CN115003041A - Circuit board preparation method and circuit board - Google Patents
Circuit board preparation method and circuit board Download PDFInfo
- Publication number
- CN115003041A CN115003041A CN202210659566.XA CN202210659566A CN115003041A CN 115003041 A CN115003041 A CN 115003041A CN 202210659566 A CN202210659566 A CN 202210659566A CN 115003041 A CN115003041 A CN 115003041A
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- China
- Prior art keywords
- insulating layer
- circuit
- conductive layer
- circuit board
- composite substrate
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 238000002360 preparation method Methods 0.000 title abstract description 15
- 239000000758 substrate Substances 0.000 claims abstract description 30
- 239000002131 composite material Substances 0.000 claims abstract description 25
- 239000004033 plastic Substances 0.000 claims abstract description 18
- 238000004519 manufacturing process Methods 0.000 claims abstract description 17
- 239000002184 metal Substances 0.000 claims description 11
- 238000000034 method Methods 0.000 claims description 8
- 230000000153 supplemental effect Effects 0.000 claims description 8
- 239000003292 glue Substances 0.000 claims description 7
- 230000009471 action Effects 0.000 claims description 3
- 239000002985 plastic film Substances 0.000 claims 1
- 238000004080 punching Methods 0.000 description 4
- 238000009413 insulation Methods 0.000 description 3
- 238000005429 filling process Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
Abstract
The invention discloses a circuit board and a preparation method thereof, and relates to the field of circuit boards. The preparation method of the circuit board comprises the following steps: preparing a composite substrate, wherein the composite substrate comprises an insulating layer and a conducting layer covering the insulating layer; and stamping the composite substrate according to a preset circuit track until the insulating layer is subjected to plastic deformation, and breaking the part of the conductive layer corresponding to the circuit track from the rest part and protruding to be separated from the rest part. The circuit board manufacturing method provided by the invention is convenient and quick to operate and high in manufacturing efficiency.
Description
Technical Field
The invention relates to the field of circuit boards, in particular to a circuit board and a preparation method thereof.
Background
At present, when a circuit board is manufactured in industry, a plastic substrate and a plurality of circuits are generally formed respectively, and then the formed circuits are sequentially bonded on the plastic substrate, so that the operation is complex, and the manufacturing efficiency is low.
Disclosure of Invention
The invention aims to provide a circuit board preparation method which has the characteristics of simple preparation process and high preparation efficiency.
Another object of the present invention is to provide a circuit board having features of convenient preparation.
The invention provides a technical scheme that:
a method for preparing a circuit board comprises the following steps:
preparing a composite substrate, wherein the composite substrate comprises an insulating layer and a conducting layer covering the insulating layer;
and stamping the composite substrate according to a preset circuit track until the insulating layer is subjected to plastic deformation, and breaking and protruding the part, corresponding to the circuit track, of the conductive layer until the part and the rest part are separated from contact.
Further, the step of preparing the composite substrate includes:
and laying a metal plate on the plastic plate to form the composite substrate.
Further, after the step of stamping the composite substrate according to the preset circuit trace, the method for manufacturing a circuit board further includes:
and arranging a supplementary insulating layer on the surface of the part, which is not protruded, of the conductive layer, wherein the thickness of the supplementary insulating layer is less than or equal to the protrusion height of the part, corresponding to the circuit trace, of the conductive layer.
Further, the step of providing a supplementary insulating layer on the non-protruding part of the surface of the conductive layer includes:
and performing glue pouring treatment on the part of the surface of the conducting layer which is not raised to form the supplementary insulating layer.
The invention also provides a circuit board which comprises an insulating layer and a conducting layer covered on the insulating layer, wherein a convex stamping part is stamped on one side of the insulating layer, which faces the conducting layer, the part of the conducting layer, which corresponds to the stamping part, is broken under the stamping action and protrudes to form a circuit, and the circuit is not in contact with the rest part of the conducting layer.
Further, the circuit board further comprises a supplementary insulating layer, and the supplementary insulating layer covers the surface of the rest part of the conducting layer except the circuit.
Further, the thickness of the supplementary insulating layer is smaller than or equal to the protruding height of the circuit relative to the conductive layer.
Further, the insulating layer is a plastic plate, and the conductive layer is a metal plate.
Compared with the prior art, the circuit board manufacturing method provided by the invention has the advantages that the whole composite substrate is directly subjected to punch forming, so that the insulating layer is subjected to plastic deformation and is not broken, the part of the conducting layer corresponding to the circuit track is driven to be broken and protruded, and the conducting layer is separated from the rest of the conducting layer to form a circuit, so that the circuit board is obtained. Therefore, the whole preparation process is formed at one time, and the steps of respectively forming the plastic substrate and the circuits and respectively bonding the circuits on the plastic substrate are omitted. Therefore, the circuit board preparation method provided by the invention has the beneficial effects that: convenient and fast operation and high preparation efficiency.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required to be used in the embodiments will be briefly described below. It is appreciated that the following drawings depict only certain embodiments of the invention and are therefore not to be considered limiting of its scope. For a person skilled in the art, it is possible to derive other relevant figures from these figures without inventive effort.
Fig. 1 is a flow chart of a circuit board manufacturing method according to an embodiment of the present invention;
fig. 2 is a cross-sectional view of the composite substrate in step S101 in fig. 1;
fig. 3 is a cross-sectional view of a circuit board provided by an embodiment of the present invention.
Icon: 100-a circuit board; 110-an insulating layer; 111-a punch; 130-a conductive layer; 131-a circuit; 150 — supplemental insulating layer.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention. It is to be understood that the embodiments described are only a few embodiments of the present invention, and not all embodiments. The components of embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the present invention, presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.
In the description of the present invention, it is to be understood that the terms "upper", "lower", "inside", "outside", "left", "right", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, or the orientations or positional relationships that the products of the present invention are conventionally placed in use, or the orientations or positional relationships that are conventionally understood by those skilled in the art, and are used for convenience of describing the present invention and simplifying the description, but do not indicate or imply that the devices or elements referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention.
Furthermore, the terms "first," "second," and the like are used merely to distinguish one description from another, and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it is also to be noted that, unless otherwise explicitly stated or limited, the terms "disposed" and "connected" are to be interpreted broadly, and for example, "connected" may be a fixed connection, a detachable connection, or an integral connection; can be mechanically or electrically connected; the connection may be direct or indirect via an intermediate medium, and may be a communication between the two elements. The specific meanings of the above terms in the present invention can be understood according to specific situations by those of ordinary skill in the art.
The following detailed description of embodiments of the invention refers to the accompanying drawings.
Examples
Referring to fig. 1, fig. 1 is a flow chart of a method for manufacturing a circuit board according to this embodiment, where the method for manufacturing a circuit board includes the following steps:
step S101, a composite substrate is prepared.
Referring to fig. 2, fig. 2 is a cross-sectional view of a composite substrate. The composite substrate includes an insulating layer 110 and a conductive layer 130 covering the insulating layer 110, in this embodiment, the insulating layer 110 is made of plastic, and the conductive layer 130 is made of metal, and the composite substrate is prepared by laying a metal plate on a plastic plate.
The metal plate and the plastic plate can be connected in a bonding mode, and in the embodiment, the thickness of the metal plate is smaller than that of the plastic plate.
Further, the preparation method of the circuit board also comprises the following steps:
step S102, the composite substrate is stamped according to a predetermined circuit trace until the insulating layer 110 is plastically deformed, and the portion of the conductive layer 130 corresponding to the circuit trace is broken from the rest portion and protrudes to be separated from the rest portion.
And stamping one side of the composite substrate where the insulating layer 110 is located according to a preset circuit track by adopting a half-cut stamping process, so that the insulating layer 110 is plastically deformed and protruded towards the direction close to the conductive layer 130. The protruding part of the insulating layer 110 pushes the part of the conductive layer 130 corresponding to the circuit trace and the remaining part of the conductive layer 130 to break and protrude until the part corresponding to the circuit trace is separated from the remaining part, the circuit 131 is molded, and the circuit board 100 is prepared.
It is understood that after the insulating layer 110 is plastically deformed by the punching, the deformed portion is not separated, and the insulating layer 110 still serves as a base of the circuit board 100 in an integral structure.
In practical application, a plurality of circuits 131 need to be punched, when the composite substrate is punched by adopting the punching equipment, the punching die of the punching equipment can be adjusted according to the number and the shape structure of the circuits 131, so that all the circuits 131 are punched at one time, and the processing efficiency is extremely high.
Further, the preparation method of the circuit board can also comprise the following steps:
step S103, a supplemental insulating layer 150 is disposed on the surface of the non-protruding portion of the conductive layer 130, wherein the thickness of the supplemental insulating layer 150 is less than or equal to the protruding height of the portion of the conductive layer 130 corresponding to the circuit trace.
After the circuit 131 is formed, the circuit 131 is not in contact with the rest of the conductive layer 130, and insulation is achieved. However, in the present application, in order to further improve the insulation reliability, a glue filling process is used to fill glue into the non-protruding surface of the conductive layer 130, so as to form the supplementary insulating layer 150 made of insulating glue.
Therefore, according to the circuit board manufacturing method provided by the embodiment, the composite substrate is subjected to integral half-cut punch forming, so that the automatic manufacturing of the circuit board 100 is realized, the operation is convenient and fast, and the manufacturing efficiency is greatly improved.
The present embodiment further provides a circuit board 100, where the circuit board 100 is prepared by the foregoing circuit board preparation method, please refer to fig. 3, and fig. 3 is a cross-sectional view of the circuit board 100.
The circuit board 100 provided by the embodiment includes an insulating layer 110 and a conductive layer 130 covering the insulating layer 110, wherein a protruding stamping part 111 is stamped and formed on one side of the insulating layer 110, which faces the conductive layer 130, a part of the conductive layer 130, which corresponds to the stamping part 111, is broken under the stamping action and protrudes to form a circuit 131, and the circuit 131 is not in contact with the rest of the conductive layer 130.
It is understood that the conductive layer 130 may be broken at a plurality of positions by one stamping to form a plurality of circuits 131, and the shape and structure of the plurality of circuits 131 may be different. After the insulating layer 110 is plastically deformed by the stamping, the deformed portion is not separated, and the insulating layer 110 still has an integral structure as a substrate for carrying the circuit 131.
In this embodiment, the insulating layer 110 is a plastic plate, the conductive layer 130 is a metal plate with conductive property, and the metal plate is covered on the plastic plate and connected by bonding or the like before stamping.
In addition, the wiring board 100 provided by the present embodiment further includes a supplemental insulating layer 150, and the supplemental insulating layer 150 covers the surface of the remaining portion of the conductive layer 130 except for the circuit 131.
In fact, after the stamping is completed, the resulting circuit 131 is not in contact with the remainder of the conductive layer 130, and isolation has been achieved. In this embodiment, the purpose of adding the supplementary insulating layer 150 to the surface of the remaining portion of the conductive layer 130 is to further enhance the insulation reliability.
In this embodiment, a glue filling process is used to fill the surface of the remaining portion of the conductive layer 130, so as to form a supplementary insulating layer 150 composed of insulating glue.
In order to avoid blocking the mounting of the electronic elements on the circuit 131, in the embodiment, the thickness of the supplementary insulating layer 150 is less than or equal to the height of the protrusion of the circuit 131 relative to the conductive layer 130.
In summary, the circuit board 100 provided in this embodiment is formed by stamping the stacked plastic plates and metal plates at one time, and does not need to additionally bond the circuit 131, so that the manufacturing efficiency is high, and the circuit board is suitable for automatic mass production.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (8)
1. A method for manufacturing a circuit board, comprising:
preparing a composite substrate, wherein the composite substrate comprises an insulating layer (110) and a conducting layer (130) covered on the insulating layer (110);
and stamping the composite substrate according to a preset circuit track until the insulating layer (110) is subjected to plastic deformation, and breaking and protruding the part, corresponding to the circuit track, of the conductive layer (130) to be separated from the rest part.
2. The method of manufacturing a wiring board according to claim 1, wherein the step of manufacturing a composite substrate comprises:
and laying a metal plate on the plastic plate to form the composite substrate.
3. The method of manufacturing a wiring board according to claim 1, wherein after the step of stamping the composite substrate with the predetermined circuit traces, the method further comprises:
and arranging a supplementary insulating layer (150) on the surface of the non-raised part of the conductive layer (130), wherein the thickness of the supplementary insulating layer (150) is less than or equal to the raised height of the part of the conductive layer (130) corresponding to the circuit track.
4. The method for preparing a wiring board according to claim 3, wherein the step of providing a supplementary insulating layer (150) on the non-protruding part of the surface of the conductive layer (130) comprises:
and performing glue pouring treatment on the non-raised part of the surface of the conductive layer (130) to form the supplementary insulating layer (150).
5. The circuit board is characterized by comprising an insulating layer (110) and a conductive layer (130) covered on the insulating layer (110), wherein a convex stamping part (111) is stamped and formed on one side, facing the conductive layer (130), of the insulating layer (110), a part, corresponding to the stamping part (111), of the conductive layer (130) is broken under the action of stamping and protrudes to form a circuit (131), and the circuit (131) is not in contact with the rest part of the conductive layer (130).
6. The wiring board of claim 5, wherein the wiring board (100) further comprises a supplemental insulating layer (150), the supplemental insulating layer (150) covering a surface of a remaining portion of the conductive layer (130) other than the circuit (131).
7. The wiring board of claim 6, wherein the thickness of the supplemental insulating layer (150) is less than or equal to the height of the protrusion of the circuit (131) relative to the conductive layer (130).
8. The wiring board of claim 5, wherein the insulating layer (110) is a plastic sheet and the conductive layer (130) is a metal sheet.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210659566.XA CN115003041A (en) | 2022-06-10 | 2022-06-10 | Circuit board preparation method and circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210659566.XA CN115003041A (en) | 2022-06-10 | 2022-06-10 | Circuit board preparation method and circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115003041A true CN115003041A (en) | 2022-09-02 |
Family
ID=83033747
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210659566.XA Pending CN115003041A (en) | 2022-06-10 | 2022-06-10 | Circuit board preparation method and circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN115003041A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0818172A (en) * | 1994-06-27 | 1996-01-19 | Shibaura Eng Works Co Ltd | Electric wiring board and production thereof |
| US20040124533A1 (en) * | 2002-12-31 | 2004-07-01 | Milan Keser | Method of semi-additive plating of imprinted layers and resulting product |
| KR20130072409A (en) * | 2011-12-22 | 2013-07-02 | 엘지이노텍 주식회사 | Printed circuit board and manufacturing method therefor |
| CN108901139A (en) * | 2018-08-16 | 2018-11-27 | 鹤山市得润电子科技有限公司 | A kind of single-sided circuit board and its manufacturing method |
-
2022
- 2022-06-10 CN CN202210659566.XA patent/CN115003041A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0818172A (en) * | 1994-06-27 | 1996-01-19 | Shibaura Eng Works Co Ltd | Electric wiring board and production thereof |
| US20040124533A1 (en) * | 2002-12-31 | 2004-07-01 | Milan Keser | Method of semi-additive plating of imprinted layers and resulting product |
| KR20130072409A (en) * | 2011-12-22 | 2013-07-02 | 엘지이노텍 주식회사 | Printed circuit board and manufacturing method therefor |
| CN108901139A (en) * | 2018-08-16 | 2018-11-27 | 鹤山市得润电子科技有限公司 | A kind of single-sided circuit board and its manufacturing method |
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