CN114953220A - Processing device for integrated circuit chip - Google Patents
Processing device for integrated circuit chip Download PDFInfo
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- CN114953220A CN114953220A CN202110191329.0A CN202110191329A CN114953220A CN 114953220 A CN114953220 A CN 114953220A CN 202110191329 A CN202110191329 A CN 202110191329A CN 114953220 A CN114953220 A CN 114953220A
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- 238000012545 processing Methods 0.000 title claims abstract description 35
- 235000012431 wafers Nutrition 0.000 claims abstract description 31
- 239000004065 semiconductor Substances 0.000 claims abstract description 23
- 239000000758 substrate Substances 0.000 claims abstract description 10
- 238000007664 blowing Methods 0.000 claims description 3
- 238000012423 maintenance Methods 0.000 claims description 3
- 238000011161 development Methods 0.000 abstract description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 6
- 229910052710 silicon Inorganic materials 0.000 description 6
- 239000010703 silicon Substances 0.000 description 6
- 230000005540 biological transmission Effects 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000013461 design Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000008520 organization Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
- B28D5/0094—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work the supporting or holding device being of the vacuum type
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Dicing (AREA)
Abstract
The invention discloses a processing device for an integrated circuit chip, which comprises a frame body with a substrate, wherein a plurality of carrying disks for placing semiconductor wafers are arranged above the substrate at intervals, a first motor is arranged in the middle of the top of the frame body, a bevel gear set is arranged at the output end of the first motor, and a first screw rod matched with the bevel gear set is rotatably arranged at the top end in the frame body; the outside of first screw rod and the both sides that are located bevel gear group are provided with a first swivel nut respectively, two the screw thread of first swivel nut sets up on the contrary, the fifth motor is installed to the one end of mounting panel, the internally mounted of framework bottom has multiunit fourth motor, a third motor is installed to bottom one side of roating seat, the fixed cutting blade that is provided with in the output shaft outside of third motor. The invention can simultaneously cut a plurality of groups of semiconductor wafers, greatly improves the working efficiency and meets the modern development requirements.
Description
Technical Field
The invention relates to the technical field of semiconductor wafer cutting, in particular to a processing device for an integrated circuit chip.
Background
Silicon wafers are used for manufacturing silicon semiconductor integrated circuits, and are called silicon wafers because of their circular shape, and various circuit element structures can be manufactured on the silicon wafers to form integrated circuit products with specific electrical functions, so that the silicon wafers are basic raw materials for manufacturing integrated circuits and chips. Silicon wafers need to be cut during production and processing.
When the existing cutting device is used for cutting a semiconductor wafer, only one group of cutters and one group of workbenches are needed, so that only one group of semiconductor wafer can be processed at the same time, the processing efficiency is low, and the modern development requirements are not met; the existing cutting device has a complex transmission structure for cutting knives, so that the operation is difficult and the popularization is inconvenient.
Disclosure of Invention
The invention aims to solve the problems that in the prior art, only one semiconductor wafer can be processed at a time, so that the processing efficiency is low, the modern development requirements are not met, and the transmission structure of a cutter is complex, so that the operation is difficult and the popularization is inconvenient, and provides a processing device for an integrated circuit chip.
In order to achieve the purpose, the invention adopts the technical scheme that: a processing device for an integrated circuit chip comprises a frame body with a substrate, wherein a plurality of carrying disks used for placing semiconductor wafers are arranged above the substrate at intervals, a first motor is arranged in the middle of the top of the frame body, a bevel gear set is arranged at the output end of the first motor, and a first screw rod matched with the bevel gear set is rotatably arranged at the top end in the frame body;
the two ends of the first movable seat are connected with the two inner side surfaces of the frame body in a sliding manner, each first threaded sleeve is connected with the first movable seat through a connecting rod, and the two ends of the connecting rod which is obliquely arranged are hinged with the first threaded sleeves and the first movable seat respectively;
racks are arranged at two ends of the top of the first moving seat, a sliding block is movably arranged on the outer side of the first moving seat, a second motor is arranged at two ends of the sliding block, a moving gear matched with the racks is arranged at the output end of the second motor, and a second moving seat is fixedly arranged at the bottom of the sliding block;
a mounting plate is arranged at one end of the second moving seat, a fifth motor is arranged at one end of the mounting plate, a second screw rod extending into the second moving seat is arranged at the output end of the fifth motor, a second screw sleeve is arranged on the outer side of the second screw rod, and a cutting head assembly is arranged at the bottom of the second screw sleeve;
a plurality of groups of fourth motors are arranged in the bottom of the frame body, a straight gear set is arranged at the output end of each fourth motor, and the lower end of the carrier disc positioned below the cutting head assembly penetrates through the base plate to be matched and connected with the straight gear set;
the cutting head assembly comprises a power seat, a rotary seat and a cutting blade, wherein the power seat, the rotary seat and the cutting blade are installed at the bottom of the second threaded sleeve, the rotary seat is installed in the middle of the bottom of the power seat, a third motor is installed on one side of the bottom of the rotary seat, and the cutting blade is fixedly arranged on the outer side of an output shaft of the third motor.
The further improved scheme in the technical scheme is as follows:
1. in the above scheme, the inside both sides of framework have all been seted up the spout, the both ends of first removal seat all are equipped with the removal fixture block with spout matched with.
2. In the above scheme, control panel is installed to the one end of framework, control panel's front end bottom is provided with the display screen, the control key just is located under the display screen in the control panel front end, all electric connection of electrical apparatus in control panel and the device.
3. In the above scheme, four corners of the bottom of the frame body are provided with the supporting legs.
4. In the scheme, the bottoms of the supporting legs are provided with the anti-skid pads.
5. In the above scheme, the second movable seat is internally provided with a groove matched with the second screw rod.
6. In the scheme, one end of the second threaded sleeve is provided with the air blowing head matched with the cutting head assembly.
7. In the above scheme, the carrying disc is a vacuum chuck.
8. In the above scheme, the bottom of framework front end is provided with fourth motor matched with maintenance door.
Due to the application of the technical scheme, compared with the prior art, the invention has the following advantages:
1. the processing device for the integrated circuit chip realizes flexible movement of the two moving seats and the cutting head assembly, can simultaneously realize multidirectional cutting of wafers, can realize multidirectional rapid processing of wafers with different sizes and specifications, and improves the processing efficiency; further, the internally mounted of its framework bottom has multiunit fourth motor, install a straight-toothed gear group on the output of fourth motor, be located the cutting head subassembly below carry a set lower extreme pass the base plate with straight-toothed gear group accordant connection can place multiunit semiconductor wafer simultaneously in carrying the dish, utilize the cutting head subassembly to cut semiconductor wafer after lining up, after same direction cutting is accomplished, rotatory year dish carries out another direction processing to semiconductor wafer, can cut multiunit semiconductor wafer simultaneously, improves work efficiency greatly, satisfies modern development demand.
2. According to the processing device for the integrated circuit chip, the cutting head assembly comprises the power seat, the rotating seat and the cutting blade, wherein the power seat, the rotating seat and the cutting blade are installed at the bottom of the second threaded sleeve, the rotating seat is installed in the middle of the bottom of the power seat, the third motor is installed on one side of the bottom of the rotating seat, and the cutting blade is fixedly arranged on the outer side of the output shaft of the third motor, so that the whole transmission structure for cutting is changed into a simple structure in design, convenient and fast to operate, easy to master and convenient to popularize.
Drawings
FIG. 1 is a first schematic structural diagram of a processing apparatus for an integrated circuit chip according to the present invention;
FIG. 2 is a second schematic structural view of a processing apparatus for an integrated circuit chip according to the present invention;
FIG. 3 is a first schematic view of a partial structure of a processing apparatus for an integrated circuit chip according to the present invention;
FIG. 4 is an enlarged view of a processing apparatus for an integrated circuit chip according to the present invention;
FIG. 5 is a second schematic view of a partial structure of a processing apparatus for an integrated circuit chip according to the present invention.
In the above drawings: 1. a frame body; 2. a first motor; 3. a bevel gear set; 4. a first screw; 5. a first threaded sleeve; 6. a connecting rod; 7. a first movable base; 8. a rack; 9. a second motor; 10. a slider; 11. a second movable base; 12. mounting a plate; 13. a cutting head assembly; 131. a power base; 132. a rotating base; 133. a third motor; 134. an output shaft; 135. a cutting blade; 14. a fourth motor; 15. a spur gear set; 16. repairing the door; 17. a carrying tray; 18. a fifth motor; 19. a chute; 20. a groove; 21. a second screw; 22. a second thread insert; 23. a moving gear; 24. a control panel; 25. a display screen; 26. a control key; 27. a substrate.
Detailed Description
Example 1: a processing device for an integrated circuit chip comprises a frame body 1 with a substrate 27, wherein a plurality of carrying disks 17 used for placing semiconductor wafers are arranged above the substrate 27 at intervals, a first motor 2 is arranged in the middle of the top of the frame body 1, a bevel gear set 3 is arranged at the output end of the first motor 2, and a first screw rod 4 matched with the bevel gear set 3 is rotatably arranged at the top end in the frame body 1;
a first threaded sleeve 5 is respectively arranged on the outer side of the first screw rod 4 and on two sides of the bevel gear set 3, threads of the two first threaded sleeves 5 are arranged oppositely, a first moving seat 7 is arranged below the first screw rod 4, two ends of the first moving seat 7 are slidably connected with two inner side surfaces of the frame body 1, each first threaded sleeve 5 is connected with the first moving seat 7 through a connecting rod 6, and two ends of the connecting rod 6 which is obliquely arranged are respectively hinged with the first threaded sleeve 5 and the first moving seat 7;
the rack 8 is arranged at both ends of the top of the first moving seat 7, the sliding block 10 is movably arranged at the outer side of the first moving seat 7, the second motor 9 is arranged at both ends of the sliding block 10, the moving gear 23 matched with the rack 8 is arranged at the output end of the second motor 9, and the second moving seat 11 is fixedly arranged at the bottom of the sliding block 10;
a mounting plate 12 is arranged at one end of the second moving seat 11, a fifth motor 18 is mounted at one end of the mounting plate 12, a second screw 21 extending into the second moving seat 11 is arranged at the output end of the fifth motor 18, a second threaded sleeve 22 is arranged on the outer side of the second screw 21, and a cutting head assembly 13 is mounted at the bottom of the second threaded sleeve 22;
a plurality of groups of fourth motors 14 are arranged inside the bottom of the frame body 1, a straight gear set 15 is arranged at the output end of each fourth motor 14, and the lower end of the carrier disc 17 positioned below the cutting head assembly 13 penetrates through a base plate 27 to be connected with the straight gear set 15 in a matching manner;
the cutting head assembly 13 comprises a power seat 131, a rotating seat 132 and a cutting blade 135 which are installed at the bottom of the second threaded sleeve 22, the rotating seat 132 is installed in the middle of the bottom of the power seat 131, a third motor 133 is installed on one side of the bottom of the rotating seat 132, and the cutting blade 135 is fixedly arranged outside an output shaft 134 of the third motor 133.
Sliding grooves 19 are formed in both sides of the interior of the frame body 1, and moving clamping blocks matched with the sliding grooves 19 are arranged at both ends of the first moving seat 7 so as to reduce friction force and better move the first moving seat 7;
a control panel 24 is installed at one end of the frame 1, a display screen 25 is installed at the bottom of the front end of the control panel 24, a control key 26 is installed at the front end of the control panel 24 and is positioned right below the display screen 25, and the control panel 24 is electrically connected with the electric appliances in the device; four corners of the bottom of the frame body 1 are provided with a supporting leg.
Example 2: a processing device for an integrated circuit chip comprises a frame body 1 with a substrate 27, wherein a plurality of carrying disks 17 used for placing semiconductor wafers are arranged above the substrate 27 at intervals, a first motor 2 is arranged in the middle of the top of the frame body 1, a bevel gear set 3 is arranged at the output end of the first motor 2, and a first screw rod 4 matched with the bevel gear set 3 is rotatably arranged at the top end in the frame body 1;
a first threaded sleeve 5 is respectively arranged on the outer side of the first screw rod 4 and on two sides of the bevel gear set 3, threads of the two first threaded sleeves 5 are arranged oppositely, a first moving seat 7 is arranged below the first screw rod 4, two ends of the first moving seat 7 are slidably connected with two inner side surfaces of the frame body 1, each first threaded sleeve 5 is connected with the first moving seat 7 through a connecting rod 6, and two ends of the connecting rod 6 which is obliquely arranged are respectively hinged with the first threaded sleeve 5 and the first moving seat 7;
the rack 8 is arranged at both ends of the top of the first moving seat 7, the sliding block 10 is movably arranged at the outer side of the first moving seat 7, the second motor 9 is arranged at both ends of the sliding block 10, the moving gear 23 matched with the rack 8 is arranged at the output end of the second motor 9, and the second moving seat 11 is fixedly arranged at the bottom of the sliding block 10;
a mounting plate 12 is arranged at one end of the second moving seat 11, a fifth motor 18 is mounted at one end of the mounting plate 12, a second screw 21 extending into the second moving seat 11 is arranged at the output end of the fifth motor 18, a second threaded sleeve 22 is arranged on the outer side of the second screw 21, and a cutting head assembly 13 is mounted at the bottom of the second threaded sleeve 22;
a plurality of groups of fourth motors 14 are arranged inside the bottom of the frame body 1, a straight gear set 15 is arranged at the output end of each fourth motor 14, and the lower end of the carrier disc 17 positioned below the cutting head assembly 13 penetrates through a base plate 27 to be connected with the straight gear set 15 in a matching manner;
the cutting head assembly 13 comprises a power seat 131, a rotating seat 132 and a cutting blade 135 which are installed at the bottom of the second threaded sleeve 22, the rotating seat 132 is installed in the middle of the bottom of the power seat 131, a third motor 133 is installed on one side of the bottom of the rotating seat 132, and the cutting blade 135 is fixedly arranged outside an output shaft 134 of the third motor 133.
The bottoms of the supporting legs are provided with anti-skid pads, so that a better supporting device is realized; a groove 20 matched with a second screw 21 is arranged in the second movable seat 11; one end of the second threaded sleeve 22 is provided with a blowing head matched with the cutting head assembly 13, so that waste can be blown clean after cutting; the carrying disc 17 is a vacuum sucking disc; a maintenance door 16 matched with the fourth motor 14 is arranged at the bottom of the front end of the frame body 1.
The working principle is as follows:
during processing, a plurality of groups of semiconductor wafers are simultaneously and correspondingly placed in the plurality of groups of carrying disks 17, and the third motor 133 is started to enable the cutting blade 135 to rotate at a high speed;
the second motor 9 is started under the control of the control panel 24, so that the second motor drives the moving gear 23 to rotate, and the second moving seat 11 is far away from the vacuum chuck 17 along the direction of the rack 8 by the mutual matching of the moving gear 23 and the rack 8;
the fifth motor 18 is started to drive the second screw 21 to rotate, so that the cutting head assembly 13 connected through the second screw sleeve 22 is far away from the carrying disc 17 along the direction of the second screw 21;
starting the first motor 2 to drive the bevel gear set 3 to rotate, so that the first screw rod 4 rotates, and then the first movable seat 7 moves downwards in the chute 19 by utilizing the interaction between the first threaded sleeve 5 and the connecting rod 6 until the specified depth is reached;
and the fifth motor 18 is started again, the cutting head assembly 13 is moved to the designated cutting width, the second motor 9 is started to drive the cutting head assembly 13 to cut the semiconductor wafer, after the cutting of the first knife is finished, the cutting head assembly 13 is separated from the semiconductor wafer, the second motor 9 is started again, the cutting head assembly 13 is moved to the next cutting point, then the cutting is carried out, after the cutting task in the same direction is finished, the fourth motor 14 is started by utilizing the control panel 24, the straight gear set 15 is driven to rotate, the vacuum chuck 17 is controlled to rotate ninety degrees, and then the steps are circulated, so that the whole processing of the semiconductor wafer is finished.
When the processing device for the integrated circuit chip is adopted, the flexible movement of the two moving seats and the cutting head assembly is realized, the multidirectional cutting of the wafer can be realized simultaneously, the multidirectional rapid processing of wafers with different sizes and specifications can be realized, and the processing efficiency is improved;
furthermore, a plurality of groups of semiconductor wafers can be placed in the carrying disc at the same time, the semiconductor wafers are cut by the cutting head assembly after being aligned, after the cutting in the same direction is completed, the carrying disc is rotated to process the semiconductor wafers in the other direction, the plurality of groups of semiconductor wafers can be cut at the same time, the working efficiency is greatly improved, and the modern development requirements are met.
In addition, its cutting head subassembly is including installing power seat, roating seat and the cutting blade in second swivel nut bottom, the department installs the roating seat in the middle of the bottom of power seat, a third motor is installed to bottom one side of roating seat, the fixed cutting blade that is provided with in the output shaft outside of third motor for holistic transmission structure of cutting usefulness becomes simply at project organization, and the simple operation, easy shang, facilitate promotion.
The above embodiments are merely illustrative of the technical ideas and features of the present invention, and the purpose thereof is to enable those skilled in the art to understand the contents of the present invention and implement the present invention, and not to limit the protection scope of the present invention. All equivalent changes and modifications made according to the spirit of the present invention should be covered within the protection scope of the present invention.
Claims (9)
1. A processing apparatus for an integrated circuit chip, comprising a housing (1) having a substrate (27), characterized in that: a plurality of carrying disks (17) for placing semiconductor wafers are arranged above the base plate (27) at intervals, a first motor (2) is arranged in the middle of the top of the frame body (1), a bevel gear set (3) is arranged at the output end of the first motor (2), and a first screw (4) matched with the bevel gear set (3) is rotatably arranged at the top end in the frame body (1);
the outer side of the first screw (4) and two sides of the bevel gear set (3) are respectively provided with a first threaded sleeve (5), threads of the two first threaded sleeves (5) are arranged oppositely, a first moving seat (7) is arranged below the first screw (4), two ends of the first moving seat (7) are slidably connected with two inner side surfaces of the frame body (1), each first threaded sleeve (5) is connected with the first moving seat (7) through a connecting rod (6), and two ends of the connecting rod (6) which is obliquely arranged are respectively hinged with the first threaded sleeves (5) and the first moving seats (7);
racks (8) are arranged at two ends of the top of the first moving seat (7), a sliding block (10) is movably arranged on the outer side of the first moving seat (7), second motors (9) are arranged at two ends of the sliding block (10), a moving gear (23) matched with the racks (8) is arranged at the output end of each second motor (9), and a second moving seat (11) is fixedly arranged at the bottom of each sliding block (10);
a mounting plate (12) is arranged at one end of the second moving seat (11), a fifth motor (18) is arranged at one end of the mounting plate (12), a second screw rod (21) extending into the second moving seat (11) is arranged at the output end of the fifth motor (18), a second threaded sleeve (22) is arranged on the outer side of the second screw rod (21), and a cutting head assembly (13) is arranged at the bottom of the second threaded sleeve (22);
a plurality of groups of fourth motors (14) are arranged inside the bottom of the frame body (1), a straight gear set (15) is arranged at the output end of each fourth motor (14), and the lower end of the carrying disc (17) positioned below the cutting head assembly (13) penetrates through a base plate (27) to be connected with the straight gear set (15) in a matched mode;
cutting head subassembly (13) are including installing power seat (131), roating seat (132) and cutting blade (135) in second swivel nut (22) bottom, department installs roating seat (132) in the middle of the bottom of power seat (131), a third motor (133) is installed to bottom one side of roating seat (132), the fixed cutting blade (135) that is provided with in output shaft (134) outside of third motor (133).
2. The processing apparatus according to claim 1, wherein: sliding grooves (19) are formed in two sides of the inner portion of the frame body (1), and moving clamping blocks matched with the sliding grooves (19) are arranged at two ends of the first moving seat (7).
3. The processing apparatus according to claim 1, wherein: control panel (24) are installed to the one end of framework (1), control panel's (24) front end bottom is provided with display screen (25), control panel (24) front end just is located control key (26) under display screen (25), control panel (24) and the interior all electric connection of electrical apparatus of device.
4. The processing apparatus according to claim 1, wherein: four corners of the bottom of the frame body (1) are provided with a supporting leg.
5. The processing apparatus according to claim 4, wherein: and the bottoms of the supporting legs are provided with anti-slip pads.
6. The processing apparatus according to claim 1, wherein: and a groove (20) matched with the second screw rod (21) is arranged in the second movable seat (11).
7. The processing apparatus according to claim 1, wherein: and one end of the second threaded sleeve (22) is provided with a blowing head matched with the cutting head assembly (13).
8. The processing apparatus according to claim 1, wherein: the carrying disc (17) is a vacuum sucker.
9. The processing apparatus according to claim 1, wherein: and a maintenance door (16) matched with a fourth motor (14) is arranged at the bottom of the front end of the frame body (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110191329.0A CN114953220A (en) | 2021-02-20 | 2021-02-20 | Processing device for integrated circuit chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110191329.0A CN114953220A (en) | 2021-02-20 | 2021-02-20 | Processing device for integrated circuit chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114953220A true CN114953220A (en) | 2022-08-30 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110191329.0A Pending CN114953220A (en) | 2021-02-20 | 2021-02-20 | Processing device for integrated circuit chip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114953220A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01178407A (en) * | 1988-01-07 | 1989-07-14 | Tokyo Seimitsu Co Ltd | Wafer collecting device of slicing machine |
| CN103183468A (en) * | 2011-12-28 | 2013-07-03 | 鸿富锦精密工业（深圳）有限公司 | Glass cutting apparatus |
| CN205021839U (en) * | 2015-08-13 | 2016-02-10 | 浙江昀丰新能源科技有限公司 | Multiplex bit line butt machine |
| CN209580123U (en) * | 2019-08-16 | 2019-11-05 | 安徽博辰电力科技有限公司 | A kind of semiconductor packages wafer cutting device |
| CN211590779U (en) * | 2019-09-12 | 2020-09-29 | 佛山市汉思通新材料科技有限公司 | Ceramic tile edge trimmer |
-
2021
- 2021-02-20 CN CN202110191329.0A patent/CN114953220A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01178407A (en) * | 1988-01-07 | 1989-07-14 | Tokyo Seimitsu Co Ltd | Wafer collecting device of slicing machine |
| CN103183468A (en) * | 2011-12-28 | 2013-07-03 | 鸿富锦精密工业（深圳）有限公司 | Glass cutting apparatus |
| CN205021839U (en) * | 2015-08-13 | 2016-02-10 | 浙江昀丰新能源科技有限公司 | Multiplex bit line butt machine |
| CN209580123U (en) * | 2019-08-16 | 2019-11-05 | 安徽博辰电力科技有限公司 | A kind of semiconductor packages wafer cutting device |
| CN211590779U (en) * | 2019-09-12 | 2020-09-29 | 佛山市汉思通新材料科技有限公司 | Ceramic tile edge trimmer |
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