CN114985228A - Gluing process for improving high-temperature resistance of sensor - Google Patents
Gluing process for improving high-temperature resistance of sensor Download PDFInfo
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- CN114985228A CN114985228A CN202210508062.8A CN202210508062A CN114985228A CN 114985228 A CN114985228 A CN 114985228A CN 202210508062 A CN202210508062 A CN 202210508062A CN 114985228 A CN114985228 A CN 114985228A
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- Prior art keywords
- coating
- glue
- primer
- sensor
- smooth curve
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/32—Processes for applying liquids or other fluent materials using means for protecting parts of a surface not to be coated, e.g. using stencils, resists
- B05D1/322—Removable films used as masks
- B05D1/325—Masking layer made of peelable film
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/36—Successively applying liquids or other fluent materials, e.g. without intermediate treatment
- B05D1/38—Successively applying liquids or other fluent materials, e.g. without intermediate treatment with intermediate treatment
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D5/00—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
- B05D7/14—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials to metal, e.g. car bodies
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
- B05D7/50—Multilayers
- B05D7/52—Two layers
- B05D7/54—No clear coat specified
- B05D7/546—No clear coat specified each layer being cured, at least partially, separately
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/16—Measuring arrangements characterised by the use of optical techniques for measuring the deformation in a solid, e.g. optical strain gauge
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B21/00—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant
- G01B21/32—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring the deformation in a solid
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Wood Science & Technology (AREA)
- Measuring Fluid Pressure (AREA)
Abstract
The invention discloses a gluing process for improving the high-temperature resistance of a sensor, which comprises seven steps of cleaning a substrate, polishing the substrate, coating primer, curing the primer, fixing the sensor, coating upper glue and curing the upper glue; when the primer and/or the topcoat are coated, the shape of the primer coating area and/or the topcoat coating area is a polygon with each internal angle larger than 90 degrees, and the external contour is a smooth curve or a smooth combination of the smooth curve and a straight line segment. According to the invention, the stress concentration phenomenon of the adhesive layer is reduced by changing the external profile of the adhesive layer, so that the interface stress of the adhesive layer/substrate is homogenized, the tolerance temperature of the adhesive layer is further improved, and a process guarantee is provided for improving the service temperature of the sensor.
Description
Technical Field
The invention relates to the field of mechanical measurement, in particular to a gluing process for improving the high-temperature resistance of a sensor.
Background
The high-temperature strain measurement is of great importance for understanding the working state and evaluating the health degree of high-temperature mechanical equipment such as engines, gas turbines and the like. The strain measurement of high-temperature parts under service conditions generally adopts a high-temperature strain gauge or an optical fiber sensor to carry out contact measurement. For parts such as blades and shafts, some common mechanical connection methods (such as threaded connection and rivet connection) cannot be applied in order to not change the original part structures. Gluing is almost the only method of fixation of such sensors. The most common cements used at normal temperature are polymer-based products, which can withstand temperatures not exceeding 300 ℃. In order to improve the temperature resistance of the cementing process, inorganic oxide-based cementing agents are designed. Because of the ultra-high melting point of the oxide, the inorganic cementing agent can resist the high temperature of over 1200 ℃, and is the mainstream fixing material in the field of high-temperature strain sensing measurement. Such as HG-1 high temperature adhesives from HPI, USA, are such products.
Since the high temperature bonding agent is composed of inorganic oxide and has a much smaller coefficient of thermal expansion than the thermal expansion system of metal (generally only 1/10), its serious thermal mismatch problem is a major factor in the failure of the bond when the sensor and the metal substrate are fixed. The thermal mismatch is caused by stress failure at the bonding interface of two materials with different thermal expansion coefficients, so that the maximum stress of the bonding interface is a key factor for limiting the temperature resistance of the adhesive bonding layer. The traditional sensor gluing process specification requires that when fixing the sensor, the glue layer coating area is controlled to be a thin rectangle capable of completely covering the sensor. According to the research result in the aspect of thermoelastic mechanical simulation, the rectangular coating mode has huge stress concentration at four right angles of the adhesive layer at high temperature, and the stress magnitude of the rectangular coating mode exceeds the average value of the adhesive layer/substrate interface by more than 20%. This results in delamination and cracking of the glue layer at the right angles of the outer periphery of the glue layer at high temperatures, followed by gradual crack growth towards the middle, and finally in loosening and failure of the sensor.
Disclosure of Invention
The invention mainly aims to provide a gluing process for improving the high-temperature resistance of a sensor, which can reduce the stress concentration effect in the original gluing mode and further improve the temperature resistance of a glue layer.
The technical scheme adopted by the invention is as follows: a glue coating process for improving the high temperature resistance of a sensor comprises seven steps of substrate cleaning, substrate polishing, primer coating, primer curing, sensor fixing, upper glue coating and upper glue curing; when the primer and/or the topcoat are coated, the shape of the primer coating area and/or the topcoat coating area is a polygon with each internal angle larger than 90 degrees, and the external contour is a smooth curve or a smooth combination of the smooth curve and a straight line segment.
According to the scheme, when the primer and/or the upper glue is coated, the high-temperature glue is coated by adopting a coating die with each polygon with an inner angle larger than 90 degrees or an inner contour of which is a smooth curve.
According to the scheme, the coating die is made of polymer adhesive tapes and is removed by a high-temperature melting or mechanical scraping method after the primer is solidified.
According to the scheme, when primer and/or upper glue is coated, the coating die is pasted to the measuring part, the middle hole can completely cover the measuring part, then high-temperature glue is filled in the hole, the hole is placed in a constant temperature furnace for curing after being filled with the high-temperature glue, and after the glue is completely cured, the coating die is removed completely by a high-temperature or mechanical scraping method.
According to the scheme, each polygon with the inner angle larger than 90 degrees is a polygon formed by cutting corners on the basis of a traditional rectangle, and the cutting corners are 4 corners of a cut rectangle.
According to the scheme, the outer contour is a smooth curve, and specifically comprises the following steps: oval or circular.
According to the scheme, the smooth combination of the smooth curve and the straight line segment specifically comprises the following steps: a chamfered polygon having more than 3 sides.
The sensor is prepared by adopting the gluing process.
The invention has the following beneficial effects: the stress concentration phenomenon of the adhesive layer is reduced by changing the external outline of the adhesive layer, so that the interface stress of the adhesive layer/substrate is homogenized, the tolerance temperature of the adhesive layer is improved, and the process guarantee is provided for improving the service temperature of the sensor.
Drawings
The invention will be further described with reference to the accompanying drawings and examples, in which:
FIG. 1 is a graph of the degree of sharp angle versus the magnitude of thermal stress at the tip.
FIG. 2 is a diagram of an apparatus for applying primer according to an embodiment of the present invention.
Fig. 3 is a graph of maximum thermal stress versus temperature obtained using different shaped coating dies.
Fig. 4 is a schematic diagram of the structure of an 8-sided adhesive layer obtained by cutting 4 corners of a rectangle.
FIG. 5 is a schematic view of an elliptical adhesive layer structure.
Fig. 6 is a schematic view of a circular adhesive layer structure.
FIG. 7 is a schematic view of a rectangular adhesive layer with a chamfer.
Fig. 8 is a schematic diagram of the structure of an irregular smooth curve-shaped adhesive layer.
In the figure: 1-substrate, 2-coating die, 3-adhesive layer.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
Researches find that the stress concentration phenomenon of the glue layer is closely related to the gluing shape. The smaller the corner angle of the peripheral outline curve of the adhesive layer is, the more obvious the stress concentration is. As shown in FIG. 1, the thermoelastic mechanical simulation research shows that the stress concentration phenomenon of the glue layer is closely related to the gluing shape. The smaller the corner angle of the peripheral outline curve of the adhesive layer is, the more obvious the stress concentration is. The lower its withstand temperature.
Based on the research, the invention reduces the stress concentration effect at the corner of the outline by changing the outline shape of the glue coating layer of the high-temperature strain sensor, improves the stress consistency of the glue layer/substrate interface, and greatly improves the temperature resistance of the glue layer. The method can greatly increase the use temperature of the adhesive layer by only modifying the coating pattern of the adhesive layer without changing any material, and has the advantages of simple process, strong operability and strong practical value.
The invention particularly provides a gluing process for improving the high-temperature resistance of a sensor, which comprises seven steps of substrate cleaning, substrate polishing, primer coating, primer curing, sensor fixing, upper glue coating and upper glue curing; when the primer and/or the upper glue is coated, the high-temperature glue is coated on the metal substrate by adopting a coating die of which each inner angle is larger than 90 degrees or the inner contour is a smooth curve, so that the shape of a primer coating area and/or an upper glue coating area is a polygon of which each inner angle is larger than 90 degrees, and the shape of the outer contour is a smooth curve or a smooth combination of the smooth curve and a straight line segment. The coating die is only one way of the process, and other ways of coating, such as coating first and then cutting, can be adopted as long as the outline of the final adhesive layer is ensured to be in the shape restricted by the invention.
As shown in fig. 2, the coating die 2 is made of a polymer tape, and is removed by high-temperature melting or mechanical scraping after the primer is cured. When coating base glue and/or coating upper glue, aim at the measuring position, paste coating die 2 on metal substrate 1, let the hole in the middle can cover the measuring position completely, then pack high-temperature glue in the hole, put into the oven curing of constant temperature after filling up high-temperature glue, after the colloid completely cures, form the cementing layer 3, scrape the way with high temperature or machinery and get rid of the coating die 2 totally.
Each polygon with an inner angle larger than 90 degrees is a polygon formed by cutting corners on the basis of a traditional rectangle, and the cutting corners are 4 corners of a cut rectangle, as shown in fig. 4.
The outer contour is a smooth curve, and specifically comprises the following steps: an oval shape as shown in fig. 5, or a circular shape as shown in fig. 6, or other irregular smooth curved shape as shown in fig. 8.
The smooth combination of the smooth curve and the straight line segment specifically comprises the following steps: a chamfered polygon with more than 3 sides as shown in fig. 7.
The invention completes the comparison result of the high temperature resistance of the polygonal (8-edge type obtained by cutting 4 corners of the rectangle), the elliptical and the circular glue layers with each internal angle larger than 90 degrees with the traditional rectangular structure, as shown in figure 3. As can be seen from fig. 3, the maximum thermal stress of the polygonal (8-sided by cutting 4 corners of the rectangle), elliptical and circular adhesive layer structures with each internal angle larger than 90 degrees is smaller than that of the conventional rectangle at any temperature. The test shows that the crack initiation temperatures of the rectangle, the polygon (8-edge type obtained by cutting 4 corners of the rectangle), the ellipse and the round glue layer are 422 ℃, 500 ℃, 425 ℃ and 530 ℃ respectively. The circular gluing mode has the best high-temperature resistant effect, and the maximum service temperature increase rate reaches 25%.
The invention also discloses a sensor prepared by the gluing process.
The innovation of the invention is that the invention is inspired by the ancestor punching 'cyclotomy', changes the original gluing mode, changes 4 right angles of the traditional rectangular gluing pattern into 8-edge shapes, increases the corresponding degrees of the inner angles, thereby reducing the stress concentration, further cuts the inner angles of the 8-edge shapes according to the ancestor punching 'cyclotomy' idea, changes the inner angles into 16-edge shapes, further increases the angles, further reduces the stress concentration effect, and continues to infinitely cut, the glue layer pattern approaches to an ellipse or a circle, at the moment, the inner angles are flat angles of 180 degrees, and the stress concentration effect is reduced to the minimum. Therefore, the obtained glue line/substrate interface has the highest stress consistency, so that the glue line cracking temperature is increased. The method can greatly increase the use temperature of the adhesive layer by only modifying the coating pattern of the adhesive layer without changing any material, and has the advantages of simple process, strong operability and strong practical value.
It will be understood that modifications and variations can be made by persons skilled in the art in light of the above teachings and all such modifications and variations are intended to be included within the scope of the invention as defined in the appended claims.
Claims (8)
1. A glue coating process for improving the high temperature resistance of a sensor comprises seven steps of substrate cleaning, substrate polishing, primer coating, primer curing, sensor fixing, upper glue coating and upper glue curing; the method is characterized in that when the primer and/or the topcoat are coated, the shape of the primer coating area and/or the topcoat coating area is a polygon with each inner angle larger than 90 degrees, and the outer contour is a smooth curve or a smooth combination of the smooth curve and a straight line segment.
2. The gluing process according to claim 1, wherein the coating mold of a polygon with an inner angle of more than 90 degrees and an outer contour of a smooth curve or a smooth combination of the smooth curve and a straight line segment is used for coating the high-temperature glue when the primer glue and/or the topcoat glue is coated.
3. Gumming process as in claim 2, wherein said coating die is made of a polymeric tape, which is removed by high temperature melting or mechanical scraping after the primer has cured.
4. The gluing process according to claim 2, wherein when the primer and/or the topcoat are applied, a coating mold is adhered to the measurement site in an alignment manner to allow the middle hole to completely cover the measurement site, then the hole is filled with the high temperature glue, the hole is cured in a constant temperature furnace after being filled with the high temperature glue, and after the glue is completely cured, the coating mold is removed by a high temperature or mechanical scraping method.
5. The gluing process according to claim 1, wherein each polygon with internal angles greater than 90 degrees is a polygon formed by cutting corners on the basis of a conventional rectangle, and the cutting corners are 4 corners of a cut rectangle.
6. Gluing process according to claim 1, wherein the external profile is a smooth curve, in particular: oval or circular.
7. Gluing process according to claim 1, characterised in that the smooth combination of the smooth curve and the straight line segment is in particular: a chamfered polygon having more than 3 sides.
8. A sensor, characterized by: the glue coating process as claimed in any one of claims 1 to 7.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210508062.8A CN114985228B (en) | 2022-05-10 | 2022-05-10 | Gluing process for improving high-temperature resistance of sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210508062.8A CN114985228B (en) | 2022-05-10 | 2022-05-10 | Gluing process for improving high-temperature resistance of sensor |
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| Publication Number | Publication Date |
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| CN114985228A true CN114985228A (en) | 2022-09-02 |
| CN114985228B CN114985228B (en) | 2023-04-11 |
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Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060115202A1 (en) * | 2002-10-08 | 2006-06-01 | Robert Stevens | Fibre optic based semiconductor micro sensors for sensing pressure or temperature, fabrication methods of said sensors, and a method of securing an optical fibre to a silicon block |
| JP2011133455A (en) * | 2009-11-24 | 2011-07-07 | Tokai Rubber Ind Ltd | Bend sensor and method of measuring deformed shape |
| JP2012127781A (en) * | 2010-12-15 | 2012-07-05 | Denso Corp | Dynamic quantity sensor |
| CN103182367A (en) * | 2011-12-27 | 2013-07-03 | 比亚迪股份有限公司 | Method for curing ultraviolet (UV) adhesive on back of flexible printed circuit (FPC) of UV adhesive attached touch screen |
| CN103869637A (en) * | 2014-03-10 | 2014-06-18 | 中国电子科技集团公司第五十五研究所 | Technique method of preparing slope-edged metal film by using photoresist stripping |
| CN104776808A (en) * | 2014-01-10 | 2015-07-15 | 中国计量学院 | Fiber grating sensor for monitoring the strain of the outer wall of high-temperature pressure pipeline online |
| CN106441140A (en) * | 2016-10-25 | 2017-02-22 | 武汉理工大学 | Fiber grating strain sensibilization sensor |
| CN112985471A (en) * | 2021-04-30 | 2021-06-18 | 深圳市汇顶科技股份有限公司 | Capacitive sensor and manufacturing method thereof |
| CN113019845A (en) * | 2021-03-17 | 2021-06-25 | 中国航发动力股份有限公司 | Gluing process |
-
2022
- 2022-05-10 CN CN202210508062.8A patent/CN114985228B/en active Active
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060115202A1 (en) * | 2002-10-08 | 2006-06-01 | Robert Stevens | Fibre optic based semiconductor micro sensors for sensing pressure or temperature, fabrication methods of said sensors, and a method of securing an optical fibre to a silicon block |
| JP2011133455A (en) * | 2009-11-24 | 2011-07-07 | Tokai Rubber Ind Ltd | Bend sensor and method of measuring deformed shape |
| JP2012127781A (en) * | 2010-12-15 | 2012-07-05 | Denso Corp | Dynamic quantity sensor |
| CN103182367A (en) * | 2011-12-27 | 2013-07-03 | 比亚迪股份有限公司 | Method for curing ultraviolet (UV) adhesive on back of flexible printed circuit (FPC) of UV adhesive attached touch screen |
| CN104776808A (en) * | 2014-01-10 | 2015-07-15 | 中国计量学院 | Fiber grating sensor for monitoring the strain of the outer wall of high-temperature pressure pipeline online |
| CN103869637A (en) * | 2014-03-10 | 2014-06-18 | 中国电子科技集团公司第五十五研究所 | Technique method of preparing slope-edged metal film by using photoresist stripping |
| CN106441140A (en) * | 2016-10-25 | 2017-02-22 | 武汉理工大学 | Fiber grating strain sensibilization sensor |
| CN113019845A (en) * | 2021-03-17 | 2021-06-25 | 中国航发动力股份有限公司 | Gluing process |
| CN112985471A (en) * | 2021-04-30 | 2021-06-18 | 深圳市汇顶科技股份有限公司 | Capacitive sensor and manufacturing method thereof |
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| CN114985228B (en) | 2023-04-11 |
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