CN114985155A - PCB photoresist spraying equipment and photoresist spraying method - Google Patents
PCB photoresist spraying equipment and photoresist spraying method Download PDFInfo
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- CN114985155A CN114985155A CN202210620958.5A CN202210620958A CN114985155A CN 114985155 A CN114985155 A CN 114985155A CN 202210620958 A CN202210620958 A CN 202210620958A CN 114985155 A CN114985155 A CN 114985155A
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- 229920002120 photoresistant polymer Polymers 0.000 title claims abstract description 132
- 238000005507 spraying Methods 0.000 title claims abstract description 61
- 239000000758 substrate Substances 0.000 claims abstract description 94
- 239000007921 spray Substances 0.000 claims abstract description 46
- 238000007664 blowing Methods 0.000 claims abstract description 42
- 238000000576 coating method Methods 0.000 claims abstract description 35
- 239000011248 coating agent Substances 0.000 claims abstract description 29
- 230000007246 mechanism Effects 0.000 claims abstract description 26
- 238000002347 injection Methods 0.000 claims abstract description 17
- 239000007924 injection Substances 0.000 claims abstract description 17
- 239000007788 liquid Substances 0.000 claims description 11
- 238000000034 method Methods 0.000 claims description 8
- 238000010438 heat treatment Methods 0.000 claims description 7
- 239000002699 waste material Substances 0.000 abstract description 3
- 230000008569 process Effects 0.000 description 6
- 239000003085 diluting agent Substances 0.000 description 4
- 230000009471 action Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 238000001259 photo etching Methods 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000012895 dilution Substances 0.000 description 1
- 238000010790 dilution Methods 0.000 description 1
- 238000003618 dip coating Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B13/00—Machines or plants for applying liquids or other fluent materials to surfaces of objects or other work by spraying, not covered by groups B05B1/00 - B05B11/00
- B05B13/02—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work
- B05B13/0221—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work characterised by the means for moving or conveying the objects or other work, e.g. conveyor belts
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B12/00—Arrangements for controlling delivery; Arrangements for controlling the spray area
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B12/00—Arrangements for controlling delivery; Arrangements for controlling the spray area
- B05B12/08—Arrangements for controlling delivery; Arrangements for controlling the spray area responsive to condition of liquid or other fluent material to be discharged, of ambient medium or of target ; responsive to condition of spray devices or of supply means, e.g. pipes, pumps or their drive means
- B05B12/084—Arrangements for controlling delivery; Arrangements for controlling the spray area responsive to condition of liquid or other fluent material to be discharged, of ambient medium or of target ; responsive to condition of spray devices or of supply means, e.g. pipes, pumps or their drive means responsive to condition of liquid or other fluent material already sprayed on the target, e.g. coating thickness, weight or pattern
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B13/00—Machines or plants for applying liquids or other fluent materials to surfaces of objects or other work by spraying, not covered by groups B05B1/00 - B05B11/00
- B05B13/02—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work
- B05B13/0278—Arrangement or mounting of spray heads
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B15/00—Details of spraying plant or spraying apparatus not otherwise provided for; Accessories
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B16/00—Spray booths
- B05B16/20—Arrangements for spraying in combination with other operations, e.g. drying; Arrangements enabling a combination of spraying operations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B17/00—Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups
- B05B17/04—Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups operating with special methods
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/02—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by baking
- B05D3/0218—Pretreatment, e.g. heating the substrate
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/04—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to gases
- B05D3/0406—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to gases the gas being air
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B5/00—Cleaning by methods involving the use of air flow or gas flow
- B08B5/02—Cleaning by the force of jets, e.g. blowing-out cavities
- B08B5/023—Cleaning travelling work
Landscapes
- Application Of Or Painting With Fluid Materials (AREA)
Abstract
The invention provides a PCB photoresist spraying device and a photoresist spraying method, which relate to the technical field of photoresist coating and comprise a conveying line, a spraying body, an air blowing mechanism and a controller, wherein the conveying line, the spraying body and the air blowing mechanism are connected with the controller through a circuit, a substrate is carried on the conveying line and is used for conveying a substrate to be coated with photoresist, photoresist is sprayed below the spraying body, and then the surface of the substrate is uniformly blown and smoothed through the air blowing mechanism, the PCB photoresist spraying device and the photoresist spraying method accurately control the feeding amount of the photoresist through an injection pump, atomize and disperse the photoresist passing through a nozzle, and directly disperse and spray the photoresist on the surface of the corresponding heated substrate through guiding of pressurized air flow, thereby improving the photoresist coating efficiency, reducing the photoresist coating waste, and simultaneously leading the substrate coated with the photoresist to enter the air blowing mechanism along with the conveying line, and the surface of the substrate is blown and dispersed, so that the photoresist is coated on the surface of the substrate with better uniformity.
Description
Technical Field
The invention relates to the technical field of photoresist coating, in particular to a PCB photoresist spraying device and a photoresist spraying method.
Background
In the photoetching process, the quality of the coating quality of the photoresist directly influences the photoetching quality. Common photoresist coating methods are: spin coating, spray coating, roll coating, dip coating, and the like.
In the coating of the photoresist of the PCB, a 'gluing-whirl coating' process is mainly adopted, and the process comprises the steps of firstly placing a substrate to be coated on an operation platform, and then adjusting a coating nozzle fixed below a nozzle translation device to a proper position above the substrate to be coated by adjusting the nozzle translation device; and then the photoresist supply device sprays the photoresist from the coating nozzle at a certain speed, and meanwhile, the nozzle translation device drives the coating nozzle to translate above the substrate, so that a layer of photoresist with the required thickness is coated on the substrate.
The coating process has the following disadvantages:
1, the efficiency is low because the coating nozzle is driven by the nozzle translation device to translate above the substrate, so that the efficiency is low;
2, the uniformity of the photoresist coating and the substrate surface is poor, and even unevenness is formed.
In conclusion, the present disclosure is derived therefrom.
Disclosure of Invention
Technical problem to be solved
Aiming at the defects of the prior art, the invention provides a PCB photoresist spraying device and a photoresist spraying method, which solve the problems in the background art.
(II) technical scheme
In order to achieve the purpose, the invention is realized by the following technical scheme: a PCB photoresist spraying device and a photoresist spraying method are disclosed, wherein the photoresist spraying device comprises: the photoresist coating device comprises a conveying line, a coating body, an air blowing mechanism and a controller, wherein the conveying line, the coating body and the air blowing mechanism are connected with the controller through lines, a substrate is borne on the conveying line and used for conveying a substrate to be coated with photoresist, the photoresist is coated below the coating body, and then the surface of the substrate is uniformly blown and smoothed through the air blowing mechanism.
Preferably, the spraying body comprises a spray head, a nozzle bracket, a differential head, a knob and a main shaft.
Preferably, still include the syringe pump and be used for feeding volume photoresist, vibration generator for produce pulse signal, still include the air pump, be used for providing the air current of taking the pressure, syringe pump, vibration generator and air pump link to each other with the controller, still include pressure sensor, pressure sensor installs before near the shower nozzle, the shower nozzle with syringe pump, vibration generator and air pump link to each other for spout atomizing, dispersed photoresist liquid droplet.
Preferably, the air blowing mechanism comprises an air blowing box, an upper cover plate, a plurality of air inlet holes and a plurality of air outlet holes, the conveying line penetrates through the air blowing box, the air inlet holes are formed in the upper cover plate and connected with an air pump, and the air outlet holes are formed in the two sides of the conveying line.
Preferably, the nozzle bracket is further provided with a blowing head, the blowing head is connected with an air pump, and the blowing head sprays air to the part, which is not sprayed on the surface of the substrate, so as to blow off foreign matters.
Preferably, the bottom of the substrate is provided with a heating plate.
A PCB photoresist coating method comprises the following steps:
step: installing a photoresist substrate to be sprayed on a conveying line of a bearing substrate;
step: the blowing head sprays gas to the part, which is not sprayed, of the substrate, so that the foreign matters are separated from the substrate along the moving direction of the conveying line;
step: the substrate passes below the spray head, and the spray head body sprays the photoresist solution on the substrate;
step: the substrate coated with the photoresist enters a box body of an air blowing mechanism along with a conveying line, air enters through an air inlet, air is discharged through an air outlet to form air flow, and the photoresist on the surface of the substrate is uniformly blown;
step: the photoresist on the surface of the substrate is coagulated.
(III) advantageous effects
The invention provides a PCB photoresist spraying device and a photoresist spraying method. The method has the following beneficial effects:
1. according to the PCB photoresist spraying equipment and the photoresist spraying method, the feeding amount (flow and flow velocity) of the photoresist is accurately controlled through the injection pump, the photoresist flowing through the nozzle is atomized and dispersed, and is directly dispersed and sprayed on the surface of the corresponding heated substrate through the guiding of the pressurized air flow, so that the photoresist coating efficiency is improved, and the photoresist coating waste is reduced.
2. According to the PCB photoresist spraying equipment and the photoresist spraying method, the substrate sprayed with the photoresist enters the air blowing mechanism along with the conveying line, and the surface of the substrate is blown and dispersed, so that the photoresist is better in uniformity when being coated on the surface of the substrate.
Drawings
FIG. 1 is a first schematic structural diagram of the present invention;
FIG. 2 is a second structural diagram of the present invention;
FIG. 3 is a schematic view of the blowing mechanism of the present invention;
FIG. 4 is a flow chart of the present invention.
In the figure: 1. a conveying line; 2. a substrate; 3. a substrate; 4. an injection pump; 5. a vibration generator; 6. an air pump; 7. spraying the body; 71. a spray head; 72. a nozzle holder; 73. differentiating the head; 74. a knob; 75. a main shaft; 8. a pressure sensor; 9. an air blowing mechanism; 91. a box body; 92. an upper cover plate; 93. an air inlet; 94. an air outlet; 95. an air deflector; 10. a blowing head.
Detailed Description
The embodiment of the invention provides a PCB photoresist spraying device and a photoresist spraying method, as shown in figures 1-4, the PCB photoresist spraying device comprises a conveying line, a spraying body, an air blowing mechanism and a controller, wherein the conveying line, the spraying body and the air blowing mechanism are connected with the controller through a circuit, a substrate is carried on the conveying line and used for conveying a substrate to be coated with photoresist, a heating plate is arranged at the bottom of the substrate, the photoresist is sprayed below the spraying body, and then the surface of the substrate is uniformly blown and smoothed through the air blowing mechanism.
The spraying body includes shower nozzle, nozzle holder, differential head, knob, main shaft, and the PCB photoresist coating equipment of this embodiment includes the optical spraying body, and this optical spraying body can include: the optical spraying body can further comprise any other required components, and the functions of the nozzle, the nozzle support, the differential head, the knob and the spindle are also similar to those of the prior art and are not described again.
As shown in fig. 1, the PCB photoresist coating apparatus includes a syringe pump, a vibration generator, an air pump, a spray body, and the like.
Specifically, the injection pump is a precision injection pump, is connected with the spray head, and is used for feeding photoresist to the spray head, and the flow rate of photoresist supply can be adjusted and controlled, so that the spray head can stably spray the photoresist.
The vibration generator is connected with the spray head and used for generating pulse signals and transmitting the pulse signals to the spray head so that the spray head vibrates to atomize the photoresist.
The air pump is connected with the spray head and used for providing air flow with pressure to the spray head so that the atomized photoresist liquid drops are scattered and sprayed out under the guiding action of compressed air.
The spray head is connected with the injection pump, the vibration generator and the air pump, receives the photoresist liquid stably supplied by the injection pump, atomizes and disperses the photoresist liquid, and then sprays the atomized and dispersed photoresist out of the spray nozzle under the action of the pressurized air flow provided by the air pump.
The injection pump, the vibration generator and the air pump are connected with the controller, the device further comprises a pressure sensor, the pressure sensor is arranged in front of the spray head, the model of the pressure sensor is CHM6A5-M8 contact type pressure sensor, the pressure sensor is connected with the controller, when the substrates on two sides of the base plate contact the pressure sensor, signals are transmitted to the controller, and the controller controls the spray head to spray photoresist.
The sprayer is internally provided with a vibrating piece which is connected with a vibration generator, receives a pulse signal generated by the vibration generator, converts the pulse signal into pulse vibration, and atomizes and disperses photoresist liquid which contacts and flows through the sprayer. The substrate includes a heating plate therein, which heats a substrate mounted on the substrate. The spray head corresponds to the position of a substrate arranged on the substrate, and the spray nozzle of the spray head can spray atomized and dispersed photoresist liquid drops onto the surface of the substrate to form a photoresist film on the surface of the substrate.
The air blowing mechanism comprises an air blowing box, an upper cover plate, a plurality of air inlet holes and a plurality of air outlet holes, the conveying line penetrates through the air blowing box, the air inlet holes are formed in the upper cover plate and connected with the air pump, and the air outlet holes are formed in the two sides of the conveying line.
The nozzle bracket is also provided with a blowing head which is connected with an air pump and sprays air to the part which is not sprayed on the surface of the substrate to blow off foreign matters.
A PCB photoresist coating method comprises the following steps:
step 1: installing a photoresist substrate to be sprayed on a conveying line of a bearing substrate;
step 2: the blowing head sprays gas to the part of the substrate which is not sprayed, so that the foreign matters are separated from the substrate along the moving direction of the conveying line; since the foreign matter removing device can be positioned above the substrate to be coated, when the coating nozzle is used for coating the upper surface of the substrate to be coated, the foreign matter removing device can spray gas to the part, not coated with glue, of the upper surface of the substrate to be coated, and the gas can enable foreign matters to be separated from the substrate to be coated along the moving direction of the nozzle translation device. This enables the foreign-matter removing device to remove foreign matter on the substrate to be coated before the coating nozzle performs no glue application operation. Therefore, the problem of uneven surface after coating the photoresist due to the existence of the contaminated foreign matters on the surface is avoided, and further various adverse conditions are avoided.
Step 3: the substrate passes below the spray head, and the spray head body sprays the photoresist solution on the substrate; when the photoresist coating method is adopted for production, the following steps are set: the feed flow range of the injection pump is between 0.1 and 0.3 ml/min; the air pressure supplied by the air pump ranges from 5 to 10 kpa; the operating power of the vibration generator is 1.0-0.5 w; the distance between the spray head and a substrate arranged on the substrate is 56-86 mm; the heating temperature of the heating plate in the substrate is between 40 ℃ and 65 ℃. The adjustment is carried out according to the process parameter range, so that better production process parameters can be obtained quickly, and the photoresist film substrate with the thickness and the uniformity meeting the requirements can be obtained.
Step 4: the base plate sprayed with the photoresist enters a box body of an air blowing mechanism along with a conveying line, air enters through an air inlet, air is discharged through an air outlet to form air flow, and the photoresist on the surface of the base plate is uniformly blown; as shown in fig. 2, the air blowing mechanism includes a box body, an upper cover plate is arranged on the box body, an air inlet hole is arranged on the upper cover plate, the air inlet hole is connected with an air pump, air outlet holes are arranged above the box body which is penetrated through by the conveying line, air outlet holes can be arranged in four directions, air enters the base plate via the air inlet hole and then is discharged from the air outlet holes, an air deflector is obliquely arranged above the air outlet holes in the box body, and when the air blows the surface of the base plate, the air deflector rebounds, and flows into the air outlet holes along with the air deflector.
Step 5: the photoresist on the surface of the substrate is coagulated.
In summary, the system can transport the feeding amount of the photoresist liquid to the spray head through the injection pump; the photoresist liquid is atomized and dispersed in the spray head through pulse vibration converted from pulse signals generated by a vibration generator; then the compressed gas generated by the air pump is guided to be sprayed out and sprayed onto the surface of the substrate; the substrate is positioned and installed on the substrate and is heated in advance, and the photoresist is sprayed to the surface of the heated substrate, so that a photoresist film can be quickly dried to form, the coating processing time is shortened, and the production efficiency is improved. The position of the spray head relative to the substrate can be adaptively adjusted, and the thickness and uniformity of the photoresist film on the surface of the substrate can be rapidly and accurately detected through the thickness detector. The thickness of the photoresist film coated and produced by the system meets the requirement and the uniformity is good.
The working principle is as follows: when the PCB photoresist spraying equipment and the photoresist spraying method are used, a substrate to be coated with photoresist is placed on a substrate with a heating function, photoresist diluent with a certain dilution volume ratio is configured, an injector containing the photoresist diluent is fixed on an injection pump, process parameters such as the flow rate of the injection pump, the air pressure of an air pump, the power of an ultrasonic generator, the distance between a nozzle and a substrate and the substrate temperature of the substrate are adjusted, after the process parameters are adjusted, the injection pump enables the photoresist diluent to be injected into the nozzle with a certain feeding amount, the ultrasonic generator continuously sends pulses to excite piezoelectric ceramic vibration in the nozzle, the photoresist diluent in the nozzle can be vibrated to be broken into liquid drops, the substrate moves forward along with a conveying line, after the upper surfaces of two sides of the substrate are contacted with a pressure sensor, a controller controls the nozzle to be started, and the photoresist liquid drops are atomized and dispersed on the surface of the heated substrate at a certain distance from the nozzle under the guiding action of load gas, the substrate coated with the photoresist enters the air blowing mechanism along with the conveying line, and the photoresist is blown and dispersed by the air blowing mechanism, so that the photoresist is uniformly coated on the surface of the substrate.
In view of the above, it is desirable to provide,
1. according to the PCB photoresist spraying equipment and the photoresist spraying method, the feeding amount (flow and flow velocity) of the photoresist is accurately controlled through the injection pump, the photoresist flowing through the nozzle is atomized and dispersed, and is directly dispersed and sprayed on the surface of the corresponding heated substrate through the guiding of the pressurized air flow, so that the photoresist coating efficiency is improved, and the photoresist coating waste is reduced.
2. According to the PCB photoresist spraying equipment and the photoresist spraying method, the substrate sprayed with the photoresist enters the air blowing mechanism along with the conveying line, and the surface of the substrate is blown and dispersed, so that the photoresist is better in uniformity when being coated on the surface of the substrate.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (7)
1. A PCB photoresist spraying device and a photoresist spraying method are characterized in that: including transfer chain (1), spraying body (7), air-blowing mechanism (9) and controller, transfer chain (1), spraying body (7), air-blowing mechanism (9) and controller line connection, bear substrate (2) on transfer chain (1) for carry and treat base plate (3) of coating photoresist, through spraying body (7) below spraying photoresist, rethread air-blowing mechanism (9) evenly blow and smooth to base plate (3) surface.
2. The PCB photoresist spraying apparatus and method according to claim 1, wherein the spraying body (7) comprises a spray head (71), a nozzle support (72), a differential head (73), a knob (74) and a spindle (75).
3. The PCB photoresist spraying equipment and the photoresist spraying method according to claim 2, further comprising an injection pump (4) for feeding photoresist, a vibration generator (5) for generating pulse signals, and an air pump (6) for providing air flow under pressure, wherein the injection pump (4), the vibration generator (5) and the air pump (6) are connected with a controller, and further comprising a pressure sensor (8), the pressure sensor (8) is arranged in front of the spray head (71), and the spray head (71) is connected with the injection pump (4), the vibration generator (5) and the air pump (6) for spraying atomized and dispersed photoresist droplets.
4. The PCB photoresist spraying apparatus and the photoresist spraying method according to claim 3, wherein: the air blowing mechanism (9) comprises an air blowing box (91), an upper cover plate (92), a plurality of air inlet holes (93) and a plurality of air outlet holes (94), the conveying line (1) penetrates through the air blowing box (91), the air inlet holes (93) are formed in the upper cover plate (142) and connected with the air pump (6), and the air outlet holes (94) are formed in two sides of the conveying line (1).
5. The PCB photoresist spraying apparatus and the photoresist spraying method according to claim 2, wherein: and the nozzle bracket (4) is also provided with a blowing head (10), the blowing head (10) is connected with the air pump (6) and used for spraying air to the part, which is not sprayed, on the surface of the substrate (3) to blow off foreign matters.
6. The PCB photoresist spraying equipment and the photoresist spraying method according to claim 1, wherein: the bottom of the substrate (2) is provided with a heating plate.
7. A PCB photoresist coating method is characterized in that:
step 1: a substrate (3) to be sprayed with photoresist is arranged on a conveying line of a bearing substrate (2);
step 2: the air blowing head (8) sprays air to the part, which is not sprayed, of the substrate (3), so that foreign matters are separated from the substrate (3) along the moving direction of the conveying line (1);
step 3: the substrate (3) passes below the spray head (71), and the spray head body (7) sprays the photoresist liquid on the substrate (3);
step 4: the substrate (3) coated with the photoresist enters a box body (91) of an air blowing mechanism (9) along with a conveying line, air enters through an air inlet hole (93), air is discharged through an air outlet hole (94) to form air flow, and the photoresist on the surface of the substrate is uniformly blown;
step 5: the photoresist on the surface of the substrate (3) is condensed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210620958.5A CN114985155A (en) | 2022-06-02 | 2022-06-02 | PCB photoresist spraying equipment and photoresist spraying method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210620958.5A CN114985155A (en) | 2022-06-02 | 2022-06-02 | PCB photoresist spraying equipment and photoresist spraying method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114985155A true CN114985155A (en) | 2022-09-02 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210620958.5A Pending CN114985155A (en) | 2022-06-02 | 2022-06-02 | PCB photoresist spraying equipment and photoresist spraying method |
Country Status (1)
| Country | Link |
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| CN (1) | CN114985155A (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05234871A (en) * | 1992-02-20 | 1993-09-10 | Nec Kagoshima Ltd | Photoresist coater |
| JPH09179308A (en) * | 1995-12-27 | 1997-07-11 | Hitachi Cable Ltd | Coating device of photoresist |
| US20030003760A1 (en) * | 2001-06-27 | 2003-01-02 | Kim Sung-Il | Photoresist coating method and apparatus |
| US20060278160A1 (en) * | 2005-06-14 | 2006-12-14 | Quanta Display Inc. | Photoresist coating method and apparatus for performing same |
| US20110192917A1 (en) * | 2010-02-08 | 2011-08-11 | Hon Hai Precision Industry Co., Ltd. | Spray apparatus and coating system using same |
| CN210333180U (en) * | 2019-04-30 | 2020-04-17 | 铜陵市峰华电子有限公司 | Continuous wafer dispensing equipment |
| CN112099313A (en) * | 2020-09-22 | 2020-12-18 | 苏州微赛智能科技有限公司 | Photoresist coating system and photoresist coating method |
-
2022
- 2022-06-02 CN CN202210620958.5A patent/CN114985155A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05234871A (en) * | 1992-02-20 | 1993-09-10 | Nec Kagoshima Ltd | Photoresist coater |
| JPH09179308A (en) * | 1995-12-27 | 1997-07-11 | Hitachi Cable Ltd | Coating device of photoresist |
| US20030003760A1 (en) * | 2001-06-27 | 2003-01-02 | Kim Sung-Il | Photoresist coating method and apparatus |
| US20060278160A1 (en) * | 2005-06-14 | 2006-12-14 | Quanta Display Inc. | Photoresist coating method and apparatus for performing same |
| US20110192917A1 (en) * | 2010-02-08 | 2011-08-11 | Hon Hai Precision Industry Co., Ltd. | Spray apparatus and coating system using same |
| CN210333180U (en) * | 2019-04-30 | 2020-04-17 | 铜陵市峰华电子有限公司 | Continuous wafer dispensing equipment |
| CN112099313A (en) * | 2020-09-22 | 2020-12-18 | 苏州微赛智能科技有限公司 | Photoresist coating system and photoresist coating method |
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Application publication date: 20220902 |
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