CN115117185A - Method for processing laminated battery piece - Google Patents
Method for processing laminated battery piece Download PDFInfo
- Publication number
- CN115117185A CN115117185A CN202210758412.6A CN202210758412A CN115117185A CN 115117185 A CN115117185 A CN 115117185A CN 202210758412 A CN202210758412 A CN 202210758412A CN 115117185 A CN115117185 A CN 115117185A
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- Prior art keywords
- battery piece
- processing
- laminated cell
- silver
- nickel
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- 238000000034 method Methods 0.000 title claims abstract description 38
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 94
- 238000009713 electroplating Methods 0.000 claims abstract description 50
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 49
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 47
- 229910052709 silver Inorganic materials 0.000 claims abstract description 46
- 239000004332 silver Substances 0.000 claims abstract description 46
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 45
- 229910052802 copper Inorganic materials 0.000 claims abstract description 45
- 239000010949 copper Substances 0.000 claims abstract description 45
- 238000000137 annealing Methods 0.000 claims abstract description 17
- 229910052581 Si3N4 Inorganic materials 0.000 claims abstract description 12
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims abstract description 12
- 238000001035 drying Methods 0.000 claims abstract description 10
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 9
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 8
- 238000005245 sintering Methods 0.000 claims abstract description 7
- 238000007639 printing Methods 0.000 claims abstract description 5
- 239000007888 film coating Substances 0.000 claims abstract description 4
- 238000009501 film coating Methods 0.000 claims abstract description 4
- 238000007747 plating Methods 0.000 claims description 32
- 229910052751 metal Inorganic materials 0.000 claims description 9
- 239000002184 metal Substances 0.000 claims description 9
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 239000002994 raw material Substances 0.000 abstract description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 9
- 238000007650 screen-printing Methods 0.000 description 9
- 229910052710 silicon Inorganic materials 0.000 description 9
- 239000010703 silicon Substances 0.000 description 9
- 238000004140 cleaning Methods 0.000 description 4
- 238000000576 coating method Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000003672 processing method Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- AZDRQVAHHNSJOQ-UHFFFAOYSA-N alumane Chemical compound [AlH3] AZDRQVAHHNSJOQ-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000008199 coating composition Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 229910021484 silicon-nickel alloy Inorganic materials 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0224—Electrodes
- H01L31/022408—Electrodes for devices characterised by at least one potential jump barrier or surface barrier
- H01L31/022425—Electrodes for devices characterised by at least one potential jump barrier or surface barrier for solar cells
- H01L31/022433—Particular geometry of the grid contacts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0224—Electrodes
- H01L31/022408—Electrodes for devices characterised by at least one potential jump barrier or surface barrier
- H01L31/022425—Electrodes for devices characterised by at least one potential jump barrier or surface barrier for solar cells
- H01L31/022441—Electrode arrangements specially adapted for back-contact solar cells
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1804—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof comprising only elements of Group IV of the Periodic Table
Landscapes
- Engineering & Computer Science (AREA)
- Electromagnetism (AREA)
- Sustainable Development (AREA)
- Sustainable Energy (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Life Sciences & Earth Sciences (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Photovoltaic Devices (AREA)
Abstract
The invention provides a method for processing a laminated cell, which comprises the following steps of sequentially carrying out the following operations on the laminated cell after film coating: grooving the front side of the battery piece, and removing silicon nitride at the position of the grooving; grooving the back surface of the battery piece; printing aluminum paste and silver paste on the back of the battery piece; drying; sintering; sequentially electroplating nickel, copper and silver at the groove positions on the front surface of the battery piece to form a fine grid; annealing; the method for manufacturing the laminated cell reduces the cost of raw materials, and can accurately control the width and the height-width ratio of the fine grid, thereby improving the efficiency of the cell; and the fine grid has low conductivity, so that the efficiency of the cell is further improved.
Description
Technical Field
The invention belongs to the technical field of solar cell preparation, and particularly relates to a method for processing a laminated cell.
Background
The traditional processing method of the laminated cell is to manufacture an electrode by screen printing of silver paste, and the specific operations of the laminated cell comprise back nanosecond laser grooving of the cell, back screen printing of aluminum paste and silver paste, drying, front screen printing of silver paste on the cell, drying and sintering.
The traditional processing method has the following defects:
1. silver paste is used for screen printing on the front side of the cell, so that the cost of raw materials is high;
2. the screen printing method cannot completely prevent the diffusion of the silver paste in the silicon layer, so that the aspect ratio of the fine grid manufactured by the screen printing method cannot be precisely controlled, and the efficiency of the cell cannot be improved from this point.
Disclosure of Invention
In view of the above problems, the present invention provides a method for processing a laminated cell, so as to solve the above disadvantages of the prior art.
In order to solve the technical problems, the technical scheme adopted by the invention is as follows:
a method for processing a laminated tile battery piece comprises the following operations of sequentially carrying out film coating on the laminated tile battery piece:
s1, grooving the front side of the battery piece, and removing silicon nitride at the grooving position;
s2, grooving the back of the battery piece;
s3, printing aluminum paste and silver paste on the back of the battery piece;
s4, drying;
s5, sintering;
s6, sequentially electroplating nickel, copper and silver at the front groove position of the battery piece to form a fine grid;
and S7, annealing.
The width of the groove on the front side of the battery piece is 12-18 um.
The thickness of the nickel plating layer is 40-200 nm.
The thickness of the nickel plating layer is 45-190 nm.
The thickness of the copper plating layer is 10-15 um.
The thickness of the silver plating layer is 1-2 um.
The annealing temperature is set to 300-400 ℃.
The annealing time is set to 1-2 min.
After each metal is electroplated, the cell is cleaned and dried, and then the next operation is carried out.
And the front surface of the battery piece is grooved by picosecond laser.
Due to the adoption of the technical scheme, the invention can ensure the formation of the metal electrode and simultaneously has the following beneficial technical effects:
1. the pure silver paste in the traditional technology has been replaced with the combination of nickel, copper, silver to equivalent to under the equal volume size's of fine grid condition, the combined cost of nickel, copper, silver is cheaper than solitary silver, thereby has reduced the cost of raw and other materials:
2. firstly, grooving the front side of the battery piece, then sequentially electroplating nickel, copper and silver, and plating the nickel on the bottommost layer to be used as a seed layer, wherein the nickel can form good ohmic contact with silicon, so that the good ohmic contact between the whole fine grid and the battery piece is ensured; the nickel layer can also be used as an isolating layer to effectively prevent subsequent copper and silver from diffusing in the silicon layer, so that the width of the final groove can be ensured to be the width of the final fine grid, and the width and the height-width ratio of the fine grid can be accurately controlled;
3. because the fine grid of the laminated cell prepared by the method contains copper, compared with the fine grid obtained by screen printing silver, the fine grid of the laminated cell has lower resistivity, so that the loss of the laminated cell in the current transmission process can be reduced, and the efficiency of the cell is improved;
4. because the coating composition of the outermost layer of the fine grid of the laminated tile battery piece prepared by the method is still silver, the outermost contact layer of the fine grid of the laminated tile battery piece prepared by the method is not changed, so that other related components in contact with and connection with the battery piece do not need to be changed in the subsequent assembly process of the photovoltaic module.
Detailed Description
The present invention will be further described with reference to the following examples.
The invention discloses a method for processing a laminated cell, which comprises the following steps of sequentially carrying out the following operations on the laminated cell after film coating:
s1, grooving the front side of the battery piece, and removing silicon nitride at the grooving position;
s2, grooving the back of the battery piece;
s3, printing aluminum paste and silver paste on the back of the battery piece;
s4, drying;
s5, sintering;
s6, sequentially electroplating nickel, copper and silver at the front groove position of the battery piece to form a fine grid;
and S7, annealing.
And (3) laser grooving is carried out on the front side of the battery piece, and silicon nitride at the grooving position of the front side of the battery piece is removed, so that subsequent nickel, copper and silver electroplating can be carried out. Because the silicon nitride layer on the surface of the front side of the battery piece can play a role of an isolating layer, the electroplating solution is prevented from entering the silicon layer of the battery piece, and the electroplating layer is also prevented from being formed at the position where the open groove is not arranged, so that the front side of the battery piece is required to be opened for metal electroplating, and the nickel can be electroplated only at the position where the open groove is arranged subsequently.
In this embodiment, the light spot of the laser can be controlled to be 12-18um, that is, the width of the groove on the front surface of the cell is 12-18um, and therefore, the width of the fine grid on the front surface of the cell after electroplating is 12-18 um. Preferably, the light spot of the laser can be controlled to be 12.5, 13, 13.5, 14, 14.5, 14.8, 15, 15.2, 15.5, 15.8, 16, 16.5, 17 or 17.5um, i.e. the width of the fine grid on the front surface of the cell piece after electroplating is 12.5, 13, 13.5, 14, 14.5, 14.8, 15, 15.2, 15.5, 15.8, 16, 16.5, 17 or 17.5 um.
Preferably, in step S1, the front surface of the battery piece is grooved by using a picosecond laser, i.e., the silicon nitride at the position corresponding to each groove on the front surface of the battery piece is removed by using an ultraviolet picosecond laser. Because the power fluctuation of the ultraviolet picosecond laser is less, the PN junction in the silicon wafer can not be damaged while the silicon nitride can be removed.
In step S2, the back surface of the cell sheet is grooved with nanosecond laser.
In steps S2 to S5, the detailed operations can adopt conventional technical solutions that are well known and feasible, and therefore are not described herein.
In the step S6, firstly electroplating nickel in the grooves on the front surface of the laminated cell, wherein the thickness of the nickel plating layer is 40-200 nm; electroplating copper on the nickel seed layer, wherein the thickness of the copper plating layer is 10-15 um; and finally, electroplating silver on the copper plating layer, wherein the thickness of the silver plating layer is 1-2 um. After plating, a metal electrode, i.e., a fine grid, is formed.
Preferably, the plating thickness of the nickel is 45 to 190 nm. Preferably, the plating thickness of the nickel is 50, 55, 58, 60, 65, 70, 75, 80, 90, 95, 100, 120, 130, 140, 150, 160, 170, 180, 190, or 195 nm. The plating thickness of the copper is 11, 12, 13, 14 or 14.5 um. The plating thickness of the silver is 1.2, 1.3, 1.4, 1.5, 1.6, 1.7, 1.8, 1.9, or 1.95 um.
When nickel is electroplated, the laminated cell is placed on a nickel electroplating solution, and the laminated cell floats on the surface of the nickel electroplating solution, so that the front surface of the laminated cell faces the nickel electroplating solution. The surface of the front surface of the laminated tile battery piece without the groove is provided with the silicon nitride layer, so that a nickel electroplating solution cannot form a plating layer on the silicon nitride layer, and only electroplating can be carried out at the groove position.
In the process of copper electroplating, the laminated cell piece which is already plated with the nickel layer is placed on a copper electroplating solution, so that the front surface of the laminated cell piece faces the copper electroplating solution. Similarly, because the surface of the front surface of the laminated tile battery piece without the groove is provided with the silicon nitride layer, the copper electroplating solution cannot form a plating layer on the silicon nitride layer, and the nickel plating layer can also be used as an isolating layer to effectively prevent the subsequent diffusion of copper and silver in the silicon layer, so that only an electroplated copper layer can be formed on the electroplated nickel layer during copper electroplating. The principle of silver electroplating is the same as that of copper electroplating, so that only copper electroplating layers can be formed on the nickel electroplating layer and the copper electroplating layer. Therefore, the fine grid is prepared by sequentially electroplating nickel, copper and silver at the positions where the front surface of the battery piece is grooved, and the width of the fine grid is the width of the groove.
As mentioned above, firstly, a groove is formed in the front surface of the battery piece, then the fine grid is manufactured by electroplating nickel, copper and silver in sequence, the nickel is plated on the bottommost layer to be used as a seed layer, and the nickel can form good ohmic contact with silicon, so that the good ohmic contact between the whole fine grid and the battery piece is ensured; the nickel layer can also be used as an isolation layer to effectively prevent subsequent copper and silver from diffusing in the silicon layer, so that the width of the final groove is ensured to be a fine grid, the nickel, the copper and the silver are formed on the battery piece in an electroplating mode, and the thickness of each coating can be accurately controlled in the electroplating mode, so that the width and the height-width ratio of the fine grid can be accurately controlled (the width of the fine grid is the thickness of the fine grid), and the target set width and height-width ratio can be accurately obtained by the method, and the efficiency of the battery piece is further improved. The efficiency of the laminated cell is improved because the resistivity of the fine grid lines can be reduced by increasing the aspect ratio of the fine grid (compared with the aspect ratio of the fine grid obtained by traditional screen printing); the width of the fine grids can be reduced, and the width of each fine grid is reduced under the condition that the number of the fine grids of the shingled battery pieces with the same volume is the same, so that the light receiving area of the battery piece can be increased, and the efficiency of the battery piece is further improved.
In addition, the front surface of the battery piece is sequentially electroplated with nickel, copper and silver, so that the operation of pure silver paste printing in the traditional technology is replaced, the metal electrode can be formed, the material cost can be saved, and the silver paste with the same volume is more expensive than the combination of nickel, copper and silver. Moreover, the fine grid obtained by electroplating the metal nickel, copper and silver coatings contains copper, so that the resistivity of the fine grid is lower than that of the fine grid obtained by screen printing silver in the traditional technology, the loss of the battery piece in the current transmission process can be reduced, and the efficiency of the battery piece is improved; because the coating component of the outermost layer of the fine grid is silver, the outermost contact layer of the fine grid of the laminated cell prepared by the method is not changed, so that other related components in contact with and connection with the cell do not need to be changed in the subsequent assembly process of the photovoltaic component.
The front side of the battery piece is grooved before the back side is grooved, but not after sintering, because the aluminum paste and the silver paste printed on the back side of the battery piece are dried and sintered to be solid, if the front side of the battery piece is grooved by laser after sintering, the solid aluminum paste and the silver paste on the back side of the battery piece are likely to generate a little aluminum powder and silver powder, and the powder object is easy to drift and the drift position is uncertain, so that the aluminum powder and the silver powder are likely to be attached to the front side of the battery piece. If the front surface of the battery piece with the aluminum and silver powder stuck on the front surface is grooved and electroplated, the efficiency and quality of the finally obtained battery piece cannot be guaranteed. The problem is avoided by placing the front groove of the cell before the back groove, and the efficiency and the quality of the cell prepared by the method are further ensured.
The specific electroplating method may be a conventional electroplating method, and the specific electroplating method is not a creation point of the present invention, and thus is not described herein.
Because nickel, copper and silver are electroplated in sequence, after each metal is electroplated, the battery piece is cleaned and dried, and then the next operation is carried out. Namely, after nickel electroplating, cleaning and drying the laminated tile battery piece; electroplating copper, and then cleaning and drying the laminated tile battery piece; and finally, carrying out silver electroplating, cleaning and drying the laminated tile battery piece, and finally annealing. Therefore, the electroplating solution on the upper layer can be prevented from being brought into the electroplating solution on the lower layer by the battery piece, so that the property of the electroplating solution on the lower layer can be prevented from being influenced, the performance of the electroplating solution on the lower layer can be prevented from being influenced, and the accurate and controllable thickness of each electroplated layer can be ensured. For example, if a copper plating solution is doped with a nickel solution, the plating solution is not completely copper but a mixture of nickel and copper when copper plating is performed, and after such a plating solution is plated, the plating layer contains nickel and copper instead of a pure copper plating layer, so that the plating layer obtained in this step is not a pure copper plating layer but a nickel and copper mixture plating layer, and thus, the thickness of the nickel and copper plating layer cannot be precisely controlled. And after the electroplating operation is completely finished, namely after the silver electroplating is finished, cleaning, drying and annealing are carried out, so that the annealing effect can be ensured, and the efficiency of the battery piece can be ensured. If the surface of the battery piece is adhered with the electroplating liquid, after annealing, the thickness of the whole thin grid layer is increased by adhering the electroplating liquid on the silver electroplating layer, namely the height of the battery piece is increased, so that the height-width ratio of the thin grid is not the originally set value, and the battery piece obtained in the way is equivalent to a unqualified product; the plating solution is left on other positions of the surface of the cell, and the efficiency of the cell is inevitably affected, so that the cell is unqualified. Namely, after the electroplated battery piece is cleaned and dried, the next operation is carried out, which is beneficial to ensuring the quality and efficiency of the battery piece.
When the laminated cell is annealed, the annealing temperature is set to 300-400 ℃, and the annealing time is set to 1-2 min. By adopting the parameter combination, the nickel and the silicon can be ensured to form the co-melted nickel-silicon alloy to form good ohmic contact, and long time is not needed, so that the processing efficiency of the laminated cell is ensured.
Preferably, the annealing temperature is set to 320, 330, 350, 360, 380, 390 or 395 degrees Celsius, and the annealing time is set to 1.1min, 1.2min, 1.3min, 1.4min, 1.5min, 1.6min, 1.7min, 1.8min or 1.9 min.
The laminated cell slice manufactured by the method can be manufactured into a laminated assembly subsequently, and in the process of manufacturing the laminated assembly, the temperature of the used series welding process is not higher than 200 ℃, but is connected by using conductive adhesive, so that in the process of serially connecting the cell slices, a metal electrode, namely a fine grid formed by electroplating the laminated cell slice manufactured by the method cannot fall off due to high temperature, and the quality problem caused by the high temperature can be avoided.
The embodiments of the present invention have been described in detail, but the description is only for the preferred embodiments of the present invention and should not be construed as limiting the scope of the present invention. All equivalent changes and modifications made within the scope of the present invention shall fall within the scope of the present invention.
Claims (10)
1. A method for processing a laminated battery piece is characterized in that: the method comprises the following steps of sequentially carrying out the following operations on the laminated cell after film coating:
s1, grooving the front side of the battery piece, and removing silicon nitride at the grooving position;
s2, grooving the back of the battery piece;
s3, printing aluminum paste and silver paste on the back of the battery piece;
s4, drying;
s5, sintering;
s6, sequentially electroplating nickel, copper and silver at the front groove position of the battery piece to form a fine grid;
and S7, annealing.
2. The method for processing a laminated cell sheet according to claim 1, wherein: the width of the groove on the front side of the battery piece is 12-18 um.
3. The method for processing a laminated cell sheet according to claim 1 or 2, wherein: the thickness of the nickel plating layer is 40-200 nm.
4. The method for processing a laminated cell sheet according to claim 3, wherein: the thickness of the nickel plating layer is 45-190 nm.
5. The method for processing a laminated cell sheet according to claim 3 or 4, wherein: the thickness of the copper plating layer is 10-15 um.
6. The method for processing a laminated cell sheet according to any one of claims 1 to 5, wherein: the thickness of the silver plating layer is 1-2 um.
7. The method for processing a laminated cell sheet according to any one of claims 1 to 6, wherein: during annealing, the annealing temperature is set to 300-400 ℃.
8. The method for processing a laminated cell sheet according to claim 7, wherein: the annealing time is set to 1-2 min.
9. The method for processing a laminated cell sheet according to any one of claims 1 to 8, wherein: after each metal is electroplated, the cell is cleaned and dried, and then the next operation is carried out.
10. The method for processing a laminated cell sheet according to any one of claims 1 to 9, wherein: and the front surface of the battery piece is grooved by picosecond laser.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210758412.6A CN115117185A (en) | 2022-06-30 | 2022-06-30 | Method for processing laminated battery piece |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202210758412.6A CN115117185A (en) | 2022-06-30 | 2022-06-30 | Method for processing laminated battery piece |
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| CN202210758412.6A Pending CN115117185A (en) | 2022-06-30 | 2022-06-30 | Method for processing laminated battery piece |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117542919A (en) * | 2023-11-09 | 2024-02-09 | 扬州大学 | Patterning method and preparation method of full back electrode contact crystalline silicon photovoltaic cell |
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| WO2022105192A1 (en) * | 2020-11-19 | 2022-05-27 | 江苏大学 | Pecvd technology-based preparation method for high-efficiency low-cost n-type topcon battery |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN105226112A (en) * | 2015-09-25 | 2016-01-06 | 中节能太阳能科技（镇江）有限公司 | A kind of preparation method of efficient crystal silicon solar batteries |
| US20200013909A1 (en) * | 2017-03-03 | 2020-01-09 | Guangdong Aiko Solar Energy Technology Co., Ltd. | Bifacial p-type perc solar cell and module, system, and preparation method thereof |
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| WO2022105192A1 (en) * | 2020-11-19 | 2022-05-27 | 江苏大学 | Pecvd technology-based preparation method for high-efficiency low-cost n-type topcon battery |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN117542919A (en) * | 2023-11-09 | 2024-02-09 | 扬州大学 | Patterning method and preparation method of full back electrode contact crystalline silicon photovoltaic cell |
| CN117542919B (en) * | 2023-11-09 | 2024-07-12 | 扬州大学 | Patterning method and preparation method of full back electrode contact crystalline silicon photovoltaic cell |
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