may form one or more of a millimeter wave antenna, a bluetooth antenna, a wireless network communication technology (Wi-Fi) antenna, a global positioning system (Global Positioning System, GPS) antenna, a near field communication (Near Field Communication, NFC) antenna, and a Laser-Direct-structuring (LDS) antenna.
Optionally, as shown in fig. 4, the frame sealing portion 200 further includes a first insulating adhesive portion 220. Alternatively, the first conductive adhesive part 210 and the first insulating adhesive part 220 are disposed side by side along the direction in which the display area AA points to the non-display area NA, and the first insulating adhesive part 220 includes, for example, adhesive such that the first substrate 100 and the second substrate 300 can be adhered to each other through the first insulating adhesive part 220. The first insulating adhesive portion 220 includes an insulating paste.
Referring to fig. 5 and 6, in alternative embodiments, the frame sealing portion 200 further includes a first insulating adhesive portion 220 and at least one second conductive adhesive portion 230. The second conductive adhesive part 230 may be used for electrostatic discharge. The first conductive adhesive parts 210 and the second conductive adhesive parts 230 are spaced apart along the direction of the display area AA pointing to the non-display area NA, the first insulating adhesive part 220 is located between the first conductive adhesive parts 210 and the second conductive adhesive parts 230, and the first conductive adhesive parts 210 are located at one side of the second conductive adhesive parts 230 facing to or facing away from the display area AA, and the second conductive adhesive parts 230 are connected to low-level signal lines. The second conductive adhesive part 230 for electrostatic discharge also functions as electromagnetic shielding.
In these alternative embodiments, the frame sealing part 200 includes a first conductive adhesive part 210 and a second conductive adhesive part 220, the first conductive adhesive part 210 is multiplexed as an antenna, the second conductive adhesive part 220 is multiplexed as an electrostatic discharge part, and a first insulating adhesive part 230 is provided between the first conductive adhesive part 210 and the second conductive adhesive part 220, that is, the antenna and the electrostatic discharge part are arranged to be insulated from each other, so that the antenna and the electrostatic discharge part do not interfere with each other.
Alternatively, as shown in fig. 5 and 6, the second conductive adhesive part 230 is located at a side of the first conductive adhesive part 210 facing away from the display area AA, so that the second conductive adhesive part 230 can shield the influence of electromagnetic interference generated between the outside and the circuit structures in the first conductive adhesive part 210 and the display area AA. In other embodiments, the second conductive adhesive part 230 may be further located at a side of the first conductive adhesive part 210 facing the display area AA, so that the second conductive adhesive part 230 may shield the influence of electromagnetic interference generated between the first conductive adhesive part 210 for an antenna and the circuit structure within the display area AA.
Optionally, as shown in fig. 5 and 6, a layer of first insulating adhesive portion 220 is further disposed on a side of the second conductive adhesive portion 230 facing away from the first conductive adhesive portion 210, so that the first insulating adhesive portion 220 can provide protection for the second conductive adhesive portion 230, and the first substrate 100 and the second substrate 300 can be adhered to each other through the first insulating adhesive portion 220, the first conductive adhesive portion 210 and the second conductive adhesive portion 220, so as to improve stability of a relative position between the first substrate 100 and the second substrate 300.
The second conductive adhesive part 230 is provided with various materials, and optionally, the material of the second conductive adhesive part 230 includes a glue material and conductive particles, that is, the second conductive adhesive part 230 includes a glue material doped with conductive particles. The conductive particles are mixed in the paste so that the second conductive adhesive part 230 can be conductive and can be adhered between the first substrate 100 and the second substrate 300. The adhesive material can be optical adhesive and other materials. The second conductive adhesive part 230 may be a closed loop shape. The second conductive adhesive part 230 may be one or more. The second conductive adhesive part 230 may be plural and serves to shunt static electricity. The number of the second conductive adhesive parts 230 may be two, wherein one second conductive adhesive part 230 is located at a side of the first conductive adhesive part 210 facing away from the display area AA, and the other second conductive adhesive part 230 is located at a side of the first conductive adhesive part 210 facing toward the display area AA.
Referring to fig. 7, in some embodiments, the number of the first conductive adhesive portions 210 is plural. Alternatively, the plurality of first conductive adhesive parts 210 are arranged along the direction in which the display area AA points to the non-display area NA. Optionally, the frame sealing portion 200 further includes a second insulating adhesive portion 240, and a second insulating adhesive portion 240 is disposed between adjacent first conductive adhesive portions 210; the plurality of first conductive adhesive parts 210 are connected in series.
Alternatively, the first conductive adhesive part 210 has a non-closed ring shape. The second insulating adhesive portion 240 includes an insulating paste.
In these alternative embodiments, the plurality of first conductive adhesive portions 210 are serially connected to each other to form a spiral distribution, so that the distribution area of the antenna can be increased, and the performance of the antenna can be further improved.
Referring to fig. 8, in still other alternative embodiments, frame portion 200 further includes a third insulating bond 260 and a third conductive bond 250. The third conductive adhesive 250 may be used for electromagnetic shielding. Alternatively, the first conductive adhesive part 210 is located at a side of the third conductive adhesive part 250 facing away from the display area AA, so that the third conductive adhesive part 250 can shield the influence of electromagnetic interference generated between the outside and the circuit structures in the first conductive adhesive part 210 and the display area AA. Alternatively, the first conductive adhesive part 210 is located at a side of the third conductive adhesive part 250 facing the display area AA, so the third conductive adhesive part 250 can shield an influence of electromagnetic interference generated between the first conductive adhesive part 210 serving as an antenna and a circuit structure within the display area AA. Optionally, the third conductive adhesive part 250 is suspended or connected to the dc voltage signal line. Optionally, a third insulating bond 260 is located between the first conductive bond 210 and the third conductive bond 250.
In these alternative embodiments, the third insulating bonding part 260 is located between the first conductive bonding part 210 and the third conductive bonding part 250, so that mutual insulation between the first conductive bonding part 210 and the third bonding part 250 can be ensured, and the third conductive bonding part 250 is located on the side of the first conductive bonding part 210 facing the display area AA, so that the third conductive bonding part 250 can play a shielding role on the first conductive bonding part 210, and other components in the display area AA can be improved to influence the transmission of antenna signals.
The third conductive adhesive portion 250 is suspended, that is, the third conductive adhesive portion 250 is separately disposed in the frame sealing portion 200 and is not connected to other conductive components.
The third conductive adhesive part 250 is provided with various materials, and optionally, the material of the third conductive adhesive part 250 includes a glue material and conductive particles, that is, the third conductive adhesive part 250 includes a glue material doped with conductive particles. The conductive particles are mixed in the paste so that the third conductive adhesive part 250 can be conductive and can be adhered between the first substrate 100 and the second substrate 300. The adhesive material can be optical adhesive and other materials. The third insulating bonding portion 260 includes an insulating paste. The third conductive adhesive 250 may be in a closed loop shape. The third conductive adhesive 250 may be one or more. The number of the third conductive adhesive parts 250 may be two, wherein one third conductive adhesive part 250 is located at a side of the first conductive adhesive part 210 facing away from the display area AA, and the other third conductive adhesive part 250 is located at a side of the first conductive adhesive part 210 facing toward the display area AA.
Alternatively, the conductive adhesive portions and the insulating adhesive portions are alternately arranged side by side in a direction in which the display area AA points to the non-display area NA. Insulating bonding parts are arranged on two sides of all the conductive bonding parts. The insulating bond closest to the display area AA may provide insulating isolation between the circuit structure of the display area AA and the conductive bond. The insulating adhesive portion farthest from the display area AA can protect the internal conductive adhesive portion and the like.
The first conductive adhesive part 210 may be disposed in various manners, and alternatively, the first conductive adhesive part 210 may be disposed around at least a portion of the display area AA.
Referring to fig. 9, fig. 9 is a schematic top view of a display device according to another embodiment of the disclosure.
In still other embodiments, as shown in fig. 9, the first conductive adhesive part 210 includes a plurality of segments 211 spaced apart in the circumferential direction of the display area AA, and a fourth insulating adhesive part 270 is provided between two circumferentially adjacent segments 211. When the first conductive adhesive part 210 is multiplexed as an antenna, the antenna includes a plurality of segments 211 spaced apart from each other, and each segment 211 can be used to transmit different types of antenna signals, enriching the functions of the first conductive adhesive part 210. Alternatively, part of the segments 211 of the plurality of segments 211 is an antenna, and the other part of the segments 211 is an electrostatic discharge portion, further enriching the function of the conductor portion 210.
In addition, the material of the fourth insulating adhesive part 270 may include an insulating adhesive material, and the first substrate 100 and the second substrate 300 are adhered to each other through the fourth insulating adhesive part 270, so that stability of the relative position between the first substrate 100 and the second substrate 300 can be ensured. The first conductive adhesive parts 210 and the fourth insulating adhesive parts 270 are alternately arranged in the circumferential direction of the display area AA, so that the fourth insulating adhesive parts 270 can be arranged around at least a part of the display area AA in the frame area FA, and different positions of the first substrate 100 and the second substrate 300 in the circumferential direction of the display area AA can be adhered to each other by the first conductive adhesive parts 210 and the fourth insulating adhesive parts 270, thereby further improving the stability of the relative position between the first substrate 100 and the second substrate 300.
The fourth insulating adhesive portion 270 may be provided in various manners, and the material of the fourth insulating adhesive portion 270 may include an organic adhesive material such as an optical adhesive, or the material of the fourth insulating adhesive portion 270 may include an inorganic adhesive material. Or the fourth insulating bond 270 may include glass frit, filler, and adhesive.
Alternatively, as shown in FIG. 10, FIG. 10 is a cross-sectional view at B-B in FIG. 9 in one embodiment. When the first conductive adhesive part 210 includes an antenna, the display device transmits signals to the antenna through the integrated circuit board, for example, the display device further includes a binding area BA on a side of the non-display area NA facing away from the display area AA, and the integrated circuit board is connected to the binding area BA to transmit antenna signals into the display device.
In some alternative embodiments, referring to fig. 10, the display device further includes a first signal line layer, where the first signal line layer includes a first signal line 410, and the first signal line 410 is connected to the first conductive adhesive portion 210 and extends to the bonding area BA. Alternatively, the first signal line 410 may be disposed on the first substrate 100 or the second substrate 300.
In these alternative embodiments, the first conductive adhesive part 210 can be drawn out to the bonding area BA by providing the first signal line 410 on the first substrate 100.
Optionally, the first signal line 410 is electrically connected to each other at the bonding area BA and the integrated circuit board so that the integrated circuit board and the first conductive adhesive part 210 transmit an antenna signal therebetween.
Referring to fig. 11, fig. 11 is a cross-sectional view of fig. 9 at B-B in another embodiment.
Alternatively, as shown in fig. 11, the display device may further include a second signal line layer, which is located at a side of the first signal line layer facing the frame sealing part 200, the second signal line layer including a second signal line 420, the second signal line 420 being for connecting the first conductive adhesive part 210 and the first signal line 410.
In these alternative embodiments, the second signal line 420 is used to make a connection between the first conductive adhesive portion 210 and the first signal line 410. When the number of the first conductive adhesive parts 210 is two or more, the two or more first conductive adhesive parts 210 may be connected in series or in parallel through the second signal line 420, thereby connecting the first conductive adhesive parts 210 after being connected in series or in parallel to the first signal line 410.
Alternatively, the second signal line 420 may be disposed on the first substrate 100 or the second substrate 300. Alternatively, the first signal line 410 and the second signal line 420 are simultaneously located on the first substrate 100 or the second substrate 300, so that the first signal line 410 and the second signal line 420 are connected to each other.
Optionally, an insulating layer is disposed between the first signal line layer and the second signal line layer, and the first signal line 410 and the second signal line 420 may be connected through a via.
As described above, the first substrate 100 is disposed in various ways, referring to fig. 12, fig. 12 is a cross-sectional view of fig. 9 at B-B in yet another embodiment.
In still other alternative embodiments, as shown in fig. 12, the first substrate 100 includes a driving device layer 110 and a pixel electrode layer 120 located at a side of the driving device layer 110 toward the second substrate 300.
Alternatively, the first substrate 100 includes the driving device layer 110 and the light emitting device layer located at a side of the driving device layer 110 facing the second substrate 300. The light emitting device layer may be located in the display region.
Optionally, referring to fig. 12, the display apparatus further includes a pixel defining layer disposed on a side of the pixel electrode layer 120 away from the driving device layer 110, the pixel defining layer includes a pixel defining portion 510 and a pixel opening 520 disposed in the display area AA, and a support pillar 600 is disposed on a side of the pixel defining portion away from the pixel defining layer. Optionally, a light emitting unit is disposed in the pixel opening 520 to achieve light emission of the display panel. Alternatively, the pixel electrode layer 120 includes a plurality of pixel electrodes 121, each pixel electrode 121 is disposed corresponding to each pixel opening 520, and each pixel electrode 121 is used for driving the light emitting unit located in each pixel opening 520 to emit light. Optionally, a common electrode layer is further disposed on a side of the pixel defining layer 500 and the support post 600 facing away from the pixel electrode layer 120, and the common electrode interacts with the pixel electrode 121 to drive the light emitting unit to emit light.
Optionally, referring to fig. 12, devices such as a thin film transistor T, a capacitor C, and the like are disposed in the driving device layer 110, where the thin film transistor T includes a semiconductor layer, a source electrode, a drain electrode, and a gate electrode. The capacitor C comprises two plates.
Alternatively, with continued reference to fig. 12, the driving device layer 110 includes a substrate and a plurality of metal layers, for example, the driving device layer 110 includes a first metal layer 111, a second metal layer 112, and a third metal layer 113 that are sequentially stacked in a direction away from the substrate. Optionally, the gate is located on the first metal layer 111, at least one plate of the capacitor is located on the second metal layer 112, and the source and the drain are located on the third metal layer 113. An insulating layer is provided between the first metal layer 111, the second metal layer 112, the third metal layer 113, and the pixel electrode layer 120.
Optionally, referring to fig. 12, the first substrate 100 further includes a pixel electrode layer 120 located on a side of the driving device layer 110 facing the frame portion 200, where the pixel electrode layer 120 includes a pixel electrode 121.
When the first substrate 100 includes four structural layers of the first metal layer 111, the second metal layer 112, the third metal layer 113, and the pixel electrode layer 120, the first signal line layer and the second signal line layer may be at least two of the four structural layers, as long as the first signal line layer is located at a side of the second signal line layer facing away from the frame sealing portion 200.
For example, when the first signal line layer is the third metal layer 113, the second signal line layer may be the pixel electrode layer 120. When the first signal line layer is the second metal layer 112, the second signal line layer may be the third metal layer 113 or the pixel electrode layer 120. When the first signal line layer is the first metal layer 111, the second signal line layer may be at least one of the second metal layer 112, the third metal layer 113, and the pixel electrode layer 120. In fig. 12, the third metal layer 113 is taken as a second signal line layer, the second signal line 420 is disposed on the third metal layer 113, the second metal layer 112 is taken as a first signal line layer, and the first signal line 410 is disposed on the second metal layer 112 for illustration.
Referring to fig. 13, fig. 13 is a schematic flow chart of a manufacturing method of a display device according to a second embodiment of the present application. The display device may be a display device provided in any one of the embodiments of the first aspect.
As shown in fig. 13, and referring to fig. 1 to 12, the method for manufacturing the display device includes:
step S01: providing a frame sealing part 200 on the first substrate 100, the frame sealing part 200 including a first conductive adhesive part 210 disposed around at least a portion of the display area AA; the first conductive adhesive portion 210 serves at least as an antenna.
Step S02: the second substrate 300 is disposed on a side of the frame sealing portion 200 away from the first substrate 100, so that the second substrate 300 is hermetically connected to the first substrate 100 through the frame sealing portion 200.
In the method for manufacturing the display device provided in the embodiment of the present application, in step S01, the frame sealing portion 200 is disposed on the first substrate 100, and in step S02, the first substrate 100 and the second substrate 300 can be connected in a sealing manner by using the frame sealing portion 200. The frame sealing part 200 not only can play a role of connecting the first substrate 100 and the second substrate 300, but also at least part of the frame sealing part 200 (namely, the first conductive bonding part 210) is multiplexed into an antenna, so that the arrangement space of the signal wires can be released in the display panel, and more signal wires can be arranged in the display panel on the premise of not increasing the size of the display panel.
Optionally, in step S01: the frame sealing part 200 is formed on the non-display area NA of the first substrate 100 using a conductive paste drop part and an insulating paste drop part arranged side by side in a direction in which the display area AA points to the non-display area NA, the conductive paste drop part being used to form at least a first conductive adhesive part 210 on the non-display area NA of the first substrate 100, and the insulating paste drop part being used to form an insulating adhesive part on the non-display area NA of the first substrate 100.
In these alternative embodiments, the material of the first conductive adhesive part 210 may be contained in the conductive adhesive dropping part, the material of the first insulating adhesive part 220 may be contained in the insulating adhesive dropping part, the conductive adhesive dropping part and the insulating adhesive dropping part are both provided with the drippers, the material of the first conductive adhesive part 210 is formed from the dripper of the conductive adhesive dropping part onto the first substrate 100 to the first conductive adhesive part 210, the material of the insulating adhesive part is dripped from the dripper of the insulating adhesive dropping part onto the second substrate 300 to form the insulating adhesive part 220, and the conductive adhesive dropping part and the insulating adhesive dropping part are arranged side by side, so that the first conductive adhesive part 210 and the insulating adhesive part 220 can be prepared simultaneously in the same process step, and the preparation efficiency of the frame sealing part 200 can be effectively improved.
Optionally, the plurality of conductive adhesive dripping portions and the plurality of insulating adhesive dripping portions are alternately arranged side by side along a direction of the display area AA pointing to the non-display area NA, so that the plurality of conductive adhesive portions and the plurality of insulating adhesive portions can be prepared in the same process step, the plurality of conductive adhesive portions are arranged at intervals along a direction of the display area AA pointing to the non-display area NA, and the insulating adhesive portions are arranged between two adjacent conductive adhesive portions.
The plurality of conductive adhesive dropping parts and the plurality of insulating adhesive dropping parts are alternately arranged side by side, so that a plurality of conductive adhesive parts and a plurality of insulating adhesive parts, such as the first conductive adhesive part 210, the second conductive adhesive part 230, the first conductive adhesive part 250, the first insulating adhesive part 220, the second insulating adhesive part 240, the third insulating adhesive part 260, the fourth insulating adhesive part 270, etc., can be simultaneously prepared in the same process step, and the preparation efficiency of the frame sealing part 200 can be effectively improved.
The present application may be embodied in other specific forms without departing from its spirit or essential characteristics. For example, the algorithms described in particular embodiments may be modified without departing from the basic spirit of the present application. The present embodiments are, therefore, to be considered in all respects as illustrative and not restrictive, the scope of the application being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.
Claims (14)
1. A display device having a display area and a non-display area disposed around at least a portion of the display area, the display device comprising:
a first substrate;
a frame sealing part arranged on the first substrate and positioned in the non-display area, wherein the frame sealing part comprises a first conductive bonding part which is arranged around at least part of the display area and at least used as an antenna;
the second substrate is positioned at one side of the frame sealing part, which is away from the first substrate, and the second substrate is connected with the first substrate in a sealing way through the frame sealing part, wherein the first conductive bonding part is multiplexed into an antenna and an electrostatic discharge part, the display device further comprises a change-over switch and a signal processing circuit, and the first end of the change-over switch is electrically connected with the first conductive bonding part; the second end of the change-over switch is grounded, and the third end of the change-over switch is electrically connected with the signal processing circuit.
2. The display device according to claim 1, wherein the frame sealing portion further includes a first insulating adhesive portion and at least one second conductive adhesive portion, the first conductive adhesive portion and the second conductive adhesive portion are spaced apart along a direction in which the display area is directed toward the non-display area, the first insulating adhesive portion is located between the first conductive adhesive portion and the second conductive adhesive portion, and the first conductive adhesive portion is located on a side of the second conductive adhesive portion facing toward or away from the display area, the second conductive adhesive portion is connected to a low-level signal line.
3. The display device according to claim 2, wherein the first conductive adhesive portion and the second conductive adhesive portion include a paste doped with conductive particles, and the first insulating adhesive portion includes an insulating paste.
4. The display device according to claim 1, wherein the plurality of first conductive adhesive portions are arranged in a direction in which the display area points to the non-display area;
the frame sealing part further comprises a second insulating bonding part, and the second insulating bonding part is arranged between the adjacent first conductive bonding parts; the plurality of first conductive bonding parts are connected in series, and the first conductive bonding parts are in a non-closed ring shape.
5. The display device according to claim 4, wherein the first conductive adhesive portion comprises a paste doped with conductive particles, and the second insulating adhesive portion comprises an insulating paste.
6. The display device of claim 1, wherein the frame sealing portion further comprises a third insulating adhesive portion and a third conductive adhesive portion, the first conductive adhesive portion being located on a side of the third conductive adhesive portion facing away from or toward the display area, the third conductive adhesive portion being suspended or connected to a dc voltage signal line, the third insulating adhesive portion being located between the first conductive adhesive portion and the third conductive adhesive portion.
7. The display device according to claim 6, wherein the first conductive adhesive portion and the third conductive adhesive portion each comprise a paste doped with conductive particles, and the third insulating adhesive portion comprises an insulating paste.
8. The display device according to claim 1, wherein the first conductive adhesive portion is disposed around the display area.
9. The display device according to claim 8, wherein the first conductive adhesive portion includes a plurality of segments that are spaced apart in a circumferential direction of the display area, and a fourth insulating adhesive portion is provided between two of the segments that are adjacent in the circumferential direction.
10. The display device of claim 1, further comprising a bonding region on a side of the non-display region facing away from the display region, the display device further comprising a first signal line layer comprising a first signal line connected to the first conductive adhesive and extending to the bonding region.
11. The display device according to claim 10, further comprising a second signal line layer located on a side of the first signal line layer facing the frame sealing portion, the second signal line layer including a second signal line for connecting the first conductive adhesive portions and the first signal line, the number of the first conductive adhesive portions being two or more, and two or more of the first conductive adhesive portions being connected in series or in parallel through the second signal line.
12. The display device according to claim 11, wherein the first substrate includes a driving device layer and a pixel electrode layer on a side of the driving device layer facing the second substrate, wherein the driving device layer includes a first metal layer, a second metal layer, and a third metal layer, wherein the first signal line layer is located at least one of the first metal layer, the second metal layer, and the third metal layer, and wherein the second signal line layer is located at least one of the second metal layer, the third metal layer, and the pixel electrode layer.
13. The display device of claim 1, wherein the display device comprises a display device,
the first substrate is an active light-emitting substrate, the second substrate is a packaging cover plate, and the frame sealing part comprises glass powder materials.
14. A method of manufacturing a display device having a display region and a non-display region disposed around at least a portion of the display region, the method comprising:
providing a frame sealing part on a non-display area of a first substrate, wherein the frame sealing part comprises a first conductive bonding part arranged around at least part of the display area; the first conductive adhesive portion serves at least as an antenna;
arranging the second substrate on one side of the frame sealing part, which is away from the first substrate, so that the second substrate is in sealing connection with the first substrate through the frame sealing part; wherein the first conductive bonding part comprises a glue material doped with conductive particles,
in the step of disposing the frame sealing portion on the non-display region of the first substrate:
the frame sealing part is formed on the non-display area of the first substrate by using a conductive adhesive dripping part and an insulating adhesive dripping part which are arranged side by side along the direction of the display area to the non-display area, wherein the conductive adhesive dripping part is used for forming at least the first conductive bonding part on the non-display area of the first substrate, and the insulating adhesive dripping part is used for forming the insulating bonding part on the non-display area of the first substrate.
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| CN202210756327.6A CN115145079B (en) | 2022-06-30 | 2022-06-30 | Display device and manufacturing method thereof |
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