CN115052419A - Double-single-panel combined flexible double-sided circuit board and preparation process - Google Patents

Double-single-panel combined flexible double-sided circuit board and preparation process Download PDF

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Publication number
CN115052419A
CN115052419A CN202210748325.2A CN202210748325A CN115052419A CN 115052419 A CN115052419 A CN 115052419A CN 202210748325 A CN202210748325 A CN 202210748325A CN 115052419 A CN115052419 A CN 115052419A
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CN
China
Prior art keywords
protective film
sided
window
double
panel
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Pending
Application number
CN202210748325.2A
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Chinese (zh)
Inventor
万海平
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Shanghai Wlcp Electrical & Technology Co ltd
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Shanghai Wlcp Electrical & Technology Co ltd
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Priority to CN202210748325.2A priority Critical patent/CN115052419A/en
Publication of CN115052419A publication Critical patent/CN115052419A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/144—Stacked arrangements of planar printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/288—Removal of non-metallic coatings, e.g. for repairing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

A double-single-panel combined flexible double-sided circuit board comprises: first single faceboard, second single faceboard, aluminum sheet and structure of windowing, first single faceboard is connected with the second single faceboard, and the second single faceboard is connected with the aluminum sheet, and the structure of windowing link up first single faceboard and second single faceboard. Compared with the prior art, the flexible double-sided board is manufactured by additionally arranging the double-layer single-sided combined flexible circuit board and combining the flexible single-sided board and the flexible substrate into a single-sided board. In the production process of component mounting technology (SMT), through welding of the upper layer bonding pad and the lower layer bonding pad, the double-layer circuit is conducted, the better flexible bending function is achieved, the electroplating technology of the double-sided board is eliminated, the processing technology flow is simple, and the flexible double-sided circuit board bending device is suitable for the bending design requirements of the flexible double-sided circuit board of the car lamp.

Description

Double-single-panel combined flexible double-sided circuit board and preparation process
Technical Field
The invention relates to the field of circuit boards, in particular to a double-single-panel combined flexible double-sided circuit board and a preparation process thereof.
Background
The double-sided board for the car lamp is often required to realize the functions of double-layer circuit conduction and bending. The common double-sided flexible circuit board needs to be conducted between two layers of circuits through a conducting hole and an electroplating process, and the manufacturing process is more complex than that of a single-sided flexible circuit board.
Therefore, in order to solve the problems of two-layer circuit conduction, flexible bending and simple manufacturing process of the double-sided flexible circuit board, it is necessary to develop a double-layer single-sided combined flexible double-sided circuit board.
In order to solve the above problems, we have made a series of improvements.
Disclosure of Invention
The invention aims to provide a double-single-panel combined flexible double-sided circuit board and a preparation process thereof, so as to overcome the defects in the prior art.
A double-single-panel combined flexible double-sided circuit board comprises: the aluminum sheet window comprises a first single-sided panel, a second single-sided panel, an aluminum sheet and a window structure, wherein the first single-sided panel is connected with the second single-sided panel, the second single-sided panel is connected with the aluminum sheet, and the window structure penetrates through the first single-sided panel and the second single-sided panel;
wherein the first single panel comprises: the upper side and the lower side of the first copper substrate are respectively connected with the first PI protective film and the second PI protective film through the first thermosetting adhesive, and the adhesive-free space is arranged between the second PI protective film and the second single-sided board;
the second single panel includes: the upper side and the lower side of the second copper substrate are respectively connected with a third PI protective film and a fourth PI protective film through second thermosetting adhesive, and the lower side of the fourth PI protective film is connected with an aluminum sheet through the second thermosetting adhesive;
the window opening structure includes: first PI protection film windowing, second PI protection film windowing, components and parts windowing, second single panel windowing and third PI protection film windowing, first PI protection film windowing link up first PI protection film and first copper base plate, first PI protection film windowing link up the aperture that first copper base plate was link up and is less than the aperture that link up first PI protection film, second PI protection film windowing link up first copper base plate and second PI protection film, second PI protection film windowing link up the aperture that first copper base plate was link up and is less than the aperture that links up the second PI protection film, components and parts windowing link up first PI protection film, second single panel windowing link up the second PI protection film, third PI protection film windowing link up the third PI protection film.
A preparation process of a flexible double-sided circuit board combined by double single panels comprises the following steps:
step 1: manufacturing a first single-sided board, blanking and punching a first PI protection film outlet window, blanking and punching a second PI protection film outlet window, blanking a first copper substrate, cleaning, sticking a second PI protection film, laminating, cleaning, generating a circuit, sticking a first PI protection film, laminating, silk-screening, sticking a first thermosetting adhesive on the back surface, and then punching and forming the window to form a glue-free space;
step 2: manufacturing a second single-sided board, blanking and punching a third PI protective film to form a window, blanking a second copper substrate, cleaning, generating a circuit, cleaning, pasting a third PI protective film, laminating, silk-screening, punching an outer shape, and pasting second thermosetting adhesive;
and 3, step 3: manufacturing an aluminum sheet, blanking, laser punching and cleaning;
and 4, step 4: assembling and manufacturing, attaching the second single-sided board and the first single-sided board, attaching an aluminum sheet, laminating, surface treating and laser shape punching.
Furthermore, the first copper substrate and the second copper substrate adopt rolled copper foils or electrolytic copper foils.
The invention has the beneficial effects that:
compared with the prior art, the flexible double-sided board is manufactured by additionally arranging the double-layer single-sided combined flexible circuit board and combining the flexible single-sided board and the flexible substrate into a single-sided board. In the production process of component mounting technology (SMT), through welding of the upper layer bonding pad and the lower layer bonding pad, the conduction and the better flexible bending function of the double-layer circuit are achieved, the electroplating process of the double-sided board is removed, the processing process flow is simple, and the flexible double-sided circuit board bending design method is suitable for the bending design requirements of the flexible double-sided circuit board of the car lamp.
Description of the drawings:
FIG. 1 is a schematic structural diagram of the present invention.
Fig. 2 is a schematic structural diagram of the windowing structure of the invention.
Fig. 3 is a schematic view of the overall structure of the present invention.
Reference numerals:
the first single-sided board 100, the first copper substrate 110, the first thermosetting adhesive 120, the first PI protective film 130, the second PI protective film 140, and the adhesive-free space 150.
A second single-sided board 200, a second copper substrate 210, a second thermosetting adhesive 220, a third PI protection film 230, and a fourth PI protection film 240.
The aluminum sheet 300, the windowing structure 400, the first PI protection film windowing 410, the second PI protection film windowing 420, the component windowing 430, the second single-panel windowing 440 and the third PI protection film windowing 450.
Detailed Description
The present invention will be further described with reference to the following examples. It should be understood that the following examples are illustrative only and are not intended to limit the scope of the present invention.
Example 1
FIG. 1 is a schematic structural diagram of the present invention. Fig. 2 is a schematic structural diagram of the windowing structure of the invention. Fig. 3 is a schematic view of the overall structure of the present invention.
As shown in fig. 1 and 3, a flexible double-sided circuit board with a double single-panel assembly includes: the aluminum sheet structure comprises a first single-sided board 100, a second single-sided board 200, an aluminum sheet 300 and a windowing structure 400, wherein the first single-sided board 100 is connected with the second single-sided board 200, the second single-sided board 200 is connected with the aluminum sheet 300, and the windowing structure 400 penetrates through the first single-sided board 100 and the second single-sided board 200.
Wherein the first single panel 100 includes: the first copper substrate 110, the first thermosetting adhesive 120, the first PI protection film 130, the second PI protection film 140 and the adhesive-free space 150, wherein the upper side and the lower side of the first copper substrate 110 are respectively connected with the first PI protection film 130 and the second PI protection film 140 through the first thermosetting adhesive 120, and the adhesive-free space 150 is arranged between the second PI protection film 140 and the second single-sided board 200.
The second single panel 200 includes: the upper and lower sides of the second copper substrate 210 are respectively connected with the third PI protective film 230 and the fourth PI protective film 240 through the second thermosetting adhesive 220, and the lower side of the fourth PI protective film 240 is connected with the aluminum sheet 300 through the second thermosetting adhesive 220.
As shown in fig. 2, the windowing structure 400 includes: the first PI protection film window 410, the second PI protection film window 420, the component window 430, the second single-panel window 440 and the third PI protection film window 450, the first PI protection film window 410 penetrates through the first PI protection film 130 and the first copper substrate 110, the aperture of the first PI protection film window 410 penetrating through the first copper substrate 110 is smaller than the aperture of the first PI protection film 130, the second PI protection film window 420 penetrates through the first copper substrate 110 and the second PI protection film 140, the aperture of the second PI protection film window 420 penetrating through the first copper substrate 110 is smaller than the aperture of the second PI protection film 140, the component window 430 penetrates through the first PI protection film 130, the second single-panel window 440 penetrates through the second PI protection film 140, and the third PI protection film window 450 penetrates through the third PI protection film 230.
A preparation process of a flexible double-sided circuit board combined by double single panels comprises the following steps:
step 1: manufacturing a first single-sided board 100, blanking and punching a first PI protective film 130 to form a window, blanking and punching a second PI protective film 140 to form a window, blanking a first copper substrate 110, cleaning, attaching the second PI protective film 140, laminating, cleaning, generating a circuit, attaching the first PI protective film 130, laminating, silk-printing, attaching a first thermosetting adhesive 120 on the back, and then punching to form a window to form a glue-free space 150;
step 2: manufacturing a second single-sided board 200, blanking and punching a third PI protective film 230 to form a window, blanking a second copper substrate 210, cleaning, generating a circuit, cleaning, pasting the third PI protective film 230, laminating, silk-screening, punching the shape, and then pasting a second thermosetting adhesive 220;
and step 3: manufacturing an aluminum sheet 300, blanking, laser punching and cleaning;
and 4, step 4: assembling and manufacturing, namely attaching the second single-sided board 200 to the first single-sided board 100, attaching the aluminum sheet 300, laminating, performing surface treatment, and performing laser shape punching.
The first copper substrate 110 and the second copper substrate 210 are made of rolled copper foil or electrolytic copper foil.
Compared with the traditional technology, the double-sided flexible circuit board can better realize the conduction and flexible bending functions of the double-layer circuit compared with the double-sided flexible circuit board of the traditional electroplating process. The principle is that the double-sided flexible circuit board is modified on the basis of the traditional flexible circuit board, and the conduction between two layers of circuits is realized through the process of conducting holes and electroplating in the traditional double-sided flexible circuit board manufacturing process. The principle is as follows: the structure of the first single panel 100 and the second single panel 200 is modified. The main improvement point of the invention is to realize the conduction of the double-layer circuit by adding the windowing structure. The present invention has 4 windowing structures 400, wherein the component windowing 430 and the second single panel windowing 440 are determined to be specific locations based on different application products. The component opening window 430 forms a pad by opening only the first PI protection film 130, and allows the component to contact the first copper substrate 110. The second single-panel window 440 penetrates the first single-panel 100 and the third PI protective film 230, and directly exposes the second copper substrate 210 to form a pad. The second PI protection film window 420 opens the second PI protection film 140, and simultaneously opens a part of the structure of the first copper substrate 110, and finally the third PI protection film window 450 opens the third PI protection film 230 to expose the second copper substrate 210 below to form a pad. In this structure, the first PI protection film window 410, the second PI protection film window 420 and the third PI protection film window 450 are located in the same vertical channel, and the aperture of the first copper substrate 110 in the window structure is smaller, which means that a part of the first copper substrate 110 is exposed outside, and the other part is hollowed out to form a window, so that the first copper substrate 110 and the second copper substrate 210 can be conducted in the window, thereby forming a double-layer single-panel conduction pad structure.
In order to make the product have good bending advantage, the bending area of the two single-sided boards of the invention adopts a process of bonding without thermosetting adhesive, different from the traditional flexible circuit board, the glue-free space 150 is positioned between the first single-sided board 100 and the second single-sided board 200, the transverse position of the glue-free space can change according to the actual situation, and the whole flexible bending function of the invention is realized through the design.
The invention is made after the above steps are completed. The invention adds a double-layer single-side combined flexible circuit board, and combines a flexible single-side panel and a flexible substrate into a single-side panel to manufacture the flexible double-side panel. In the production process of component mounting technology (SMT), through welding of the upper layer bonding pad and the lower layer bonding pad, the conduction and the better flexible bending function of the double-layer circuit are achieved, the electroplating process of the double-sided board is removed, the processing process flow is simple, and the flexible double-sided circuit board bending design method is suitable for the bending design requirements of the flexible double-sided circuit board of the car lamp.
While the present invention has been described with reference to the specific embodiments, the present invention is not limited thereto, and various changes may be made without departing from the spirit of the present invention.

Claims (3)

1. The utility model provides a flexible two-sided circuit board of two single-faceplate combinations which characterized in that includes: the aluminum sheet window comprises a first single-sided panel (100), a second single-sided panel (200), an aluminum sheet (300) and a window opening structure (400), wherein the first single-sided panel (100) is connected with the second single-sided panel (200), the second single-sided panel (200) is connected with the aluminum sheet (300), and the window opening structure (400) penetrates through the first single-sided panel (100) and the second single-sided panel (200);
wherein the first single panel (100) comprises: the structure comprises a first copper substrate (110), a first thermosetting adhesive (120), a first PI protective film (130), a second PI protective film (140) and an adhesive-free space (150), wherein the upper side and the lower side of the first copper substrate (110) are respectively connected with the first PI protective film (130) and the second PI protective film (140) through the first thermosetting adhesive (120), and the adhesive-free space (150) is arranged between the second PI protective film (140) and a second single-sided board (200);
the second single-sided board (200) comprises: the upper side and the lower side of the second copper substrate (210) are respectively connected with the third PI protective film (230) and the fourth PI protective film (240) through the second thermosetting adhesive (220), and the lower side of the fourth PI protective film (240) is connected with the aluminum sheet (300) through the second thermosetting adhesive (220);
the windowing structure (400) comprises: a first PI protective film window (410), a second PI protective film window (420), a component window (430), a second single-panel window (440) and a third PI protective film window (450), the first PI protective film window (410) penetrates through the first PI protective film (130) and the first copper substrate (110), the aperture of the first PI protection film window (410) penetrating through the first copper substrate (110) is smaller than the aperture of the first PI protection film (130), the second PI protective film window (420) penetrates through the first copper substrate (110) and the second PI protective film (140), the aperture of the second PI protective film window (420) penetrating through the first copper substrate (110) is smaller than the aperture of the second PI protective film (140), the component window (430) penetrates through the first PI protective film (130), the second single-panel window (440) penetrates through the second PI protective film (140), the third PI protective film window (450) penetrates through the third PI protective film (230).
2. A preparation process of a flexible double-sided circuit board combined by double single panels is characterized by comprising the following steps:
step 1: manufacturing a first single-sided board (100), blanking and punching a first PI protective film (130) to form a window, blanking and punching a second PI protective film (140) to form a window, blanking a first copper substrate (110), cleaning, pasting the second PI protective film (140), laminating, cleaning, generating a circuit, pasting the first PI protective film (130), laminating, silk-screening, pasting a first thermosetting adhesive (120) on the back surface, and then punching to form a window to form a glue-free space (150);
step 2: manufacturing a second single-sided board (200), blanking, punching a third PI protective film (230) to form a window, blanking a second copper substrate (210), cleaning, line generation, cleaning, pasting the third PI protective film (230), laminating, silk-screen printing, shape punching and pasting a second thermosetting adhesive (220);
and step 3: manufacturing an aluminum sheet (300), blanking, laser punching and cleaning;
and 4, step 4: and (3) combining and manufacturing, namely attaching a second single-sided board (200) to the first single-sided board (100), attaching an aluminum sheet (300), laminating, performing surface treatment, and performing laser shape punching.
3. The process for preparing a double-single-panel combined flexible double-sided circuit board according to claim 2, wherein the process comprises the following steps: the first copper substrate (110) and the second copper substrate (210) adopt rolled copper foils or electrolytic copper foils.
CN202210748325.2A 2022-06-29 2022-06-29 Double-single-panel combined flexible double-sided circuit board and preparation process Pending CN115052419A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202210748325.2A CN115052419A (en) 2022-06-29 2022-06-29 Double-single-panel combined flexible double-sided circuit board and preparation process

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202210748325.2A CN115052419A (en) 2022-06-29 2022-06-29 Double-single-panel combined flexible double-sided circuit board and preparation process

Publications (1)

Publication Number Publication Date
CN115052419A true CN115052419A (en) 2022-09-13

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ID=83163403

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202210748325.2A Pending CN115052419A (en) 2022-06-29 2022-06-29 Double-single-panel combined flexible double-sided circuit board and preparation process

Country Status (1)

Country Link
CN (1) CN115052419A (en)

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