CN114958216A - Packaging adhesive film for heterojunction battery and preparation method and application thereof - Google Patents
Packaging adhesive film for heterojunction battery and preparation method and application thereof Download PDFInfo
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- CN114958216A CN114958216A CN202210744576.3A CN202210744576A CN114958216A CN 114958216 A CN114958216 A CN 114958216A CN 202210744576 A CN202210744576 A CN 202210744576A CN 114958216 A CN114958216 A CN 114958216A
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- Prior art keywords
- adhesive film
- packaging adhesive
- film layer
- ethylene
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- 239000002313 adhesive film Substances 0.000 title claims abstract description 159
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 159
- 238000002360 preparation method Methods 0.000 title claims abstract description 44
- 239000002994 raw material Substances 0.000 claims abstract description 32
- 229920005989 resin Polymers 0.000 claims abstract description 27
- 239000011347 resin Substances 0.000 claims abstract description 27
- 239000007822 coupling agent Substances 0.000 claims abstract description 25
- 239000012948 isocyanate Substances 0.000 claims abstract description 25
- 150000002513 isocyanates Chemical class 0.000 claims abstract description 25
- 239000011159 matrix material Substances 0.000 claims abstract description 25
- 239000006087 Silane Coupling Agent Substances 0.000 claims abstract description 18
- 239000000463 material Substances 0.000 claims description 18
- 238000000034 method Methods 0.000 claims description 17
- 239000003963 antioxidant agent Substances 0.000 claims description 16
- 239000004611 light stabiliser Substances 0.000 claims description 16
- 238000001125 extrusion Methods 0.000 claims description 14
- 238000005469 granulation Methods 0.000 claims description 14
- 230000003179 granulation Effects 0.000 claims description 14
- AZQGFVRDZTUHBU-UHFFFAOYSA-N isocyanic acid;triethoxy(propyl)silane Chemical group N=C=O.CCC[Si](OCC)(OCC)OCC AZQGFVRDZTUHBU-UHFFFAOYSA-N 0.000 claims description 14
- 238000005266 casting Methods 0.000 claims description 13
- 238000002156 mixing Methods 0.000 claims description 13
- 230000003078 antioxidant effect Effects 0.000 claims description 11
- 238000005538 encapsulation Methods 0.000 claims description 11
- 239000005038 ethylene vinyl acetate Substances 0.000 claims description 8
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 claims description 8
- 239000008393 encapsulating agent Substances 0.000 claims description 7
- 229920006244 ethylene-ethyl acrylate Polymers 0.000 claims description 7
- 229920006225 ethylene-methyl acrylate Polymers 0.000 claims description 7
- 238000004519 manufacturing process Methods 0.000 claims description 7
- 238000000465 moulding Methods 0.000 claims description 7
- -1 polyethylene Polymers 0.000 claims description 7
- FIYMNUNPPYABMU-UHFFFAOYSA-N 2-benzyl-5-chloro-1h-indole Chemical group C=1C2=CC(Cl)=CC=C2NC=1CC1=CC=CC=C1 FIYMNUNPPYABMU-UHFFFAOYSA-N 0.000 claims description 6
- 229920000089 Cyclic olefin copolymer Polymers 0.000 claims description 6
- 238000013329 compounding Methods 0.000 claims description 6
- 229920001038 ethylene copolymer Polymers 0.000 claims description 6
- 239000003999 initiator Substances 0.000 claims description 6
- 239000004743 Polypropylene Substances 0.000 claims description 5
- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 claims description 5
- 238000002844 melting Methods 0.000 claims description 5
- 230000008018 melting Effects 0.000 claims description 5
- 229920001155 polypropylene Polymers 0.000 claims description 5
- 239000004711 α-olefin Substances 0.000 claims description 5
- CARSMBZECAABMO-UHFFFAOYSA-N 3-chloro-2,6-dimethylbenzoic acid Chemical compound CC1=CC=C(Cl)C(C)=C1C(O)=O CARSMBZECAABMO-UHFFFAOYSA-N 0.000 claims description 4
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 claims description 4
- 235000019400 benzoyl peroxide Nutrition 0.000 claims description 4
- 125000004122 cyclic group Chemical group 0.000 claims description 4
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 claims description 4
- MABAWBWRUSBLKQ-UHFFFAOYSA-N ethenyl-tri(propan-2-yloxy)silane Chemical compound CC(C)O[Si](OC(C)C)(OC(C)C)C=C MABAWBWRUSBLKQ-UHFFFAOYSA-N 0.000 claims description 4
- HTCRKQHJUYBQTK-UHFFFAOYSA-N 2-ethylhexyl 2-methylbutan-2-yloxy carbonate Chemical compound CCCCC(CC)COC(=O)OOC(C)(C)CC HTCRKQHJUYBQTK-UHFFFAOYSA-N 0.000 claims description 3
- 239000004677 Nylon Substances 0.000 claims description 3
- 238000006243 chemical reaction Methods 0.000 claims description 3
- 229920001778 nylon Polymers 0.000 claims description 3
- 229920000098 polyolefin Polymers 0.000 claims description 3
- 229920001935 styrene-ethylene-butadiene-styrene Polymers 0.000 claims description 3
- CIHOLLKRGTVIJN-UHFFFAOYSA-N tert-Butyl hydroperoxide Substances CC(C)(C)OO CIHOLLKRGTVIJN-UHFFFAOYSA-N 0.000 claims description 3
- MYOQALXKVOJACM-UHFFFAOYSA-N (2-methylpropan-2-yl)oxy pentaneperoxoate Chemical compound CCCCC(=O)OOOC(C)(C)C MYOQALXKVOJACM-UHFFFAOYSA-N 0.000 claims description 2
- AGKBXKFWMQLFGZ-UHFFFAOYSA-N (4-methylbenzoyl) 4-methylbenzenecarboperoxoate Chemical compound C1=CC(C)=CC=C1C(=O)OOC(=O)C1=CC=C(C)C=C1 AGKBXKFWMQLFGZ-UHFFFAOYSA-N 0.000 claims description 2
- 125000004178 (C1-C4) alkyl group Chemical group 0.000 claims description 2
- NALFRYPTRXKZPN-UHFFFAOYSA-N 1,1-bis(tert-butylperoxy)-3,3,5-trimethylcyclohexane Chemical compound CC1CC(C)(C)CC(OOC(C)(C)C)(OOC(C)(C)C)C1 NALFRYPTRXKZPN-UHFFFAOYSA-N 0.000 claims description 2
- DMWVYCCGCQPJEA-UHFFFAOYSA-N 2,5-bis(tert-butylperoxy)-2,5-dimethylhexane Chemical compound CC(C)(C)OOC(C)(C)CCC(C)(C)OOC(C)(C)C DMWVYCCGCQPJEA-UHFFFAOYSA-N 0.000 claims description 2
- QLZJUIZVJLSNDD-UHFFFAOYSA-N 2-(2-methylidenebutanoyloxy)ethyl 2-methylidenebutanoate Chemical compound CCC(=C)C(=O)OCCOC(=O)C(=C)CC QLZJUIZVJLSNDD-UHFFFAOYSA-N 0.000 claims description 2
- XMNIXWIUMCBBBL-UHFFFAOYSA-N 2-(2-phenylpropan-2-ylperoxy)propan-2-ylbenzene Chemical compound C=1C=CC=CC=1C(C)(C)OOC(C)(C)C1=CC=CC=C1 XMNIXWIUMCBBBL-UHFFFAOYSA-N 0.000 claims description 2
- UGJCILYXGIEERK-UHFFFAOYSA-N 2-tert-butylperoxy-1,3-di(propan-2-yl)benzene Chemical compound CC(C)C1=CC=CC(C(C)C)=C1OOC(C)(C)C UGJCILYXGIEERK-UHFFFAOYSA-N 0.000 claims description 2
- 239000004698 Polyethylene Substances 0.000 claims description 2
- NOZAQBYNLKNDRT-UHFFFAOYSA-N [diacetyloxy(ethenyl)silyl] acetate Chemical compound CC(=O)O[Si](OC(C)=O)(OC(C)=O)C=C NOZAQBYNLKNDRT-UHFFFAOYSA-N 0.000 claims description 2
- 239000000853 adhesive Substances 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 claims description 2
- 125000003545 alkoxy group Chemical group 0.000 claims description 2
- DQXBYHZEEUGOBF-UHFFFAOYSA-N but-3-enoic acid;ethene Chemical compound C=C.OC(=O)CC=C DQXBYHZEEUGOBF-UHFFFAOYSA-N 0.000 claims description 2
- WOXXJEVNDJOOLV-UHFFFAOYSA-N ethenyl-tris(2-methoxyethoxy)silane Chemical compound COCCO[Si](OCCOC)(OCCOC)C=C WOXXJEVNDJOOLV-UHFFFAOYSA-N 0.000 claims description 2
- 239000005042 ethylene-ethyl acrylate Substances 0.000 claims description 2
- 239000005043 ethylene-methyl acrylate Substances 0.000 claims description 2
- VKSCZTWQDPUHIK-UHFFFAOYSA-N isocyanic acid;trimethoxy(propyl)silane Chemical compound N=C=O.CCC[Si](OC)(OC)OC VKSCZTWQDPUHIK-UHFFFAOYSA-N 0.000 claims description 2
- 229920000573 polyethylene Polymers 0.000 claims description 2
- 239000000565 sealant Substances 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 13
- 239000010410 layer Substances 0.000 description 89
- 238000003466 welding Methods 0.000 description 33
- 230000000052 comparative effect Effects 0.000 description 20
- 229910021417 amorphous silicon Inorganic materials 0.000 description 16
- 239000000306 component Substances 0.000 description 16
- 230000007547 defect Effects 0.000 description 13
- 239000010408 film Substances 0.000 description 11
- 238000003475 lamination Methods 0.000 description 11
- 239000003795 chemical substances by application Substances 0.000 description 8
- 238000010030 laminating Methods 0.000 description 8
- 238000013461 design Methods 0.000 description 6
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 5
- 229910021419 crystalline silicon Inorganic materials 0.000 description 5
- 229910052709 silver Inorganic materials 0.000 description 5
- 239000004332 silver Substances 0.000 description 5
- 229910000679 solder Inorganic materials 0.000 description 5
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 239000012785 packaging film Substances 0.000 description 4
- 229920006280 packaging film Polymers 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- 238000005476 soldering Methods 0.000 description 4
- OJMIONKXNSYLSR-UHFFFAOYSA-N phosphorous acid Chemical compound OP(O)O OJMIONKXNSYLSR-UHFFFAOYSA-N 0.000 description 3
- 150000003254 radicals Chemical class 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- 238000003490 calendering Methods 0.000 description 2
- 229920000092 linear low density polyethylene Polymers 0.000 description 2
- 239000004707 linear low-density polyethylene Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000010248 power generation Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 239000012945 sealing adhesive Substances 0.000 description 2
- DZRUNSUYJCQUIG-UHFFFAOYSA-N 2-methylbutan-2-yl hydrogen carbonate Chemical compound CCC(C)(C)OC(O)=O DZRUNSUYJCQUIG-UHFFFAOYSA-N 0.000 description 1
- PZRWFKGUFWPFID-UHFFFAOYSA-N 3,9-dioctadecoxy-2,4,8,10-tetraoxa-3,9-diphosphaspiro[5.5]undecane Chemical compound C1OP(OCCCCCCCCCCCCCCCCCC)OCC21COP(OCCCCCCCCCCCCCCCCCC)OC2 PZRWFKGUFWPFID-UHFFFAOYSA-N 0.000 description 1
- MXLBKVCGLRNKBW-UHFFFAOYSA-N C(=C)OO[Si](C(C)(C)C)(C(C)(C)C)C(C)(C)C Chemical compound C(=C)OO[Si](C(C)(C)C)(C(C)(C)C)C(C)(C)C MXLBKVCGLRNKBW-UHFFFAOYSA-N 0.000 description 1
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 1
- 229920002292 Nylon 6 Polymers 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 241000206469 Pulsatilla Species 0.000 description 1
- 150000004982 aromatic amines Chemical class 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000004330 calcium propionate Substances 0.000 description 1
- 239000011203 carbon fibre reinforced carbon Substances 0.000 description 1
- 238000003889 chemical engineering Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 239000008358 core component Substances 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000006078 metal deactivator Substances 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- 150000008301 phosphite esters Chemical class 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 238000010791 quenching Methods 0.000 description 1
- 230000000171 quenching effect Effects 0.000 description 1
- 239000002516 radical scavenger Substances 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 150000003568 thioethers Chemical class 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
- 229920000428 triblock copolymer Polymers 0.000 description 1
- QQQSFSZALRVCSZ-UHFFFAOYSA-N triethoxysilane Chemical group CCO[SiH](OCC)OCC QQQSFSZALRVCSZ-UHFFFAOYSA-N 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/10—Adhesives in the form of films or foils without carriers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J151/00—Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
- C09J151/06—Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers grafted on to homopolymers or copolymers of aliphatic hydrocarbons containing only one carbon-to-carbon double bond
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/048—Encapsulation of modules
- H01L31/0481—Encapsulation of modules characterised by the composition of the encapsulation material
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
- C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/33—Applications of adhesives in processes or use of adhesives in the form of films or foils for batteries or fuel cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Laminated Bodies (AREA)
Abstract
The invention provides a packaging adhesive film for a heterojunction battery, and a preparation method and application thereof. The packaging adhesive film comprises a first packaging adhesive film layer and a second packaging adhesive film layer which are attached to each other; the preparation raw materials of the second packaging adhesive film layer comprise the following components in parts by weight: 45-85 parts of first matrix resin, 10-50 parts of second matrix resin, 0.5-4 parts of double-bond-containing silane coupling agent and 0.05-1 part of isocyanate coupling agent. The packaging adhesive film provided by the invention has better mechanical property and packaging effect on the heterojunction battery.
Description
Technical Field
The invention belongs to the technical field of photovoltaic modules, and particularly relates to a packaging adhesive film for a heterojunction battery, and a preparation method and application thereof.
Background
Photovoltaic is an important clean energy source, and is an important energy field and a technical direction in the world. The photovoltaic cell assembly is used as a core component of photovoltaic power generation, and the crystalline silicon cell assembly occupies more than 95% of the market. The cost of the crystalline silicon chip and the silver paste occupies a great proportion in the crystalline silicon component, the silver paste amount and the silicon chip amount are reduced, the comprehensive cost of the component is reduced, the electric cost of the battery is lowered, and the photovoltaic market application is promoted, so that the heterojunction battery is widely researched and applied as a thin battery.
A heterojunction cell (HIT, also called HJT) is a hybrid solar cell made of a crystalline silicon substrate and an amorphous silicon Thin film, has many advantages of simple preparation process, low process temperature, high open circuit voltage, high photoelectric conversion efficiency, low temperature coefficient, and the like, and is one of the most widely used high-efficiency crystalline silicon solar technologies at present. The heterojunction cell comprises an n-type silicon wafer, intrinsic amorphous silicon layers (alpha-Si: H (i)) respectively arranged on two opposite end surfaces of the n-type silicon wafer, p-type amorphous silicon layers (alpha-Si: H (p)) and n-type amorphous silicon layers (alpha-Si: H (n)) respectively arranged on the intrinsic amorphous silicon layers on the two surfaces, transparent conducting layers (TCO layers) respectively arranged on the p-type amorphous silicon layers and the n-type amorphous silicon layers, and gate electrodes respectively arranged on the transparent conducting layers on the two surfaces, and the heterojunction cell and the preparation thereof become the current research hotspot.
CN212085022U discloses a heterojunction cell and a heterojunction cell assembly. The heterojunction cell includes: a silicon wafer; an amorphous silicon layer including a first intrinsic amorphous silicon layer and a first p-type amorphous silicon layer on the first region, a second intrinsic amorphous silicon layer and a first n-type amorphous silicon layer on the second region, a third intrinsic amorphous silicon layer and a second n-type amorphous silicon layer on the third region, and a fourth intrinsic amorphous silicon layer and a second p-type amorphous silicon layer on the fourth region; a transparent conductive layer; and an electrode. The heterojunction battery provided by the technical scheme is provided with the first electrode and the second electrode on two sides, and the two electrodes can be alternately arranged when being interconnected; the welding strips are welded on the same side of the battery, so that the space between the batteries in the assembly can be reduced, the effective power generation area of the assembly is increased, and the output power of the assembly is improved; the solder strip need not to detour from top to bottom, has reduced solder strip length, and then has reduced the joule loss on the solder strip.
CN114068735A discloses a method for manufacturing a heterojunction photovoltaic cell assembly. Forming a heterojunction photovoltaic cell assembly formed by connecting a plurality of heterojunction cell pieces according to circuit typesetting; each cell piece is provided with a surface and a back surface, TCO conductive films are arranged on the surface and the back surface, and other grid line electrodes are not arranged; the manufacturing method comprises the following steps: arranging a plurality of mutually parallel welding strips on the surface of the battery piece; arranging a connecting point on the surfaces of the welding strip and the battery piece, and connecting the connecting point with the welding strip; fixing one side of the welding strip on the surface of the battery piece through an adhesive positioning adhesive film, and preliminarily pressing the welding strip and the surface of the battery piece; fixing the other side of the welding strip on the back of the adjacent battery piece through a bonding and positioning adhesive film, and preliminarily pressing the welding strip and the back of the battery piece; connecting a plurality of battery pieces to form a battery piece assembly through the method; arranging and forming the positioned battery piece assembly according to a circuit, adding a packaging assembly, inputting the packaging assembly into a laminating machine, and laminating and hot-assembling the welding strip and the bonding positioning adhesive film to enable the welding strip and the bonding positioning adhesive film to be fixedly contacted with the surface of the battery piece; and finally, mounting the junction box and the frame to finish the manufacture of the photovoltaic cell assembly.
Due to the particularity of the structure of the heterojunction battery, the battery pieces need to be connected, and in the prior art, the connection method mainly comprises infrared welding, a laminated assembly and a low-temperature welding technology. The temperature of infrared welding is generally 220-350 ℃, the welding temperature is high, in order to realize effective welding, a large number of silver main grid lines need to be used below a welding strip, and the large number of the main silver main grid lines bring high silver paste and battery cost; the stack tile assembly does not adopt welding to interconnect batteries, the batteries are bonded through conductive paste, the batteries are overlapped, each assembly wastes 2-3 batteries additionally, cost is increased, the surfaces of the batteries still need to use metal main grids and fine grids, and the extra high-price conductive paste can further increase the cost of the batteries; in the low-temperature welding technology, a welding strip can be spot-welded on a battery piece in advance, after a packaging adhesive film is laid, a component enters a laminating machine for laminating, a low-temperature coating on the surface of the laminated welding strip is melted, so that the welding strip is completely bonded with the battery piece, however, the welding point has a height, the packaging adhesive film is partially melted in the laminating process, and the melted packaging adhesive film flows into the welding point, so that the welding failure between the welding strip and the battery piece can be caused.
Therefore, how to provide a package adhesive film for a heterojunction battery to prevent the package adhesive film from flowing between a solder strip and a battery piece to cause welding failure is a technical problem to be solved urgently at present.
Disclosure of Invention
Aiming at the defects of the prior art, the invention aims to provide a packaging adhesive film for a heterojunction battery, and a preparation method and application thereof. According to the invention, through the design of the packaging adhesive film structure and the design of the preparation raw material of the second packaging adhesive film layer, and further through the use of the silane coupling agent and the isocyanate coupling agent containing double bonds, the prepared packaging adhesive film has better mechanical property and packaging effect on the heterojunction battery.
In order to achieve the purpose, the invention adopts the following technical scheme:
in a first aspect, the invention provides a packaging adhesive film for a heterojunction battery, the packaging adhesive film comprises a first packaging adhesive film layer and a second packaging adhesive film layer which are attached to each other;
the preparation raw materials of the second packaging adhesive film layer comprise the following components in parts by weight:
45-85 parts of first matrix resin, 10-50 parts of second matrix resin, 0.5-4 parts of double-bond-containing silane coupling agent and 0.05-1 part of isocyanate coupling agent.
The heterojunction battery is prepared by using a low-temperature welding technology, a welding strip is required to be spot-welded on a battery piece in advance, and then a low-temperature plating layer on the surface of the welding strip is melted in the laminating process of a battery assembly, so that the welding strip is completely bonded on the battery piece. However, since the soldering points have a certain height, when the heterojunction battery module is packaged and laminated by using the packaging adhesive film, the packaging adhesive film is partially melted due to the higher laminating temperature, and the melted packaging adhesive film on the side close to the battery piece flows into the soldering points, so that the soldering between the soldering strip and the battery piece is failed.
According to the invention, through the design of the packaging adhesive film structure and the design of the preparation raw material of the second packaging adhesive film layer, the use of the first matrix resin and the second matrix resin and the modification of the matrix resin by the double-bond-containing silane coupling agent and the isocyanate coupling agent are further adopted, so that the melting temperature of the second packaging adhesive film layer is higher, the fluidity of the second packaging adhesive film layer is poorer in the laminating process of the battery assembly, and the problem of welding failure between a welding strip and a battery piece caused by the melting and flowing into a welding point is avoided. Therefore, the packaging adhesive film provided by the invention has better mechanical property and packaging effect on the heterojunction battery.
According to the invention, the double-bond-containing silane coupling agent is used for modifying the first matrix resin, so that the polarity of the first matrix resin is improved, and meanwhile, an active group capable of reacting with other raw materials is introduced, so that the second packaging film layer with excellent performance is conveniently prepared.
In the invention, the prepared packaging adhesive film has better performance by controlling the content of the isocyanate coupling agent within a specific range. If the content of the isocyanate coupling agent is too low, the stripping force with the battery piece is small; if the content of the isocyanate coupling agent is too high, the production cost of the packaging adhesive film is too high, and the peeling force between the packaging adhesive film and the battery piece is also reduced.
In the present invention, the weight part of the first base resin may be 45 parts, 50 parts, 55 parts, 60 parts, 65 parts, 70 parts, 75 parts, 80 parts, 85 parts, or the like.
The weight part of the second matrix resin may be 10 parts, 15 parts, 20 parts, 25 parts, 30 parts, 35 parts, 40 parts, 45 parts, 50 parts, or the like.
The weight portion of the double bond-containing silane coupling agent can be 0.5 portion, 1 portion, 1.5 portions, 2 portions, 2.5 portions, 3 portions, 3.5 portions or 4 portions, etc.
The isocyanate coupling agent may be present in an amount of 0.05 parts, 0.1 parts, 0.2 parts, 0.3 parts, 0.4 parts, 0.5 parts, 0.6 parts, 0.7 parts, 0.8 parts, 0.9 parts, 1 part, or the like, by weight.
It should be noted that, in the present invention, the structure of the first encapsulation film layer is not limited in any way, and an encapsulation film having a single-layer structure or a multi-layer structure may be selected as the first encapsulation film layer in the present invention. Meanwhile, the source of the first packaging adhesive film layer is not limited in any way, and a commercially available packaging adhesive film can be selected and can also be obtained by self-manufacturing; if the packaging adhesive film is made by self-manufacturing, the raw materials for preparing the packaging adhesive film in the art are suitable, and exemplary materials include, but are not limited to: refer to CN111961422A for the preparation of the packaging adhesive film as the preparation of the first packaging film layer.
The following is a preferred technical solution of the present invention, but not a limitation to the technical solution provided by the present invention, and the object and advantageous effects of the present invention can be better achieved and achieved by the following preferred technical solution.
In a preferred embodiment of the present invention, the first matrix resin is an ethylene copolymer.
Preferably, the ethylene copolymer is selected from any one of or a combination of at least two of ethylene-vinyl acetate copolymer, ethylene-methyl acrylate copolymer, ethylene-ethyl acrylate copolymer, ethylene-vinyl acetate multipolymer, ethylene-methyl acrylate multipolymer, ethylene-ethyl acrylate multipolymer, ethylene-methyl methacrylate multipolymer, ethylene-ethyl methacrylate multipolymer and ethylene-alpha-olefin copolymer.
Preferably, the ethylene copolymer has a melting point of 70 ℃ or higher, and may be, for example, 70 ℃, 75 ℃, 80 ℃, 85 ℃, 90 ℃, 95 ℃ or 100 ℃.
Preferably, the double bond-containing silane coupling agent is selected from any one of or a combination of at least two of vinyltrimethoxysilane, vinyltriethoxysilane, vinyltri-tert-butylhydroperoxide, vinyltriacetoxysilane, vinyltriisopropoxysilane, or vinyltris (. beta. -methoxyethoxy) silane.
In a preferred embodiment of the present invention, the second matrix resin is selected from any one of polyethylene, polypropylene, nylon, cyclic polyolefin, and SEBS, or a combination of at least two of them.
The SEBS is a linear triblock copolymer having polystyrene as a terminal block and an ethylene-butene copolymer obtained by hydrogenating polybutadiene as an intermediate elastic block.
Preferably, the structural formula of the isocyanate coupling agent is R X (R 1 O) 3-X Si(CH 2 ) n -N＝C＝O；
Wherein X is selected from 0 or 1, n is selected from 2 or 3;
r is-CH 3 ，R 1 Is C1-C4 alkyl (which may be methyl, ethyl, propyl or butyl, for example).
Preferably, the isocyanate coupling agent is selected from isocyanate propyltriethoxysilane and/or isocyanate propyltrimethoxysilane.
In a preferred embodiment of the present invention, the raw material for preparing the second encapsulating film layer further includes 0.05 to 0.2 parts of an initiator, which may be, for example, 0.05 part, 0.1 part, 0.15 part, or 0.2 part.
Preferably, the initiator is selected from the group consisting of tert-butyl peroxy-2-ethylhexyl carbonate, tert-amyl peroxy-2-ethylhexyl carbonate, 2, 5-dimethyl-2, 5-bis (tert-butylperoxy) hexane, tert-butyl peroxy-3, 5, 5-trimethylhexanoate, bis (4-methylbenzoyl) peroxide, dibenzoyl peroxide, 1-di-tert-butylperoxycyclohexane, tert-butylperoxy-2-ethylhexyl carbonate, n-butyl-4, 4-bis (tert-butylperoxy) valerate, dicumyl peroxide, alpha, any one or a combination of at least two of α' -bis (t-butylperoxy) -1, 3-diisopropylbenzene and 1, 1-bis (t-butylperoxy) -3,3, 5-trimethylcyclohexane.
In a preferred embodiment of the present invention, the raw material for preparing the second encapsulating film layer further includes 0.05 to 0.3 parts of a light stabilizer, which may be, for example, 0.05 part, 0.1 part, 0.15 part, 0.2 part, 0.25 part, or 0.3 part.
Preferably, the light stabilizer is selected from any one of light-shielding agent type light stabilizers, quenching agent type light stabilizers, radical trapping agent type light stabilizers or hydroperoxide decomposer type light stabilizers or a combination of at least two of the light stabilizers.
Preferably, the preparation raw material of the second packaging adhesive film layer further comprises 0.01-0.1 part of antioxidant, for example, 0.01 part, 0.02 part, 0.04 part, 0.06 part, 0.08 part or 0.1 part, and the like.
Preferably, the antioxidant is selected from any one or a combination of at least two of hindered phenol antioxidants, aromatic amine antioxidants, phosphite antioxidants, thioether antioxidants and metal deactivator antioxidants.
In a preferred embodiment of the present invention, the thickness of the first encapsulant film layer is 300 to 900 μm, and may be 300 μm, 350 μm, 400 μm, 450 μm, 500 μm, 550 μm, 600 μm, 650 μm, 700 μm, 750 μm, 800 μm, 850 μm, 900 μm, or the like.
Preferably, the thickness of the second encapsulant film layer is 30 to 200 μm, and may be 30 μm, 40 μm, 60 μm, 80 μm, 100 μm, 120 μm, 140 μm, 160 μm, 180 μm, or 200 μm, for example.
According to the invention, the thicknesses of the first packaging adhesive film layer and the second packaging adhesive film layer are respectively controlled within a specific range, so that the prepared packaging adhesive film has a good packaging effect. If the thickness of the first packaging adhesive film layer is too small, air bubbles may be generated after lamination; if the thickness of the second encapsulation adhesive film layer is too small, the adhesion of the second encapsulation adhesive film layer to the battery piece is small, and the solder strip may move after lamination.
In a second aspect, the present invention provides a method for preparing the encapsulant film for heterojunction according to the first aspect, the method comprising the following steps:
(1) mixing the first matrix resin with an initiator optionally selected from a silane coupling agent containing double bonds, and performing reaction extrusion granulation by a double-screw granulation line to obtain a graft material;
mixing the grafting material with second matrix resin, isocyanate coupling agent, optional light stabilizer and antioxidant, and extruding and casting to obtain a second packaging adhesive film layer;
(2) and compounding and molding the second packaging adhesive film layer and the first packaging adhesive film layer to obtain the packaging adhesive film for the heterojunction.
According to the invention, the first matrix resin and the double-bond-containing silane coupling agent are mixed, the double-bond-containing silane coupling agent is reacted with the carbon-carbon double bond in the first matrix resin, so that the double-bond-containing silane coupling agent modifies the first matrix resin in a double-screw extrusion granulation process, a polar group is introduced into the first matrix resin to obtain the grafting material, and the obtained grafting material is easy to react with other raw materials of the second packaging film layer, so that the second packaging film layer with excellent performance is conveniently prepared.
As a preferred embodiment of the present invention, the temperature of the extrusion granulation in the step (1) is 180 to 250 ℃, and may be, for example, 180 ℃, 190 ℃, 200 ℃, 210 ℃, 220 ℃, 230 ℃, 240 ℃ or 250 ℃.
Preferably, the grafting ratio of the alkoxy group in the graft material is 0.5 to 1.8%, and may be, for example, 0.5%, 0.6%, 0.8%, 1%, 1.2%, 1.4%, 1.6%, or 1.8%.
As a preferred embodiment of the present invention, the temperature of the extrusion casting in the step (1) is 150 to 300 ℃, and may be, for example, 150 ℃, 160 ℃, 180 ℃, 200 ℃, 220 ℃, 240 ℃, 260 ℃, 280 ℃ or 300 ℃.
According to the invention, the temperature of extrusion casting is controlled to be more than or equal to 150 ℃, so that the isocyanate coupling agent, the grafting material and the second matrix resin are uniformly mixed and react, and the prepared second packaging adhesive film layer has good cohesiveness with the battery piece and good packaging effect. If the temperature of the extrusion casting is too low, the prepared second packaging adhesive film has poor adhesion with the battery piece and small stripping force.
In a third aspect, the present invention provides an application of the packaging adhesive film in the first aspect in the packaging of a heterojunction battery, wherein a side of the second packaging adhesive film layer away from the first packaging adhesive film layer in the packaging adhesive film is attached to a battery sheet in the heterojunction battery.
Compared with the prior art, the invention has the following beneficial effects:
according to the invention, through the design of the structure of the packaging adhesive film and the design of the preparation raw material of the second packaging adhesive film layer, the use of a silane coupling agent containing double bonds and an isocyanate coupling agent is further adopted, the content of the isocyanate coupling agent is controlled within a specific range, and meanwhile, the packaging adhesive film prepared by the specific preparation method has good mechanical property and good packaging effect, the stripping force is 33.4-62.3N/cm, and no shadow is generated through an EL test after lamination.
Detailed Description
For the purpose of facilitating an understanding of the present invention, the present invention will now be described by way of examples. It should be understood by those skilled in the art that the examples are only for the understanding of the present invention and should not be construed as the specific limitation of the present invention.
Some of the components in the following examples and comparative examples were sourced as follows:
ethylene-vinyl acetate copolymer: korean, E282 PV;
ethylene-methyl acrylate copolymer: dupont, 1913 AC;
ethylene-ethyl acrylate copolymer: dupont, 8200;
ethylene- α -olefin copolymer: DOW corporation, 8450;
LLDPE: DOW corporation, usa, 5220G;
polypropylene: taiwan plastic, 3084H;
nylon 6: plastic-space chemical engineering of Dongguan city, M32800;
cyclic polyolefin: japanese pulsatilla, COC;
light-shielding agent-based light stabilizer: avadin corporation, titanium dioxide;
radical scavenger-based light stabilizer: company, photostabilizer 770;
hindered phenol antioxidant: newshow corporation, BHT;
phosphite ester antioxidant: company, Bisheng, antioxidant 618;
a first packaging adhesive film layer: purchased from Suzhou saiwu (EVA: T11) and having a thickness of 500. mu.m.
Example 1
The embodiment provides a packaging adhesive film for a heterojunction battery and a preparation method thereof, wherein the packaging adhesive film comprises a first packaging adhesive film layer and a second packaging adhesive film layer which are attached to each other;
the preparation raw materials of the second packaging adhesive film layer comprise the following components in parts by weight:
68 parts of ethylene-vinyl acetate copolymer, 2 parts of vinyl triethoxysilane, 0.1 part of tert-butyl peroxy-2-ethylhexyl carbonate, 30 parts of LLDPE, 0.1 part of isocyanate propyl triethoxysilane, 0.2 part of light-shielding agent light stabilizer and 0.1 part of hindered phenol antioxidant.
The preparation method of the packaging adhesive film comprises the following steps:
(1) mixing ethylene-vinyl acetate copolymer, vinyl triethoxysilane and tert-butyl peroxy-2-ethylhexyl carbonate, and performing reactive extrusion granulation by a double-screw granulation line at 220 ℃ to obtain a graft material with a grafting rate of 0.92%;
mixing the grafting material with other raw material components of the second packaging adhesive film layer, and extruding and casting at 200 ℃ to obtain a second packaging adhesive film layer with the thickness of 70 mu m;
(2) and compounding and molding the second packaging adhesive film layer and the first packaging adhesive film layer to obtain the packaging adhesive film for the heterojunction.
Example 2
The embodiment provides a packaging adhesive film for a heterojunction battery and a preparation method thereof, wherein the packaging adhesive film comprises a first packaging adhesive film layer and a second packaging adhesive film layer which are attached to each other;
the preparation raw materials of the second packaging adhesive film layer comprise the following components in parts by weight:
85 parts of ethylene-methyl acrylate copolymer, 4 parts of vinyl tri-tert-butyl peroxy silane, 0.2 part of peroxy-2-ethylhexyl tert-amyl carbonate, 10 parts of polypropylene, 0.2 part of isocyanate propyl triethoxysilane, 0.1 part of free radical trapping agent light stabilizer and 0.05 part of hindered phenol antioxidant.
The preparation method of the packaging adhesive film comprises the following steps:
(1) mixing ethylene-methyl acrylate copolymer, vinyl tri-tert-butyl hydroperoxide and tert-amyl peroxy-2-ethylhexyl carbonate, and performing reactive extrusion granulation on the mixture at 250 ℃ by a double-screw granulation line to obtain a graft material with a grafting rate of 1.1%;
mixing the grafting material with other raw material components of the second packaging adhesive film layer, and extruding and casting at 230 ℃ to obtain a second packaging adhesive film layer with the thickness of 100 mu m;
(2) and compounding and molding the second packaging adhesive film layer and the first packaging adhesive film layer to obtain the packaging adhesive film for the heterojunction.
Example 3
The embodiment provides a packaging adhesive film for a heterojunction battery and a preparation method thereof, wherein the packaging adhesive film comprises a first packaging adhesive film layer and a second packaging adhesive film layer which are attached to each other;
the preparation raw materials of the second packaging adhesive film layer comprise the following components in parts by weight:
65 parts of ethylene-ethyl acrylate copolymer, 3 parts of vinyl trimethoxy silane, 0.1 part of dibenzoyl peroxide, 630 parts of nylon, 0.1 part of isocyanate propyl triethoxysilane, 0.3 part of isocyanate propyl triethoxysilane, 0.2 part of free radical trapping agent light stabilizer and 0.1 part of phosphite antioxidant.
The preparation method of the packaging adhesive film comprises the following steps:
(1) mixing ethylene-ethyl acrylate copolymer, vinyl trimethoxy silane and dibenzoyl peroxide, and performing reactive extrusion granulation on the mixture at 180 ℃ by a double-screw granulation line to obtain a grafting material with the grafting rate of 0.8%;
mixing the grafting material with other raw material components of the second packaging adhesive film layer, and extruding and casting at 280 ℃ to obtain a second packaging adhesive film layer with the thickness of 30 mu m;
(2) and compounding and molding the second packaging adhesive film layer and the first packaging adhesive film layer to obtain the packaging adhesive film for the heterojunction.
Example 4
The embodiment provides a packaging adhesive film for a heterojunction battery and a preparation method thereof, wherein the packaging adhesive film comprises a first packaging adhesive film layer and a second packaging adhesive film layer which are attached to each other;
the preparation raw materials of the second packaging adhesive film layer comprise the following components in parts by weight:
45 parts of ethylene-alpha-olefin copolymer, 0.5 part of vinyl triisopropoxysilane, 0.05 part of tert-butyl peroxy-3, 5, 5-trimethylhexanoate, 50 parts of cyclic polypropylene, 0.5 part of isocyanate propyl triethoxysilane, 0.1 part of light shielding agent light stabilizer and 0.1 part of phosphite antioxidant.
The preparation method of the packaging adhesive film comprises the following steps:
(1) mixing ethylene-alpha-olefin copolymer, vinyl triisopropoxysilane and tert-butyl peroxy-3, 5, 5-trimethylhexanoate, and extruding and granulating at 200 deg.c in a double screw granulating line to obtain grafting material with grafting rate of 0.98%;
mixing the grafting material with other raw material components of the second packaging adhesive film layer, and extruding and casting at 300 ℃ to obtain a second packaging adhesive film layer with the thickness of 200 mu m;
(2) and compounding and molding the second packaging adhesive film layer and the first packaging adhesive film layer to obtain the packaging adhesive film for the heterojunction.
Example 5
The present example provides a package adhesive film for a heterojunction battery and a preparation method thereof, and the difference from example 1 is only that the parts by weight of the isocyanate propyltriethoxysilane is 0.02 part, the parts by weight of the isocyanate propyltriethoxysilane is 0.03 part, and other conditions are the same as example 1.
Example 6
The present example provides a package adhesive film for a heterojunction battery and a preparation method thereof, and the difference from example 1 is only that the parts by weight of the isocyanate propyltriethoxysilane is 0.5 part, and other conditions are the same as example 1.
Example 7
The present embodiment provides a package adhesive film for a heterojunction battery and a preparation method thereof, which is different from embodiment 1 only in that the preparation method of the insulating adhesive film is as follows:
(1) mixing the raw material components of the second packaging adhesive film layer, extruding and granulating by a double screw at 220 ℃, and then extruding and casting at 170 ℃ to obtain a second packaging adhesive film layer with the thickness of 70 mu m;
(2) and carrying out calendering molding on the second packaging adhesive film layer and the first packaging adhesive film layer by using three-roller calendering equipment to obtain the packaging adhesive film for the heterojunction.
Example 8
This example provides a sealing adhesive film for a heterojunction battery and a method for preparing the same, which is different from example 1 only in that the temperature of extrusion casting is 130 ℃, and other conditions are the same as example 1.
Comparative example 1
The comparative example provides a packaging adhesive film for a heterojunction battery and a preparation method thereof, and the packaging adhesive film is different from the packaging adhesive film in example 1 only in that the isocyanate propyl triethoxysilane is 0.01 part by weight, and other conditions are the same as those in example 1.
Comparative example 2
The comparative example provides a packaging adhesive film for a heterojunction battery and a preparation method thereof, and the packaging adhesive film is different from the packaging adhesive film in example 1 only in that the isocyanate propyl triethoxysilane is 0.7 part by weight, and other conditions are the same as those in example 1.
Comparative example 3
The present comparative example provides a packaging adhesive film for a heterojunction battery and a preparation method thereof, and is different from example 1 only in that raw materials for preparing the second packaging adhesive film layer do not contain isocyanate propyl triethoxysilane and isocyanate propyl triethoxysilane, and other conditions are the same as example 1.
Comparative example 4
This comparative example provides a sealing adhesive film for a heterojunction battery and a method for preparing the same, which are different from example 1 only in that vinyltriethoxysilane is replaced with triethoxysilane, and other conditions are the same as example 1.
The performance of the packaging adhesive films provided by the above examples and comparative examples was tested, and the test method was as follows:
peeling force: GB/T29848-2018;
EL (electroluminescence) test after lamination: IEC 61215& 61730;
TC200, rear EL: IEC 61215& 61730;
assembly lamination condition: the packaging adhesive films provided by the above examples and comparative examples are used for packaging heterojunction batteries, vacuumizing is carried out at 145 ℃ for 5min, then lamination is carried out for 10min, and appearance of the heterojunction battery assembly obtained after lamination is observed;
used heterojunction battery piece is hua cheng 166 battery piece, efficiency: 24.0H _ SL, level: A0.
the above examples and comparative examples provide the results of the performance test of the packaging adhesive film as shown in table 1 below:
TABLE 1
| Peeling force/(N/cm) | Post-lamination EL | TC200 rear EL | Lamination of the Components | |
| Example 1 | 42.4 | Without shadow | Without shadow | No appearance defect |
| Example 2 | 37.4 | Without shadow | Without shadow | No appearance defect |
| Example 3 | 47.8 | Without shadow | Without shadow | No appearance defect |
| Example 4 | 42.4 | Without shadow | Without shadow | No appearance defect |
| Example 5 | 33.4 | Without shadow | Without shadow | No appearance defect |
| Example 6 | 62.3 | Without shadow | Without shadow | No appearance defect |
| Example 7 | 21.4 | Without shadow | Without shadow | No appearance defect |
| Example 8 | 18.4 | Without shadow | With shadow | No appearance defect |
| Comparative example 1 | 21.3 | With shadow | Severe shadow | No appearance defect |
| Comparative example 2 | 33.4 | Without shadow | With shadow | No appearance defect |
| Comparative example 3 | 8.4 | With shadow | Severe shadow | No appearance defect |
| Comparative example 4 | 10.4 | With shadow | Severe shadow | No appearance defect |
The content in table 1 shows that, by designing the structure of the packaging adhesive film and the preparation raw material of the second packaging adhesive film layer, the double bond-containing silane coupling agent and the isocyanate coupling agent are further used, the content of the isocyanate coupling agent is controlled within a specific range, and meanwhile, the packaging adhesive film prepared by the specific preparation method has good mechanical properties and good packaging effect, the peeling force is 33.4-62.3N/cm, and no shadow is generated after lamination through an EL test.
Compared with example 1, if all the preparation raw materials of the second packaging adhesive film layer are mixed together and extruded for granulation (example 7) or the temperature of extrusion casting in the step (2) is too low (example 8) in the preparation process, the mechanical property and the packaging effect of the prepared packaging adhesive film are poor.
Compared with the example 1, if the content of the isocyanate coupling agent in the raw material for preparing the second packaging adhesive film is too small (comparative example 1), the mechanical property and the packaging effect of the prepared packaging adhesive film are poor; if the content of the isocyanate coupling agent in the raw material for preparing the second packaging adhesive film is too large (comparative example 2), the packaging effect of the prepared packaging adhesive film is poor.
Compared with example 1, if the raw material for preparing the second packaging adhesive film does not contain an isocyanate coupling agent (comparative example 3) or does not contain a silane coupling agent with double bonds (comparative example 4), the mechanical property and the packaging effect of the prepared packaging adhesive film are poor.
In summary, in the invention, by designing the structure of the encapsulation adhesive film and the preparation raw material of the second encapsulation adhesive film layer, the silane coupling agent containing double bonds and the isocyanate coupling agent are further used, the content of the isocyanate coupling agent is controlled within a specific range, and meanwhile, the encapsulation adhesive film prepared by the specific preparation method has good mechanical properties and good encapsulation effect, and is suitable for lamination encapsulation of heterojunction.
The applicant states that the present invention is illustrated by the detailed process flow of the present invention through the above examples, but the present invention is not limited to the above detailed process flow, that is, it does not mean that the present invention must rely on the above detailed process flow to be implemented. It should be understood by those skilled in the art that any modification of the present invention, equivalent substitutions of the raw materials of the product of the present invention, addition of auxiliary components, selection of specific modes, etc., are within the scope and disclosure of the present invention.
Claims (10)
1. The packaging adhesive film for the heterojunction battery is characterized by comprising a first packaging adhesive film layer and a second packaging adhesive film layer which are attached to each other;
the preparation raw materials of the second packaging adhesive film layer comprise the following components in parts by weight:
45-85 parts of first matrix resin, 10-50 parts of second matrix resin, 0.5-4 parts of double-bond-containing silane coupling agent and 0.05-1 part of isocyanate coupling agent.
2. The packaging adhesive film according to claim 1, wherein the melting point resin of the first matrix resin is ethylene copolymer;
preferably, the ethylene copolymer is selected from any one or a combination of at least two of ethylene-vinyl acetate copolymer, ethylene-methyl acrylate copolymer, ethylene-ethyl acrylate copolymer, ethylene-vinyl acetate multipolymer, ethylene-methyl acrylate multipolymer, ethylene-ethyl acrylate multipolymer, ethylene-methyl methacrylate multipolymer, ethylene-ethyl methacrylate multipolymer and ethylene-alpha-olefin copolymer;
preferably, the melting point of the ethylene copolymer is more than or equal to 70 ℃;
preferably, the double bond-containing silane coupling agent is selected from any one of or a combination of at least two of vinyltrimethoxysilane, vinyltriethoxysilane, vinyltri-tert-butylhydroperoxide, vinyltriacetoxysilane, vinyltriisopropoxysilane, or vinyltris (. beta. -methoxyethoxy) silane.
3. The adhesive sealant film for a heterojunction battery according to claim 1 or 2, wherein the second matrix resin is selected from any one or a combination of at least two of polyethylene, polypropylene, nylon, cyclic polyolefin, and SEBS;
preferably, the structural formula of the isocyanate coupling agent is R X (R 1 O) 3-X Si(CH 2 ) n -N＝C＝O；
Wherein X is selected from 0 or 1, n is selected from 2 or 3;
r is-CH 3 ，R 1 Is C1-C4 alkyl;
preferably, the isocyanate coupling agent is selected from isocyanate propyltriethoxysilane and/or isocyanate propyltrimethoxysilane.
4. The packaging adhesive film according to any one of claims 1 to 3, wherein the raw material for preparing the second packaging adhesive film layer further comprises 0.05 to 0.2 parts of an initiator;
preferably, the initiator is selected from the group consisting of tert-butyl peroxy-2-ethylhexyl carbonate, tert-amyl peroxy-2-ethylhexyl carbonate, 2, 5-dimethyl-2, 5-bis (tert-butylperoxy) hexane, tert-butyl peroxy-3, 5, 5-trimethylhexanoate, bis (4-methylbenzoyl) peroxide, dibenzoyl peroxide, 1-di-tert-butylperoxycyclohexane, tert-butylperoxy-2-ethylhexyl carbonate, n-butyl-4, 4-bis (tert-butylperoxy) valerate, dicumyl peroxide, alpha, any one or a combination of at least two of α' -bis (t-butylperoxy) -1, 3-diisopropylbenzene and 1, 1-bis (t-butylperoxy) -3,3, 5-trimethylcyclohexane.
5. The packaging adhesive film according to any one of claims 1 to 4, wherein the raw material for preparing the second packaging adhesive film layer further comprises 0.05 to 0.3 parts of a light stabilizer;
preferably, the preparation raw materials of the second packaging adhesive film layer further comprise 0.01-0.1 part of antioxidant.
6. The packaging adhesive film according to any one of claims 1 to 5, wherein the thickness of the first packaging adhesive film layer is 300 to 900 μm;
preferably, the thickness of the second packaging adhesive film layer is 30-200 μm.
7. A method for preparing the encapsulant film for heterojunction as claimed in any one of claims 1 to 6, wherein the method comprises the following steps:
(1) mixing the first matrix resin with an initiator optionally selected from a silane coupling agent containing double bonds, and performing reaction extrusion granulation by a double-screw granulation line to obtain a graft material;
mixing the grafting material with second matrix resin, isocyanate coupling agent, optional light stabilizer and antioxidant, and extruding and casting to obtain a second packaging adhesive film layer;
(2) and compounding and molding the second packaging adhesive film layer and the first packaging adhesive film layer to obtain the packaging adhesive film for the heterojunction.
8. The preparation method according to claim 7, wherein the temperature of the extrusion granulation in the step (1) is 180-250 ℃;
preferably, the grafting rate of the alkoxy in the grafting material is 0.5-1.8%.
9. The production method according to claim 7 or 8, wherein the temperature of the extrusion casting in the step (1) is 150 to 300 ℃.
10. The use of the encapsulant film as claimed in any one of claims 1 to 6 in the encapsulation of a heterojunction battery, wherein the side of the second encapsulant film layer away from the first encapsulant film layer is bonded to the battery sheet of the heterojunction battery.
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
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