CN115019636A - Flexible display module and electronic equipment - Google Patents
Flexible display module and electronic equipment Download PDFInfo
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- CN115019636A CN115019636A CN202111246620.XA CN202111246620A CN115019636A CN 115019636 A CN115019636 A CN 115019636A CN 202111246620 A CN202111246620 A CN 202111246620A CN 115019636 A CN115019636 A CN 115019636A
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- 238000005452 bending Methods 0.000 claims abstract description 47
- 239000000463 material Substances 0.000 claims description 12
- 230000004308 accommodation Effects 0.000 claims description 10
- 229910000831 Steel Inorganic materials 0.000 claims description 5
- 239000010959 steel Substances 0.000 claims description 5
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims description 4
- 229910003460 diamond Inorganic materials 0.000 claims description 4
- 239000010432 diamond Substances 0.000 claims description 4
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 4
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 4
- 239000010935 stainless steel Substances 0.000 claims description 4
- 229910001220 stainless steel Inorganic materials 0.000 claims description 4
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims description 4
- 239000010937 tungsten Substances 0.000 claims description 4
- 229910052721 tungsten Inorganic materials 0.000 claims description 4
- UONOETXJSWQNOL-UHFFFAOYSA-N tungsten carbide Chemical compound [W+]#[C-] UONOETXJSWQNOL-UHFFFAOYSA-N 0.000 claims description 4
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 2
- 238000000034 method Methods 0.000 description 14
- 230000008569 process Effects 0.000 description 12
- 230000009286 beneficial effect Effects 0.000 description 4
- 238000004891 communication Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 238000001125 extrusion Methods 0.000 description 4
- 230000002349 favourable effect Effects 0.000 description 4
- 238000003825 pressing Methods 0.000 description 4
- 229910000838 Al alloy Inorganic materials 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 230000001965 increasing effect Effects 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 229910001069 Ti alloy Inorganic materials 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 230000009471 action Effects 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000000994 depressogenic effect Effects 0.000 description 2
- 230000003993 interaction Effects 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 230000002159 abnormal effect Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000003190 augmentative effect Effects 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000002372 labelling Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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Classifications
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The embodiment of the application provides a flexible display module and electronic equipment. The flexible display module at least includes: the backboard comprises a first surface, a second surface and a first concave part, wherein the first surface and the second surface are oppositely arranged along the thickness direction of the backboard, and the first concave part is concave from the second surface to the first surface; the flexible display component comprises a display part, a bending part and a binding part, wherein the bending part is connected with the display part and the binding part, the display part is arranged on the first surface, and the binding part is positioned on one side of the second surface; the driving chip is arranged on one side, back to the display part, of the binding part; the supporting component is arranged on one side, facing the backboard, of the binding portion, at least part of the supporting component is accommodated in the first concave portion, and the driving chip, the supporting component and the first concave portion are correspondingly arranged along the thickness direction. The flexible display module of this application can reduce the drive chip and take place the possibility of rupture damage, can reduce flexible display module's whole thickness simultaneously.
Description
Technical Field
The embodiment of the application relates to the technical field of terminals, in particular to a flexible display module and electronic equipment.
Background
An Organic Light Emitting Diode (OLED) Display module has self-Light Emitting, low driving voltage, high Light Emitting efficiency, high definition and contrast, and other properties. The organic light emitting diode display module can realize flexible display and large-area full-color display. The organic light emitting diode display module is a flexible display module. The full-face screen or the folding screen usually adopts an organic light emitting diode display module. The flexible display module has the characteristics of being bendable and easy to carry, and the application range of the flexible display module is wider and wider. The organic light emitting diode display module comprises a display part and a Driver IC (Driver IC). The driving chip is used for transmitting a driving signal to the display part so as to enable the display part to display a corresponding image. In order to reduce the frame of the display module to achieve full display, the driving chip and the binding portion for setting the driving chip are usually bent to the back of the display portion. In the display module assembly use, there is the condition that drive chip takes place to break and damages to lead to the unable normal demonstration of display module assembly. In order to reduce the possibility of damage to the driving chip, a support member is provided between the driving chip and the display part. The supporting piece can improve the rigidity of the binding area and reduce the possibility that the driving chip is damaged due to external force impact or extrusion. However, the thickness of the display module is increased by the supporting member, which is not favorable for the light and thin design of the display module.
Disclosure of Invention
The embodiment of the application provides a flexible display module and electronic equipment, can reduce the drive chip and take place the possibility of rupture damage, can reduce flexible display module's whole thickness simultaneously, is favorable to flexible display module's frivolous design.
The present application provides a flexible display module in a first aspect, which is used for an electronic device, and at least comprises:
the backboard comprises a first surface, a second surface and a first concave part, wherein the first surface and the second surface are oppositely arranged along the thickness direction of the backboard, and the first concave part is concave from the second surface to the first surface;
the flexible display component comprises a display part, a bending part and a binding part, wherein the bending part is connected with the display part and the binding part, the display part is arranged on the first surface, and the binding part is positioned on one side of the second surface;
the driving chip is arranged on one side of the binding part, which is back to the display part;
the supporting component is arranged on one side, facing the backboard, of the binding portion, at least part of the supporting component is contained in the first concave portion, and the driving chip, the supporting component and the first concave portion are correspondingly arranged along the thickness direction.
In the flexible display module assembly of the embodiment of the application, the driving chip, the supporting component, the back plate and the display part are stacked along the thickness direction of the back plate. The supporting component is arranged between the driving chip and the display part. The support component can form protection to the driving chip. When the display part is pressed and dented in the pressing area, the dented portion of the display part presses the back plate, and then the back plate transmits an external force to the support member. The supporting component can apply a reaction force to the display part to effectively buffer an external acting force, or the supporting component can move down integrally, so that the driving chip can be driven to move down integrally. Therefore, stress concentration is not easy to occur on the driving chip, and local bending deformation is not easy to occur. The supporting component can reduce the external acting force applied to the whole driving chip, and the whole driving chip is uniformly stressed, so that the possibility of the driving chip being broken and damaged is effectively reduced. The back plate is provided with a first concave part, and the driving chip, the supporting component and the first concave part are correspondingly arranged. At least part of the supporting component is accommodated in the first concave part, so that the space occupied by the supporting component in the thickness direction is reduced, the overall thickness of the region corresponding to the flexible display module and the driving chip can be reduced, and the light and thin design of the flexible display module is facilitated.
In a possible embodiment, the back plate has a side surface facing the bending portion, and the first recess penetrates through the side surface, or a first sidewall of the first recess is spaced apart from the side surface.
In one possible embodiment, the shape of the support member matches the shape of the first recess.
In one possible embodiment, the orthographic projection area of the supporting component is larger than that of the driving chip along the thickness direction.
In a possible implementation manner, the support assembly comprises a first support member and a connecting member, the connecting member connects the first support member and the first bottom wall of the first recess portion, the first support member comprises a base portion and a convex portion, the convex portion is located on one side of the base portion, which faces away from the first surface, the base portion and the convex portion form an accommodating space, at least part of the binding portion is located in the accommodating space, the binding portion is connected with the base portion, and the driving chip is arranged corresponding to the accommodating space along the thickness direction.
In a possible embodiment, the convex portion is disposed in a region of the base portion away from the bending portion, and the convex portion is located on a side of the driving chip away from the bending portion.
In one possible embodiment, the convex portion is disposed in a region of the base portion close to the bent portion, and the convex portion is located on a side of the driving chip facing the bent portion.
In a possible embodiment, the length of the driving chip is less than or equal to the length of the convex portion along the axial direction of the bending portion.
In one possible embodiment, the surface of the driving chip facing away from the back plate is higher than the surface of the convex portion facing away from the back plate in the thickness direction.
In one possible embodiment, the material of the first support has a modulus of elasticity greater than 70 GPa.
In one possible embodiment, the material of the first support is selected from any one of silicon carbide, diamond, alumina, tungsten carbide, aluminum nitride, stainless steel, and tungsten steel.
In a possible implementation manner, the flexible display module further includes a second supporting member, the second supporting member is disposed on a side of the binding portion facing away from the display portion, and the second supporting member is spaced apart from the driving chip.
In one possible embodiment, the thickness of the second support member is smaller than the thickness of the driving chip in the thickness direction.
In a possible embodiment, the length of the driving chip is less than or equal to the length of the second support along the axial direction of the bending portion.
In one possible embodiment, the second supporting member is located on a side of the driving chip facing the bending portion.
In one possible embodiment, the support assembly has an orthographic area in the thickness direction that is greater than an orthographic area of the second support.
In a possible implementation manner, the back plate further includes a second recessed portion recessed from the second surface to the first surface, the flexible display module further includes a flexible circuit board located on one side of the driving chip opposite to the bending portion, the flexible circuit board is connected to the binding portion and electrically connected to the driving chip, and at least a portion of the flexible circuit board is located in the second recessed portion.
In a possible implementation manner, the first side wall of the first recess and the second side wall of the second recess are spaced apart, and the second recess is located on a side of the first recess away from the bending portion.
In one possible embodiment, the flexible display member is a flexible screen; or, the flexible display part includes the flexible screen and the flexible switching circuit board that link to each other, and the switching circuit board is located binding portion, and driver chip sets up in the switching circuit board.
In one possible embodiment, the first surface and the second surface are both planar.
In one possible embodiment, the binding is adhesively attached to the support member.
In a possible embodiment, the backplate includes first supporting part, intermediate strut portion and second supporting part, and first depressed part sets up in first supporting part, and the backplate has fold condition and expansion state, and the backplate is used for driving the display portion folding or expand, and in fold condition, first supporting part, intermediate strut portion and the mutual parallel and level of second supporting part, and in expansion state, first supporting part and the equal relative intermediate strut portion of second supporting part bend.
A second aspect of the present application provides an electronic device, which at least includes the flexible display module as described above.
Drawings
FIG. 1 is a schematic structural diagram of an electronic device in an unfolded state;
FIG. 2 is a schematic structural diagram of the electronic device shown in FIG. 1 in a semi-folded state;
FIG. 3 is a schematic structural diagram of the electronic device of FIG. 1 in a folded state;
FIG. 4 is a partially exploded view of the electronic device of FIG. 1;
FIG. 5 is a schematic view of a portion of a back side of a flexible display module according to the related art;
FIG. 6 is a schematic cross-sectional view taken along line A-A of FIG. 5;
FIG. 7 is a schematic view of a partial structure of a back surface of a flexible display module according to an embodiment of the present application;
FIG. 8 is a cross-sectional view taken along the line B-B in FIG. 7;
FIG. 9 is an enlarged view of FIG. 8 at C;
fig. 10 is a schematic diagram of a back side structure of a back plate according to an embodiment of the present application;
fig. 11 is a schematic view of a partial structure of a back surface of a flexible display module according to an embodiment of the present application;
FIG. 12 is a schematic cross-sectional view taken along the line D-D in FIG. 11;
FIG. 13 is an enlarged view of E in FIG. 12;
fig. 14 is a schematic partial cross-sectional view illustrating a flexible display module according to an embodiment of the present disclosure;
fig. 15 is a schematic partial cross-sectional view illustrating a flexible display module according to another embodiment of the present disclosure;
fig. 16 is a schematic partial cross-sectional view illustrating a flexible display module according to yet another embodiment of the present application;
fig. 17 is a schematic partial cross-sectional view illustrating a flexible display module according to yet another embodiment of the present application;
fig. 18 is a schematic partial cross-sectional view illustrating a flexible display module according to yet another embodiment of the present application;
fig. 19 is a schematic partial cross-sectional view illustrating a flexible display module according to yet another embodiment of the present application;
fig. 20 is a schematic partial sectional view illustrating a flexible display module according to still another embodiment of the present disclosure.
Description of the labeling:
10. an electronic device; 11. a first housing; 12. a second housing; 13. a hinge;
20. a flexible display module; 201. a first display area; 202. a second display area; 203. a third display area;
30. a driving chip;
40. a support body;
50. a back plate; 501. a first surface; 502. a second surface; 503. a first recess; 5031. a first bottom wall; 5032. a first side wall; 5032a, a first wall; 5032b, a second wall; 5032c, a third wall; 5032d, a fourth wall; 5032e, a fifth wall; 504. a side surface; 505. a second recess; 5051. a second bottom wall; 5052. a second side wall; 51. a first support section; 52. a second support portion; 53. a middle support part; 531. a gap;
60. a flexible display member; 601. a display unit; 602. a bending part; 603. a binding section; 61. a flexible screen; 62. switching the circuit board;
70. a support assembly; 71. a first support member; 71a, an accommodating space; 711. a base; 712. a convex portion; 72. a connecting member;
80. a second support member;
90. a flexible circuit board;
100. a shielding member;
x, thickness direction;
y, axial direction.
Detailed Description
The electronic device in the embodiment of the present application may be referred to as a User Equipment (UE) or a terminal (terminal), for example, the electronic device may be a mobile terminal or a fixed terminal such as a tablet computer (PAD), a Personal Digital Assistant (PDA), a handheld device having a wireless communication function, a computing device, a vehicle-mounted device, a wearable device, a Virtual Reality (VR) terminal device, an Augmented Reality (AR) terminal device, a wireless terminal in industrial control (industrial control), a wireless terminal in self driving (self driving), a wireless terminal in remote medical (remote medical), a wireless terminal in smart grid (smart grid), a wireless terminal in transportation safety (transportation safety), a wireless terminal in smart city (smart city), a wireless terminal in smart home (smart home), and the like. The form of the terminal device is not particularly limited in the embodiment of the present application.
In the embodiment of the present application, fig. 1 schematically shows a structure of an electronic device. Referring to fig. 1, an electronic device 10 is taken as an example of a handheld device with a wireless communication function. The wireless communication enabled handheld device may be a cell phone, for example. For example, the cell phone may be a foldable cell phone comprising a flexible display module.
Fig. 2 schematically shows the structure of the electronic device 10 in a half-folded state. Fig. 3 schematically shows the folded configuration of the electronic device 10. Referring to fig. 2 and 3, the electronic apparatus 10 includes a first housing 11, a second housing 12, and a hinge 13. The first housing 11 and the second housing 12 are located on both sides of the hinge 13, respectively. The first housing 11 and the second housing 12 are respectively connected to hinges 13. For example, the first housing 11 and the second housing 12 may be connected to the hinge 13 by welding or fastening. The first housing 11 and the second housing 12 can be respectively turned and folded with respect to the hinge 13. When the first housing 11 and the second housing 12 are close to each other and stacked on each other, the electronic apparatus 10 is in a folded state. When the first casing 11 and the second casing 12 are away from each other from the stacked state and the first casing 11 and the second casing 12 are rotated to be unable to rotate, the electronic apparatus 10 is in the unfolded state. The process of the first casing 11 and the second casing 12 from the folded state to the unfolded state is the unfolding process, and the process from the unfolded state to the folded state is the folding process. Illustratively, the number of the first housing 11 and the second housing 12 may each be one. When the electronic apparatus 10 is in the folded state, the first housing 11 and the second housing 12 are stacked to form a two-layer structure.
Fig. 4 schematically shows a partially exploded structure of the electronic device 10 of an embodiment. Referring to fig. 4, the electronic device 10 further includes a flexible display module 20. The flexible display module 20 has a display area for displaying image information. The flexible display module 20 may be disposed on the first housing 11, the hinge 13, and the second housing 12, and a display area of the flexible display module 20 is exposed to facilitate presentation of image information to a user. The flexible display module 20 includes a first display area 201, a second display area 202, and a third display area 203. The first display area 201 is disposed corresponding to the first housing 11. The second display area 202 is disposed corresponding to the second housing 12. The third display area 203 is provided corresponding to the hinge 13. The flexible display module 20 has a bending capability and can deform under the action of an external force. When the first housing 11 and the second housing 12 are in the folded state, the flexible display module 20 is in the bent state. The first display area 201 and the third display area 203 of the flexible display module 20 are close to each other, and the third display area 203 can be bent into an arc state. When the first housing 11 and the second housing 12 are in the unfolded state, the flexible display module 20 is in the unfolded state, and the first display area 201, the second display area 202 and the third display area 203 are in a flat state.
The electronic device 10 can change its overall size by folding or unfolding, and can have a larger display area in the unfolded state.
Fig. 5 schematically shows a partial structure of the back surface of the flexible display module 20 according to an embodiment. Referring to fig. 5 and 6, the flexible display module 20 includes a driving chip 30. The driving chip 30 is configured to transmit a driving signal to the flexible display module 20, so that the display area of the flexible display module 20 displays a corresponding image. The driver chip 30 may be formed by a wafer dicing process. The wafer refers to a silicon wafer used for manufacturing a silicon semiconductor circuit. The main material of the driving chip 30 is silicon, so that the driving chip 30 has low rigidity, brittleness and weak deformation resistance, and thus the driving chip 30 is easily broken when being subjected to external force. Set up driver chip 30 in the back of flexible display module assembly 20 usually to can reduce the black frame area in flexible display module assembly 20 edge, be favorable to increasing display area, realize flexible display module assembly 20's comprehensive screen display effect.
The flexible display module 20 has a touch function. The user can touch the display area of the flexible display module 20 by hand to execute the corresponding operation instruction. Because the flexible display module 20 is relatively soft, when a user's hand applies a relatively large compressive stress to the display region, the display region deforms and sags downward. If the user's hand applies a large pressure on the display area above the driving chip 30, the display area may press the driving chip 30 after sinking. When the pressing force to which the driver chip 30 is subjected is large, the driver chip 30 is at risk of being broken and damaged.
The flexible display module 20 includes a support 40. The support 40 is disposed between the driving chip 30 and the display region. The support 40 is a rigid structure, and thus has high rigidity and deformation resistance. For example, the support 40 may be an aluminum alloy having a thickness of 0.2 mm. The aluminum alloy may have an elastic modulus of 70 GPa. The supporter 40 may form a shield against the driving chip 30. When the display area is depressed, the supporting body 40 may apply a reaction force to the display area to effectively buffer an external force, or the supporting body 40 moves down as a whole, so that the supporting body 40 may drive the driving chip 30 to move down as a whole, and the driving chip 30 is not prone to crack and damage due to stress concentration. The supporting body 40 can effectively reduce the external acting force applied to the whole driving chip 30, ensure the whole driving chip 30 to be uniformly stressed, and effectively reduce the possibility of breakage and damage of the driving chip 30. However, the area corresponding to the driving chip 30 is usually the area with the largest thickness of the flexible display module 20, and therefore, the support 40 is disposed to increase the thickness of the area, which results in an increase in the overall thickness of the flexible display module 20 and affects the light and thin design of the flexible display module 20.
The flexible display module 20 provided by the embodiment of the application can reduce the possibility of breakage and damage of the driving chip 30, and can reduce the overall thickness of the flexible display module 20, thereby being beneficial to the light and thin design of the flexible display module 20.
The following explains an implementation of the flexible display module 20 provided in the embodiment of the present application.
Fig. 7 schematically shows a partial structure of the back surface of the flexible display module 20 according to an embodiment. Referring to fig. 7 to 9, the flexible display module 20 according to the embodiment of the present disclosure includes a back plate 50, a flexible display member 60, a driving chip 30, and a supporting assembly 70. The back plate 50 includes a first surface 501, a second surface 502, and a first recess 503. The first surface 501 and the second surface 502 are disposed oppositely in the thickness direction X of the back plate 50. The first recess 503 is recessed from the second surface 502 toward the first surface 501. The flexible display member 60 includes a display portion 601, a bending portion 602, and a binding portion 603. The bending portion 602 connects the display portion 601 and the binding portion 603. The display unit 601 displays image information. The portion of the flexible display member 60 beyond the display 601 is folded back towards the second surface 502 of the back plate 50. The portion of the flexible display member 60 beyond the display portion 601 forms a bent portion 602 and a binding portion 603. The flexible display member 60 itself is easily deformed by an external force. The display portion 601 of the flexible display member 60 is disposed on the first surface 501 side of the rear plate 50. The back plate 50 can provide good support for the display portion 601, thereby ensuring that the display portion 601 has good flatness and the display portion 601 is not easy to generate concave deformation when being subjected to external force, and reducing the concave deformation of the display portion 601. The binding portion 603 is located at one side of the second surface 502. The driving chip 30 is disposed on a side of the binding portion 603 facing away from the display portion 601, so that the driving chip 30 is located on a back side of the flexible display module 20. The driving chip 30 is used for transmitting a driving signal to the flexible display member 60 to make the display portion 601 display corresponding image information. The support member 70 is disposed at a side of the binding portion 603 facing the backboard 50. At least a portion of the support member 70 is received within the first recess 503. A portion of the support member 70 may be received in the first recess 503, and another portion is located outside the first recess 503. Alternatively, the support member 70 is entirely accommodated in the first recess 503. The driving chip 30, the supporting member 70 and the first recess 503 are correspondingly disposed along the thickness direction X of the backplate 50.
In the embodiment of the present application, the driving chip 30, the supporting member 70, the back plate 50, and the display portion 601 are stacked along the thickness direction X of the back plate 50. The supporting member 70 is disposed between the driving chip 30 and the display portion 601. The support member 70 may form a shield against the driving chip 30. When the display part 601 is pressed and dented in the pressed area, the dented portion of the display part 601 presses the back plate 50, and then the back plate 50 transmits an external force to the supporting member 70. The supporting member 70 may apply a reaction force to the display portion 601 to effectively buffer an external force, or the supporting member 70 may move down as a whole, so as to drive the driving chip 30 to move down as a whole. Therefore, stress concentration and local bending deformation are not easily generated on the driving chip 30. The supporting component 70 can reduce the external force applied to the whole driving chip 30, and make the whole driving chip 30 uniformly stressed, thereby effectively reducing the possibility of the driving chip 30 breaking and damaging. The back plate 50 has a first recess 503, and the driving chip 30, the supporting member 70 and the first recess 503 are correspondingly disposed. At least a portion of the supporting element 70 is accommodated in the first recess 503, so that the space occupied by the supporting element 70 in the thickness direction X is reduced, thereby reducing the overall thickness of the flexible display module 20 and the area corresponding to the driving chip 30, and facilitating the implementation of the light and thin design of the flexible display module 20.
In some realizable forms, the back plate 50 is a rigid structural member. The material of the back plate 50 may be copper, copper alloy, steel, titanium or titanium alloy. For example, the material of the back plate 50 may be titanium or a titanium alloy. The thickness of the back plate 50 is small, so that the back plate 50 can be bent and deformed, and when the flexible display module 20 is applied to the foldable electronic device 10, the back plate 50 can be folded or unfolded with the flexible display module 20. The backboard 50 has high rigidity, so that when an external force is applied along the thickness direction X of the backboard 50, the first surface 501 of the backboard 50 is not easy to be deformed.
In some examples, referring to fig. 7, the back plate 50 includes a first support portion 51, a second support portion 52, and an intermediate support portion 53. The display portion 601 of the flexible display module 20 may cover the first support portion 51, the second support portion 52 and the middle support portion 53. The first recess 503 is disposed on the first support 51. The back panel 50 has a folded state and an unfolded state. The back plate 50 is used for driving the display portion 601 of the flexible display module 20 to fold or unfold. The back plate 50 is in a folded state with the first support part 51, the second support part 52 and the intermediate support part 53 being flush with each other. In the unfolded state of the back plate 50, the first support portion 51 and the second support portion 52 are each bent with respect to the intermediate support portion 53. Illustratively, the intermediate support portion 53 is provided with a plurality of slits 531, so as to reduce the rigidity of the intermediate support portion 53, and facilitate the intermediate support portion 53 to be able to bend and deform with a small force. The slit 531 penetrates the first surface 501 and the second surface 502.
In some examples, the first surface 501 and the second surface 502 of the backplate 50 are both planar. When the flexible display module 20 is disposed on the first surface 501, the first surface 501 does not support the flexible display module 20 locally, so that the flexible display module 20 has a local concentrated stress region or the flexible display module 20 has a local bump. Illustratively, the first surface 501 and the second surface 502 of the backplate 50 are parallel to each other.
A perpendicular distance between the first bottom wall 5031 of the first recess 503 and the first surface 501 is smaller than a perpendicular distance between the second surface 502 and the first surface 501 along the thickness direction X of the back plate 50. In some examples, a predetermined region of the backplate 50 may be machined to form the first recess 503. For example, the machining may be milling or cutting. Alternatively, an etching process may be used to perform a subtractive process on a predetermined region of the backplate 50 to form the first recess 503.
In some realizable manners, referring to fig. 9, the orthographic projection area of the supporting component 70 is larger than that of the driving chip 30 along the thickness direction X of the back plate 50. The orthographic projection of the driver chip 30 is located within the orthographic projection of the support member 70. The support member 70 completely shields the driving chip 30 at one side of the driving chip 30. When the display portion 601 is acted by an external force and transmits the external force to the supporting component 70 through the back plate 50, the supporting component 70 can drive the driving chip 30 and the portion around the driving chip 30 on the binding portion 603 to move down integrally, so that the portions around the driving chip 30 on the supporting component 70 and the binding portion 603 can be used for buffering the external force, and the possibility of breakage and damage of the driving chip 30 caused by the external force acting on the driving chip 30 is further reduced. In some examples, the support assembly 70 includes a first support 71 and a connector 72. The first support 71 is a rigid structural member, and thus has high rigidity and deformation resistance by itself. The connector 72 connects the first support 71 and the first bottom wall 5031 of the first recess 503. The orthographic projection area of the first support 71 is larger than that of the driving chip 30 along the thickness direction X of the backplate 50. The orthographic projection of the driving chip 30 is located within the orthographic projection of the first support 71. The first support 71 completely shields the driving chip 30 at one side of the driving chip 30.
In some realizable ways, fig. 10 schematically shows a partial structure of the back surface of the back plate 50 of an embodiment. Referring to fig. 9 and 10, the back plate 50 is located inside the bent portion 602, so that the back plate 50 is shielded by the bent portion 602 when viewed from the outside of the bent portion 602. The back plate 50 has a side surface 504 facing the bend 602. The first recess 503 extends in the thickness direction X and is formed with an opening on the second surface 502. Meanwhile, the first recess 503 penetrates through the side surface 504 of the back plate 50 facing the bending part 602, so that an opening is also formed on the side surface 504. The wall surface of the first concave portion 503 facing the driving chip 30 is a first bottom wall 5031, and the wall surface intersecting the first bottom wall 5031 is a first side wall 5032. In some examples, the support assembly 70 includes a first support 71 and a connector 72. The connecting member 72 is disposed between the first support 71 and the first bottom wall 5031 of the first recess 503. The connector 72 connects the first support 71 and the first bottom wall 5031 of the first recess 503. Illustratively, the connecting member 72 may be an adhesive member, so that the first supporting member 71 and the first bottom wall 5031 of the first recess 503 are connected by adhesion, and the first supporting member 71 and the binding portion 603 are also connected by adhesion, thereby being beneficial to reducing the number of used parts and the assembly difficulty, and also ensuring the structural integrity of the first supporting member 71, the back plate 50 and the binding portion 603. In some examples, along the axial direction Y of the bending portion 602, the back plate 50 has two opposite side surfaces 504, and the first recess 503 does not penetrate through the two side surfaces 504 of the back plate 50. The axial direction Y of the bent portion 602 refers to a direction perpendicular to the bending direction of the bent portion 602. The axial direction Y of the bent portion 602 is perpendicular to the thickness direction X of the back plate 50.
In some realizable manners, the shape of the support member 70 matches the shape of the first recess 503, thereby facilitating accurate placement of the support member 70 within the first recess 503. In some examples, at least a portion of the first support 71 is located within the first recess 503. The shape of the first support 71 matches the shape of the first recess 503, so that it is easy to accurately place the first support 71 into the first recess 503. The first side wall 5032 of the first concave portion 503 can form a limiting constraint on the first supporter 71 from different directions, so as to reduce the possibility that the first supporter 71 is prone to position deviation in the first concave portion 503, and facilitate the first supporter 71 being in a predetermined position and being connected to the first bottom wall 5031 of the first concave portion 503.
In some examples, the first recess 503 extends through the side surface 504 of the back plate 50 facing the bending portion 602. The first side wall 5032 of the first recess 503 includes a first wall 5032a, a second wall 5032b, a third wall 5032c, a fourth wall 5032d, and a fifth wall 5032e, which are continuously disposed. The third wall 5032c is located on a side of the first support 71 opposite to the bending part 602. The angle between the second wall 5032b and the third wall 5032c is equal to the angle between the fourth wall 5032d and the third wall 5032 c. The angle between the first wall 5032a and the second wall 5032b is equal to the angle between the fifth wall 5032e and the fourth wall 5032 d. The first support 71 has five outer walls provided in one-to-one correspondence with the first wall 5032a, the second wall 5032b, the third wall 5032c, the fourth wall 5032d, and the fifth wall 5032 e.
In some realizable ways, fig. 11 schematically shows a partial structure of the back surface of the flexible display module 20 according to an embodiment. Referring to fig. 11 to 13, the first side wall 5032 of the first concave portion 503 is spaced from the side surface 504 of the back plate 50 facing the bending portion 602. The first recess 503 does not penetrate through the side surface 504 of the back plate 50 facing the bending part 602. The size of the first support 71 can be designed smaller, thereby reducing the weight of the first support 71. Therefore, the thickness of the whole flexible display module 20 is reduced, and the weight of the flexible display module 20 can be reduced. The first recess 503 for accommodating the first support 71 is also designed to be smaller in size. When the first recessed portion 503 is designed to have a smaller size, the area occupied by the area of the back plate 50 with the reduced thickness due to the formation of the first recessed portion 503 is reduced, so that the possibility of adverse effect on the overall rigidity of the back plate 50 due to the formation of the first recessed portion 503 by machining is reduced, and the overall rigidity of the back plate 50 is ensured to meet the requirement. In some examples, the first recess 503 does not extend through the side surface 504 of the back plate 50 facing the bending portion 602. For example, the first recess 503 may be rectangular, and the first support 71 may also be rectangular. In some examples, the binding 603 is connected to an area of the backplate 50 between the first recess 503 and the side surface 504. Illustratively, the binding 603 and the area of the back plate 50 between the first recess 503 and the side surface 504 are connected by bonding.
In some realizable ways, fig. 14 schematically shows a partial cross-sectional structure of the flexible display module 20 of an embodiment. Referring to fig. 14, the first support 71 is an integrally formed structure. The first support 71 includes a base 711 and a projection 712. The convex portion 712 is located on a side of the base portion 711 facing away from the first surface 501 in the thickness direction X. Since the protrusion 712 protrudes from the surface of the base 711, an accommodation space 71a is formed between the base 711 and the protrusion 712. At least a portion of the binding portion 603 is located in the accommodating space 71 a. The binding portion 603 is connected to the base portion 711. Specifically, the binding portion 603 is connected to a surface of the base portion 711 facing the binding portion 603. For example, the binding portion 603 and the base portion 711 may be connected by bonding. The driving chip 30 is disposed corresponding to the accommodating space 71a along the thickness direction X of the back plate 50.
The thickness of the region of the first support 71 corresponding to the convex portion 712 is greater than the thickness of the other regions of the first support 71. The first support 71 forms a locally thickened structure where the protrusion 712 is located. The arrangement mode of the unequal-thickness structure of the first supporting piece 71 is favorable for improving the rigidity of the first supporting piece 71, and further enhancing the deformation resistance of the first supporting piece 71. In some examples, the surface of the driving chip 30 facing away from the back plate 50 is higher than the surface of the convex portion 712 facing away from the back plate 50 along the thickness direction X of the back plate 50, so that the first support 71 can make full use of the space to dispose the convex portion 712, and the disposed convex portion 712 does not affect the overall thickness of the flexible display module 20 while improving the rigidity of the first support 71. In some examples, the resistance to deformation of the first support 71 in the region corresponding to the protrusion 712 is higher than the resistance to deformation of other regions of the first support 71. Along the axial direction Y of the bending portion 602, the length of the driving chip 30 is less than or equal to the length of the convex portion 712, so that the convex portion 712 of the first support 71 can be disposed corresponding to the whole driving chip 30. When the area of the first support 71 corresponding to the convex portion 712 is acted by an external force, the deformation amount of the area of the first support 71 corresponding to the convex portion 712 is small, so that the acting force transmitted to the driving chip 30 is ensured to be small.
Illustratively, the convex portion 712 is disposed at an area of the base portion 711 away from the bent portion 602. The convex portion 712 is located on a side of the driving chip 30 opposite to the bending portion 602. A wall surface of the convex portion 712 facing the accommodation space 71a and a wall surface of the base portion 711 facing the accommodation space 71a may be perpendicular to each other. A corner on the top of the convex portion 712, away from the receiving space 71a, is provided with a chamfered structure, for example, a rounded structure, which reduces the possibility of stress concentration areas on adjacent structural members due to the corner being pressed against the adjacent structural members.
Exemplarily, fig. 15 schematically shows a partial cross-sectional structure of the flexible display module 20 according to an embodiment. Referring to fig. 15, the convex portion 712 is disposed in the area of the base portion 711 near the bent portion 602. The convex portion 712 is located on a side of the driving chip 30 facing the bending portion 602. The wall surface of the convex portion 712 facing the accommodation space 71a is an inclined surface. An angle between a wall surface of the convex portion 712 facing the accommodation space 71a and a wall surface of the base portion 711 facing the accommodation space 71a may be an obtuse angle. A corner on the top of the convex part 712 near the accommodation space 71a is provided with a chamfered structure, for example, may be a rounded structure, reducing the possibility that the corner is pressed against the binding part 603 to cause a stress concentration region on the binding part 603.
In some realizable approaches, the elastic modulus of the material of the first support 71 is greater than 70 GPa. Since the thickness of the area of the back plate 50 where the first recessed portion 503 is disposed is reduced, the stiffness of the area of the back plate 50 corresponding to the first recessed portion 503 is reduced, so that the area corresponding to the first recessed portion 503 is easily recessed and deformed when the back plate 50 receives the same external force as other areas with thicker thickness. The first supporting member 71 is made of a material with a large elastic modulus, so that the deformation resistance of the first supporting member 71 can be improved without increasing the thickness of the first supporting member, thereby being beneficial to stably supporting the area with the reduced thickness of the backboard 50 and reducing the possibility of the area corresponding to the first concave part 503 to generate concave deformation. Meanwhile, when the first support 71 itself receives the same external force, the deformation amount of the first support 71 is smaller, so that the force transmitted to the driving chip 30 is smaller.
In some examples, the elastic modulus of the material of the first support 71 is greater than or equal to 105 GPa. The material of the first support 71 is selected from any one of silicon carbide, diamond, alumina, tungsten carbide, aluminum nitride, stainless steel, and tungsten steel.
In some realizable ways, fig. 16 schematically shows a partial cross-sectional structure of the flexible display module 20 of an embodiment. Referring to fig. 16, the flexible display module 20 further includes a second supporting member 80. The second support 80 is disposed on a side of the binding portion 603 facing away from the display portion 601. In some examples, the second supporting member 80 is connected to the binding portion 603 by adhesion. The second supporting member 80 is a rigid structural member having good deformation resistance. The second supporter 80 is spaced apart from the driving chip 30. The second support member 80 may further increase the overall rigidity of the binding portion 603, and reduce the possibility that the binding portion 603 is deformed and transmits a force to the driving chip 30, which may cause the driving chip 30 to be broken and damaged.
When the display portion 601 region of the flexible display module 20 receives a pressing force, the pressing force is transmitted to the backplate 50, the first support 71, the binding portion 603, and the second support 80. Under the effect of extrusion force, first support piece 71, second support piece 80 and the region that binds portion 603 and correspond driver chip 30 can effectively cushion extrusion force or can move down wholly to make binding portion 603 be difficult for taking place to warp, extrusion force is difficult for transmitting to driver chip 30 through binding portion 603, guarantee that driver chip 30 self does not take place to warp or the deflection is less, and then effectively reduce driver chip 30 because of receiving great exogenic action and lead to the possibility of rupture damage. In some examples, the second support 80 is located on a side of the driving chip 30 facing the bending part 602. In some examples, the material of the second support 80 is selected from any one of aluminum, aluminum alloy, silicon carbide, diamond, aluminum oxide, tungsten carbide, aluminum nitride, stainless steel, and tungsten steel.
The thickness of the second support 80 is less than the thickness of the driving chip 30 in the thickness direction X of the backplate 50. The surface of the driving chip 30 facing away from the backplate 50 is higher than the surface of the second supporting member 80 facing away from the backplate 50, so that the second supporting member 80 can be disposed by fully utilizing the space, and the overall thickness of the flexible display module 20 is not affected by the disposed second supporting member 80 while the rigidity of the binding portion 603 is improved.
Along the axial direction Y of the bending portion 602, the length of the driving chip 30 is less than or equal to the length of the second supporting member 80, so that the second supporting member 80 can be disposed corresponding to the whole driving chip 30. When the second supporting member 80 is acted by an external force, the second supporting member 80 can drive the region of the binding portion 603 corresponding to the driving chip 30 to move downwards, so that the acting force transmitted to the driving chip 30 is reduced.
In some realizable manners, the orthographic projection area of the support assembly 70 is greater than the orthographic projection area of the second support 80 along the thickness direction X of the backplate 50. In one example, the orthographic projection area of the first support 71 is larger than the orthographic projection area of the second support 80 in the thickness direction X of the backplate 50. The second supporting member 80 has a smaller size, which is beneficial to ensuring the light weight of the flexible display module 20 and reducing the space occupancy rate of the second supporting member 80. In some examples, the length of the first support 71 and the length of the second support 80 are equal along the axial direction Y of the bending portion 602. Opposite edges of the second support 80 are aligned with opposite edges of the first support 71.
In some realizable ways, fig. 17 schematically shows a partial cross-sectional structure of the flexible display module 20 of an embodiment. Referring to fig. 17, the back plate 50 further includes a second recess 505. The second recess 505 is recessed from the second surface 502 toward the first surface 501. The second recess 505 includes a second bottom wall 5051 and a second side wall 5052. The Flexible display module 20 further includes a Flexible Printed Circuit (FPC) 90. The flexible circuit board 90 is located on a side of the driving chip 30 opposite to the bending portion 602. The flexible circuit board 90 is connected to the bonding part 603 and electrically connected to the driving chip 30. The flexible circuit board 90 may be electrically connected to the motherboard to implement electrical signal interaction between the driving chip 30 and the motherboard. The flexible circuit board 90 itself is soft and easily bent and deformed. At least a portion of the flexible circuit board 90 is located in the second recessed portion 505, so that the space occupied by the flexible circuit board 90 in the thickness direction X is reduced, and the thickness of the area corresponding to the flexible circuit board 90 on the flexible display module 20 is effectively reduced. When the flexible display module 20 is applied to the electronic device 10, more space can be saved under the flexible circuit board 90 for disposing a larger number of other devices or other devices with larger volume. In some examples, the flexible circuit board 90 and the second bottom wall 5051 of the second recess 505 may be connected by adhesion, so as to reduce the number of used components, and meanwhile, it is not necessary to provide a corresponding connection structure on the flexible circuit board 90 or the back plate 50 due to additional use of a connection component, which reduces the assembly difficulty, and may also ensure the structural integrity of the flexible circuit board 90 and the back plate 50.
In some examples, the first side wall 5032 of the first recess 503 and the second side wall 5052 of the second recess 505 are spaced apart. The first recess 503 and the second recess 505 may not be in communication with each other. The second recess 505 is located on a side of the first recess 503 away from the bending portion 602. The thickness of the area for separating the first recess 503 from the second recess 505 on the backplate 50 is larger than the thickness of the area corresponding to the first recess 503 and the second recess 505, so that the area for separating the first recess 503 from the second recess 505 has higher deformation resistance, and the possibility of excessive reduction of the rigidity of the backplate 50 caused by the arrangement of the first recess 503 and the second recess 505 on the backplate 50 is reduced.
In some realizable forms, the flexible display component 60 is a flexible screen. The portion of the flexible screen beyond the display portion 601 is used to form a bending portion 602 and a binding portion 603. The driver chip 30 is directly connected to the flexible screen. In other realizable manners, fig. 18 schematically shows a partial cross-sectional structure of the flexible display module 20 according to an embodiment. Referring to fig. 18, the flexible display unit 60 includes a flexible screen 61 and a flexible relay circuit board 62. The flexible relay circuit board 62 is flexible and easily deformed. The relay circuit board 62 and the flexible panel 61 are electrically connected. The driving chip 30 is disposed on the adapting circuit board 62. The driving chip 30 transmits a driving signal to the flexible screen 61 through the relay circuit board 62. In some examples, the connection of the flexible screen 61 and the relay circuit board 62 is located at the binding portion 603. A portion of the flexible screen 61 and the relay circuit board 62 form a binding portion 603.
In some realizable ways, fig. 19 schematically shows a partial cross-sectional structure of the flexible display module 20 of an embodiment. Referring to fig. 19, the support assembly 70 includes a first support 71 and a connector 72. The connecting member 72 is disposed between the first support 71 and the first bottom wall 5031 of the first recess 503. The connector 72 connects the first support 71 and the first bottom wall 5031 of the first recess 503. At least a portion of the connector 72 is disposed within the first recess 503.
In some realizable ways, fig. 20 schematically shows a partial cross-sectional structure of the flexible display module 20 of an embodiment. Referring to fig. 20, the flexible display module 20 further includes a shielding member 100. The shielding member 100 is disposed on a side of the binding portion 603 facing away from the display portion 601. The shielding member 100 may cover the driving chip 30. The driving chip 30 is located in a space formed by the shielding member 100 and the binding portion 603. The shielding member 100 is used for shielding the driving chip 30, and effectively reduces the possibility that an external signal interferes with the driving chip 30 to cause an abnormal signal to appear on the driving chip 30.
In the description of the embodiments of the present application, it should be noted that unless otherwise explicitly stated or limited, the terms "mounted," "connected," and "connected" are to be construed broadly and may include, for example, a fixed connection, an indirect connection through an intermediate medium, a connection between two elements, or an interaction between two elements. The specific meanings of the above terms in the embodiments of the present application can be understood by those of ordinary skill in the art according to specific situations.
Reference throughout this specification to apparatus or components, in embodiments or to components thereof, may be understood as not necessarily referring to the particular orientation, construction or operation as such. In the description of the embodiments of the present application, "a plurality" means two or more unless specifically stated otherwise.
The terms "first," "second," "third," "fourth," and the like in the description and claims of the embodiments of the application and in the drawings described above, if any, are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used is interchangeable under appropriate circumstances such that the embodiments of the application described herein are, for example, capable of operation in sequences other than those illustrated or otherwise described herein. Moreover, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed, but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.
The term "plurality" herein means two or more. The term "and/or" herein is merely an association relationship describing an associated object, and means that there may be three relationships, for example, a and/or B, which may mean: a exists alone, A and B exist simultaneously, and B exists alone. In addition, the character "/" herein generally indicates that the former and latter related objects are in an "or" relationship; in the formula, the character "/" indicates that the preceding and succeeding related objects are in a relationship of "division".
It is to be understood that the various numerical references referred to in the embodiments of the present application are merely for convenience of description and distinction and are not intended to limit the scope of the embodiments of the present application. It should be understood that, in the embodiment of the present application, the sequence numbers of the above-mentioned processes do not imply an order of execution, and the order of execution of the processes should be determined by their functions and inherent logic, and should not limit the implementation process of the embodiment of the present application in any way.
Claims (19)
1. The utility model provides a flexible display module assembly for electronic equipment, its characterized in that includes at least:
the backlight module comprises a back plate and a light source, wherein the back plate comprises a first surface, a second surface and a first concave part, the first surface and the second surface are oppositely arranged along the thickness direction of the back plate, and the first concave part is concave from the second surface to the first surface;
the flexible display component comprises a display part, a bending part and a binding part, wherein the bending part is connected with the display part and the binding part, the display part is arranged on the first surface, and the binding part is positioned on one side of the second surface;
the driving chip is arranged on one side, back to the display part, of the binding part;
the supporting component is arranged on one side, facing the backboard, of the binding portion, at least part of the supporting component is accommodated in the first concave portion, and the driving chip, the supporting component and the first concave portion are correspondingly arranged along the thickness direction.
2. The flexible display module according to claim 1, wherein the back plate has a side surface facing the bending portion, the first recess penetrates through the side surface, or a first sidewall of the first recess is spaced apart from the side surface.
3. The flexible display module of claim 1 or 2, wherein the shape of the support member matches the shape of the first recess.
4. The flexible display module of any one of claims 1 to 3, wherein an orthographic area of the supporting member is larger than an orthographic area of the driving chip along the thickness direction.
5. The flexible display module according to any one of claims 1 to 4, wherein the support assembly comprises a first support member and a connector, the connector connects the first support member and the first bottom wall of the first recess, the first support member comprises a base portion and a convex portion, the convex portion is located on a side of the base portion facing away from the first surface, the base portion and the convex portion form an accommodation space, at least a portion of the binding portion is located in the accommodation space, the binding portion is connected with the base portion, and the driving chip is arranged corresponding to the accommodation space along the thickness direction.
6. The flexible display module of claim 5, wherein:
the convex part is arranged in an area of the base part far away from the bending part, and the convex part is positioned on one side of the driving chip back to the bending part; or,
the convex part is arranged in an area of the base part close to the bending part, and the convex part is positioned on one side of the driving chip facing the bending part.
7. The flexible display module of claim 5 or 6, wherein:
along the axial direction of the bending part, the length of the driving chip is less than or equal to that of the convex part; or,
along the thickness direction, the surface of the driving chip, which faces away from the back plate, is higher than the surface of the convex part, which faces away from the back plate.
8. The flexible display module of any of claims 5-7, wherein the material of the first support member has a modulus of elasticity greater than 70 GPa.
9. The flexible display module of claim 8, wherein the material of the first support is selected from any one of silicon carbide, diamond, aluminum oxide, tungsten carbide, aluminum nitride, stainless steel, and tungsten steel.
10. The flexible display module according to any one of claims 1 to 9, further comprising a second supporting member disposed on a side of the binding portion facing away from the display portion, wherein the second supporting member is spaced apart from the driving chip.
11. The flexible display module of claim 10, wherein the thickness of the second support member is less than the thickness of the driving chip along the thickness direction.
12. The flexible display module according to claim 10 or 11, wherein the length of the driving chip is less than or equal to the length of the second supporting member along the axial direction of the bending portion.
13. The flexible display module of any one of claims 10-12, wherein:
the second supporting piece is positioned on one side, facing the bending part, of the driving chip; or,
along the thickness direction, the orthographic projection area of the support component is larger than that of the second support piece.
14. The flexible display module according to any one of claims 1 to 13, wherein the back plate further comprises a second recess portion, the second recess portion is recessed from the second surface to the first surface, the flexible display module further comprises a flexible circuit board, the flexible circuit board is located on a side of the driving chip facing away from the bending portion, the flexible circuit board is connected to the binding portion and electrically connected to the driving chip, and at least a portion of the flexible circuit board is located in the second recess portion.
15. The flexible display module according to claim 14, wherein a first sidewall of the first recess and a second sidewall of the second recess are spaced apart, and the second recess is located on a side of the first recess away from the bending portion.
16. The flexible display module of any one of claims 1-15, wherein the flexible display member is a flexible screen; or, flexible display part is including the flexible screen and the flexible switching circuit board that link to each other, the switching circuit board is located binding portion, driver chip set up in switching circuit board.
17. The flexible display module of any one of claims 1-16, wherein:
the first surface and the second surface are both planar; alternatively, the binding is adhered to the support member.
18. The flexible display module assembly of any one of claims 1 to 17, wherein the back plate comprises a first support portion, an intermediate support portion and a second support portion, the first recess is disposed in the first support portion, the back plate has a folded state and an unfolded state, the back plate is configured to drive the display portion to fold or unfold, the folded state is that the first support portion, the intermediate support portion and the second support portion are flush with each other, and in the unfolded state, the first support portion and the second support portion are both opposite to the intermediate support portion, and the intermediate support portion is bent.
19. An electronic device, characterized by comprising at least the flexible display module according to any one of claims 1 to 18.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210851639.5A CN116030713A (en) | 2021-10-26 | 2021-10-26 | Flexible display module and electronic equipment |
| CN202111246620.XA CN115019636B (en) | 2021-10-26 | 2021-10-26 | Flexible display module and electronic equipment |
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| CN202111246620.XA CN115019636B (en) | 2021-10-26 | 2021-10-26 | Flexible display module and electronic equipment |
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| CN202210851639.5A Division CN116030713A (en) | 2021-10-26 | 2021-10-26 | Flexible display module and electronic equipment |
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| CN115019636A true CN115019636A (en) | 2022-09-06 |
| CN115019636B CN115019636B (en) | 2023-08-15 |
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| CN202111246620.XA Active CN115019636B (en) | 2021-10-26 | 2021-10-26 | Flexible display module and electronic equipment |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| WO2024000321A1 (en) * | 2022-06-29 | 2024-01-04 | 京东方科技集团股份有限公司 | Display module and display device |
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| CN113053244A (en) * | 2021-03-11 | 2021-06-29 | 京东方科技集团股份有限公司 | Display module, manufacturing method thereof and back film |
| CN113286456A (en) * | 2021-04-08 | 2021-08-20 | 荣耀终端有限公司 | Electronic equipment |
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2021
- 2021-10-26 CN CN202210851639.5A patent/CN116030713A/en active Pending
- 2021-10-26 CN CN202111246620.XA patent/CN115019636B/en active Active
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| JPH1020805A (en) * | 1996-07-08 | 1998-01-23 | Denso Corp | Portable information equipment with liquid crystal panel |
| CN107067977A (en) * | 2016-02-10 | 2017-08-18 | 株式会社日本显示器 | Display device and its manufacture method |
| US20180059727A1 (en) * | 2016-08-29 | 2018-03-01 | Samsung Display Co., Ltd. | Rollable display device |
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| US20190129229A1 (en) * | 2017-10-31 | 2019-05-02 | Wuhan China Star Cptoelectronics Technology Co., Ltd | Narrow frame display panel and display device |
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| CN110767092A (en) * | 2019-11-05 | 2020-02-07 | 京东方科技集团股份有限公司 | Display device |
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| CN113053244A (en) * | 2021-03-11 | 2021-06-29 | 京东方科技集团股份有限公司 | Display module, manufacturing method thereof and back film |
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| WO2024000321A1 (en) * | 2022-06-29 | 2024-01-04 | 京东方科技集团股份有限公司 | Display module and display device |
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| Publication number | Publication date |
|---|---|
| CN116030713A (en) | 2023-04-28 |
| CN115019636B (en) | 2023-08-15 |
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