CN115103565A - Data center's cooling system - Google Patents
Data center's cooling system Download PDFInfo
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- CN115103565A CN115103565A CN202210729029.8A CN202210729029A CN115103565A CN 115103565 A CN115103565 A CN 115103565A CN 202210729029 A CN202210729029 A CN 202210729029A CN 115103565 A CN115103565 A CN 115103565A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20718—Forced ventilation of a gaseous coolant
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20763—Liquid cooling without phase change
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
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- General Engineering & Computer Science (AREA)
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- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention provides a heat dissipation system of a data center, which is used for the heat dissipation system of the data center with cabinets arranged in a machine room, wherein a plurality of hosts are arranged in each cabinet, and each host comprises a processor chip and other onboard equipment which are used as heat dissipation object equipment; the heat dissipation system includes: a liquid cooling subsystem and an air cooling subsystem; the processor chip is provided with a liquid cooling subsystem, a core heat exchanger and an air supply heat exchanger, wherein the liquid cooling subsystem is provided with a liquid cooling pipeline, the core heat exchanger and the air supply heat exchanger are communicated from a branch of the liquid cooling pipeline, and the core heat exchanger is used for carrying out liquid cooling heat dissipation on the processor chip; and the air cooling subsystem carries out air cooling heat dissipation on the onboard equipment after heat exchange is carried out by the air supply heat exchanger. According to the invention, by adopting the technology of combining the liquid cooling subsystem and the air cooling subsystem, normal heat dissipation of other equipment in the machine room is met while chip-level cooling of the data center is realized, the equipment space is saved, the heat dissipation effect is increased, the energy consumption is reduced, and the machine room is convenient to maintain.
Description
Technical Field
The invention relates to the field of computer room heat dissipation, in particular to a heat dissipation system of a data center.
Background
With the explosion of information and the rise of cloud computing, big data, the internet of things and the like, data centers are developing towards the directions of scale, high density, intensification, greenization, automation and intellectualization, and with the gradual increase of integration density and processing capacity, the power consumption of servers is rapidly increased, and the heat dissipation problem of devices inside the servers becomes a technical problem to be solved urgently.
The heat dissipation system of the traditional data center machine room carries out unit type planning and layout on a refrigerating unit-a precision air conditioner. However, with the deployment of high-performance processing chips, the power density of a single cabinet is continuously increased, the heat dissipation system of the conventional data center cannot meet the heat dissipation requirement of the data center gradually, and the liquid cooling heat dissipation will gradually replace the conventional air cooling due to the high heat carrying capacity of the liquid working medium, and becomes the mainstream technology of heat dissipation of the server in the future. The data center of the liquid cooling system directly leads the liquid cooling into the server, so that chip-level cooling is realized, a water chilling unit is not needed, and the integral energy efficiency of the data center can be improved. However, in the liquid cooling system of the existing data center, there are many intermediate heat exchange links and related devices, and the existing heat dissipation system of the data center cannot be directly utilized, which results in higher initial investment cost of the liquid cooling system of the data center.
Disclosure of Invention
In order to solve the technical problems, the invention provides a heat dissipation system of a data center, which realizes chip-level cooling of the data center by adopting a technology of combining a liquid cooling subsystem and an air cooling subsystem, meets the normal heat dissipation of other equipment in a machine room, saves equipment space, increases heat dissipation effect, reduces energy consumption and is convenient for maintenance of the machine room.
The invention provides a heat dissipation system of a data center, which is used for the heat dissipation system of the data center with cabinets arranged in a machine room, wherein a plurality of hosts are arranged in each cabinet, and each host comprises a processor chip serving as heat dissipation object equipment and other onboard equipment; the heat dissipation system includes: a liquid cooling subsystem and an air cooling subsystem; the processor chip is provided with a liquid cooling subsystem, a core heat exchanger and an air supply heat exchanger, wherein the liquid cooling subsystem is provided with a liquid cooling pipeline, the core heat exchanger and the air supply heat exchanger are communicated from a branch of the liquid cooling pipeline, and the core heat exchanger is used for carrying out liquid cooling heat dissipation on the processor chip; and the air cooling subsystem carries out air cooling heat dissipation on the onboard equipment after heat exchange is carried out by the air supply heat exchanger.
Furthermore, the heat dissipation system is also provided with a main heat exchanger which is used as a constituent part of the liquid cooling subsystem, on one hand, the main heat exchanger forms a loop with a circulating water pump and a cold liquid distribution unit which are included in the liquid cooling subsystem, on the other hand, the main heat exchanger is connected with a cooling tower to form a loop, and the cold liquid after heat exchange of the cooling tower carries out heat exchange on the liquid of the liquid cooling subsystem; the circulating water pump provides circulating power for the liquid cooling subsystem, is arranged on a water outlet pipeline of the main heat exchanger and is connected with the cold liquid distribution unit; the cold liquid distribution unit is provided with a cold liquid pipeline and branch pipelines, and distributes cold liquid to each cabinet.
Further, the core heat exchanger is in contact with the processor chip and used for liquid cooling heat dissipation of the processor chip.
Furthermore, the cold liquid pipeline is provided with a water inlet pipeline and a water return pipeline; the water inlet pipeline conveys cold liquid from one side of the main heat exchanger to the core heat exchanger for heat exchange to form return liquid, and the return liquid returns to the other side of the main heat exchanger through the return pipeline for heat exchange to form cold liquid again.
Furthermore, the branch pipeline is provided with a branch water inlet pipeline and a branch water return pipeline; the branch water inlet pipeline conveys cold liquid of the main heat exchanger to the air cooling subsystem for heat exchange to form branch return liquid, and the branch return liquid enters the main heat exchanger through the branch water return pipeline for heat exchange to form cold liquid again.
Further, the air supply heat exchanger is used as a part of the air cooling subsystem, and blows air blown by a fan in an air conveying pipeline to an on-board device for air cooling and heat dissipation, and then the air is recovered through the air conveying pipeline to form circulating air; the air supply heat exchanger is connected with the branch pipeline and is used for heat exchange between cold liquid of the branch pipeline and circulating air of the air delivery pipeline; the fan is used for providing circulating power of the air cooling subsystem and is arranged between the air conveying pipeline and the air supply heat exchanger.
Further, the air delivery pipeline comprises an air outlet pipeline and an air return pipeline; the cold air of the air outlet pipeline is used for air cooling and heat dissipation of the onboard equipment; the hot air enters the air return pipeline to exchange heat with the air supply heat exchanger to be converted into cold air, and then enters the air outlet pipeline.
Furthermore, a control system is further arranged for controlling the liquid flow of the liquid cooling subsystem and the wind speed of the air cooling subsystem in real time.
Further, the control system is provided with a controller and a plurality of temperature sensors; the temperature sensors are respectively arranged on the processor chip and the on-board equipment; and the controller controls the liquid flow of the liquid cooling subsystem and the wind speed of the air cooling subsystem according to the temperature difference monitored in real time.
In a second aspect of the present invention, a data center is provided, which uses the above heat dissipation system to dissipate heat.
By adopting the heat dissipation system, the heat dissipation system for cooling liquid and air cooling is arranged on the branch pipeline of the liquid cooling subsystem through the air cooling subsystem, so that the heat dissipation of a processor chip, other onboard equipment and a machine room cabinet is realized; the cooling tower only connected with the liquid cooling subsystem is arranged for heat exchange, so that the control is relatively simple; through the setting of inlet channel and branch inlet channel, do benefit to and realize the modularization extension, easy operation.
It should be understood that the statements herein reciting aspects are not intended to limit the critical or essential features of any embodiment of the invention, nor are they intended to limit the scope of the invention. Other features of the present invention will become apparent from the following description.
Drawings
The above and other features, advantages and aspects of embodiments of the present invention will become more apparent upon consideration of the following detailed description, taken in conjunction with the accompanying drawings. In the drawings, like or similar reference characters designate like or similar elements, and wherein:
fig. 1 is a structural diagram of a heat dissipation system in a machine room according to the present embodiment;
fig. 2 is a structural diagram of a heat dissipation system inside the cabinet of the present embodiment;
wherein, the correspondence between the reference numbers and the component names in fig. 1 to 2 is:
1 rack, 2 total heat exchangers, 3 circulating water pump, 4 cooling towers, 5 inlet channels, 6 return water pipes, 7 branch inlet channels, 8 branch return water pipes, 9 air supply heat exchangers, 10 air outlet pipelines, 11 return air pipelines, 13 treater chips, 14 on-board equipment, 15 core heat exchangers, 16 computer rooms.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all embodiments of the present invention. All other embodiments, which can be obtained by a person skilled in the art without any inventive step based on the embodiments of the present invention, are within the scope of the present invention.
In addition, the term "and/or" herein is only one kind of association relationship describing the association object, and means that there may be three kinds of relationships, for example, a and/or B, and may mean: a exists alone, A and B exist simultaneously, and B exists alone. In addition, the character "/" herein generally indicates that the former and latter associated objects are in an "or" relationship.
In the following, referring to fig. 1, a first aspect of the present invention is described, and a heat dissipation system for a data center is provided, where the data center is disposed in a machine room 16, cabinets 1 arranged in an array are disposed in the machine room 16, and each cabinet 1 has a plurality of hosts therein, where each host includes a processor chip 13 and other on-board devices 14 as devices to be heat dissipated.
The cooling system of computer lab includes: a liquid cooling subsystem and an air cooling subsystem; the liquid cooling subsystem is arranged in a liquid cooling air conditioning room, the liquid cooling air conditioning room is arranged on one side of the machine room 16 and is provided with a cold liquid pipeline and branch pipelines, the core heat exchanger 15 and the air supply heat exchanger 9 are communicated from the cold liquid pipeline branch, and the core heat exchanger 15 is used for carrying out liquid cooling heat dissipation on the processor chip 13; the air cooling subsystem is arranged in an air cooling air conditioning room, the air cooling air conditioning room is arranged on the other side of the machine room 16, the air cooling subsystem is arranged in the branch pipeline, and after heat exchange is carried out by the air supply heat exchanger 9, air cooling heat dissipation is carried out on the onboard equipment 14; and the control system controls the liquid flow of the liquid cooling subsystem and the wind speed of the air cooling subsystem in real time.
This is disclosed through setting up the forced air cooling subsystem in the branch of liquid cooling subsystem, has reduced refrigeration plant's use, as long as adopt one set of refrigeration plant just can satisfy the requirement of computer lab, through accurate accuse temperature, the equipment that different temperature required is arranged in the subregion, carries out the computer lab heat dissipation of pertinence through forced air cooling and liquid cooling complex technical scheme.
In the above embodiment, the heat dissipation system further includes a main heat exchanger 2, which is used as a constituent part of the liquid cooling subsystem, and forms a loop with the circulating water pump 3 and the cold liquid distribution unit included in the liquid cooling subsystem on the one hand, and connects with the cooling tower 4 on the other hand to form a loop, and the cold liquid after heat exchange by the cooling tower 4 exchanges heat with the liquid of the liquid cooling subsystem; the circulating water pump 3 provides circulating power for the liquid cooling subsystem, is arranged on a water outlet pipeline of the main heat exchanger 2 and is connected with the cold liquid distribution unit; the cold liquid distribution unit is provided with a cold liquid pipeline and branch pipelines for distributing cold liquid to each cabinet 1. The cooling liquid provided by the cooling tower 4 is a liquid with high specific heat capacity, such as cooling water or a phase-change secondary refrigerant and other refrigeration substances, and different materials are selected according to requirements.
In this embodiment, the cooling tower 4 is used as a refrigerating device and is placed outdoors, and other refrigerating devices such as an air cooling machine and a refrigerator may be used. But the economic cost of the cooling tower 4 is the lowest, the cost is reduced to the maximum extent, and the refrigeration effect is the best in the refrigeration process; the circulating water pump 3 circulates the cold liquid according to the total requirement of a flowmeter arranged on the cold liquid pipeline and is controlled by a control system; the cold liquid pipeline is designed according to the number of the cabinet 1 and the number of the processor chips 13, and each processor chip 13 is ensured to be provided with one cold liquid pipeline; the branch pipeline is mainly used for an air cooling subsystem, and multiple paths can be arranged according to the size of the machine room 16 and the requirements of other onboard equipment 14, so that the overall temperature of the machine room 13 is guaranteed to be adjusted.
In the above embodiment, the cold liquid pipeline is provided with the core heat exchanger 15, and the core heat exchanger 15 is disposed in contact with the processor chip 13, and is used for liquid cooling heat dissipation of the processor chip 13. The core heat exchanger 15 can adopt a cold plate, the arrangement of the cold plate is to increase the contact area with the processor chip 13, the temperature of the processor chip 13 is reduced more quickly and effectively, and because the heating devices such as the processor chip 13 do not need to be in direct contact with liquid, the radiating system does not need to reform the whole set of machine room equipment again, and the operability is stronger. And temperature sensors are respectively arranged at the water inlet and the water outlet of the cold plate, and the flow velocity of cold liquid in the cold liquid pipeline is adjusted according to the temperature difference. The temperature sensor uploads real-time temperature to the control system, and the control system controls the circulating water pump and the flow meter of each cold liquid pipeline according to the temperature difference, so that the adjustment control of the flow rate of cold liquid is realized, automatic cooling and heat dissipation are really realized, manpower is saved, the cooling rate is increased, and the service life of the processor chip 13 is prolonged under the condition of ensuring the service environment.
In the above embodiment, the cold liquid pipeline is provided with a water inlet pipeline 5 and a water return pipeline 6; the water inlet pipeline 5 conveys cold liquid from one side of the main heat exchanger 2 to the cold plate, heat exchange is carried out to form return liquid, and the return liquid returns to one side of the main heat exchanger 2 through the water return pipeline 6 to carry out heat exchange to form cold liquid again. The main heat exchanger 2 is used for carrying out heat exchange between liquid and liquid to realize liquid cooling and heat dissipation. The core heat exchanger 15 switching valve is arranged at the water inlet pipeline 5 and is controlled to be opened and closed through the control system, so that each water inlet pipeline 5 is opened and closed, and the processor chips 13 at different positions are cooled in a targeted manner.
In the above embodiment, the branch pipe is provided with a branch water inlet pipe 7 and a branch water return pipe 8; the branch water inlet pipeline 7 conveys cold liquid of the main heat exchanger 2 to the air cooling subsystem for heat exchange to form branch return liquid, and the branch return liquid enters the main heat exchanger 2 through the branch water return pipeline 8 for heat exchange to form cold liquid again. An air-cooled switch valve is arranged at the branch water inlet pipeline 7, and is controlled to be opened and closed by a control system, so that the air-cooled subsystem is opened and closed to be matched with the liquid-cooled subsystem to perform integral cooling and heat dissipation of the machine room 16. The air cooling subsystem is arranged on the branch pipeline of the liquid cooling distribution unit, a cold source is provided for the air cooling subsystem, the refrigerating equipment is prevented from being reset by the air cooling subsystem, the cost of the system is saved, the laying layout of pipelines in a machine room is simplified in a phase-changing manner, the heat dissipation system is simplified on the whole, the heat dissipation effect is not weakened, heat dissipation in different modes is carried out under different equipment heat dissipation requirements, energy is saved, heat dissipation is targeted, and the heat dissipation effect is improved.
In the above embodiment, the air-blowing heat exchanger 9 is used as a part of an air-cooling subsystem, and blows air blown by a fan in an air duct to the on-board equipment 14 for air-cooling and heat dissipation, and then the air is recovered through the air duct to form circulating air; wherein, the air supply heat exchanger 9 is connected with the branch pipeline and is used for heat exchange between the cold liquid of the branch pipeline and the circulating air of the air delivery pipeline; the fan is used for providing circulating power of the air cooling subsystem and is arranged between the air conveying pipeline and the air supply heat exchanger 9. The air delivery duct delivers air for air-cooling and heat dissipation of the on-board equipment 14. Air supply heat exchanger 9 carries out the heat exchange between liquid and the air, cool hot-air through cold liquid and form cold air, will carry other board carried equipment in rack 1 with cold air through the defeated air duct and carry out the forced air cooling heat dissipation, especially be in the high-temperature region in rack 1, through increasing the better forced air cooling heat dissipation that carries on of air flow, also carried out the forced air cooling heat dissipation to the inside of whole rack 1 and the inside of whole computer lab 16, the circulation of air has increased radiating area, be fit for the whole cooling of large tracts of land.
In the above embodiment, the air delivery duct includes the air outlet duct 10 and the air return duct 11; the cold air of the air outlet pipeline 11 is used for air cooling and heat dissipation of onboard equipment; the hot air enters the air return pipeline 10 to exchange heat with the air supply heat exchanger 9 to be converted into cold air, and then enters the air outlet pipeline 11. The air outlet of air-out pipeline 10 can set up the next door at board carrier equipment 14, also can set up inside rack 1 or 16 tops of computer lab, and diversified setting increases the radiating effect, also needs to utilize new trend system setting in the position of difference, increases the circulation of air, forms the air-cooling of being convenient for in various wind gaps, the return air inlet of the hot-air admission return air pipeline 10 of also being convenient for. Air supply equipment is arranged at the air outlet, the cooling rate of cold air is improved, and 3 types of mixed air supply mode, vertical air supply mode and horizontal air supply mode are arranged. The mixed air supply mode layout takes the whole cabinet 1 as a cooling object to cause the mixing of cold air and hot air, so that the heat exchange in the cabinet 1 is carried out, but the heat exchange efficiency is lower; the vertical air supply mode generally refers to a downward air supply (upward air supply) and upward air return (side air return) mode, generally adopts an air supply mode of an air delivery pipeline or a floor static pressure box opening mode, can reduce the mixed flow of cold air and hot air, greatly improves the efficiency of an air conditioner, and reduces the construction cost, and is an economical and practical air supply mode for a machine room; the horizontal air supply mode generally refers to the mode of being close to the cabinet, uniformly supplying cold air along the surface of the cabinet, and uniformly supplying cold air into the cabinet.
In the above embodiment, the cold air system is provided with multiple air outlet pipelines 10 for cooling and heat dissipation at different positions; an air outlet switch valve is arranged on the air outlet pipeline 10, and the control system controls the opening and closing of the air outlet pipeline 10 and is used for performing air cooling heat dissipation at different positions in a targeted manner; an air speed regulator is arranged on the air outlet pipeline 10 to regulate different air speeds; the cold air system is also provided with a plurality of temperature sensors for uploading real-time temperature to the control system, the control system regulates and controls the rotating speed of the fan after carrying out temperature difference calculation according to the uploaded temperature, and the heat dissipation is realized by regulating the air speed through the air speed regulator. The temperature sensors are arranged at the air outlet and the air inlet and used for monitoring the air outlet temperature and the air inlet temperature in real time; the temperature sensors are also arranged in the onboard equipment 14, the cabinet 1 and the machine room 16, and are used for monitoring the ambient temperature in real time and starting the fan to perform air cooling in real time according to the ambient temperature; the wind speed of different air outlets can be adjusted through the wind speed adjuster according to different temperature requirements and current temperatures of the onboard equipment 14, the cabinet 1 and the machine room 16, and targeted cooling processing is achieved.
In the above embodiment, the control system controls the liquid flow of the liquid cooling subsystem and the wind speed of the air cooling subsystem in real time. The control system is provided with a controller and the plurality of temperature sensors; the temperature sensor uploads temperature data to the controller, and after internal calculation, the controller controls the liquid flow of the liquid cooling subsystem and the wind speed of the air cooling subsystem according to the temperature difference monitored in real time.
In the following, a second aspect of the present invention is described, and a data center for dissipating heat by using the heat dissipation system is provided.
When the heat dissipation system works, heat in the operation of a data server of the data center is discharged to the cabinet, the ambient temperature of the cabinet rises, and after a certain temperature is reached, the heat dissipation system of the cabinet can be started through the control system to cool and dissipate the heat of the cabinet, so that the purpose of cooling and dissipating the heat of the server in the cabinet and the cabinet is automatically achieved. Specifically, when the temperature of the processor chip is higher than a preset temperature and the ambient temperature of the cabinet or other onboard equipment is lower than the preset temperature, the control system controls to start the liquid cooling subsystem and close the air cooling subsystem to cool and dissipate the heat of the processor chip; when the temperature of the processor chip is higher than the preset temperature and the environmental temperature of the machine room or other onboard equipment is higher than the preset temperature, the control system controls to start the liquid cooling subsystem and simultaneously starts the air cooling subsystem to cool and dissipate the heat of the whole machine room; when the temperature of the processor chip is lower than the preset temperature and the environmental temperature of the machine room or other onboard equipment is higher than the preset temperature, the control system controls to start the air cooling subsystem and simultaneously close the liquid cooling subsystem to cool and dissipate heat of the machine room and the onboard equipment.
By adopting the heat dissipation system, the heat dissipation system for cooling liquid and air cooling is arranged on the branch pipeline of the liquid cooling subsystem through the air cooling subsystem, so that the heat dissipation of a processor chip, other onboard equipment and a machine room cabinet is realized in a targeted manner; the cooling tower only connected with the liquid cooling subsystem is arranged for heat exchange, so that the control is relatively simple; through the setting of inlet channel 5 and branch inlet channel 7, do benefit to and realize the modularization extension, easy operation.
In the description of the present invention, the terms "connect", "mount", "fix", and the like are used in a broad sense, for example, "connect" may be a fixed connection, a detachable connection, or an integral connection; may be directly connected or indirectly connected through an intermediate. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.
In the description of the present application, the description of the terms "one embodiment," "some embodiments," or the like, mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the application. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
The above is merely a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made to the present invention by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. A heat dissipation system of a data center is used for the heat dissipation system of the data center with cabinets arranged in a machine room and is characterized in that,
a plurality of hosts are arranged in each cabinet, and each host comprises a processor chip serving as heat dissipation object equipment and other onboard equipment;
the heat dissipation system includes: a liquid cooling subsystem and an air cooling subsystem; wherein the content of the first and second substances,
the liquid cooling subsystem is provided with a cold liquid pipeline, a core heat exchanger and an air supply heat exchanger are communicated from the cold liquid pipeline branch, and the core heat exchanger is used for carrying out liquid cooling heat dissipation on the processor chip;
and the air cooling subsystem carries out air cooling heat dissipation on the onboard equipment after the heat exchange of the air supply heat exchanger.
2. The heat dissipation system of claim 1,
the system is characterized by also comprising a main heat exchanger which is used as a constituent part of the liquid cooling subsystem, wherein on one hand, the main heat exchanger forms a loop with a circulating water pump and a cold liquid distribution unit which are included in the liquid cooling subsystem, on the other hand, the main heat exchanger is connected with a cooling tower to form a loop, and the cold liquid after heat exchange of the cooling tower carries out heat exchange on the liquid of the liquid cooling subsystem;
the circulating water pump provides circulating power for the liquid cooling subsystem, is arranged on a water outlet pipeline of the main heat exchanger and is connected with the cold liquid distribution unit;
the cold liquid distribution unit is provided with the cold liquid pipeline and the branch pipelines, and distributes cold liquid to each cabinet.
3. The heat dissipating system of claim 1,
the core heat exchanger is in contact with the processor chip and used for liquid cooling heat dissipation of the processor chip.
4. The heat dissipation system of claim 2,
the cold liquid pipeline is provided with a water inlet pipeline and a water return pipeline;
the water inlet pipeline conveys cold liquid from one side of the main heat exchanger to the core heat exchanger for heat exchange to form return liquid, and the return liquid returns to the other side of the main heat exchanger through the return pipeline for heat exchange to form the cold liquid again.
5. The heat dissipating system of claim 4,
the branch pipeline is provided with a branch water inlet pipeline and a branch water return pipeline;
the branch water inlet pipeline conveys the cold liquid of the main heat exchanger to the air cooling subsystem for heat exchange to form branch return liquid, and the branch return liquid enters the main heat exchanger through the branch return water pipeline for heat exchange to form the cold liquid again.
6. The heat dissipating system of claim 1,
the air supply heat exchanger is used as a part of the air cooling subsystem, and blows air blown by a fan in an air conveying pipeline to on-board equipment for air cooling and heat dissipation, and then the air is recycled through the air conveying pipeline to form circulating air; wherein the content of the first and second substances,
the air supply heat exchanger is connected with the branch pipeline and is used for heat exchange between cold liquid of the branch pipeline and circulating air of the air delivery pipeline;
the fan is used for providing circulating power of the air cooling subsystem and is arranged between the air delivery pipeline and the air supply heat exchanger.
7. The heat dissipating system of claim 6,
the air delivery pipeline comprises an air outlet pipeline and an air return pipeline;
the cold air of the air outlet pipeline is used for air cooling and heat dissipation of the onboard equipment; and hot air enters the air return pipeline to exchange heat with the air supply heat exchanger to be converted into cold air, and then enters the air outlet pipeline.
8. The heat dissipating system of claim 1,
the control system is also arranged for controlling the liquid flow of the liquid cooling subsystem and the wind speed of the air cooling subsystem in real time.
9. The heat dissipating system of claim 8,
the control system is provided with a controller and a plurality of temperature sensors; wherein, the first and the second end of the pipe are connected with each other,
the temperature sensors are respectively arranged on the processor chip and the on-board equipment;
and the controller controls the liquid flow of the liquid cooling subsystem and the wind speed of the air cooling subsystem according to the temperature difference monitored in real time.
10. A data center, characterized in that the data center is cooled by the cooling system according to any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN202210729029.8A CN115103565A (en) | 2022-06-24 | 2022-06-24 | Data center's cooling system |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202210729029.8A CN115103565A (en) | 2022-06-24 | 2022-06-24 | Data center's cooling system |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115484800A (en) * | 2022-11-14 | 2022-12-16 | 联通(广东)产业互联网有限公司 | Liquid cooling heat dissipation system of data center and control method thereof |
| CN116225103A (en) * | 2023-05-08 | 2023-06-06 | 合肥创科电子工程科技有限责任公司 | Cabinet intelligent monitoring temperature control system based on Internet of things |
| CN117092947A (en) * | 2023-07-20 | 2023-11-21 | 广州崇实自动控制科技有限公司 | Computer lab controlling means and fortune dimension monitoring system |
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2022
- 2022-06-24 CN CN202210729029.8A patent/CN115103565A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115484800A (en) * | 2022-11-14 | 2022-12-16 | 联通(广东)产业互联网有限公司 | Liquid cooling heat dissipation system of data center and control method thereof |
| CN116225103A (en) * | 2023-05-08 | 2023-06-06 | 合肥创科电子工程科技有限责任公司 | Cabinet intelligent monitoring temperature control system based on Internet of things |
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