CN115138984B - Automatic laser cutting equipment of flexible circuit board based on high accuracy location - Google Patents
Automatic laser cutting equipment of flexible circuit board based on high accuracy location Download PDFInfo
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- CN115138984B CN115138984B CN202210740549.9A CN202210740549A CN115138984B CN 115138984 B CN115138984 B CN 115138984B CN 202210740549 A CN202210740549 A CN 202210740549A CN 115138984 B CN115138984 B CN 115138984B
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- 238000003698 laser cutting Methods 0.000 title claims abstract description 28
- 238000005520 cutting process Methods 0.000 claims abstract description 180
- 238000004458 analytical method Methods 0.000 claims abstract description 81
- 230000007246 mechanism Effects 0.000 claims abstract description 66
- 238000012545 processing Methods 0.000 claims abstract description 44
- 230000000007 visual effect Effects 0.000 claims abstract description 21
- 238000000034 method Methods 0.000 claims abstract description 4
- 230000008569 process Effects 0.000 claims abstract description 4
- 239000010410 layer Substances 0.000 claims description 35
- 230000001105 regulatory effect Effects 0.000 claims description 10
- 238000012795 verification Methods 0.000 claims description 9
- 239000002356 single layer Substances 0.000 claims description 6
- 238000001514 detection method Methods 0.000 claims description 4
- 238000009434 installation Methods 0.000 abstract description 2
- 238000004519 manufacturing process Methods 0.000 description 17
- 238000010586 diagram Methods 0.000 description 5
- 230000005489 elastic deformation Effects 0.000 description 5
- 230000006872 improvement Effects 0.000 description 4
- 230000004048 modification Effects 0.000 description 4
- 238000012986 modification Methods 0.000 description 4
- 238000001179 sorption measurement Methods 0.000 description 4
- 230000001276 controlling effect Effects 0.000 description 3
- 230000009467 reduction Effects 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- 206010020649 Hyperkeratosis Diseases 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
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- Laser Beam Processing (AREA)
Abstract
The invention relates to flexible circuit board automatic laser cutting equipment based on high-precision positioning, in particular to the technical field of flexible circuit board processing, which comprises a positioning mechanism, a trowelling mechanism, an actuating element and a power element, wherein the positioning mechanism is arranged on a positioning table and consists of a negative pressure box, a positioning carrier plate, a negative pressure groove, a connecting pipe, a small vacuum pump and a visual detector, the trowelling mechanism consists of a rubber roller, a connecting seat, an installation sliding block and a linear sliding rail, the actuating element consists of a laser emitter, a fixed block, a telescopic rod, a sliding block, a sliding rod and a screw rod, the power element consists of a first motor, a second motor and a third motor, the control system comprises an acquisition module for acquiring data, an analysis module for analyzing the data acquired by the acquisition module, a processing module for processing the analyzed data and an adjusting module for adjusting the processing process, and the precision degree of circuit board cutting is greatly improved.
Description
Technical Field
The invention relates to the technical field of flexible circuit board processing, in particular to flexible circuit board automatic laser cutting equipment based on high-precision positioning.
Background
The flexible printed circuit board is also called a soft board, is a flexible printed circuit board which is made of polyimide or polyester film as a base material and has the characteristics of high wiring density, light weight and thin thickness, can be freely bent, rolled and folded, can bear millions of dynamic bending without damaging wires, can be randomly arranged according to space layout requirements, and can be randomly moved and stretched in a three-dimensional space, thereby achieving the integration of component assembly and wire connection.
Chinese patent publication No.: CN113650068a discloses a cutting device for processing a flexible circuit board, which comprises a workbench and supporting legs, wherein two ends of two sides of the bottom end of the workbench are respectively and fixedly connected with a group of supporting legs, and one side of the top end of the workbench is provided with a cutting mechanism. This cutting device that flexible circuit board processing was used is through being provided with the second cylinder, when cutting, start the second cylinder and promote the second telescopic link of one side and stretch out, the push pedal motion of one side is driven to the second telescopic link when stretching out, the push pedal promotes the flexible circuit board of one side again to one side motion to cut, and the outside spacing sliding sleeve of second telescopic link can carry out spacing to the second telescopic link when the second telescopic link moves, make the second telescopic link remain in same perpendicular motion all the time, enough stability when guaranteeing to promote the flexible circuit board, the rubber pad of push pedal one side can prevent that the push pedal from causing the damage to the circuit board when striking the flexible circuit board, what the solution is need the manual work to promote the circuit board and cut has dangerous problem. It follows that the cutting device for processing the flexible circuit board. There are the following problems: the flexible circuit board cannot be processed in a complex manner, and is easy to deform elastically when fixed, so that the processed flexible circuit board is cut inaccurately.
Disclosure of Invention
Therefore, the invention provides the automatic laser cutting equipment for the flexible circuit board based on high-precision positioning, which is used for solving the problems that the flexible circuit board cannot be processed in a complex manner in the prior art, and the flexible circuit board is easy to generate elastic deformation when being fixed, so that the processed flexible circuit board is cut inaccurately.
In order to achieve the above purpose, the invention provides automatic laser cutting equipment for a flexible circuit board based on high-precision positioning, which comprises a positioning mechanism arranged in a positioning table, a trowelling mechanism arranged on the upper surface of the positioning table, a cutting mechanism arranged vertically above the positioning mechanism and a control system in wireless connection with the positioning mechanism, the trowelling mechanism and the cutting mechanism;
The positioning mechanism comprises a negative pressure box, a positioning carrier plate arranged on the upper surface of the negative pressure box, and a visual detector arranged on the cutting mechanism far away from the upper part of the positioning carrier plate, wherein a plurality of negative pressure grooves which are uniformly distributed in the inner part and are in the shape of a round table with the shape of big top and small bottom are arranged in the positioning carrier plate, and the negative pressure box is connected with a vacuum pump through a connecting pipe;
The trowelling mechanism comprises rubber rollers arranged on the positioning carrier plate, connecting seats which are symmetrically arranged at two ends of the rubber rollers and are provided with mounting sliding blocks at the bottoms, and the mounting sliding blocks are arranged at the upper parts of the linear sliding rails;
the cutting mechanism comprises an executing element and a power element, wherein the executing element is a laser emitter, and the power element comprises a plurality of motors for providing power for the laser emitter;
The control system comprises an acquisition module, an analysis module, a processing module and an adjustment module, wherein the acquisition module is used for acquiring a circuit board cutting route, a circuit board position, a circuit board thickness, a vacuum pump pressure, a trowelling pressure, a circuit board area, a circuit board bulge area, a transverse moving speed of a cutting mechanism, a deviation distance of the cutting route in pre-cutting and an actual deviation distance of the cutting route in actual cutting, the analysis module is connected with the acquisition module and used for determining whether the circuit board position is aligned, the number of layers of a multi-layer circuit board and whether the multi-layer circuit board is aligned according to data acquired by the acquisition module, the processing module is connected with the analysis module and used for processing an analysis result of the analysis module and issuing a control command, and the adjustment module is respectively connected with the analysis module and the processing module and used for adjusting a processing process.
Further, when the obtaining module obtains specific data of the circuit board, the analyzing module judges whether the circuit board is cut in multiple layers according to the comparison result of the thickness of the circuit board and the thickness of the preset circuit board, wherein A is the thickness of the circuit board, A0 is the thickness of the preset single-layer circuit board,
When A is less than or equal to A0, the analysis module judges that the flexible circuit board is cut in a single layer;
When A is more than A0, the analysis module judges that the flexible circuit board is cut in multiple layers.
Further, when the analysis module determines that the circuit board is cut in multiple layers, the analysis module calculates the number of layers B of the circuit board according to the comparison relation between the thickness of the circuit board and the thickness of the preset circuit board, and sets B=A/A0.
Further, the analysis module calculates the number of layers of the circuit board, detects the circuit board through the visual detector, determines whether the multi-layer circuit board is not aligned according to the comparison result of the area of the circuit board determined by the detection image of the visual detector and the area of the preset circuit board, wherein C is the area of the circuit board, C0 is the area of the preset circuit board,
When c=c0, the analysis module determines that the multi-layer circuit board is aligned, and performs pre-cutting processing;
When C > C0, the analysis module determines that the multi-layer circuit board is not aligned, and manually performs alignment.
Further, before the processing module issues the pre-cutting instruction, the visual detector judges whether the circuit board is aligned on the positioning carrier plate, if the circuit board is aligned, the laser cutting equipment directly performs pre-cutting verification on the vertical upper side of the circuit board, and if the circuit board is not aligned, the position of the circuit board is manually aligned.
Further, when the processing module determines that the position of the circuit board is regulated and issues a pre-cutting instruction, determining the position of an initial pre-cutting route of the cutting mechanism according to the position of the circuit board and the cutting route of the circuit board, performing pre-cutting verification on the vertical upper side of the circuit board, dividing the pre-cutting route into N pre-cutting routes consisting of N points, analyzing Na points to coincide with the cutting route of the circuit board by the analysis unit, calculating the coincidence ratio P of the pre-cutting route, setting P=Na/N, determining the corresponding state of the circuit board according to the comparison result of the coincidence ratio and the preset coincidence ratio, wherein the analysis module is provided with a first preset coincidence ratio P1 and a second preset coincidence ratio P2, and P1 is smaller than P2,
When P is smaller than P1, the analysis module judges that the circuit board is not adsorbed well, and the flexible circuit board is adsorbed again;
When P1 is more than or equal to P2, the analysis module judges that the circuit board is not smoothed, and the flexible circuit board is smoothed again;
When P is more than P2, the analysis module judges that the coincidence degree of the pre-cutting route and the cutting route of the circuit board meets the requirement, and the cutting is directly carried out.
Further, when the processing module re-adsorbs the circuit board and re-performs pre-cutting verification, dividing the pre-cutting route into N pre-cutting routes composed of N points to obtain pre-cutting route points N, analyzing that Nb points are not coincident with the cutting route of the circuit board by the analysis unit, wherein the deviation distance K is the distance from each non-coincident point of the pre-cutting route to a coincident point corresponding to the non-coincident point of the pre-cutting route, the average deviation distance Kp is the ratio of the total deviation distance to the non-coincident point of the pre-cutting route, kp= (K1+K2+ … Kb)/Nb is set, the adjustment module selects a corresponding vacuum pumping pressure emphasis node coefficient according to the comparison result of the average deviation distance and the preset deviation distance,
Wherein X is the vacuum pump pressure before adjustment, a first preset average deviation distance Kp1, a second preset average deviation distance Kp2, a first vacuum pump pressure adjustment coefficient Q1, a second vacuum pump pressure adjustment coefficient Q2 and a third vacuum pump pressure adjustment coefficient Q3 are arranged in the adjustment module, wherein Kp1 is more than Kp1, Q1 is more than 1 and less than Q2 and less than Q3,
When Kp is smaller than Kp1, the adjusting unit selects a first vacuum pump pressure adjusting coefficient Q1 to adjust the vacuum pump pressure;
When Kp1 is more than or equal to Kp and less than or equal to Kp2, the adjusting module selects a second vacuum pump pressure adjusting coefficient Q2 to adjust the vacuum pump pressure;
when Kp is larger than Kp2, the adjusting module selects a third vacuum pump pressure regulating coefficient Q3 to regulate the vacuum pump pressure;
When the adjustment module selects the ith vacuum pump pressure coefficient Qi to adjust the vacuum pump pressure, i=1, 2 and 3 are set, and the adjustment module sets x0=xxxqi for the adjusted vacuum pump pressure as X0.
Further, the processing module performs trowelling again on the circuit board, the analysis module determines the flatness S of the circuit board according to the comparison result of the raised area Sn of the surface of the circuit board and the total area Sz of the flexible circuit board, which are recognized by the visual detector, the adjustment module selects the corresponding trowelling pressure adjustment coefficient according to the comparison result of the flatness and the preset flatness,
Wherein Y is the trowelling pressure before adjustment, the adjustment module is provided with a first preset flatness S1, a second preset flatness S2, a first trowelling pressure adjustment coefficient F1, a second trowelling pressure adjustment coefficient F2 and a third trowelling pressure adjustment coefficient F3, wherein S1 is more than S2, F1 is more than 1 and less than F2 and F3 is more than 1.5,
When S is less than or equal to S1, the adjusting module selects a first trowelling pressure adjusting coefficient F1 to adjust trowelling pressure;
When S1 is more than S and less than or equal to S2, the adjusting module selects a second trowelling pressure adjusting coefficient F2 to adjust trowelling pressure;
And when S is more than S2, the adjusting module selects a third trowelling pressure adjusting coefficient F3 to adjust trowelling pressure.
When the adjustment module selects the r-th trowelling pressure adjustment coefficient Fr to adjust the trowelling pressure, r=1, 2,3 is set, and the adjustment module sets y0=yxfr for the adjusted trowelling pressure as Y0.
Further, when the processing module performs actual cutting on the adjusted circuit board, the analysis module judges whether the cutting route of the cutting mechanism needs to be correspondingly adjusted according to the comparison result of the actual cut contact ratio Pn and the preset actual contact ratio Pn0,
When Pn is smaller than Pn0, the analysis module judges that the actual contact ratio of the circuit board does not meet the requirement;
When Pn is more than or equal to Pn0, the analysis module judges that the actual contact ratio of the circuit board reaches the requirement, and the circuit board can be produced in batches.
Further, when the actual cutting overlap ratio does not meet the requirement, the analysis module determines the transverse moving speed Vh and the actual offset distance Ks of the cutting mechanism, the adjustment module determines a corresponding speed adjustment coefficient according to the comparison relation between the actual offset distance and the preset actual offset distance Ks0 to adjust the transverse moving speed of the cutting mechanism, wherein the adjustment module is provided with a first speed adjustment coefficient W1 and a second speed adjustment coefficient W2, W1 is more than 0.2 and less than 0.7,
When Ks is less than Ks0, the adjusting module selects a second speed adjusting coefficient W2 to compensate the transverse moving speed Vh;
when Ks is more than or equal to Ks0, the adjusting module selects a first speed adjusting coefficient W1 to compensate the transverse moving speed Vh;
when the adjustment module selects the u-th speed adjustment coefficient Wu to adjust the lateral movement speed, u=1, 2 is set, and the adjustment module sets V to the adjusted lateral movement speed, and v=vh×wu is set.
Compared with the prior art, the invention has the beneficial effects that the circuit board is uniformly adsorbed and fixed through the positioning mechanism, the elastic deformation of the circuit board can be greatly reduced, the cutting accuracy is ensured, the lifting of the positioning table is realized through the supporting mechanism, the adjustment can be carried out according to operators with different heights, the working efficiency is greatly improved, the productivity is improved, the flattening of the circuit board is realized through the leveling mechanism, meanwhile, the circuit board is adsorbed better, the cutting accuracy is ensured, the circuit board is cut through the laser equipment, the accurate control of the cutting process is realized through the control system, the product quality is greatly improved, and the production efficiency is improved.
Further, when the obtaining module obtains specific data of the circuit board, the analyzing module judges whether the multi-layer cutting is performed according to a comparison result of the thickness of the circuit board and the thickness of the preset circuit board, and judges whether the circuit board is aligned, so that errors of the cutting of the circuit board are greatly reduced, accurate control of the cutting process is improved, product quality is greatly improved, and production efficiency is improved.
Further, when the analysis module judges that the circuit board is cut in multiple layers, the analysis module calculates the number data of the circuit board layers according to the comparison relation between the thickness data of the circuit board and the thickness data of the preset circuit board, and provides a basis for the specific trowelling pressure when the circuit board is trowelled later through the calculation of the number of layers of the multiple circuit boards, so that the accuracy degree of cutting is greatly improved.
Further, when the analysis module calculates the number of layers of the circuit board, the analysis module analyzes and obtains a comparison result of the area data of the circuit board and the area data of the preset circuit board according to a detection image of the visual detector to determine whether the multilayer circuit board is not aligned.
Further, before the processing module gives the pre-cutting instruction, the visual detector judges whether the circuit board is righted on the positioning carrier plate, and the precise control of the cutting process is improved by righting the circuit board, so that the product quality is greatly improved, and the production efficiency is improved.
Further, when the vision detector judges that the position of the circuit board is regulated, the corresponding state condition of the circuit board is determined according to the comparison result of the coincidence degree and the preset coincidence degree, the condition affecting the cutting accuracy of the circuit board is determined through judging the coincidence degree, and the conditions are correspondingly regulated, so that the accurate control of the cutting process is improved, the product quality is greatly improved, and the production efficiency is improved.
Further, after the flexible circuit board is adsorbed again, the adjusting module selects a corresponding adsorption force adjusting coefficient according to the comparison result of the average deviation distance and the preset deviation distance, and through adjusting the adsorption force, the elastic deformation of the circuit board is greatly reduced, the accurate control of the cutting process is improved, the product quality is greatly improved, and the production efficiency is improved.
Further, after the circuit board is screeded again, the adjustment module selects a corresponding screeding pressure adjustment coefficient according to the comparison result of the flatness and the preset flatness, and the accurate handle control of the cutting process is improved through adjustment of the screeding pressure, so that the product quality is greatly improved, and the production efficiency is improved.
Further, when the processing module performs actual cutting on the adjusted circuit board, the adjusting module judges whether corresponding compensation is needed on the cutting route of the laser cutting device according to the comparison result of the actual contact ratio and the preset actual contact ratio, and the cutting route of the laser cutting device is correspondingly adjusted through judging the actual contact ratio, so that the cutting accuracy is improved, the cutting error of the circuit board is greatly reduced, the accurate control of the cutting process is improved, the product quality is greatly improved, and the production efficiency is improved.
Further, when the actual cutting overlap ratio does not meet the requirement, the adjusting module determines a corresponding speed compensation system according to the comparison relation between the actual offset distance and the preset actual offset distance, so that the cutting accuracy is improved, the error of cutting a circuit board is greatly reduced, the accurate control of the cutting process is improved, the product quality is greatly improved, and the production efficiency is improved.
Drawings
FIG. 1 is a schematic diagram of a front view of an automatic laser cutting device for a flexible circuit board based on high-precision positioning;
FIG. 2 is a schematic diagram of a front cross-sectional structure of the automatic laser dicing apparatus for flexible circuit board based on high-precision positioning according to the present invention;
FIG. 3 is a schematic side view of the automatic laser cutting device for flexible circuit board based on high-precision positioning;
FIG. 4 is a schematic diagram of a cross-sectional elevation structure of a supporting mechanism of the automatic laser cutting device for flexible circuit boards based on high-precision positioning according to the present invention;
reference numerals in the drawings illustrate:
1. Positioning table, 2, positioning mechanism, 201, negative pressure box, 202, positioning carrier plate, 203, negative pressure groove, 204, connecting pipe, 205, small-size vacuum pump, 3, control switch, 4, supporting mechanism, 401, thread bush, 402, threaded rod, 403, support callus on sole, 404, storage groove, 5, trowelling mechanism, 501, linear slide rail, 502, installation slider, 503, connecting seat, 504, rubber roller, 505, handle, 6, cutting mechanism, 601, laser emitter, 602, fixed block, 603, telescopic link, 604, slider, 605, slide rail, 606, slide bar, 7, first motor, 8, second motor, 9, third motor, 10, visual detector, 11, screw rod, 12, power element, 13, executive component.
Detailed Description
In order that the objects and advantages of the invention will become more apparent, the invention will be further described with reference to the following examples; it should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the invention.
Preferred embodiments of the present invention are described below with reference to the accompanying drawings. It should be understood by those skilled in the art that these embodiments are merely for explaining the technical principles of the present invention, and are not intended to limit the scope of the present invention.
It should be noted that, in the description of the present invention, terms such as "upper," "lower," "left," "right," "inner," "outer," and the like indicate directions or positional relationships based on the directions or positional relationships shown in the drawings, which are merely for convenience of description, and do not indicate or imply that the apparatus or elements must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the present invention.
Furthermore, it should be noted that, in the description of the present invention, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present invention can be understood by those skilled in the art according to the specific circumstances.
Referring to fig. 1, a schematic front view of an automatic laser splitting device for flexible circuit board based on high-precision positioning according to the present invention is shown; referring to fig. 2, a schematic diagram of a front cross-sectional structure of an automatic laser splitting device for a flexible circuit board based on high-precision positioning according to the present invention is shown; referring to fig. 3, a schematic side view of the automatic laser splitting device for flexible circuit board based on high-precision positioning according to the present invention is shown; fig. 4 is a schematic diagram showing a cross-sectional structure of a supporting mechanism of the automatic laser splitting device for flexible circuit board based on high-precision positioning.
Referring to fig. 1,2,3 and 4, the flexible circuit board automatic laser cutting device based on high-precision positioning in the embodiment of the invention comprises a positioning mechanism 2, a control switch 3, a supporting mechanism 4, a trowelling mechanism 5 and a cutting mechanism 6 which are arranged on a positioning table 1;
The positioning mechanism 2 comprises a negative pressure box 201, a positioning carrier plate 202, negative pressure grooves 203, connecting pipes 204, a small vacuum pump 205 and a visual detector 10, wherein the positioning carrier plate 202 is arranged on the surface of the negative pressure box 201, the negative pressure grooves 203 are arranged in the positioning carrier plate 202, the negative pressure box 201 is connected with the small vacuum pump 205 through the connecting pipes 204, the negative pressure grooves 203 are arranged in a plurality, the negative pressure grooves 203 are uniformly distributed in the positioning carrier plate 202, the shape of the negative pressure grooves 203 is in a round table shape with the upper part being big and the lower part being small, and the visual detector is arranged on the cutting mechanism 6 far away from the upper part of the positioning carrier plate;
The trowelling mechanism 5 comprises a rubber roller 504, a connecting seat 503, a small sliding block 502 and a linear sliding rail 605, wherein the connecting seat 503 is arranged at two ends of the rubber roller 504, the small sliding block 502 is arranged at the bottom end of the connecting seat 503, and the small sliding block 502 is arranged at the top end of the linear sliding rail 605;
The cutting mechanism 6 comprises an actuator and a power element 12, wherein,
The actuator 13 comprises a laser emitter 601, a fixed block 602, a telescopic rod 603, a sliding block 604, a sliding rod 606 and a screw 11, wherein the laser emitter 601 is connected with the fixed block 602 and is arranged at the central position of the lower part of the fixed block 602, the telescopic rod 603 is respectively connected with the fixed block 602 and the sliding block 604, the upper end of the telescopic rod 603 is connected to the lower part of the sliding block 604, the lower end of the telescopic rod 603 is connected to the upper part of the fixed block 602, the sliding block 604 is connected with the sliding rod 606 and is arranged in a sliding rail 605 at the lower part of the sliding rod 606, and the sliding rod 606 is connected with the screw 11 and vertically penetrates through the sliding rod 606;
The power element 12 comprises a first motor 7, a second motor 8 and a third motor 9, the first motor 7 is connected with the fixed block 602 and is arranged on the right side of the fixed block 602 for controlling the telescopic state of the telescopic rod 603, the second motor 8 is connected with the sliding rod 606 and is arranged on the right side of the sliding rod 606 for controlling the horizontal movement state of the sliding rod 604 in the sliding rail 605, and the third motor 9 is connected with the screw 11 and is arranged on the left side of the screw 11 for controlling the rotation of the screw 11 and is transmitted to the sliding rod 606;
Positioning mechanism, trowelling mechanism and cutting mechanism pass through wireless connection control system, and control system includes:
The device comprises an acquisition module, a control module and a control module, wherein the acquisition module is used for acquiring a circuit board cutting route, a circuit board position, a circuit board thickness, a vacuum pump pressure, a trowelling pressure, a circuit board area, a circuit board bulge area, a transverse moving speed of a cutting mechanism, a deviation distance of the cutting route in pre-cutting and an actual deviation distance of the cutting route in actual cutting completion;
the analysis module is connected with the acquisition module and is used for determining whether the position of the circuit board is aligned, the number of layers of the multi-layer circuit board and whether the multi-layer circuit board is aligned according to the data acquired by the acquisition module;
The processing module is connected with the analysis module and is used for processing the analysis result of the analysis module and issuing a control command;
the adjusting module is respectively connected with the analysis module and the processing module and is used for adjusting the processing process;
Specifically, realize the even absorption fixed to the circuit board through positioning mechanism, elastic deformation takes place for the circuit board that can be very big reduction, guarantee the accuracy nature of cutting, through supporting mechanism, realize the lift to the locating bench, can adjust according to the operator of different heights, very big improvement work efficiency, the productivity is improved, through the mechanism of screeding, realize flattening to the circuit board, also let the circuit board be better by the absorbing simultaneously, guaranteed the accurate degree of cutting, realized the cutting to the circuit board through laser equipment, realized the accurate accuse to the cutting process through control system, very big improvement product quality, production efficiency has been improved.
The embodiment of the invention discloses automatic laser cutting equipment of a flexible circuit board based on high-precision positioning, when an acquisition module acquires specific data of the circuit board, an analysis module judges whether the circuit board is subjected to multi-layer cutting according to the comparison result of the thickness of the circuit board and the thickness of a preset circuit board, wherein A is the thickness of the circuit board, A0 is the thickness of the preset single-layer circuit board,
When A is less than or equal to A0, the analysis module judges that the flexible circuit board is cut in a single layer;
When A is more than A0, the analysis module judges that the flexible circuit board is cut in multiple layers.
Specifically, when the acquisition module acquires specific data of the circuit board, the analysis module judges whether the circuit board is subjected to multi-layer cutting according to the comparison result of the thickness of the circuit board and the thickness of the preset circuit board, judges whether the processed circuit board is subjected to multi-layer cutting, judges whether the circuit board is aligned, greatly reduces errors of cutting the circuit board, improves accurate control of the cutting process, greatly improves product quality, and improves production efficiency.
According to the flexible circuit board automatic laser cutting equipment based on high-precision positioning, when the analysis module determines that the circuit board is cut in multiple layers, the analysis module calculates the number of layers B of the circuit board according to the comparison relation between the thickness of the circuit board and the thickness of a preset circuit board, and the number B=A/A0 is set.
Specifically, when judging that the circuit board is multi-layer cutting, the analysis module calculates circuit board layer number data according to the comparison relation between the circuit board thickness data and preset circuit board thickness data, and provides a basis for the specific trowelling pressure through the number of layers of the multi-circuit board when trowelling the circuit board later, so that the cutting accuracy is greatly improved.
The embodiment of the invention is based on the flexible circuit board automatic laser cutting equipment with high precision positioning, when an analysis module calculates the number of layers of the circuit board and detects the circuit board through a visual detector, the analysis module determines whether the multilayer circuit board is not aligned according to the comparison result of the area of the circuit board determined by the detection image of the visual detector and the area of a preset circuit board, wherein C is the area of the circuit board, C0 is the area of the preset circuit board,
When c=c0, the analysis module determines that the multi-layer circuit board is aligned, and performs pre-cutting processing;
when C > C0, the analysis module determines that the multi-layer circuit board is not aligned, and the alignment is performed manually.
Specifically, when the analysis module calculates the number of layers data of the circuit board, the analysis module vertically obtains the comparison result of the area data of the circuit board and the area data of the preset circuit board according to the visual detector to determine whether the multilayer circuit board is not aligned, and through the alignment of the multilayer circuit board, the error of cutting the circuit board is greatly reduced, the accurate control of the cutting process is improved, the product quality is greatly improved, and the production efficiency is improved.
According to the embodiment of the invention, based on the high-precision positioning automatic laser cutting equipment for the flexible circuit board, before a processing module issues a pre-cutting instruction, a visual detector judges whether the circuit board is aligned on a positioning carrier board, if the circuit board is aligned, the laser cutting equipment directly performs pre-cutting verification on the vertical upper side of the circuit board, and if the circuit board is not aligned, the position of the circuit board is manually aligned.
Specifically, before the processing module gives the pre-cutting instruction, the visual detector judges whether the circuit board is righted on the positioning carrier plate, and by righting the circuit board, the error of cutting the circuit board is greatly reduced, the accurate control of the cutting process is improved, the product quality is greatly improved, and the production efficiency is improved.
The embodiment of the invention discloses an automatic laser cutting device for a flexible circuit board based on high-precision positioning, a processing module determines the position of an initial pre-cutting route of a cutting mechanism according to the position of the circuit board and a cutting route of the circuit board when determining that the position of the circuit board is regulated and giving a pre-cutting instruction, and performs pre-cutting verification on the vertical upper part of the circuit board, the pre-cutting route is divided into N pre-cutting routes consisting of N points, an analysis unit analyzes that Na points coincide with the cutting route of the circuit board, calculates the coincidence ratio P of the pre-cutting route, sets P=Na/N, determines the corresponding state of the circuit board according to the comparison result of the coincidence ratio and the pre-set coincidence ratio, wherein the analysis module is provided with a first pre-set coincidence ratio P1 and a second pre-set coincidence ratio P2, and P1 is smaller than P2,
When P is smaller than P1, the analysis module judges that the circuit board is not adsorbed well, and the flexible circuit board is adsorbed again;
when P1 is more than or equal to P2, the analysis module judges that the circuit board is not smoothed, and the flexible circuit board is smoothed again;
When P is more than P2, the analysis module judges that the coincidence degree of the pre-cutting route and the cutting route of the circuit board meets the requirement, and the cutting is directly carried out.
Specifically, when the vision detector judges that the position of the circuit board is regulated, the corresponding state condition of the circuit board is determined according to the comparison result of the coincidence degree and the preset coincidence degree, the condition affecting the cutting accuracy of the circuit board is determined through judging the coincidence degree, and the conditions are correspondingly regulated, so that the error of the cutting of the circuit board is greatly reduced, the accurate control of the cutting process is improved, the product quality is greatly improved, and the production efficiency is improved.
The embodiment of the invention discloses an automatic laser cutting device of a flexible circuit board based on high-precision positioning, a processing module re-adsorbs the circuit board and re-performs pre-cutting verification, a pre-cutting route formed by N points is divided into a pre-cutting route, a pre-cutting route point N is obtained, an analysis unit analyzes that Nb points are not overlapped with the cutting route of the circuit board, a deviation distance K is the distance from each non-overlapping point of the pre-cutting route to a corresponding overlapping point, an average deviation distance Kp is the ratio of the total deviation distance to the non-overlapping point of the pre-cutting route, kp= (K1+K2+ … Kb)/Nb is set, an adjusting module selects a corresponding vacuum pump pressure emphasis node coefficient according to the comparison result of the average deviation distance and the preset deviation distance,
Wherein X is the vacuum pump pressure before adjustment, a first preset average deviation distance Kp1, a second preset average deviation distance Kp2, a first vacuum pump pressure adjustment coefficient Q1, a second vacuum pump pressure adjustment coefficient Q2 and a third vacuum pump pressure adjustment coefficient Q3 are arranged in the adjustment module, wherein Kp1 is more than Kp1, Q1 is more than 1 and less than Q2 and less than 3,
When Kp is smaller than Kp1, the adjusting unit selects a first vacuum pump pressure adjusting coefficient Q1 to adjust the vacuum pump pressure;
When Kp1 is more than or equal to Kp and less than or equal to Kp2, the adjusting module selects a second vacuum pump pressure adjusting coefficient Q2 to adjust the vacuum pump pressure;
When Kp is larger than Kp2, the adjusting module selects a third vacuum pump pressure regulating coefficient Q3 to regulate the vacuum pump pressure;
when the adjustment module selects the ith vacuum pump pressure adjustment coefficient Qi to adjust the vacuum pump pressure, i=1, 2,3 is set, and the adjustment module sets x0=xxxqi for the adjusted vacuum pump pressure as X0.
Specifically, after the flexible circuit board is adsorbed again, the adjusting module selects a corresponding adsorption force adjusting coefficient according to the comparison result of the average deviation distance and the preset deviation distance, through the adjustment of the adsorption force, the elastic deformation of the circuit board is greatly reduced, the cutting error of the circuit board is greatly reduced, the accurate control of the cutting process is improved, the product quality is greatly improved, and the production efficiency is improved.
The embodiment of the invention is based on the flexible circuit board automatic laser cutting equipment with high precision positioning, the processing module performs trowelling again on the circuit board, the analysis module determines the flatness S of the circuit board according to the comparison result of the surface convex area Sn of the circuit board and the total area Sz of the flexible circuit board identified by the visual detector, the S=Sn/Sz is set, the adjustment module selects the corresponding trowelling pressure adjustment coefficient according to the comparison result of the flatness and the preset flatness,
Wherein Y is the leveling pressure before adjustment, the adjustment module is provided with a first preset flatness S1, a second preset flatness S2, a first leveling pressure adjustment coefficient F1, a second leveling pressure adjustment coefficient F2 and a third leveling pressure adjustment coefficient F3, wherein S1 is more than S2, F1 is more than 1 and less than F2 and F3 is more than 1.5,
When S is less than or equal to S1, the adjusting module selects a first trowelling pressure adjusting coefficient F1 to adjust trowelling pressure;
When S1 is more than S and less than or equal to S2, the adjusting module selects a second trowelling pressure adjusting coefficient F2 to adjust trowelling pressure;
And when S is more than S2, the adjusting module selects a third trowelling pressure adjusting coefficient F3 to adjust trowelling pressure.
When the adjustment module selects the r-th trowelling pressure adjustment coefficient Fr to adjust the trowelling pressure, r=1, 2,3 are set, and the adjustment module sets y0=y×fr for the adjusted trowelling pressure as Y0.
Specifically, after the circuit board is screeded again, the adjustment module selects corresponding screeding pressure adjustment coefficient according to the comparison result of the flatness and the preset flatness, and through the adjustment of the screeding pressure, the error of the circuit board cutting is greatly reduced, the accurate control of the cutting process is improved, the product quality is greatly improved, and the production efficiency is improved.
The embodiment of the invention is based on the automatic laser cutting equipment of the flexible circuit board with high precision positioning, when the processing module performs actual cutting on the adjusted circuit board, the analysis module judges whether the cutting route of the cutting mechanism needs to be correspondingly adjusted according to the comparison result of the actual cut contact ratio Pn and the preset actual contact ratio Pn0,
When Pn is smaller than Pn0, the analysis module judges that the actual contact ratio of the circuit board does not meet the requirement;
When Pn is more than or equal to Pn0, the analysis module judges that the actual contact ratio of the circuit board reaches the requirement, and the circuit board can be produced in batches.
Specifically, when the processing module carries out actual cutting to the circuit board after the adjustment, the adjustment module judges whether to need to carry out corresponding compensation to the cutting route of cutting mechanism according to the comparison result of actual coincidence degree and preset actual coincidence degree, through the judgement to actual coincidence degree, carries out corresponding adjustment to the cutting route of cutting mechanism, has improved the accuracy of cutting, very big reduction the error of circuit board cutting, improved the accurate accuse of cutting process, very big improvement product quality, improved production efficiency.
The embodiment of the invention is based on high-precision positioning flexible circuit board automatic laser cutting equipment, when the actual cutting coincidence degree does not meet the requirement, an analysis module determines the transverse moving speed Vh and the actual offset distance Ks of a cutting mechanism, an adjustment module determines corresponding speed adjustment coefficients according to the comparison relation between the actual offset distance and the preset actual offset distance Ks0, wherein the adjustment module is provided with a first speed adjustment coefficient W1 and a second speed adjustment coefficient W2, W1 is more than 0.2 and less than 0.7,
When Ks is less than Ks0, the adjusting module selects a second speed adjusting coefficient W2 to adjust the transverse moving speed Vh;
when Ks is more than or equal to Ks0, the adjusting module selects a first speed adjusting coefficient W1 to adjust the transverse moving speed Vh;
when the adjustment module selects the u-th speed adjustment coefficient Wu to adjust the lateral movement speed, u=1, 2 is set, and the adjustment module sets V to the adjusted lateral movement speed, and v=vh×wu is set.
Specifically, when the actual cutting overlap ratio does not meet the requirement, the adjusting module determines a corresponding speed adjusting coefficient according to the comparison relation between the actual offset distance and the preset actual offset distance, so that the cutting accuracy is improved, the error of cutting a circuit board is greatly reduced, the accurate control of the cutting process is improved, the product quality is greatly improved, and the production efficiency is improved.
Thus far, the technical solution of the present invention has been described in connection with the preferred embodiments shown in the drawings, but it is easily understood by those skilled in the art that the scope of protection of the present invention is not limited to these specific embodiments. Equivalent modifications and substitutions for related technical features may be made by those skilled in the art without departing from the principles of the present invention, and such modifications and substitutions will be within the scope of the present invention.
The foregoing description is only of the preferred embodiments of the invention and is not intended to limit the invention; various modifications and variations of the present invention will be apparent to those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (8)
1. The automatic laser cutting equipment for the flexible circuit board based on high-precision positioning is characterized by comprising a positioning mechanism arranged in a positioning table, a trowelling mechanism arranged on the upper surface of the positioning table, a cutting mechanism arranged vertically above the positioning mechanism and a control system in wireless connection with the positioning mechanism, the trowelling mechanism and the cutting mechanism;
The positioning mechanism comprises a negative pressure box, a positioning carrier plate arranged on the upper surface of the negative pressure box, and a visual detector arranged on the cutting mechanism far away from the upper part of the positioning carrier plate, wherein a plurality of negative pressure grooves which are uniformly distributed in the inner part and are in the shape of a round table with the shape of big top and small bottom are arranged in the positioning carrier plate, and the negative pressure box is connected with a vacuum pump through a connecting pipe;
The trowelling mechanism comprises rubber rollers arranged on the positioning carrier plate, connecting seats which are symmetrically arranged at two ends of the rubber rollers and are provided with mounting sliding blocks at the bottoms, and the mounting sliding blocks are arranged at the upper parts of the linear sliding rails;
the cutting mechanism comprises an executing element and a power element, wherein the executing element is a laser emitter, and the power element comprises a plurality of motors for providing power for the laser emitter;
The control system comprises an acquisition module, an analysis module, a processing module, an adjustment module and an adjustment module, wherein the acquisition module is used for acquiring a circuit board cutting route, a circuit board position, a circuit board thickness, a vacuum pump pressure, a trowelling pressure, a circuit board area, a circuit board bulge area, a transverse moving speed of a cutting mechanism, a deviation distance of a cutting route in pre-cutting and an actual deviation distance of a cutting route in actual cutting completion, the analysis module is connected with the acquisition module and used for determining whether the circuit board position is aligned, the number of layers of a multi-layer circuit board and whether the multi-layer circuit board is aligned according to data acquired by the acquisition module, the processing module is connected with the analysis module and used for processing the analysis result of the analysis module and issuing a control command, and the adjustment module is respectively connected with the analysis module and the processing module and used for adjusting the processing process
When the processing module determines that the position of the circuit board is regulated and gives a pre-cutting instruction, determining the position of an initial pre-cutting route of a cutting mechanism according to the position of the circuit board and the cutting route of the circuit board, performing pre-cutting verification on the vertical upper side of the circuit board, dividing the pre-cutting route into N pre-cutting routes consisting of points, analyzing Na points to coincide with the cutting route of the circuit board by the analysis module, calculating the coincidence ratio P of the pre-cutting route, setting P=Na/N, determining the corresponding state of the circuit board according to the comparison result of the coincidence ratio and the preset coincidence ratio, wherein the analysis module is provided with a first preset coincidence ratio P1 and a second preset coincidence ratio P2, P1 is smaller than P2,
When P is smaller than P1, the analysis module judges that the circuit board is not adsorbed well, and the flexible circuit board is adsorbed again;
When P1 is more than or equal to P2, the analysis module judges that the circuit board is not smoothed, and the flexible circuit board is smoothed again;
when P is more than P2, the analysis module judges that the coincidence degree of the pre-cutting route and the cutting route of the circuit board meets the requirement, and the cutting is directly carried out;
The processing module re-adsorbs the circuit board and re-performs pre-cutting verification, the pre-cutting route is divided into N pre-cutting routes composed of N points to obtain pre-cutting route points N, the analysis module analyzes that Nb points are not coincident with the cutting route of the circuit board, the deviation distance K is the distance from each non-coincident point of the pre-cutting route to a coincident point corresponding to the non-coincident point of the pre-cutting route, the average deviation distance Kp is the ratio of the total deviation distance to the non-coincident point of the pre-cutting route, kp= (K1+K2+ … Kb)/Nb is set, the adjustment module selects a corresponding vacuum pump pressure emphasis node coefficient according to the comparison result of the average deviation distance and the preset deviation distance,
Wherein X is the vacuum pump pressure before adjustment, a first preset average deviation distance Kp1, a second preset average deviation distance Kp2, a first vacuum pump pressure adjustment coefficient Q1, a second vacuum pump pressure adjustment coefficient Q2 and a third vacuum pump pressure adjustment coefficient Q3 are arranged in the adjustment module, wherein Kp1 is more than Kp1, Q1 is more than 1 and less than Q2 and less than Q3,
When Kp is smaller than Kp1, the adjusting module selects a first vacuum pump pressure adjusting coefficient Q1 to adjust the vacuum pump pressure;
When Kp1 is more than or equal to Kp and less than or equal to Kp2, the adjusting module selects a second vacuum pump pressure adjusting coefficient Q2 to adjust the vacuum pump pressure;
when Kp is larger than Kp2, the adjusting module selects a third vacuum pump pressure regulating coefficient Q3 to regulate the vacuum pump pressure;
When the adjustment module selects the ith vacuum pump pressure coefficient Qi to adjust the vacuum pump pressure, i=1, 2 and 3 are set, and the adjustment module sets x0=xxxqi for the adjusted vacuum pump pressure as X0.
2. The automatic laser cutting device for flexible circuit board based on high-precision positioning according to claim 1, wherein the obtaining module obtains specific data of the circuit board, the analyzing module judges whether the circuit board is cut in multiple layers according to the comparison result of the thickness of the circuit board and the thickness of a preset circuit board, wherein A is the thickness of the circuit board, A0 is the thickness of a preset single-layer circuit board,
When A is less than or equal to A0, the analysis module judges that the flexible circuit board is cut in a single layer;
When A is more than A0, the analysis module judges that the flexible circuit board is cut in multiple layers.
3. The automatic laser splitting device for flexible circuit board based on high-precision positioning according to claim 2, wherein when the analysis module determines that the circuit board is multi-layer cut, the analysis module calculates the number of layers B of the circuit board according to the comparison relation between the thickness of the circuit board and the thickness of a preset circuit board, and sets b=a/A0.
4. The automatic laser splitting device of claim 3, wherein the analysis module calculates the number of layers of the circuit board, detects the circuit board by a visual detector, determines whether there is a misalignment of the multi-layer circuit board according to a comparison result of the circuit board area determined by the detection image of the visual detector and a preset circuit board area, wherein C is the circuit board area, C0 is the preset circuit board area,
When c=c0, the analysis module determines that the multi-layer circuit board is aligned, and performs pre-cutting processing;
When C > C0, the analysis module determines that the multi-layer circuit board is not aligned, and manually performs alignment.
5. The automatic laser splitting device for flexible circuit boards based on high-precision positioning according to claim 4, wherein the processing module judges whether the circuit board is aligned on the positioning carrier board or not before issuing a pre-cutting instruction, if the circuit board is aligned, the laser splitting device directly performs pre-cutting verification on the vertical upper side of the circuit board, and if the circuit board is not aligned, the circuit board is manually aligned.
6. The automatic flexible circuit board laser cutting device based on high-precision positioning according to claim 5, wherein the processing module performs trowelling again on the circuit board, the analysis module determines the flatness S of the circuit board according to the comparison result of the raised area Sn of the surface of the circuit board and the total area Sz of the flexible circuit board identified by the visual detector, sets s=sn/Sz, the adjustment module selects the corresponding trowelling pressure adjustment coefficient according to the comparison result of the flatness and the preset flatness,
Wherein Y is the trowelling pressure before adjustment, the adjustment module is provided with a first preset flatness S1, a second preset flatness S2, a first trowelling pressure adjustment coefficient F1, a second trowelling pressure adjustment coefficient F2 and a third trowelling pressure adjustment coefficient F3, wherein S1 is more than S2, F1 is more than 1 and less than F2 and F3 is more than 1.5,
When S is less than or equal to S1, the adjusting module selects a first trowelling pressure adjusting coefficient F1 to adjust trowelling pressure;
When S1 is more than S and less than or equal to S2, the adjusting module selects a second trowelling pressure adjusting coefficient F2 to adjust trowelling pressure;
When S is more than S2, the adjusting module selects a third trowelling pressure adjusting coefficient F3 to adjust trowelling pressure;
When the adjustment module selects the r-th trowelling pressure adjustment coefficient Fr to adjust the trowelling pressure, r=1, 2,3 is set, and the adjustment module sets y0=yxfr for the adjusted trowelling pressure as Y0.
7. The automatic laser cutting device of claim 6, wherein the processing module determines whether the cutting line of the cutting mechanism needs to be adjusted according to the comparison result of the real cutting overlap ratio Pn and the preset real overlap ratio Pn0 when the adjusted circuit board is actually cut,
When Pn is smaller than Pn0, the analysis module judges that the actual contact ratio of the circuit board does not meet the requirement;
When Pn is more than or equal to Pn0, the analysis module judges that the actual contact ratio of the circuit board reaches the requirement, and the circuit board can be produced in batches.
8. The automatic laser cutting device for flexible circuit board based on high-precision positioning according to claim 7, wherein the analysis module determines the transverse moving speed Vh and the actual offset distance Ks of the cutting mechanism when the actual cutting overlap ratio does not meet the requirement, the adjustment module determines the corresponding speed adjustment coefficient according to the comparison relation between the actual offset distance and the preset actual offset distance Ks0 to adjust the transverse moving speed of the cutting mechanism, wherein the adjustment module is provided with a first speed adjustment coefficient W1 and a second speed adjustment coefficient W2, wherein 0.2 < W1 < W2 < 0.7,
When Ks is less than Ks0, the adjusting module selects a second speed adjusting coefficient W2 to compensate the transverse moving speed Vh;
when Ks is more than or equal to Ks0, the adjusting module selects a first speed adjusting coefficient W1 to compensate the transverse moving speed Vh;
When the adjustment module selects the u-th speed adjustment coefficient Wu to adjust the lateral movement speed, u=1, 2 is set, and the adjustment module sets V to the adjusted lateral movement speed, and v=vh×wu is set.
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN101363188A (en) * | 2008-07-29 | 2009-02-11 | 瑞安市博业激光应用技术有限公司 | Cutting method along boundary of laser cutting equipment |
| CN109158754A (en) * | 2018-09-14 | 2019-01-08 | 苏州迈克埃迩科技有限公司 | A kind of automation equipment for the processing of multi-ladder thicknesses of metal plate |
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| CN207972080U (en) * | 2018-03-21 | 2018-10-16 | 济南精锐数控设备有限公司 | For cutting machine plank adsorbent equipment |
| KR101974432B1 (en) * | 2018-09-27 | 2019-05-02 | 와이제이링크 주식회사 | Cutting method of printed circuit board using laser router vision system |
| CN110814529B (en) * | 2019-11-01 | 2020-07-24 | 成都大德人光电科技有限公司 | Flexible circuit board laser cutting method |
| CN113478095B (en) * | 2021-05-24 | 2023-11-07 | 浙江泰好科技股份有限公司 | Flexible plate laser precision cutting system and method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101363188A (en) * | 2008-07-29 | 2009-02-11 | 瑞安市博业激光应用技术有限公司 | Cutting method along boundary of laser cutting equipment |
| CN109158754A (en) * | 2018-09-14 | 2019-01-08 | 苏州迈克埃迩科技有限公司 | A kind of automation equipment for the processing of multi-ladder thicknesses of metal plate |
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