CN115097696B - Optimize gummed developing machine - Google Patents
Optimize gummed developing machine Download PDFInfo
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- CN115097696B CN115097696B CN202211034922.5A CN202211034922A CN115097696B CN 115097696 B CN115097696 B CN 115097696B CN 202211034922 A CN202211034922 A CN 202211034922A CN 115097696 B CN115097696 B CN 115097696B
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
- G03F7/162—Coating on a rotating support, e.g. using a whirler or a spinner
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
The invention relates to the field of semiconductor production, in particular to a developing machine for optimizing glue coating. The technical problem of the invention is as follows: the photoresist sprayed on the upper surface of the silicon wafer flows to the lower surface of the silicon wafer, so that the lower surface of the silicon wafer is polluted, and the subsequent treatment of the silicon wafer is influenced. The technical scheme of the invention is as follows: a developing machine for optimizing glue coating comprises an organic frame, a movable wheel, a machine door and the like; the middle part of the machine frame is provided with a partition plate which is used for dividing the machine frame into an upper chamber and a lower chamber; four corners of the lower side of the machine frame are respectively and fixedly connected with a movable wheel; frame front side swing joint has four quick-witted doors to four quick-witted doors are the rectangle and distribute. According to the invention, through the arrangement of the adsorption unit and the centering unit, the silicon wafer is adsorbed and fixed after being centered, and then whether the flatness of the silicon wafer reaches the standard is detected, so that the silicon wafer is directly centered in the developing machine, the silicon wafer is prevented from being shifted in the transfer process, meanwhile, the spraying effect of the photoresist is prevented from being influenced by the substandard flatness of the silicon wafer, and the spraying effect of the photoresist is greatly optimized.
Description
Technical Field
The invention relates to the field of semiconductor production, in particular to a developing machine for optimizing glue coating.
Background
At present, when a semiconductor is manufactured, a developing machine is needed to be used for developing a silicon wafer, when the developing machine works, photoresist is sprayed on the rotating silicon wafer, and thus the photoresist is coated on the silicon wafer for developing operation; however, the photoresist is spread by utilizing the rotation swing of the silicon wafer, and flows to the lower surface of the silicon wafer after the photoresist is spread to the edge of the silicon wafer, so that the lower surface of the silicon wafer is polluted, the subsequent treatment of the silicon wafer is influenced, and the current developing machine does not have a function of detecting the surface flatness of the silicon wafer, when the surface of the silicon wafer is uneven, the developing effect can be influenced due to the uneven distribution of the photoresist on the surface of the silicon wafer, and the current developing machine does not have a centering function, and is dragged and transferred into the developing machine by a manipulator after being centered externally, the silicon wafer can deviate from the manipulator in the transferring process, so that the silicon wafer is also deviated when being placed in the developing machine, and the developing effect can be influenced due to the uneven distribution of the photoresist on the surface of the silicon wafer by rotating and spraying the photoresist in the deviating state; in addition, partial photoresist can be remained after the photoresist nozzle sprays the photoresist, the photoresist remained in the way of removing the photoresist nozzle can drop in the rest areas of the machine table, and the photoresist can be solidified and blocked after the photoresist nozzle is left unused for a long time, so that the next silicon wafer developing operation is influenced.
Disclosure of Invention
The invention provides a developing machine for optimizing gluing, aiming at overcoming the defect that photoresist sprayed on the upper surface of a silicon wafer flows to the lower surface of the silicon wafer to cause the lower surface of the silicon wafer to be polluted so as to influence the subsequent treatment of the silicon wafer.
The technical scheme of the invention is as follows: a developing machine for optimizing glue coating comprises an organic frame, a moving wheel and a machine door; the middle part of the machine frame is provided with a partition plate which is used for dividing the machine frame into an upper chamber and a lower chamber; four corners of the lower side of the machine frame are respectively and fixedly connected with a movable wheel; the front side of the machine frame is movably connected with four machine doors which are distributed in a rectangular shape; the device also comprises a wind guide pipe, an adsorption unit, an air injection unit, a centering unit, a glue spraying unit and a cleaning unit; the middle part in the machine frame is connected with an adsorption unit which is used for adsorbing and fixing a silicon wafer; the machine frame is internally connected with an air injection unit, and the air injection unit is positioned on the inner side of the adsorption unit; the gas injection unit is connected with a wind guide pipe and is used for injecting gas to the back of the silicon wafer through the wind guide pipe; the left side and the right side in the machine frame are respectively connected with a centering unit which is used for centering the silicon wafer; the machine frame is internally connected with a glue spraying unit, the glue spraying unit is positioned behind the adsorption unit, and the glue spraying unit is used for spraying photoresist on the silicon wafer for developing; the right side is connected with the clearance unit in the frame to the clearance unit is located the rear of two centering units, and the clearance unit is located the right-hand of spouting gluey unit moreover, and the clearance unit is used for clearing up the photoresist that solidifies.
More preferably, the air guide pipe is horn-shaped and is used for spraying gas on the back surface of the silicon wafer so as to blow the photoresist flowing to the lower surface of the silicon wafer outwards and prevent the lower surface of the silicon wafer from being polluted.
More preferably, the adsorption unit comprises a first mounting plate, a first motor, a first transmission shaft, an electric sucker, a first cylinder, a second mounting plate and a collection frame; the middle part of the lower side in the machine frame is fixedly connected with a first mounting plate; the upper part of the first mounting plate is fixedly connected with a first motor; the output shaft of the first motor is fixedly connected with a first transmission shaft; the upper part of the first transmission shaft is fixedly connected with an electric sucker; the middle part of the inner lower side of the machine frame is fixedly connected with two first cylinders which are arranged in bilateral symmetry; the telescopic ends of the two first cylinders are fixedly connected with a second mounting plate respectively; a collecting frame is fixedly connected between the two second mounting plates; the collecting frame is connected with the machine frame separation plate in a sliding mode.
More preferably, the upper part of the collecting frame is provided with a baffle plate protruding inwards for blocking the photoresist from splashing.
More preferably, the air injection unit comprises a third mounting plate, an annular frame, an annular block, a ventilation pipe and a ventilation opening; two third mounting plates are fixedly connected to the middle of the inner lower side of the machine frame, are arranged in bilateral symmetry and are positioned between the two first cylinders; the upper sides of the two third mounting plates are fixedly connected with an annular frame together; the upper side of the annular frame is fixedly connected with an annular block; the upper side of the annular block is fixedly connected with a ventilation pipe; the inner side of the ventilation pipe is fixedly connected with four air ports which are arranged in an annular array; the upper side of the ventilation pipe is communicated with the air guide pipe.
More preferably, the left centering unit comprises a second cylinder, a fourth mounting plate, a fifth mounting plate, a pushing block, a sixth mounting plate and a distance sensor; a second cylinder is fixedly connected to the left side in the machine frame; a fourth mounting plate is fixedly connected with the telescopic end of the second air cylinder; the right side of the fourth mounting plate is fixedly connected with a fifth mounting plate; the upper side of the fifth mounting plate is fixedly connected with three push blocks; the upper side of the fourth mounting plate is fixedly connected with a sixth mounting plate; the right part of the lower side of the sixth mounting plate is fixedly connected with a distance sensor.
More preferably, the right portion of the fifth mounting plate is provided in an arc shape.
More preferably, the glue spraying unit comprises a mounting frame, a second motor, a second transmission shaft, a cam, a third motor, a third transmission shaft, a seventh mounting plate, a straight slide rail, an eighth mounting plate, a straight spring, a straight slide block, a convex plate and a glue spraying opening; the upper side of the machine frame partition plate is fixedly connected with a mounting frame; a third motor is fixedly connected to the lower side of the machine frame partition plate; the upper part of the mounting frame is fixedly connected with a second motor; the output shaft of the second motor is fixedly connected with a second transmission shaft; the second transmission shaft is rotatably connected with the mounting frame; the front part of the outer surface of the second transmission shaft is fixedly connected with a cam; a third transmission shaft is fixedly connected with an output shaft of the third motor; a seventh mounting plate is fixedly connected to the upper part of the outer surface of the third transmission shaft; a straight slide rail is fixedly connected to the right side of the seventh mounting plate; a straight sliding block is connected in the straight sliding rail in a sliding way; the front side and the rear side of the straight slide rail are respectively and fixedly connected with an eighth mounting plate; the opposite sides of the two eighth mounting plates are fixedly connected with a straight spring respectively; the front side and the rear side of the straight sliding block are respectively fixedly connected with a straight spring; three glue spraying ports penetrate through the middle part of the straight sliding block at equal intervals; the right part of the upper side of the straight sliding block is fixedly connected with a convex plate.
More preferably, the cleaning unit comprises a ninth mounting plate, a third cylinder, a tenth mounting plate, an electric sliding rail, an electric sliding block, a heating plate, an eleventh mounting plate, a spring telescopic rod, a twelfth mounting plate, a suction pipe, a first wedge-shaped block, a second wedge-shaped block and a suction pump; a ninth mounting plate is fixedly connected to the right side in the machine frame; a third air cylinder is fixedly connected to the left side of the ninth mounting plate; a tenth mounting plate is fixedly connected with the telescopic end of the third air cylinder; the upper part of the left side of the tenth mounting plate is fixedly connected with an electric sliding rail; the electric slide rail is connected with two electric slide blocks in a sliding way, and the two electric slide blocks are symmetrically arranged in front and back; the left sides of the two electric sliding blocks are respectively and fixedly connected with a heating plate; the lower part of the left side of the tenth mounting plate is fixedly connected with two eleventh mounting plates which are symmetrically arranged in front and back; the left parts of the upper sides of the eleventh mounting plates are fixedly connected with a spring telescopic rod respectively; the telescopic ends of the two spring telescopic rods are fixedly connected with a twelfth mounting plate together; three suction pipes penetrate through the middle part of the twelfth mounting plate at equal intervals; a first wedge-shaped block is fixedly connected to the right side of the twelfth mounting plate; the lower side of the heating plate at the rear is fixedly connected with a second wedge-shaped block; the first wedge-shaped block and the second wedge-shaped block are matched with each other; the upper side of the machine frame partition plate is fixedly connected with a suction pump.
More preferably, two hot plate opposite sides all are provided with three arc recess for the centre gripping spouts the jiao kou.
Compared with the prior art, the invention has the following advantages: 1. according to the invention, through the arrangement of the adsorption unit and the centering unit, the silicon wafer is adsorbed and fixed after being centered, and then whether the flatness of the silicon wafer reaches the standard is detected, so that the silicon wafer is directly centered in the developing machine, the silicon wafer is prevented from being shifted in the transfer process, meanwhile, the spraying effect of the photoresist is prevented from being influenced by the substandard flatness of the silicon wafer, and the spraying effect of the photoresist is greatly optimized.
2. According to the invention, through the arrangement of the gas injection unit, gas is injected to the back of the silicon wafer through the trumpet-shaped air guide pipe, so that the photoresist flowing to the lower surface of the silicon wafer is blown outwards, and the lower surface of the silicon wafer is prevented from being polluted.
3. According to the invention, the photoresist is sprayed on the silicon wafer through the arrangement of the photoresist spraying unit, and the photoresist remained at the photoresist openings is shaken off the silicon wafer when the three photoresist spraying openings are controlled to move back and forth after the spraying is finished, so that the residual photoresist is prevented from dripping on the rest areas of the machine table in the process of removing the three photoresist spraying openings, and meanwhile, the photoresist is prevented from being largely solidified at the three photoresist spraying openings.
4. According to the invention, through the arrangement of the cleaning unit, the photoresist solidified in the three glue spraying openings is cleaned, so that the next development operation of the silicon wafer is prevented from being influenced.
Drawings
FIG. 1 is a schematic perspective view of a first embodiment of the optimized paste developer of the present invention;
FIG. 2 is a schematic view of a first partial perspective view of the developing machine for optimizing glue application of the present invention;
FIG. 3 is a sectional view of a first partial perspective view of the optimized paste developer of the present invention;
FIG. 4 is a sectional view of a second partial perspective view of the optimized paste developer of the present invention;
FIG. 5 is a partial perspective view of the air jet unit of the developing machine for optimizing glue application according to the present invention;
FIG. 6 is a schematic perspective view of a centering unit of the developing machine for optimizing glue application according to the present invention;
FIG. 7 is a sectional view of a third partial perspective view of the paste optimized developer of the present invention;
FIG. 8 is a schematic perspective view of a glue spraying unit of the developing machine for optimizing glue application according to the present invention;
FIG. 9 is a schematic perspective view of a cleaning unit of the developing machine for optimizing glue application according to the present invention;
fig. 10 is a partial perspective view of a cleaning unit of the developing machine for optimizing glue application according to the present invention.
Wherein the figures include the following reference numerals: 1-machine frame, 2-moving wheel, 3-machine door, 201-first mounting plate, 202-first motor, 203-first transmission shaft, 204-electric sucker, 205-first cylinder, 206-second mounting plate, 207-collecting frame, 301-third mounting plate, 302-ring frame, 303-ring block, 304-ventilation pipe, 305-ventilation port, 306-air guiding pipe, 401-second cylinder, 402-fourth mounting plate, 403-fifth mounting plate, 404-pushing block, 405-sixth mounting plate, 406-distance sensor, 501-mounting frame, 502-second motor, 503-second transmission shaft, 504-cam, 505-third motor, 506-third transmission shaft, 507-seventh mounting plate, 508-straight sliding rail, 509-eighth mounting plate, 5010-straight spring, 5011-straight sliding block, 5012-convex plate, 5013-501glue spraying port, 601-ninth mounting plate, 602-third cylinder, 603-tenth mounting plate, 604-sliding rail, 604-electric sliding block, 605-6011-straight sliding block, 6011-heating plate, 6012-wedge-electric heating plate, 608-wedge-suction pump, twelve-wedge-shaped block, and twelve-wedge-shaped suction rod.
Detailed Description
Although the present invention may be described with respect to particular applications or industries, those skilled in the art will recognize the broader applicability of the invention. Those of ordinary skill in the art will recognize other factors such as: terms such as above, below, upward, downward, etc. are used to describe the figures and are not meant to limit the scope of the invention as defined by the appended claims. Such as: any numerical designation of first or second, and the like, is merely exemplary and is not intended to limit the scope of the invention in any way.
Examples
A developing machine for optimizing glue spreading, as shown in FIGS. 1-10, comprises an organic frame 1, moving wheels 2 and a door 3; the middle part of the machine frame 1 is provided with a partition plate which is used for dividing the machine frame 1 into an upper chamber and a lower chamber; four corners of the lower side of the machine frame 1 are respectively connected with a movable wheel 2 through bolts; the front side of the machine frame 1 is hinged with four machine doors 3, and the four machine doors 3 are distributed in a rectangular shape;
the device also comprises an air guide pipe 306, an adsorption unit, an air injection unit, a centering unit, a glue injection unit and a cleaning unit; the middle part in the machine frame 1 is connected with an adsorption unit; an air injection unit is connected in the machine frame 1 and is positioned on the inner side of the adsorption unit; the air injection unit is connected with an air guide pipe 306; the left side and the right side in the machine frame 1 are respectively connected with a centering unit; the machine frame 1 is internally connected with a glue spraying unit which is positioned behind the adsorption unit; frame 1 inside right side is connected with the clearance unit to the clearance unit is located the rear of two centering units, and the clearance unit is located the right-hand side of spouting gluey unit moreover.
The air guide pipe 306 is in a horn shape and is used for spraying gas on the back of the silicon wafer, so that the photoresist flowing to the lower surface of the silicon wafer is blown outwards, and the lower surface of the silicon wafer is prevented from being polluted.
The adsorption unit comprises a first mounting plate 201, a first motor 202, a first transmission shaft 203, an electric suction cup 204, a first air cylinder 205, a second mounting plate 206 and a collection frame 207; the middle part of the inner lower side of the machine frame 1 is fixedly connected with a first mounting plate 201; a first motor 202 is connected to the upper part of the first mounting plate 201 through bolts; a first transmission shaft 203 is fixedly connected to an output shaft of the first motor 202; the upper part of the first transmission shaft 203 is fixedly connected with an electric sucker 204; the middle part of the inner lower side of the machine frame 1 is fixedly connected with two first cylinders 205, and the two first cylinders 205 are arranged in bilateral symmetry; the telescopic ends of the two first cylinders 205 are fixedly connected with a second mounting plate 206 respectively; a collecting frame 207 is fixedly connected between the two second mounting plates 206; the collecting frame 207 is connected with the partition plate of the machine frame 1 in a sliding way.
The upper part of the collecting frame 207 is provided with a baffle plate protruding inwards for preventing the photoresist from splashing.
The air injection unit comprises a third mounting plate 301, an annular frame 302, an annular block 303, a ventilation pipe 304 and a ventilation port 305; two third mounting plates 301 are fixedly connected to the middle of the inner lower side of the machine frame 1, the two third mounting plates 301 are arranged in bilateral symmetry, and the two third mounting plates 301 are positioned between the two first cylinders 205; the upper sides of the two third mounting plates 301 are fixedly connected with an annular frame 302; the upper side of the annular frame 302 is fixedly connected with an annular block 303; the upper side of the annular block 303 is fixedly connected with a ventilation pipe 304; four air vents 305 are fixedly connected to the inner side of the ventilation pipe 304, and the four air vents 305 are arranged in an annular array; the upper side of the ventilation pipe 304 communicates with a wind guide pipe 306.
The upper side of the ring-shaped frame 302 is provided with a slope for guiding the glue solution to flow downwards.
The left centering unit comprises a second cylinder 401, a fourth mounting plate 402, a fifth mounting plate 403, a push block 404, a sixth mounting plate 405 and a distance sensor 406; a second cylinder 401 is connected to the left side of the machine frame 1 through a bolt; a fourth mounting plate 402 is fixedly connected with the telescopic end of the second air cylinder 401; a fifth mounting plate 403 is fixedly connected to the right side of the fourth mounting plate 402; three push blocks 404 are fixedly connected to the upper side of the fifth mounting plate 403; a sixth mounting plate 405 is fixedly connected to the upper side of the fourth mounting plate 402; a distance sensor 406 is fixedly connected to the right portion of the lower side of the sixth mounting plate 405.
The fifth mounting plate 403 is provided with an arc shape at the right portion.
The glue spraying unit comprises a mounting frame 501, a second motor 502, a second transmission shaft 503, a cam 504, a third motor 505, a third transmission shaft 506, a seventh mounting plate 507, a straight sliding rail 508, an eighth mounting plate 509, a straight spring 5010, a straight sliding block 5011, a convex plate 5012 and a glue spraying port 5013; the upper side of the partition plate of the machine frame 1 is connected with an installation frame 501 through bolts; a third motor 505 is connected with the lower side of a partition plate of the machine frame 1 through bolts; the upper part of the mounting frame 501 is connected with a second motor 502 through bolts; a second transmission shaft 503 is fixedly connected to an output shaft of the second motor 502; the second transmission shaft 503 is rotatably connected with the mounting frame 501; a cam 504 is fixedly connected to the front part of the outer surface of the second transmission shaft 503; a third transmission shaft 506 is fixedly connected to an output shaft of the third motor 505; a seventh mounting plate 507 is fixedly connected to the upper part of the outer surface of the third transmission shaft 506; a straight slide rail 508 is fixedly connected to the right side of the seventh mounting plate 507; a straight sliding block 5011 is connected in the straight sliding rail 508 in a sliding manner; the front side and the rear side of the straight slide rail 508 are fixedly connected with an eighth mounting plate 509 respectively; opposite sides of the two eighth mounting plates 509 are fixedly connected with a straight spring 5010 respectively; the front side and the rear side of the straight sliding block 5011 are fixedly connected with a straight spring 5010 respectively; three glue spraying ports 5013 penetrate through the middle of the straight sliding block 5011 at equal intervals; the upper right part of the straight sliding block 5011 is fixedly connected with a convex plate 5012.
The cleaning unit comprises a ninth mounting plate 601, a third cylinder 602, a tenth mounting plate 603, an electric sliding rail 604, an electric sliding block 605, a heating plate 606, an eleventh mounting plate 607, a spring telescopic rod 608, a twelfth mounting plate 609, a suction pipe 6010, a first wedge-shaped block 6011, a second wedge-shaped block 6012 and a suction pump 6013; a ninth mounting plate 601 is fixedly connected to the inner right side of the machine frame 1; a third cylinder 602 is connected to the left side of the ninth mounting plate 601 through a bolt; a tenth mounting plate 603 is fixedly connected to the telescopic end of the third cylinder 602; the upper part of the left side of the tenth mounting plate 603 is bolted with an electric slide rail 604; the electric slide rail 604 is connected with two electric slide blocks 605 in a sliding manner, and the two electric slide blocks 605 are symmetrically arranged in front and back; the left sides of the two electric sliding blocks 605 are fixedly connected with a heating plate 606 respectively; two eleventh mounting plates 607 are fixedly connected to the lower portion of the left side of the tenth mounting plate 603, and the two eleventh mounting plates 607 are arranged in a front-back symmetrical manner; the left parts of the upper sides of the eleventh mounting plates 607 are fixedly connected with a spring telescopic rod 608 respectively; the telescopic ends of the two spring telescopic rods 608 are fixedly connected with a twelfth mounting plate 609; three suction pipes 6010 penetrate through the middle part of the twelfth mounting plate 609 at equal intervals; a first wedge-shaped block 6011 is fixedly connected to the right side of the twelfth mounting plate 609; a second wedge-shaped block 6012 is fixedly connected to the lower side of the heating plate 606 at the rear; the first wedge-shaped block 6011 and the second wedge-shaped block 6012 are matched with each other; the upper side of the partition plate of the machine frame 1 is fixedly connected with a suction pump 6013.
The opposite sides of the two heating plates 606 are provided with three arc-shaped grooves for clamping the glue spraying openings 5013.
The upper part of the suction pipe 6010 is trumpet-shaped.
Before working, a worker pushes the developing machine for optimizing gluing to the side edge of the silicon wafer discharging machine, then two machine doors 3 above the developing machine are opened, then the silicon wafer discharging machine is controlled to place the silicon wafer on the electric sucker 204, and then two centering units are controlled to center the silicon wafer, so that the silicon wafer is centered with the electric sucker 204, and the phenomenon that photoresist is unevenly distributed on the silicon wafer due to the fact that the silicon wafer rotates in an offset state is prevented; when the left centering unit works, the second air cylinder 401 is controlled to drive the fourth mounting plate 402, the fifth mounting plate 403, the three pushing blocks 404, the sixth mounting plate 405 and the distance sensor 406 to move rightwards until the three pushing blocks 404 are contacted with the left side of a silicon wafer, and meanwhile, the three pushing blocks 404 in the right centering unit move leftwards to be contacted with the right side of the silicon wafer, so that the silicon wafer is centered right above the electric sucking disc 204; and then controlling the electric sucker 204 to suck and fix the silicon wafer, controlling the distance sensor 406 to detect the distance between the electric sucker and the left part of the upper side of the silicon wafer, simultaneously detecting the distance between the distance sensor 406 in the right centering unit and the right part of the upper side of the silicon wafer, obtaining the flatness of the surface of the silicon wafer according to the two numerical values, starting to glue the silicon wafer when the flatness is qualified, taking out the silicon wafer for storage when the flatness is not qualified, and replacing a new silicon wafer to repeat the operation.
After the flatness of the silicon wafer is qualified, the two centering units are controlled to reset, then the two first air cylinders 205 are controlled to drive the two second mounting plates 206 and the collecting frame 207 to move upwards, so that the silicon wafer is positioned in the collecting frame 207, then the third motor 505 is controlled to drive the third transmission shaft 506 to rotate clockwise by ninety degrees on the basis of the view from top to bottom, the third transmission shaft 506 drives the seventh mounting plate 507, the straight sliding rail 508, the two eighth mounting plates 509, the two straight springs 5010, the straight sliding block 5011, the convex plate 5012 and the three glue spraying ports 5013 to rotate clockwise by ninety degrees, so that the three glue spraying ports 5013 are positioned right above the silicon wafer, then an external glue sprayer is controlled to spray the photoresist on the silicon wafer through the three glue spraying ports 5013, the first motor 202 is controlled to drive the first transmission shaft 203 and the electric suction cup 204 to rotate during spraying, the electric suction cup 204 drives the silicon wafer to rotate, so that the photoresist is sprayed on the rotating silicon wafer, and the photoresist is uniformly coated on the silicon wafer to perform development operation, and redundant photoresist is dropped in the collecting frame 207 and then is discharged out of the collecting frame 207 to be repeatedly utilized; the photoresist sprayed on the upper surface of the silicon wafer flows to the lower surface of the silicon wafer to cause the lower surface of the silicon wafer to be polluted, so that an external air pump is controlled to be started in the coating process, air is injected into the vent pipe 304 through the four air vents 305, the air is blown obliquely upwards through the air guide pipe 306, namely to the lower surface of the silicon wafer, and the air is blown outwards along the lower surface of the silicon wafer, so that the photoresist flowing on the lower surface of the silicon wafer can be blown away, and the lower surface of the silicon wafer is prevented from being polluted; stopping the transmission of the photoresist after the coating is finished; then, the second motor 502 is controlled to drive the second transmission shaft 503 to drive the cam 504 to rotate, the cam 504 intermittently contacts the convex plate 5012 when rotating, the cam 504 drives the convex plate 5012 to move rightwards when contacting, the cam 504 drives the straight sliding block 5011 to slide on the straight sliding rail 508, meanwhile, the straight sliding block 5011 compresses the straight spring 5010 on the right side and stretches the straight spring 5010 on the left side, when not contacting, the straight sliding block 5011 moves leftwards to reset due to the elastic force of the two straight springs 5010, so that the straight sliding block 5011 moves leftwards and rightwards in a reciprocating mode through the continuous rotation of the cam 504, the straight sliding block 5011 drives the three glue spraying ports 5013 to move in a reciprocating mode, when the three glue spraying ports 5013 move in a reciprocating mode, photoresist is prevented from dropping on the rest areas of the machine table on the way of the three glue spraying ports 3, meanwhile, the photoresist is prevented from being solidified in a large amount at the three glue spraying ports 5013, and the first motor 202 is controlled to stop, the first transmission shaft and the electric suction cup 204 is driven to rotate, and the silicon wafer is stopped to remove; after the photoresist finishes the development of the silicon wafer, the third motor 505 is controlled to drive the third transmission shaft 506 to rotate anticlockwise for ninety-degree reset, so that the three glue spraying ports 5013 rotate to reset, then the two first air cylinders 205 are controlled to drive the two second mounting plates 206 and the collecting frame 207 to move downwards, and then the silicon wafer feeding machine is controlled to take down the silicon wafer from the electric sucker 204.
When the three glue-spraying ports 5013 are idle for a long time, the photoresist remained in the three glue-spraying ports 5013 can be solidified and blocked, and the next silicon wafer development operation is affected, at this time, the third cylinder 602 is controlled to drive the tenth mounting plate 603 to move leftwards, the tenth mounting plate 603 drives the electric slide rail 604, the two electric sliders 605, the two heating plates 606, the two eleventh mounting plates 607, the two spring telescopic rods 608, the twelfth mounting plate 609, the three suction pipes 6010, the first wedge-shaped block 6011 and the second wedge-shaped block 6012 to move, the two heating plates 606 clamp the three glue-spraying ports 5013 in the middle, the arc-shaped grooves in the heating plates 606 correspond to the three glue-spraying ports 5013, then the electric slide rail 604 is controlled to drive the two electric sliders 605 to approach each other, the two heating plates 606 approach each other to contact each other and wrap the three glue-spraying ports 5013, when the heating plate 606 at the rear moves, the second wedge-shaped block 6012 is driven to move forwards to be in contact with the first wedge-shaped block 6011, the first wedge-shaped block 6011 is forced to move upwards, the first wedge-shaped block 6011 drives the twelfth mounting plate 609 to move upwards to stretch the two spring telescopic rods 608, the twelfth mounting plate 609 drives the three suction pipes 6010 to move upwards, the three suction pipes 6010 are upwards in contact with the lower sides of the two heating plates 606, the three suction pipes 6010 are located right below one glue spraying opening 5013 respectively, then the two heating plates 606 are electrified, the three glue spraying openings 5013 are heated by the two heating plates 606 simultaneously, the solidified photoresist is melted, after the solidified photoresist is melted, the suction pump 6013 is controlled to be started after the solidified photoresist is melted, the suction pump 6013 applies suction force to the three suction pipes 6010, the melted photoresist in the three glue spraying openings 5013 is pumped away, and therefore cleaning of the three glue spraying openings 5013 is achieved.
The present application is described in detail above, and the principles and embodiments of the present application are described herein by using specific examples, which are only used to help understand the method and the core idea of the present application; meanwhile, for a person skilled in the art, according to the idea of the present application, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present application.
Claims (6)
1. A developing machine for optimizing gluing comprises an organic frame (1), a moving wheel (2) and a machine door (3); the middle part of the machine frame (1) is provided with a partition plate which is used for dividing the machine frame (1) into an upper chamber and a lower chamber; four corners of the lower side of the machine frame (1) are respectively and fixedly connected with a movable wheel (2); the front side of the machine frame (1) is movably connected with four machine doors (3), and the four machine doors (3) are distributed in a rectangular shape; the method is characterized in that: the device also comprises an air guide pipe (306), an adsorption unit, an air injection unit, a centering unit, a glue spraying unit and a cleaning unit; the middle part in the machine frame (1) is connected with an adsorption unit which is used for adsorbing and fixing a silicon wafer; an air injection unit is connected in the machine frame (1) and is positioned on the inner side of the adsorption unit; the gas spraying unit is connected with a wind guide pipe (306), and is used for spraying gas out of the back of the silicon wafer through the wind guide pipe (306); the inner left side and the inner right side of the machine frame (1) are respectively connected with a centering unit which is used for centering a silicon wafer; the frame (1) is internally connected with a glue spraying unit, the glue spraying unit is positioned behind the adsorption unit, and the glue spraying unit is used for spraying photoresist on a silicon wafer for development; the right side in the machine frame (1) is connected with a cleaning unit, the cleaning unit is positioned behind the two centering units and positioned on the right side of the glue spraying unit, and the cleaning unit is used for cleaning solidified photoresist;
the adsorption unit comprises a first mounting plate (201), a first motor (202), a first transmission shaft (203), an electric suction cup (204), a first air cylinder (205), a second mounting plate (206) and a collection frame (207); the middle part of the inner lower side of the machine frame (1) is fixedly connected with a first mounting plate (201); a first motor (202) is fixedly connected to the upper part of the first mounting plate (201); a first transmission shaft (203) is fixedly connected with an output shaft of the first motor (202); the upper part of the first transmission shaft (203) is fixedly connected with an electric sucker (204); the middle part of the inner lower side of the machine frame (1) is fixedly connected with two first cylinders (205), and the two first cylinders (205) are arranged in bilateral symmetry; the telescopic ends of the two first cylinders (205) are respectively fixedly connected with a second mounting plate (206); a collecting frame (207) is fixedly connected between the two second mounting plates (206); the collecting frame (207) is connected with a partition plate of the machine frame (1) in a sliding way;
the air injection unit comprises a third mounting plate (301), an annular frame (302), an annular block (303), a ventilation pipe (304) and a ventilation port (305); the middle part of the inner lower side of the machine frame (1) is fixedly connected with two third mounting plates (301), the two third mounting plates (301) are arranged in bilateral symmetry, and the two third mounting plates (301) are positioned between the two first cylinders (205); the upper sides of the two third mounting plates (301) are fixedly connected with an annular frame (302) together; the upper side of the annular frame (302) is fixedly connected with an annular block (303); the upper side of the annular block (303) is fixedly connected with a ventilation pipe (304); four air vents (305) are fixedly connected to the inner side of the ventilation pipe (304), and the four air vents (305) are arranged in an annular array; the upper side of the ventilation pipe (304) is communicated with an air guide pipe (306);
the left centering unit comprises a second cylinder (401), a fourth mounting plate (402), a fifth mounting plate (403), a push block (404), a sixth mounting plate (405) and a distance sensor (406); a second cylinder (401) is fixedly connected to the left side in the machine frame (1); a fourth mounting plate (402) is fixedly connected with the telescopic end of the second air cylinder (401); a fifth mounting plate (403) is fixedly connected to the right side of the fourth mounting plate (402); three push blocks (404) are fixedly connected to the upper side of the fifth mounting plate (403); a sixth mounting plate (405) is fixedly connected to the upper side of the fourth mounting plate (402); a distance sensor (406) is fixedly connected to the right part of the lower side of the sixth mounting plate (405);
the glue spraying unit comprises a mounting frame (501), a second motor (502), a second transmission shaft (503), a cam (504), a third motor (505), a third transmission shaft (506), a seventh mounting plate (507), a straight sliding rail (508), an eighth mounting plate (509), a straight spring (5010), a straight sliding block (5011), a convex plate (5012) and a glue spraying opening (5013); the upper side of a partition plate of the machine frame (1) is fixedly connected with a mounting frame (501); a third motor (505) is fixedly connected to the lower side of a partition plate of the machine frame (1); the upper part of the mounting rack (501) is fixedly connected with a second motor (502); the output shaft of the second motor (502) is fixedly connected with a second transmission shaft (503); the second transmission shaft (503) is rotatably connected with the mounting frame (501); a cam (504) is fixedly connected to the front part of the outer surface of the second transmission shaft (503); a third transmission shaft (506) is fixedly connected with an output shaft of the third motor (505); a seventh mounting plate (507) is fixedly connected to the upper part of the outer surface of the third transmission shaft (506); a straight slide rail (508) is fixedly connected to the right side of the seventh mounting plate (507); a straight sliding block (5011) is connected in the straight sliding rail (508) in a sliding manner; the front side and the rear side of the straight slide rail (508) are respectively and fixedly connected with an eighth mounting plate (509); the opposite sides of the two eighth mounting plates (509) are fixedly connected with a straight spring (5010) respectively; the front side and the rear side of the straight sliding block (5011) are respectively fixedly connected with a straight spring (5010); three glue spraying openings (5013) penetrate through the middle part of the straight sliding block (5011) at equal intervals; the right part of the upper side of the straight sliding block (5011) is fixedly connected with a convex plate (5012).
2. A developer machine for optimizing glue application according to claim 1, characterised in that: the cleaning unit comprises a ninth mounting plate (601), a third air cylinder (602), a tenth mounting plate (603), an electric sliding rail (604), an electric sliding block (605), a heating plate (606), an eleventh mounting plate (607), a spring telescopic rod (608), a twelfth mounting plate (609), a suction pipe (6010), a first wedge-shaped block (6011), a second wedge-shaped block (6012) and a suction pump (6013); a ninth mounting plate (601) is fixedly connected to the right side in the machine frame (1); a third cylinder (602) is fixedly connected to the left side of the ninth mounting plate (601); a tenth mounting plate (603) is fixedly connected with the telescopic end of the third cylinder (602); the upper part of the left side of the tenth mounting plate (603) is fixedly connected with an electric sliding rail (604); the electric sliding rail (604) is connected with two electric sliding blocks (605) in a sliding way, and the two electric sliding blocks (605) are symmetrically arranged in front and back; the left sides of the two electric sliding blocks (605) are respectively and fixedly connected with a heating plate (606); the lower part of the left side of the tenth mounting plate (603) is fixedly connected with two eleventh mounting plates (607), and the two eleventh mounting plates (607) are symmetrically arranged in the front-back direction; the left parts of the upper sides of the two eleventh mounting plates (607) are respectively fixedly connected with a spring telescopic rod (608); the telescopic ends of the two spring telescopic rods (608) are fixedly connected with a twelfth mounting plate (609) together; three suction pipes (6010) penetrate through the middle part of the twelfth mounting plate (609) at equal intervals; a first wedge-shaped block (6011) is fixedly connected to the right side of the twelfth mounting plate (609); a second wedge-shaped block (6012) is fixedly connected to the lower side of the heating plate (606) at the rear part; the first wedge-shaped block (6011) and the second wedge-shaped block (6012) are matched with each other; the upper side of the partition plate of the machine frame (1) is fixedly connected with a suction pump (6013).
3. A developer machine for optimizing glue application according to claim 1, characterised in that: the air guide pipe (306) is in a horn shape and is used for spraying gas on the back of the silicon chip, so that the photoresist flowing to the lower surface of the silicon chip is blown outwards, and the lower surface of the silicon chip is prevented from being polluted.
4. A developer machine for optimizing gumming according to claim 1, characterized in that: the upper part of the collecting frame (207) is provided with a baffle which protrudes inwards and is used for preventing the photoresist from splashing.
5. A developer machine for optimizing glue application according to claim 2, characterised in that: the right part of the fifth mounting plate (403) is arc-shaped.
6. A developer machine for optimizing glue application according to claim 2, characterised in that: the opposite sides of the two heating plates (606) are provided with three arc-shaped grooves for clamping the glue spraying openings (5013).
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| CN202211034922.5A CN115097696B (en) | 2022-08-26 | 2022-08-26 | Optimize gummed developing machine |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN115400924B (en) * | 2022-10-31 | 2023-01-31 | 天霖(张家港)电子科技有限公司 | Glue spreading developing machine with smooth glue spreading function |
| CN117139078B (en) * | 2023-10-30 | 2024-02-06 | 宇弘研科技(苏州)有限公司 | Positive pressure anti-dripping silicon wafer glue solution side blowing mechanism |
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