CN115060937A - Probe platform for testing integrated circuit chip wafer - Google Patents
Probe platform for testing integrated circuit chip wafer Download PDFInfo
- Publication number
- CN115060937A CN115060937A CN202210638570.8A CN202210638570A CN115060937A CN 115060937 A CN115060937 A CN 115060937A CN 202210638570 A CN202210638570 A CN 202210638570A CN 115060937 A CN115060937 A CN 115060937A
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- wafer
- push rod
- probe
- fixedly connected
- air bag
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
The invention relates to the technical field of wafer testing, and discloses a probe platform for testing an integrated circuit chip wafer, which comprises a workbench, an electric push rod, a probe frame, a probe and a wafer fixing block, wherein a movable cavity is formed in the workbench, a movable plate is connected to the interior of the movable cavity in a sliding manner, a through hole is formed in the workbench and positioned at the upper side of the movable cavity, a sliding cavity is formed in the upper push rod of the electric push rod, a sliding block is connected to the interior of the sliding cavity in a sliding manner, an air bag is fixedly connected to the top surface of the sliding block, an air groove is formed in the middle of the sliding block, a spring is fixedly connected to the inner side wall of the upper part of the air groove, and a ball plug is fixedly connected to the top end of the spring. According to the invention, the lower push rod of the electric push rod extends out, so that negative pressure is generated inside the air bag, air outside the air bag is promoted to enter the air bag along the air groove through the negative pressure inside the air bag, and the accelerated airflow at the contact position of the probe and the wafer is utilized to promote the wafer to realize cooling and heat dissipation.
Description
Technical Field
The invention relates to the technical field of wafer testing, in particular to a probe platform for testing an integrated circuit chip wafer.
Background
Wafer testing is an important processing step in chip production and manufacturing, and in order to count the yield of chips, the wafer is mainly subjected to electrical detection through a wafer probe platform, and the on-off of a circuit in the wafer is judged by utilizing the conductivity of a probe so as to ensure the quality of finished chips.
When the existing wafer probe platform is used, the wafer is mainly subjected to electrical detection, so that a certain amount of heat can be generated in the detection process of the wafer, for some elements with weak welding pins on the wafer, the heat during detection easily causes the conditions of pin desoldering and the like, and the quality of a finished wafer is influenced.
Disclosure of Invention
The invention provides a probe platform for testing an integrated circuit chip wafer, which aims at overcoming the defects of the conventional probe platform in the use process in the background art, has the advantages of cooling the wafer and the probe, preventing the wafer from moving and sliding and facilitating the taking of the wafer after the test is finished, and solves the technical problems in the background art.
The invention provides the following technical scheme: a probe platform for testing integrated circuit chip wafers comprises a workbench, an electric push rod, a probe frame, probes and a wafer fixing block, wherein a movable cavity is formed inside the workbench, a movable plate is connected inside the movable cavity in a sliding manner, a through hole is formed in the workbench and positioned at the upper side of the movable cavity, a sliding cavity is formed in the upper push rod of the electric push rod, a sliding block is connected inside the sliding cavity in a sliding manner, an air bag is fixedly connected to the top surface of the sliding block, an air groove is formed in the middle of the sliding block, a spring is fixedly connected to the inner side wall of the upper portion of the air groove, a ball plug is fixedly connected to the top end of the spring, fixing plates are fixedly connected to two sides of the probe frame, an ejector rod is fixedly connected to the bottom of each fixing plate, an arc-shaped groove is formed in the wafer fixing block, and a rotating shaft is fixedly connected to the side wall of the arc-shaped groove, and the outer side of the rotating shaft is movably sleeved with a special-shaped plate.
Preferably, the movable cavity is located under the wafer fixed block, the side of the movable plate is in sliding contact with the inner side wall of the movable cavity, the number of the through holes is three, and the through holes are uniformly distributed on the top surface of the workbench and located between the two wafer fixed blocks.
Preferably, the middle part of the bottom surface of the sliding block is fixedly connected with the top of a lower push rod of the electric push rod, the top surface of the air bag is fixedly connected with the top surface of the sliding cavity, the air groove penetrates through the inner part of the lower push rod of the electric push rod and goes deep into the probe, and the air groove is communicated with the bottom of the air bag.
Preferably, the gas tank is located inside one section of slider and establishes to calabash form, spring fixed connection is in the calabash form bottom of gas tank, the diameter of ball stopper equals the middle part aperture in calabash form gas tank, the initial position of ball stopper is in the middle part of gas tank calabash form.
Preferably, the number of the ejector rods is two, the two ejector rods penetrate through the two wafer fixing blocks respectively and extend into the movable cavity, and the bottom ends of the ejector rods are fixedly connected with the top surface of the movable plate.
Preferably, the quantity of arc wall is two, two the arc wall corresponds two wafer fixed blocks respectively, two the dysmorphism board is in directly over two side openings of through-hole respectively, the radian of deflecting radian and the arc wall of dysmorphism board is the same.
The invention has the following beneficial effects:
1. according to the invention, through designing the sliding cavity, the sliding block, the air bag, the air groove, the spring and the ball plug, the lower push rod of the electric push rod extends out, so that the lower push rod drives the sliding block to stretch the air bag, negative pressure is generated in the air bag, when the lower push rod of the electric push rod drives the probe to be in contact with the wafer, the negative pressure in the air bag is maximum, the ball plug is driven to overcome the potential energy of the spring by the negative pressure to move upwards, the air groove is opened, so that air on the outer side enters the air bag along the air groove, the air flow velocity at the probe is increased, and the accelerated air flow is used for driving the contact position of the wafer and the probe to realize heat dissipation.
2. According to the invention, by designing the sliding cavity, the sliding block, the air bag, the air groove, the spring and the ball plug, after the wafer is detected, the electric push rod is moved upwards, the lower push rod of the electric push rod is retracted, so that the lower push rod drives the sliding block to extrude the air bag, the gas pressure in the air bag is increased, the ball plug is pushed to overcome the potential energy of the spring to move downwards, the gas in the air bag is discharged through the air groove, the heated probe is cooled and radiated by using the discharged gas, the cooling speed of the probe is increased, and the wafer detection is prevented from being influenced after the probe is heated.
3. According to the invention, by designing the movable cavity, the movable plate, the through hole, the fixed plate, the ejector rod, the arc-shaped groove, the rotating shaft and the special-shaped plate, the probe rack is driven to move downwards when the lower push rod of the electric push rod moves downwards, so that the ejector rod and the sliding plate are driven to move downwards, the movable plate is used for promoting the interior of the movable cavity to generate negative pressure, the negative pressure generated by the movable cavity is further used for promoting the stability of a wafer placed on the special-shaped plate to be increased, and the wafer can be prevented from being displaced in the detection process to influence the detection result.
4. According to the invention, by designing the movable cavity, the movable plate, the through holes, the fixed plate, the ejector rod, the arc-shaped groove, the rotating shaft and the special-shaped plate, the probe rack is driven to move upwards when the lower push rod of the electric push rod moves upwards, so that the probe rack drives the ejector rod and the sliding plate to move upwards, gas in the movable cavity is driven to be discharged through the through holes by the upwards movement of the sliding plate, the gas discharged through the middle through hole is blown to the wafer to drive the wafer to be loosened, the gas discharged through the through holes on two sides is blown to the bottom of the special-shaped plate to drive the special-shaped plate to deflect in the arc-shaped groove under the action of the rotating shaft, and the deflected special-shaped plate jacks up the wafer, so that the wafer after detection is conveniently taken out, meanwhile, the direct contact between the wafer and the detection platform is effectively prevented, and the wafer is prevented from being scratched by the detection platform.
Drawings
FIG. 1 is a schematic overall perspective view of the present invention;
FIG. 2 is a schematic view of an integral half-section of the present invention;
FIG. 3 is a schematic view of the overall internal structure of the present invention;
FIG. 4 is a schematic diagram of the structure of the probe of FIG. 3 in an upward moving state according to the present invention;
FIG. 5 is a schematic view of the interior of the slider of the present invention;
fig. 6 is a schematic internal three-dimensional structure of the wafer mounting block according to the present invention.
In the figure: 1. a work table; 11. a movable cavity; 12. a movable plate; 13. a through hole; 2. a fixed mount; 3. a fixed table; 4. an electric push rod; 41. a slide chamber; 42. a slider; 43. an air bag; 44. an air tank; 45. a spring; 46. a ball plug; 5. a probe holder; 51. a fixing plate; 52. a top rod; 6. a probe; 7. fixing blocks of the wafer; 71. an arc-shaped slot; 72. a rotating shaft; 73. a shaped plate.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1 to 4, a probe platform for testing an integrated circuit chip wafer includes a worktable 1, a fixing frame 2 is fixedly installed at the middle of the rear side of the top surface of the worktable 1, a fixing table 3 is fixedly installed at the top end of the fixing frame 2, an electric push rod 4 is fixedly installed at the middle of the bottom surface of the fixing table 3, a probe frame 5 is fixedly installed at the bottom end of the electric push rod 4, probes 6 are fixedly installed at the bottom of the probe frame 5, and wafer fixing blocks 7 are symmetrically installed at the middle of the top surface of the worktable 1.
Referring to fig. 1-6, a movable cavity 11 is formed inside a worktable 1, a movable plate 12 is slidably connected inside the movable cavity 11, through holes 13 are formed inside the worktable 1 and located on the upper side of the movable cavity 11, the movable cavity 11 is located right below a wafer fixing block 7, the side surface of the movable plate 12 is in sliding contact with the inner side wall of the movable cavity 11, the number of the through holes 13 is three, the three through holes 13 are uniformly distributed on the top surface of the worktable 1 and located between the two wafer fixing blocks 7, so that the wafer can be fixed when negative pressure is generated inside the movable cavity 11, and the wafer can be conveniently taken out when gas inside the movable cavity 11 is exhausted, a sliding cavity 41 is formed inside an upper push rod of an electric push rod 4, a sliding block 42 is slidably connected inside the sliding cavity 41, an air bag 43 is fixedly connected to the top surface of the sliding block 42, an air groove 44 is formed in the middle part of the sliding block 42, and the middle part of the bottom surface of the sliding block 42 is fixedly connected to the top part of the lower push rod of the electric push rod 4, the push rod of the electric push rod 4 is convenient to drive the slide block 42 to move, the top surface of the air bag 43 is fixedly connected with the top surface of the slide cavity 41, the air groove 44 penetrates through the interior of the push rod of the electric push rod 4 and extends into the interior of the probe 6, the air groove 44 is communicated with the bottom of the air bag 43, the air speed at the top end of the probe 6 can be increased under the action of the air groove 44 when negative pressure is generated in the air bag 43, the inner side wall of the upper part of the air groove 44 is fixedly connected with a spring 45, the top end of the spring 45 is fixedly connected with a ball plug 46, one section of the air groove 44 positioned in the slide block 42 is in a gourd shape, the spring 45 is fixedly connected with the gourd-shaped bottom of the air groove 44, the diameter of the ball plug 46 is equal to the middle aperture of the gourd-shaped air groove 44, the initial position of the ball plug 46 is positioned in the gourd-shaped middle part of the air groove 44, the ball plug 46 can enter the gourd-shaped upper part when the negative pressure in the air bag 43 is at the highest value, and the ball plug 46 can enter the gourd-shaped lower part when the air bag 43 is extruded, the air groove 44 is communicated with the air bag 43, the two sides of the probe frame 5 are fixedly connected with a fixing plate 51, the bottom of the fixing plate 51 is fixedly connected with two push rods 52, the two push rods 52 respectively penetrate through the two wafer fixing blocks 7 and extend into the movable cavity 11, and the bottom end of the ejector rod 52 is fixedly connected with the top surface of the movable plate 12, so that the ejector rod 52 is used for driving the movable plate 12 to move downwards when the probe holder 5 moves downwards, the arc-shaped grooves 71 are formed in the wafer fixing blocks 7, the side walls of the arc-shaped grooves 71 are fixedly connected with the rotating shaft 72, the special-shaped plates 73 are movably sleeved on the outer sides of the rotating shaft 72, the number of the arc-shaped grooves 71 is two, the two arc-shaped grooves 71 correspond to the two wafer fixing blocks 7 respectively, the two special-shaped plates 73 are located right above the two side holes of the through hole 13 respectively, and the deflection radian of the special-shaped plates 73 is the same as that of the arc-shaped grooves 71, so that the special-shaped plates 73 can deflect in the arc-shaped grooves 71 to jack up the wafer.
Referring to fig. 1-6, when the lower push rod of the electric push rod 4 moves downward to drive the probe 6 to inspect the wafer, the probe holder 5 moves downward to drive the push rod 52 to move downward, the push rod 52 drives the movable plate 12 to move downward to drive the interior of the movable cavity 11 to generate negative pressure, and the wafer placed on the special-shaped plate 73 is fixed under the action of the negative pressure through the through hole 13, and the position of the special-shaped plate 73 is fixed by two side holes of the through hole 13 and the negative pressure, so that the position of the wafer is more stable in the inspection process;
referring to fig. 1-6, as the lower push rod of the electric push rod 4 moves downward and causes the probe to contact the wafer, the negative pressure generated inside the air bag 43 is maximized, so that the ball plunger 46 moves upward against the potential energy of the spring 45 and enters the gourd-shaped upper portion of the air groove 44, thereby causing the air bag 43 to communicate with the air groove 44, so that the external air enters the air bag 43 by the negative pressure of the air bag 43, the air velocity at the contact position of the probe 6 and the wafer is increased, and the heat generated during the wafer detection process is dissipated by the accelerated air flow, thereby ensuring the quality of the wafer;
referring to fig. 1-6, after the wafer is detected, the air bag 43 is pressed by the slider 42 along with the upward movement of the lower push rod of the electric push rod 4, and at this time, the ball plug 46 overcomes the potential energy of the spring 45 and enters the gourd-shaped lower part of the air groove 44 under the action of the air pressure, so that the air in the air bag 43 is discharged through the air groove 44, and the discharged air is utilized to accelerate the heat dissipation and cooling of the probe 6, thereby preventing the probe 6 from affecting the detection result of the wafer after being heated;
referring to fig. 1-6, the lower push rod of the electric push rod 4 moves upward to drive the probe holder 5 to move upward, so that the push rod 52 extrudes the gas inside the movable cavity 11, the gas inside the movable cavity 11 is exhausted through the through hole 13, the wafer placed on the special-shaped plate 73 is loosened, and meanwhile, the gas exhausted through the two side holes of the through hole 13 is directly blown to the bottom of the special-shaped plate 73, so that the special-shaped plate 73 is deflected under the action of the rotating shaft 72, the deflected special-shaped plate 73 jacks up the loosened wafer, the wafer is convenient to take out, meanwhile, the wafer is effectively prevented from directly contacting with the workbench 1, and the wafer is prevented from being scratched by the workbench.
The using method of the invention has the following working principle:
firstly, a wafer is placed on a plane formed by two special-shaped plates 73, an electric push rod 4 is started, the electric push rod 4 drives a probe rack 5 and a probe 6 to move downwards, the probe 6 is enabled to be in contact with the wafer to realize the detection of the wafer, as the lower push rod of the electric push rod 4 moves downwards, a lower push rod of the electric push rod 4 drives a slide block 42 to move downwards and stretch an air bag 43, negative pressure is generated inside the air bag 43, when the probe 6 is driven to be in contact with the wafer by the lower push rod of the electric push rod 4, the negative pressure inside the air bag 43 is at the highest value, the ball plug 46 is enabled to overcome the potential energy of a spring 45 to move upwards under the action of the negative pressure, the ball plug 46 enters the gourd-shaped upper part of the air groove 44, the air groove 44 is further communicated with the outside, so that the outside air is enabled to enter the inside of the air bag 43 through the bottom end of the air groove 44 under the action of the negative pressure, and the air flow speed at the contact position of the probe 6 and the wafer is enabled to be increased, meanwhile, the lower push rod of the electric push rod 4 drives the probe frame 5 to move downwards, so that the probe frame 5 drives the ejector rod 52 to move downwards, the ejector rod 52 drives the movable plate 12 to move downwards in the movable cavity 11, negative pressure is generated in the movable cavity 11, the through hole 13 is arranged to cause the negative pressure to act on the special-shaped plate 73 and the wafer, so that the position of the wafer is fixed, then the lower push rod of the electric push rod 4 moves upwards to cause the sliding block 42 to extrude the air bag 43 along with the completion of the detection of the wafer, so that the air pressure in the air bag 43 is increased to push the ball plug 46 to overcome the potential energy of the spring 45 to enter the calabash-shaped lower part of the air groove 44, so that the air in the air bag 43 is discharged through the air groove 44, meanwhile, the lower push rod of the electric push rod 4 moves upwards to cause the probe frame 5 to drive the ejector rod 52 to move upwards, so that the movable plate 12 extrudes the air in the movable cavity 11, the position of the wafer is loosened by the action of the through hole 13, and the gas in the movable cavity 11 is blown to the bottom of the special-shaped plate 73 by the two side holes of the through hole 13, so that the special-shaped plate 73 deflects and jacks up the wafer.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. The utility model provides a probe platform is used in integrated circuit chip wafer test, includes workstation (1), electric putter (4), probe frame (5), probe (6) and wafer fixed block (7), its characterized in that: the probe fixing structure comprises a workbench (1), a movable cavity (11) is formed in the workbench (1), a movable plate (12) is connected to the inner portion of the movable cavity (11) in a sliding mode, a through hole (13) is formed in the upper side of the movable cavity (11) in the workbench (1), a sliding cavity (41) is formed in the upper push rod of an electric push rod (4), a sliding block (42) is connected to the inner portion of the sliding cavity (41) in a sliding mode, an air bag (43) is fixedly connected to the top surface of the sliding block (42), an air groove (44) is formed in the middle of the sliding block (42), a spring (45) is fixedly connected to the inner side wall of the upper portion of the air groove (44), a ball plug (46) is fixedly connected to the top end of the spring (45), fixing plates (51) are fixedly connected to two sides of a probe frame (5), an ejector rod (52) is fixedly connected to the bottom of the fixing plates (51), an arc-shaped groove (71) is formed in the wafer fixing block (7), the lateral wall fixedly connected with pivot (72) of arc wall (71), dysmorphism board (73) has been cup jointed in the outside activity of pivot (72).
2. The probe platform for testing integrated circuit chip wafers as recited in claim 1, wherein: activity chamber (11) are located wafer fixed block (7) under, the side of fly leaf (12) and the inside wall sliding contact in activity chamber (11), the quantity of through-hole (13) is three, three through-hole (13) evenly distributed just is located between two wafer fixed blocks (7) at the top surface of workstation (1).
3. The probe platform for testing integrated circuit chip wafers as recited in claim 1, wherein: the middle of the bottom surface of the sliding block (42) is fixedly connected with the top of a lower push rod of the electric push rod (4), the top surface of the air bag (43) is fixedly connected with the top surface of the sliding cavity (41), the air groove (44) penetrates through the inner part of the lower push rod of the electric push rod (4) and extends into the probe (6), and the air groove (44) is communicated with the bottom of the air bag (43).
4. The probe platform for testing integrated circuit chip wafers as recited in claim 1, wherein: the gas tank (44) is located the inside one section of slider (42) and establishes to calabash form, spring (45) fixed connection is in the calabash form bottom of gas tank (44), the diameter of ball stopper (46) equals the middle part aperture of calabash form gas tank (44), the initial position of ball stopper (46) is in the middle part of gas tank (44) calabash form.
5. The probe platform for testing integrated circuit chip wafers as recited in claim 1, wherein: the number of the ejector rods (52) is two, the two ejector rods (52) penetrate through the two wafer fixing blocks (7) respectively and extend into the movable cavity (11), and the bottom ends of the ejector rods (52) are fixedly connected with the top surface of the movable plate (12).
6. The probe platform for testing integrated circuit chip wafers as recited in claim 1, wherein: the quantity of arc wall (71) is two, two arc wall (71) corresponds two wafer fixed blocks (7) respectively, two dysmorphism board (73) are in through-hole (13) two side openings directly over respectively, the radian that deflects of dysmorphism board (73) is the same with the radian of arc wall (71).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210638570.8A CN115060937B (en) | 2022-06-07 | 2022-06-07 | Probe platform for testing integrated circuit chip wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210638570.8A CN115060937B (en) | 2022-06-07 | 2022-06-07 | Probe platform for testing integrated circuit chip wafer |
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| Publication Number | Publication Date |
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| CN115060937A true CN115060937A (en) | 2022-09-16 |
| CN115060937B CN115060937B (en) | 2023-10-13 |
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| CN202210638570.8A Active CN115060937B (en) | 2022-06-07 | 2022-06-07 | Probe platform for testing integrated circuit chip wafer |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN209231389U (en) * | 2018-08-21 | 2019-08-09 | 天津恒芯唯恩泰克电子科技有限公司 | A kind of integrated circuit DC test manual probe device |
| CN211979119U (en) * | 2020-01-19 | 2020-11-20 | 伍煜杰 | Automatic chip connection testing equipment |
| CN213707381U (en) * | 2020-11-05 | 2021-07-16 | 苏州市永辰芯微电子有限公司 | Special testing arrangement of wafer production and processing |
| JP2021118344A (en) * | 2020-01-28 | 2021-08-10 | 末晴 宮川 | Wafer test device |
| CN113466665A (en) * | 2021-07-06 | 2021-10-01 | 苏州斯尔特微电子有限公司 | Full-automatic wafer test probe station |
| CN216900623U (en) * | 2021-08-11 | 2022-07-05 | 飞锃半导体（上海）有限公司 | Wafer test probe equipment |
-
2022
- 2022-06-07 CN CN202210638570.8A patent/CN115060937B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN209231389U (en) * | 2018-08-21 | 2019-08-09 | 天津恒芯唯恩泰克电子科技有限公司 | A kind of integrated circuit DC test manual probe device |
| CN211979119U (en) * | 2020-01-19 | 2020-11-20 | 伍煜杰 | Automatic chip connection testing equipment |
| JP2021118344A (en) * | 2020-01-28 | 2021-08-10 | 末晴 宮川 | Wafer test device |
| CN213707381U (en) * | 2020-11-05 | 2021-07-16 | 苏州市永辰芯微电子有限公司 | Special testing arrangement of wafer production and processing |
| CN113466665A (en) * | 2021-07-06 | 2021-10-01 | 苏州斯尔特微电子有限公司 | Full-automatic wafer test probe station |
| CN216900623U (en) * | 2021-08-11 | 2022-07-05 | 飞锃半导体（上海）有限公司 | Wafer test probe equipment |
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| CN115060937B (en) | 2023-10-13 |
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