CN115061550A - Distributed thermal management device based on thermoelectric cooler and control method - Google Patents
Distributed thermal management device based on thermoelectric cooler and control method Download PDFInfo
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- CN115061550A CN115061550A CN202210697281.5A CN202210697281A CN115061550A CN 115061550 A CN115061550 A CN 115061550A CN 202210697281 A CN202210697281 A CN 202210697281A CN 115061550 A CN115061550 A CN 115061550A
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- 238000000034 method Methods 0.000 title claims abstract description 10
- 238000012544 monitoring process Methods 0.000 claims abstract description 26
- 239000000110 cooling liquid Substances 0.000 claims abstract description 25
- 239000007788 liquid Substances 0.000 claims abstract description 15
- 239000002826 coolant Substances 0.000 claims description 11
- 239000000463 material Substances 0.000 claims description 4
- 239000007769 metal material Substances 0.000 claims description 3
- 238000001816 cooling Methods 0.000 abstract description 12
- 230000017525 heat dissipation Effects 0.000 abstract description 4
- 238000005057 refrigeration Methods 0.000 abstract description 3
- 239000012809 cooling fluid Substances 0.000 description 7
- 238000010586 diagram Methods 0.000 description 5
- 230000001276 controlling effect Effects 0.000 description 3
- 238000012546 transfer Methods 0.000 description 3
- 238000005265 energy consumption Methods 0.000 description 2
- 230000001105 regulatory effect Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010622 cold drawing Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
- G06F1/206—Cooling means comprising thermal management
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Abstract
The invention belongs to the field of liquid cooling heat dissipation of servers and data centers, and discloses a distributed heat management device and a control method based on a thermoelectric refrigerator, wherein the distributed heat management device comprises a base, the thermoelectric refrigerator, a first cold plate, a second cold plate, a main inlet, a main outlet and a pipeline; the base is horizontally placed on the monitoring target, the thermoelectric refrigerator and the first cold plate are horizontally placed on the base side by side, the second cold plate is stacked on the thermoelectric refrigerator, the cold end of the thermoelectric refrigerator faces the base, the hot end of the thermoelectric refrigerator faces the second cold plate, the pipeline is used for interconnection among the main inlet, the first cold plate, the second cold plate and the main outlet, cooling liquid enters the device from the main inlet and leaves the device from the main outlet, and the pipeline is provided with a plurality of electric valves for controlling the flow direction of the cooling liquid. The invention realizes the series-parallel switching of the two cold plates by controlling the electric valve, prevents the heat generated at the hot end of the thermoelectric refrigerator from being reversely conducted to the processor when the thermoelectric refrigerator works, and improves the refrigeration efficiency.
Description
Technical Field
The invention belongs to the field of liquid cooling heat dissipation of servers and data centers, and particularly relates to a distributed heat management device based on a thermoelectric refrigerator and a control method.
Background
With the increasing demand for computing power, the operating loads of servers and data centers are increased, and the requirements on heat dissipation systems are higher and higher. Liquid cooling is increasingly focused and applied as a high-performance and low-energy-consumption heat dissipation mode. The liquid cooling system utilizes the liquid in the closed pipeline as the medium to carry out the heat exchange inside the server and outside, and the mode of adjusting the heat transfer volume has two kinds: regulating the liquid flow and regulating the liquid temperature. It is known that, a general server only has one CDU (liquid Cooling Distribution Unit), and a data center or even a plurality of servers share one CDU, and only can uniformly adjust the liquid flow and temperature at the inlet of the server, and cannot independently adjust each processor Unit inside the server. However, in most cases, the work loads of the processors are different, the heating values are also different, and the unified adjustment inevitably results in insufficient local cooling capacity and overflow of the local cooling capacity.
Patent US20180275730a1 discloses a cooler with built-in pumps, one for each processor, and the built-in pump body can independently regulate the flow of the coolant in the circuit. The device has the disadvantages of high cost and large volume of the micropump.
Patent CN112650373A discloses a heterogeneous liquid cooling server with a semiconductor dehumidifying device, which is located at the main inlet of the server cooling liquid, and is a device for centralized cooling and dehumidifying, and distributed thermal management cannot be realized.
Disclosure of Invention
The invention aims to provide a distributed thermal management device based on a thermoelectric refrigerator and a control method, so as to solve the technical problem.
In order to solve the technical problems, the invention provides a distributed thermal management device based on a thermoelectric refrigerator and a control method thereof, which have the following specific technical scheme:
a distributed thermal management device based on a thermoelectric cooler comprises a base, the thermoelectric cooler, a first cold plate, a second cold plate, a main inlet, a main outlet and a pipeline; the base is flatly placed on the monitoring target, the thermoelectric refrigerator and the first cold plate are flatly placed on the base side by side, the second cold plate is stacked on the thermoelectric refrigerator, the cold end of the thermoelectric refrigerator faces the base, the hot end of the thermoelectric refrigerator faces the second cold plate, the pipeline is used for interconnection among the main inlet, the first cold plate, the second cold plate and the main outlet, cooling liquid enters the device from the main inlet and leaves the device from the main outlet, and the pipeline is provided with a plurality of electric valves for controlling the flow direction of the cooling liquid.
Furthermore, the first cold plate and the second cold plate are respectively provided with a pair of cooling liquid inlets and outlets which are respectively a first inlet, a first outlet, a second inlet and a second outlet; the main inlet and the first inlet, the first outlet and the main outlet, the main inlet and the second inlet, the second outlet and the main outlet, and the first outlet and the second inlet are all connected through pipelines; and electric valves are respectively arranged between the main inlet and the second inlet, between the first outlet and the main outlet and between the first outlet and the second inlet, and each electric valve is controlled to be opened or closed through an electric signal.
Further, the cooling liquid flows in through the first inlet and flows out of the first cold plate through the first outlet; the cooling liquid flows in through the second inlet and flows out of the second cold plate through the second outlet; the main inlet is communicated with the first inlet and the second inlet, the main outlet is communicated with the first outlet and the second outlet, and the first outlet is communicated with the second inlet; the first electric valve is positioned between the main inlet and the second inlet, the second electric valve is positioned between the first outlet and the main outlet, and the third electric valve is positioned between the first outlet and the second inlet.
Further, a gap is provided between the thermoelectric cooler and the first cold plate.
Further, the base and the monitoring target contact surface, the thermoelectric cooler and the base contact surface, the first cold plate and the base contact surface, the thermoelectric cooler and the second cold plate contact surface are filled with a heat conducting interface material.
Further, the base, the first cold plate and the second cold plate are made of heat-conducting metal materials.
Further, the size of the base is larger than or equal to that of the monitoring target, and the base completely covers the surface of the CPU.
Further, the bottom area of the thermoelectric refrigerator is smaller than the surface area of the base.
Furthermore, the device is installed on each processor in the server, and the corresponding thermoelectric refrigerator and the electric valve are controlled to be opened and closed according to the utilization rate and the temperature change of each processor, so that distributed heat management is realized.
The invention also discloses a distributed heat control method based on the thermoelectric refrigerator, which comprises the following steps:
when the monitoring target is in an initial state or the temperature is lower than a safety line, the thermoelectric refrigerator is powered off, the first electric valve and the second electric valve are closed, the third electric valve is opened, cooling liquid sequentially flows through the first cold plate and the second cold plate, heat generated by the monitoring target is conducted to the first cold plate and the second cold plate through the base and then is taken away by the cooling liquid flowing through the cold plates;
when the monitoring target rate of utilization rises, the temperature reaches the safety threshold value, thermoelectric refrigerator circular telegram, and first electric valve and second electric valve are opened, and the third electric valve is closed, and the coolant liquid divides into two strands and flows first cold plate and second cold plate respectively, joins the outflow at last again, and the cold junction absorbs the heat that the monitoring target produced through the base, transmits the second cold drawing by the hot junction again, is taken away the heat by the coolant liquid.
The distributed thermal management device and the control method based on the thermoelectric refrigerator have the following advantages:
(1) the precise and rapid temperature control of the processor is realized by utilizing the characteristic that the thermoelectric refrigerator is powered on, namely, refrigeration;
(2) the heat management devices corresponding to part of the overheating processors are turned on in a targeted manner, so that the energy efficiency is improved, and the energy consumption input is saved;
(3) the series-parallel switching of the two cold plates is realized by controlling the electric valve, so that the heat generated by the hot end of the thermoelectric refrigerator is prevented from being reversely conducted to the processor when the thermoelectric refrigerator works, and the refrigeration efficiency is improved.
Drawings
FIG. 1 is a schematic diagram of the structure of the apparatus of the present invention;
FIG. 2 is a schematic diagram of the coolant piping and valving arrangement of the apparatus of the present invention;
FIG. 3 is a schematic diagram of the flow of cooling fluid when the thermoelectric cooler of the present invention is de-energized;
FIG. 4 is a schematic block diagram of the flow of cooling fluid when the thermoelectric cooler of the present invention is de-energized;
FIG. 5 is a schematic view of the flow of the cooling fluid when the thermoelectric cooler of the present invention is energized;
FIG. 6 is a schematic block diagram of the flow of the cooling fluid when the thermoelectric cooler of the present invention is energized;
the notation in the figure is: 1. a base; 2. a thermoelectric refrigerator; 3. a first cold plate; 4. a second cold plate; 5. a main inlet; 6. a main outlet; 7. a first electrically operated valve; 8. a second electrically operated valve; 9. a third electrically operated valve; 10. a pipeline; 31. a first inlet; 32. a first outlet; 41. a second inlet; 42. a second outlet.
Detailed Description
For a better understanding of the objects, structure and function of the present invention, a distributed thermal management apparatus and control method based on thermoelectric coolers will be described in further detail with reference to the accompanying drawings.
The invention adopts the thermoelectric refrigerator with small volume and low cost to combine with the traditional cold plate into a liquid cooling device, which can independently control the temperature of each CPU/GPU and realize the distributed heat management of the server and the data center.
As shown in fig. 1, a distributed thermal management apparatus based on a thermoelectric refrigerator of the present invention includes a base 1, a thermoelectric refrigerator 2, a first cold plate 3, a second cold plate 4, a total inlet 5, a total outlet 6, a first electrically operated valve 7, a second electrically operated valve 8, a third electrically operated valve 9, and a pipe 10. The base 1 is flatly placed on a monitoring target (CPU/GPU), the thermoelectric refrigerator 2 and the first cold plate 3 are flatly placed on the base 1 side by side, and the second cold plate 4 is stacked on the thermoelectric refrigerator 2. Wherein, the cold end of the thermoelectric refrigerator 2 faces the base 1, and the hot end faces the second cold plate 4. Said ducts 10 are used for the interconnection between the main inlet 5, the first cold plate 3, the second cold plate 4 and the main outlet 6, the cooling liquid entering the device from the main inlet 5 and leaving the device from the main outlet 6. The first cold plate 3 and the second cold plate 4 are each provided with a pair of coolant inlets and outlets, respectively a first inlet 31, a first outlet 32, a second inlet 41, and a second outlet 42. The total inlet 5 and the first inlet 31, the first outlet 32 and the total outlet 6, the total inlet 5 and the second inlet 41, the second outlet 42 and the total outlet 6, and the first outlet 32 and the second inlet 41 are all connected by a pipe 10. Electric valves are respectively arranged between the main inlet 5 and the second inlet 41, between the first outlet 32 and the main outlet 6 and between the first outlet 32 and the second inlet 41, and each electric valve is respectively controlled to be opened or closed by an electric signal.
There is a gap between the thermoelectric refrigerator 2 and the first cold plate 3, preventing heat transfer.
Each contact surface to be thermally conductive, such as the contact surface of the base 1 and the CPU, the contact surface of the thermoelectric refrigerator 2 and the base 1, the contact surface of the first cold plate 3 and the base 1, the contact surface of the thermoelectric refrigerator 2 and the second cold plate 4, etc., is filled with a thermally conductive interface material, such as thermally conductive silicone grease, thermally conductive gel, etc.
The base 1, the first cold plate 3 and the second cold plate 4 are made of a metal material with good heat conductivity, such as aluminum or copper.
The size of the base 1 is larger than or equal to that of the monitoring target, and the base 1 completely covers the surface of the CPU.
The bottom area of the thermoelectric refrigerator 2 is smaller than the surface area of the base 1, and preferably, the bottom area of the thermoelectric refrigerator 2 occupies half of the surface area of the base 1.
In the present embodiment, referring to fig. 2, the first cold plate 3 and the second cold plate 4 are communicated through a duct 10, and the cooling liquid flows in the duct 10. The cooling fluid flows into the device through a main inlet 5 and out of the device through a main outlet 6. The coolant flows in through the first inlet 31 and flows out of the first cold plate 3 through the first outlet 32. The coolant flows in through the second inlet 41 and flows out of the second cold plate 4 through the second outlet 42. The collective inlet 5 communicates with the first inlet 31 and the second inlet 41, the collective outlet 6 communicates with the first outlet 32 and the second outlet 42, and the first outlet 32 communicates with the second inlet 41. A first electrically operated valve 7 is located between the main inlet 5 and the second inlet 41, a second electrically operated valve 8 is located between the first outlet 32 and the main outlet 6, and a third electrically operated valve 9 is located between the first outlet 32 and the second inlet 41.
The electrically operated valve may be any valve that can be controlled to open and close by an electric signal, and the valve is not limited herein.
The present embodiment realizes temperature control of the monitoring target by:
assuming that the low usage state of the monitoring target (CPU/GPU) is the "initial state" or the temperature is lower than the safety line, the thermoelectric refrigerator 2 is kept powered off, the first and second electric valves 7 and 8 are closed, and the third electric valve 9 is opened, and at this time, the coolant flows through the first and second cold plates 3 and 4 in sequence as shown in fig. 3. For the sake of brevity, this flow pattern is hereinafter referred to as "in series". As shown in fig. 4, the heat generated by the monitoring target is conducted through the base 1 to the first cold plate 3 and the second cold plate 4 and then removed by the cooling fluid flowing through the cold plates. When the usage rate of the monitoring target (CPU/GPU) rises and the temperature reaches the safety threshold, the thermoelectric refrigerator 2 is powered on, the first electric valve 7 and the second electric valve 8 are opened, the third electric valve 9 is closed, the flow path of the cooling liquid is as shown in fig. 5, the cooling liquid is divided into two flows which respectively flow through the first cold plate 3 and the second cold plate 4, and finally flow out after being merged as shown in fig. 6, and the flow mode is hereinafter referred to as parallel connection. It will be appreciated by those skilled in the art that when a thermoelectric refrigerator is energized, it absorbs heat at one end and releases heat at the other, thereby forming a cold end and a hot end. In this embodiment, the cold end absorbs heat generated by the monitoring target through the base 1, and the heat is transmitted to the second cold plate 4 through the hot end, and the heat is taken away by the cooling liquid. In this embodiment, the power of the thermoelectric refrigerator is controlled by PWM (Pulse width modulation), so that the amount of heat absorbed by the thermoelectric refrigerator is balanced with the amount of heat generated by the increase in the usage rate of the monitoring target, and the temperature of the monitoring target is controlled within a safety threshold.
In this embodiment, the following discusses the beneficial effects of controlling the cooling fluids "in series" and "in parallel":
the thermal resistance is great under the thermoelectric cooler outage state, and there is great loss in the heat conduction from the monitoring target through thermoelectric cooler to the second cold plate, and the loss of direct conduction to first cold plate is less, therefore first cold plate heat exchange efficiency is high, second cold plate heat exchange efficiency is low. Therefore, the cooling liquid firstly flows through the first cold plate to complete the sufficient heat exchange and then flows into the second cold plate to assist the heat exchange in a series connection mode. If the parallel connection is adopted, half of cooling liquid enters the first cold plate, and the other half of the cooling liquid enters the second cold plate, so that the heat exchange is insufficient, and the cooling efficiency is low. When the thermoelectric refrigerator is in a power-on state, heat is absorbed from the cold end and released from the hot end, and the heat released from the hot end is the sum of the heat absorbed by the cold end and the input electric energy, namely the heat released from the hot end is greater than the heat released by the CPU. Therefore, if the series connection mode is adopted, the heat generated by the hot end of the thermoelectric refrigerator is reversely transmitted back to the monitoring target through the cooling liquid, and the cooling efficiency is reduced; the parallel connection mode is adopted, so that the heat transfer between the two cold plates is not influenced mutually.
The device is arranged on each CPU/GPU in the server, and controls the corresponding thermoelectric cooler and the electric valve switch according to the utilization rate and the temperature change of each CPU/GPU, so that distributed heat management is realized.
It is to be understood that the present invention has been described with reference to certain embodiments, and that various changes in the features and embodiments, or equivalent substitutions may be made therein by those skilled in the art without departing from the spirit and scope of the invention. In addition, many modifications may be made to adapt a particular situation or material to the teachings of the invention without departing from the essential scope thereof. Therefore, it is intended that the invention not be limited to the particular embodiment disclosed, but that the invention will include all embodiments falling within the scope of the appended claims.
Claims (10)
1. A distributed thermal management device based on thermoelectric coolers is characterized by comprising a base (1), a thermoelectric cooler (2), a first cold plate (3), a second cold plate (4), a main inlet (5), a main outlet (6) and a pipeline (10); the device comprises a base (1), a thermoelectric refrigerator (2) and a first cold plate (3), wherein the base (1) is flatly placed on a monitoring target, the thermoelectric refrigerator (2) and the first cold plate (3) are flatly placed on the base (1) side by side, a second cold plate (4) is stacked on the thermoelectric refrigerator (2), the cold end of the thermoelectric refrigerator (2) faces the base (1), the hot end of the thermoelectric refrigerator faces the second cold plate (4), a pipeline (10) is used for interconnection among a main inlet (5), the first cold plate (3), the second cold plate (4) and a main outlet (6), cooling liquid enters the device from the main inlet (5) and leaves the device from the main outlet (6), and a plurality of electric valves are arranged on the pipeline (10) and used for controlling the flow direction of the cooling liquid.
2. The distributed thermal management apparatus based on a thermoelectric cooler according to claim 1, wherein the first cold plate (3) and the second cold plate (4) are each provided with a pair of coolant inlets and outlets, respectively a first inlet (31), a first outlet (32), a second inlet (41), and a second outlet (42); the main inlet (5) and the first inlet (31), the first outlet (32) and the main outlet (6), the main inlet (5) and the second inlet (41), the second outlet (42) and the main outlet (6), and the first outlet (32) and the second inlet (41) are all connected through a pipeline (10); and electric valves are respectively arranged between the main inlet (5) and the second inlet (41), between the first outlet (32) and the main outlet (6) and between the first outlet (32) and the second inlet (41), and each electric valve is respectively controlled to be opened or closed by an electric signal.
3. The thermoelectric cooler-based distributed thermal management apparatus according to claim 2, wherein the cooling liquid flows in through a first inlet (31) and out of the first cold plate (3) through a first outlet (32); the cooling liquid flows in through a second inlet (41) and flows out of the second cold plate (4) through a second outlet (42); the main inlet (5) is communicated with the first inlet (31) and the second inlet (41), the main outlet (6) is communicated with the first outlet (32) and the second outlet (42), and the first outlet (32) is communicated with the second inlet (41); the first electric valve (7) is positioned between the main inlet (5) and the second inlet (41), the second electric valve (8) is positioned between the first outlet (32) and the main outlet (6), and the third electric valve (9) is positioned between the first outlet (32) and the second inlet (41).
4. The thermoelectric cooler-based distributed thermal management apparatus according to claim 1, wherein there is a gap between the thermoelectric cooler (2) and the first cold plate (3).
5. The thermoelectric cooler-based distributed thermal management apparatus according to claim 1, wherein the base (1) and the monitoring target contact surface, the thermoelectric cooler (2) and base (1) contact surface, the first cold plate (3) and base (1) contact surface, and the thermoelectric cooler (2) and second cold plate (4) contact surface are filled with a thermal interface material.
6. The thermoelectric cooler-based distributed thermal management apparatus according to claim 1, wherein the base (1), the first cold plate (3) and the second cold plate (4) are of a thermally conductive metal material.
7. The distributed thermal management apparatus based on a thermoelectric cooler according to claim 1, wherein the size of the base (1) is equal to or larger than the size of the monitoring target, and the base (1) completely covers the CPU surface.
8. The thermoelectric chiller based distributed thermal management apparatus of claim 1, wherein the thermoelectric chiller (2) has a smaller bottom surface area than the base (1) surface area.
9. The distributed thermal management apparatus based on thermoelectric coolers according to claim 1, wherein the apparatus is installed on each processor in the server, and controls the corresponding thermoelectric cooler and the electric valve switch according to the usage rate and temperature change of each processor, thereby realizing distributed thermal management.
10. A method for distributed control of a thermoelectric chiller using a thermoelectric chiller based distributed thermal management apparatus according to any of claims 1-9, comprising the steps of:
when the monitoring target is in an initial state or the temperature is lower than a safety line, the thermoelectric refrigerator (2) keeps power off, the first electric valve (7) and the second electric valve (8) are closed, the third electric valve (9) is opened, cooling liquid sequentially flows through the first cold plate (3) and the second cold plate (4), heat generated by the monitoring target is transmitted to the first cold plate (3) and the second cold plate (4) through the base (1), and then is taken away by the cooling liquid flowing through the cold plates;
when monitoring target rate of utilization rises, when the temperature reaches the safety threshold, thermoelectric refrigerator (2) circular telegram, first electric valve (7) and second electric valve (8) are opened, third electric valve (9) are closed, the coolant liquid divide into two strands and flow through first cold plate (3) and second cold plate (4) respectively, join the outflow again at last, the cold junction absorbs the heat that the monitoring target produced through base (1), transmit for second cold plate (4) by the hot junction again, take away the heat by the coolant liquid.
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| CN110430715A (en) * | 2019-06-29 | 2019-11-08 | 西南电子技术研究所（中国电子科技集团公司第十研究所） | The method of controlling electronic devices cooling liquid outlet temperature |
| CN210401985U (en) * | 2019-09-23 | 2020-04-24 | 北京镭创高科光电科技有限公司 | Partition liquid cooling heat dissipation system and projector |
| WO2021057060A1 (en) * | 2019-09-25 | 2021-04-01 | 华为技术有限公司 | Vehicle temperature control system |
| CN211654906U (en) * | 2020-03-31 | 2020-10-09 | 无锡威唐新能源科技有限公司 | Liquid cooling battery box of electric automobile |
| CN112153878A (en) * | 2020-10-22 | 2020-12-29 | 苏州浪潮智能科技有限公司 | Pipeline device for switching liquid cooling pipes in series-parallel connection, heat dissipation system and switching method |
| WO2022012302A1 (en) * | 2021-01-25 | 2022-01-20 | 东南大学 | Apparatus and method for two-phase flow active/passive heat dissipation in multi-level data center rack |
| CN114144045A (en) * | 2021-12-13 | 2022-03-04 | 长城超云(北京)科技有限公司 | Liquid cooling circulation system |
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