CN115066137A - Multilayer microwave assembly, double-layer pressing microwave assembly and implementation method thereof - Google Patents
Multilayer microwave assembly, double-layer pressing microwave assembly and implementation method thereof Download PDFInfo
- Publication number
- CN115066137A CN115066137A CN202210755361.1A CN202210755361A CN115066137A CN 115066137 A CN115066137 A CN 115066137A CN 202210755361 A CN202210755361 A CN 202210755361A CN 115066137 A CN115066137 A CN 115066137A
- Authority
- CN
- China
- Prior art keywords
- cavity
- layer
- circuit board
- double
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 16
- 238000003825 pressing Methods 0.000 title claims abstract description 16
- 238000010586 diagram Methods 0.000 claims abstract description 24
- 229910052751 metal Inorganic materials 0.000 claims abstract description 20
- 239000002184 metal Substances 0.000 claims abstract description 20
- 238000003466 welding Methods 0.000 claims abstract description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 19
- 229910052802 copper Inorganic materials 0.000 claims description 19
- 239000010949 copper Substances 0.000 claims description 19
- 238000012545 processing Methods 0.000 claims description 16
- 238000010030 laminating Methods 0.000 claims description 13
- 238000003475 lamination Methods 0.000 claims description 9
- 229910052782 aluminium Inorganic materials 0.000 claims description 8
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 8
- 230000000712 assembly Effects 0.000 claims description 7
- 238000000429 assembly Methods 0.000 claims description 7
- 230000008054 signal transmission Effects 0.000 claims description 5
- 238000004891 communication Methods 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 3
- 230000000149 penetrating effect Effects 0.000 claims description 3
- 238000002360 preparation method Methods 0.000 claims description 3
- 238000005530 etching Methods 0.000 claims description 2
- 238000007789 sealing Methods 0.000 claims description 2
- 230000010354 integration Effects 0.000 abstract description 4
- 230000008569 process Effects 0.000 abstract description 2
- 239000010410 layer Substances 0.000 description 153
- 230000005540 biological transmission Effects 0.000 description 6
- 239000004020 conductor Substances 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 239000002356 single layer Substances 0.000 description 4
- 238000009826 distribution Methods 0.000 description 3
- 230000007797 corrosion Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000002355 dual-layer Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
- H05K7/1427—Housings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P1/00—Auxiliary devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P11/00—Apparatus or processes specially adapted for manufacturing waveguides or resonators, lines, or other devices of the waveguide type
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/061—Etching masks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention relates to a multilayer microwave assembly, a double-layer laminated microwave assembly and a realization method thereof, wherein the double-layer laminated microwave assembly comprises a metal shell, an upper cavity and a lower cavity are respectively formed on two sides of the shell, a TOP layer printed circuit board consisting of a TOP layer circuit diagram and a TOP dielectric layer medium is laminated in the upper cavity under the condition of high temperature and high pressure, and a BOTTOM layer printed circuit board consisting of a BOTTOM layer circuit diagram and a BOTTOM layer medium layer is laminated in the lower cavity under the condition of high temperature and high pressure. The invention adopts the mode of integrally pressing the microstrip circuit and the structural cavity, solves the problem of cavities possibly caused in the process of bonding or welding the microstrip circuit and the structural cavity, and improves the performance of the microwave component; structurally, an upper cavity and a lower cavity are adopted, so that the product integration level is enhanced, and the number of signal channels capable of being accommodated in a limited volume is increased.
Description
Technical Field
The invention belongs to the technical field of microwave assemblies, and particularly relates to a double-layer lamination microwave assembly, a multilayer lamination microwave assembly and an implementation method thereof.
Background
With the development of modern radar, electronic countermeasure, military communication and 5G technology, microwave components play an increasingly important role in various signal transmission processing systems, and the microwave components are increasingly developed towards multifunction and integration.
A general multifunctional microwave module is a module that integrates functions of switching, amplifying, direct connection, power division, coupling, and the like. At present, the multifunctional components are realized mainly in the following ways:
1) a multifunctional integrated chip is adopted; although the integrated chip has small volume and relatively many functions and has a plurality of advantages in the aspect of small-sized multifunctional integration, the requirement of high power is difficult to meet due to the limitation of small volume, and the multifunctional integrated chip on the market cannot be suitable for different requirement scenes, and the chip customized according to the requirement has long development period and high cost and is also difficult to meet the requirement.
2) A multilayer laminating technology is adopted, and is commonly called a laminated board; the power distribution is more used when the number of the power distribution paths is small, but the multifunctional hybrid integrated circuit has the defects of high processing difficulty, low yield, incapability of debugging, low power resistance and only scrapping and re-production when the indexes are not met.
3) Sintering the microstrip circuit or bonding silver paste in the shell; the mode is flexible, the processing difficulty is small, the cost is low, but the mode is generally a single-layer line, when a product interface is fixed, the single-layer microstrip is difficult to arrange and route, a cavity is easily formed at the joint of the microstrip line and the shell, and particularly, poor signal transmission is easily caused at a millimeter wave band. In addition, when the microstrip line is used in cooperation with a chip, solder pastes with different temperature gradients are needed, so that the assembly and disassembly are difficult.
Disclosure of Invention
The invention aims to provide a double-layer pressing microwave assembly, a multilayer pressing microwave assembly and an implementation method thereof, which combine the microstrip line transmission principle, directly press a single-layer microstrip line with a graph in a metal cavity by using a high-temperature and high-pressure technology, and realize the processing and transmission of signals under the condition of fixed external interface position.
The purpose of the invention and the technical problem to be solved are realized by adopting the following technical scheme. The invention provides a double-layer laminating microwave assembly which comprises a metal shell, wherein an upper-layer cavity and a lower-layer cavity are respectively formed on two sides of the shell, a TOP-layer printed circuit board consisting of a TOP-layer circuit diagram and a TOP dielectric layer medium is laminated in the upper-layer cavity under the vacuum high-temperature high-pressure condition, and a BOTTOM-layer printed circuit board consisting of a BOTTOM-layer circuit diagram and a BOTTOM-layer medium layer is laminated in the lower-layer cavity under the high-temperature high-pressure condition.
The object of the present invention and the technical problems solved thereby can be further achieved by the following technical measures.
The shell is further provided with an air cavity used for achieving conduction between the upper layer cavity and the lower layer cavity.
In the double-layer laminated microwave assembly, the TOP-layer printed circuit board and the BOTTOM-layer printed circuit board are in signal connection through the cavity-penetrating interconnection pin penetrating through the air cavity.
In the double-layer laminating microwave assembly, the shell and the upper-layer cavity and the lower-layer cavity on the two sides of the shell are of an integrated structure.
According to the double-layer pressing microwave assembly, the upper-layer cavity and the lower-layer cavity respectively comprise a cavity wall and a cavity bottom, and the cavity wall is 2-2.3 mm high.
In the double-layer pressing microwave assembly, the TOP layer printed circuit board and the BOTTOM layer printed circuit board are welded with different electronic elements to realize different signal transmission functions, and different signals are separated by the cavity wall.
In the double-layer pressing microwave assembly, the upper cover plate and the lower cover plate are fixed on two sides of the shell, and the cover plates are matched with the side cavities where the cover plates are located to form independent channels.
The purpose of the invention and the technical problem to be solved are realized by adopting the following technical scheme. The invention provides a method for realizing a double-layer lamination microwave assembly, which comprises the following steps: 1) selecting a whole aluminum base as a preparation material of the shell, determining the size of the shell and the number and the positions of the external interfaces according to requirements, designing graphs of an upper cavity and a lower cavity according to the positions of the external interfaces and functions to be realized, and finally processing the whole aluminum base according to the graphs to obtain the shell with cavities on two sides; 2) processing an upper copper sheet according to the shape of the upper cavity, processing a lower copper sheet according to the shape of the lower cavity, laminating the upper copper sheet and the TOP layer dielectric layer, and laminating the lower copper sheet and the BOTTOM layer dielectric layer; then, etching the upper copper sheet and the lower copper sheet according to a microstrip line drawing designed according to the functional requirements to form a TOP layer printed circuit board and a BOTTOM layer printed circuit board; 3) correspondingly pressing the molded TOP layer printed circuit board and the molded BOTTOM layer printed circuit board in the upper layer cavity and the lower layer cavity under the conditions of high temperature and high pressure; 4) welding electronic components on the TOP layer printed circuit board and the BOTTOM layer printed circuit board after the lamination in the step 3) is completed so as to realize different functions; 5) and 4) sealing the upper cover plate and the lower cover plate at the upper layer cavity and the lower layer cavity after the step 4).
The object of the present invention and the technical problems solved thereby can be further achieved by the following technical measures.
In the implementation method of the double-layer pressing microwave assembly, an air cavity for realizing communication between the upper-layer cavity and the lower-layer cavity is further processed in the step 1).
The purpose of the invention and the technical problem to be solved are realized by adopting the following technical scheme. The multilayer microwave assembly provided by the invention comprises at least two double-layer laminated microwave assemblies which are vertically laminated and fixed, wherein the double-layer laminated microwave assemblies are the double-layer laminated microwave assemblies, and signal exchange is realized between adjacent layer cavities through an air cavity or a connector
Compared with the prior art, the invention has obvious advantages and beneficial effects. By means of the technical scheme, the invention can achieve considerable technical progress and practicability, has wide industrial utilization value and at least has the following advantages:
the invention adopts the mode of integrally pressing the microstrip circuit and the structural cavity, solves the problem of cavities possibly caused in the process of bonding or welding the microstrip circuit and the structural cavity, and improves the performance of the microwave component.
The structure adopts a double-layer form of an upper cavity and a lower cavity, so that the product integration level is enhanced, and the number of signal channels capable of being accommodated in a limited volume is increased. The double-layer upper and lower cavities are designed into a 50-omega air cavity form and are connected by adopting an inner conductor, so that the switching of upper and lower layer signals is realized.
After the microstrip circuit and the cavity are in double-layer press fit, the upper layer and the lower layer are both open cavities, so that microwave signal index debugging is facilitated.
Drawings
FIG. 1 is a schematic diagram of an overall structure of a double-layer laminated microwave module according to the present invention;
FIG. 2 is a schematic view of FIG. 1 with the upper cover plate removed;
fig. 3 is a schematic view of an upper cavity of the double-layer laminating microwave module according to the present invention;
FIG. 4 is a schematic view of a lower cavity of a double-layer laminated microwave module according to the present invention;
fig. 5 is a TOP layer printed board of the double-layer laminated microwave module of the present invention;
FIG. 6 is a BOTTOM layer printed board of the double-layer laminated microwave module of the present invention;
FIG. 7 is a schematic diagram of signal transfer between upper and lower layers;
fig. 8 is a schematic diagram of a multi-layer microwave assembly.
[ description of main element symbols ]
1: shell
11: upper cavity
12: lower cavity
13: chamber wall
14: bottom of cavity
2: upper cover plate
3: external interface
41: TOP layer dielectric layer
42: BOTTOM layer dielectric layer
5: connector interface
6: TOP layer circuit diagram
7: BOTTOM layer circuit diagram
8: support column
9: fixing hole
10: metal cavity
Detailed Description
To further illustrate the technical means and effects of the present invention adopted to achieve the predetermined objects, the following detailed description of the embodiments, structures, features and effects of the double-layer laminated microwave module according to the present invention will be made with reference to the accompanying drawings and preferred embodiments.
Please refer to fig. 1-8, which are schematic structural diagrams of parts of a dual-layer laminated microwave module according to the present invention, the microwave module sequentially includes, from TOP to BOTTOM, a TOP layer circuit diagram 6, a TOP dielectric layer 41, a structural cavity, a BOTTOM layer dielectric layer 42, and a BOTTOM layer circuit diagram 7, wherein the structural cavity is a metal cavity including an upper cavity 11 and a lower cavity 12, the TOP layer circuit diagram 6 and the TOP layer dielectric layer 41 are laminated in the upper cavity 11, and the BOTTOM layer circuit diagram 7 and the BOTTOM layer dielectric layer 42 are laminated in the lower cavity 12. In the embodiment of the invention, the TOP layer circuit diagram 6 and the BOTTOM layer circuit diagram 7 are both 35 μm copper sheets, and the TOP layer dielectric layer 41 and the BOTTOM layer dielectric layer 42 are both 0.254mm TLY-5 dielectric layers. The structural cavity is used as a cavity supporting layer and also used as a BOTTOM metal substrate of the microstrip line in the TOP layer circuit diagram 6 and the BOTTOM layer circuit diagram 7.
The structure cavity is formed by the shell 1, wherein the upper cavity 11 is located on the upper side of the shell 1, the lower cavity is located on the lower side of the shell 1, the upper cavity 11 and the lower cavity 12 both comprise a cavity wall 13 and a cavity bottom 14, wherein the cavity wall 13 has a supporting function and a cavity separating function, and the cavity 14 and the cavity wall 13 are matched to form a signal processing transmission channel together.
In the embodiment of the invention, the shell 1 is formed by processing a whole aluminum base, an upper layer cavity 11 and a lower layer cavity 12 are respectively processed on two sides of the aluminum base, preferably, the upper layer cavity 11 and the lower layer cavity 12 are both washed and disinfected, the cavity walls 13 of the upper layer cavity 11 and the lower layer cavity 12 are 2-2.3 mm high, and the whole thickness of the part of the shell 1 with the upper layer cavity 11 and the lower layer cavity 12 is 5mm, that is, the thickness of the shell 1 is 5 mm.
The edge portions of the upper cavity 11 and the lower cavity 12 are also formed with an external interface 3 for connecting with the outside, and the position of the external interface 3 can be determined according to the requirement.
The upper cavity 11 and the lower cavity 12 are further formed with a connector interface 5 for connecting with a connector. In the present embodiment, the thickness of the housing 1 at the connector interface 5 after the connector is mounted is 7.6 mm.
The TOP layer circuit diagram 6 and the BOTTOM layer circuit diagram 7 are both microstrip circuit diagrams, printed circuit boards formed by laminating the microstrip circuit diagrams and the dielectric layer 4 respectively form a TOP layer printed circuit board and a BOTTOM layer printed circuit board after corrosion, and the TOP layer printed circuit board and the BOTTOM layer printed circuit board are respectively laminated in the upper layer cavity 11 and the lower layer cavity 12 under the conditions of vacuum, high temperature and high pressure to respectively form an upper layer microwave assembly and a lower layer microwave assembly so as to form a double-layer microwave assembly with a metal cavity.
A metal cavity 10 for signal connection is further arranged between the upper cavity 11 and the lower cavity 12, the arrangement of the metal cavity 10 can realize signal connection transmission between the upper cavity and the lower cavity, and preferably, signal transfer between the TOP printed circuit board in the upper micro cavity and the BOTTOM printed circuit board in the lower micro cavity is realized through a cavity-through interconnection pin 101 located in the metal cavity 10. In the embodiment of the present invention, the metal cavity 10 is a 50 Ω metal cavity, and the cavity-penetrating interconnection needle 101 is an inner conductor with a diameter of 0.5 mm.
An upper cover plate and a lower cover plate are further mounted on the upper side and the lower side of the shell 1 respectively, the upper cover plate 2 is matched with the upper-layer cavity 11 through screws to form a closed upper-layer independent channel, and the lower cover plate is matched with the lower-layer cavity 12 through screws to form a closed lower-layer independent channel. Therefore, the TOP layer printed circuit board and the BOTTOM layer printed circuit board are respectively positioned in the upper independent channel and the lower independent channel, the TOP layer printed circuit board and the BOTTOM layer printed circuit board comprise various signals, and different signals are separated through the cavity wall 13, so that different signals are positioned in an independent cavity formed by the cavity wall, the cavity BOTTOM and the cover plate, and the interference among the signals is avoided.
The upper microwave assembly formed by laminating the TOP layer printed circuit board and the upper cavity and the lower microwave assembly formed by laminating the BOTTOM layer printed circuit board and the lower cavity can realize different functions by welding required electronic components.
In the embodiment of the invention, the double-layer pressing microwave circuit can realize processing and transmission of multiple paths and multiple signals, and comprises a signal channel with S, C frequency band one-to-four power division, X frequency band one-to-eight power division, S, C frequency band one-to-three switch, X frequency band one-to-six switch, two paths of X frequency band straight-through, two paths of S, C frequency band straight-through, one path of low frequency straight-through and S, C, X frequency band reference, wherein different signals are separated through a cavity wall.
The double-layer pressing microwave assembly is realized by the following method that 1) a whole aluminum base is selected as a preparation material of the shell 1, the size of the shell 1 and the position of an external interface 3 on the shell 1 are determined according to requirements, and the patterns of an upper-layer cavity 11 and a lower-layer cavity 12 are designed according to the position of the external interface 3 and the functional requirements of the microwave assembly; then, the whole aluminum base is processed according to the pattern, and the shell 1 with the upper layer cavity 11, the lower layer cavity 12 and the external interface 3 is obtained. This 1 whole round pin of washing of casing forms, and the chamber wall 13 of upper chamber body 11 and lower floor's cavity 12 is high 2 ~ 2.3mm, and 1 upper structure chamber of casing is thick 5mm, and the thickness at 11 wall heights of upper chamber body, 12 wall heights of lower floor's cavity and chamber bottom promptly and for 5mm, and the thickness of this structure chamber behind the installation connector is 7.6 mm.
In this step, a 50 Ω metal cavity is also processed to realize the connection between the upper cavity 11 and the lower cavity 12.
2) Processing an upper copper sheet according to the shape of the upper cavity 11, processing a lower copper sheet according to the shape of the lower cavity 12, laminating the upper copper sheet with the TOP layer dielectric layer 41, laminating the lower copper sheet with the BOTTOM layer dielectric layer 42, designing a microstrip line drawing according to the product function requirement, corroding the upper copper sheet and the lower copper sheet according to the drawing, and respectively forming the TOP layer printed circuit board and the BOTTOM layer printed circuit board after corrosion.
3) The processed TOP layer printed circuit board and BOTTOM layer printed circuit board are correspondingly pressed in the upper layer cavity 11 and the lower layer cavity 12 under the conditions of vacuum, high temperature and high pressure, and a novel double-layer circuit board with a metal cavity is formed at the moment. In this example, the pressure under vacuum was 20kg/cm 2 The temperature was 210 ℃.
4) And 3) welding required electronic components on the circuit board with the metal cavity formed in the step 3) to meet different functional requirements.
5) And an inner conductor is arranged in the 50-omega metal cavity to realize signal connection and switching between the TOP layer printed circuit board and the BOTTOM layer circuit board.
6) An upper cover plate and a lower cover plate are respectively arranged at the upper layer cavity and the lower layer cavity, and the cover plates and the cavities are fixed by screws to form closed independent channels.
The invention relates to a method for realizing a double-layer pressed microwave assembly, which combines the microstrip line transmission principle on the basis of the traditional multilayer PCB realization method, directly presses a single-layer microstrip line with a graph in a metal cavity by using a high-temperature high-pressure technology, and realizes the processing and transmission of multiple paths and multiple signals under the condition of fixing the position of an external interface.
The double-layer pressing microwave component adopts a method of micro-strip circuit double-layer distribution under the conditions of limited space and fixed external interface position, expands a signal layer, integrates and realizes the functions of multi-channel switching, power division and direct connection of different frequency bands, and has flexible realization mode. Different signals are separated by a metal cavity, so that the interference between the signals is reduced. In addition, the micro-strip plate can be selected from various types, and when power resistance is required, the micro-strip plate with thick medium and wide metal layer can be selected.
The method for realizing the integrated pressing of the microstrip circuit and the shell does not need to be bonded or welded, and solves the problem of welding cavities. When the micro-strip circuit is matched with a chip for use, the micro-strip circuit can be directly welded and disassembled without adopting tin paste with temperature gradient.
The invention also provides a multilayer microwave assembly which is formed by connecting at least two shells with double-layer cavities and circuit boards pressed in the cavities at high temperature and high pressure up and down, wherein adjacent shells are fixed by screws, and adjacent layers are connected by a connector or an inner conductor penetrating through the air cavity of 50 omega.
Although the present invention has been described with reference to a preferred embodiment, it should be understood that various changes, substitutions and alterations can be made herein without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (10)
1. A double-layer lamination microwave assembly is characterized in that: the circuit board comprises a metal shell, wherein an upper cavity and a lower cavity are respectively formed on two sides of the shell, a TOP layer printed circuit board consisting of a TOP layer circuit diagram and a TOP dielectric layer medium is pressed in the upper cavity under the vacuum high-temperature high-pressure condition, and a BOTTOM layer printed circuit board consisting of a BOTTOM layer circuit diagram and a BOTTOM layer dielectric layer is pressed in the lower cavity under the high-temperature high-pressure condition.
2. A double layer laminated microwave assembly as claimed in claim 1, wherein: still be equipped with the air chamber that is used for realizing switching on between upper cavity and the lower floor's cavity on the casing.
3. A double layer laminated microwave assembly as claimed in claim 1, wherein: and the TOP layer printed circuit board and the BOTTOM layer printed circuit board are in signal connection through a cavity-penetrating interconnection pin penetrating through the air cavity.
4. The double-layer laminated microwave assembly of claim 1, wherein: the shell and the upper layer cavity and the lower layer cavity on the two sides of the shell are of an integrated structure.
5. A double layer laminated microwave assembly as claimed in claim 1, wherein: the upper-layer cavity and the lower-layer cavity respectively comprise a cavity wall and a cavity bottom, and the cavity wall is 2-2.3 mm high.
6. A double layer laminated microwave assembly as in claim 5, wherein: the TOP layer printed circuit board and the BOTTOM layer printed circuit board realize different signal transmission functions by being welded with different electronic elements, and different signals are separated by a cavity wall.
7. A double layer laminated microwave assembly as claimed in claim 1, wherein: and upper and lower cover plates are fixed on two sides of the shell, and the cover plates are matched with the side cavities of the shell to form independent channels.
8. A method for implementing a double-layer laminated microwave module as claimed in claim 1, comprising the steps of:
1) selecting a whole aluminum base as a preparation material of the shell, determining the size of the shell and the number and the positions of the external interfaces according to requirements, designing graphs of an upper cavity and a lower cavity according to the positions of the external interfaces and functions to be realized, and finally processing the whole aluminum base according to the graphs to obtain the shell with cavities on two sides;
2) processing an upper copper sheet according to the shape of the upper cavity, processing a lower copper sheet according to the shape of the lower cavity, laminating the upper copper sheet and the TOP layer dielectric layer, and laminating the lower copper sheet and the BOTTOM layer dielectric layer; then, etching the upper copper sheet and the lower copper sheet according to a microstrip line drawing designed according to the functional requirements to form a TOP layer printed circuit board and a BOTTOM layer printed circuit board;
3) correspondingly pressing the molded TOP layer printed circuit board and the molded BOTTOM layer printed circuit board in the upper layer cavity and the lower layer cavity under the conditions of vacuum, high temperature and high pressure;
4) welding electronic components on the TOP layer printed circuit board and the BOTTOM layer printed circuit board after the lamination in the step 3) is completed so as to realize different functions;
5) and 4) sealing the upper cover plate and the lower cover plate at the upper layer cavity and the lower layer cavity after the step 4).
9. The method of claim 8, wherein: wherein an air cavity for realizing the communication between the upper cavity and the lower cavity is also processed in the step 1).
10. A multi-layer microwave assembly, comprising: the microwave module comprises at least two double-layer lamination microwave assemblies which are vertically laminated and fixed, wherein the double-layer lamination microwave assemblies are the double-layer lamination microwave assemblies as claimed in any one of claims 1 to 6, and the cavities of adjacent layers are connected through an air cavity or a connector to realize signal connection.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210755361.1A CN115066137A (en) | 2022-06-30 | 2022-06-30 | Multilayer microwave assembly, double-layer pressing microwave assembly and implementation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210755361.1A CN115066137A (en) | 2022-06-30 | 2022-06-30 | Multilayer microwave assembly, double-layer pressing microwave assembly and implementation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115066137A true CN115066137A (en) | 2022-09-16 |
Family
ID=83204496
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210755361.1A Pending CN115066137A (en) | 2022-06-30 | 2022-06-30 | Multilayer microwave assembly, double-layer pressing microwave assembly and implementation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN115066137A (en) |
Citations (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1280392A1 (en) * | 2001-07-26 | 2003-01-29 | Siemens Information and Communication Networks S.p.A. | Printed circuit board and relevant manufacturing method for the installation of microwave chips up to 80 Ghz |
| CN101938881A (en) * | 2009-06-30 | 2011-01-05 | 华为技术有限公司 | Printed circuit board for integrated filter and manufacture method thereof |
| CN103533749A (en) * | 2013-10-31 | 2014-01-22 | 华为技术有限公司 | Circuit board of power amplifier and manufacturing method of circuit board |
| CN103700918A (en) * | 2013-12-24 | 2014-04-02 | 北京理工雷科电子信息技术有限公司 | One-into-six equipower distributor |
| US20150054593A1 (en) * | 2013-08-26 | 2015-02-26 | Microelectronics Technology, Inc. | Multi-layer circuit board with waveguide to microstrip transition structure |
| CN204375878U (en) * | 2015-01-09 | 2015-06-03 | 成都盟升科技有限公司 | The small size radiofrequency signal syndeton of microwave module assembly |
| CN105789142A (en) * | 2016-05-05 | 2016-07-20 | 中国工程物理研究院电子工程研究所 | Organic substrate high-density integrated three-dimensional microwave circuit structure |
| CN106163114A (en) * | 2015-04-15 | 2016-11-23 | 深南电路股份有限公司 | A kind of metal-base circuit plate structure and processing method thereof |
| CN106785284A (en) * | 2016-12-06 | 2017-05-31 | 电子科技大学 | Low-loss circuit structure based on the integrated suspended substrate stripline of medium |
| CN107978829A (en) * | 2017-11-22 | 2018-05-01 | 贵州航天计量测试技术研究所 | A kind of microwave components structure based on multilayer cabling |
| CN108258393A (en) * | 2017-12-29 | 2018-07-06 | 中国电子科技集团公司第二十研究所 | A kind of K-band minimizes millimeter wave T/R components |
| CN207624884U (en) * | 2016-06-22 | 2018-07-17 | 安徽天兵电子科技有限公司 | A kind of high-isolation microwave components |
| CN112436242A (en) * | 2020-10-26 | 2021-03-02 | 中国电子科技集团公司第十三研究所 | High integrated microwave assembly |
| CN112533358A (en) * | 2020-11-24 | 2021-03-19 | 中国电子科技集团公司第十三研究所 | High-frequency microwave multilayer circuit board and high-frequency microwave assembly |
| CN112992887A (en) * | 2021-02-05 | 2021-06-18 | 中国船舶重工集团公司第七二三研究所 | Double-layer stacked micro-interconnection high-density integrated assembly |
| CN114630511A (en) * | 2022-03-04 | 2022-06-14 | 中国航天科工集团八五一一研究所 | Implementation method of bidirectional frequency conversion integrated assembly |
-
2022
- 2022-06-30 CN CN202210755361.1A patent/CN115066137A/en active Pending
Patent Citations (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1280392A1 (en) * | 2001-07-26 | 2003-01-29 | Siemens Information and Communication Networks S.p.A. | Printed circuit board and relevant manufacturing method for the installation of microwave chips up to 80 Ghz |
| CN101938881A (en) * | 2009-06-30 | 2011-01-05 | 华为技术有限公司 | Printed circuit board for integrated filter and manufacture method thereof |
| US20150054593A1 (en) * | 2013-08-26 | 2015-02-26 | Microelectronics Technology, Inc. | Multi-layer circuit board with waveguide to microstrip transition structure |
| CN103533749A (en) * | 2013-10-31 | 2014-01-22 | 华为技术有限公司 | Circuit board of power amplifier and manufacturing method of circuit board |
| CN103700918A (en) * | 2013-12-24 | 2014-04-02 | 北京理工雷科电子信息技术有限公司 | One-into-six equipower distributor |
| CN204375878U (en) * | 2015-01-09 | 2015-06-03 | 成都盟升科技有限公司 | The small size radiofrequency signal syndeton of microwave module assembly |
| CN106163114A (en) * | 2015-04-15 | 2016-11-23 | 深南电路股份有限公司 | A kind of metal-base circuit plate structure and processing method thereof |
| CN105789142A (en) * | 2016-05-05 | 2016-07-20 | 中国工程物理研究院电子工程研究所 | Organic substrate high-density integrated three-dimensional microwave circuit structure |
| CN207624884U (en) * | 2016-06-22 | 2018-07-17 | 安徽天兵电子科技有限公司 | A kind of high-isolation microwave components |
| CN106785284A (en) * | 2016-12-06 | 2017-05-31 | 电子科技大学 | Low-loss circuit structure based on the integrated suspended substrate stripline of medium |
| CN107978829A (en) * | 2017-11-22 | 2018-05-01 | 贵州航天计量测试技术研究所 | A kind of microwave components structure based on multilayer cabling |
| CN108258393A (en) * | 2017-12-29 | 2018-07-06 | 中国电子科技集团公司第二十研究所 | A kind of K-band minimizes millimeter wave T/R components |
| CN112436242A (en) * | 2020-10-26 | 2021-03-02 | 中国电子科技集团公司第十三研究所 | High integrated microwave assembly |
| CN112533358A (en) * | 2020-11-24 | 2021-03-19 | 中国电子科技集团公司第十三研究所 | High-frequency microwave multilayer circuit board and high-frequency microwave assembly |
| CN112992887A (en) * | 2021-02-05 | 2021-06-18 | 中国船舶重工集团公司第七二三研究所 | Double-layer stacked micro-interconnection high-density integrated assembly |
| CN114630511A (en) * | 2022-03-04 | 2022-06-14 | 中国航天科工集团八五一一研究所 | Implementation method of bidirectional frequency conversion integrated assembly |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN111541001B (en) | Integrated tile active phased-array antenna | |
| CN213280231U (en) | Embedded circuit board, mobile device and sensing assembly | |
| US9525200B2 (en) | Multi-layer substrate and method of manufacturing multi-layer substrate | |
| CN113194599B (en) | Integrated integration method based on multifunctional composite substrate | |
| CA2574208A1 (en) | Improved multi-layer integrated rf/if circuit board | |
| CN110011010B (en) | Strip line structure for low-pass filter, communication device and system | |
| WO2006007725A1 (en) | Improved multi-layer integrated rf/if circuit board | |
| CN110797616B (en) | Multilayer digital-analog mixed pressing plate based on substrate integrated coaxial line structure | |
| CN115066137A (en) | Multilayer microwave assembly, double-layer pressing microwave assembly and implementation method thereof | |
| RU2500052C1 (en) | Micrometre and millimetre wavelength range circuit | |
| TWI772096B (en) | Circuit board having waveguides and method of manufacturing the same | |
| CN211297147U (en) | Buried plane resistor mixed-voltage step multilayer circuit board | |
| CN110690179B (en) | Laminated low-loss chip integrated waveguide packaging structure | |
| CN220021126U (en) | Photoelectric device shell with ceramic bonding pad | |
| CN111212521A (en) | Multilayer circuit board with embedded plane resistance ceramic powder filled with hydrocarbon resin | |
| CN112087861A (en) | Multilayer LCP circuit board | |
| US11272620B2 (en) | Embedded circuit board, mobile terminal, and method for manufacturing embedded circuit board | |
| CN221102386U (en) | Miniaturized surface-mounted broadband bridge | |
| CN109980328B (en) | Method for manufacturing low-pass filter | |
| CN116487449A (en) | Photoelectric device shell with ceramic bonding pad | |
| CN113871833B (en) | Circuit chip with three-layer strip line structure | |
| CN113036571B (en) | Preparation method of connector, connector and integrated device | |
| CN112753289B (en) | Circuit board and manufacturing method thereof, and manufacturing method of circuit board assembly | |
| CN217011286U (en) | Printed board and radar equipment | |
| CN209845436U (en) | Radio frequency switch circuit board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |