CN114953640B - Flexible metal-clad plate, electronic device and manufacturing method of flexible metal-clad plate - Google Patents

Flexible metal-clad plate, electronic device and manufacturing method of flexible metal-clad plate Download PDF

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Publication number
CN114953640B
CN114953640B CN202210595813.4A CN202210595813A CN114953640B CN 114953640 B CN114953640 B CN 114953640B CN 202210595813 A CN202210595813 A CN 202210595813A CN 114953640 B CN114953640 B CN 114953640B
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layer
base film
insulating base
metal foil
flexible metal
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CN114953640A (en
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苏陟
周街胜
周涵钰
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Guangzhou Fangbang Electronics Co Ltd
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Guangzhou Fangbang Electronics Co Ltd
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C69/00—Combinations of shaping techniques not provided for in a single one of main groups B29C39/00 - B29C67/00, e.g. associations of moulding and joining techniques; Apparatus therefore
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/06—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of natural rubber or synthetic rubber
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/082—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising vinyl resins; comprising acrylic resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/092—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/095—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyurethanes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/18—Layered products comprising a layer of metal comprising iron or steel
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B25/00—Layered products comprising a layer of natural or synthetic rubber
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • B32B27/308—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising acrylic (co)polymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/40—Layered products comprising a layer of synthetic resin comprising polyurethanes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B33/00—Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2007/00—Flat articles, e.g. films or sheets
    • B29L2007/002—Panels; Plates; Sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2009/00—Layered products
    • B29L2009/003—Layered products comprising a metal layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/206—Insulating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/306—Resistant to heat
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/54—Yield strength; Tensile strength
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/732—Dimensional properties
    • B32B2307/734—Dimensional stability
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10—Energy storage using batteries

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Laminated Bodies (AREA)

Abstract

The invention discloses a flexible metal-clad plate, an electronic device and a manufacturing method of the flexible metal-clad plate, wherein the flexible metal-clad plate comprises an insulating base film layer and a metal foil layer arranged on at least one surface of the insulating base film layer; one surface of the metal foil layer facing the insulating base film layer is a roughened surface, and a plurality of roughness parameters of the roughened surface meet a surface profile longitudinal uniformity relational expression and/or a surface profile transverse uniformity relational expression. The roughening treatment surface is limited by a plurality of roughness parameters, so that roughening particles formed by the roughening treatment surface are required to be distributed nearly uniformly, the uniform roughening particles are utilized to improve the bonding strength between the metal foil layer and the insulating base film layer, the peeling strength between the metal foil layer and the insulating base film layer is obviously improved, and the improvement of the overall performance of heat resistance, bubbling resistance, tensile strength and dimensional stability of the whole flexible metal clad plate is facilitated.

Description

Flexible metal-clad plate, electronic device and manufacturing method of flexible metal-clad plate
Technical Field
The present invention relates to the field of flexible printed circuits, and more particularly, to a flexible metal-clad sheet, an electronic device, and a method for manufacturing the flexible metal-clad sheet.
Background
With the development of 5G communication technology, the research and development investment of flexible printed circuits for 5G high-frequency high-speed products is gradually strengthened, and the flexible printed circuits are used as special base materials for connecting electronic components, have excellent performances of light weight, thinness, various structures, bending resistance and the like, and have important significance for the high-frequency high-speed development of electronic products due to the improvement and perfection of the performances.
The flexible metal clad plate in the prior art mainly adopts a pressing method to press the metal foil on one side or two sides of the polyimide film at high temperature, however, the interface peeling is formed due to insufficient adhesive force between the polyimide film and the metal foil, which affects the subsequent use of the flexible metal clad plate. Therefore, in order to avoid peeling of the metal foil and polyimide of the flexible metal-clad sheet, the surface of the metal foil needs to be treated to improve the peel strength of the flexible metal-clad sheet.
In the prior art, the surface roughening treatment is mainly carried out on the produced metal foil, so that the more the amount of roughened particles is, the higher the surface roughness of the metal foil is, the mechanical fixing effect is increased, and the peeling strength is slightly improved; however, the prior surface roughening treatment technology has extremely limited peeling strength, and has technical bottlenecks, so that the peeling strength of the flexible metal clad sheet is still in urgent need.
Disclosure of Invention
The invention provides a flexible metal-clad plate, an electronic device and a manufacturing method of the flexible metal-clad plate, which are used for solving the technical problem that the peeling strength of the flexible metal-clad plate is difficult to be obviously improved by the existing metal foil surface roughening treatment technology.
In order to solve the technical problems, an embodiment of the present invention provides a flexible metal-clad sheet, including an insulating base film layer and a metal foil layer disposed on at least one surface of the insulating base film layer;
one surface of the metal foil layer facing the insulating base film layer is a roughened surface, and a plurality of roughness parameters of the roughened surface meet a surface profile longitudinal uniformity relational expression and/or a surface profile transverse uniformity relational expression.
As a further development, the surface profile longitudinal uniformity relationship: r is more than or equal to 2.00 y /R a ≤5.50；
Wherein R is y Represents the maximum height of the contour, R a Representing the mean deviation of the contour arithmetic.
As a further development, the surface profile longitudinal uniformity relationship: r is more than or equal to 1.00 y /R z ≤1.50；
Wherein R is y Represents the maximum height of the contour, R z Represents the ten-point average roughness of the contour.
As a further development, the surface profile lateral uniformity relationship: S/S of 1.00 ∈10 m ≤2.65；
Wherein S represents the unimodal average spacing of the contours, S m Representing the average pitch of the microscopic irregularities of the profile.
As a further development, the surface profile lateral uniformity relationship: a is less than or equal to e=n/l;
where E represents the coarsening particle density of the coarsened surface, N represents the number of contour peaks per unit sampling length, and l represents the sampling length.
As a further improvement, a surface of the metal foil layer facing away from the insulating base film layer is a smooth surface.
As a further improvement, the insulating base film layer is made of at least one of thermosetting polyimide, thermoplastic polyimide, modified epoxy resin, modified acrylic, modified rubber, modified thermoplastic polyimide, and modified polyurethane resin;
the metal foil layer is made of a metal material, wherein the metal material is at least one of aluminum, titanium, zinc, iron, nickel, chromium, cobalt, copper, silver, gold and molybdenum, or an alloy formed by at least two of the metal simple substances.
As a further improvement scheme, when the upper surface and the lower surface of the insulating base film layer are respectively provided with a metal foil layer, a plurality of roughness parameters of the roughened surfaces of the two metal foil layers are the same or different.
As a further improvement scheme, an adhesive layer is arranged between the roughened surface of the metal foil layer and the insulating base film layer.
As a further improvement, the adhesive layer is made of at least one of thermoplastic polyimide resin, modified epoxy resin, modified acrylic resin, modified polyurethane resin and modified phenolic resin.
The invention also provides an embodiment of the electronic device, which comprises the flexible metal-clad plate.
The invention also provides a manufacturing method of the flexible metal-clad plate, which comprises the following steps:
the roughened surface of the metal foil layer is formed by chemical plating, PVD, CVD, evaporation plating, sputtering plating, electroplating or a composite process thereof;
and laminating the metal foil layer and the insulating base film layer by a lamination method to obtain a two-layer single-sided flexible metal clad/two-layer double-sided flexible metal clad.
As a further improvement, the method comprises the following steps:
the roughened surface of the metal foil layer can be formed by a roughened surface technical means, including but not limited to chemical plating, PVD, CVD, evaporation plating, sputtering plating, electroplating or a composite process thereof;
and laminating and pressing the metal foil layer, the adhesive layer and the insulating base film layer by a lamination method to obtain the three-layer single-sided flexible metal clad/three-layer double-sided flexible metal clad.
Compared with the prior art, the embodiment of the invention has the following beneficial effects:
1) The roughness parameters of the roughened surface are limited to meet the relation of longitudinal uniformity of the surface profile and/or the relation of transverse uniformity of the surface profile, so that the roughened particles formed by the roughened surface are required to be distributed uniformly (the longitudinal distribution is close to the average height, and the transverse distribution is close to the equal interval), the uniform roughened particles are utilized to improve the bonding strength between the metal foil layer and the insulating base film layer (such as thermoplastic polyimide), the peeling strength between the metal foil layer and the insulating base film layer is obviously improved, and the improvement of the overall performance of the heat resistance, the bubbling resistance, the tensile strength and the dimensional stability of the whole flexible metal clad plate is facilitated.
2) According to the embodiment of the invention, the coarsening surface meeting the requirements of the roughness parameters is prepared, so that the distance and the height of coarsening particles are not too large or too small, the coarsening particles in the form are relatively uniform in distribution, are not easy to fall off in a further processing technology, can be firmly attached to the surface of the metal foil layer, and further can be effectively prevented from being aggregated on the surface of the coarsening surface to cause the increase of the unevenness of the coarsening surface, so that the subsequent adhesion with other materials is influenced, and the probability of foaming, cracking and other conditions is further reduced.
3) In addition, the roughening particles of the metal foil layer are uniformly distributed by means of the 'know-how' method, so that the adhesion between the insulating base film layer (such as thermoplastic polyimide) and the roughening particles is more compact, the adhesive force and the pulling force of each part between the tightly attached metal foil layer and the insulating base film layer tend to be equal, the peeling strength is greatly improved, and the method has a stepwise progressive significance for improving the peeling strength of the flexible metal-clad plate.
Drawings
In order to more clearly illustrate the technical solutions of the present invention, the drawings that are needed in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and that other drawings can be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic illustration of the structure of a metal foil layer in an embodiment of the invention;
FIG. 2 is an electron microscopic view of a copper foil without roughening treatment according to an embodiment of the present invention;
FIG. 3 is an electron microscopic view of a roughened copper foil according to an embodiment of the present invention;
fig. 4 is a schematic structural view of a flexible copper-clad laminate structure including an intermediate adhesive layer in an embodiment of the present invention;
FIG. 5 is a schematic structural view of a flexible copper clad laminate structure without an intermediate tie layer in an embodiment of the invention;
wherein, the reference numerals in the specification and the drawings are as follows:
1. a metal foil layer; 11. coarsening particles;
101. a first copper foil layer, 102, a second copper foil layer;
201. a first intermediate adhesive layer; 202. a second intermediate adhesive layer;
3. an insulating base film layer.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
In the description and claims, it should be understood that the terms "upper," "lower," "left," "right," "front," "rear," "top," "bottom," "inner," "outer," and the like indicate an orientation or positional relationship based on that shown in the drawings, merely to facilitate description of the embodiments of the invention, and do not indicate or imply that the devices or components referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the embodiments of the invention.
Furthermore, the terms first, second and the like in the description and in the claims, are used for descriptive purposes only and are not necessarily for describing relative importance or to indicate the number of features indicated or to imply a sequence or order. The terms are interchangeable where appropriate. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature.
Example 1
The embodiment provides a flexible metal-clad plate, which comprises an insulating base film layer and a metal foil layer 1 arranged on at least one surface of the insulating base film layer; one surface of the metal foil layer 1 facing the insulating base film layer is a roughened surface, and a plurality of roughness parameters of the roughened surface meet a surface profile longitudinal uniformity relational expression and/or a surface profile transverse uniformity relational expression.
The roughening treatment surface and roughness parameters of the embodiment of the invention are described as follows:
1. the roughened surface is the surface of the metal foil layer 1 subjected to the roughening treatment.
2. The roughened particles 11 are protrusions formed on the metal foil layer on the surface of the metal foil layer subjected to roughening treatment by roughening treatment, and fig. 2 shows an electron microscope image without roughening treatment using a copper foil as the metal foil layer, and fig. 3 shows an electron microscope image after roughening treatment using a copper foil as the metal foil layer.
3. The surface roughness parameters on the roughened surface of the metal foil layer 1 according to the embodiment of the present invention include at least:
contour arithmetic mean deviation R a : within the sampling length, the arithmetic average value of the absolute value of the distance from each point on the measured contour to the contour center line, R a The larger the surface, the rougher the surface, expressed by the formula:
maximum height of contour R y : the distance between the crest line and the trough line of the profile within the sampling length; peak and valley lines refer to lines parallel to the midline and passing through the highest and lowest points of the profile, respectively, over the sampling length; r is R y Can reflect the surface roughness, R is as shown in FIG. 2, the copper foil without roughening treatment is sliced y About 0.7 μm, and R is as shown in FIG. 3 y About 2.2 μm.
Ten-point average roughness R of contour z : and (3) in the sampling length, calculating the arithmetic average value of the absolute value of the distance from each point on the measured contour to the contour center line.
Average spacing S of microscopic irregularities of contours m : a section of centerline length S comprising one contour peak and an adjacent contour valley mi A pitch called profile micro-roughness; the average value of the pitch of the microscopic irregularities of the profile within the sampling length, called the average pitch S of the microscopic irregularities of the profile m The formula is:
the unimodal average spacing of profiles S: the projection length Si of the highest point of adjacent contour single peaks on the central line is called the interval of the contour single peaks; the average of the profile unimodal spacings, referred to as the profile unimodal average spacing S, over the sample length is formulated as:
4. for measuring the above parameters, at least the following measurement methods are selected:
based on the scanning electron microscope, the surface morphology is obtained by combining photographing with measurement, statistics and analysis software statistics. Generally includes the following ways:
sample preparation, namely taking a metal foil as a metal foil layer for example, cutting a sample with a certain size on the whole metal foil product at will, carrying out sample preparation according to the detection requirement of a scanning electron microscope, and observing the section and the surface morphology of the metal foil sample by selecting proper multiples (generally 2000-10000 times) under the scanning electron microscope, and shooting morphology images. Repeating the above steps for multiple times to obtain multiple topography maps, and carrying out statistics and analysis by means of statistics and analysis software.
The stylus method is adopted, the diamond stylus with the radius of curvature of the needle tip being about 2 microns is utilized to slowly slide along the surface to be measured, the up-down displacement of the diamond stylus is converted into an electric signal by an electric length sensor, the surface roughness value is indicated by a display instrument after amplification, filtering and calculation, and the profile curve of the section to be measured can be recorded by a recorder. In general, a measuring tool capable of displaying only a surface roughness value is called a surface roughness measuring instrument, and both measuring tools capable of recording a surface profile curve, called a surface roughness profilometer, are provided with an electronic computing circuit or an electronic computer, and can automatically calculate a profile arithmetic mean deviation R a Ten-point average roughness R of contour z Maximum height of profile R y And other various assessment parameters, and the measurement efficiency is high.
The interference method uses the light wave interference principle (see plane crystal, laser length measuring technique) to display the shape error of the measured surface in the interference fringe pattern, and uses the microscope with high magnification (up to 500 times) to amplify the microscopic part of the interference fringes and then measure the microscopic part to obtain the roughness of the measured surface. The surface roughness measuring tool to which this method is applied is called an interference microscope.
5. In order to achieve uniform distribution of roughened particles 11 (longitudinal distribution is close to average height, lateral distribution is close to equal interval) formed on roughened surface, roughening treatment
The roughened surface of the metal foil layer is formed by chemical plating, PVD, CVD, evaporation plating, sputtering plating, electroplating or a composite process thereof; and laminating the metal foil layer and the insulating base film layer by a lamination method to obtain a two-layer single-sided flexible metal clad/two-layer double-sided flexible metal clad, or laminating and laminating the metal foil layer, the adhesive layer and the insulating base film layer by a lamination method to obtain a three-layer single-sided flexible metal clad/three-layer double-sided flexible metal clad.
6. The present invention defines a number of roughness parameters of the roughened surface to meet the surface profile longitudinal uniformity relation and/or the surface profile transverse uniformity relation, thereby requiring that roughened particles formed by the roughened surface be distributed uniformly (the longitudinal distribution approaches the average height and the transverse distribution approaches the equal interval), and based on experiments, the present inventors tested the peel strength between the metal foil layer and the insulating base film layer under different surface profile longitudinal uniformity and transverse uniformity, and the test gave the following (partial) results, see table 1 and table 2:
TABLE 1 different R y /R a 、S/S m Peel strength under parameters
TABLE 2 different R y /R z 、S/S m Peel strength under parameters
Based on test results, it is shown that by limiting a plurality of roughness parameters of the roughened surface, the peel strength of 18N/cm and more than 18N/cm can be achieved, and the maximum peel strength of 21N/cm is achieved.
Based on this, the surface profile longitudinal uniformity relational expression and the surface profile lateral uniformity relational expression are set as follows:
surface profileLongitudinal uniformity relationship: r is more than or equal to 2.00 y /R a Less than or equal to 5.50; or, R is 1.00 ≡R y /R z ≤1.50；
R y Represents the maximum height of the contour, R a Representing the mean deviation of the contour arithmetic, R z Represents the ten-point average roughness of the contour.
Surface profile lateral uniformity relationship: S/S of 1.00 ∈10 m ≤2.65；
S represents the unimodal average spacing of the contours, S m Representing the average pitch of the microscopic irregularities of the profile.
The invention uses uniform coarsening particles to improve the firm bonding strength between the metal foil layer and the insulating base film layer (such as thermoplastic polyimide), can obviously improve the peeling strength between the metal foil layer and the insulating base film layer to reach 21N/cm, and is further beneficial to improving the overall performance of heat resistance, bubbling resistance, tensile strength and dimensional stability of the whole flexible metal-clad plate.
According to the embodiment of the invention, the coarsening surface meeting the requirements of the roughness parameters is prepared, so that the distance and the height of coarsening particles are not too large or too small, the coarsening particles in the form are relatively uniform in distribution, are not easy to fall off in a further processing technology, can be firmly attached to the surface of the metal foil layer, and further can be effectively prevented from being aggregated on the surface of the coarsening surface to cause the increase of the unevenness of the coarsening surface, so that the subsequent adhesion with other materials is influenced, and the probability of foaming, cracking and other conditions is further reduced.
The roughening particles of the metal foil are uniformly distributed by means of 'know how', so that the adhesion between the insulating base film layer (such as thermoplastic polyimide) and the roughening particles is more compact, the adhesive force and the pulling force of each part between the densely-attached metal foil and the insulating base film layer tend to be uniform, and the peeling strength is improved to 21N/cm.
In addition, the surface profile lateral uniformity relationship may also be: a is less than or equal to e=n/l;
where E represents the coarsening particle density of the coarsened surface, N represents the number of contour peaks per unit sampling length, and l represents the sampling length. E can represent the density of coarsening particles, and under a certain degree, the higher the density is, the higher the peel strength is.
In a preferred embodiment, a surface of the metal foil layer facing away from the insulating base film layer is a smooth surface, so that the flow of current can be facilitated and the resistance can be reduced. The insulating base film layer is made of insulating materials with insulating resistance more than or equal to 109, dielectric constant less than or equal to 4.0 and dimensional stability less than or equal to 0.08 percent, such as at least one of thermosetting polyimide, thermoplastic polyimide, modified epoxy resin, modified acrylic, modified rubber, modified thermoplastic polyimide and modified polyurethane resin; the metal foil layer is made of a metal material, wherein the metal material is at least one of aluminum, titanium, zinc, iron, nickel, chromium, cobalt, copper, silver, gold and molybdenum, or an alloy formed by at least two of the metal simple substances.
It can be understood that when a metal foil layer is respectively arranged on the upper surface and the lower surface of the insulating base film layer, a plurality of roughness parameters of roughened surfaces of the two metal foil layers are the same or different.
An adhesive layer is arranged between the roughened surface of the metal foil layer and the insulating base film layer. The adhesive layer is made of at least one of thermoplastic polyimide resin, modified epoxy resin, modified acrylic resin, modified polyurethane resin and modified phenolic resin.
Example two
Based on the first embodiment, the structural design of the flexible copper clad laminate is as follows:
referring to fig. 4, the flexible copper clad laminate structure including the intermediate adhesive layer includes a first copper foil layer 101, a first intermediate adhesive layer 201, an insulating base film layer 3, a second intermediate adhesive layer 202, and a second copper foil layer 102 stacked from top to bottom.
Wherein, the insulating base film layer 3 can be made of at least one of thermosetting polyimide, thermoplastic polyimide, modified epoxy resin, modified acrylic acid, modified rubber, modified thermoplastic polyimide and modified polyurethane resin; the lower surface of the first copper foil layer 101 is bonded to the first intermediate adhesive layer 201, and the upper surface of the second copper foil layer 102 is bonded to the second intermediate adhesive layer 202. The first intermediate adhesive layer 201/the second intermediate adhesive layer 202 are made of one or more materials selected from polyimide, thermoplastic Polyimide (TPI), modified epoxy resin, modified acrylic resin, polyethylene terephthalate, polybutylene terephthalate, polyethylene naphthalate, polystyrene, polyvinyl chloride, polysulfone, polyphenylene sulfide, polyether ether ketone, polyphenylene oxide, polytetrafluoroethylene, liquid crystal polymer, and polyethylene glycoluril; the upper surface of the first copper foil layer 101 and the lower surface of the second copper foil layer 102 are of smooth structures, so that current can flow conveniently, and resistance is reduced; the lower surface of the first copper foil layer 101 and the upper surface of the second copper foil layer 102 are roughened surfaces to facilitate rivet bonding with thermosetting polyimide/thermoplastic polyimide/other resin films.
Referring to fig. 5, the flexible copper clad laminate structure without an intermediate adhesive layer includes a first copper foil layer 101, an insulating base film layer 3 (thermosetting polyimide/thermoplastic polyimide/other resin film may be used), and a second copper foil layer 102 stacked from top to bottom. The lower surface of the first copper foil layer 101 is bonded with the thermoplastic polyimide, and the upper surface of the second copper foil layer 102 is bonded with the thermoplastic polyimide; the upper surface of the first copper foil layer 101 and the lower surface of the second copper foil layer 102 are of smooth structures, so that current can flow conveniently, and resistance is reduced; the lower surface of the first copper foil layer 101 and the upper surface of the second copper foil layer 102 are roughened surfaces to facilitate rivet bonding with thermosetting polyimide/thermoplastic polyimide/other resin films.
The roughness parameters of the lower surface of the first copper foil layer 101 and the upper surface of the second copper foil layer 102 may be the same or different, whether the flexible copper-clad plate structure containing the intermediate adhesive layer or the flexible copper-clad plate structure not containing the intermediate adhesive layer, but the requirements are satisfied:
1.00≤S/S m a surface profile lateral uniformity relationship of less than or equal to 2.65, and,
1.00≤R y /R z r is more than or equal to 1.50 or 2.00 y /R a Surface wheel less than or equal to 5.50Profile longitudinal uniformity relationship.
In the embodiment, through experimental tests and verification, the peel strength between the first copper foil layer of the prepared flexible copper clad laminate and the insulating base film layers of thermosetting polyimide, thermoplastic polyimide and the like can be stabilized above 18N/cm, and the roughened surface meeting the requirements of roughness parameters can be prepared, so that the distance and the height of roughened particles can not be too large or too small, the distribution is relatively uniform, the roughened particles in the form are not easy to fall off in a further processing technology, the copper foil layer and polyimide can be only clamped and nailed, and meanwhile, the cohesive force of the polyimide is contacted, so that the peel strength of the copper foil layer and the polyimide is improved. Therefore, the peel strength of the upper copper foil layer and the lower copper foil layer and polyimide is improved (can reach 21N/cm), which is obviously beneficial to the improvement of the overall performance of heat resistance, bubbling resistance, tensile strength and dimensional stability of the whole flexible copper clad laminate.
In addition, the roughened surface of the copper foil layer can be formed by adopting a roughened surface technical means, including but not limited to an electroless plating mode, PVD, CVD, evaporation plating, sputtering plating, electroplating or a composite process thereof; and laminating the metal foil layer and the insulating base film layer by a lamination method to obtain a two-layer single-sided flexible metal clad/two-layer double-sided flexible metal clad, or laminating and laminating the metal foil layer, the adhesive layer and the insulating base film layer by a lamination method to obtain a three-layer single-sided flexible metal clad/three-layer double-sided flexible metal clad.
Example III
The invention also provides an embodiment of the electronic device, which comprises the flexible metal-clad plate. Examples of electronic devices may include electronic circuit devices and electronic components. Examples of the electronic circuit device may include a semiconductor board, a printed circuit board, and a wiring board. Examples of electronic devices may include display devices such as LCDs and OLEDs, among others.
While the foregoing is directed to the preferred embodiments of the present invention, it will be appreciated by those skilled in the art that changes and modifications may be made without departing from the principles of the invention, such changes and modifications are also intended to be within the scope of the invention.

Claims (9)

1. A flexible metal-clad plate is characterized by comprising an insulating base film layer and a metal foil layer arranged on at least one surface of the insulating base film layer;
one surface of the metal foil layer facing the insulating base film layer is a roughened surface, and a plurality of roughness parameters of the roughened surface meet a surface profile longitudinal uniformity relational expression and a surface profile transverse uniformity relational expression;
the surface profile longitudinal uniformity relationship is: 2.00 is less than or equal toLess than or equal to 5.50; or, 1.00 +.>≤1.50；
In the method, in the process of the invention,representing the maximum height of the outline>Representing the mean deviation of the contour arithmetic, +.>Representing the average roughness of ten points of the contour;
the surface profile lateral uniformity relationship is: 1.00 is less than or equal to≤2.65；
In the method, in the process of the invention,unimodal mean spacing representing profile, +.>Representing the average pitch of the microscopic irregularities of the profile.
2. The flexible metal clad of claim 1 wherein a surface of said metal foil layer facing away from said insulating base film layer is a smooth surface.
3. The flexible metal-clad sheet according to claim 1, wherein the insulating base film layer is made of at least one of thermosetting polyimide, thermoplastic polyimide, modified epoxy resin, modified acrylic, modified rubber, modified thermoplastic polyimide, and modified polyurethane resin;
the metal foil layer is made of a metal material, wherein the metal material is at least one of aluminum, titanium, zinc, iron, nickel, chromium, cobalt, copper, silver, gold and molybdenum, or an alloy formed by at least two of the metal simple substances.
4. The flexible metal-clad sheet according to claim 1, wherein when a metal foil layer is provided on each of the upper and lower surfaces of the insulating base film layer, a plurality of roughness parameters of roughened surfaces of the two metal foil layers are the same or different.
5. The flexible metal-clad sheet according to any one of claims 1 to 4, wherein an adhesive layer is provided between the roughened surface of the metal foil layer and the insulating base film layer.
6. The flexible metal-clad sheet according to claim 5, wherein the adhesive layer is made of at least one of thermoplastic polyimides, modified epoxy resins, modified acrylics, modified polyurethanes, and modified phenolic resins.
7. An electronic device comprising the flexible metal-clad sheet according to any one of claims 1 to 6.
8. The method of manufacturing a flexible metal-clad sheet according to claim 1, comprising the steps of:
the roughened surface of the metal foil layer is formed by chemical plating, PVD, CVD, evaporation plating, sputtering plating, electroplating or a composite process thereof;
and laminating the metal foil layer and the insulating base film layer by a lamination method to obtain a two-layer single-sided flexible metal clad/two-layer double-sided flexible metal clad.
9. The method of manufacturing a flexible metal-clad sheet according to claim 5, comprising the steps of:
the roughened surface of the metal foil layer is formed by chemical plating, PVD, CVD, evaporation plating, sputtering plating, electroplating or a composite process thereof;
and laminating and pressing the metal foil layer, the adhesive layer and the insulating base film layer by a lamination method to obtain the three-layer single-sided flexible metal clad/three-layer double-sided flexible metal clad.
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CN102740613A (en) * 2011-03-31 2012-10-17 新日铁化学株式会社 Metal-clad laminate
CN113463155A (en) * 2021-07-26 2021-10-01 电子科技大学 Roughening liquid for electronic copper foil surface roughening treatment and surface roughening treatment process

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