CN114957749A - Preparation method of transparent heat-insulation film with microstructure - Google Patents
Preparation method of transparent heat-insulation film with microstructure Download PDFInfo
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- CN114957749A CN114957749A CN202210587042.4A CN202210587042A CN114957749A CN 114957749 A CN114957749 A CN 114957749A CN 202210587042 A CN202210587042 A CN 202210587042A CN 114957749 A CN114957749 A CN 114957749A
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- microstructure
- tungsten bronze
- cesium tungsten
- transparent heat
- insulation film
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- 238000009413 insulation Methods 0.000 title claims abstract description 31
- 238000002360 preparation method Methods 0.000 title claims abstract description 16
- 229910000906 Bronze Inorganic materials 0.000 claims abstract description 33
- OHUPZDRTZNMIJI-UHFFFAOYSA-N [Cs].[W] Chemical compound [Cs].[W] OHUPZDRTZNMIJI-UHFFFAOYSA-N 0.000 claims abstract description 33
- 239000010974 bronze Substances 0.000 claims abstract description 33
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 claims abstract description 33
- 239000011248 coating agent Substances 0.000 claims abstract description 17
- 238000000576 coating method Methods 0.000 claims abstract description 17
- 239000002002 slurry Substances 0.000 claims abstract description 16
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 12
- 239000010949 copper Substances 0.000 claims abstract description 12
- 229910052802 copper Inorganic materials 0.000 claims abstract description 12
- 238000002156 mixing Methods 0.000 claims abstract description 9
- 238000001291 vacuum drying Methods 0.000 claims abstract description 8
- 229920005749 polyurethane resin Polymers 0.000 claims abstract description 6
- 238000003754 machining Methods 0.000 claims description 34
- 238000000498 ball milling Methods 0.000 claims description 18
- 238000000034 method Methods 0.000 claims description 18
- 238000000227 grinding Methods 0.000 claims description 15
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 5
- 238000001035 drying Methods 0.000 claims description 4
- 239000008367 deionised water Substances 0.000 claims description 3
- 229910021641 deionized water Inorganic materials 0.000 claims description 3
- 229910003460 diamond Inorganic materials 0.000 claims description 3
- 239000010432 diamond Substances 0.000 claims description 3
- 239000002270 dispersing agent Substances 0.000 claims description 3
- 239000011858 nanopowder Substances 0.000 claims description 3
- 230000000737 periodic effect Effects 0.000 claims description 3
- 238000009966 trimming Methods 0.000 claims description 3
- 238000005485 electric heating Methods 0.000 claims description 2
- 238000007605 air drying Methods 0.000 claims 1
- 238000002834 transmittance Methods 0.000 abstract description 8
- 230000000694 effects Effects 0.000 description 6
- 238000010586 diagram Methods 0.000 description 3
- 229920002635 polyurethane Polymers 0.000 description 3
- 239000004814 polyurethane Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000004088 simulation Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2375/00—Characterised by the use of polyureas or polyurethanes; Derivatives of such polymers
- C08J2375/04—Polyurethanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B80/00—Architectural or constructional elements improving the thermal performance of buildings
- Y02B80/10—Insulation, e.g. vacuum or aerogel insulation
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Moulding By Coating Moulds (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
Abstract
The invention relates to the field of heat insulation films, and discloses a preparation method of a microstructure transparent heat insulation film, which comprises the following steps: s1: preparing cesium tungsten bronze slurry; s2: mixing the prepared cesium tungsten bronze slurry with aqueous polyurethane resin to obtain fully mixed cesium tungsten bronze coating; s3, determining a microstructure with a certain size, selecting a microstructure with a period of 90um, a duty ratio of 100% and an apex angle of 60 degrees, and processing a V-shaped groove array microstructure on a copper plate by adopting a CNC precision grinder; s4: placing a template on the surface of the microstructure, injecting the cesium tungsten bronze coating into the template, then airing and vacuum drying, and demolding after the coating is completely formed to finally obtain the transparent heat-insulating film with the microstructure. According to the preparation method of the microstructure transparent heat insulation film, the microstructure transparent heat insulation film has the advantage of high visible light transmittance, and the utilization of visible light is effectively improved.
Description
Technical Field
The invention relates to the technical field of heat insulation films, in particular to a preparation method of a microstructure transparent heat insulation film.
Background
The heat insulation principle of the existing transparent heat insulation film is to reflect near infrared light and reduce the heat effect of the infrared light, but the visible light transmittance of the existing transparent heat insulation film is not high enough. The thickness of the transparent heat insulation film is too thin, the near infrared reflection effect is reduced, the heat insulation effect is affected, the thickness of the transparent heat insulation film is too thick, and the visible light transmittance is reduced. The microstructure has a good antireflection effect, and the transmittance of visible light can be effectively increased, so that the invention provides a preparation method of the microstructure transparent heat-insulation film.
Disclosure of Invention
Technical problem to be solved
Aiming at the defects of the prior art, the invention provides a preparation method of a micro-structure transparent heat insulation film, which aims to solve the problems.
(II) technical scheme
In order to achieve the above purpose, the invention provides the following technical scheme:
a preparation method of a microstructure transparent heat insulation film comprises the following steps:
s1: preparing cesium tungsten bronze slurry;
s2: mixing the prepared cesium tungsten bronze slurry with aqueous polyurethane resin to obtain fully mixed cesium tungsten bronze coating;
s3, determining a microstructure with a certain size, selecting a microstructure with a period of 90um, a duty ratio of 100% and an apex angle of 60 degrees, and processing a V-shaped groove array microstructure on a copper plate by adopting a CNC precision grinder;
s4: placing a template on the surface of the microstructure, injecting the cesium tungsten bronze coating into the template, then airing and vacuum drying, and demolding after the coating is completely formed to finally obtain the transparent heat-insulating film with the microstructure.
Preferably, the cesium tungsten bronze slurry in S1 is prepared as follows: and (3) putting 8 g of cesium tungsten bronze nano powder, 200 ml of deionized water and 3 g of 735 dispersing agent into a ball milling tank, starting a ball mill, setting the ball milling rotation speed to be 3000r/min, and carrying out ball milling for 6 hours to finally obtain the uniformly dispersed cesium tungsten bronze slurry.
Preferably, the preparation process of the cesium tungsten bronze coating in S2 is as follows: mixing the cesium tungsten bronze slurry and the aqueous polyurethane resin according to a volume ratio of 1: 2, mixing, putting into a ball milling tank, starting the ball mill, setting the ball milling rotating speed to 3000r/min, and ball milling for 6 hours to obtain the cesium tungsten bronze slurry.
Preferably, the dimensions of the microstructure in S3 include the following: and selecting a two-dimensional microstructure V-shaped groove as a microstructure.
Preferably, the processing content of the V-shaped groove array microstructure is as follows:
the first step is as follows: trimming the diamond grinding wheel into a V shape of 60 degrees according to the fact that the vertex angle of the microstructure is 60 degrees;
the second step is that: fixing the copper plate on a workbench, and processing the V-shaped tip grinding wheel along the X direction;
the third step: and processing an array microstructure with the periodic size of 90um, the vertex angle of 60 degrees and the duty ratio of 100 percent on the copper plate.
Preferably, the machining content of the V-shaped tip grinding wheel along the X direction comprises rough machining and finish machining, and the finish machining is carried out after the rough machining is finished;
rough machining: the rough machining depth is 0.05mm, the rotating speed of the grinding wheel is 2000r/min, the rough machining feed speed is 500mm/min, and the rough machining feed depth is 0.003 mm/min;
finish machining: the finish machining depth is 0.004mm, the rotation speed of the grinding wheel is 4000r/min, the finish machining feed speed is 100mm/min, and the finish machining feed depth is 0.001 mm/min.
Preferably, the template in S4 is a box with a thickness of 50 um.
Preferably, the drying and vacuum drying in S4 are as follows: the natural drying time is 2 hours, and the electric heating vacuum drying oven is dried for 6 hours at 80 degrees.
(III) advantageous effects
Compared with the prior art, the preparation method of the microstructure transparent heat insulation film provided by the invention has the following beneficial effects:
1. according to the preparation method of the microstructure transparent heat insulation film, the water-based polyurethane is selected as the film forming resin, and the water-based polyurethane has good transmittance in visible light, so that the microstructure transparent heat insulation film has the advantage of high transmittance in visible light, and the utilization of the visible light is effectively improved.
2. According to the preparation method of the microstructure transparent heat insulation film, the two-dimensional microstructure V-shaped groove is selected as the antireflection microstructure, the structure is simple to process and easy to demould, and the demoulded shape is consistent with the microstructure shape.
Drawings
FIG. 1 is a schematic view of a structural V-shaped microstructure array transparent heat insulation film according to an embodiment of the present invention;
FIG. 2 is a schematic view of a microstructure according to an embodiment of the present invention;
FIG. 3 is a schematic view of a surface with a square frame placed on a microstructure according to an embodiment of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Example (b):
referring to fig. 1-3, a method for manufacturing a microstructure transparent heat insulation film according to an embodiment of the present invention includes the following steps:
firstly, the cesium tungsten bronze has the performance of visible light transmission and near infrared light reflection, and the cesium tungsten bronze is selected to prepare the transparent heat insulation film. And (3) putting 8 g of cesium tungsten bronze nano powder, 200 ml of deionized water and 3 g of 735 dispersing agent into a ball milling tank, starting a ball mill, setting the ball milling rotation speed to be 3000r/min, and ball milling for 6 hours, so as to obtain the uniformly dispersed cesium tungsten bronze slurry.
And secondly, preparing the cesium tungsten bronze coating. The waterborne polyurethane is selected as film-forming resin, has good transmittance in visible light, and has the characteristics of no color, no smell and high wear resistance. Mixing the prepared cesium tungsten bronze slurry and aqueous polyurethane resin in a volume ratio of 1: 2, mixing, putting into a ball milling tank, starting the ball mill, setting the ball milling rotating speed to 3000r/min, and ball milling for 6 hours to obtain the fully mixed cesium tungsten bronze coating.
And thirdly, determining the size of the microstructure. The two-dimensional microstructure V-shaped groove is selected as the antireflection microstructure, the structure is simple to process and easy to demould, and the demoulded shape is consistent with the microstructure shape. And determining the size, duty ratio and vertex angle of the V-shaped groove microstructure to the antireflection effect of visible light by adopting a Finite Difference Time Domain (FDTD) method. According to the simulation result, the microstructure structure is selected to have a period of 90um, a duty ratio of 100% and a vertex angle of 60 degrees.
And fourthly, processing the V-shaped groove array microstructure on the copper plate by adopting a CNC precision grinding machine. And trimming the diamond grinding wheel into a V shape of 60 degrees according to the vertex angle of the microstructure of 60 degrees, fixing the copper plate on a workbench, and processing the V-shaped tip grinding wheel along the X direction. The rough machining depth is 0.05mm, the grinding wheel rotating speed is 2000r/min, the rough machining feed speed is 500mm/min, the rough machining feed depth is 0.003mm/min, the finish machining is carried out after the rough machining, the finish machining depth is 0.004mm, the grinding wheel rotating speed is 4000r/min, the finish machining feed speed is 100mm/min, and the finish machining feed depth is 0.001 mm/min. An array microstructure with the periodic dimension of 90um, the vertex angle of 60 degrees and the duty ratio of 100 percent of a V-shaped groove microstructure is processed on a copper plate, and the schematic diagram is shown in figure 2.
And fifthly, preparing the microstructure transparent heat insulation film. The microstructure array copper plate was subjected to a nano-polishing treatment for better mold release. A box with the thickness of 50um is taken to be placed on the surface of the microstructure, so as to obtain a transparent thermal insulation coating with the thickness of 50um, and the schematic diagram is shown in FIG. 3. And injecting the cesium tungsten bronze coating into a square frame, naturally airing for 2 hours, and drying the cesium tungsten bronze coating in an electrothermal vacuum drying oven at 80 ℃ for 6 hours. And (3) demolding is carried out after the coating is completely formed, and the square frame and the microstructure array copper plate are taken out and taken down, so that the V-shaped microstructure array transparent heat insulation film can be obtained, wherein the schematic diagram is shown in figure 1.
According to the preparation method of the microstructure transparent heat insulation film provided by the embodiment of the invention, the microstructure transparent heat insulation film has the advantage of high visible light transmittance, and the utilization of visible light is effectively improved.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (8)
1. A preparation method of a microstructure transparent heat insulation film is characterized by comprising the following steps:
s1: preparing cesium tungsten bronze slurry;
s2: mixing the prepared cesium tungsten bronze slurry with aqueous polyurethane resin to obtain fully mixed cesium tungsten bronze coating;
s3, determining a microstructure with a certain size, selecting a microstructure with a period of 90um, a duty ratio of 100% and an apex angle of 60 degrees, and processing a V-shaped groove array microstructure on a copper plate by adopting a CNC precision grinder;
s4: placing a template on the surface of the microstructure, injecting the cesium tungsten bronze coating into the template, then airing and vacuum drying, and demolding after the coating is completely formed to finally obtain the transparent heat-insulating film with the microstructure.
2. The method of claim 1, wherein the method comprises the steps of: the preparation process of the cesium tungsten bronze slurry in S1 is as follows: and (3) putting 8 g of cesium tungsten bronze nano powder, 200 ml of deionized water and 3 g of 735 dispersing agent into a ball milling tank, starting a ball mill, setting the ball milling rotation speed to be 3000r/min, and carrying out ball milling for 6 hours to finally obtain the uniformly dispersed cesium tungsten bronze slurry.
3. The method of claim 1, wherein the method comprises the steps of: the preparation process of the cesium tungsten bronze coating in S2 is as follows: mixing the cesium tungsten bronze slurry and the aqueous polyurethane resin according to a volume ratio of 1: 2, mixing, putting into a ball milling tank, starting the ball mill, setting the ball milling rotating speed to 3000r/min, and ball milling for 6 hours to obtain the cesium tungsten bronze slurry.
4. The method for preparing the microstructured transparent thermal insulation film according to claim 1, wherein the method comprises the following steps: the dimensions of the microstructure in S3 include the following: and selecting a two-dimensional microstructure V-shaped groove as a microstructure.
5. The method of claim 1, wherein the method comprises the steps of: the processing content of the V-shaped groove array microstructure is as follows:
the first step is as follows: trimming the diamond grinding wheel into a V shape of 60 degrees according to the fact that the vertex angle of the microstructure is 60 degrees;
the second step is that: fixing the copper plate on a workbench, and processing the V-shaped tip grinding wheel along the X direction;
the third step: and processing an array microstructure with the periodic dimension of 90um, the vertex angle of 60 degrees and the duty ratio of 100 percent on a copper plate.
6. The method of claim 5, wherein the method comprises the steps of: the V-shaped tip grinding wheel performs machining contents including rough machining and finish machining along the X direction, and the finish machining is performed after the rough machining is completed;
rough machining: the rough machining depth is 0.05mm, the rotating speed of the grinding wheel is 2000r/min, the rough machining feed speed is 500mm/min, and the rough machining feed depth is 0.003 mm/min;
finish machining: the finish machining depth is 0.004mm, the rotation speed of the grinding wheel is 4000r/min, the finish machining feed speed is 100mm/min, and the finish machining feed depth is 0.001 mm/min.
7. The method of claim 1, wherein the method comprises the steps of: the template in S4 is a box with a thickness of 50 um.
8. The method of claim 1, wherein the method comprises the steps of: the specific contents of air drying and vacuum drying in the S4 are as follows: the natural drying time is 2 hours, and the electric heating vacuum drying oven is dried for 6 hours at 80 degrees.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210587042.4A CN114957749B (en) | 2022-05-27 | 2022-05-27 | Preparation method of microstructure transparent heat-insulating film |
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| CN202210587042.4A CN114957749B (en) | 2022-05-27 | 2022-05-27 | Preparation method of microstructure transparent heat-insulating film |
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| CN114957749A true CN114957749A (en) | 2022-08-30 |
| CN114957749B CN114957749B (en) | 2023-12-01 |
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Cited By (1)
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| CN115991944A (en) * | 2022-12-02 | 2023-04-21 | 苏州时分秒家纺整理有限公司 | Water-based phase change ink particles and preparation method and application thereof |
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