CN114989472A - Application of conductive ink in reducing resistivity of flexible polar plate after being bent for multiple times - Google Patents

Application of conductive ink in reducing resistivity of flexible polar plate after being bent for multiple times Download PDF

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CN114989472A
CN114989472A CN202110232113.4A CN202110232113A CN114989472A CN 114989472 A CN114989472 A CN 114989472A CN 202110232113 A CN202110232113 A CN 202110232113A CN 114989472 A CN114989472 A CN 114989472A
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resistivity
flexible
conductive ink
polar plate
solvent
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CN114989472B (en
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李伟
陈民芳
孙士昭
徐晓雪
郭兴祥
叶雨昊
袁虹娇
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Tianjin University of Technology
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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/04Coating
    • C08J7/044Forming conductive coatings; Forming coatings having anti-static properties
    • DTEXTILES; PAPER
    • D21PAPER-MAKING; PRODUCTION OF CELLULOSE
    • D21HPULP COMPOSITIONS; PREPARATION THEREOF NOT COVERED BY SUBCLASSES D21C OR D21D; IMPREGNATING OR COATING OF PAPER; TREATMENT OF FINISHED PAPER NOT COVERED BY CLASS B31 OR SUBCLASS D21G; PAPER NOT OTHERWISE PROVIDED FOR
    • D21H19/00Coated paper; Coating material
    • D21H19/36Coatings with pigments
    • D21H19/38Coatings with pigments characterised by the pigments
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2301/00Characterised by the use of cellulose, modified cellulose or cellulose derivatives
    • C08J2301/08Cellulose derivatives
    • C08J2301/26Cellulose ethers
    • C08J2301/28Alkyl ethers
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2367/00Characterised by the use of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Derivatives of such polymers
    • C08J2367/02Polyesters derived from dicarboxylic acids and dihydroxy compounds
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2379/00Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
    • C08J2379/04Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08J2379/08Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2383/00Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Derivatives of such polymers
    • C08J2383/04Polysiloxanes
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product

Abstract

The invention discloses an application of conductive ink in reducing resistivity of a flexible polar plate after being bent for many times, which is operated according to a mode 1 or a mode 2: mode 1, the following steps are repeated a plurality of times: coating conductive ink on the flexible polar plate in a deformed state, sintering, and spraying a solvent; mode 2, coating conductive ink on the flexible polar plate in the deformed state, and repeating the following steps for multiple times: sintering and spraying solvent. The application of the invention can be carried out in the air, the resistivity after sintering in the air is only 1/10-1/4 of the traditional straight preparation and sintering treatment, and the resistivity can be kept unchanged under the high-frequency bending and twisting state, thus having the application prospect of realizing large-scale production.

Description

Application of conductive ink in reducing resistivity of flexible polar plate after being bent for multiple times
Technical Field
The invention belongs to the technical field of preparation of flexible conductive polar plates, and particularly relates to application of conductive ink in reducing resistivity of a flexible polar plate after being bent for many times.
Background
The conductive ink is a key material for sustainable development of the printed electronic technology and the electronic industry, and because the conductive ink is a key material for determining conductivity, along with the social and economic development trends of green production, energy conservation and emission reduction, various conductive inks are printed on various substrates to prepare green, flexible and low-cost electronic products or devices, such as electronic newspapers (EP), curved display screens, wireless intelligent identification electronic tags (RFID), Printed Circuit Boards (PCB), solar cell panels (TFSB), sensors and the like, and the conductive ink is bound to become a mainstream trend.
The conductive ink mainly comprises conductive filler, mixed solvent, connecting material and auxiliary agent. The conductive ink contains metal nanoparticles such as gold, silver, copper or nickel or non-metal fillers (carbon powder, polymers such as graphene, carbon nanotube and polyaniline are the key of ink quality) which play a role in conducting electricity, and the conductive ink is the only source of conductivity of a printed wire or a conductive pattern. In the case of metal nanoparticles, the surface is usually coated to improve the oxidation resistance, and the transition coating treatment hinders the formation of conductive paths after subsequent sintering, and directly affects the conductivity of the pattern. In the case of the non-metallic filler, the additive, binder and the like added in the ink can also form a transitional coating layer to influence the conductivity of the subsequent sintering pattern. The mixed solvent in the conductive ink determines the adhesion state of the ink and the polar plate and influences the quality of the resolution of the conductive pattern. Therefore, the key factors affecting the conductivity of the ink mainly include the properties of the material itself, the surface coating layer of the material, the ink solvent, the density and the like, and the properties of the material itself are not changeable, for example, the conductivity of the metal base is generally higher than that of the nonmetal base. In order to improve the conductivity of the sintered conductive pattern, the coating layer on the surface of the conductive material, the printing ink solvent, the density of the conductive pattern and the like can be regulated and controlled.
At present, a lot of research reports on conductive ink exist, and companies such as the U.S. Flint ink company and the Korean ABC nanotechnology develop commercially available nano silver conductive ink, but the conductive ink is expensive in production cost and limited in wide application. Only colleges and universities, scientific research institutions and the like are researched in China, but the research is still in the starting stage, and the current bottlenecks are that the resistivity of the prepared conductive pattern is generally higher, the conductive pattern is often protected by inert atmosphere, the resistivity is obviously increased after the conductive pattern is bent for many times in the using process, and more micro cracks appear on the conductive pattern, so that the application of the conductive pattern in the field of flexible electronic devices is greatly limited.
Disclosure of Invention
Aiming at the defects of the prior art, the invention aims to provide the application of the conductive ink in reducing the resistivity of the flexible polar plate after being bent for many times.
The purpose of the invention is realized by the following technical scheme.
The application of the conductive ink in reducing the resistivity of the flexible polar plate after being bent for multiple times is carried out according to a mode 1 or a mode 2:
mode 1, the following steps are repeated a plurality of times: coating conductive ink on the flexible polar plate in a deformed state, sintering, and spraying a solvent;
mode 2, coating conductive ink on the flexible polar plate in the deformed state, and repeating the following steps for multiple times: sintering and spraying solvent.
In the above technical solution, the flexible polar plate is photographic paper, a Polydimethylsiloxane (PDMS) film, a polyethylene terephthalate (PET) film, a polyvinylidene fluoride (PVDF) film, a polyimide film (Kapton) film, or an ethyl cellulose film.
In the above technical scheme, the coating mode is spraying or brushing.
In the technical scheme, the thickness of the conductive ink coating is 10-300 mu m.
In the above technical scheme, the conductive material in the conductive ink is one or a mixture of more of silver powder, copper powder, nickel powder, carbon powder, iron powder, graphene, carbon nanotube and gold powder.
In the above technical solution, the deformation state is a shape when the resistivity of the flexible polar plate is to be reduced after being bent.
In the technical scheme, after bending, the flexible polar plate is bent or twisted when the resistivity is to be reduced, wherein when the resistivity is to be reduced, the bending radius of the deformed state is 1-5mm larger than that of the shape when the resistivity is to be reduced; when the shape with the electrical resistivity to be reduced is a twist, the twist angle of the deformed state is 1-15 degrees larger than that of the shape with the electrical resistivity to be reduced, and the bending radius angle of the deformed state is 1-10mm larger than that of the shape with the electrical resistivity to be reduced.
In the above technical scheme, the rolling is performed after the operation according to the mode 1 or the mode 2.
In the technical scheme, the repetition of the following steps is 1-20 times.
In the technical scheme, the sintering temperature is 25-100 ℃, and the sintering time is 1-10 min.
In the technical scheme, the solvent is a mixture of water and a volatile solvent, and the volatile solvent is one or more of alcohol, acetone, diethyl ether, chloroform, vinyl acrylate, tetrafluoro-hydrogen pyran and ascorbic acid.
In the technical scheme, the concentration of the volatile solvent in the solvent is 0.1-1.0 g/mL.
In the technical scheme, the rolling strength is 0.5-50MPa, the rolling times are 1-3 times, and the time for rolling each time is 2-10 min.
Compared with the prior art, the invention has the following beneficial effects:
1) the application of the invention can be carried out in the air, the resistivity after sintering in the air is only 1/10-1/4 of the traditional straight preparation and sintering treatment, and the resistivity can be kept unchanged in the high-frequency bending and twisting state, thus having the application prospect of realizing large-scale production.
2) The conductive pattern prepared by the invention is suitable for various flexible conductive circuits, primary school, high and middle school circuit demonstration experiments, printed electronic devices or functional components thereof, and has the advantages of simple process and low cost.
Drawings
FIG. 1 is an SEM image of the flexible plate obtained in example 1 and comparative example 1;
FIG. 2 is a graph showing the resistivity of the flexible plates obtained in example 1 and comparative example 1;
FIG. 3 is a graph showing the resistivity of the flexible plates obtained in example 2 and comparative example 2;
FIG. 4 is a graph showing the resistivity of the flexible plates obtained in example 3 and comparative example 3;
FIG. 5 is a graph showing the resistivity of the flexible plates obtained in example 4 and comparative example 4;
FIG. 6 is a graph showing the resistivity of the flexible plates obtained in example 5 and comparative example 5;
FIG. 7 is a graph showing the resistivity of the flexible plates obtained in example 6 and comparative example 6;
fig. 8 is a graph showing the resistivity of the flexible plates obtained in example 7 and comparative example 7.
Detailed Description
The technical scheme of the invention is further explained by combining specific examples.
In the following examples, solid drugs were purchased from Aladdin pharmaceuticals Ltd, purity was 99.9% analytical purity, the organic solvents were purchased from Tianjin Jiangtian science and technology Ltd, and the mass fraction of the solvents was greater than 99.7%, except that the solvents were prepared from deionized water laboratories.
The writing brush is a common type sold in the market, the ink-jet printer is a Hewlett packard ink-jet 1112 type, the infrared heating lamp for infrared sintering is provided by Langpu opto-electronic technology limited company in Guangzhou, the power is 0-100W, and the resistivity calculation formula is rho ═ RS/L.
The operations of the following examples were all performed in an air environment at room temperature.
The sintering in the following examples may be infrared sintering, hair dryer, electric furnace, etc.
The rolling means that: the prepared flexible polar plate is clamped in a rolling die by a detachable rolling die with adjustable radian, and is rolled and pressed anticlockwise or clockwise under the action of external force, so that the density is further improved, and the conductivity of the polar plate in a bending state is improved.
In the following embodiments, each bending is to bend the flexible plate from the shape of the resistivity to be reduced to a straight shape and then to the shape of the resistivity to be reduced. In the following comparative example, each bending is a shape in which the flexible plate is bent from flat to the resistivity to be reduced of the comparative example, and then bent to flat.
Example 1
The application of the conductive ink in reducing the resistivity of the flexible polar plate after being bent for multiple times is operated according to the following steps:
the following steps were repeated 3 times: hewlett packard ultrathin photo paper is prepared as a flexible polar plate, conductive ink is coated on the flexible polar plate in a deformed state in a spraying mode, the coating thickness of the conductive ink is 50 micrometers, the conductive ink is the conductive ink in the embodiment 5 in the patent application No. 201810651247.8, and the conductive material in the conductive ink is silver powder. Sintering the flexible polar plate in the deformation state at 50 ℃ for 2min (infrared sintering, the sintering power is 15W), and spraying a solvent in the deformation state, wherein the solvent is a mixture of water and a volatile solvent, the volatile solvent is acetone, and the concentration of the volatile solvent in the solvent is 0.75 g/mL;
and (4) rolling is carried out after repeating, the rolling strength is 35MPa, the rolling times are 2 times, and the rolling time is 5min each time.
The flexible polar plate is bent in a deformation state, the conductive ink is coated on the inner side of the cambered surface formed by bending, and the bending radius of the flexible polar plate in the deformation state is 5 cm.
The flexible polar plate is bent when the resistivity is reduced, and the bending radius of the deformed state is larger than 2.5mm of the bending radius of the shape when the resistivity is reduced.
Comparative example 1
The deformed state in embodiment 1 was replaced with straight (i.e., the flexible substrate was always kept straight when the flexible substrate was processed).
The resistivity of the flexible electrode plates prepared in example 1 and comparative example 1 is tested after the flexible electrode plates are bent for 400 times, and SEM microscopic structure observation shows that the flexible electrode plates prepared in comparative example 1 have low density and high porosity among particles, as shown in figure 1a, and the flexible electrode plates prepared in example 1 have high density and low porosity among particles, as shown in figure 1 b. After bending 400 times, as shown in fig. 2, the resistivity was about 40 μ Ω · cm in comparative example 1, about 25 times the bulk silver resistivity (1.6 μ Ω · cm), and the resistivity was only about 6.6 μ Ω · cm in example 1, about 4 times the bulk silver resistivity, which is 1/6 of comparative example, and was remarkably decreased.
Example 2
The application of the conductive ink in reducing the resistivity of a flexible polar plate after being bent for many times is operated according to the following steps:
the following steps were repeated 5 times: a KRN type Polydialkylsilylmethane (PDMS) elastic film is prepared as a flexible polar plate, conductive ink is coated on the flexible polar plate in a deformed state in a mode of brushing with a roller, the thickness of the conductive ink coating is 100 micrometers, the conductive ink is the conductive ink in example 6 in patent application No. 201810651247.8, and the conductive material in the conductive ink is copper powder. Sintering the flexible polar plate in the deformation state at 40 ℃ for 3min (sintering by using a hair dryer with the sintering power of 10W), and spraying a solvent in the deformation state, wherein the solvent is a mixture of water and a volatile solvent, the volatile solvent is alcohol, and the concentration of the volatile solvent in the solvent is 0.35 g/mL;
and (4) rolling after repeating, wherein the rolling strength is 50MPa, the rolling times are 1 time, and the rolling time is 10 min.
The flexible polar plate is twisted in a deformation state, the conductive ink is coated on the inner side of an arc surface formed by twisting, the bending radius of the deformation state is 7cm, and the twisting angle is 45 degrees.
The flexible polar plate is twisted when the resistivity is to be reduced, the twisted angle of the deformed state is larger than 5 degrees of the twisted angle of the shape when the resistivity is to be reduced, and the bending radius angle of the deformed state is larger than 5mm of the bending radius of the shape when the resistivity is to be reduced.
Comparative example 2
The deformed state in embodiment 2 was replaced with straight (i.e., the flexible substrate was kept straight at all times when the flexible substrate was processed).
The resistivity of the flexible electrodes prepared in example 2 and comparative example 2 was measured after bending 400 times, and after bending 400 times, as shown in fig. 3, the resistivity of comparative example 2 was about 275 μ Ω · cm, which is about 154 times the bulk copper resistivity (1.78 μ Ω · cm), and the resistivity of example 2 was only about 49 μ Ω · cm, which is about 27.5 times the bulk silver resistivity, which is about 1/6 of comparative example 2.
Example 3
The application of the conductive ink in reducing the resistivity of the flexible polar plate after being bent for multiple times is operated according to the following steps:
the following steps were repeated 10 times: preparing an ultra-thin polyimide (Kapton) film produced by Beilong electronics Limited company in Guangzhou city as a flexible polar plate, coating conductive ink on the flexible polar plate in a deformed state, wherein the coating mode is brush coating by using a brush pen, the coating thickness of the conductive ink is 100 mu M, the conductive ink is a mixture of Canon colored GI-890< M > ink and nickel powder, and the mass ratio of the ink to the nickel powder is 1: 2. sintering the flexible polar plate in the deformation state at 100 ℃ for 5min (infrared sintering, sintering power is 100W), spraying a solvent in the deformation state, wherein the solvent is a mixture of water and a volatile solvent, the volatile solvent is a mixture of alcohol and acetone, the concentration of the volatile solvent in the solvent is 0.7g/mL, and the ratio of the alcohol to the acetone is 1:1 in parts by volume;
and (4) rolling is carried out after repeating, the rolling strength is 25MPa, the rolling times are 2 times, and the rolling time is 3min each time.
The deformation state is distortion, the deformation state is the shape of the flexible polar plate when the resistivity is to be reduced, the conductive ink is coated on the inner side of the cambered surface formed in the deformation state, the bending radius is 6cm, and the distortion angle is about 10 degrees.
Comparative example 3
The deformed state in example 3 was replaced with straight (i.e., the flexible substrate was always kept straight when being processed).
The resistivity of the flexible electrodes prepared in example 3 and comparative example 3 was measured after bending 400 times, and as shown in fig. 4, the resistivity of the flexible electrode prepared in comparative example 3 was about 2500 μ Ω · cm after bending 400 times, and the resistivity of example 3 was about 250 μ Ω · cm, which is 1/5 of comparative example 3.
Example 4
The application of the conductive ink in reducing the resistivity of the flexible polar plate after being bent for multiple times is operated according to the following steps:
the following steps were repeated 2 times: preparing a polyimide (Kapton) film produced by Beilong electronics Co Ltd of Guangzhou city as a flexible polar plate, coating conductive ink on the flexible polar plate in a deformed state in a mode of brush coating by using a brush pen, wherein the coating thickness of the conductive ink is 100 microns, the conductive ink is a mixture of a mixed solvent and gold powder in example 4 in patent application No. 201810651247.8, and the mass ratio of the mixed solvent to the gold powder is 1:1, sintering the flexible polar plate in a deformation state at 90 ℃ for 1min (infrared sintering, sintering power is 100W), spraying a solvent in the deformation state, wherein the solvent is a mixture of water and a volatile solvent, the volatile solvent is a mixture of alcohol and acetone, the concentration of the volatile solvent in the solvent is 0.4 g/mL, and the ratio of the alcohol to the acetone is 1:3 in parts by volume;
and (4) rolling is carried out after repeating, the rolling strength is 35MPa, the rolling times are 2 times, and the rolling time is 2min each time.
The flexible polar plate is bent in a deformation state, the conductive ink is coated on the outer side of a cambered surface formed by bending, and the bending radius is 7 cm.
The flexible polar plate is bent when the resistivity is reduced, and the bending radius of the deformed state is larger than 5mm of the bending radius of the shape when the resistivity is reduced.
Comparative example 4
The deformed state in example 4 was replaced with straight (i.e., the flexible substrate was always kept straight when being processed).
The resistivity of the flexible electrodes prepared in example 4 and comparative example 4 was measured after bending 400 times, and as shown in fig. 5, the resistivity of comparative example 4 was about 50 μ Ω · cm and the resistivity of the flexible electrode prepared in example 4 was about 5.0 μ Ω · cm after bending 400 times, which was 1/10 of comparative example.
Example 5
The application of the conductive ink in reducing the resistivity of the flexible polar plate after being bent for multiple times is operated according to the following steps:
the following steps were repeated 10 times: a self-made ethyl cellulose film (literature: RSC Advances,2017,7(11), 6772-6779) is prepared to be used as a flexible polar plate, conductive ink is coated on the flexible polar plate in a deformed state in a brush coating mode, the coating thickness of the conductive ink is 100 microns, the conductive ink is a mixture of a mixed solvent, copper powder and silver powder in the example 5 of the patent application No. 201810651247.8, and the mass ratio of the mixed solvent, the copper powder and the silver powder is 1:2: 2. Sintering the flexible polar plate in the deformation state at 60 ℃ for 4min (infrared sintering, sintering power is 20W), spraying a solvent in the deformation state, wherein the solvent is a mixture of water and a volatile solvent, the volatile solvent is a mixture of acetone and diethyl ether, and the ratio of the acetone to the diethyl ether is 3: 1, the concentration of the volatile solvent in the solvent is 0.7 g/mL;
and (4) rolling after repeating, wherein the rolling strength is 50MPa, the rolling frequency is 1 time, and the rolling time is 1min each time.
The deformation state of the flexible polar plate is distortion, the conductive ink is coated on the outer side of an arc surface formed by the distortion, the distortion angle is 60 degrees, and the bending radius is 6 cm.
The flexible polar plate is twisted when the resistivity is to be reduced, the twisted angle of the deformed state is larger than 10 degrees of the twisted angle of the shape when the resistivity is to be reduced, and the bending radius angle of the deformed state is larger than 8mm of the bending radius of the shape when the resistivity is to be reduced.
Comparative example 5
The deformed state in example 5 was replaced with straight (i.e., the flexible substrate was always kept straight when being processed).
The resistivity of the flexible electrodes prepared in example 5 and comparative example 5 was measured after bending 400 times, and as shown in fig. 6, the resistivity of comparative example 5 was about 50.3 μ Ω · cm and the resistivity of the flexible electrode prepared in example 5 was about 13.3 μ Ω · cm after bending 400 times, which is 1/4 of comparative example 5.
Example 6
The application of the conductive ink in reducing the resistivity of the flexible polar plate after being bent for multiple times is operated according to the following steps:
the following steps were repeated 15 times: KRN type PDMS was prepared as a flexible plate, conductive ink was coated on the flexible plate in a deformed state by brush coating with a writing brush, the thickness of the conductive ink was 50 μm, the conductive ink was a mixture of the mixed solvent, nickel powder and copper powder in example 4 of patent application No. 201810651247.8, and the mass ratio of the mixed solvent, nickel powder and copper powder was 1:1: 2. Sintering the flexible polar plate in the deformation state at 80 ℃ for 4min (sintering power is 100W, time is 4min), and spraying a solvent in the deformation state, wherein the solvent is a mixture of water and a volatile solvent, the volatile solvent is alcohol, and the concentration of the volatile solvent in the solvent is 0.65 g/mL;
and (4) rolling is carried out after repeating, the rolling strength is 40MPa, the rolling times are 3 times, and the rolling time is 2min each time.
The flexible polar plate is distorted in deformation state, the conductive ink is coated on the outer side of a cambered surface formed by distortion, the distortion angle is 30 degrees, and the bending radius is 8cm
The flexible polar plate is twisted when the resistivity is to be reduced, the twisted angle of the deformed state is larger than 5 degrees of the twisted angle of the shape when the resistivity is to be reduced, and the bending radius angle of the deformed state is larger than 10mm of the bending radius of the shape when the resistivity is to be reduced.
Comparative example 6
The deformed state in example 6 was replaced with straight (i.e., the flexible substrate was always kept straight when being processed).
The resistivity of the flexible electrodes prepared in example 6 and comparative example 6 was measured after bending 400 times, and as shown in fig. 7, the resistivity of comparative example 6 was about 1042 μ Ω · cm and the resistivity of the flexible electrode prepared in example 6 was about 173 μ Ω · cm after bending 400 times, which is 1/6 of comparative example.
Example 7
The application of the conductive ink in reducing the resistivity of a flexible polar plate after being bent for many times is operated according to the following steps:
preparing a polyethylene terephthalate (PET) film produced by Hunan City science and technology Co., Ltd, and coating conductive ink on the deformed flexible polar plate in a spraying manner, wherein the coating thickness of the conductive ink is 60 μm, the conductive ink is a mixture of a mixed solvent, graphene and carbon powder in example 5 of patent application No. 201810651247.8, and the mass ratio of the mixed solvent, the graphene and the carbon powder is 2:1: 1. The following steps were repeated 10 times: sintering the flexible polar plate in the deformation state at 70 ℃ for 5min, spraying a solvent, wherein the solvent is a mixture of water and a volatile solvent, the volatile solvent is a mixture of diethyl ether and tetrafluorohydropyran, the volume ratio of the diethyl ether to the tetrafluorohydropyran is 1:1, and the concentration of the volatile solvent in the solvent is 0.5 g/mL;
and (4) rolling is carried out after repeating, the rolling strength is 50MPa, the rolling times are 2 times, and the rolling time is 3min each time.
The deformation state is distortion, the deformation state is the shape of the flexible polar plate when the resistivity is to be reduced, the conductive ink is coated on the outer side of the cambered surface formed by the distortion, the bending radius is 7cm, and the distortion angle is about 20 degrees.
Comparative example 7
The deformed state in example 7 was replaced with straight (i.e., the flexible substrate was always kept straight when being processed).
The resistivity of the flexible electrodes prepared in example 7 and comparative example 7 was measured after bending 400 times, and as shown in fig. 8, the resistivity of comparative example 7 was about 10426 μ Ω after bending 400 times · cm, the resistivity of the flexible electrode prepared in example 7 was about 1735. mu. omega · cm, 1/6 of comparative example 7.
The invention has been described in an illustrative manner, and it is to be understood that any simple variations, modifications or other equivalent changes which can be made by one skilled in the art without departing from the spirit of the invention fall within the scope of the invention.

Claims (10)

1. The application of the conductive ink in reducing the resistivity of a flexible polar plate after being bent for multiple times is characterized in that the method is operated according to a mode 1 or a mode 2:
mode 1, the following steps are repeated a plurality of times: coating conductive ink on the flexible polar plate in a deformed state, sintering, and spraying a solvent;
mode 2, conductive ink is coated on the flexible polar plate in the deformed state, and the following steps are repeated for multiple times: sintering and spraying solvent.
2. The use according to claim 1, wherein the flexible plate is a photo paper, a polydimethylsiloxane film, a polyethylene terephthalate film, a polyvinylidene fluoride film, a polyimide film or an ethyl cellulose film, the coating is performed by spraying or brushing, and the conductive ink is coated to a thickness of 10-300 μm.
3. The application of claim 1, wherein the conductive material in the conductive ink is one or a mixture of silver powder, copper powder, nickel powder, carbon powder, iron powder, graphene, carbon nanotubes and gold powder.
4. The use according to claim 1, wherein the deformed state is a shape of the flexible plate after bending to reduce resistivity.
5. The use of claim 1, wherein after bending, the flexible plate is bent or twisted in a shape in which the resistivity is to be reduced, wherein when the shape in which the resistivity is to be reduced is bent, the radius of curvature in the deformed state is 1-5mm greater than the radius of curvature of the shape in which the resistivity is to be reduced; when the shape with the electrical resistivity to be reduced is a twist, the twist angle of the deformed state is 1-15 degrees larger than that of the shape with the electrical resistivity to be reduced, and the bending radius angle of the deformed state is 1-10mm larger than that of the shape with the electrical resistivity to be reduced.
6. The use according to claim 4 or 5, characterized in that rolling is carried out after the operation according to mode 1 or mode 2, the rolling strength is 0.5-50MPa, the number of rolling is 1-3, and the time of each rolling is 2-10 min.
7. The use according to claim 1, wherein the number of repetitions of the following steps is 1 to 20 times.
8. The use according to claim 1, wherein the sintering temperature is 25-100 ℃ and the sintering time is 1-10 min.
9. The use of claim 1, wherein the solvent is a mixture of water and a volatile solvent, and the volatile solvent is one or more of alcohol, acetone, diethyl ether, chloroform, vinyl acrylate, tetrafluoropyran, and ascorbic acid.
10. The use according to claim 9, wherein the concentration of the volatile solvent in the solvent is 0.1-1.0 g/mL.
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