CN115121738A - Laser pin forming device and forming method - Google Patents
Laser pin forming device and forming method Download PDFInfo
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- CN115121738A CN115121738A CN202210836570.9A CN202210836570A CN115121738A CN 115121738 A CN115121738 A CN 115121738A CN 202210836570 A CN202210836570 A CN 202210836570A CN 115121738 A CN115121738 A CN 115121738A
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- 238000000034 method Methods 0.000 title claims abstract description 16
- 238000003825 pressing Methods 0.000 claims abstract description 57
- 230000007246 mechanism Effects 0.000 claims abstract description 46
- 230000000149 penetrating effect Effects 0.000 claims description 7
- 230000008569 process Effects 0.000 claims description 6
- 238000005452 bending Methods 0.000 claims description 3
- 230000001174 ascending effect Effects 0.000 abstract 1
- 238000000465 moulding Methods 0.000 description 3
- 238000007493 shaping process Methods 0.000 description 3
- 230000007547 defect Effects 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 238000013475 authorization Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21F—WORKING OR PROCESSING OF METAL WIRE
- B21F1/00—Bending wire other than coiling; Straightening wire
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Bending Of Plates, Rods, And Pipes (AREA)
Abstract
The invention discloses a laser pin forming device and a forming method, wherein the top of a lower die holder is provided with a laser groove in the front and back directions, forming notches are formed in the tops of the lower die holder on the left side and the right side of the laser groove, pin grooves are formed in the tops of the lower die holder between the inner side surfaces of the forming notches and the corresponding side surfaces of the laser groove at equal intervals, and backing plates with different thicknesses are arranged at the bottoms of the forming notches; the left and right pressure heads at the bottom of the upper template ascending and descending along the upper and lower guide mechanisms are aligned at the inner side of the forming notch at the side, a left pressure plate and a right pressure plate are arranged at the top of the lower die base corresponding to the left and right pin grooves, the rear ends of the left and right pressure plates are hinged at the top of the lower die base, and a hanging buckle mechanism capable of pressing the left and right pressure plates on the lower die base is arranged between the front ends of the left and right pressure plates and the front end part of the lower die base. When the die is closed, an L-shaped pipe pin forming area is formed between the inner side surface of each pressure head and the inner side surface of the corresponding forming notch, and between the bottom surface of each pressure head and the top surface of the corresponding backing plate.
Description
Technical Field
The invention relates to a compression molding technology, in particular to a laser pin molding device and a molding method.
Background
In the assembly of the photoelectric communication equipment, the pin of a laser in the equipment needs to be bent and formed in a Z shape, and then welding is carried out under the condition that the pin has no internal stress.
At the present stage, the laser pin of the single customization equipment is mainly manually bent and formed by workers, so that the workload of workers is large, the speed is low, the manual bending and forming precision is poor, the internal stress exists after the laser pin is welded, the requirements of assembly and welding processes are difficult to meet, and meanwhile, the damage risk also exists in the laser in the later-stage equipment use process.
In order to solve the problems of manual bending and forming of the tube pins of the laser, the utility model patent application with the authorization number of CN214556504U provides a forming device for the tube pins of the butterfly laser, which not only needs twice forming to bend the tube pins into a Z shape, but also has the defects of excessive scattering of parts, difficult assembly, stress on the root parts of the tube pins during extrusion forming and the like, thereby easily causing the damage of the laser.
Disclosure of Invention
Aiming at the defects of the prior art, the invention aims to provide a laser pin forming device and a laser pin forming method which are simple in structure, low in manufacturing cost, high in forming speed and high in forming precision.
Can solve above-mentioned technical problem's laser pipe foot forming device, its technical scheme includes that mould mechanism and lower mould mechanism, the institute is different:
1. lower die mechanism includes the die holder, preceding, backward laser groove has been seted up to the top central authorities of die holder, the shaping notch has been seted up to the symmetry on the die holder top of the left and right both sides of laser groove, and preceding, back equidistance interval are equipped with left and right-hand foot groove on the medial surface of each shaping notch and the die holder top between the laser groove corresponding side, and the bottom of each shaping notch is provided with the backing plate that has different thickness.
2. The upper die mechanism comprises an upper die plate which ascends and descends along an upper guide mechanism and a lower guide mechanism, the bottom of the upper die plate is provided with left and right symmetrical pressing heads, each pressing head is aligned to the inner side of the forming notch on the side where the pressing head is located, and an L-shaped pipe pin forming area is formed between the inner side surface of each pressing head and the inner side surface of the corresponding forming notch and between the bottom surface of each pressing head and the top surface of the corresponding base plate during die assembly.
3. The left and right pressing plates are arranged at the top of the lower die base corresponding to the left and right pin grooves, the rear ends of the left and right pressing plates are hinged on the lower die base, and a hanging buckle mechanism capable of pressing the left and right pressing plates on the lower die base is arranged between the front ends of the left and right pressing plates and the front end part of the lower die base.
One structure of the hanging buckle mechanism comprises a U-shaped hook hinged to the front ends of the left and right pressing plates and a lock catch penetrating through the U-shaped hook and hinged to the front end of the lower die holder, and the lock catch rotating downwards in place downwards tightens the U-shaped hook so as to press the left and right pressing plates on the left and right pin grooves.
Furthermore, one structure of the guide mechanism comprises guide rods arranged on the lower die base according to the front position, the rear position, the left position and the right position, and each guide rod is arranged in a guide hole correspondingly formed in the upper die plate in a penetrating manner; the top of the upper template is provided with a left-hand and a right-hand handle bar, and the left end and the right end of the handle bar are extended out of the upper template to form a handle.
The device of the invention is adopted to carry out molding operation on the pin of the laser, and the process steps are as follows:
1. respectively assembling an upper die mechanism and a lower die mechanism and placing a lower die base of the lower die mechanism on the working platform.
2. And the left and right pressing plates are turned back and upwards, the laser is suspended in the laser groove of the lower die base, and the left and right rows of pins of the laser are clamped in the left and right rows of pin grooves.
3. The left and right pressing plates are turned back to the front lower part and lightly pressed on the left and right rows of pins, the lock catch penetrates through the U-shaped hook and then is pressed down to a proper position to lock the left and right pressing plates, so that the left and right rows of pins are pressed tightly.
4. The upper template is taken up by the rods and is arranged on the four guide rods in a penetrating way.
5. And slowly pressing the upper template downwards, wherein a left pressing head and a right pressing head respectively act on the left row of pins and the right row of pins until the pressing heads are limited by the backing plate, and the left row of pins and the right row of pins are bent in the left L-shaped pin forming area and the right L-shaped pin forming area.
6. And after pressure maintaining, the upper template is moved away from the lower die holder, the lock catch is upwards turned to be loose to be separated from the U-shaped hook, the left and right pressing plates are turned upwards and backwards, and the laser is taken out to complete the pin forming of the laser.
The invention has the beneficial effects that:
1. the laser pin forming device and the forming method can quickly position the laser and quickly compress the pin of the laser through the hanging and buckling mechanism, and the condition that the pressing force is suddenly increased or not tightly pressed can not occur in the compressing process, so that the pin of the laser is stressed in a reasonable range, and the laser can be quickly and reliably positioned.
2. The invention is only composed of the upper die mechanism and the lower die mechanism, has simple structure, can conveniently lock the pressing plate through the hanging and buckling mechanism to reliably press the pin of the laser, avoids the stress on the root part of the pin of the laser in the forming process, can complete the forming of the pin of the laser into a Z-shaped shape through one-time operation, and has simple and convenient operation.
3. In the structure of the invention, the backing plate can be designed into a series with different thicknesses, and the pins of the laser can be molded into different heights by replacing the cushion blocks with different thicknesses.
Drawings
FIG. 1 is an isometric view of one embodiment of the present invention.
Fig. 2 is an isometric view of a lower die mechanism of the embodiment of fig. 1.
FIG. 3 is an isometric view of the lower die holder of the lower die mechanism of FIG. 2.
FIG. 4 is an isometric view of the components (consisting of left and right platens and a "U" shaped clevis hook) of the lower die mechanism of FIG. 2.
FIG. 5 is a design drawing of a latch tensioning "U" hook in the lower die mechanism of FIG. 2.
Fig. 6 is an isometric view of a shaped laser pin bent using the embodiment of fig. 1.
And (3) identifying the figure number: 1. a lower die holder; 1-1, a laser groove; 1-2, forming a notch; 1-3, pin grooves; 1-4, a limit groove; 2. a base plate; 3. mounting a template; 4. a pressure head; 5. pressing a plate; 6. a handle bar; 7. a hanging and buckling mechanism; 7-1 and a U-shaped hook; 7-2, locking; 8. a laser; 8-1, a pin; 9. a guide bar; 10. a connecting plate.
Detailed Description
The technical solution of the present invention is further explained with reference to the embodiments shown in the drawings.
The laser pin forming device comprises an upper die mechanism and a lower die mechanism which are mutually matched to form a left row of pins 8-1 and a right row of pins 8-1 (each row is provided with a plurality of left-direction pins 8-1 which are arranged at equal intervals in the front and the back), as shown in figures 1 and 6.
The lower die mechanism comprises a cuboid lower die base 1 (the length direction is front and back), a front laser groove 1-1 (a through groove) and a back laser groove 1-1 are arranged in the middle of the top surface of the lower die base 1, the left width and the right width of the laser groove 1-1 are matched with the body width of a laser 8, four vertical guide rods 9 are arranged at the front, back, left and right four corners of the top surface of the lower die base 1 through threaded connection, left and right symmetrical forming notches 1-2 (cuboid notches and the length direction is front and back) are arranged on the top surfaces of the lower die base 1 at the left side and the right side of the laser groove 1-1, each forming notch 1-2 is positioned between the front guide rod 9 and the back guide rod 9 at the side, a backing plate 2 (different thicknesses can be designed) is arranged at the bottom of each forming notch 1-2 through a front countersunk head screw and a back countersunk head screw, and the top surface of the backing plate 2 between the front countersunk head screw head and the back countersunk grooves is lower surfaces at two ends, a plurality of left-and-right pin grooves 1-3 (the same as the pins 8-1 on the same side in quantity and in the same positions) are arranged on the top surface of the lower die base 1 between the inner side surface (the position of the sinking groove on the backing plate 2 on the same side) of each forming notch 1-2 and the corresponding side surface of the laser groove 1-1 at equal intervals from front to back; the two rows of symmetrical left and right foot grooves 1-3 are provided with left and right symmetrical strip-shaped pressing plates 5 (the length direction is front and back directions) on the top surface of the lower die base 1, a whole body (or a whole plate body can be processed and manufactured) is formed between the left and right pressing plates 5 by a middle connecting plate 10, the bottom surface of the connecting plate 11 is higher than the bottom surfaces of the left and right pressing plates 5, the rear ends of the left and right pressing plates 5 are hinged on the top surface of the lower die base 1 at the left and right sides of the rear end of the laser groove 1-1, and the front ends of the left and right pressing plates 5 extend out of the front end surface of the lower die base 1 and are connected with the front end surface of the lower die base 1 through a hanging and buckling mechanism 7, as shown in fig. 1, fig. 2, fig. 3 and fig. 4.
The hanging buckle mechanism 7 comprises a U-shaped hook 7-1 (made of round steel) and a lock catch 7-2, the U-shaped hook 7-1 is hinged to the front ends of the left and right pressing plates 5, the upper end of the lock catch 7-2 is hinged to the front end face of the lower die holder 1 below the front ends of the left and right pressing plates 5, a limit groove 1-4 is formed in the front end face of the lower die holder 1 corresponding to the buckle body of the lock catch 7-2, the lock catch 7-2 penetrates through the U-shaped hook 7-1 forwards and upwards and then rotates downwards to be limited in the limit groove 1-4 in the front end face of the lower die holder 1, and the U-shaped hook 7-1 is tensioned downwards by the lock catch 7-2 in the downward rotating process, so that the left and right pressing plates 5 are respectively pressed on the left and right rows of foot grooves 1-3, as shown in fig. 2, 3 and 4.
The design scheme of the hanging buckle mechanism 7 is as follows:
the hinged center of the U-shaped hook 7-1 and the hinged center of the lock catch 7-2 are positioned at the upper position and the lower position in the same vertical plane and satisfy the formula L + gamma & gtR, wherein L is the distance between the hinged centers of the U-shaped hook 7-1 and the lock catch 7-2, R is the radius of an inner contour circle of the U-shaped hook 7-1 rotating around the corresponding hinged center, gamma is the distance from the hinged center of the lock catch 7-2 to a locking surface (a surface interacting with the U-shaped hook 7-1), L + gamma-R can be designed to be 0.2mm, at the position where the lock catch 7-2 completes locking, the action surface of the lock catch 7-2 starts to be rounded downwards at the hinged center of the lock catch 7-2, the rounding is larger than the cylindrical characteristic of the U-shaped hook 7-1 at the position where the lock catch 7-2 is in contact with the vertical plane, but is as small as possible, conveniently by applying force, as shown in figure 5.
The upper die mechanism comprises a square upper die plate 3, four guide holes are formed in the front, rear, left and right corners of the upper die plate 3, the four guide holes are respectively aligned with four guide rods 9, a left and right handle 6 is mounted on the top surface of the upper die plate 3 by screws in the middle, the left and right ends of the handle 6 are respectively extended out of the upper die plate 3 to form a left handle and a right handle, left and right symmetrical square pressure heads 4 (the length direction is front and rear directions) are mounted at the bottom of the upper die plate 3, and the pressure heads 4 are aligned to the inner sides of the forming notches 1-2 on the same side; the upper template 3 is arranged through four guide rods 9 by four guide holes and can be manually operated to lift up and down along the four guide rods 9, each pressure head 4 is pressed on the high positions (limit steps) at the front end and the rear end of the backing plate 2 at the position of the stop point of the descending of the upper template 3, and an L-shaped pipe pin forming area is formed between the inner side surface of each pressure head 4 and the inner side surface of the corresponding forming notch 1-2, and between the bottom surface of each pressure head 4 and the top surface (sinking groove position, the depth of the sinking groove is equal to the thickness of the pipe pin 8-1) of the corresponding backing plate 2, as shown in figure 1.
The forming method for forming the laser pin comprises the following process steps:
1. respectively assembling an upper die mechanism and a lower die mechanism, and arranging a lower die base 1 of the lower die mechanism on the working platform.
2. Under the condition that the hanging buckle mechanism 7 is unlocked, the left pressing plate 5 and the right pressing plate 5 are turned back and upwards, the machine body of the laser 8 is placed in the laser groove 1-1 of the lower die holder 1, the pins 8-1 in the left row and the right row of the machine body are clamped in the pin grooves 1-3 in the left row and the right row, so that the bottom of the machine body keeps a gap with the bottom of the laser groove 1-1, the thickness of each pin 8-1 is slightly larger than the depth of the corresponding pin groove 1-3, namely, each pin 8-1 clamped in position is slightly higher than the corresponding pin groove 1-3.
3. The left and right pressing plates 5 are rotated back to the front and the bottom to slightly press the left and right rows of pins 8-1 (the bottom of the connecting plate 11 keeps a gap with the top of the machine body), the lock catch 7-2 passes through the U-shaped hook 7-1 and then is rotated down to a proper position to lock the left and right pressing plates 5, and therefore the left and right rows of pins 8-1 are pressed tightly through the left and right pressing plates 5.
4. The upper template 3 can be moved up and down along the guide rods 9 by manually operating the upper template 3 by taking the rods 6 up and aligning the four guide holes on the upper template with the four guide rods 9 for penetrating.
5. The upper template 3 is slowly pressed down, the left and right pressure heads 4 respectively act on the left and right rows of pins 8-1 until each pressure head 4 is limited by the height of the front and rear ends of the corresponding backing plate 2 (so as to prevent the pins 8-1 from being stressed too much), and the left and right rows of pins 8-1 are bent in the left and right L-shaped pin forming areas.
6. After pressing and holding for 10s, the upper template 3 is moved away from the lower die holder 1, the lock catch 7-2 is turned upwards to be loose so as to be separated from the U-shaped hook 7-1, the left and right pressing plates 5 are turned upwards and backwards, and the laser 8 is taken out, so that the pin 8-1 of the laser 8 is formed (the pin 8-1 is bent and formed into a Z shape).
The above-described embodiments are only specific examples for further explaining the object, technical solution and advantageous effects of the present invention in detail, and the present invention is not limited thereto. Any modification, equivalent replacement, improvement and the like made within the scope of the disclosure of the present invention are included in the scope of protection of the present invention.
Claims (4)
1. Laser pipe foot forming device, including last mold mechanism and lower mold mechanism, its characterized in that:
the lower die mechanism comprises a lower die base (1), the center of the top of the lower die base (1) is provided with a laser groove (1-1) in the front and back directions, the tops of the lower die base (1) on the left side and the right side of the laser groove (1-1) are symmetrically provided with forming notches (1-2), the top of the lower die base (1) between the inner side surface of each forming notch (1-2) and the corresponding side surface of the laser groove (1-1) is provided with a left tube foot groove (1-3) in the front and back directions at equal intervals, and the bottom of each forming notch (1-2) is provided with a backing plate (2) with different thicknesses;
the upper die mechanism comprises an upper die plate (3) which ascends and descends along an upper guide mechanism and a lower guide mechanism, the bottom of the upper die plate (3) is provided with left and right symmetrical pressure heads (4), each pressure head (4) is aligned to the inner side of a forming notch (1-2) at the side, and an L-shaped pipe foot forming area is formed between the inner side surface of each pressure head (4) and the inner side surface of the corresponding forming notch (1-2) and between the bottom surface of each pressure head (4) and the top surface of the corresponding backing plate (2) during die assembly;
the left and right pressing plates (5) are arranged at the top of the lower die base (1) corresponding to the left and right pin grooves (1-3), the rear ends of the left and right pressing plates (5) are hinged on the lower die base (1), and a hanging buckle mechanism (7) capable of pressing the left and right pressing plates (5) on the lower die base (1) is arranged between the front ends of the left and right pressing plates (5) and the front end of the lower die base (1).
2. The laser pin forming apparatus according to claim 1, wherein: the hanging buckle mechanism (7) comprises a U-shaped hook (7-1) hinged to the front ends of the left pressing plate and the right pressing plate (5) and a buckle (7-2) penetrating through the U-shaped hook (7-1) and hinged to the front end of the lower die holder (1), and the buckle (7-2) rotating downwards in place downwards tensions the U-shaped hook (7-1) downwards so as to press the left pressing plate and the right pressing plate (5) on the left pipe leg groove and the right pipe leg groove (1-3).
3. The laser pin forming apparatus of claim 2, wherein: the guide mechanism comprises guide rods (9) which are arranged on the lower die base (1) according to the front, rear, left and right positions, and each guide rod (9) is arranged in a guide hole correspondingly formed in the upper template (3) in a penetrating manner; the top of the upper template (3) is provided with a left-right handlebar (6), and the left end and the right end of the handlebar (6) are extended out of the upper template (3) to form handles.
4. The method for forming laser pins is characterized in that the laser pin forming device of claim 3 is adopted, and the pin forming process comprises the following steps:
firstly, respectively assembling an upper die mechanism and a lower die mechanism and placing a lower die seat (1) of the lower die mechanism on a working platform;
rotating the left pressing plate (5) and the right pressing plate (5) to the back upper side, suspending the laser (8) in a laser groove (1-1) of the lower die base (1), and clamping the left row of pins (8-1) and the right row of pins (8-1) of the laser (8) in the left row of pin grooves (1-3) and the right row of pin grooves;
thirdly, the left pressing plate (5) and the right pressing plate (5) are rotated back to the front lower direction and lightly pressed on the left row of pins and the right row of pins (8-1), the lock catch (7-2) penetrates through the U-shaped hook (7-1) and then is pressed downwards to the right position to lock the left pressing plate (5) and the right pressing plate (5) so as to tightly press the left row of pins and the right row of pins (8-1);
fourthly, the upper template (3) is taken up by the rods (6) and is arranged on the four guide rods (9) in a penetrating way;
slowly pressing the upper template (3), respectively acting the left pressure head (4) and the right pressure head (4) on the left row of pins (8-1) and the right row of pins (4) until the pressure heads (4) are limited by the backing plate (2), and bending the left row of pins (8-1) and the right row of pins in the left L-shaped pin forming area and the right L-shaped pin forming area;
and sixthly, moving the upper template (3) upwards to be taken away from the lower die holder (1) after pressure maintaining, loosening the lock catch (7-2) upwards to separate from the U-shaped hook (7-1), rotating the left pressing plate (5) and the right pressing plate (5) upwards and backwards, and taking out the laser (8) to complete the pin forming of the laser.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210836570.9A CN115121738A (en) | 2022-07-15 | 2022-07-15 | Laser pin forming device and forming method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210836570.9A CN115121738A (en) | 2022-07-15 | 2022-07-15 | Laser pin forming device and forming method |
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| Publication Number | Publication Date |
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| CN115121738A true CN115121738A (en) | 2022-09-30 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202210836570.9A Pending CN115121738A (en) | 2022-07-15 | 2022-07-15 | Laser pin forming device and forming method |
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| CN (1) | CN115121738A (en) |
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| CN110496879A (en) * | 2019-08-20 | 2019-11-26 | 中铁隆昌铁路器材有限公司 | A kind of sequence forming frock and forming method for the production of ω type spring |
| CN210891292U (en) * | 2019-12-10 | 2020-06-30 | 苏州欧普照明有限公司 | Hasp spare and ceiling lamp |
| CN216886945U (en) * | 2022-01-15 | 2022-07-05 | 重庆长安汽车股份有限公司 | Cargo vehicle side lock joint structure |
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