CN115008777B - Manufacturing method of temperature sensing wide-field probe - Google Patents
Manufacturing method of temperature sensing wide-field probe Download PDFInfo
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- CN115008777B CN115008777B CN202210657566.6A CN202210657566A CN115008777B CN 115008777 B CN115008777 B CN 115008777B CN 202210657566 A CN202210657566 A CN 202210657566A CN 115008777 B CN115008777 B CN 115008777B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C67/00—Shaping techniques not covered by groups B29C39/00 - B29C65/00, B29C70/00 or B29C73/00
- B29C67/24—Shaping techniques not covered by groups B29C39/00 - B29C65/00, B29C70/00 or B29C73/00 characterised by the choice of material
- B29C67/242—Moulding mineral aggregates bonded with resin, e.g. resin concrete
- B29C67/243—Moulding mineral aggregates bonded with resin, e.g. resin concrete for making articles of definite length
Abstract
The invention relates to the technical field of laser wide-field imaging sensing, and discloses a technical scheme for achieving the purposes, which comprises the following steps: a manufacturing method of a temperature sensing wide-field probe comprises the following steps: manufacturing a forming die; diamond particles containing NV color centers are paved in a forming die; adding the substrate raw material which is in the initial fluid state into a forming die to enable the substrate raw material to cover the diamond particles; the substrate raw material is solidified into a solid substrate, and diamond particles are embedded into the lower side surface of the substrate; taking the substrate and the diamond particles out of the forming die after demolding; the manufacturing method provided by the invention can be used for rapidly connecting batches of diamond particles containing NV on the substrate, and can effectively ensure that the detection ends of the diamond particles are positioned in the same detection plane.
Description
Technical Field
The invention relates to the technical field of laser wide-field imaging sensing, in particular to a manufacturing method of a temperature sensing wide-field probe.
Background
In recent years, the integration of electronic circuits has been increasing, and many circuits are assembled in one chip, and the corresponding power consumption has been increasing in proportion to the scale of the circuit, in which case the chip temperature has risen, and the worst case may cause the chip to burn out. In order to avoid this, it is required to detect the chip temperature of the semiconductor device and control the semiconductor device system so as to protect the chip. And the local temperature of the semiconductor chip is also a heavy index, and the local temperature is too high to cause the loss of the functions of the module. How to implement the calculation of the chip temperature and the scanning of the chip temperature gradient in a local area are the problems to be solved.
At present, in order to obtain a sensor with higher sensitivity and measurement accuracy, researchers have shifted the center of gravity to the concept and technology of quantum physics, wherein the research of magnetic field measurement and temperature information detection by using electron spin has been greatly progressed. By utilizing the electron spin paramagnetic property and optical property of the diamond nitrogen vacancy center (NV color center), the ultrahigh-sensitivity magnetic field measurement can be realized under the action of externally applied laser and microwaves. Meanwhile, the NV color center diamond is used as a sensitive element of the temperature sensor, and temperature measurement can be realized by measuring the optical detection magnetic resonance spectrum (ODMR spectrum) of the NV color center under the action of a plurality of physical fields of externally applied laser, microwaves and given magnetic fields. There are two main types of NV color center electron spin currently studied: a single NV color center electron spin and an ensemble NV color center. The NV color center diamond with high concentration and high uniformity is used as a sensitive element, so that the sensor has higher signal-to-noise ratio, higher sensitivity and higher measurement accuracy.
However, at present, the technology of utilizing the NV color center to measure the temperature is a point-to-point measurement mode, namely, the point-to-point measurement is performed on the surface of the chip through the small-particle NV color center diamond, however, the measurement mode is extremely slow and is unfavorable for rapidly obtaining the chip temperature data, so that the research of a large-size NV diamond probe (wide-field probe) is on the rise for improving the detection efficiency, however, the existing manufacturing method of the wide-field probe based on the NV color center is single (can manufacture a large-size diamond film), and the manufacturing of the probe is difficult to meet the requirement of diversity.
Based on the method, the invention designs a manufacturing method of the novel temperature sensing wide-field probe.
Disclosure of Invention
The invention provides a manufacturing method of a temperature sensing wide-field probe, which aims to solve the problems in the background technology.
In order to achieve the above purpose, the present invention provides the following technical solutions:
a manufacturing method of a temperature sensing wide-field probe comprises the following steps:
s1, manufacturing a forming die;
s2, paving diamond particles containing NV color centers in the forming die;
s3, adding the substrate raw material which is in the initial fluid state into a forming die to enable the substrate raw material to cover the diamond particles;
s4, solidifying the substrate raw material to form a solid substrate, and embedding diamond particles into the lower side surface of the substrate;
s5, taking the substrate and the diamond particles out of the forming die after demolding.
Preferably, after the substrate is removed by demolding, an antireflection film is arranged on the upper side surface of the substrate, and a reflective heat-insulating coating layer is arranged on the lower side surface of the substrate.
Preferably, after the reflective heat-insulating coating layer is arranged on the lower side surface of the substrate, the lower side surface of the substrate is wiped by using the grinding platform, so that the reflective heat-insulating coating on the detection end of the diamond particles is erased.
Preferably, diamond particle positioning grooves are uniformly distributed on the bottom surface of the inner cavity of the forming die, the bottom surfaces of all the diamond particle positioning grooves approach to the same horizontal plane, and the error is not more than 0.1mm.
Preferably, the diamond particle positioning groove is in a shape of a circular table, an included angle between a bus of the circular table and the bottom surface is 30-70 degrees, the groove bottom of the diamond particle positioning groove is a narrow surface, and the groove opening is a wide surface.
Preferably, the flatness of the bottom surface of the inner cavity of the forming die is not more than 0.1mm.
Preferably, before the substrate raw material is solidified, impurities or bubbles in the substrate raw material are removed, and then the top surface of the substrate raw material is pressed by a flat plate to be flat.
Preferably, the substrate is a poor conductor of heat and is transparent to light.
Preferably, the substrate is glass, organic glass or epoxy resin.
Preferably, the specific process of step S2 is as follows:
firstly, taking a certain amount of diamond particles containing NV color centers, pouring the diamond particles into ethanol solution, and uniformly distributing the diamond particles in the ethanol by stirring or vibration or combination of the two;
then pouring a certain amount of the solution into a forming die to cover the bottom surface of the die cavity;
finally, after the ethanol is naturally volatilized, the diamond particles are uniformly distributed in the forming die.
Preferably, the specific process of step S3 is as follows:
firstly, a mesh screen cylinder with the size matched with the inner cavity of a forming die is manufactured, and a piston plate is manufactured in a matched mode;
then, the mesh screen cylinder is moved to a position, which is close to the upper part of the diamond particles, in the forming die;
finally, pouring a certain amount of the substrate raw material in a fluid state on the net screen cylinder, and pressing the substrate raw material by moving the piston plate to enable the substrate raw material to slowly pass through meshes on the net screen cylinder and cover diamond particles in the forming die.
Compared with the prior art, the invention has the beneficial effects that: the invention provides a manufacturing method of a temperature sensing wide-field probe, which can be used for rapidly connecting batches of diamond particles containing NV on a substrate and effectively ensuring that the detection ends of the diamond particles are positioned in the same detection plane.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are needed for the description of the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a flow chart of the method of the present invention;
FIG. 2 is a schematic diagram of a temperature sensing wide field probe in accordance with a first embodiment;
FIG. 3 is a schematic view illustrating a state of a mold according to the first embodiment;
FIG. 4 is a schematic diagram showing a state of adding a substrate raw material to a mold in the first embodiment;
FIG. 5 is a schematic diagram illustrating a flattening process performed by a flat plate according to the first embodiment;
FIG. 6 is a schematic diagram showing a state at the time of demolding in the first embodiment;
FIG. 7 is a schematic diagram of a temperature sensing wide field probe in a second embodiment;
fig. 8 is a schematic view showing a state of wiping diamond particles with an abrasive table in the second embodiment;
FIG. 9 is a schematic diagram of a temperature sensing wide field probe in a third embodiment;
FIG. 10 is a schematic view of a substrate in a third embodiment;
FIG. 11 is a schematic diagram of a temperature sensing wide field probe in a fourth embodiment;
fig. 12 is a schematic diagram of the preparation of a temperature sensing wide field probe in embodiment four.
Reference numerals: the device comprises a 1-temperature sensing wide-field probe, a 2-mold, a 3-punching device, a 4-flat plate, a 5-grinding platform, a 6-net screen drum, a 7-piston plate, a 11-substrate, 12-diamond particles and 21-diamond particle positioning grooves.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present disclosure more apparent, the technical solutions of the embodiments of the present disclosure will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present disclosure. It will be apparent that the described embodiments are some, but not all, of the embodiments of the present disclosure. All other embodiments, which can be made by one of ordinary skill in the art without the need for inventive faculty, are within the scope of the present disclosure, based on the described embodiments of the present disclosure.
Example 1
Referring to fig. 2, a temperature sensing wide field probe 1 to be manufactured in an embodiment includes a substrate 11, the substrate 11 is a square planar sheet structure made of a light-transmitting material with low thermal conductivity, which may be glass, organic glass, epoxy resin, etc., in this embodiment, the substrate 11 is made of transparent epoxy resin, one side of the substrate 11 is a micro-particle surface, the other side is an illumination surface, diamond particles 12 (including NV color centers) are distributed on the micro-particle surface at intervals, the diamond particles 12 are 1mm cubic particles, the distance between adjacent diamond particles 12 is 0.5 mm-0.7 mm, and one end of all the diamond particles 12 far away from the light-transmitting planar substrate 11 approaches to the same virtual plane.
Referring to fig. 1, for the above temperature sensing wide field probe, the embodiment discloses a manufacturing method, which specifically comprises the following steps:
s1, manufacturing a forming die:
specifically, referring to fig. 3, a die 2 is manufactured according to the external dimension requirement of the temperature sensing wide-field probe, and diamond particle positioning grooves 21 which are arranged in an array are punched on the bottom surface of an inner cavity of the die 2 through punching equipment 3;
s2, paving diamond particles containing NV color centers in a forming die: specifically, one diamond particle 12 is placed in each diamond particle positioning groove 21;
s3, adding the substrate raw material which is in the initial fluid state into a forming die, and enabling the substrate raw material to cover the diamond particles:
specifically, referring to fig. 4, a liquid epoxy resin and a curing agent are uniformly mixed, a certain amount of mixed solution is poured into a mold 2 to cover diamond particles 12 (note that bubbles in the mixture are cleaned), and when the mixed solution is poured, the mixed solution is poured at one side close to the mold 2, and the flow rate is controlled to be slowly poured, so that the diamond particles 12 are prevented from being displaced due to the impact of the mixture;
the top surface of the mixed solution is pressed by a flat plate 4 (as shown in fig. 5), so that the top surface of the substrate 11 is leveled on one hand, and the mixed solution is more tightly contacted with the diamond particles 12 on the other hand, and is not easy to fall off in the later stage;
s4, the substrate raw material is solidified into a solid substrate, and diamond particles are embedded into the lower side surface of the substrate: the epoxy resin cures over time (1-2 days at room temperature, the diamond particles 12 are fully cured) embedding one side of the solid epoxy resin;
s5, taking the substrate and the diamond particles out of the forming die after demolding, and referring to figure 6.
Furthermore, after the finished product is manufactured, the two-sided flatness is checked, and when the flatness does not reach the standard, the flatness is subjected to flattening treatment such as polishing and the like.
Example two
Referring to fig. 7, the temperature sensing wide field probe to be manufactured in this embodiment has an overall structure similar to that of the temperature sensing wide field probe in the first embodiment, except that an antireflection film is disposed on the illumination surface of the substrate 11, which can effectively improve the light transmittance of the substrate 11 and reduce the reflected light; the reflective heat-insulating coating layer is arranged on the grain surface, and can reflect the trigger light which does not act on the diamond grains 12, namely, the trigger light irradiates the chip, the heating effect of the trigger light on the chip is reduced, and the temperature of the surface of the chip is accurately measured;
based on the design of the antireflection film and the reflective heat-insulating coating layer, the manufacturing method in the embodiment is additionally provided with the following steps:
a. after the substrate 11 is taken out after demolding, a layer of antireflection film is arranged on the upper side surface of the substrate 11 by a sputtering method, and a reflective heat-insulating paint layer is formed by spraying on the lower side surface;
b. after the reflective heat-insulating coating layer is provided on the lower side of the substrate 11, the lower side of the substrate 11 is wiped with the polishing table 5 (or may be wiped with cardboard) so that the reflective heat-insulating coating on the detection end of the diamond particles 12 is wiped off (as shown in fig. 8).
Example III
Referring to fig. 9, a temperature sensing wide field probe to be manufactured in the third embodiment has an overall structure similar to that of the second embodiment, except that protrusions for wrapping the diamond particles 12 are formed around each diamond particle 12 (trigger light enters the substrate 11, part of the trigger light directly irradiates the diamond particles 12, and part of the trigger light irradiates the inclined surfaces of the protrusions around the diamond particles 12, and after being reflected, the trigger light irradiates the diamond particles 12, so that the utilization rate of the trigger light is improved);
based on the design of the convex structure, when the temperature sensing wide-field probe is manufactured, the diamond particle positioning groove 21 is manufactured into a circular truncated cone shape, the included angle alpha between the bus of the circular truncated cone and the bottom surface is about 45 degrees (see fig. 10), the groove bottom of the diamond particle positioning groove 21 is a narrow surface, and the notch is a wide surface; during the manufacturing process, the size of the selected diamond particles 12 is slightly smaller than the narrow surface size of the circular table, the diamond particles 12 are placed in the middle of the diamond particle positioning groove 21, and the substrate raw material automatically fills the periphery of the diamond particles to form a bulge.
Example IV
Referring to fig. 11, a temperature sensing wide field probe according to the fourth embodiment is similar to the temperature sensing wide field probe according to the first embodiment in its overall structure, except that the diamond particles 12 are powder particles with a size of micrometer, and since the diamond particles 12 are very small, a large number of diamond particles 12 may be provided on the fine grain surface of the substrate 11, which increases the sensitivity of temperature sensing.
Referring to fig. 12, for the foregoing differences, the present embodiment provides a method for manufacturing the wide field probe for temperature sensing as described above:
s1, manufacturing a forming die:
specifically, a mold 2 is manufactured according to the external dimension requirement of the temperature sensing wide-field probe (in this example, since diamond particles are very small and numerous, the diamond particle positioning groove 21 is not arranged any more);
s2, paving diamond particles containing NV color centers in a forming die:
specifically, taking a certain amount of diamond particles 12 with the size of 50-100 um, pouring the diamond particles into ethanol, uniformly distributing the diamond particles 12 in the ethanol through stirring, vibration and other technologies, and pouring a certain amount of the solution into a mold 2 (a thin layer is formed and covers the bottom surface of the mold 2); after the ethanol is naturally volatilized, the diamond particles 12 are uniformly distributed in the die 2;
s3, adding the substrate raw material which is in the initial fluid state into a forming die, and enabling the substrate raw material to cover the diamond particles:
firstly, a mesh screen cylinder 6 with the size matched with the inner cavity of a forming die is manufactured, and a piston plate 7 is manufactured in a matched mode;
then, the mesh screen cylinder 6 is moved to a position in the mold 2 close to above the diamond particles 12;
finally, a certain amount of the substrate raw material in a fluid state (a mixed liquid of liquid epoxy resin and a curing agent) is poured onto the mesh screen cylinder 6, and the substrate raw material is pressed by moving the piston plate 7 so as to slowly pass through the mesh openings on the mesh screen cylinder 6 and cover the diamond particles 12 in the molding die.
The screen drum 6 can reduce the speed of the mixed liquid, and can ensure that the mixed liquid impacts the diamond particles 12 uniformly, so that the uniformity of the distribution of the diamond particles 62 is effectively ensured;
the top surface of the mixed solution is pressed by a flat plate 4, so that the top surface of the substrate 11 is leveled on one hand, and on the other hand, the mixture is more tightly contacted with the diamond particles 12, and the situation that the mixture falls off is difficult to occur in the later stage;
s4, the substrate raw material is solidified into a solid substrate, and diamond particles are embedded into the lower side surface of the substrate: the epoxy resin cures over time (1-2 days at room temperature, the diamond particles 12 are fully cured) embedding one side of the solid epoxy resin;
s5, taking the substrate and the diamond particles out of the forming die after demolding.
The treatment methods of the flatness, the antireflection film and the reflective insulation coating in this embodiment are the same as those described above, and will not be repeated here.
In this embodiment, the diamond particle circumference is not provided with protrusions.
In the description of the present specification, the descriptions of the terms "one embodiment," "example," "specific example," and the like, mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present invention. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiments or examples. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
The preferred embodiments of the invention disclosed above are intended only to assist in the explanation of the invention. The preferred embodiments are not intended to be exhaustive or to limit the invention to the precise form disclosed. Obviously, many modifications and variations are possible in light of the above teaching. The embodiments were chosen and described in order to best explain the principles of the invention and the practical application, to thereby enable others skilled in the art to best understand and utilize the invention. The invention is limited only by the claims and the full scope and equivalents thereof.
Claims (9)
1. The manufacturing method of the temperature sensing wide-field probe is characterized by comprising the following steps of:
s1, manufacturing a forming die;
s2, paving diamond particles containing NV color centers in the forming die;
s3, adding the substrate raw material which is in the initial fluid state into a forming die to enable the substrate raw material to cover the diamond particles;
s4, solidifying the substrate raw material to form a solid substrate, and embedding diamond particles into the lower side surface of the substrate;
s5, taking the substrate and the diamond particles out of the forming die after demolding; after the substrate is taken out through demolding, an antireflection film is arranged on the upper side surface of the substrate, and a reflective heat-insulating coating layer is arranged on the lower side surface of the substrate.
2. The method of manufacturing according to claim 1, wherein: after the reflective heat-insulating coating layer is arranged on the lower side surface of the substrate, the lower side surface of the substrate is wiped by using the grinding platform, so that the reflective heat-insulating coating on the detection end of the diamond particles is erased.
3. The method of manufacturing according to claim 1, wherein: the bottom surface of the inner cavity of the forming die is uniformly provided with diamond particle positioning grooves, the bottom surfaces of all the diamond particle positioning grooves are close to the same horizontal plane, and the error is not more than 0.1mm.
4. A method of making as claimed in claim 3, wherein: the diamond particle positioning groove is in a circular truncated cone shape, the included angle between the generatrix and the bottom surface of the circular truncated cone is 30-70 degrees, the groove bottom of the diamond particle positioning groove is a narrow surface, and the groove opening is a wide surface.
5. The method of manufacturing according to claim 1, wherein: the flatness of the bottom surface of the inner cavity of the forming die is not more than 0.1mm.
6. The method of manufacturing according to claim 1, wherein: before the substrate raw material is solidified, impurities or bubbles in the substrate raw material are removed, and then the top surface of the substrate raw material is pressed by a flat plate to be flat.
7. The method of manufacturing according to claim 1, wherein: the substrate is glass, organic glass or epoxy resin.
8. The method of manufacturing according to claim 1, wherein: the specific process of step S2 is as follows: firstly, taking a certain amount of diamond particles containing NV color centers, pouring the diamond particles into ethanol solution, and uniformly distributing the diamond particles in the ethanol by stirring or vibration or combination of the two; then pouring a certain amount of the solution into a forming die to cover the bottom surface of the die cavity; finally, after the ethanol is naturally volatilized, the diamond particles are uniformly distributed in the forming die.
9. The method of manufacturing according to claim 1, wherein: the specific process of step S3 is as follows: firstly, a mesh screen cylinder with the size matched with the inner cavity of a forming die is manufactured, and a piston plate is manufactured in a matched mode; then, the mesh screen cylinder is moved to a position, which is close to the upper part of the diamond particles, in the forming die; finally, pouring a certain amount of the substrate raw material in a fluid state on the net screen cylinder, and pressing the substrate raw material by moving the piston plate to enable the substrate raw material to slowly pass through meshes on the net screen cylinder and cover diamond particles in the forming die.
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