CN114964101B - Automatic measuring equipment and measuring method for module glue height - Google Patents
Automatic measuring equipment and measuring method for module glue height Download PDFInfo
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- CN114964101B CN114964101B CN202210894452.3A CN202210894452A CN114964101B CN 114964101 B CN114964101 B CN 114964101B CN 202210894452 A CN202210894452 A CN 202210894452A CN 114964101 B CN114964101 B CN 114964101B
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- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B21/00—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant
- G01B21/02—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring length, width, or thickness
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Abstract
The invention discloses a module glue height automatic measuring device and a measuring method thereof, belonging to the technical field of automatic measuring devices, and comprising a measuring device body, wherein the measuring device body comprises a bearing bottom plate, an upper track plate and a lower track plate, the lower track plate is provided with a hole groove, the bearing bottom plate is placed in the hole groove, the upper plane of the bearing bottom plate is flush with the upper plane of the lower track plate, the upper track plate and the lower track plate are matched to form a product track, a module is arranged above the bearing bottom plate, a measuring glue surface is arranged above the module, a height measuring sensor is arranged above the outside of the module, the height measuring sensor is arranged right opposite to the module, and the height measuring sensor and the module are in one-to-one correspondence. The problems in the prior art are solved.
Description
Technical Field
The invention relates to automatic measuring equipment and a measuring method for module adhesive height, and belongs to the technical field of automatic measuring devices.
Background
In the module packaging process, following the IC attach and wire bonding process, the encapsulation machine completes the final packaging of the module. However, due to the influence of various factors, the thickness of the rubber surface of the encapsulated module is often inconsistent, and the thickness of the module needs to be measured. The traditional manual detection mode has the disadvantages of low efficiency, high labor intensity and the like, and the automatic detection equipment must gradually replace manual detection. The modules to be tested are smart card modules, the substrate thickness is about 0.15mm, it is continuous during manufacturing and testing, and most of the middle part does not allow friction with the equipment to cause product damage, so it generally moves along the track when being processed in many production processes, and two side edges can contact with the track. In the prior art, a manual micrometer is adopted to carry out height test on the test piece, the test process is long in time, and the efficiency is low; the pneumatic contact type height measuring sensor is an effective technical means for realizing the measuring function of the thickness of the module, but a sensor specially used for measuring the glue height of the module is lacked in the prior art, and meanwhile, the height measuring sensor in the prior art is used for directly measuring the glue height of the module, so that the following problems exist:
1. the bottom plate of contact is metal material (generally with copper and stainless steel), and hardness is high, and elasticity is poor, because the product metal covering is soft relatively, and the surface hardness is lower, presses down the back when height finding sensor gauge head, causes the crushing of product metal covering easily, directly causes the product to scrap.
2. In the prior art, the measuring head has large impact force when being pressed down, so that the possibility of IC splinter and NG electrical measurement of products is high.
3. The module that awaits measuring lacks effectual fixed part, and the effectual protective member of unable installation in outside simultaneously prevents the module damage after using attached sticky tape to fix the module that awaits measuring among the prior art, because the sticky tape has certain thickness and material softness, when the height measurement sensor pushes down, the sticky tape has the deformation of certain degree, leads to measuring result inaccurate.
4. Due to processing and mounting errors and the generation of scratching and grinding damage, the horizontal height of the upper surface of the bottom plate is lower than the lower surface of the product track, so that the middle part of the module is firmly adsorbed and sunken when the module is adsorbed, and the edges of two sides of the module are positioned in the product track and higher than the middle part of the module; when the measuring head is pressed down for measurement, systematic measurement errors are inevitably caused.
5. In the prior art, height measuring sensors cannot uniformly regulate pressure, so that the pressing pressure of the height measuring sensors is different, and different height measuring sensors have different measurement results on the same module.
Based on the above problems in the prior art, how to reduce the damage to the module caused by the glue high-automation equipment in the measurement process and effectively improve the measurement accuracy becomes an urgent need at present.
Disclosure of Invention
Aiming at the defects of the prior art, the invention aims to provide a module glue high-automatic measuring device and a measuring method thereof, which solve the problems in the prior art.
The invention relates to a module glue height automatic measuring device which comprises a measuring device body, wherein the measuring device body comprises a bearing bottom plate, an upper track plate and a lower track plate, a hole groove is formed in the lower track plate, the bearing bottom plate is placed in the hole groove, the upper plane of the bearing bottom plate is flush with the upper plane of the lower track plate, the upper track plate and the lower track plate are matched to form a product track, a module is arranged above the bearing bottom plate, a measuring glue surface is arranged above the module, a height measuring sensor is arranged above the outside of the module, the height measuring sensor is placed over against the module, the height measuring sensor and the module are in one-to-one correspondence, a measuring head below the height measuring sensor presses down to the measuring glue surface, the measuring head of the height measuring sensor retracts after measurement is finished, and the height measuring sensor is connected with a pressure control component to realize pressure control during measurement of the height measuring sensor.
Furthermore, a negative pressure adsorption device is arranged on the bearing bottom plate and used for adsorbing and fixing the module.
Furthermore, a blowing hole is formed in the bearing bottom plate, and the position of the blowing hole is close to the edge of the bearing bottom plate.
Furthermore, a pressure sensor is arranged below a measuring head in the height measuring sensor.
Furthermore, the pressure control part is an air path pressure regulating control part, a plurality of air path pressure regulating devices are arranged in the air path pressure regulating control part, each air path pressure regulating device is respectively and independently connected with one height measuring sensor, and air paths between the height measuring sensors are separated to realize independent air pressure control.
Further, the gas circuit pressure regulating devices comprise electromagnetic valves and pressure regulating valves, and a plurality of gas circuit pressure regulating devices are connected in parallel and then connected with gas sources.
Furthermore, the height measurement sensor is connected with a sensor clamping device, and the height measurement sensor is clamped and positioned through the sensor clamping device, so that the installation height of the height measurement sensor is adjusted.
The invention relates to a method for automatically measuring the module adhesive height, which comprises the following steps:
s1: adjusting the pressure value and the height value of the height measuring sensor to ensure that the pressing pressure of the measuring heads of all the height measuring sensors is the same;
s2: after the module to be measured is moved to a measuring position along the product track, the supporting bottom plate adsorbs the product on the supporting bottom plate through a negative pressure adsorption device;
s3: pressing down all height measuring sensor measuring heads to a measuring rubber surface, and retracting the measuring heads after the measurement is finished;
s4: the air blowing holes on the bearing bottom plate are used for blowing air at positive pressure, and the product is blown away from the surface of the bearing bottom plate;
s5: the module moves forward, the untested module moves to the measuring position, and steps S2-S4 are repeated.
Further, the step of adjusting the pressure value of the height sensor in step S1 specifically includes the following steps: and placing the pressure sensor below the measuring head, controlling to open the electromagnetic valve corresponding to the height measuring sensor to enable the measuring head to press down to the surface of the pressure sensor, adjusting the pressure regulating valve to enable the pressure sensor to display the value as a set value, and adjusting all the height measuring sensors to be consistent in pressure according to the steps.
Further, the step of adjusting the height value of the height measuring sensor in step S1 specifically includes the following steps: and each height measuring sensor is placed in the sensor clamping device for clamping and positioning, and the mounting height of each height measuring sensor is adjusted to be consistent by using a standard gauge between the base plane and the measuring head in the retraction state of the measuring head of the height measuring sensor.
Further, the pressure value setting range of the height measuring sensor is as follows: 0.3N-0.5N.
Compared with the prior art, the invention has the following beneficial effects:
according to the module glue height automatic measuring equipment and the measuring method thereof, the module glue height can be measured, and the product defects caused by an automatic height measuring device are greatly reduced. The support bottom plate is made of POM materials, and has high strength and rigidity, good elasticity and good abrasion resistance. A large number of tests show that when other test conditions are the same, the metal bottom plate can cause the metal surface of the product to be crushed, the POM bottom plate can not cause the crushing, and an adhesive tape does not need to be attached. The position of the air blowing and sucking hole is close to the edge of the bottom plate, so that the generation of scratching and grinding damage caused by the friction between the module and the edge of the bottom plate when the module moves is prevented.
The bottom plate has the function of a lower rail. The bottom plate is widened, the large hole groove is formed in the corresponding position of the lower rail, the bottom plate can be placed in the hole groove, and the bottom plate and the upper rail form a product rail, so that the bottom plate has the function of the lower rail. The benefit of design like this lies in, has the negative pressure to carry out the module when adsorbing at the bottom plate aperture, can all adsorb whole module bottom surface on the bottom plate, has avoided systematic measuring error. When the original device is used, the scratch rate of the surface of the product is about 5-20% under the condition that the adhesive tape is not attached. When the device is used, the scratch can be almost avoided.
The maintenance time is reduced. Typically, 10 rolls of product are tested and replaced with one tape change, each time for about 30-60 minutes. When the device is used, the maintenance time is short, and only clean compressed air is used for blowing and wiping the upper surface of the bottom plate. The damage of the glue high-automation equipment to the module product in the measuring process can be greatly reduced, and the measuring precision is improved. The problems in the prior art are solved.
Drawings
FIG. 1 is a front view of a measuring apparatus in an embodiment of the present invention;
FIG. 2 is a side view of a measuring apparatus in an embodiment of the present invention;
FIG. 3 is a diagram of a pressure regulating control gas circuit of the height measuring sensor in the embodiment of the invention;
FIG. 4 is a schematic structural diagram of a height sensor clamping device according to an embodiment of the present invention;
fig. 5 is a perspective view of a measuring apparatus in an embodiment of the present invention.
In the figure: 1. a height measurement sensor; 2. Measuring the rubber surface; 3. An upper track plate; 4. A module; 5. A lower track plate; 6. A bearing bottom plate; 7. A gas path pressure regulating device; 8. And (4) a gas source.
Detailed Description
The invention is further illustrated by the following examples in conjunction with the drawings:
example 1:
as shown in fig. 1, 2, and 5, the automatic measuring apparatus for module glue height according to the present invention includes a supporting bottom plate 6, an upper track plate 3, and a lower track plate 5, wherein a hole groove is formed on the lower track plate 5, the supporting bottom plate 6 is placed in the hole groove, the upper plane of the supporting bottom plate 6 is flush with the upper plane of the lower track plate 5, the upper track plate 3 and the lower track plate 5 cooperate to form a product track, a module 4 is disposed above the supporting bottom plate 6, a measuring glue surface 2 is disposed above the module 4, a height measuring sensor 1 is disposed above the module 4, the height measuring sensor 1 is disposed opposite to the module 4, the height measuring sensors 1 and the modules 4 are in a one-to-one correspondence relationship, a measuring head below the height measuring sensor 1 presses down to the measuring glue surface 2, and the measuring head of the height measuring sensor 1 retracts after measurement is completed, and the height measuring sensor 1 is connected to a pressure control component to realize pressure control when the height measuring sensor 1 measures.
And a negative pressure adsorption device is arranged on the bearing bottom plate 6 and is used for adsorbing and fixing the module 4.
The bearing bottom plate 6 is also provided with a blowing hole, and the position of the blowing hole is close to the edge of the bearing bottom plate 6.
A pressure sensor is arranged below a measuring head in the height measuring sensor 1.
As shown in fig. 3, the pressure control part is a gas circuit pressure regulating control part, a plurality of gas circuit pressure regulating devices 7 are arranged in the gas circuit pressure regulating part, each gas circuit pressure regulating device 7 is respectively and independently connected with one height measuring sensor 1, and the gas circuits of the height measuring sensors 1 are separated, so that independent air pressure control is realized. The gas circuit pressure regulating devices 7 comprise electromagnetic valves and pressure regulating valves, and a plurality of gas circuit pressure regulating devices 7 are connected in parallel and then connected with a gas source 8.
As shown in fig. 4, the height measuring sensor 1 is connected with a sensor clamping device, and the height measuring sensor 1 is clamped and positioned by the sensor clamping device to adjust the installation height of the height measuring sensor 1. The sensor clamping device clamps the height measuring sensor 1 by tightening a screw on the side surface. One end of a clamping plate is provided with two holes with the diameter slightly larger than that of the height measuring sensor 1, a gap is reserved from the hole at the inner side to the edge of the plate, each hole can be used for placing one height measuring sensor 1, and after the height is adjusted, the height measuring sensor 1 is clamped by fastening two screws.
The working principle of the embodiment is as follows: during measurement, after a module to be measured moves to a measurement position along a rail, negative pressure is generated at a small hole on the metal supporting bottom plate 6, and a product is adsorbed on the supporting bottom plate 6; all measuring heads of the height measuring sensor 1 are pressed down to the rubber surface, and the measuring heads retract after the measurement is finished; positive pressure blowing is formed at the small hole on the metal bottom plate, and the product is blown away from the surface of the bottom plate; the module moves forward, the untested module moves to the measuring position, and the steps are repeated.
Supporting base plate 6 material: the supporting bottom plate 6 is made of POM material, and has high strength and rigidity, good elasticity and good abrasion resistance. A large number of tests show that when other test conditions are the same, the metal bottom plate can cause the metal surface of a product to be crushed, and the POM bottom plate can not cause the crushing and the adhesive tape is not required to be attached.
Arranging blowing and sucking air holes: the position of the air blowing and sucking hole is close to the edge of the bottom plate, so that the generation of scratching and grinding damage caused by the friction between the module and the edge of the bottom plate when the module moves is prevented.
The matching mode of the bearing bottom plate 6 and the track is as follows: the supporting base plate 6 has the function of a lower rail. The bottom plate is widened, the large hole groove is formed in the corresponding position of the lower rail, the bottom plate can be placed in the hole groove, and the bottom plate and the upper rail form a product rail, so that the bottom plate has the function of the lower rail. Compare former track, the benefit of design like this lies in, has the negative pressure to carry out the module when adsorbing at the bottom plate aperture, can all adsorb whole module bottom surface on the bottom plate, has avoided the systematic measuring error in former track.
And carrying out pressure calibration on all height measuring sensors. The height measuring sensor is generally pneumatic in view of automation, high detection speed and high controllability. The invention separates the gas paths of the height measuring sensors, realizes independent air pressure control and adjusts the pressure of the measuring heads of the sensors to be consistent.
Example 2:
the invention relates to a method for automatically measuring the height of a module adhesive, which comprises the following steps:
s1: adjusting the pressure value and the height value of the height measuring sensor 1 to ensure that the pressing pressure of the measuring heads of all the height measuring sensors 1 is the same;
s2: after the module 4 to be measured is moved to a measuring position along the product track, the supporting bottom plate 6 adsorbs the product on the supporting bottom plate 6 through a negative pressure adsorption device;
s3: all the measuring heads of the height measuring sensor 1 are pressed down to the measuring rubber surface 2, and the measuring heads retract after the measurement is finished;
s4: the air blowing holes on the bearing bottom plate 6 are used for blowing air at positive pressure, and the product is blown away from the surface of the bearing bottom plate 6;
s5: the module 4 is moved forward and the untested module is moved to the measuring position and steps S2-S4 are repeated.
The step of adjusting the pressure value of the height sensor in the step S1 specifically includes the following steps: and placing the pressure sensor below the measuring head, controlling to open the electromagnetic valve corresponding to the height measuring sensor to enable the measuring head to press down to the surface of the pressure sensor, adjusting the pressure regulating valve to enable the pressure sensor to display the value as a set value, and adjusting all the height measuring sensors to be consistent in pressure according to the steps.
The step of adjusting the height value of the height measuring sensor in the step S1 specifically includes the following steps: and each height measuring sensor is placed in the sensor clamping device for clamping and positioning, and the mounting height of each height measuring sensor is adjusted to be consistent by using a standard gauge between the base plane and the measuring head in the retraction state of the measuring head of the height measuring sensor.
The specific case corresponding to example 2:
a section of the product is taken and subjected to the height test by using the method and the device.
The method comprises the following steps:
1. using the structure shown in fig. 1;
2. the control mode of the height measuring sensor 1 is as shown in figure 3, and the air pressure is adopted for independent control;
3. the height measuring sensor 1 is a mature product, and a Digi Crown2 digital pen type sensor manufactured by Marcoss company is selected here, and the high-precision displacement is calculated in a grating ruler pulse mode. The height measurement sensor is connected to a computer, and height measurement data can be read out and stored through the control of a main control algorithm.
4. The supporting bottom plate 6 is made of POM material and is provided with a negative pressure adsorption device and air holes which are reasonably arranged;
the measurement steps are as follows:
s1: using a standard gauge to enable the heights of all the height measuring sensors 1 to be consistent, and enabling the lower surface of the measuring head to be 2mm away from the upper surface of the supporting base plate 6; using a pressure sensor to adjust the pressure values of all the height measuring sensors 1 to 0.4N;
s2, placing the section of product in a track, moving the section of product to a measuring position, and adsorbing the product on a bearing bottom plate 6 through a negative pressure adsorption device by using the bearing bottom plate 6;
s3: all height measuring sensor measuring heads are pressed down to the measuring rubber surface 2, and the measuring heads retract after the measurement is finished;
s4: the air blowing holes on the bearing bottom plate 6 are used for blowing air at positive pressure, and the product is blown away from the surface of the bearing bottom plate 6;
s5: and (5) continuously moving the product forwards, moving the untested module to the measuring position, repeating the steps S2-S4 until all the adhesive surfaces are measured, and terminating the measurement.
And (3) data comparison:
the height of the product is tested by a high-precision manual micrometer and the result is recorded as an approximate real value, as shown in table 1, table 1 is the height measurement precision table of embodiment 2 of the invention, and the height measurement data, the manual measurement data and the error (unit: micrometer) of the product are stored in the table.
TABLE 1
And (5) drawing a conclusion that: for the product, the difference value between the test data and the hand test data is +/-2 microns, and the test requirement +/-5 microns is met. Therefore, the technical scheme of the invention can effectively realize the measurement of the glue height of the module and solve the problems in the prior art.
Comparative example 1:
comparative example 1 the initial height of the height measuring sensor and the air supply pressure are used as variables to measure whether the two variables have influence on the damage of the module to the product.
1. The method comprises the following steps:
1. and defining the height position of the height measuring sensor, namely the distance from the lower surface of a measuring head of the height measuring sensor 1 to the supporting bottom plate. Determining a high position 5mm and a low position 2mm, and firstly adjusting all height measuring sensors to the high position 5mm;
2. adjusting the air pressure to change the pressure value of the height measuring sensors, measuring the pressure value by using the pressure sensors, and firstly setting the pressure values of all the height measuring sensors to be 0.1N;
3. in the present invention, other conditions such as the device structure, the material of the parts, and the like were kept consistent except for the above two changes, and a piece of the module product 100 was tested according to the procedure of example 2.
4. And (4) repeating the step (2-3), setting the pressure values of all the height measuring sensors to be 0.2N, 0.3N, 0.4N, 0.5N, 0.6N, 0.7N and 0.8N respectively, and completing the test of the module products with the same number (100 pieces) under different pressure conditions.
5. Adjusting the height measuring sensor to 2mm at a low position;
6. and (5) repeating the steps 2, 3 and 4.
2. Statistics of bad products
An electric measuring machine is used for testing the damage condition of a module product, bad products are counted, a table 2 is a corresponding table of the height of a height measuring sensor and the damage number of the product caused by pressure, and the result is shown in the table 2 (unit: sheet):
TABLE 2
Forming a conclusion: the height position and the pressure of the height measuring sensor influence damage to the module product; when the pressure is the same, the height measuring sensor is more easily damaged to the product at a high position and is not easily damaged at a low position; when the height position is the same, the probability of damaging the product is improved along with the increase of the pressure.
Therefore, it is necessary to calibrate the height and pressure of the sensor, generally, the height of the height measuring sensor is set to be 2mm at a low position, and the damage to the module product is not easily caused when the pressure is in a range of 0.1-0.5N.
Comparative example 2:
on the premise of ensuring that a module product is not damaged, namely the height of the sensor is set to be 2mm at the low position, the pressure range is 0.1-0.5N, and the comparative example verifies the influence on the test precision when the pressure condition is changed.
A section of product is taken, the adhesive height of the product is measured by the method, the device conditions are the same as those of the embodiment 2, and the test steps are as follows:
1. adjusting the heights of all height measuring sensors to be 2mm at low positions;
2. adjusting the air pressure to change the pressure value of the height measuring sensors, measuring the pressure value by using the pressure sensors, and firstly setting the pressure values of all the height measuring sensors to be 0.1N;
3. in the invention, except that the pressure is changed, other conditions such as the structure of the device, the material of parts and the like are kept consistent, and a section of module product is tested according to the step of the embodiment 2;
4. and (5) repeating the step (2-3), setting the pressure values of all the height measuring sensors to be 0.2N, 0.3N, 0.4N and 0.5N respectively, and completing the test of the module product at the same section under different pressure conditions.
And (4) counting and concluding:
the test results are shown in table 3, and the error between the height data and the true value under different pressure conditions is calculated and similarly put into table 3. (unit: micron)
TABLE 3
Table 3 is an error comparison table of the height data and the true value under different pressure conditions, and it can be seen from table 3 that the set pressure values of the height measurement sensors are different, and the measured values of the same product are different. The pressure condition of less than 0.3N has larger measurement error which exceeds +/-5 microns and does not meet the measurement requirement; to ensure the accuracy of the measurement, the pressure should be set between 0.3N and 0.5N, typically 0.4N.
By adopting the module glue height automatic measuring equipment and the measuring method thereof in the embodiment of the invention described in the above with the accompanying drawings, the module glue height can be measured, and the product defects caused by an automatic height measuring device are greatly reduced. The module is prevented from rubbing the edge of the bottom plate when moving, so that scratch and abrasion are prevented. The problems in the prior art are solved. The present invention is not limited to the embodiments described, but rather, variations, modifications, substitutions and alterations are possible without departing from the spirit and scope of the present invention.
Claims (5)
1. The utility model provides a high automatic measuring equipment is glued to module, includes the measuring device body, its characterized in that: the measuring device comprises a measuring device body and a measuring head, wherein the measuring device body comprises a bearing bottom plate (6), an upper track plate (3) and a lower track plate (5), a hole groove is formed in the lower track plate (5), the bearing bottom plate (6) is placed in the hole groove, the upper plane of the bearing bottom plate (6) is flush with the upper plane of the lower track plate (5), the upper track plate (3) is matched with the lower track plate (5) to form a product track, the bearing bottom plate (6) has the function of the lower track plate (5), a module (4) is arranged above the bearing bottom plate (6), a measuring adhesive surface (2) is arranged above the module (4), a hole groove is formed in the upper track plate (3), the width of the hole groove formed in the upper track plate (3) is smaller than that of the lower track plate (5), a height measuring sensor (1) is arranged above the outside the module (4), the height measuring sensor (1) is arranged right opposite to the module (4), the height measuring sensor (1) and the module (4) and the pressure measuring head (1) is in one-to-one correspondence relationship, and the pressure measuring sensor (1) is connected with the pressure measuring head (1), and the pressure measuring sensor (1) and the pressure measuring head (1) is controlled to control the measuring head to control the measuring part to complete the measuring;
a negative pressure adsorption device is arranged on the bearing bottom plate (6) and is used for adsorbing and fixing the module (4); the bearing bottom plate (6) is also provided with a gas blowing hole, and the position of the gas blowing hole is close to the edge of the bearing bottom plate (6); during measurement, after a module to be measured is moved to a measurement position along a rail, negative pressure is generated at an air blowing hole on the supporting bottom plate (6), a product is adsorbed on the supporting bottom plate (6), and the lower surfaces of two sides of the hole groove of the upper rail plate (3) are contacted with the module (4); all measuring heads of the height measuring sensor (1) are pressed down to the rubber surface, and the measuring heads retract after the measurement is finished; blowing air at the air blowing hole on the bearing bottom plate (6) in positive pressure, blowing the product away from the surface of the bearing bottom plate (6), moving the module (4) forwards, moving the untested module (4) to a measuring position, and repeating the steps;
the pressure control part is an air path pressure regulating control part, a plurality of air path pressure regulating devices (7) are arranged in the air path pressure regulating control part, each air path pressure regulating device (7) is respectively and independently connected with one height measuring sensor (1), and air paths of the height measuring sensors (1) are separated to realize independent air pressure control;
the gas circuit pressure regulating devices (7) comprise electromagnetic valves and pressure regulating valves, and a plurality of gas circuit pressure regulating devices (7) are connected in parallel and then connected with a gas source (8); the height measurement sensor (1) is connected with a sensor clamping device, and the height measurement sensor (1) is clamped and positioned through the sensor clamping device, so that the installation height of the height measurement sensor (1) is adjusted.
2. The modular glue height automatic measuring device according to claim 1, characterized in that: and a pressure sensor is arranged below a measuring head in the height measuring sensor (1).
3. A module glue height automatic measuring method is applied to the module glue height automatic measuring equipment of any one of claims 1-2, and is characterized in that: the method comprises the following steps:
s1: adjusting the pressure value and the height value of the height measuring sensors (1) to ensure that the pressing pressure of measuring heads of all the height measuring sensors (1) is the same, and the installation height of each height measuring sensor (1) is adjusted to be consistent;
s2: after the module (4) to be measured is moved to a measuring position along the product track, the supporting bottom plate (6) adsorbs the product on the supporting bottom plate (6) through a negative pressure adsorption device;
s3: the measuring heads of all the height measuring sensors (1) are pressed down to the measuring rubber surface (2), and the measuring heads retract after the measurement is finished;
s4: the air blowing holes on the bearing bottom plate (6) are used for blowing air at positive pressure, so that the product is blown away from the surface of the bearing bottom plate (6);
s5: the module (4) moves forward, the untested module moves to the measuring position, and steps S2-S4 are repeated.
4. The method for automatically measuring the glue height of the module as claimed in claim 3, wherein: the step of adjusting the pressure value of the height sensor in the step S1 specifically includes the following steps: placing a pressure sensor below a measuring head, controlling to open an electromagnetic valve corresponding to the height measuring sensor, enabling the measuring head to press down to the surface of the pressure sensor, adjusting a pressure regulating valve, enabling the pressure sensor to display a value which is a set value, and adjusting all the height measuring sensors to be consistent in pressure according to the steps; the step of adjusting the height value of the height measuring sensor in the step S1 specifically includes the following steps: and each height measuring sensor is placed in the sensor clamping device for clamping and positioning, and the mounting height of each height measuring sensor is adjusted to be consistent by using a standard gauge between the base plane and the measuring head in the retraction state of the measuring head of the height measuring sensor.
5. The method for automatically measuring the glue height of the module as claimed in claim 4, wherein: the pressure value setting range of the height measuring sensor is as follows: 0.3N-0.5N.
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| CN110328149A (en) * | 2019-07-31 | 2019-10-15 | 汪成林 | A kind of mobile-phone lens open defect automatic checkout equipment |
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| CN212320672U (en) * | 2020-06-24 | 2021-01-08 | 山东魔方新能源科技有限公司 | Film multiple spot thickness measuring device |
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