CN114959602B - Stepped circuit board surface coating device and process based on gold surface copper plating surface mixing - Google Patents
Stepped circuit board surface coating device and process based on gold surface copper plating surface mixing Download PDFInfo
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- CN114959602B CN114959602B CN202210662513.3A CN202210662513A CN114959602B CN 114959602 B CN114959602 B CN 114959602B CN 202210662513 A CN202210662513 A CN 202210662513A CN 114959602 B CN114959602 B CN 114959602B
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- plating
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- 238000000576 coating method Methods 0.000 title claims abstract description 73
- 239000011248 coating agent Substances 0.000 title claims abstract description 70
- 238000007747 plating Methods 0.000 title claims abstract description 43
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 18
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 18
- 239000010949 copper Substances 0.000 title claims abstract description 18
- 238000000034 method Methods 0.000 title claims abstract description 18
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 title claims abstract description 16
- 239000010931 gold Substances 0.000 title claims abstract description 16
- 229910052737 gold Inorganic materials 0.000 title claims abstract description 16
- 230000008569 process Effects 0.000 title claims abstract description 16
- 238000002156 mixing Methods 0.000 title claims description 14
- 238000004140 cleaning Methods 0.000 claims abstract description 58
- 230000000694 effects Effects 0.000 claims abstract description 10
- 239000000203 mixture Substances 0.000 claims abstract 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 39
- 238000005406 washing Methods 0.000 claims description 13
- 230000007246 mechanism Effects 0.000 claims description 12
- 238000004321 preservation Methods 0.000 claims description 10
- 238000003848 UV Light-Curing Methods 0.000 claims description 9
- 230000009471 action Effects 0.000 claims description 8
- 230000008859 change Effects 0.000 claims description 8
- 239000007888 film coating Substances 0.000 claims description 7
- 238000009501 film coating Methods 0.000 claims description 7
- 239000013077 target material Substances 0.000 claims description 5
- 150000002500 ions Chemical class 0.000 claims description 4
- 230000003014 reinforcing effect Effects 0.000 claims description 4
- 239000010865 sewage Substances 0.000 claims description 4
- 238000002791 soaking Methods 0.000 claims description 4
- 230000003213 activating effect Effects 0.000 claims description 3
- 238000001723 curing Methods 0.000 claims description 3
- 230000002146 bilateral effect Effects 0.000 claims description 2
- 241001657258 Pachycare flavogriseum Species 0.000 claims 1
- 230000000712 assembly Effects 0.000 claims 1
- 238000000429 assembly Methods 0.000 claims 1
- 239000012466 permeate Substances 0.000 claims 1
- 239000011247 coating layer Substances 0.000 abstract description 5
- 238000007790 scraping Methods 0.000 abstract description 4
- 239000000428 dust Substances 0.000 abstract description 3
- 239000010410 layer Substances 0.000 abstract description 2
- 239000000758 substrate Substances 0.000 description 4
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 238000005086 pumping Methods 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 238000010894 electron beam technology Methods 0.000 description 2
- 238000001771 vacuum deposition Methods 0.000 description 2
- 230000004913 activation Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000006748 scratching Methods 0.000 description 1
- 230000002393 scratching effect Effects 0.000 description 1
- 230000007306 turnover Effects 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/02—Pretreatment of the material to be coated
- C23C14/021—Cleaning or etching treatments
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/50—Substrate holders
- C23C14/505—Substrate holders for rotation of the substrates
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/58—After-treatment
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working
Abstract
The invention discloses a plating device and a plating process for the surface of a stepped circuit board based on the mixture of gold surface and copper plating surface, and aims to solve the technical problems that the prior art does not have a cleaning function, the surface of the circuit board is easy to be stained with dust, the plating effect is affected, the circuit board after plating cannot be solidified, and the scraping of a plating layer is easy to be caused. The coating device comprises a cleaning box, a coating machine and a conveying frame which are sequentially arranged at the right end of the cleaning box, and a first conveying belt, a first rotating shaft and a second conveying belt which are sequentially arranged on the inner side of the conveying frame from front to back. The coating device and the process can clean the circuit board to be coated by using the design of the cleaning box, so that the coating effect is improved, the position of the circuit board is adjusted during coating, each circuit board can be uniformly coated, the scraping of a coating layer is prevented, the circuit board can be turned over, and the two sides of the circuit board can be solidified.
Description
Technical Field
The invention belongs to the technical field of circuit board processing, and particularly relates to a stepped circuit board surface coating device and process based on gold surface copper plating surface mixing.
Background
The circuit board makes the circuit miniaturized, visual, plays an important role in mass production of fixed circuits and optimizing the layout of electrical appliances, and along with the development of miniaturization and digitalization of electronic products, the printed circuit board also develops towards high density and high precision.
At present, the invention patent with publication number of CN113621920A discloses a vacuum coating method of a vacuum coating machine, which comprises the following steps: preparing the equipment in the early stage; when the temperature of the cold plate of the cold pump reaches 220+/-5 ℃ below zero, starting a vacuum pumping system to perform rough vacuum pumping on the coating cavity, and continuously pumping the cold pump in the process; when the temperature of the cold plate of the cold pump reaches 270+/-5 ℃ below zero, the cold pump continuously works and keeps the current vacuum degree, and when the vacuum degree in the coating cavity reaches a set value, rough vacuumizing is finished, and a vacuumizing pipe interface is closed; the first opening and closing power device drives the valve clack to be separated from the valve seat, and vacuum is continuously built for the film coating cavity again by using the cold pump; when the vacuum degree in the coating cavity meets the process requirement, the valve clack is driven by the first opening and closing power device to be matched and sealed with the valve seat; starting a rotary power device to enable the self-rotating frame to rotate, starting an electron gun to generate high-energy electron beams, heating target metal in the crucible by the electron beams to evaporate the target metal, and rising and depositing evaporated metal gas on a substrate on the self-rotating frame; after the film coating is completed, the electron gun and the rotary power device stop working; introducing nitrogen into the film plating cavity for breaking the cavity; taking the substrate out of the film coating cavity; repeating the steps after replacing a new batch of substrates until the target material in the crucible is completely consumed. The self-rotating frame is arranged at the top of the coating cavity, so that the thickness of the coating film of the substrate is more uniform, but the coating film device does not have a cleaning function, dust is easy to be stained on the surface of the circuit board, the coating film effect is affected, the circuit board after coating film cannot be solidified, and the scraping of the coating film layer is easy to be caused.
Therefore, in order to solve the above problems of not having a cleaning function and easy scratching of the coating layer, a solution is needed to improve the usage scenario of the coating device.
Disclosure of Invention
(1) Technical problem to be solved
Aiming at the defects of the prior art, the invention aims to provide a stepped circuit board surface coating device and process based on gold surface copper plating surface mixing, and the coating device and process aim to solve the technical problems that the prior art does not have a cleaning function, the surface of a circuit board is easy to be stained with dust, the coating effect is affected, the circuit board after coating cannot be solidified, and the scraping of a coating layer is easy to be caused.
(2) Technical proposal
In order to solve the technical problems, the invention provides a stepped circuit board surface coating device based on gold surface copper plating surface mixing, which comprises a cleaning box, a coating machine and a conveying frame which are sequentially arranged at the right end of the cleaning box, a first conveying belt, a first rotating shaft and a second conveying belt which are sequentially arranged at the inner side of the conveying frame from front to back, a guide mechanism arranged at the front side of the upper end of the conveying frame, a heat preservation cover fixed at the rear side of the upper end of the conveying frame, and UV curing lamps which are arranged at the lower end of the inner top of the heat preservation cover and distributed at equal intervals; the inner top lower extreme fixedly connected with toasts the heater in the coating machine, the second axis of rotation is installed to coating machine rear end inboard, the annular equidistant head rod that distributes is installed to the second axis of rotation outside, the head rod front end rotates and is connected with the dwang, dwang front end fixedly connected with coating plate, the centre gripping subassembly that equidistantly distributes is all installed to coating plate left and right sides upper end, the activation electrode is installed to coating machine left end inboard, electronic gun and crucible are installed in proper order from a left side to the right side to coating machine inner bottom upper end, the sliding tray of fore-and-aft symmetry distribution has been seted up to cleaning box inner bottom upper end, sliding connection has the sliding block in the sliding tray, sliding block and another sliding block upper end fixedly connected with are used for depositing the washing basket of waiting to wash the circuit board, cleaning box rear end is provided with the water inlet, install in the cleaning box with the inlet tube that the water inlet is link up mutually, the nozzle that equidistantly distributes is installed to the inlet tube front end, cleaning box left end fixedly connected with bottom plate, motor fixedly connected with the upper end, the first impeller is installed to the inside the annular impeller, the inside is connected with the first rotating shaft, the eccentric cap fixedly connected with the inside the annular impeller, the inside is connected with the eccentric cap, the inside the eccentric cap is connected with the inside the annular impeller, the inside the eccentric cap is connected with the eccentric cap through the inside the impeller.
Preferably, the rear end of the second rotating shaft is sequentially provided with a coupler and a second motor, and reinforcing rods which are distributed in bilateral symmetry are fixedly connected between the second motor and the coating machine.
Preferably, the right end of the coating machine is provided with a vacuum port, the left end of the coating machine is provided with an air inlet, and the right end of the conveying rack is provided with a third motor for driving the first rotating shaft.
Preferably, the front end of the coating machine is rotatably connected with a front cover, and the lower end of the cleaning box is provided with a water outlet.
Preferably, the guide mechanism comprises a positioning plate, a long threaded rod fixed between the positioning plate and the other positioning plate, a first elastic element and guide plates and nuts which are symmetrically distributed from inside to outside and are sequentially arranged on the outer side of the long threaded rod.
Preferably, the clamping assembly comprises a fixed plate, a guide hole is formed in the fixed plate, a guide column is inserted into the guide hole, a clamping plate is fixedly connected to the inner side of the guide column, and a second elastic element is fixedly connected between the clamping plate and the fixed plate.
The step circuit board surface coating process based on gold surface copper plating surface mixing comprises the step circuit board surface coating device based on gold surface copper plating surface mixing, and the steps are as follows:
step one: opening the upper cover, placing the circuit board to be treated into a cleaning basket, adding a proper amount of board washing water into the cleaning box through the water inlet, enabling the board washing water to submerge the circuit board, and soaking for 20 minutes;
step two: starting a first motor at the upper end of the bottom plate, driving an eccentric wheel to rotate, driving the position of a movable block to change by the eccentric wheel, driving a second connecting rod to do linear reciprocating motion along with the change of the position of the movable block, driving a cleaning basket to synchronously move by the second connecting rod, sliding a sliding block at the lower end of the cleaning basket in a sliding groove at the moment, opening a water outlet to discharge sewage after 10 minutes, keeping the water outlet in an opened state, cleaning a circuit board by using flowing plate washing water sprayed by a nozzle, and stopping after 5 minutes;
step three: starting a fan, airing the circuit board, and then taking out the aired circuit board;
step four: the cleaned circuit board is placed at the upper end of the circuit board, the clamping plate is pushed inwards under the action of the rebound force of the second elastic element, the circuit board is kept stable through the clamping plate, the vacuum port is vacuumized, the second motor is started, the power of the second motor is transmitted to the second rotating shaft through the coupler, the target material in the crucible is bombarded by the electron gun, the surface components are sputtered out in the form of atomic groups or ions, the surface components are finally deposited on the surface of the circuit board, a film is finally formed through the film forming process, and the film coating effect of the circuit board on the circuit board is more uniform through the rotation of the second motor;
step five: opening the front cover, taking out the circuit board after coating film, placing the circuit board on the first conveyor belt, adjusting the feeding position of the circuit board through the guide mechanism, enabling the film on the surface of the circuit board to be cured through the UV curing lamp in the heat preservation cover in an accelerating way, moving the circuit board to the turning blade, driving the first rotating shaft to rotate under the action of the third motor, enabling the circuit board to fall on the second conveyor belt after being turned over, and accordingly curing the other surface of the circuit board.
Preferably, the vacuum pressure in the film plating machine in the fourth step is 0.4-0.5MPa.
(3) Advantageous effects
Compared with the prior art, the invention has the beneficial effects that: the coating device and the process can clean the circuit board to be coated by using the design of the cleaning box, air-dry the circuit board by using the fan, ensure the cleanness of the circuit board, improve the coating effect, and adjust the position of the circuit board during coating by using the design of the second motor, so that each circuit board can be uniformly coated, the curing of the coating layer can be accelerated by arranging the UV curing lamp, the coating layer is prevented from being scratched, and the circuit board can be turned over by using the first rotating shaft and the turning blade in a matched manner, so that the two sides of the circuit board can be cured without manual operation, and the use is more convenient.
Drawings
FIG. 1 is a schematic perspective view of a coating device according to an embodiment of the present invention;
FIG. 2 is a schematic diagram showing the front structure of a coating apparatus according to an embodiment of the present invention;
FIG. 3 is a schematic side view of a coating machine according to one embodiment of the coating apparatus of the present invention;
FIG. 4 is a schematic side view of a conveyor frame and a thermal cover according to one embodiment of the coating device of the present invention;
FIG. 5 is a schematic top view of a coating apparatus according to an embodiment of the present invention;
FIG. 6 is a schematic view showing the assembly of a guide mechanism in one embodiment of the coating apparatus of the present invention;
FIG. 7 is a schematic view illustrating an assembly of a clamping assembly in an embodiment of the coating apparatus of the present invention.
The marks in the drawings are: 1. a cleaning box; 2. a film plating machine; 3. a conveying rack; 4. a first conveyor belt; 5. a first rotation shaft; 6. a second conveyor belt; 7. a guide mechanism; 71. a positioning plate; 72. a long threaded rod; 73. a first elastic element; 74. a guide plate; 75. a nut; 8. a thermal insulation cover; 9. a UV curing lamp; 10. a bake heater; 11. a second rotation shaft; 12. a first connecting rod; 13. a rotating lever; 14. a film plating plate; 15. a clamping assembly; 151. a fixing plate; 152. a guide hole; 153. a guide post; 154. a clamping plate; 155. a second elastic element; 16. activating the electrode; 17. an electron gun; 18. a crucible; 19. a sliding groove; 20. a sliding block; 21. cleaning the basket; 22. a water inlet; 23. a water inlet pipe; 24. a nozzle; 25. a bottom plate; 26. a first motor; 27. an eccentric wheel; 28. a movable block; 29. a second connecting rod; 30. turning over the blade; 31. an upper cover; 32. a fan; 33. a coupling; 34. a second motor; 35. a reinforcing rod; 36. a vacuum port; 37. an air inlet; 38. a third motor; 39. a front cover; 40. and a water outlet.
Detailed Description
Example 1
Referring to fig. 1-7, the coating device comprises a cleaning box 1, a coating machine 2 and a conveying frame 3 which are sequentially arranged at the right end of the cleaning box 1, a first conveying belt 4, a first rotating shaft 5 and a second conveying belt 6 which are sequentially arranged at the inner side of the conveying frame 3 from front to back, a guide mechanism 7 arranged at the front side of the upper end of the conveying frame 3, a heat preservation cover 8 fixed at the rear side of the upper end of the conveying frame 3, and UV curing lamps 9 which are arranged at the inner top and the lower end of the heat preservation cover 8 and are equidistantly distributed; the lower end of the inner top of the film plating machine 2 is fixedly connected with a baking heater 10, the inner side of the rear end of the film plating machine 2 is provided with a second rotating shaft 11, the outer side of the second rotating shaft 11 is provided with a first connecting rod 12 which is distributed in annular equidistant mode, the front end of the first connecting rod 12 is rotationally connected with a rotating rod 13, the front end of the rotating rod 13 is fixedly connected with a film plating plate 14, the upper ends of the left side and the right side of the film plating plate 14 are respectively provided with a clamping component 15 which is distributed in equidistant mode, the inner side of the left end of the film plating machine 2 is provided with an activating electrode 16, the upper end of the inner bottom of the film plating machine 2 is provided with an electron gun 17 and a crucible 18 in sequence from left to right, the upper end of the inner bottom of the cleaning box 1 is provided with sliding grooves 19 which are distributed in front-back symmetry, sliding blocks 20 are connected in the sliding grooves 19 in a sliding mode, the upper ends of the sliding blocks 20 and the other sliding blocks 20 are fixedly connected with a cleaning basket 21 for storing a circuit board to be cleaned, the rear end of the cleaning box 1 is provided with a water inlet 22, a water inlet pipe 23 communicated with the water inlet 22 is arranged in the cleaning box 1, nozzles 24 distributed at equal intervals are arranged at the front end of the water inlet pipe 23, the left end of the cleaning box 1 is fixedly connected with a bottom plate 25, the upper end of the bottom plate 25 is fixedly connected with a first motor 26, the front end of the first motor 26 is provided with an eccentric wheel 27, the outer side of the eccentric wheel 27 is movably connected with a movable block 28, the right end of the movable block 28 is fixedly connected with a second connecting rod 29 which extends into the cleaning box 1 and is connected with a cleaning basket 21, the outer side of the first rotating shaft 5 is fixedly connected with annular turnover blades 30 distributed at equal intervals, the upper end of the cleaning box 1 is rotatably connected with an upper cover 31 through a hinge, and the inner top lower end of the upper cover 31 is provided with a fan 32.
The rear end of the second rotating shaft 11 is sequentially provided with a coupler 33 and a second motor 34, reinforcing rods 35 which are distributed symmetrically left and right are fixedly connected between the second motor 34 and the coating machine 2, the right end of the coating machine 2 is provided with a vacuum port 36, the left end of the coating machine 2 is provided with an air inlet 37, and the right end of the conveying frame 3 is provided with a third motor 38 which is used for driving the first rotating shaft 5.
Simultaneously, the front end of the film plating machine 2 is rotationally connected with a front cover 39, the lower end of the cleaning box 1 is provided with a water outlet 40, and the guide mechanism 7 comprises a positioning plate 71, a long threaded rod 72 fixed between the positioning plate 71 and the other positioning plate 71, a first elastic element 73 and a guide plate 74 and a nut 75 which are symmetrically distributed from inside to outside and are sequentially arranged outside the long threaded rod 72.
In addition, the clamping assembly 15 includes a fixing plate 151, a guide hole 152 is formed in the fixing plate 151, a guide column 153 is inserted into the guide hole 152, a clamping plate 154 is fixedly connected to the inner side of the guide column 153, and a second elastic element 155 is fixedly connected between the clamping plate 154 and the fixing plate 151.
The step circuit board surface coating process based on gold surface copper plating surface mixing comprises the step circuit board surface coating device based on gold surface copper plating surface mixing, and the steps are as follows:
step one: opening the upper cover 31, placing the circuit board to be treated into the cleaning basket 21, adding a proper amount of board washing water into the cleaning box 1 through the water inlet 22, enabling the board washing water to submerge the circuit board, and soaking for 20 minutes;
step two: starting a first motor 26 at the upper end of the bottom plate 25, driving an eccentric wheel 27 to rotate by the first motor 26, driving a movable block 28 to change in position by the eccentric wheel 27, driving a second connecting rod 29 to do linear reciprocating motion along with the change in position of the movable block 28, driving a cleaning basket 21 to synchronously move by the second connecting rod 29, sliding a sliding block 20 at the lower end of the cleaning basket 21 in a sliding groove 19 at the moment, opening a water outlet 40 to discharge sewage after 10 minutes, keeping the water outlet 40 in an opened state, cleaning a circuit board by flowing washing plate water sprayed by a nozzle 24, and stopping after 5 minutes;
step three: starting a fan 32, airing the circuit board, and then taking out the aired circuit board;
step four: the cleaned circuit board is placed at the upper end of the circuit board 14, the clamping plate 154 is pushed inwards under the action of the rebound force of the second elastic element 155, the circuit board is kept stable through the clamping plate 154, the vacuum port 36 is vacuumized, the second motor 34 is started, the power of the second motor 34 is transmitted to the second rotating shaft 11 through the coupler 33, the target material in the crucible 18 is bombarded by the electron gun 17, the surface components are sputtered out in the form of atomic groups or ions, and finally deposited on the surface of the circuit board, a film is finally formed through the film forming process, and the film forming effect of the circuit board on the circuit board 14 is more uniform through the rotation of the second motor 34;
step five: the front cover 39 is opened, the circuit board after film coating is taken out, the circuit board is placed on the first conveyor belt 4, the feeding position of the circuit board is adjusted through the guide mechanism 7, the film on the surface of the circuit board is cured by the UV curing lamp 9 in the heat preservation cover 8 in an accelerating way, the circuit board is moved to the turning blade 30, the first rotating shaft 5 is driven to rotate under the action of the third motor 38, the circuit board is turned over and then falls on the second conveyor belt 6, and accordingly the other surface of the circuit board is cured.
Wherein the vacuum pressure in the film plating machine 2 in the fourth step is 0.4-0.5MPa.
When the coating device and the process of the technical scheme are used, the method comprises the following steps: opening the upper cover 31, placing the circuit board to be treated into the cleaning basket 21, adding a proper amount of board washing water into the cleaning box 1 through the water inlet 22, enabling the board washing water to submerge the circuit board, and soaking for 20 minutes; step two: starting a first motor 26 at the upper end of the bottom plate 25, driving an eccentric wheel 27 to rotate by the first motor 26, driving a movable block 28 to change in position by the eccentric wheel 27, driving a second connecting rod 29 to do linear reciprocating motion along with the change in position of the movable block 28, driving a cleaning basket 21 to synchronously move by the second connecting rod 29, sliding a sliding block 20 at the lower end of the cleaning basket 21 in a sliding groove 19 at the moment, opening a water outlet 40 to discharge sewage after 10 minutes, keeping the water outlet 40 in an opened state, cleaning a circuit board by flowing washing plate water sprayed by a nozzle 24, and stopping after 5 minutes; step three: starting a fan 32, airing the circuit board, and then taking out the aired circuit board; step four: the cleaned circuit board is placed at the upper end of the film plating plate 14, the clamping plate 154 is pushed inwards under the action of the rebound force of the second elastic element 155, the circuit board is kept stable through the clamping plate 154, the vacuum port 36 is vacuumized, the vacuum pressure in the film plating machine 2 is 0.4MPa, the second motor 34 is started, the power of the second motor 34 is transmitted to the second rotating shaft 11 through the coupler 33, the target material in the crucible 18 is bombarded by the electron gun 17, the surface components are sputtered in the form of atomic groups or ions, the surface components are finally deposited on the surface of the circuit board, a film is finally formed through the film forming process, and the film plating effect of the circuit board on the film plating plate 14 is more uniform through the rotation of the second motor 34; step five: the front cover 39 is opened, the circuit board after film coating is taken out, the circuit board is placed on the first conveyor belt 4, the feeding position of the circuit board is adjusted through the guide mechanism 7, the film on the surface of the circuit board is cured by the UV curing lamp 9 in the heat preservation cover 8 in an accelerating way, the circuit board is moved to the turning blade 30, the first rotating shaft 5 is driven to rotate under the action of the third motor 38, the circuit board is turned over and then falls on the second conveyor belt 6, and accordingly the other surface of the circuit board is cured.
Claims (8)
1. The utility model provides a ladder circuit board surface coating film device based on golden face copper facing surface mixes, this coating film device includes washs case (1), sets gradually coating film machine (2) and conveying frame (3) of washs case (1) right-hand member, installs in proper order from front to back first conveyer belt (4), first pivot axle (5) and second conveyer belt (6) of conveying frame (3) inboard, set up guiding mechanism (7) of conveying frame (3) upper end front side, fix heat preservation cover (8) of conveying frame (3) upper end rear side, install UV curing lamp (9) that top lower extreme equidistance distributes in heat preservation cover (8); the device is characterized in that a baking heater (10) is fixedly connected to the lower end of the inner top of the coating machine (2), a second rotating shaft (11) is arranged on the inner side of the rear end of the coating machine (2), a first connecting rod (12) which is distributed in an annular equidistant manner is arranged on the outer side of the second rotating shaft (11), a rotating rod (13) is rotatably connected to the front end of the first connecting rod (12), a coating plate (14) is fixedly connected to the front end of the rotating rod (13), clamping assemblies (15) which are distributed in an equidistant manner are respectively arranged at the upper ends of the left side and the right side of the coating plate (14), an activating electrode (16) is arranged on the inner side of the left end of the coating machine (2), an electronic gun (17) and a crucible (18) are sequentially arranged at the upper end of the inner bottom of the coating machine (2) from left side to right side, sliding grooves (19) which are symmetrically distributed in a front-back are formed in the upper end of the inner bottom of the cleaning box (1), sliding blocks (20) are connected in a sliding manner, the sliding blocks (20) are fixedly connected to the upper ends of the sliding blocks (20) and the other sliding blocks (20), a water inlet (22) are arranged on the upper ends of the sliding blocks to be fixedly connected to the cleaning plate (21), a water inlet (22) and a water inlet (23) which is arranged in the cleaning box (1), the novel cleaning box comprises a cleaning box body (1), wherein the left end of the cleaning box body is fixedly connected with a bottom plate (25), the upper end of the bottom plate (25) is fixedly connected with a first motor (26), the front end of the first motor (26) is provided with an eccentric wheel (27), the outer side of the eccentric wheel (27) is movably connected with a movable block (28), the right end of the movable block (28) is fixedly connected with a second connecting rod (29) which extends into the cleaning box body (1) and is connected with a cleaning basket (21), the outer side of the first rotating shaft (5) is fixedly connected with annular equally-distributed overturning blades (30), the upper end of the cleaning box body (1) is rotationally connected with an upper cover (31) through a hinge, and the lower end of the inner top of the upper cover (31) is provided with a fan (32).
2. The stepped circuit board surface coating device based on the gold surface copper plating surface mixing according to claim 1, wherein a coupler (33) and a second motor (34) are sequentially installed at the rear end of the second rotating shaft (11), and reinforcing rods (35) which are distributed in a bilateral symmetry mode are fixedly connected between the second motor (34) and the coating machine (2).
3. The plating device for the surface of the stepped circuit board based on the gold surface copper plating surface mixing according to claim 1, wherein a vacuum port (36) is arranged at the right end of the plating machine (2), an air inlet (37) is arranged at the left end of the plating machine (2), and a third motor (38) for driving the first rotating shaft (5) is arranged at the right end of the conveying frame (3).
4. The plating device for the surface of the stepped circuit board based on the mixture of the gold surface and the copper surface according to claim 1, wherein the front end of the plating machine (2) is rotatably connected with a front cover (39), and a water outlet (40) is arranged at the lower end of the cleaning box (1).
5. The stepped circuit board surface coating device based on gold surface copper plating surface mixing according to claim 1, wherein the guiding mechanism (7) comprises a positioning plate (71), a long threaded rod (72) fixed between the positioning plate (71) and another positioning plate (71), a first elastic element (73) and a guiding plate (74) and a nut (75) which are symmetrically distributed from inside to outside and are sequentially arranged on the outer side of the long threaded rod (72).
6. The stepped circuit board surface coating device based on the gold surface copper plating surface mixing according to claim 1, wherein the clamping assembly (15) comprises a fixed plate (151), a guide hole (152) is formed in the fixed plate (151), a guide column (153) is inserted in the guide hole (152), a clamping plate (154) is fixedly connected to the inner side of the guide column (153), and a second elastic element (155) is fixedly connected between the clamping plate (154) and the fixed plate (151).
7. A gold-plated copper surface mixing-based stepped circuit board surface coating process, which is characterized by comprising the steps of:
step one: opening an upper cover (31), placing a circuit board to be treated into a cleaning basket (21), adding a proper amount of board washing water into a cleaning box (1) through a water inlet (22), enabling the board washing water to permeate the circuit board, and soaking for 20 minutes;
step two: starting a first motor (26) at the upper end of a bottom plate (25), driving an eccentric wheel (27) to rotate by the first motor (26), driving the position of a movable block (28) to change by the eccentric wheel (27), driving a second connecting rod (29) to do linear reciprocating motion along with the change of the position of the movable block (28), driving a cleaning basket (21) to synchronously move by the second connecting rod (29), at the moment, sliding a sliding block (20) at the lower end of the cleaning basket (21) in a sliding groove (19), opening a water outlet (40) to discharge sewage after 10 minutes, keeping the water outlet (40) in an opened state, cleaning a circuit board by using flowing washing plate water sprayed by a nozzle (24), and stopping after 5 minutes;
step three: starting a fan (32), airing the circuit board, and then taking out the air-dried circuit board;
step four: the cleaned circuit board is placed at the upper end of a coating plate (14), a clamping plate (154) is pushed inwards under the action of the rebound force of a second elastic element (155), the circuit board is kept stable through the clamping plate (154), a vacuum port (36) is vacuumized, a second motor (34) is started, the power of the second motor (34) is transmitted to a second rotating shaft (11) through a coupler (33), an electron gun (17) is used for bombarding a target material in a crucible (18), surface components are sputtered in the form of atomic groups or ions, the surface components are finally deposited on the surface of the circuit board, a film is finally formed through the film forming process, and the film coating effect of the circuit board on the coating plate (14) is more uniform through the rotation of the second motor (34);
step five: opening the front cover (39), taking out the circuit board after coating, placing the circuit board on the first conveyor belt (4), adjusting the feeding position of the circuit board through the guide mechanism (7), enabling the film on the surface of the circuit board to be cured through the UV curing lamp (9) in the heat preservation cover (8) in an accelerating way, moving the circuit board to the turning blade (30), driving the first rotating shaft (5) to rotate under the action of the third motor (38), enabling the circuit board to fall on the second conveyor belt (6) after being turned, and curing the other surface of the circuit board.
8. The plating process of the surface of the stepped circuit board based on the mixture of the gold surface and the copper plating surface according to claim 7, wherein the vacuum pressure in the plating machine (2) in the fourth step is 0.4-0.5MPa.
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| CN114959602A (en) | 2022-08-30 |
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Application publication date: 20220830 Assignee: XINFENG ZHENGTIANWEI ELECTRONIC TECHNOLOGIES Co.,Ltd. Assignor: Jiangxi fuchangfa Circuit Technology Co.,Ltd. Contract record no.: X2023980050364 Denomination of invention: A Surface Coating Device and Process for Stepped Circuit Board Based on Gold Plated Copper Surface Mixing Granted publication date: 20230815 License type: Common License Record date: 20231206 Application publication date: 20220830 Assignee: SHENZHEN ZHENGTIANWEI TECHNOLOGIES CO.,LTD. Assignor: Jiangxi fuchangfa Circuit Technology Co.,Ltd. Contract record no.: X2023980050331 Denomination of invention: A Surface Coating Device and Process for Stepped Circuit Board Based on Gold Plated Copper Surface Mixing Granted publication date: 20230815 License type: Common License Record date: 20231205 |