CN115007957B - Liquid bridge constrained electrochemical machining method for complex three-dimensional microstructure array - Google Patents
Liquid bridge constrained electrochemical machining method for complex three-dimensional microstructure array Download PDFInfo
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Abstract
The invention discloses a liquid bridge constraint electrochemical machining method of a complex three-dimensional microstructure array, which comprises the following steps of firstly, machining an insulating lyophobic/super lyophobic layer on the surface of a to-be-machined part to obtain a lyophobic surface; then, locally removing a lyophobic/ultra lyophobic layer on the surface of a workpiece to be processed, and constructing a lyophile pattern array to obtain a lyophobic surface with lyophile patterns; step two, constructing a liquid bridge in a lifting mode or an electrolyte flow mode; and thirdly, using a liquid bridge as a connecting channel, applying current between a workpiece to be machined and the metal plate for electrodeposition or electrolytic machining, and machining the raised microstructure array or the micro-pit array. The invention has great application prospect in the field of reinforced phase-change heat transfer microstructure and MEMS microstructure manufacturing.
Description
Technical Field
The invention belongs to the field of non-traditional processing technology and equipment, relates to a processing method of a complex three-dimensional microstructure array, and particularly relates to a liquid bridge constraint electrochemical processing method of a complex three-dimensional microstructure array.
Background
The microstructure array has important application value in the fields of heat transfer, micro-mechanical systems and the like, and the microstructure array processing method mainly comprises mask electrochemical processing, laser, electric spark, micro-milling and the like. Mask electrochemical machining combines the high dimensional resolution of photolithographic techniques with the high surface quality characteristics of electrochemical machining and is therefore widely used in the fabrication of micro-structured arrays. For example, bai et al fabricated a high 150 μmNi microneedle array structure for drug delivery by means of a mask electroforming technique (Adv mate Res,2011,418-420:1911-1914). The university of Nanjing aviation, university of aviation Zhu Di et al electroformed high aspect ratio microstructure arrays (CIRP Annals,2008, 57:227-230) using a trailing mask template as a mask. In addition, laser, electric spark and micro milling can be used for efficiently processing structural arrays (ACS Applied Materials & Interfaces,2020,12:24419-24431;Nature Physics,2014,10:515-519) of micropillars, micro grooves and the like. The processing method can process various two-dimensional and three-dimensional structures, but the processing of complex three-dimensional (space curved surface) microstructures still faces great challenges, which restricts the development of phase-change heat transfer enhancement technology and micro-mechanical systems to a certain extent, and is a bottleneck problem to be broken through.
Disclosure of Invention
The invention provides a liquid bridge constrained electrochemical machining method of a complex three-dimensional microstructure array, which aims to overcome the defects of the prior art.
In order to achieve the above object, the present invention provides a liquid bridge constrained electrochemical machining method for a complex three-dimensional microstructure array, which has the following characteristics: the method comprises the following steps:
step one, processing an insulating lyophobic/superlyophobic layer on the surface of a workpiece to be processed to obtain a lyophobic surface; then, locally removing a lyophobic/ultra lyophobic layer (exposing a substrate) on the surface of a workpiece to be processed, and constructing a lyophile pattern array to obtain a lyophobic surface with lyophile patterns; the minimum feature size of the lyophilic pattern is 10-1000 μm;
step two, constructing a liquid bridge in a lifting mode or an electrolyte flow mode;
the lifting mode is as follows: the method comprises the steps of horizontally contacting a to-be-machined piece with a lyophobic surface with a lyophobic pattern with the liquid level of electrolyte in an electrolyte tank, and then lifting upwards to enable the lyophobic pattern and the electrolyte to be connected into a liquid bridge, wherein the shape of the liquid bridge can be regulated and controlled by the distance between the surface of the to-be-machined piece and the liquid level of the electrolyte; a metal plate is arranged in the electrolyte and below the liquid level;
the electrolyte flow mode is as follows: placing a to-be-machined part with a lyophobic surface with a lyophile pattern opposite to a metal plate, enabling electrolyte to flow between the to-be-machined part and the metal plate, and enabling part of electrolyte to spontaneously reside and adhere between the lyophile pattern and the metal plate under discontinuous wetting action to form a liquid bridge;
the metal plate is preferably a phosphor copper plate or a red copper plate;
and thirdly, applying voltage between the to-be-machined piece and the metal plate to perform electrodeposition or electrolytic machining by taking the liquid bridge as a connecting channel, and machining the raised microstructure array or the micro-pit array.
Further, the invention provides a liquid bridge constrained electrochemical machining method of a complex three-dimensional microstructure array, which can also have the following characteristics: in the lifting mode of the second step, the distance between the electrolyte liquid level and the metal plate is 0.1-10.0 mm, and the size of the metal plate in the horizontal direction is more than 1 time of the area covered by the liquid bridge.
Further, the invention provides a liquid bridge constrained electrochemical machining method of a complex three-dimensional microstructure array, which can also have the following characteristics: which is a kind ofIn the third step, when the electrodeposition processing is carried out, the electrolyte is CuSO with the concentration of 0.1-5.0 mol/L 4 An aqueous solution; the workpiece to be processed is a cathode (connected with a power supply cathode), and the metal plate is an anode (connected with a power supply anode); the current density is 0.5-10.0A/dm 2 。
Further, the invention provides a liquid bridge constrained electrochemical machining method of a complex three-dimensional microstructure array, which can also have the following characteristics: in the third step, when the electro-deposition processing is carried out, the workpiece to be processed is stationary, the electro-deposition is restrained in the liquid bridge channel, and the catenary-like surface bulge microstructure consistent with the liquid bridge shape is processed.
Further, the invention provides a liquid bridge constrained electrochemical machining method of a complex three-dimensional microstructure array, which can also have the following characteristics: in the third step, when the electro-deposition processing is carried out, the workpiece to be processed is lifted off at a constant speed along the direction vertical to the liquid level, and the super-large height-width ratio structure is processed, wherein the lifting speed of the workpiece to be processed is consistent with the growth speed of the deposition layer.
Further, the invention provides a liquid bridge constrained electrochemical machining method of a complex three-dimensional microstructure array, which can also have the following characteristics: wherein in the third step, during electrolytic processing, the electrolyte is NaCl aqueous solution or NaNO with the mass percent of 0.5-15 percent 3 An aqueous solution; the workpiece to be processed is an anode (connected with the positive electrode of a power supply), the metal plate is a cathode (connected with the negative electrode of the power supply), and the current density is 1-10.0A/dm 2 . During electrolysis, the distance between the anode and the cathode is kept constant, and a concave microstructure array is processed.
Further, the invention provides a liquid bridge constrained electrochemical machining method of a complex three-dimensional microstructure array, which can also have the following characteristics: when the liquid bridge is built in a lifting mode, in the third electrodeposition or electrolytic machining process, the liquid bridge is broken by quickly lifting the workpiece to be machined away along the direction vertical to the liquid level, and after ions are fully diffused and supplemented, the liquid bridge is reconstructed, so that ion updating in the liquid bridge channel is realized.
Further, the invention provides a liquid bridge constrained electrochemical machining method of a complex three-dimensional microstructure array, which can also have the following characteristics: when the second step is to construct a liquid bridge in an electrolyte flow mode, in the third step, in the electro-deposition or electrolytic machining process, the electrolyte flow is repeatedly introduced to break and reconstruct the liquid bridge, so that ion updating in a liquid bridge channel is realized.
Further, the invention provides a liquid bridge constrained electrochemical machining method of a complex three-dimensional microstructure array, which can also have the following characteristics: in the first step, the lyophobic/super lyophobic layer is processed by spraying the lyophobic/super lyophobic layer or chemical vapor deposition.
Further, the invention provides a liquid bridge constrained electrochemical machining method of a complex three-dimensional microstructure array, which can also have the following characteristics: in the first step, the mode of locally removing the lyophobic/superlyophobic layer on the surface of the workpiece to be processed is nanosecond pulse laser ablation or micro milling process.
The invention has the beneficial effects that:
1. the electrochemical reaction of the liquid bridge constraint electrochemical processing technology provided by the invention is constrained in the liquid bridge channel, so that the processing of a complex three-dimensional catenary surface bulge micro-structure array or a micro-pit array consistent with the liquid bridge form can be realized, and the complex three-dimensional micro-structure is difficult to process by the existing technology;
2. when the liquid bridge constraint electrochemical machining process provided by the invention is used for electro-deposition machining, a workpiece to be machined can be lifted off the liquid level at a constant speed along the direction vertical to the liquid level of the electrolyte, so that an ultra-large aspect ratio convex microstructure array is electro-deposited, and the height of a theoretically electro-deposited convex structure is not limited.
3. The invention has simple process and important application value in the aspects of manufacturing the ultra-large aspect ratio complex three-dimensional microstructure array, strengthening phase change heat transfer and the like.
Drawings
FIG. 1 is a process route diagram of a liquid bridge constrained electrochemical machining method for a complex three-dimensional microstructure array provided by the invention;
FIG. 2 is a photograph of a liquid bridge constructed by the liquid bridge constrained electrochemical machining method of the complex three-dimensional microstructure array of example 1;
FIG. 3 is a cloud of potential in the liquid bridge channels of the complex three-dimensional microstructure array of example 1 as electrodeposited by the liquid bridge constrained electrochemical process;
FIG. 4 is a cloud of current densities in liquid bridge channels as electrodeposited by the liquid bridge constrained electrochemical process method for the complex three-dimensional microstructure array of example 1;
FIG. 5 is a process route diagram of the liquid bridge constrained electrochemical machining method of the complex three-dimensional microstructure array of example 2 for electro-deposition machining of ultra-high aspect ratio raised microstructure arrays;
FIG. 6 is a photograph of a test of a high aspect ratio raised microstructure electrodeposited by the liquid bridge constrained electrochemical process method of the complex three-dimensional microstructure array of example 2;
FIG. 7 is a photograph of a test of a circular micro-pit array electrolytically fabricated by the liquid bridge constrained electrochemical fabrication method of the complex three-dimensional microstructure array of example 3;
the marks in the drawings are: 1. a workpiece to be machined; 2. lyophobic/superlyophobic layer; 3. a lyophile pattern; 4. a liquid bridge; 5. an electrolyte; 6. a metal plate; 7. a catenary-like surface bulge microstructure; 8. a micro-pit structure; 9. an electrolyte flow.
Detailed Description
The invention is further illustrated below with reference to specific examples.
Example 1
The embodiment provides a liquid bridge constrained electrochemical machining method of a complex three-dimensional microstructure array, wherein the process route is shown in the left diagram of fig. 1, and the method specifically comprises the following steps:
spraying a Neverwet ultra-lyophobic coating on the surface of a workpiece to be processed to obtain a lyophobic surface; then, locally removing a Neverwet ultra-lyophobic coating on the surface of a workpiece to be processed by adopting a micro-milling process, constructing a 10 multiplied by 10 lyophobic circular array, wherein the circular array has a circular diameter of 0.2mm and a spacing of 1.5mm, and obtaining a lyophobic surface with lyophobic patterns;
step two, constructing a liquid bridge in a lifting mode: the work piece with lyophobic surface with lyophile pattern is horizontally contacted with the electrolyte liquid level in the electrolyte tank and then is lifted upwards, so that the lyophile circle and the electrolyte are connected into a liquid bridge, the height of the liquid bridge is 0.3mm, and the electrolyte is 1m as shown in figure 2ol/L CuSO 4 An aqueous solution;
a phosphor copper plate is horizontally arranged in the electrolyte and at a position 2.0mm below the liquid level, and the dimension of the phosphor copper plate in the horizontal direction is 1 time larger than the area covered by the liquid bridge;
step three, using a liquid bridge as a connecting channel, and applying direct current between a to-be-machined piece and the phosphor copper plate to perform electrodeposition; wherein the workpiece to be processed is a cathode (connected with a power supply negative electrode), the phosphor copper plate is an anode (connected with a power supply positive electrode), and the current density is 1.0A/dm 2 The method comprises the steps of carrying out a first treatment on the surface of the The distance between the cathode and the liquid level of the electrolyte is kept constant during electrodeposition, and a potential cloud image and a current density cloud image in a liquid bridge channel obtained through COMSOL simulation are shown in figures 3 and 4; the cathode is quickly lifted away along the direction vertical to the liquid level every 2 hours, so that a liquid bridge is broken, and after ions are fully diffused and supplemented, the liquid bridge is reconstructed, so that the ions in a liquid bridge channel are updated; electrodeposition is accumulated for 12h, and a catenary-like surface convex microstructure array consistent with the liquid bridge shape can be obtained.
Example 2
The embodiment provides a liquid bridge constrained electrochemical machining method of a complex three-dimensional microstructure array, wherein the process route is shown in fig. 5, and the method specifically comprises the following steps:
spraying a Neverwet ultra-lyophobic coating on the surface of a workpiece to be processed to obtain a lyophobic surface; then, locally removing the Neverwet ultra-lyophobic coating on the surface of the workpiece to be processed by adopting a micro-milling process, and constructing a rectangular lyophile stripe array, wherein the width of the rectangular lyophile stripe is 0.4mm, the length is 2.0mm, and the interval is 2.0mm, so as to obtain a lyophobized surface with lyophobic patterns;
step two, constructing a liquid bridge in a lifting mode: the to-be-processed piece with lyophobic surface with lyophobic pattern is horizontally contacted with the liquid level of electrolyte in the electrolyte tank and then is lifted upwards, so that the lyophobic stripe and the electrolyte are connected into a liquid bridge, the height of the liquid bridge is 0.6mm, and the electrolyte is 1mol/L CuSO 4 An aqueous solution;
a phosphor copper plate is horizontally arranged at a position 3.0mm below the liquid level in the electrolyte, and the dimension of the phosphor copper plate in the horizontal direction is 1 time larger than the area covered by the liquid bridge;
step three, using a liquid bridge as a connecting channel, and applying direct current between a to-be-machined piece and the phosphor copper plate to perform electrodeposition; wherein, to be treatedThe machined part is a cathode (connected with a power supply cathode), the phosphor copper plate is an anode (connected with a power supply anode), and the current density is 1.0A/dm 2 The method comprises the steps of carrying out a first treatment on the surface of the The distance between the cathode and the electrolyte liquid level is increased at a constant speed of 25 mu m/h during electrodeposition, and the continuous electrodeposition can be carried out to obtain a convex microstructure array with an ultra-large aspect ratio, as shown in figure 6; when the raised microstructure grows to a certain height, the distance between the cathode and the electrolyte liquid level is kept unchanged, and a catenary-like surface configuration can be grown on the top of the raised microstructure, so that the catenary-like raised microstructure array with the ultra-large aspect ratio is obtained.
Example 3
The embodiment provides a liquid bridge constrained electrochemical machining method of a complex three-dimensional microstructure array, wherein the process route is shown in the left diagram of fig. 1, and the method specifically comprises the following steps:
step one, performing chemical vapor deposition of a lyophobic coating on the surface of a workpiece to be processed to obtain a lyophobized surface; then, adopting ultraviolet nanosecond pulse laser to localize and remove lyophobic coating on the surface of a workpiece to be processed, constructing a 10 multiplied by 10 lyophile round array, wherein the round array has a diameter of 1.0mm and a spacing of 1.5mm, and obtaining the lyophobic surface with lyophile patterns;
step two, constructing a liquid bridge in a lifting mode: the method comprises the steps of horizontally contacting a to-be-machined piece with a lyophobic surface with a lyophobic pattern with the liquid level of electrolyte in an electrolyte tank, and then lifting upwards to enable a lyophobic circle and the electrolyte to be connected into a liquid bridge, wherein the height of the liquid bridge is 1.5mm, and the electrolyte is 15wt% of NaCl aqueous solution;
a red copper plate is horizontally arranged in the electrolyte and at a position 2.0mm below the liquid level, and the horizontal dimension of the red copper plate is 1 time greater than the area covered by the liquid bridge;
step three, using a liquid bridge as a connecting channel, and applying direct current between a to-be-machined piece and the copper plate for electrolytic machining; wherein the workpiece to be processed is an anode (connected with a power supply anode), the copper plate is a cathode (connected with a power supply cathode), and the current density is 5.0A/dm 2 The method comprises the steps of carrying out a first treatment on the surface of the The distance between the anode and the electrolyte liquid level is kept constant during electrolysis; the primary electrolysis time is 2 seconds, and the anode is quickly lifted away along the direction vertical to the liquid level after each electrolysis, so that a liquid bridge is broken, and after ions are fully diffused and supplemented, the liquid bridge is reconstructed, so that the ion update in a liquid bridge channel is realized; the electrolysis is carried out for 5min to obtain circular micro-pit arrays, such asShown in fig. 7.
Example 4
The embodiment provides a liquid bridge constrained electrochemical machining method of a complex three-dimensional microstructure array, wherein the process route is shown in the right diagram of fig. 1, and the method specifically comprises the following steps:
spraying a Neverwet ultra-lyophobic coating on the surface of a workpiece to be processed to obtain a lyophobic surface; then, locally removing a Neverwet ultra-lyophobic coating on the surface of a workpiece to be processed by adopting a micro-milling process, constructing a 10 multiplied by 10 lyophobic circular array, wherein the circular array has a circular diameter of 0.2mm and a spacing of 1.5mm, and obtaining a lyophobic surface with lyophobic patterns;
step two, constructing a liquid bridge through an electrolyte flow mode: horizontally placing a to-be-machined piece, and horizontally placing a phosphor copper plate on the lyophobic surface of the to-be-machined piece, wherein the lyophobic surface of the to-be-machined piece is provided with a lyophile pattern, and the interval is 0.3mm; allowing electrolyte to flow between the to-be-processed piece and the phosphor copper plate, wherein part of electrolyte spontaneously resides and adheres between the lyophile round and the phosphor copper plate under discontinuous wetting action to form a liquid bridge; the electrolyte is 1.0mol/L CuSO 4 An aqueous solution;
step three, using a liquid bridge as a connecting channel, and applying direct current between a to-be-machined piece and the phosphor copper plate to perform electrodeposition; wherein the workpiece to be processed is a cathode (connected with a power supply negative electrode), the phosphor copper plate is an anode (connected with a power supply positive electrode), and the current density is 3.0A/dm 2 The method comprises the steps of carrying out a first treatment on the surface of the The distance between the cathode and the electrolyte liquid level is kept constant during electrodeposition; electrolyte flow is repeatedly introduced every 10min, so that a liquid bridge is broken and reconstructed, and ion updating in a liquid bridge channel is realized; and electrodepositing for 10 hours to obtain the catenary-like surface convex microstructure array consistent with the liquid bridge shape.
Example 5
The embodiment provides a liquid bridge constrained electrochemical machining method of a complex three-dimensional microstructure array, wherein the process route is shown in the right diagram of fig. 1, and the method specifically comprises the following steps:
spraying a Neverwet ultra-lyophobic coating on the surface of a workpiece to be processed to obtain a lyophobic surface; then, removing a Neverwet ultra-lyophobic coating on the surface of a workpiece to be processed by adopting a carbon dioxide nanosecond pulse laser localization, constructing a 10 multiplied by 10 lyophile square array, wherein the side length of the square pattern is 0.8mm, and the interval is 3.0mm, so as to obtain a lyophobized surface with lyophile patterns;
step two, constructing a liquid bridge through an electrolyte flow mode: horizontally placing a to-be-machined piece, and horizontally placing a red copper plate on the lyophobic surface of the to-be-machined piece, wherein the lyophobic surface of the to-be-machined piece is provided with a lyophile pattern, and the distance between the lyophobic surface and the to-be-machined piece is 1mm; enabling electrolyte to flow between a workpiece to be processed and the copper plate, wherein part of electrolyte spontaneously resides and adheres between the lyophile micro-pits and the copper plate under discontinuous wetting action to form a liquid bridge; 15wt% NaNO electrolyte 3 An aqueous solution;
step three, using a liquid bridge as a connecting channel, and applying direct current between a to-be-machined piece and the phosphor copper plate for electrolytic machining; wherein the workpiece to be processed is an anode (connected with a power supply anode), the copper plate is a cathode (connected with a power supply cathode), and the current density is 5.0A/dm 2 The method comprises the steps of carrying out a first treatment on the surface of the The distance between the anode and the cathode is kept constant during electrolysis; electrolyte flow is repeatedly introduced every 2 seconds, so that a liquid bridge is broken and reconstructed, and ion updating in a liquid bridge channel is realized; and (5) carrying out electrolysis accumulation for 5min to obtain the square micro-pit array.
According to the invention, an insulated lyophobic/superlyophobic layer is prepared on the surface of a workpiece to be processed, a lyophobic/superlyophobic layer is locally removed by using a laser or micro-milling technology, a lyophobic pattern is processed, a lyophobic pattern is utilized to absorb electrolyte to construct a liquid bridge, the liquid bridge is used as an electrochemical reaction and ion transmission channel, the electrochemical reaction is effectively restrained in the liquid bridge, a complex three-dimensional catenary surface bulge microstructure array consistent with the liquid bridge in shape is processed, or a micro-pit array is processed, and the complex three-dimensional microstructure is difficult to be processed by the existing technology. In addition, when liquid bridge constraint electrodeposition is carried out, the workpiece to be processed can be lifted off at a constant speed along the direction vertical to the liquid level of the electrolyte, so that an ultra-large height-width ratio convex microstructure array is electrodeposited, and the height of the electrodeposited convex structure can be continuously increased theoretically without upper limit. The liquid bridge constraint electrochemical machining method of the complex three-dimensional microstructure array has important application value in the aspects of manufacturing the complex three-dimensional catenary surface bulge microstructure array, enhancing phase change heat transfer, manufacturing novel phase change heat radiator and the like.
The foregoing is merely a preferred embodiment of the present invention, and the scope of the present invention is not limited to the above embodiments, but all technical solutions falling under the concept of the present invention fall within the scope of the present invention, and it should be noted that, for those skilled in the art, several modifications and adaptations without departing from the principles of the present invention should and are intended to be regarded as the scope of the present invention.
Claims (10)
1. A liquid bridge constrained electrochemical machining method of a complex three-dimensional microstructure array is characterized by comprising the following steps of:
the method comprises the following steps:
step one, processing an insulating lyophobic/superlyophobic layer on the surface of a workpiece to be processed to obtain a lyophobic surface; then, locally removing a lyophobic/ultra lyophobic layer on the surface of a workpiece to be processed, and constructing a lyophile pattern array to obtain a lyophobic surface with lyophile patterns;
step two, constructing a liquid bridge in a lifting mode or an electrolyte flow mode;
the lifting mode is as follows: the method comprises the steps of horizontally contacting a to-be-machined part with a lyophobic surface with a lyophobic pattern with the liquid level of electrolyte, and then lifting upwards to enable the lyophobic pattern to be connected with the electrolyte into a liquid bridge, wherein the shape of the liquid bridge can be regulated and controlled by the distance between the surface of the to-be-machined part and the liquid level of the electrolyte; a metal plate is arranged in the electrolyte and below the liquid level;
the electrolyte flow mode is as follows: placing a to-be-machined part with a lyophobic surface with a lyophile pattern opposite to a metal plate, enabling electrolyte to flow between the to-be-machined part and the metal plate, and enabling part of electrolyte to spontaneously reside and adhere between the lyophile pattern and the metal plate under discontinuous wetting action to form a liquid bridge;
and thirdly, applying voltage between the to-be-machined piece and the metal plate to perform electrodeposition or electrolytic machining by taking the liquid bridge as a connecting channel, and machining the raised microstructure array or the micro-pit array.
2. The liquid bridge constrained electrochemical machining method of the complex three-dimensional microstructure array of claim 1, wherein:
in the lifting mode of the second step, the distance between the electrolyte liquid level and the metal plate is 0.1-10.0 mm, and the dimension of the metal plate in the horizontal direction is more than 1 time of the area covered by the liquid bridge.
3. The liquid bridge constrained electrochemical machining method of the complex three-dimensional microstructure array of claim 1, wherein:
wherein in the third step, when the electrodeposition processing is carried out, the electrolyte is CuSO with the concentration of 0.1-5.0 mol/L 4 An aqueous solution; the workpiece to be processed is a cathode, and the metal plate is an anode; the current density is 0.5-10.0A/dm 2 。
4. The liquid bridge constrained electrochemical machining method of the complex three-dimensional microstructure array of claim 1, wherein:
in the third step, when the electro-deposition processing is carried out, the workpiece to be processed is stationary, the electro-deposition is restrained in the liquid bridge channel, and the catenary-like surface bulge microstructure consistent with the liquid bridge shape is processed.
5. The liquid bridge constrained electrochemical machining method of the complex three-dimensional microstructure array of claim 1, wherein:
in the third step, when the electro-deposition processing is carried out, the workpiece to be processed is lifted off at a constant speed along the direction vertical to the liquid level, and the super-large height-width ratio structure is processed, wherein the lifting speed of the workpiece to be processed is consistent with the growth speed of the deposition layer.
6. The liquid bridge constrained electrochemical machining method of the complex three-dimensional microstructure array of claim 1, wherein:
wherein in the third step, during electrolytic processing, the electrolyte is NaCl aqueous solution or NaNO with the mass percent of 0.5-15 percent 3 An aqueous solution; the workpiece to be processed is an anode, the metal plate is a cathode, and the current density is 1-10.0A/dm 2 。
7. The liquid bridge constrained electrochemical machining method of the complex three-dimensional microstructure array of claim 1, wherein:
when the liquid bridge is built in a lifting mode, in the third electrodeposition or electrolytic machining process, the liquid bridge is broken by quickly lifting the workpiece to be machined away along the direction vertical to the liquid level, and after ions are fully diffused and supplemented, the liquid bridge is reconstructed, so that ion updating in the liquid bridge channel is realized.
8. The liquid bridge constrained electrochemical machining method of the complex three-dimensional microstructure array of claim 1, wherein:
when the second step is to construct a liquid bridge in an electrolyte flow mode, in the third step, in the electro-deposition or electrolytic machining process, the electrolyte flow is repeatedly introduced to break and reconstruct the liquid bridge, so that ion updating in a liquid bridge channel is realized.
9. The liquid bridge constrained electrochemical machining method of the complex three-dimensional microstructure array of claim 1, wherein:
in the first step, the lyophobic/super lyophobic layer is processed by spraying the lyophobic/super lyophobic layer or chemical vapor deposition.
10. The liquid bridge constrained electrochemical machining method of the complex three-dimensional microstructure array of claim 1, wherein:
in the first step, the mode of locally removing the lyophobic/superlyophobic layer on the surface of the workpiece to be processed is nanosecond pulse laser ablation or micro milling process.
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| CN114131125A (en) * | 2021-11-30 | 2022-03-04 | 清华大学 | Tool electrode with surface hydrophobic structure and preparation method thereof |
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| CN107891198A (en) * | 2017-11-14 | 2018-04-10 | 深圳大学 | The preparation method of metal parts hydrophobic surface |
| CN112658412A (en) * | 2020-11-18 | 2021-04-16 | 南京航空航天大学 | Ultrasonic-assisted electrochemical micro-nano machining method based on electrolyte constraint |
| CN214350095U (en) * | 2021-01-11 | 2021-10-08 | 河南理工大学 | Device for preparing super-hydrophobic micro-texture surface and super-hydrophilic micro-pits on metal |
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