CN115106605A - Method for batch automatic tin feeding and gold removing of welding ends of bottom welding end type device - Google Patents
Method for batch automatic tin feeding and gold removing of welding ends of bottom welding end type device Download PDFInfo
- Publication number
- CN115106605A CN115106605A CN202210692017.2A CN202210692017A CN115106605A CN 115106605 A CN115106605 A CN 115106605A CN 202210692017 A CN202210692017 A CN 202210692017A CN 115106605 A CN115106605 A CN 115106605A
- Authority
- CN
- China
- Prior art keywords
- soldering
- gold
- welding
- tin
- components
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000003466 welding Methods 0.000 title claims abstract description 62
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 title claims abstract description 38
- 239000010931 gold Substances 0.000 title claims abstract description 38
- 229910052737 gold Inorganic materials 0.000 title claims abstract description 38
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 title claims abstract description 35
- 238000000034 method Methods 0.000 title claims abstract description 25
- 238000005476 soldering Methods 0.000 claims abstract description 42
- 239000007788 liquid Substances 0.000 claims description 15
- 238000002844 melting Methods 0.000 claims description 4
- 230000008018 melting Effects 0.000 claims description 4
- 230000009471 action Effects 0.000 claims description 3
- 238000007664 blowing Methods 0.000 claims description 3
- 239000007921 spray Substances 0.000 claims description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 12
- 229910000679 solder Inorganic materials 0.000 description 10
- 230000008569 process Effects 0.000 description 9
- 239000011248 coating agent Substances 0.000 description 7
- 238000000576 coating method Methods 0.000 description 7
- 229910052742 iron Inorganic materials 0.000 description 6
- 238000007747 plating Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 230000007774 longterm Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- 238000009736 wetting Methods 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000003685 thermal hair damage Effects 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0607—Solder feeding devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention discloses a method for automatically soldering and removing gold from soldering terminals of bottom soldering terminal type devices in batch. The invention has the advantages of simple operation, wide applicability, low cost and the like, solves the difficult problem of tin and gold removal of bottom welding end devices, greatly improves the working efficiency, has important significance for improving the tin and gold removal efficiency and the welding quality of bottom terminal chips such as DFN, QFN, LGA, MLFP and the like, and has wider application range and market prospect.
Description
Technical Field
The invention belongs to the technical field related to an electronic assembly process, and particularly relates to a method for tin coating and gold removing of a bottom welding end device (including DFN, QFN, LGA and MLFP packaged devices).
Background
With the continuous development of microelectronic technology, the integration level of components is higher and higher. Compared with the conventional mounting devices represented by DIP packages and SOP packages, the bottom-bonding-end devices represented by LGA, QFN and DFN have the characteristics of high integration and lower cost, and are rapidly applied in the electronic industry. However, in the military, aviation, aerospace, navigation, rail transit and automotive electronics industries where high reliability is required, the bottom solder end type device soldering has the following problems:
1. the control difficulty of the welding spot cavity of the welded bottom welding end device is high: according to the requirements of IPC-7093 standard, the area rate of the cavity at the bottom of the BTC terminal is recommended to be controlled within 30%, however, because the welding surface of the bottom welding end type device is a plane or a concave surface, a device welding pad is buckled on the welding pad like a pot cover in the welding process, gas in tin paste is difficult to escape in the welding process, and bubbles are remained in the welding point after the welding point is cooled to form a welding point cavity.
2. The welding spots of bottom welding end devices are easy to generate gold brittleness, and the long-term reliability of the welding spots is influenced: almost all aerospace electronic components and parts adopt a gold plating process to improve the oxidation resistance of the terminals, and according to the standard requirements of GJB/Z163, IPC/EIA J-STD-001G, QJ3117-99 and the like, all surface-mounted components (including bottom terminals) need to be subjected to gold removal before welding, if the gold removal treatment is not carried out according to the standard requirements, the welded welding points are easy to generate 'gold brittleness' cracks in the using process, so that the long-term reliability of products is obviously reduced.
In order to solve the problem of welding the bottom welding end type devices, the tin pre-coating gold removing treatment is basically adopted in the industry before the welding of the devices. At present, the methods for removing gold and tin adopted in the industry mainly comprise two methods:
1. the method of melting a solder wire by a manual electric iron and then applying the solder wire to the welding end of a component is commonly called manual tin feeding and gold removing;
2. the solder is removed from the gold by direct contact of the solder tip with a liquid solder wave generating device (such as wave soldering, selective wave soldering machine, and special devices with similar structures).
However, the bottom terminal type chips such as LGA, QFN, and DFN are a type of square flat surface mount chip, which has a small package size and a dense pin pitch as small as 0.4mm, and the bonding terminals thereof are not like SOP, QFP, etc. having protruding pins but only have pads of a planar lattice structure. In both of the above methods, the following problems occur:
1. the operation efficiency is low: the two methods can only perform tin coating and gold removing on a small number of welding ends at the same time, so that the efficiency of the bottom welding end type devices with large quantity and more welding ends becomes a remarkable bottleneck due to low efficiency, and the assembly speed of a subsequent process cannot be matched;
2. the tin coating and gold removing effects are poor, and the defects of continuous welding and the like are easy to generate: because the distance between the welding ends of the bottom welding end type devices is small, no matter the manual electric iron or the welding wave generating device carries out tin soldering and gold removing, compared with the welding end with a small area, the tin soldering is excessive, so that the welding end continuous welding is very easy to occur after tin soldering and gold removing;
therefore, in order to solve the problem of removing tin and gold from the bottom pads of bottom-pad devices (including DFN, QFN, LGA and MLFP packaged devices) and avoid the problem of removing tin and gold from the manual soldering iron and the solder wave generating device, it is necessary to design an automatic tin and gold removing method for the bottom pads of the bottom-pad devices (including DFN, QFN, LGA and MLFP packaged devices).
Disclosure of Invention
The invention aims to provide a method for automatically feeding tin and removing gold on the welding ends of bottom welding end type devices in batch, which has the advantages of simple operation, wide applicability, low cost and the like and has important significance for improving tin feeding and gold removing efficiency and quality of DFN, QFN, LGA and MLFP packaged devices.
The invention aims to be realized by the following technical scheme:
a method for batch automatic tin feeding and gold removing of welding ends of bottom welding end type devices comprises the following steps:
firstly, a plurality of components 1 to be tinned and gold-removed are placed upside down on a tray carrier 2 with matched size, so that the bottom welding ends of the components are upward;
secondly, according to the soldering terminal graph of the component, the glue dispensing nozzle 3 is used for spraying and printing soldering paste on the soldering terminal of the component to be soldered and gold-removed;
and step three, placing the tray carrier 2 loaded with the components under a hot air generating device 4, melting the soldering paste under the action of hot air, increasing the air volume of the hot air generating device after the gold layer on the components is melted by the soldering liquid, blowing the liquid soldering tin away from the welding ends so as to blow a part of the soldering tin liquid with the gold dissolved away from the welding pads, wherein a small part of the soldering tin liquid is left on the welding ends of the components due to a certain wetting force between the soldering tin liquid and the welding ends, and the welding ends of the components are subjected to tin coating and gold removing after the components are cooled.
The invention has the beneficial effects that:
compared with a manual electric iron and a soldering tin wave generating device, the tin soldering device can complete tin soldering and gold removing of a large number of devices at one time, so that the efficiency is extremely high; in addition, because the invention adopts high-temperature gas as a heat transfer carrier, the welding end continuous welding caused by the instability of an electric iron or a soldering tin wave generating device during working is avoided, and the instantaneous thermal impact caused by the direct contact of liquid solder or a high-temperature soldering iron head with a device is also avoided, so that the tin-plating gold-removing effect is better, and the thermal damage to the device is smaller.
Drawings
FIG. 1 is a schematic flow chart of a batch automatic tin-loading and gold-removing method for the bonding terminals of a bottom bonding terminal type device.
Fig. 2 is a schematic diagram of the change of the component in the tin coating and gold removing process.
Fig. 3 is a schematic view of a tray carrier.
FIG. 4 is a schematic view of a solder paste spraying process.
Fig. 5 is a schematic view of a hot air tinning process.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings and examples.
In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention, however, the present invention may be practiced otherwise than as specifically described and thus the scope of the present invention is not limited by the specific examples disclosed below.
As shown in fig. 1-5. The method for batch automatic tin-plating and gold-removing of the welding ends of the bottom welding end type device shown in the embodiment comprises the following steps:
firstly, a plurality of components 1 to be tinned and gold-removed are placed upside down on a tray carrier 2 with matched size, so that the bottom welding ends of the components are upward;
step two, placing the tray carrier 2 loaded with the components under the dispensing nozzle 3, using the dispensing nozzle 3 to spray and print the soldering paste on the soldering end of the component to be soldered and gold-removed according to the soldering end pattern of the component, and unloading the tray loaded with the components from the spray printing machine after the solder paste is sprayed and printed;
and step three, placing the tray carrier 2 loaded with the components under a hot air generating device 4, melting the soldering paste under the action of hot air, increasing the air volume of the hot air generating device after the gold layer on the components is melted by the soldering liquid, blowing the liquid soldering tin away from the welding ends so as to blow a part of the soldering liquid with the gold dissolved away from the welding pads, leaving a small part of the soldering liquid away from the welding ends of the devices due to a certain wetting force between the soldering liquid and the welding ends, and completing the tin-coating and gold-removing of the welding ends of the devices after the devices are cooled.
The embodiment has the advantages of simple operation, wide applicability, low cost and the like, solves the problem of tin and gold removal of bottom welding end devices, greatly improves the working efficiency, has important significance for improving tin and gold removal efficiency and welding quality of bottom terminal chips such as DFN, QFN, LGA, MLFP and the like, and has wide application range and market prospect.
It should be understood that equivalents and modifications of the technical solution and inventive concept thereof may occur to those skilled in the art, and all such modifications and alterations should fall within the scope of the appended claims.
Claims (1)
1. A method for batch automatic tin feeding and gold removing of welding ends of bottom welding end type devices is characterized by comprising the following steps:
the method comprises the following steps that firstly, a plurality of components to be subjected to tin soldering and gold removing are placed upside down on a tray carrier with matched size, and the bottom soldering ends of the components are upward;
secondly, according to the soldering terminal graph of the component, using a dispensing nozzle to spray and print soldering paste on the soldering terminal of the component to be soldered and gold-removed;
and step three, placing the tray carrier loaded with the components under a hot air generating device, melting the soldering paste under the action of hot air, increasing the air volume of the hot air generating device after the gold layer on the components is melted by the soldering liquid, blowing a part of the soldering liquid with the gold dissolved away from the bonding pad, and leaving a part of the soldering liquid at the welding end of the components.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210692017.2A CN115106605A (en) | 2022-06-17 | 2022-06-17 | Method for batch automatic tin feeding and gold removing of welding ends of bottom welding end type device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210692017.2A CN115106605A (en) | 2022-06-17 | 2022-06-17 | Method for batch automatic tin feeding and gold removing of welding ends of bottom welding end type device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115106605A true CN115106605A (en) | 2022-09-27 |
Family
ID=83328193
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210692017.2A Pending CN115106605A (en) | 2022-06-17 | 2022-06-17 | Method for batch automatic tin feeding and gold removing of welding ends of bottom welding end type device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN115106605A (en) |
Citations (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CA2055910A1 (en) * | 1991-02-12 | 1992-08-13 | William E. Elias | Fluxless solder |
| CN101033550A (en) * | 2007-03-27 | 2007-09-12 | 广东东硕科技有限公司 | Micro-corrosion liquid and application thereof in printing wiring board silver aggradation pretreatment |
| CN101234455A (en) * | 2007-01-30 | 2008-08-06 | 播磨化成株式会社 | Soldering tin paste composition and soldering-tin precoating method |
| EP1952935A1 (en) * | 2007-02-01 | 2008-08-06 | Harima Chemicals, Inc. | Solder paste composition and solder precoating method |
| CN101988165A (en) * | 2009-07-31 | 2011-03-23 | 中国科学院金属研究所 | High-temperature oxidation resistant lead-free tin-coated alloy |
| CN110524083A (en) * | 2019-08-20 | 2019-12-03 | 中国航空工业集团公司西安飞行自动控制研究所 | A kind of automation for QFN device goes metal working to fill and go golden method |
| CN111681972A (en) * | 2020-06-19 | 2020-09-18 | 中国航空无线电电子研究所 | Tool for assisting gold removal of chip with pins and gold removing and tin coating method |
| CN112820652A (en) * | 2021-01-19 | 2021-05-18 | 国营芜湖机械厂 | Method for removing gold and tin lining of L-shaped welding terminal of QFN (quad Flat No lead) packaging device |
| CN113000966A (en) * | 2021-04-29 | 2021-06-22 | 西安微电子技术研究所 | Welding method of connector between gold-plated pin plates |
| CN113319454A (en) * | 2021-04-29 | 2021-08-31 | 中国电子科技集团公司第二十九研究所 | Solder presetting method for welding end of surface-mounted self-contained solid solder connector |
| CN113438822A (en) * | 2021-07-02 | 2021-09-24 | 德中（天津）技术发展股份有限公司 | Circuit board manufacturing method for comprehensively optimizing bare board surface treatment and component mounting |
| CN114101833A (en) * | 2021-12-13 | 2022-03-01 | 中国电子科技集团公司第十三研究所 | Tin-coating gold-removing method for leadless ceramic device |
| CN114423179A (en) * | 2022-02-15 | 2022-04-29 | 惠州市则成技术有限公司 | Welding manufacturing process based on FPC board and components |
-
2022
- 2022-06-17 CN CN202210692017.2A patent/CN115106605A/en active Pending
Patent Citations (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CA2055910A1 (en) * | 1991-02-12 | 1992-08-13 | William E. Elias | Fluxless solder |
| CN101234455A (en) * | 2007-01-30 | 2008-08-06 | 播磨化成株式会社 | Soldering tin paste composition and soldering-tin precoating method |
| EP1952935A1 (en) * | 2007-02-01 | 2008-08-06 | Harima Chemicals, Inc. | Solder paste composition and solder precoating method |
| CN101033550A (en) * | 2007-03-27 | 2007-09-12 | 广东东硕科技有限公司 | Micro-corrosion liquid and application thereof in printing wiring board silver aggradation pretreatment |
| CN101988165A (en) * | 2009-07-31 | 2011-03-23 | 中国科学院金属研究所 | High-temperature oxidation resistant lead-free tin-coated alloy |
| CN110524083A (en) * | 2019-08-20 | 2019-12-03 | 中国航空工业集团公司西安飞行自动控制研究所 | A kind of automation for QFN device goes metal working to fill and go golden method |
| CN111681972A (en) * | 2020-06-19 | 2020-09-18 | 中国航空无线电电子研究所 | Tool for assisting gold removal of chip with pins and gold removing and tin coating method |
| CN112820652A (en) * | 2021-01-19 | 2021-05-18 | 国营芜湖机械厂 | Method for removing gold and tin lining of L-shaped welding terminal of QFN (quad Flat No lead) packaging device |
| CN113000966A (en) * | 2021-04-29 | 2021-06-22 | 西安微电子技术研究所 | Welding method of connector between gold-plated pin plates |
| CN113319454A (en) * | 2021-04-29 | 2021-08-31 | 中国电子科技集团公司第二十九研究所 | Solder presetting method for welding end of surface-mounted self-contained solid solder connector |
| CN113438822A (en) * | 2021-07-02 | 2021-09-24 | 德中（天津）技术发展股份有限公司 | Circuit board manufacturing method for comprehensively optimizing bare board surface treatment and component mounting |
| CN114101833A (en) * | 2021-12-13 | 2022-03-01 | 中国电子科技集团公司第十三研究所 | Tin-coating gold-removing method for leadless ceramic device |
| CN114423179A (en) * | 2022-02-15 | 2022-04-29 | 惠州市则成技术有限公司 | Welding manufacturing process based on FPC board and components |
Non-Patent Citations (1)
| Title |
|---|
| 李策: "βSn组织和晶粒取向对焊锡接头可靠性影响机理研究进展", 机械工程学报, vol. 2, no. 58, pages 203 - 222 * |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6280858B1 (en) | Substrate with solder alloy for mounting electronic parts | |
| CN110449683B (en) | High-reliability printed circuit board assembly QFN (quad Flat No lead) assembling and welding pretreatment method | |
| CN104540333B (en) | The assembly technique of 3D Plus packagings | |
| JPH0410240B2 (en) | ||
| JPH11114667A (en) | Joining method of metal member and joined body | |
| JPH04504230A (en) | Method for manufacturing soldered articles | |
| WO2014020751A1 (en) | Component having electrode dissolution prevention layer, and manufacturing method therefor | |
| CN101030546B (en) | Capacitor attachment method | |
| CN115106605A (en) | Method for batch automatic tin feeding and gold removing of welding ends of bottom welding end type device | |
| CN112820652B (en) | Method for removing Jin Tang tin from L-shaped welding terminal of QFN packaging device | |
| KR20020036658A (en) | Electrode forming method and bump electrode formable base used therefor | |
| CN111540691A (en) | Semiconductor packaging structure and packaging method thereof | |
| CN110739228B (en) | Method for quickly mounting BGA chip | |
| EP0263221A1 (en) | Method of forming solder bumps on metal contact pads of a substrate | |
| JP4639607B2 (en) | Method for producing lead-free solder material and Pb-free solder material | |
| CN212062388U (en) | Semiconductor packaging structure | |
| Prasad et al. | Introduction to surface mount technology | |
| JP3014989B2 (en) | Electronic component manufacturing equipment | |
| CN214815528U (en) | Laser welding equipment for surface mounting process | |
| US20140048586A1 (en) | Innovative Multi-Purpose Dipping Plate | |
| Hlina et al. | Alternative interconnection methods for bare die electronic components | |
| CN115279024A (en) | Circuit board and circuit board processing method | |
| CN117226210A (en) | Welding method for high-density pins | |
| JPH07235764A (en) | Surface mount method for narrow-pitch parts | |
| JPH0899189A (en) | Cream solder |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |