CN114953276A - Demoulding device and demoulding method for micro-nano machining field - Google Patents
Demoulding device and demoulding method for micro-nano machining field Download PDFInfo
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- CN114953276A CN114953276A CN202110190084.XA CN202110190084A CN114953276A CN 114953276 A CN114953276 A CN 114953276A CN 202110190084 A CN202110190084 A CN 202110190084A CN 114953276 A CN114953276 A CN 114953276A
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- 238000000034 method Methods 0.000 title claims abstract description 42
- 238000003754 machining Methods 0.000 title claims description 51
- 230000007246 mechanism Effects 0.000 claims abstract description 101
- 229920000642 polymer Polymers 0.000 claims abstract description 95
- 239000012528 membrane Substances 0.000 claims description 8
- 238000000926 separation method Methods 0.000 claims description 8
- 230000033001 locomotion Effects 0.000 claims description 7
- 239000002184 metal Substances 0.000 claims description 3
- 239000000853 adhesive Substances 0.000 claims 1
- 230000001070 adhesive effect Effects 0.000 claims 1
- 238000004891 communication Methods 0.000 claims 1
- 230000008569 process Effects 0.000 description 17
- 230000008901 benefit Effects 0.000 description 8
- 238000010586 diagram Methods 0.000 description 8
- 230000000694 effects Effects 0.000 description 6
- 239000002086 nanomaterial Substances 0.000 description 6
- 230000008859 change Effects 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 238000005411 Van der Waals force Methods 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 238000000016 photochemical curing Methods 0.000 description 1
- 238000003908 quality control method Methods 0.000 description 1
- 230000010076 replication Effects 0.000 description 1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/44—Moulds or cores; Details thereof or accessories therefor with means for, or specially constructed to facilitate, the removal of articles, e.g. of undercut articles
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Abstract
The invention mainly provides a demoulding device and a demoulding method thereof used in the field of micro-nano processing, wherein the demoulding device used in the field of micro-nano processing is used for separating a flexible mould from the surface of a polymer, the demoulding device used in the micro-nano processing field comprises at least one driving mechanism, a tension mechanism, a traction mechanism and a film frame, wherein the tension mechanism can drive the driving mechanism and the film frame to move upwards relative to the flexible die, so that the driving mechanism and the film frame can form a certain included angle with the polymer, one end of the flexible mold is fixedly connected with the traction mechanism, the traction mechanism is connected with the driving mechanism and can slide on the film frame under the driving of the driving mechanism, and therefore the flexible mold is driven to be separated from the surface of the polymer.
Description
Technical Field
The invention belongs to the technical field of micro-nano processing, and particularly relates to a demoulding device and a demoulding method thereof in the field of micro-nano processing.
Background
The method for preparing the micro-nano structure in a large scale by adopting a flexible mold to carry out nano imprinting and mold turnover in the field of micro-nano processing mainly comprises the following process flows of (1) preparing the mold, preparing the flexible mold based on a flexible substrate material, and taking the micro-nano structure as a copied matrix on the surface of the mold; (2) placing a mold and a photo-curing polymer of a microstructure to be copied into imprinting equipment, closely attaching the mold and the polymer to copy the micro-nano structure on the mold to the surface of the polymer, and irradiating the micro-nano structure with a corresponding light source after the micro-nano structure is completely attached to the polymer to cure and form the microstructure on the polymer; (3) and separating the polymer and the mold to obtain a microstructure complementary with the concave-convex of the mold on the surface of the polymer.
In the micro-nano product processing, the separation (hereinafter referred to as demolding) process of the mold and the polymer is the last process in the imprinting process and is also the most critical process. This process is the primary stage of defect generation during microstructure replication. Because the contact surface of the polymer and the mould has certain intermolecular acting force (Van der Waals force), mechanical force can be generated on the joint surface, and because the contact between the mould and the polymer contact surface is tight, the polymer is cooled and has the shrinkage packing force, the adhesion force and other adhesion effects on the mould, so that the demoulding is more difficult. The prior common demoulding modes include manual demoulding and automatic demoulding. Manual demolding means that the replicated microstructure and mold are removed from the imprint apparatus and separated manually. And automatic demolding means that a designed device is adopted to realize the separation of the polymer and the mold. The manual demoulding is easy to introduce demoulding direction errors, so that the micro-nano structure is damaged, and the manual demoulding method can be only used in a microstructure demoulding scene with low quality requirement and low depth-to-width ratio. The automatic demoulding mechanism commonly used in the field of micro-nano processing is manufactured by referring to a demoulding mechanism in macro equipment. The separation is achieved by holding the polymeric carrier substrate by a vacuum chuck and then pulling the flexible mold by mechanical means. The existing automatic demoulding structure in the field has two problems in actual use, one is that the demoulding force is small at the initial position, so that the mould and the polymer can not be separated, even the risk of damage of the impressing structure exists, and the other is that even if the separation is successful, the microstructure is still easy to deform greatly during the separation, so that the microstructure which is impressed well is damaged.
Disclosure of Invention
One advantage of the present invention is to provide a demolding device and a demolding method thereof used in the micro-nano processing field, wherein the demolding device used in the micro-nano processing field can avoid the demolding defects such as deformation and damage of a mold and a polymer during the demolding process, so as to improve the quality of a product of a demolded polymer.
One advantage of the present invention is to provide a demolding device and a demolding method thereof for micro-nano processing field, wherein the demolding device for micro-nano processing field can improve the yield of demolded polymers, reduce the demolding cost of polymers, and improve the demolding efficiency of polymers in unit time.
One advantage of the present invention is to provide a demolding device and a demolding method thereof for the micro-nano processing field, wherein the demolding device for the micro-nano processing field has a simple structure and is convenient to operate, and the imprinting cost of a polymer can be reduced.
One advantage of the present invention is to provide a demolding device and a demolding method thereof for micro-nano machining, wherein the demolding device for micro-nano machining keeps the direction and the magnitude of the resultant force of a mold and a polymer at a demolding boundary constant during demolding, so as to ensure that a flexible mold and the polymer are stably and uniformly separated.
One advantage of the present invention is to provide a demolding device and a demolding method thereof for micro-nano processing field, wherein the demolding device for micro-nano processing field ensures that a polymer can be uniformly separated from a flexible mold by adjusting an included angle between the flexible mold and the polymer, so as to improve the demolding quality control of the polymer.
One advantage of the present invention is to provide a demolding device and a demolding method thereof for micro-nano processing field, wherein the demolding device for micro-nano processing field is provided with a buffer structure, so that a buffer protection effect can be provided for a polymer in a demolding process, and a stable and uniform separation between a flexible mold and the polymer is further ensured.
In order to achieve at least one advantage of the invention, the invention provides a demolding device for the micro-nano processing field, which is used for separating a flexible mold from the surface of a polymer, and comprises at least one driving mechanism, a tension mechanism, a traction mechanism and a film frame, wherein the tension mechanism can drive the driving mechanism and the film frame to move upwards relative to the flexible mold, so that a certain included angle can be formed between the driving mechanism and the film frame and the polymer, one end of the flexible mold is fixedly connected to the traction mechanism, and the traction mechanism is connected to the driving mechanism and can slide on the film frame under the driving of the driving mechanism, so that the flexible mold is driven to be separated from the surface of the polymer.
In some embodiments, the flexible mold has a first end and a second end, wherein the first end of the flexible mold is fixedly connected to the pulling mechanism and the second end of the flexible mold is fixedly disposed on an end of the film frame remote from the pulling mechanism.
In some embodiments, the pulling mechanism is fixedly connected to the driving mechanism and one end of the film frame close to the driving mechanism, so that the driving mechanism and the film frame are driven by the pulling mechanism to move upwards relative to the flexible mold.
In some embodiments, the film frame is implemented as a rectangular plate-shaped structure, and the other end of the film frame is fixed to a hinge base, so that the module can rotate relative to the hinge base under the driving of the tension mechanism to realize the upward movement of the film frame relative to the polymer.
In some embodiments, the drawing mechanism is a floating plate, the floating plate is disposed on the surface of the membrane frame, the drawing mechanism further includes at least one set of guide rails, the guide rails are fixedly disposed on both sides of the membrane frame by screws, and the floating plate is respectively connected to the guide rails on both sides of the module, so that the floating plate can slide on the membrane frame along the guide rails.
In some embodiments, the floating plate is fixedly connected to the driving mechanism, so that the driving mechanism can drive the floating plate to slide on the film frame along the guide rail.
In some of these embodiments, the drive mechanism is a linear servo motor.
In some embodiments, the linear servo motor is fixedly connected to the film frame through a metal connecting plate, so as to be fixedly connected with the film frame and have a constant relative position.
In some embodiments, the film frame further comprises at least one connecting plate, the connecting plate is flexibly connected to the floating plate, and the connecting plate is connected to the execution end of the linear servo motor so as to slide on the film frame along the guide rail together with the floating plate under the driving of the linear servo motor.
In some of these embodiments, the connecting plate is flexibly connected to the floating plate by a spring.
In some of these embodiments, the flexible mold is adhesively attached to the surface of the polymer.
In order to achieve at least one of the advantages of the invention, the invention further provides a demolding method used in the micro-nano processing field, which is used for detaching a flexible mold from the surface of a polymer, and the demolding method used in the micro-nano processing field comprises the following steps:
a: connecting the first end of the flexible mould and fixing the second end of the flexible mould;
b: pulling the first end of the flexible mold upwards to form an included angle between the flexible mold and the polymer; and
c: and driving the first end of the flexible mould to move towards the second end of the flexible mould so as to enable the flexible mould to be separated from the surface of the polymer, wherein the included angle between the flexible mould and the polymer in the separation process is kept at 60 degrees.
In some embodiments, the demolding method for the micro-nano machining field is implemented by a demolding device for the micro-nano machining field, and in the step a, a floating plate in the demolding device for the micro-nano machining field is connected to the first end of the flexible mold, so as to drive the first end of the flexible mold to move.
In some embodiments, in the step B, the floating plate is pulled upwards by a pulling force mechanism in the demolding device for the micro-nano processing field to drive the flexible mold to move upwards, so that the included angle is formed between the flexible mold and the polymer.
In some embodiments, in the step C, the flexible mold is moved from the first end of the flexible mold to the second end of the flexible mold by the traction mechanism in the demolding device for the micro-nano machining field, so that the flexible mold is separated from the surface of the polymer.
Drawings
Fig. 1 is a schematic perspective view of a first embodiment of a demolding device for micro-nano machining field according to the present invention.
Fig. 2 is a schematic structural diagram of a first embodiment of a demolding device for the micro-nano machining field according to the present invention in a front view.
Fig. 3A is a mechanical equivalent schematic diagram of a force-bearing angle between a flexible mold and a polymer at the beginning of demolding of a demolding device used in the field of micro-nano processing in the prior art.
Fig. 3B is a mechanical equivalent schematic diagram of a force angle between a flexible mold and a polymer at a later stage of demolding of a demolding device used in the field of micro-nano processing in the prior art.
Fig. 4 is a mechanical equivalent schematic diagram of a force-bearing angle between a flexible mold and a polymer in a demolding process of the first embodiment of the demolding device for the micro-nano machining field.
Fig. 5 is a schematic diagram of a motion curve of a linear servo motor in the first embodiment of the demolding device for the micro-nano machining field.
Fig. 6A is a schematic view of a first embodiment of a demolding device for micro-nano machining according to the present invention, in a working state at the beginning of demolding.
Fig. 6B is a schematic view of a working state of the demolding device for the micro-nano machining field in the demolding process according to the first embodiment of the invention.
Fig. 6C is a schematic view of a working state of the demolding device for the micro-nano machining field in the later demolding stage according to the first embodiment of the invention.
Fig. 7 is a schematic flow diagram of a first embodiment of a demolding method for the micro-nano machining field according to the present invention.
Detailed Description
The following description is presented to disclose the invention so as to enable any person skilled in the art to practice the invention. The preferred embodiments in the following description are given by way of example only, and other obvious variations will occur to those skilled in the art. The underlying principles of the invention, as defined in the following description, may be applied to other embodiments, variations, modifications, equivalents, and other technical solutions without departing from the spirit and scope of the invention.
It will be understood by those skilled in the art that in the present disclosure, the terms "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in an orientation or positional relationship indicated in the drawings for ease of description and simplicity of description, and do not indicate or imply that the referenced devices or components must be in a particular orientation, constructed and operated in a particular orientation, and thus the above terms are not to be construed as limiting the present invention.
It is understood that the terms "a" and "an" should be interpreted as meaning "at least one" or "one or more," i.e., that a quantity of one element may be one in one embodiment, while a quantity of another element may be plural in other embodiments, and the terms "a" and "an" should not be interpreted as limiting the quantity.
The invention mainly provides a demoulding device 10 used in the field of micro-nano machining and a demoulding method thereof, and is a structural schematic diagram of a first embodiment of the demoulding device 10 used in the field of micro-nano machining, as shown in fig. 1 and fig. 2. The demolding device 10 for the micro-nano processing field is used for demolding a polymer 30, the polymer 30 is flexibly connected with a flexible mold 20, the demolding device 10 for the micro-nano processing field comprises at least one driving mechanism 12, one tension mechanism 11, one traction mechanism 13 and one film frame 16, wherein the driving mechanism 12 is fixedly connected with the film frame 16 and can drive the traction mechanism 13 to move on the film frame 16, the tension mechanism 11 can drive the driving mechanism 12 and the film frame 16 to move upwards, so that the driving mechanism 12 and the film frame 16 can form a certain included angle beta with the polymer 30, the traction mechanism 13 is set to be fixedly connected with one end of the flexible mold 20 and the traction mechanism 13 can drive the flexible mold 20 to move linearly along the film frame 16, thereby enabling the traction mechanism 13 to drive the flexible mold 20 to separate from the surface of the polymer 30 under the driving of the driving mechanism 12.
Further, in the first embodiment of the demolding device 10 for the micro-nano machining field of the present invention, the flexible mold 20 is disposed on the surface of the polymer 30 and is adhesively connected to the polymer 30. The flexible mold 20 has a first end 21 and a second end 22, wherein the first end 21 of the flexible mold 20 is fixedly connected to the pulling mechanism 13, and the second end 22 of the flexible mold 20 is fixedly connected to the film frame 16. The tension mechanism 11 is fixedly connected with the driving mechanism 12 and the film frame 16, so that the driving mechanism 12 and the film frame 16 move up and down relative to the flexible mold 20 under the driving of the tension mechanism 11, and the flexible mold 20 is pulled to be separated from the surface of the polymer 30.
In detail, in the first embodiment of the demolding device 10 for micro-nano machining field of the present invention, the film frame 16 is implemented as a rectangular plate-shaped structure, and one end of the film frame 16 is fixed to a hinge base 14, so that the film frame 16 can perform a rotation motion with respect to the hinge base 14.
The drawing mechanism 13 is implemented as a floating plate 131, and the floating plate 131 is provided on the surface of the film frame 16. The drawing mechanism 13 further includes a set of guide rails 132, the guide rails 132 are fixedly installed on both sides of the film frame 16 by screws, and both ends of the floating plate 131 are respectively connected to the guide rails 132 on both sides of the film frame 16, so that the floating plate 131 can move on the film frame 16 along the guide rails 132.
Further, the floating plate 131 is provided as a driving shaft fixedly connected to the driving mechanism 12 so that the driving mechanism 12 can drive the floating plate 131 to move on the film frame 16. Preferably, in the first embodiment of the present invention, the driving mechanism 12 is implemented as a linear servo motor 121 to drive the floating plate 131.
Besides, the shape, fixing manner and/or type of the driving structure of the membrane frame 16 can be modified by those skilled in the art according to actual requirements, and the invention is not limited thereto as long as the technical solution similar or similar to the invention is adopted based on the above disclosure of the invention.
As shown in fig. 5, which is a schematic view illustrating a movement curve of the linear servo motor 121, the floating plate 131 is moved on the film frame 16 along the slide rail by the linear servo motor 121, and one end of the flexible mold 20 is fixedly connected to the floating plate 131, so that the flexible mold 20 can move relative to the polymer 30 in accordance with the movement of the floating plate 131.
Further, as shown in fig. 2, in the first embodiment of the present invention, the body of the linear servo motor 121 is fixedly connected to the film frame 16 through a metal connecting plate 15, so as to be fixedly connected to the film frame 16 with a constant relative position.
Preferably, in the first embodiment of the demolding device 10 for the micro-nano machining field of the present invention, the pulling mechanism 11 is implemented as a pulling rod 111, and the film frame 16 and the driving mechanism 12 are driven by the pulling rod 111 to move up and down relative to the polymer 30, so that the flexible mold 20 can be detached from the surface of the polymer 30.
In the first embodiment of the demolding device 10 for micro-nano machining field according to the present invention, the demolding device further includes at least one connection plate 133, the connection plate 133 is flexibly connected to the floating plate 131 through a spring 134, and the connection plate 133 is connected to the actuating end of the linear servo motor 121 so as to slide on the film frame 16 along the guide rail 132 together with the floating plate 131 under the driving of the linear servo motor 121.
Therefore, in the first embodiment of the demolding device 10 in the micro-nano machining field according to the present invention, the first end 21 of the flexible mold 20 is fixedly connected to the floating plate 131, the second end 22 of the flexible mold 20 is fixed to the film frame 16, and the floating plate 131 can slide on the film frame 16 along the guide rail 132 and can be moved up and down along with the film frame 16 by the pulling mechanism 11, so that the flexible mold 20 can be separated from the surface of the polymer 30 by the dual driving of the pulling mechanism 11 and the pulling mechanism 13, and the force angle and the demolding tension between the flexible mold 20 and the polymer 30 can be controlled.
Next, the operation principle of the demolding device 10 in the micro-nano machining field according to the present invention is further briefly described with reference to fig. 3A to 6C.
First, as shown in fig. 3A and 3B, the mechanical equivalent principle diagram of the force angle between the flexible mold 20 and the polymer 30 during the operation of the demolding device 10 in the micro-nano processing field in the prior art is shown.
At the beginning of demolding, as shown in fig. 3A, since the force angle between the flexible mold 20 and the polymer 30 is large, the linear pulling force applied to the flexible mold 20 is very large, and at the same time, the demolding pulling force applied to the boundary between the flexible mold 20 and the polymer 30 is very small.
In the later stage of demolding, as shown in fig. 3B, since the demolding angle between the flexible mold 20 and the polymer 30 is too large, the whole demolding process is not smooth, and the demolding effect on the microstructure on the surface of the polymer 30 is affected.
In the present invention, as shown in fig. 4 to 6C, the film frame 166 is lifted by the tension mechanism 11 to a certain height, and the film frame 166 performs a rotational motion along the hinge base 14 and forms a certain inclination angle with the horizontal plane. At this time, the linear servo motor 121 is positioned to a designated coordinate, and drives the connecting plate 133 and the floating plate 131 to move rightward on the film frame 16 along the guide rail 132, so as to increase the included angle β between the flexible mold 20 and the polymer 30, thereby achieving an optimal demolding angle.
After the dynamic demolding starts, the film frame 16 is driven by the tension mechanism 11 to continue to be lifted upwards at a constant speed and stably, and the linear servo motor 121 is subjected to linkage control, so that the linear servo motor 121 controls the speed and the distance at which the connecting plate 133 and the floating plate 131 drive the flexible mold 20 to move. As shown in fig. 5, the linear servo motor 121 is driven by the tension mechanism 11 to move and displace, and the linear servo motor 121 is controlled to drive the connecting plate 133 and the floating plate 131 to slide on the film frame 16 along the guide rail 132, thereby driving the flexible mold 20 to be separated from the surface of the polymer 30.
At the later stage of dynamic demolding, the flexible mold 20 is completely separated from the surface of the polymer 30, so that the problem that the surface microstructure of the polymer 30 is distorted or even damaged in the process of separating from the flexible mold 20 is avoided.
As shown in fig. 6A to 6C, in the process that the whole flexible mold 20 is driven to be separated from the surface of the polymer 30, the resultant force of the flexible mold 20 and the polymer 30 at the demolding boundary is uniform in magnitude and consistent in direction, and meanwhile, since the spring 134 can play an auxiliary role in buffering and protecting, the flexible mold 20 and the polymer 30 can be ensured to be separated smoothly and uniformly, so that the surface imprinted microstructure of the polymer 30 is ensured not to be distorted, deformed or damaged.
Therefore, the demolding device 10 for the micro-nano machining field can keep the direction and the size of the resultant force of the flexible mold 20 and the polymer 30 at the demolding boundary constant in the whole demolding process, so that the flexible mold 20 and the polymer 30 can be stably and uniformly separated, and the deformation and the damage of the microstructure on the surface of the polymer 30 can be effectively avoided.
It is worth emphasizing that, in the first embodiment of the demolding device 10 for the micro-nano machining field of the present invention, the included angle β between the flexible mold 20 and the polymer 30 is controlled to be a fixed 60 ° during the whole demolding process, so as to ensure that the flexible mold 20 and the polymer 30 are separated smoothly and uniformly.
As a variation of the first embodiment of the present invention, a person skilled in the art may also change the included angle β between the flexible mold 20 and the polymer 30 during the demolding process according to actual situations, for example, the included angle β between the flexible mold 20 and the polymer 30 during the demolding process is controlled to be 45 ° or other fixed angles according to the degree of adhesion between the surface of the polymer 30 and the flexible mold 20, and also falls within the protection scope of the present invention. In other words, as long as the same or similar technical solution as the present invention is adopted on the basis of the above disclosure, the same or similar technical problem as the present invention is solved, and the same or similar technical effect as the present invention is achieved, and the present invention also belongs to the protection scope of the present invention, and the specific implementation manner of the present invention is not limited thereto.
Besides, those skilled in the art can select or replace the type of the tension mechanism 11 and the connection manner between the connecting plate 133 and the floating plate 131 according to actual situations, and the embodiment of the present invention is not limited thereto as long as the same or similar technical solution as the present invention is adopted based on the above disclosure of the present invention, the same or similar technical problem as the present invention is solved, and the same or similar technical effect as the present invention is achieved.
As shown in fig. 7, the present invention further provides a demolding method of the demolding device 10 for the micro-nano machining field, wherein a flexible mold 20 is separated from a surface of a polymer 30 by the demolding device 10 for the micro-nano machining field, and the demolding method for the micro-nano machining field comprises the following steps:
a: connecting a first end 21 of the flexible mold 20 and fixing a second end 22 of the flexible mold 20;
b: pulling the first end 21 of the flexible mold 20 upward to form an included angle β between the flexible mold 20 and the polymer 30; and
c: the first end 21 of the flexible mold 20 is moved toward the second end 22 of the flexible mold 20 to release the flexible mold 20 from the surface of the polymer 30, wherein the included angle β between the flexible mold 20 and the polymer 30 is maintained at 60 ° during the release.
In the step a, the floating plate 131 of the demolding device 10 for the micro-nano machining field is connected to the first end 21 of the flexible mold 20, so as to drive the first end 21 of the flexible mold 20 to move.
In the step B, the film frame 16 in the demolding device 10 is pulled upwards by the tensile mechanism 11 in the demolding device 10 for the micro-nano machining field, so that the included angle β is formed between the flexible mold 20 and the polymer 30.
In the step C, the flexible mold 20 is driven by the traction mechanism 13 in the demolding device 10 for micro-nano machining field to move from the direction of the first end 21 of the flexible mold 20 to the direction of the second end 22 of the flexible mold 20, so that the flexible mold 20 is separated from the surface of the polymer 30.
It should be emphasized that, in the first embodiment of the demolding method of the demolding device 10 for the micro-nano machining field of the present invention, the tensile mechanism 11 and the traction mechanism 13 are set to be in a linkage mode, so that the tensile mechanism 11 can drive the floating plate 131 to drive the first end 21 of the flexible mold 20 to move towards the second end 22 of the flexible mold 20 by the traction mechanism 13 while pulling the first end 21 of the flexible mold 20 upwards, and the included angle β between the flexible mold 20 and the polymer 30 is kept at a constant 60 degrees.
Besides, a person skilled in the art can change the included angle β between the flexible mold 20 and the polymer 30, for example, to 45 degrees, etc., by changing the linkage mode between the tension mechanism 11 and the traction mechanism 13 according to the actual situation. As long as the same or similar technical solution as the present invention is adopted on the basis of the above disclosure, the same or similar technical problem as the present invention is solved, and the same or similar technical effect as the present invention is achieved, all of which belong to the protection scope of the present invention, and the specific embodiments of the present invention are not limited thereto.
It will be appreciated by persons skilled in the art that the embodiments of the invention described above and shown in the drawings are given by way of example only and are not limiting of the invention. The objects of the invention have been fully and effectively accomplished. The functional and structural principles of the present invention have been shown and described in the embodiments, and any variations or modifications may be made to the embodiments of the present invention without departing from the principles described.
Claims (15)
1. The utility model provides a shedder for micro-nano processing field for make a flexible mould break away from in the surface of a polymer, a serial communication port, shedder for micro-nano processing field includes an at least actuating mechanism, a pulling force mechanism, a drive mechanism and a membrane frame, wherein pulling force mechanism can drive actuating mechanism with the membrane frame for flexible mould moves upwards, thereby makes actuating mechanism with the membrane frame can with form certain contained angle between the polymer, the one end fixed connection of flexible mould in drive mechanism, drive mechanism connect in actuating mechanism can be in under actuating mechanism's the drive slide on the membrane frame, thereby drive flexible mould break away from in the surface of polymer.
2. The demolding device for the micro-nano machining field of claim 1, wherein the flexible mold has a first end and a second end, wherein the first end of the flexible mold is fixedly connected to the traction mechanism, and the second end of the flexible mold is fixedly disposed at an end of the film frame away from the tension mechanism.
3. The demolding device for the micro-nano machining field of claim 2, wherein the tensile mechanism is fixedly connected with the driving mechanism and one end of the film frame, which is close to the driving mechanism, so that the driving mechanism and the film frame move upwards relative to the flexible mold under the driving of the tensile mechanism.
4. The demolding device for the micro-nano machining field as claimed in claim 3, wherein the film frame is implemented as a rectangular plate-shaped structure, and the other end of the film frame is fixed to a hinge base, so that the module can rotate relative to the hinge base under the driving of the tensile mechanism, so as to realize the upward movement of the film frame relative to the polymer.
5. The demolding device for the micro-nano machining field of claim 4, wherein the drawing mechanism is a floating plate, the floating plate is arranged on the surface of the film frame, the drawing mechanism further comprises at least one set of guide rails, the guide rails are fixedly arranged on two sides of the film frame through screws, and the floating plates are respectively connected with the guide rails on two sides of the module, so that the floating plate can slide on the film frame along the guide rails.
6. The demolding device for the micro-nano machining field of claim 5, wherein the floating plate is fixedly connected to the driving mechanism, so that the driving mechanism can drive the floating plate to slide on the film frame along the guide rail.
7. The demolding device for the micro-nano machining field of claim 6, wherein the driving mechanism is a linear servo motor.
8. The demolding device for the micro-nano machining field of claim 7, wherein the linear servo motor is fixedly connected to the film frame through a metal connecting plate, so that the linear servo motor is fixedly connected with the film frame and the relative position of the linear servo motor and the film frame is unchanged.
9. The demolding device for the micro-nano machining field of claim 8, further comprising at least one connection plate flexibly connected to the floating plate, and connected to an execution end of the linear servo motor so as to slide on the film frame along the guide rail together with the floating plate under the driving of the linear servo motor.
10. The demolding device for the micro-nano machining field of claim 9, wherein the connection plate is flexibly connected to the floating plate through a spring.
11. The demolding device for the micro-nano machining field as claimed in any one of claims 1 to 10, wherein the flexible mold is in adhesive connection with the surface of the polymer.
12. A demoulding method used in the micro-nano processing field is used for separating a flexible mould from the surface of a polymer, and is characterized by comprising the following steps:
a: connecting the first end of the flexible mould and fixing the second end of the flexible mould;
b: pulling the first end of the flexible mold upwards to form an included angle between the flexible mold and the polymer; and
c: and driving the first end of the flexible mould to move towards the second end of the flexible mould so as to enable the flexible mould to be separated from the surface of the polymer, wherein the included angle between the flexible mould and the polymer in the separation process is kept at 60 degrees.
13. The demolding method for the micro-nano machining field according to claim 12, wherein the demolding method for the micro-nano machining field is implemented by a demolding device for the micro-nano machining field, and in the step a, a floating plate in the demolding device for the micro-nano machining field is connected to the first end of the flexible mold, so as to drive the first end of the flexible mold to move.
14. The demolding method for the micro-nano machining field according to claim 13, wherein in the step B, the floating plate is pulled upwards by a pulling mechanism in the demolding device for the micro-nano machining field to drive the flexible mold to move upwards, so that the included angle is formed between the flexible mold and the polymer.
15. The demolding method for the micro-nano machining field according to claim 14, wherein in the step C, the flexible mold is moved from the first end of the flexible mold to the second end of the flexible mold by the traction mechanism in the demolding device for the micro-nano machining field, so that the flexible mold is separated from the surface of the polymer.
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| JP2014054735A (en) * | 2012-09-11 | 2014-03-27 | Toshiba Mach Co Ltd | Transfer device and molded material |
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| CN111208708A (en) * | 2018-11-21 | 2020-05-29 | 吉佳蓝科技股份有限公司 | Apparatus and method for fabricating replica mold for imprint lithography |
| CN111819057A (en) * | 2018-03-08 | 2020-10-23 | 株式会社大赛璐 | Method and apparatus for removing mold from molded article |
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| JP2014054735A (en) * | 2012-09-11 | 2014-03-27 | Toshiba Mach Co Ltd | Transfer device and molded material |
| CN107000308A (en) * | 2014-12-22 | 2017-08-01 | 奥贝达克特公司 | Install and stripper apparatus |
| JP2017005085A (en) * | 2015-06-09 | 2017-01-05 | 大日本印刷株式会社 | Imprint device and imprint method |
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