CN115003036B - Production method of high-power LED stepped metal electronic circuit board - Google Patents
Production method of high-power LED stepped metal electronic circuit board Download PDFInfo
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- H—ELECTRICITY
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Abstract
The invention discloses a method for producing a high-power LED stepped metal electronic circuit board, which relates to the field related to basic electrical components and obtains drawing information; manufacturing a metal electronic flat plate and a grading step die, and carrying out position positioning through the grading step die and a first step positioning hole on the working surface of the metal electronic flat plate; after positioning is completed, step-by-step manufacturing of the metal electronic flat plate is carried out through the stepped step die, positioning hole positioning information is collected through the positioning device, first deviation information, second deviation information and Nth deviation information are obtained, optimization of the stepped step die is carried out according to the deviation information, and production of the target LED stepped metal electronic circuit board is carried out according to the optimized stepped step die.
Description
Technical Field
The invention relates to the field related to basic electrical components, in particular to a production method of a high-power LED stepped metal electronic circuit board.
Background
The stepped circuit board is an element for fixing the LED and transmitting a signal. Due to the unique advantages of the stepped circuit board in the practical application process, the stepped circuit board is widely applied to a plurality of fields at present. However, due to the special shape and material of the stepped circuit board, the quality control cannot be accurately performed in the production process of the stepped circuit board, which leads to uneven production of the stepped circuit board.
In the prior art, the size control is poor in the process of producing the LED stepped metal electronic circuit board, so that the production precision of the LED stepped metal electronic circuit board is not high.
Disclosure of Invention
The application provides the production method of the high-power LED ladder-shaped metal electronic circuit board, and solves the technical problem that in the process of producing the LED ladder-shaped metal electronic circuit board in the prior art, the size is not well controlled, so that the production precision of the LED ladder-shaped metal electronic circuit board is not high, and the technical effects of optimizing a mold through positioning hole positioning information and improving the production precision of the LED ladder-shaped metal electronic circuit board are achieved.
In view of the above problems, the present application provides a method for producing a stepped metal electronic circuit board for high-power LEDs.
In a first aspect, the present application provides a method for producing a high-power LED step-shaped metal electronic circuit board, where the method is applied to a production system of the metal electronic circuit board, and the production system of the metal electronic circuit board is in communication connection with a positioning device, and the method includes: obtaining drawing information of the target LED stepped metal electronic circuit board; manufacturing a metal electronic panel according to the drawing information; manufacturing a grading step die according to the drawing information, and positioning the metal electronic flat plate through the grading step die and a first step positioning hole on the working surface of the metal electronic flat plate; after the positioning is finished, the first-stage step of the metal electronic flat plate is manufactured through the stepped step die, and the positioning device arranged on the stepped step die is used for collecting the positioning information of a second-stage step positioning hole of the working surface of a second-stage step to obtain first deviation information; manufacturing a second-stage ladder of the metal electronic flat plate through the grading ladder die, and acquiring third-stage positioning hole positioning information of a working surface of a third-stage ladder through the positioning device arranged on the grading ladder die to obtain second deviation information; manufacturing an Nth-level ladder of the metal electronic flat plate through the grading ladder die, and acquiring positioning information of an (N + 1) th ladder positioning hole of a working surface of an (N + 1) th ladder through the positioning device arranged on the grading ladder die to obtain Nth deviation information, wherein N is a positive integer greater than 2; and optimizing the grading step die according to the first deviation information, the second deviation information and the Nth deviation information, and producing the target LED step-shaped metal electronic circuit board according to the optimized grading step die.
On the other hand, the application also provides a production system of the high-power LED ladder-shaped metal electronic circuit board, the system is in communication connection with the positioning device, and the system comprises: the drawing acquisition module is used for acquiring drawing information of the target LED stepped metal electronic circuit board; the manufacturing module is used for manufacturing the metal electronic flat plate according to the drawing information; the positioning module is used for manufacturing a grading ladder die according to the drawing information and positioning the metal electronic flat plate through the grading ladder die and a first ladder positioning hole on the working surface of the metal electronic flat plate; the first deviation analysis module is used for manufacturing a first-stage ladder of the metal electronic flat plate through the grading ladder die after the positioning is finished, and acquiring second-stage ladder positioning hole positioning information of a working surface of a second-stage ladder through the positioning device arranged on the grading ladder die to obtain first deviation information; the second deviation analysis module is used for manufacturing a second-stage step of the metal electronic flat plate through the grading step die and collecting third-stage positioning hole positioning information of a working surface of a third-stage step through the positioning device arranged on the grading step die to obtain second deviation information; the Nth deviation analysis module is used for manufacturing the Nth-level ladder of the metal electronic flat plate through the grading ladder die and collecting the positioning information of the (N + 1) th ladder positioning hole of the working surface of the (N + 1) th ladder through the positioning device arranged on the grading ladder die to obtain the Nth deviation information, wherein N is a positive integer larger than 2; and the optimizing module is used for optimizing the grading step die according to the first deviation information, the second deviation information and the Nth deviation information and producing the target LED step-shaped metal electronic circuit board according to the optimized grading step die.
One or more technical solutions provided in the present application have at least the following technical effects or advantages:
because the drawing information is obtained; manufacturing a metal electronic panel according to the drawing information; manufacturing a grading step die according to the drawing information, and positioning the metal electronic flat plate through the grading step die and a first step positioning hole on the working surface of the metal electronic flat plate; after positioning is completed, manufacturing a first-stage ladder of the metal electronic flat plate through the grading ladder die, and acquiring positioning information of a second-stage ladder positioning hole of a working surface of a second-stage ladder through the positioning device arranged on the grading ladder die to obtain first deviation information; manufacturing a second-stage ladder of the metal electronic flat plate through the grading ladder die, and collecting positioning information of a third-stage positioning hole of a working surface of a third-stage ladder through the positioning device arranged on the grading ladder die to obtain second deviation information; manufacturing an Nth-stage ladder of the metal electronic flat plate through the grading ladder die, and collecting positioning information of an (N + 1) th ladder positioning hole of a working surface of an (N + 1) th ladder through the positioning device arranged on the grading ladder die to obtain Nth deviation information, wherein N is a positive integer greater than 2; and optimizing the grading step die according to the first deviation information, the second deviation information and the Nth deviation information, and producing the target LED step-shaped metal electronic circuit board according to the optimized grading step die. The technical effects of optimizing the die through the positioning information of the positioning holes and improving the production precision of the LED ladder-shaped metal electronic circuit board are achieved.
The foregoing description is only an overview of the technical solutions of the present application, and the present application can be implemented according to the content of the description in order to make the technical means of the present application more clearly understood, and the following detailed description of the present application is given in order to make the above and other objects, features, and advantages of the present application more clearly understandable.
Drawings
FIG. 1 is a schematic flow chart of a method for producing a stepped metal electronic circuit board with a high-power LED according to the present application;
FIG. 2 is a schematic flow diagram illustrating the step-by-step mold optimization of a high-power LED step-like metal electronic circuit board according to the present invention;
FIG. 3 is a schematic flow diagram of a refinement step mold optimization of the production method of the high-power LED step-shaped metal electronic circuit board of the present application;
fig. 4 is a schematic structural diagram of a production system of a high-power LED stepped metal electronic circuit board according to the present application.
Description of the reference numerals: the device comprises a drawing acquisition module 1, a manufacturing module 2, a positioning module 3, a first deviation analysis module 4, a second deviation analysis module 5, an Nth deviation analysis module 6 and an optimization module 7.
Detailed Description
The application provides the production method of the high-power LED ladder-shaped metal electronic circuit board, and solves the technical problem that in the process of producing the LED ladder-shaped metal electronic circuit board in the prior art, the size is not well controlled, so that the production precision of the LED ladder-shaped metal electronic circuit board is not high, and the technical effects of optimizing a mold through positioning hole positioning information and improving the production precision of the LED ladder-shaped metal electronic circuit board are achieved. Embodiments of the present application are described below with reference to the accompanying drawings. It can be known to those skilled in the art that with the development of technology and the emergence of new scenes, the technical solutions provided in the present application are also applicable to similar technical problems.
The terms "comprises," "comprising," and "having," and any variations thereof, herein are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of elements is not necessarily limited to those elements, but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Having thus described the general principles of the present application, various non-limiting embodiments thereof will now be described in detail with reference to the accompanying drawings.
Example one
As shown in fig. 1, the present application provides a method for producing a high-power LED step-shaped metal electronic circuit board, the method is applied to a production system of the metal electronic circuit board, the production system of the metal electronic circuit board is communicatively connected with a positioning device, and the method includes:
step S100: obtaining drawing information of a target LED stepped metal electronic circuit board;
step S200: manufacturing a metal electronic flat plate according to the drawing information;
specifically, the production system of the metal electronic circuit board is a system for carrying out data acquisition, supervision and analysis optimization on the production of the metal electronic circuit board, the positioning device is a device for carrying out positioning identification, can be an image acquisition device and can also be a laser identification positioning device, and the production system of the metal electronic circuit board is in communication connection with the positioning device and can carry out mutual information transmission.
Furthermore, the target LED step-shaped metal electronic circuit board is a circuit board with a plurality of steps, and the drawing information identifies information such as size, shape, structure, technical parameters, and the like of the target LED step-shaped metal electronic circuit board. The target LED ladder-shaped metal electronic circuit board is manufactured by firstly processing a metal electronic flat plate, then opening a positioning hole and an LED fixing hole, and finally punching and deforming. And producing the metal electronic flat plate according to the obtained drawing information. By acquiring the drawing information, data support is provided for accurate production constraint and control in the follow-up process.
Step S300: manufacturing a grading step die according to the drawing information, and positioning the metal electronic flat plate through the grading step die and a first step positioning hole on the working surface of the metal electronic flat plate;
step S400: after positioning is completed, manufacturing a first-stage ladder of the metal electronic flat plate through the grading ladder die, and acquiring positioning information of a second-stage ladder positioning hole of a working surface of a second-stage ladder through the positioning device arranged on the grading ladder die to obtain first deviation information;
specifically, the grading step die is a die for stamping steps step by step, and the die size parameters of each grading step in the grading step die are determined according to the drawing information.
And after the grading step die is manufactured, step-by-step processing of the metal electronic flat plate is performed through the grading step die. Firstly, the grading ladder die and the average electronic flat plate are positioned, and the positioning is realized through the first ladder positioning hole. The metal electronic flat plate is determined to be a plurality of areas, namely a first-stage step working face area, a first-stage step plane area, a second-stage step working face area, a second-stage step plane area …, an Nth-stage step working face area and an Nth-stage step plane area. Through hierarchical ladder mould with the first ladder locating hole of dull and stereotyped first order ladder working face of metal electron carries out dull and stereotyped position location of metal electron, after the location is accomplished, through hierarchical ladder mould carries out dull and stereotyped first order ladder preparation of metal electron, actually passes through the fashioned working face of first order mould of hierarchical ladder mould is first order ladder plane and second grade ladder, works as after the preparation of first order ladder, through set up on the hierarchical ladder mould positioner carries out the second ladder locating hole locating information acquisition of the working face of second grade ladder, obtains first deviation information.
Through carrying out the ladder preparation step by step, reduce because the influence that the metal produced the deformation and cause in the ladder preparation process to through the record positioning deviation, tamped the basis for follow-up accurate analysis and size optimization.
Step S500: manufacturing a second-stage ladder of the metal electronic flat plate through the grading ladder die, and acquiring third-stage positioning hole positioning information of a working surface of a third-stage ladder through the positioning device arranged on the grading ladder die to obtain second deviation information;
step S600: manufacturing an Nth-level ladder of the metal electronic flat plate through the grading ladder die, and acquiring positioning information of an (N + 1) th ladder positioning hole of a working surface of an (N + 1) th ladder through the positioning device arranged on the grading ladder die to obtain Nth deviation information, wherein N is a positive integer greater than 2;
step S700: and optimizing the grading step die according to the first deviation information, the second deviation information and the Nth deviation information, and producing the target LED step-shaped metal electronic circuit board according to the optimized grading step die.
Specifically, after the first-stage ladder is manufactured, the position of a corresponding first-stage hierarchical ladder die when the first-stage ladder is manufactured is kept unchanged, then second-stage ladder manufacturing of the metal electronic flat plate is carried out through a second-stage hierarchical ladder die, positioning information acquisition of a third-stage positioning hole of a working face of a third-stage ladder is carried out through a positioning device arranged on the hierarchical ladder die, and second deviation information is obtained. And analogizing in sequence, manufacturing the Nth-level step of the metal electronic flat plate through the hierarchical step mould, and collecting the positioning information of the (N + 1) th step positioning hole of the working surface of the (N + 1) th step through the positioning device arranged on the hierarchical step mould to obtain the Nth deviation information, wherein N is a positive integer greater than 2. When the metal electronic flat plate is not extended, the positioning holes should be matched with positioning points preset at the positions of the stepped dies, but when the metal electronic flat plate is extended, although the positions of the dies at the formed positions are fixed, the extension still exists, so that the positions of the positioning holes are abnormal, and the adaptive size optimization of the dies is needed. And optimizing the step-by-step mold according to the deviation information of the positions of the positioning holes, namely optimizing the step-by-step mold according to the first deviation information, the second deviation information and the Nth deviation information, and producing the target LED step-shaped metal electronic circuit board according to the optimized step-by-step mold. Through the analysis of the position deviation of the positioning holes, the grading step die is optimized step by step, so that the obtained optimized grading step die is more adaptive to the target LED step-shaped metal electronic circuit board, and the accurate size and precision control of the target LED step-shaped metal electronic circuit board is realized.
Further, as shown in fig. 2, step S700 of the present application further includes:
step S710: judging whether the first deviation information, the second deviation information and the Nth deviation information have equidirectional deviation or not;
step S720: when the homodromous deviation exists, performing adjacent-level deviation calculation to obtain an adjacent-level deviation calculation set;
step S730: and carrying out the hierarchical step mold optimization through a neighboring step deviation calculation set.
Specifically, the equidirectional deviation means that a dimensional deviation in the same direction occurs in the deviation information. Generally, when the stepped die is manufactured without considering metal elongation factors, the manufactured stepped die may cause the same-direction deviation for the metal electronic flat plate punching. And when the homodromous deviation exists, calculating deviation information of adjacent stages, and obtaining a calculation set of the deviation of the adjacent stages according to a calculation result.
Further, the adjacent step deviation calculation refers to the deviation calculation of the positioning information of the adjacent positioning holes, for example, the first step positioning hole is a hole for positioning the metal electronic plate, so that the deviation of the first step positioning hole is 0, the deviation information of the second step positioning hole is recorded as the deviation of the second step positioning hole, and the deviation information of the third step positioning hole is recorded as the deviation information of the third step positioning hole … and the N-th step positioning hole is recorded as the deviation of the N-th step positioning hole. And obtaining a first adjacent deviation according to the second stepped positioning hole deviation and the deviation of the first stepped positioning hole, obtaining a second adjacent deviation according to the third stepped positioning hole deviation and the second stepped positioning hole deviation, and so on, and obtaining an N-1 adjacent deviation according to the Nth stepped positioning hole deviation and the N-1 th stepped positioning hole deviation. Obtaining the neighbor level bias computation set based on the first neighbor bias, the second neighbor bias, and the N-1 neighbor bias.
The adjacent-stage deviation calculation set reflects the analysis result that each next-stage deviation is influenced by the previous-stage deviation, and the hierarchical step mold optimization can be completed according to the adjacent-stage deviation calculation set through the step-by-step hierarchical optimization, so that a more accurate step mold is obtained, and the production of the step-shaped metal electronic circuit board with accurate precision control is realized.
Further, as shown in fig. 3, step S730 of the present application further includes:
step S731: obtaining a first adjacent stage deviation increment value in the adjacent stage deviation calculation set;
step S732: performing mold optimization of the stepped mold corresponding to the first-stage stepped position through the first adjacent-stage deviation growth value, and performing the first-stage stepped manufacture of the metal electronic flat plate based on the stepped mold optimizing the first-stage stepped position;
step S733: after the manufacturing is finished, acquiring second-step positioning hole positioning information of a working surface of a second-step through the positioning device arranged on the stepped step die to obtain first optimized deviation information;
step S734: judging whether the first optimization deviation information meets an expected constraint deviation threshold value;
step S735: and when the first optimization deviation information meets the expected constraint deviation threshold, optimizing the grading step die step by step, and producing the target LED step-shaped metal electronic circuit board according to the optimized grading step die.
Specifically, the step-by-step optimization of the mold is performed through the adjacent step deviation calculation set, first-step mold parameter optimization is performed, that is, a first adjacent step deviation increase value, namely, a first adjacent deviation, is obtained through the adjacent step deviation calculation set, the step-by-step mold optimization corresponding to the first step position is performed through the first adjacent step deviation increase value, the first step manufacturing of the metal electronic flat plate is performed through the step-by-step mold at the optimized first step position, and after the first step manufacturing is completed, positioning hole positioning information acquisition of the working surface of the second step is performed through the positioning device, so that positioning accuracy deviation information of the second step positioning hole after optimization, namely, the first optimization deviation information, is obtained.
Judging whether the first optimization deviation information meets an expected constraint deviation threshold, and if not, indicating that the first-stage step position mold still has a large error, so that the mold optimization of the first-stage step position is required to be further carried out according to the deviation size until the expected constraint threshold is met; when the first optimization deviation information meets the expected constraint deviation threshold, the mold optimization of the first-stage step position at the moment is completed, at the moment, the mold size optimization corresponding to the second-stage step position is performed according to the second adjacent-stage deviation increment value, and because the mold optimization of the first-stage step position is completed, the second-stage step positioning hole deviation generated by the second-stage step position mold is eliminated according to the first-stage step position influence value, so that the mold optimization corresponding to the second-stage step position is performed only according to the second adjacent deviation, and by analogy, the mold optimization of all step positions is performed step by step until the mold optimization is completed. Through optimizing the mould step by step, reduced the error between the mould relevance, avoided because the relevant factor leads to the unusual problem of mould optimization size, through the mould optimization of control variable step by step, and then make the mould size precision that obtains match the demand more, and then the LED echelonment metal electronic circuit board that the production precision is higher.
Further, the production system of metal electronic circuit board still with size survey device communication connection, this application still includes:
step S810: carrying out size measurement on the metal electronic flat plate through the size measurement device to obtain size deviation information;
step S820: carrying out step machining on the metal electronic flat plate through the optimized grading step die to obtain a first machining result;
step S830: carrying out size measurement on the first machining result through the size measuring device, and obtaining influence size deviation information according to the measurement result and the size deviation information;
step S840: and carrying out production management on the target LED stepped metal electronic circuit board according to the information of the influence size deviation.
Specifically, after the hierarchical step mold is optimized, in order to enable the produced size to be more accurate and adaptive, size information of each metal electronic flat plate is acquired, and the size information and subsequent finished products are subjected to data unique identification and then stored. Carrying out step processing on the metal electronic flat plate through the optimized hierarchical step die to obtain a first processing result, carrying out size acquisition on the first processing result, constructing a size acquisition set according to the size acquisition result, carrying out production evaluation on the target LED step-shaped metal electronic circuit board through the size acquisition set, carrying out influence value evaluation on the size deviation information according to the size evaluation result, wherein the larger the influence value evaluation is, the larger the influence of the corresponding size position of the metal electronic flat plate on the size of a final product is, and carrying out subsequent production management on the target LED step-shaped metal electronic circuit board according to the obtained influence size deviation information of the metal electronic flat plate. Through analysis and constraint of the influence size of the metal electronic board, support is provided for obtaining more accurate precision control of the target LED stepped metal electronic circuit board subsequently.
Further, step S840 of the present application further includes:
step S841: obtaining a size constraint threshold;
step S842: judging whether the influence size deviation information meets the size constraint threshold;
step S843: when the influence size deviation information does not meet the size constraint threshold, performing size influence analysis on the size deviation information to obtain a first correlation size;
step S844: adding the first associated size to a dimensional constraint interval of the metal electronic plate.
Further, step S840 of the present application further includes:
step S845: obtaining a second correlation size according to the size influence analysis result;
step S846: constructing an incidence relation between the first incidence size and the second incidence size, and forming a combined size constraint interval according to the incidence relation;
step S847: and carrying out production size constraint on the metal electronic flat plate through the combined size constraint interval.
Specifically, the size constraint threshold is a threshold for further constraining and determining a deviation affecting the size deviation information, and the size constraint threshold may be preset by large data or may be manually adjusted again. And judging whether the obtained information of the deviation of each influence size can meet the size constraint threshold, and if so, indicating that the size constraint value at the moment is in an expected range, namely that the information of the deviation of the size corresponding to the metal electronic flat plate can produce the target LED step-shaped metal electronic circuit board meeting the preset requirement, and not processing at the moment.
When the obtained information of the deviation of each influence size does not meet the size constraint threshold, the fact that the size deviation of the associated metal electronic flat plate has a large influence is shown at the moment, sequencing is carried out according to the influence value of each deviation size, the maximum size of the influence value is used as a first associated size, and the first associated size is added to the production constraint size of the metal electronic flat plate, so that the production constraint on the metal electronic flat plate is more accurate, and the production precision of the subsequent target LED ladder-shaped metal electronic circuit board is further ensured.
Furthermore, in order to enable evaluation and analysis of the influence sizes to be more accurate, a second correlation size is obtained according to the sequencing result of the influence values of the deviation sizes, wherein the second correlation size is the second size of the influence value sequencing, and the correlation relationship between the first correlation size and the second correlation size is established, that is, only when the first correlation size and the second correlation size simultaneously meet the current abnormal value, the subsequent target LED ladder-shaped metal electronic circuit board is considered to be abnormal. Through the construction of the incidence relation between the first incidence size and the second incidence size, the constraint of the target LED ladder-shaped metal electronic circuit board is more accurate, and the problem that the production cost is increased due to the fact that size control is too strict is solved.
Further, this application still includes:
step S910: obtaining installation feedback evaluation information of the target LED stepped metal electronic circuit board;
step S920: performing identification positioning on the target LED stepped metal electronic circuit board according to the installation feedback evaluation information to obtain an identification positioning result;
step S930: acquiring the size of the corresponding metal electronic flat plate according to the identification positioning result to obtain a size set;
step S940: and performing K-means clustering on the size set, and generating a size optimization interval of the metal electronic plate according to a clustering result.
Specifically, production data of each target LED stepped metal electronic circuit board is recorded and identified, namely each target LED stepped metal electronic circuit board has a unique identity ID, and the installation feedback identification is adapted to the installation of each target LED stepped metal electronic circuit board after the target LED stepped metal electronic circuit board is distributed to an installation manufacturer. The adaptive feedback information can be obtained through feedback investigation, according to the installation feedback evaluation information, the identification positioning of the target LED ladder-shaped metal electronic circuit board is carried out according to the ID identification to obtain an identification positioning result, the size calling is carried out based on the positioning identification result, the called size is still the size of the corresponding metal electronic flat plate, the size with good feedback is subjected to K-mean clustering, the clustering result is used as the size optimization interval of the metal electronic flat plate produced subsequently, the size with poor feedback is subjected to K-mean clustering in the same way, and the clustering result is used as the size abnormity result. And carrying out size management on the metal electronic plate in the subsequent production process through the size optimization interval and the size abnormity result.
Example two
Based on the same inventive concept as the method for producing the high-power LED stepped metal electronic circuit board in the previous embodiment, the invention also provides a production system of the high-power LED stepped metal electronic circuit board, as shown in FIG. 4, the system is in communication connection with a positioning device, and the system comprises:
the drawing acquisition module 1 is used for acquiring drawing information of the target LED stepped metal electronic circuit board;
the manufacturing module 2 is used for manufacturing the metal electronic flat plate according to the drawing information;
the positioning module 3 is used for manufacturing a grading step die according to the drawing information and positioning the metal electronic flat plate through the grading step die and a first step positioning hole on the working surface of the metal electronic flat plate;
the first deviation analysis module 4 is used for manufacturing a first-stage step of the metal electronic flat plate through the stepped step die after positioning is completed, and acquiring positioning information of a second-stage step positioning hole of a working surface of a second-stage step through the positioning device arranged on the stepped step die to obtain first deviation information;
the second deviation analysis module 5 is used for manufacturing a second-stage step of the metal electronic flat plate through the stepped step die, and acquiring third-step positioning hole positioning information of a working surface of a third-stage step through the positioning device arranged on the stepped step die to obtain second deviation information;
the nth deviation analysis module 6 is configured to perform nth step manufacturing of the metal electronic flat plate through the stepped step die, and perform N +1 th step positioning hole positioning information acquisition of a working surface of an N +1 th step through the positioning device arranged on the stepped step die to obtain nth deviation information, where N is a positive integer greater than 2;
the optimizing module 7 is used for optimizing the grading step die according to the first deviation information, the second deviation information and the Nth deviation information, and producing the target LED step-shaped metal electronic circuit board according to the optimized grading step die;
further, the optimization module 7 is further configured to:
judging whether the first deviation information, the second deviation information and the Nth deviation information have equidirectional deviation or not;
when the homodromous deviation exists, performing adjacent-level deviation calculation to obtain an adjacent-level deviation calculation set;
and carrying out the hierarchical step mold optimization through the adjacent level deviation calculation set.
Further, the optimization module 7 is further configured to:
obtaining a first adjacent stage deviation increment value in the adjacent stage deviation calculation set;
performing mold optimization of the stepped mold corresponding to the first-stage stepped position through the first adjacent-stage deviation growth value, and performing the first-stage stepped manufacture of the metal electronic flat plate based on the stepped mold optimizing the first-stage stepped position;
after the manufacturing is finished, collecting second-step positioning hole positioning information of the working surface of a second-step through the positioning device arranged on the stepped step die to obtain first optimization deviation information;
judging whether the first optimization deviation information meets an expected constraint deviation threshold value;
and when the first optimization deviation information meets the expected constraint deviation threshold, the hierarchical stepped die is optimized step by step, and the hierarchical stepped die is optimized according to the optimized hierarchical stepped die.
Further, the production system of the metal electronic circuit board is also in communication connection with a dimension measuring device, and the system further comprises a dimension management module, wherein the dimension management module is used for:
carrying out size measurement on the metal electronic flat plate through the size measurement device to obtain size deviation information;
carrying out step machining on the metal electronic flat plate through the optimized grading step die to obtain a first machining result;
carrying out size measurement on the first machining result through the size measuring device, and obtaining influence size deviation information according to the measurement result and the size deviation information;
and carrying out production management on the target LED stepped metal electronic circuit board according to the information of the influence size deviation.
Further, the size management module is further configured to:
obtaining a size constraint threshold;
judging whether the influence size deviation information meets the size constraint threshold;
when the influence size deviation information does not meet the size constraint threshold, performing size influence analysis on the size deviation information to obtain a first correlation size;
adding the first associated size to a dimensional constraint interval of the metal electronic plate.
Further, the size management module is further configured to:
obtaining a second correlation size according to the size influence analysis result;
constructing an incidence relation between the first incidence size and the second incidence size, and forming a combined size constraint interval according to the incidence relation;
and carrying out production size constraint on the metal electronic flat plate through the combined size constraint interval.
Further, the size management module is further configured to:
obtaining installation feedback evaluation information of the target LED stepped metal electronic circuit board;
performing identification positioning of the target LED stepped metal electronic circuit board according to the installation feedback evaluation information to obtain an identification positioning result;
collecting the size of the corresponding metal electronic flat plate according to the identification positioning result to obtain a size set;
and performing K-means clustering on the size set, and generating a size optimization interval of the metal electronic plate according to a clustering result.
Various changes and specific examples of the method for producing a high-power LED stepped metal electronic circuit board in the first embodiment of fig. 1 are also applicable to the system for producing a high-power LED stepped metal electronic circuit board in the present embodiment, and through the foregoing detailed description of the method for producing a high-power LED stepped metal electronic circuit board, those skilled in the art can clearly know the method for implementing the system for producing a high-power LED stepped metal electronic circuit board in the present embodiment, so for the brevity of the description, detailed description is not repeated here.
The above description is only a preferred embodiment of the present disclosure, and is not intended to limit the scope of the present disclosure. Any modification, equivalent replacement, improvement and the like made within the spirit and principle of the present application shall be included in the protection scope of the present application.
Claims (8)
1. A method for producing a high-power LED step-shaped metal electronic circuit board is characterized in that the method is applied to a production system of the metal electronic circuit board, the production system of the metal electronic circuit board is in communication connection with a positioning device, and the method comprises the following steps:
obtaining drawing information of a target LED stepped metal electronic circuit board;
manufacturing a metal electronic flat plate according to the drawing information;
manufacturing a grading step die according to the drawing information, and positioning the metal electronic flat plate through the grading step die and a first step positioning hole on the working surface of the metal electronic flat plate;
after positioning is completed, manufacturing a first-stage ladder of the metal electronic flat plate through the grading ladder die, and acquiring positioning information of a second-stage ladder positioning hole of a working surface of a second-stage ladder through the positioning device arranged on the grading ladder die to obtain first deviation information;
manufacturing a second-stage ladder of the metal electronic flat plate through the grading ladder die, and collecting positioning information of a third-stage positioning hole of a working surface of a third-stage ladder through the positioning device arranged on the grading ladder die to obtain second deviation information;
manufacturing an Nth-level ladder of the metal electronic flat plate through the grading ladder die, and acquiring positioning information of an (N + 1) th ladder positioning hole of a working surface of an (N + 1) th ladder through the positioning device arranged on the grading ladder die to obtain Nth deviation information, wherein N is a positive integer greater than 2;
and optimizing the grading step die according to the first deviation information, the second deviation information and the Nth deviation information, and producing the target LED step-shaped metal electronic circuit board according to the optimized grading step die.
2. The method of claim 1, wherein the method further comprises:
judging whether the first deviation information, the second deviation information and the Nth deviation information have homodromous deviation or not;
when the homodromous deviation exists, performing adjacent-level deviation calculation to obtain an adjacent-level deviation calculation set;
and carrying out the hierarchical step mold optimization through the adjacent-level deviation calculation set.
3. The method of claim 2, wherein the method further comprises:
obtaining a first adjacent stage deviation increment value in the adjacent stage deviation calculation set;
performing the hierarchical step mold corresponding to the first-stage step position mold optimization through the first adjacent-stage deviation growth value, and performing the first-stage step manufacturing of the metal electronic flat plate based on the hierarchical step mold optimizing the first-stage step position;
after the manufacturing is finished, acquiring second-step positioning hole positioning information of a working surface of a second-step through the positioning device arranged on the stepped step die to obtain first optimized deviation information;
judging whether the first optimization deviation information meets an expected constraint deviation threshold value;
and when the first optimization deviation information meets the expected constraint deviation threshold, optimizing the grading step die step by step, and producing the target LED step-shaped metal electronic circuit board according to the optimized grading step die.
4. The method of claim 1, wherein the metallic electronic circuit board production system is further communicatively coupled to a sizing device, the method further comprising:
carrying out size measurement on the metal electronic flat plate through the size measurement device to obtain size deviation information;
carrying out step machining on the metal electronic flat plate through the optimized grading step die to obtain a first machining result;
carrying out size measurement on the first machining result through the size measuring device, and obtaining influence size deviation information according to a measurement result and the size deviation information;
and carrying out production management on the target LED stepped metal electronic circuit board according to the information of the influence size deviation.
5. The method of claim 4, wherein the method further comprises:
obtaining a size constraint threshold;
judging whether the influence size deviation information meets the size constraint threshold;
when the influence size deviation information does not meet the size constraint threshold, carrying out size influence analysis on the size deviation information to obtain a first correlation size;
adding the first associated size to a dimensional constraint interval of the metal electronic plate.
6. The method of claim 5, wherein the method further comprises:
obtaining a second correlation size according to the size influence analysis result;
constructing an incidence relation between the first incidence size and the second incidence size, and forming a combined size constraint interval according to the incidence relation;
and carrying out production size constraint on the metal electronic flat plate through the combined size constraint interval.
7. The method of claim 1, wherein the method further comprises:
obtaining installation feedback evaluation information of the target LED stepped metal electronic circuit board;
performing identification positioning on the target LED stepped metal electronic circuit board according to the installation feedback evaluation information to obtain an identification positioning result;
collecting the size of the corresponding metal electronic flat plate according to the identification positioning result to obtain a size set;
and performing K-means clustering on the size set, and generating a size optimization interval of the metal electronic plate according to a clustering result.
8. A production system of a high-power LED stepped metal electronic circuit board is characterized in that the system is in communication connection with a positioning device, and the system comprises:
the drawing acquisition module is used for acquiring drawing information of the target LED stepped metal electronic circuit board;
the manufacturing module is used for manufacturing the metal electronic flat plate according to the drawing information;
the positioning module is used for manufacturing a grading ladder die according to the drawing information and positioning the metal electronic flat plate through the grading ladder die and a first ladder positioning hole on the working surface of the metal electronic flat plate;
the first deviation analysis module is used for manufacturing a first-stage ladder of the metal electronic flat plate through the grading ladder die after positioning is finished, and collecting positioning information of a second-stage ladder positioning hole of a working face of a second-stage ladder through the positioning device arranged on the grading ladder die to obtain first deviation information;
the second deviation analysis module is used for manufacturing a second-stage step of the metal electronic flat plate through the grading step die and collecting third-stage positioning hole positioning information of a working surface of a third-stage step through the positioning device arranged on the grading step die to obtain second deviation information;
the Nth deviation analysis module is used for manufacturing the Nth-level ladder of the metal electronic flat plate through the grading ladder die and collecting the positioning information of the (N + 1) th ladder positioning hole of the working surface of the (N + 1) th ladder through the positioning device arranged on the grading ladder die to obtain the Nth deviation information, wherein N is a positive integer larger than 2;
and the optimizing module is used for optimizing the grading step die according to the first deviation information, the second deviation information and the Nth deviation information and producing the target LED step-shaped metal electronic circuit board according to the optimized grading step die.
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