CN114985288A - Intelligent discharging equipment for detecting surface defects of wafers - Google Patents
Intelligent discharging equipment for detecting surface defects of wafers Download PDFInfo
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- CN114985288A CN114985288A CN202210605396.7A CN202210605396A CN114985288A CN 114985288 A CN114985288 A CN 114985288A CN 202210605396 A CN202210605396 A CN 202210605396A CN 114985288 A CN114985288 A CN 114985288A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/02—Measures preceding sorting, e.g. arranging articles in a stream orientating
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/34—Sorting according to other particular properties
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/36—Sorting apparatus characterised by the means used for distribution
- B07C5/361—Processing or control devices therefor, e.g. escort memory
- B07C5/362—Separating or distributor mechanisms
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67271—Sorting devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention discloses intelligent discharging equipment for detecting surface defects of wafers, which comprises a base, and a wafer grabbing mechanism, a good product transferring mechanism, a defective product transferring mechanism, a bin conveying mechanism, a boxing mechanism, a partition board transferring mechanism and a labeling mechanism which are arranged on the base; the wafer grabbing mechanism is used for grabbing a tested wafer from the detection equipment and placing the tested wafer on the good product transfer mechanism or the defective product transfer mechanism; the good product transfer mechanism is used for conveying the tested good product wafer; the defective product transferring mechanism is used for conveying the tested defective product wafers; the bin conveying mechanism is used for conveying bins; the boxing mechanism is used for grabbing the tested good wafers from the good product transfer mechanism and placing the wafers into a material box; the partition plate transfer mechanism is used for grabbing a partition plate and placing the partition plate into a material box to separate wafers which are tested; the labeling mechanism is used for attaching labels to the material box.
Description
Technical Field
The invention relates to the technical field of optical detection, in particular to intelligent discharging equipment for detecting defects on the surface of a wafer.
Background
The wafer refers to a silicon wafer used for manufacturing a silicon semiconductor circuit in a display module, and the raw material of the wafer is silicon. And after dissolving the high-purity polycrystalline silicon, doping silicon crystal seed crystals, and then slowly pulling out to form cylindrical monocrystalline silicon. The detection of the wafer is an important part in the manufacturing process of the display module, the manual discharging is usually adopted in the detection process of the surface defects of the existing wafer, and the mode has the advantages of low speed, low efficiency and easy damage to the wafer.
Disclosure of Invention
The invention aims to provide intelligent discharging equipment for detecting the defects of the surface of a wafer, which is used for solving the problems.
In order to achieve the purpose, the invention adopts the following technical scheme:
an intelligent discharging device for detecting the surface defects of wafers comprises a base, and a wafer grabbing mechanism, a good product transferring mechanism, a defective product transferring mechanism, a bin conveying mechanism, a boxing mechanism, a partition board transferring mechanism and a labeling mechanism which are arranged on the base;
the wafer grabbing mechanism is used for grabbing a tested wafer from the detection equipment and placing the tested wafer on the good product transfer mechanism or the defective product transfer mechanism;
the good product transfer mechanism is used for conveying the tested good product wafers;
the defective product transferring mechanism is used for conveying the tested defective product wafers;
the bin conveying mechanism is used for conveying bins;
the boxing mechanism is used for grabbing the tested good wafers from the good product transfer mechanism and placing the wafers into a material box;
the partition plate transfer mechanism is used for grabbing a partition plate and placing the partition plate into a material box to separate wafers with measured good products;
the labeling mechanism is used for attaching labels to the material box.
Preferably, the wafer grabbing mechanism comprises a transferring module, a transverse moving frame, a grabbing lifting module and a wafer grabbing head, the moving module is arranged on the base and drives the transverse moving frame to horizontally and transversely move, the grabbing lifting module is fixedly arranged on the transverse moving frame and drives the wafer grabbing head to vertically lift, and the wafer grabbing head is used for grabbing measured wafers from the detection equipment and placing the wafers on the good product transferring mechanism or the defective product transferring mechanism.
Preferably, the good-product wafer transfer mechanism comprises a good-product transfer table and a good-product transfer module, and the good-product transfer module is used for driving the good-product transfer table to move between the lower parts of the tail ends of the plurality of groups of wafer grabbing mechanisms;
preferably, the defective wafer transfer mechanism is arranged below the non-defective product transfer table and comprises a movable slide rail, an installation base frame, belt driving rollers, a conveying belt, a driving motor and an anti-falling plate, wherein the movable slide rail is fixedly arranged on the base frame, a sliding base clamped on the movable slide rail in a sliding manner is arranged at the bottom side of the installation base frame, the two ends of the installation base frame are respectively provided with one belt driving roller for driving the conveying belt to transfer in a matched manner, an output shaft of the driving motor is connected with one group of the belt driving rollers, the anti-falling plate is fixedly arranged between the upper layer and the lower layer of the conveying belt, a plurality of wafer sensors for monitoring whether wafers are placed on the conveying belt or not are arranged on the anti-falling plate at intervals along the conveying direction of the belt, and one end of the installation base frame is also provided with a handle;
preferably, workbin conveying mechanism includes first workbin conveying roller set, second workbin conveying roller set, third workbin conveying roller set and workbin lifting module, first workbin conveying roller set and second workbin conveying roller set are adjacent to set up from top to bottom and are used for carrying workbin and empty case respectively, and direction of delivery is opposite, workbin lifting module drive third workbin conveying roller set goes up and down along vertical direction and is used for linking first workbin conveying roller set or second workbin conveying roller set, third workbin conveying roller set both sides are equipped with the workbin deflector, third workbin conveying roller set top is equipped with workbin location camera and is used for acquireing the position information of workbin.
Preferably, the boxing mechanism comprises a mechanical arm, a good product wafer grabbing head and a wafer positioning camera, the good product grabbing head is used for grabbing the good product wafers on the good product conveying table and driving the good product wafers to be placed in a material box on the material box conveying mechanism through the mechanical arm, and the wafer positioning camera is arranged above the good product conveying table and used for acquiring position information of the good product wafers.
Preferably, the baffle transfer mechanism includes that the baffle carries the platform, carries a lift module, the baffle snatchs the head, the baffle snatchs lift module, the baffle is transferred and is put up and the module is transferred to the baffle, the both sides of third workbin transfer roller set are equipped with one respectively carry a lift module, carry a lift module to be used for the drive the baffle carries the platform to go up and down along vertical direction, the baffle carries the platform to be used for placing the baffle, the drive of baffle transfer module the baffle is transferred the frame and is moved between the top of third workbin transfer roller set and baffle transfer platform, the baffle snatchs lift module set firmly drive on the baffle is transferred the frame the baffle snatchs the head and goes up and down along vertical direction, the baffle snatchs the head and be used for snatching the baffle.
Preferably, the labeling mechanism comprises a label printer, a label transfer assembly and a label reading camera;
the label transfer component comprises a double-shaft driving module and a label transfer platform, the double-shaft driving module is used for driving the label transfer platform to move in the horizontal XY double-shaft direction, the label printer prints a label and places the label on the label transfer platform, and the label reading camera is arranged above the label transfer platform and is used for acquiring product information of the label;
the label is transferred the subassembly and is used for snatching the workbin label of revolving stage top in the label transfers to workbin conveying mechanism and pastes the mark, the label is transferred the subassembly and is included triaxial drive module, pastes mark bed frame, pastes the mark rotation axis, pastes mark rotating electrical machines and label and absorb the head, triaxial drive module is used for the drive paste the mark bed frame and remove in space XYZ triaxial direction, it pastes the mark swivel bearing to be equipped with on the mark bed frame, it sets up to paste the mark rotation axis paste on the mark swivel bearing, and it is driven through pasting mark rotating electrical machines, it absorbs first fixed connection to paste the mark be used for absorbing the label on the mark rotation axis.
After adopting the technical scheme, compared with the background technology, the invention has the following advantages:
the invention provides the intelligent discharging equipment for detecting the surface defects of the wafers, which has high automation degree, replaces manpower, reduces the labor intensity, saves the cost, eliminates the adverse effect of human participation on wafer contact, does not damage the wafers and effectively ensures the quality of products.
Drawings
FIG. 1 is a schematic view of the structure of the present invention;
FIG. 2 is a schematic structural view of a wafer removal gripping mechanism according to the present invention;
FIG. 3 is a schematic structural view of a good product transfer mechanism, a defective product transfer mechanism and a boxing mechanism according to the present invention;
FIG. 4 is a schematic view of the structure of the bin conveying mechanism of the present invention;
FIG. 5 is a schematic view of a partition transfer mechanism according to the present invention;
fig. 6 is a schematic structural view of the labeling mechanism of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
In the present invention, it should be noted that the terms "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. are all based on the orientation or positional relationship shown in the drawings, and are only for convenience of describing the present invention and simplifying the description, but do not indicate or imply that the apparatus or element of the present invention must have a specific orientation, and thus, should not be construed as limiting the present invention.
Examples
With reference to fig. 1 to 6, the invention discloses an intelligent discharging device for detecting surface defects of wafers, which comprises a base, and a wafer grabbing mechanism 1, a good product transferring mechanism 2, a defective product transferring mechanism 3, a bin conveying mechanism 4, a boxing mechanism 5, a partition transferring mechanism 6 and a labeling mechanism 7 which are arranged on the base;
the wafer grabbing mechanism 1 is used for grabbing a tested wafer from an external detection device 8 and placing the tested wafer on the good product transfer mechanism 2 or the defective product transfer mechanism 3;
the good product transfer mechanism 2 is used for conveying the tested good product wafers;
the defective product transfer mechanism 3 is used for conveying the tested defective product wafer;
the bin conveying mechanism 4 is used for conveying bins;
the boxing mechanism 5 is used for grabbing the tested good wafers from the good product transfer mechanism 2 and placing the wafers into a material box;
the clapboard transferring mechanism 6 is used for grabbing the clapboard to place the clapboard in a material box to separate the tested good wafers;
the labeling mechanism 7 is used for attaching labels on the material box.
The wafer grabbing mechanism 1 comprises a transferring module 11, a transverse moving frame 12, a grabbing lifting module 13 and a wafer grabbing head 14, wherein the moving module 11 is arranged on the base and drives the transverse moving frame 12 to horizontally and transversely move, the grabbing lifting module 13 is fixedly arranged on the transverse moving frame 12 and drives the wafer grabbing head 14 to vertically lift, and the wafer grabbing head 14 is used for grabbing tested wafers from the detection equipment 8 and placing the tested wafers on the good product transferring mechanism 2 or the defective product transferring mechanism 3.
The wafer grabbing mechanism 1 comprises a plurality of groups of wafers which are horizontally and longitudinally arranged adjacently, the good wafer transfer mechanism 2 comprises a good transfer table 21 and a good transfer module 22, and the good transfer module 22 is used for driving the good transfer table 21 to move between the lower parts of the tail ends of the groups of wafer grabbing mechanisms 1;
the defective wafer transfer mechanism 3 is arranged below the non-defective transfer table 21 and comprises a movable slide rail 31, an installation base frame 32, belt driving rollers 33, a conveying belt 34, a driving motor 35 and an anti-falling plate 36, wherein the movable slide rail 31 is fixedly arranged on the base, a sliding base 37 clamped on the movable slide rail 31 in a sliding manner is arranged at the bottom side of the installation base frame 32, the belt driving rollers 33 are respectively arranged at two ends of the installation base frame 32 and used for driving the conveying belt 34 to convey in a matching manner, an output shaft of the driving motor 35 is connected with one group of the belt driving rollers 33, the anti-falling plate 36 is fixedly arranged between the upper layer and the lower layer of the conveying belt 254, a plurality of wafer sensors 38 are arranged on the anti-falling plate 36 at intervals along the conveying direction of the belt and used for monitoring whether wafers are placed on the conveying belt 34, and a handle 39 is further arranged at one end of the installation base frame 32 and used for pulling out the defective wafer transfer mechanism 3;
the bin conveying mechanism 4 comprises a first bin conveying roller group 41, a second bin conveying roller group 42, a third bin conveying roller group 43 and a bin lifting module 44, the first bin conveying roller group 41 and the second bin conveying roller group 42 are adjacently arranged up and down and are respectively used for conveying bins and empty bins, the conveying directions are opposite, the bin lifting module 44 drives the third bin conveying roller group 43 to lift along the vertical direction and is used for connecting the first bin conveying roller group 41 or the second bin conveying roller group 42, bin guide plates 431 are arranged on two sides of the third bin conveying roller group 43, and a bin positioning camera 45 is arranged above the third bin conveying roller group 43 and is used for acquiring position information of the bins.
The boxing mechanism 5 comprises a mechanical arm 51, a good product wafer grabbing head 52 and a wafer positioning camera 53, wherein the good product grabbing head 52 is used for grabbing the good product wafers on the good product transfer table 21 and driving the good product wafers to be placed in a material box on the material box conveying mechanism 4 through the mechanical arm 51, and the wafer positioning camera 53 is arranged above the good product transfer table and used for acquiring the position information of the good product wafers.
The partition plate transferring mechanism 6 comprises a partition plate conveying table 61, a conveying table lifting module 62, partition plate grabbing heads 63, a partition plate grabbing lifting module 64, a partition plate transferring frame 65 and a partition plate transferring module 66, two sides of a third material box conveying roller group 73 are respectively provided with a conveying table lifting module 62, the conveying table lifting module 62 is used for driving the partition plate conveying table 63 to lift along the vertical direction, the partition plate conveying table 61 is used for placing a partition plate, the partition plate transferring module 66 drives the partition plate transferring frame 65 to move between the third material box conveying roller group 73 and the partition plate conveying table 61, the partition plate grabbing lifting module 64 is fixedly arranged on the partition plate transferring frame 65 and drives the partition plate grabbing heads 63 to lift along the vertical direction, and the partition plate grabbing heads 63 are used for grabbing partition plates.
The labeling mechanism 7 comprises a label printer 71, a label transferring component 72, a label transferring component 73 and a label reading camera 74;
the label transferring assembly 72 comprises a dual-axis driving module 721 and a label transferring platform 722, wherein the dual-axis driving module 721 is used for driving the label transferring platform 722 to move in the horizontal XY dual-axis direction, the label printer 71 prints labels and places the labels on the label transferring platform 722, and the label reading camera 74 is arranged above the label transferring platform 722 and is used for acquiring product information of the labels;
the label transferring assembly 73 is used for grabbing a bin label above the label transfer platform 722 and transferring the bin label to the bin conveying mechanism 8 for labeling on a bin, the label transferring assembly 73 comprises a three-axis driving module 731, a labeling base frame 732, a labeling rotating shaft 733, a labeling rotating motor 734 and a label suction head 735, the three-axis driving module 731 is used for driving the labeling base frame 732 to move in three-axis directions of space XYZ, a labeling rotating bearing 736 is arranged on the labeling base frame 732, the labeling rotating shaft 733 is rotatably arranged on the labeling rotating bearing 736 and is driven by the labeling rotating motor 734, and the labeling suction head 735 is fixedly connected to the labeling rotating shaft 733 for sucking the label.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present invention are included in the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (8)
1. The utility model provides an intelligent discharging equipment that wafer surface defect detected which characterized in that: the automatic packaging machine comprises a machine base, and a wafer grabbing mechanism, a good product transferring mechanism, a defective product transferring mechanism, a material box conveying mechanism, a boxing mechanism, a partition board transferring mechanism and a labeling mechanism which are arranged on the machine base;
the wafer grabbing mechanism is used for grabbing a tested wafer from the detection equipment and placing the tested wafer on the good product transfer mechanism or the defective product transfer mechanism;
the good product transfer mechanism is used for conveying the tested good product wafer;
the defective product transferring mechanism is used for conveying the tested defective product wafers;
the bin conveying mechanism is used for conveying bins;
the boxing mechanism is used for grabbing the tested good wafers from the good product transfer mechanism and placing the wafers into a material box;
the partition plate transfer mechanism is used for grabbing a partition plate and placing the partition plate into a material box to separate wafers which are tested;
the labeling mechanism is used for attaching labels on the material box.
2. The intelligent discharging device for detecting the surface defects of the wafers as recited in claim 1, wherein: the wafer grabbing mechanism comprises a transferring module, a transverse moving frame, a grabbing lifting module and a wafer grabbing head, the moving module is arranged on the base and drives the transverse moving frame to move horizontally and transversely, the grabbing lifting module is fixedly arranged on the transverse moving frame and drives the wafer grabbing head to lift along the vertical direction, and the wafer grabbing head is used for grabbing measured wafers from detection equipment and placing the wafers on the good product transferring mechanism or the defective product transferring mechanism.
3. The intelligent discharging device for detecting the surface defects of the wafers as recited in claim 1, wherein: the good product wafer transfer mechanism comprises a good product transfer table and a good product transfer module, wherein the good product transfer module is used for driving the good product transfer table to move between a plurality of groups of tail end lower parts of the wafer grabbing mechanisms.
4. The intelligent discharging device for detecting the surface defects of the wafers as claimed in claim 3, wherein: substandard product wafer transfer mechanism sets up the below of yields transfer platform, it includes movable slide rail, installation bed frame, belt drive roller, conveyer, driving motor and prevents falling the board, movable slide rail sets firmly on the frame, the bottom side of installation bed frame is equipped with the slip card and establishes sliding base on the movable slide rail, the both ends of installation bed frame are equipped with one respectively the belt drive roller is used for the cooperation to drive the conveyer conveying, driving motor's output shaft and wherein a set of the belt drive roller is connected, prevent falling the board and set firmly between conveyer's the upper and lower layer, whether it has placed the wafer to prevent falling to be equipped with a plurality of wafer sensors along the belt direction of transfer interval on the board and be used for monitoring conveyer, the one end of installation bed frame still is equipped with the handle.
5. The intelligent discharging device for detecting the defects on the surface of the wafer as claimed in claim 1, wherein: workbin conveying mechanism includes that first workbin carries roller set, second workbin and carries roller set, third workbin and carries roller set and workbin lifting module, first workbin carries roller set and second workbin to carry roller set adjacent setting from top to bottom to be used for carrying workbin and empty case respectively, and direction of delivery is opposite, workbin lifting module drive third workbin carries roller set to go up and down along vertical direction and is used for linking up first workbin carries roller set or second workbin and carries roller set, third workbin carries roller set both sides to be equipped with the workbin deflector, third workbin carries roller set top to be equipped with workbin location camera and is used for acquireing the positional information of workbin.
6. The intelligent discharging device for detecting the surface defects of the wafers as recited in claim 1, wherein: the boxing mechanism comprises a mechanical arm, a good product wafer grabbing head and a wafer positioning camera, wherein the good product grabbing head is used for grabbing a good product wafer on the good product conveying table and is driven by the mechanical arm to be placed in a material box on the material box conveying mechanism, and the wafer positioning camera is arranged above the good product conveying table and used for acquiring position information of the good product wafer.
7. The intelligent discharging device for detecting the surface defects of the wafers as recited in claim 1, wherein: the baffle transfer mechanism includes that the baffle carries the platform, carries a lift module, the baffle snatchs head, baffle and snatchs lift module, baffle and transfer the frame and the baffle and transfer the module, the both sides of third workbin transport roller set are equipped with one respectively carry a lift module, carry a lift module to be used for the drive the baffle transport table goes up and down along vertical direction, the baffle carries the platform to be used for placing the baffle, the baffle is transferred the module drive the baffle is transferred the frame and is removed between the top that third workbin transported roller set and baffle carried the platform, the baffle snatchs lift module and sets firmly drive on the baffle is transferred the frame the baffle snatchs the head and goes up and down along vertical direction, the baffle snatchs the head and is used for snatching the baffle.
8. The intelligent discharging device for detecting the surface defects of the wafers as recited in claim 1, wherein: the labeling mechanism comprises a label printer, a label transfer component, a label transferring component and a label reading camera;
the label transfer component comprises a double-shaft driving module and a label transfer platform, the double-shaft driving module is used for driving the label transfer platform to move in the horizontal XY double-shaft direction, the label printer prints a label and places the label on the label transfer platform, and the label reading camera is arranged above the label transfer platform and is used for acquiring product information of the label;
the label transfer assembly is used for grabbing the workbin label of revolving stage top in the label transfers to workbin conveying mechanism and pastes the mark, the label transfer assembly includes that triaxial drive module, subsides mark bed frame, pastes the mark rotation axis, pastes mark rotating electrical machines and label absorption head, triaxial drive module is used for the drive it removes in space XYZ triaxial direction to paste the mark bed frame, be equipped with on the mark bed frame and paste mark rotating bearing, paste the mark rotation axis and rotate and set up paste mark rotating bearing is last, and it drives through pasting mark rotating electrical machines, paste mark absorption head fixed connection be in be used for absorbing the label on the mark rotation axis.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202210605396.7A CN114985288A (en) | 2022-05-30 | 2022-05-30 | Intelligent discharging equipment for detecting surface defects of wafers |
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| CN202210605396.7A CN114985288A (en) | 2022-05-30 | 2022-05-30 | Intelligent discharging equipment for detecting surface defects of wafers |
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