CN114952043A - Laser processing system capable of quickly positioning mechanical arm to three-dimensional coordinate system - Google Patents

Laser processing system capable of quickly positioning mechanical arm to three-dimensional coordinate system Download PDF

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Publication number
CN114952043A
CN114952043A CN202110188514.4A CN202110188514A CN114952043A CN 114952043 A CN114952043 A CN 114952043A CN 202110188514 A CN202110188514 A CN 202110188514A CN 114952043 A CN114952043 A CN 114952043A
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China
Prior art keywords
test board
probes
laser
axis
galvanometer
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CN202110188514.4A
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Chinese (zh)
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黄绍甫
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Yicheng Technology Shenzhen Co ltd
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Yicheng Technology Shenzhen Co ltd
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Priority to CN202110188514.4A priority Critical patent/CN114952043A/en
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70Auxiliary operations or equipment
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03Observing, e.g. monitoring, the workpiece
    • B23K26/032Observing, e.g. monitoring, the workpiece using optical means
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08Devices involving relative movement between laser beam and workpiece
    • B23K26/083Devices involving movement of the workpiece in at least one axial direction
    • B23K26/0853Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)

Abstract

The invention provides a laser processing system capable of quickly positioning a mechanical arm to a three-dimensional coordinate system, which comprises a laser processing machine, a positioning device and a positioning device, wherein the laser processing machine is used for emitting laser beams to process; a correction module is arranged outside a processing galvanometer on the laser processing machine; three probes are arranged on the lower surface of the correction module and are of telescopic structures; the three probe placing surfaces form a two-dimensional plane; the tips of the three probes are positioned on the same horizontal plane during testing, and the correction module is also positioned on the horizontal plane; a robot arm including a clamping member for clamping a workpiece so that the laser processing machine can project laser light onto the workpiece; when in test, the clamping piece clamps a test board, so that the test board is close to the three probes and abuts against the three probes; and (3) adjusting the angle of the clamping piece of the mechanical arm for clamping the test board by using the compression length of each probe, and repeating the test and the angle adjustment until the compression lengths of the three probes are the same when the three probes are abutted, so that the test board is in the horizontal plane.

Description

Laser processing system capable of quickly positioning mechanical arm to three-dimensional coordinate system
Technical Field
The present invention relates to laser processing, and more particularly, to a laser processing system capable of rapidly positioning a robot to a three-dimensional coordinate system.
Background
The laser processing machine uses laser beam to achieve high focusing through the processing of a lens, and then uses the laser beam to achieve the purposes of processing, material removal, cutting or engraving on a laser processing object. The workpiece is typically placed on a slide. And then the motor system is used for controlling the movement and the rotation of the sliding table, and the sliding table is moved to a position suitable for processing so as to carry out processing operation. Wherein, the computer calculates the processing coordinate and controls the laser processor to process.
However, in many applications, the workpiece is placed on a robot, but because the range of the robot is quite large and the robot is not fixed in its location, when the robot clamps the workpiece, the coordinates of the clamped workpiece have a large error with the coordinates of the laser emitted from the laser galvanometer, and if the error is not corrected, the coordinates calculated by the computer device have an error with the actual machining point of the laser machining machine, so that the final pattern on the workpiece is distorted, and the final machined pattern of the workpiece cannot meet the expected result
Therefore, the present invention is directed to a novel laser processing system capable of positioning a robot arm to a three-dimensional coordinate system, so as to solve the above-mentioned drawbacks of the prior art.
Disclosure of Invention
Therefore, the present invention is directed to solve the above-mentioned problems of the prior art, and an object of the present invention is to provide a laser processing system capable of rapidly positioning a robot arm to a three-dimensional coordinate system, which is capable of rapidly positioning a horizontal position of a test board held by the robot arm, aligning the test board with a coordinate of a processing galvanometer of a laser processing machine in the horizontal position, and determining a focal length and a focus of the processing galvanometer by a photographing focal length determining device. Therefore, when an object is machined, the horizontal position of the test board measured by the invention can be applied, the coordinate of the test board in the horizontal position and the focal length and the focal point of the machining galvanometer are aligned, and the mechanical arm can be quickly adjusted to a required position, so that a workpiece clamped by the mechanical arm in actual work can be accurately machined by laser.
In order to achieve the above object, the present invention provides a laser processing system capable of rapidly positioning a robot arm to a three-dimensional coordinate system, comprising a laser processing machine for emitting a laser beam for processing; each laser processing machine is provided with a processing galvanometer, and the processing galvanometer is used for moving to a required position in the direction of an X, Y, Z axis so as to project laser light to achieve the purpose of processing; the laser processing controller is connected with the laser processing machine; the laser processing controller is used for receiving coordinate data to be processed and controlling a corresponding laser processing machine so as to carry out required processing operation on the workpiece; a correction module, installed below the processing galvanometer of the laser processing machine; wherein the center of the correction module is provided with a hollow hole which is aligned to the lower part of the processing galvanometer, so that the laser emitted by the processing galvanometer can be projected on an object to be processed through the hollow hole; the lower surface of the correction module is provided with three probes which are of telescopic structures; the layout surfaces of the three probes form a two-dimensional plane; when in test, the needle points of the three probes are positioned on the same horizontal plane, and the correction module is also positioned on the horizontal plane; the mechanical arm comprises a clamping piece, and the clamping piece is used for clamping a workpiece when in work so that a processing galvanometer of the laser processing machine can project laser light on the workpiece; during testing, the robot arm uses the clamping member to clamp a test board for determining the horizontal plane; wherein the upper surface of the test board is a flat upper plate; the mechanical arm uses the clamping piece to clamp the test board during testing, and the test board is close to the three probes on the lower surface of the correction module; the three probes will properly retract upward when being pressed by the test board; the angle of the clamping piece of the mechanical arm is adjusted by applying the compression length of each probe, the angle of the clamping piece for clamping the test board is changed, and the test and the angle adjustment are repeated until the compression lengths of the three probes are the same when the three probes are abutted, so that the test board is shown to be on the horizontal plane.
Preferably, each probe is fitted with a sensor for sensing the compressed length of each probe.
Further preferably, the laser processing system further comprises a control processor; the mechanical arm also comprises a clamping position controller, and the clamping position controller is used for adjusting the clamping position of the mechanical arm; the control processor is connected with the sensor of each probe and the clamping position controller of the mechanical arm;
wherein during testing, when the three probes are abutted by the test board, the sensor of each probe senses the compression length of each probe and transmits the compression length of each probe to the control processor; when the compression length of each probe is consistent, the upper flat plate of the test plate is positioned on the horizontal plane;
when the compressed length of each probe is inconsistent, the control processor converts the compressed length into an angle required to be adjusted by the clamping piece of the mechanical arm, and transmits the calculated angle to the clamping position controller, so that the mechanical arm is adjusted to a corresponding clamping position, and the angle for clamping the test board by the clamping piece is changed; then, the mechanical arm uses the clamping piece to clamp the test board, the test board is close to the lower surface of the calibration module, the test and the angle adjustment are repeated until the compression lengths of the three probes are the same when the three probes are abutted, and the test board is shown to be on the horizontal plane.
Preferably, the three probes are located at two ends and corners of an L-shaped path, and the corners of the L-shaped path are right angles.
Preferably, the upper plate of the upper surface of the test board is provided with a two-dimensional groove, and the orientation of the test board is adjusted to enable the three probes to fall into the two-dimensional groove, so that the coordinate of the horizontal plane of the test board is overlapped with the coordinate of the processing galvanometer when the three probes fall into the two-dimensional groove.
Further preferably, the depth of the two-dimensional groove is the same, and when three probes fall into the two-dimensional groove, the X coordinate and the Y coordinate are aligned.
Further preferably, the two-dimensional groove is an L-shaped groove.
Preferably, the laser processing system further comprises a vertical coordinate calibrator in signal communication with the robot arm, the vertical coordinate calibrator being configured to calibrate a vertical coordinate such that the test plate is positioned at a focal point of the laser projection.
Further preferably, the vertical coordinate calibrator includes a focal length determining device for determining a distance between the machining galvanometer and the test board; the camera focal length determining device comprises a camera for shooting the image of the test board, and a comparator connected with the camera, wherein the camera inputs the projected image into the comparator; when the test board clamped by the mechanical arm moves up and down along the laser ejection path, so that the laser illumination range measured by the image input by the camera reaches the minimum, the height of the test board is the position of the focus at the moment, and the distance between the focus and the laser ejection point in the processing galvanometer is calculated to be the focal length.
Preferably, when the operation of aligning the X axis and the Y axis is performed, the coordinates of the test board are aligned with the coordinates of the robot arm, so that the robot arm obtains the coordinate position of the test board; then, the mechanical arm is translated in a non-rotating mode, so that the test board just touches three probes of the correction module at the same time, and a first plane formed by vertexes of the three probes is recorded at the moment; then the test board rotates for an angle along the X axis of the test board, the same operation is carried out, so that the test board just touches three probes of the correction module at the same time, and a second plane formed by the vertexes of the three probes is recorded at the moment; calculating the intersection line of the first plane and the second plane to obtain the X axis of the test board observed at the calibration module; rotating the test plate about its own Y-axis in the same manner to also obtain the Y-axis of the test plate as viewed at the calibration module; so the calibration module obtains the X axis and the Y axis of the test board, and compares the X axis and the Y axis of the test board with the X axis and the Y axis of the calibration module to obtain the coordinate difference of the two; then, the difference is inputted to the robot for compensation or calculated compensation at the program end of the laser processing machine.
Further preferably, the operation of determining the coordinates of the X-axis and the Y-axis and the difference calculation are performed a plurality of times, and the calculated values of the plurality of times are averaged for compensation.
Preferably, the module is located below, in front of, behind, to the left of, or to the right of the machining galvanometer.
Preferably, the calibration module is located below the processing galvanometer, and a hollow is located in the center of the calibration module and aligned with the lower part of the processing galvanometer, so that laser emitted by the processing galvanometer can be projected onto an object to be processed through the hollow.
A further understanding of the nature and advantages of the present invention will become apparent from the following description when read in conjunction with the accompanying drawings.
Drawings
FIG. 1 is a schematic view showing the combination of the main components of the present invention;
FIG. 2 shows a schematic view of the bottom side of FIG. 1;
FIG. 3 is a schematic view of a probe, a sensor, a control processor and a robot according to the present invention;
FIG. 4 is a schematic plan view showing the arrangement of the probe of the present invention;
FIG. 5 is a schematic view of another embodiment of the present invention;
FIG. 6 is a schematic view of a laser processing machine, a vertical coordinate calibration device and a robot according to the present invention;
FIG. 7A is a schematic view of the laser light irradiation range projected on the test board by the laser light according to the present invention;
FIG. 7B is another schematic diagram illustrating the range of laser light irradiation projected by the laser light according to the present invention on the test board;
FIG. 7C is a schematic view of the laser light irradiation range projected on the test board by the laser light according to the present invention;
FIG. 8A is a schematic view showing three probes just before touching the test board in another method for aligning the X-axis and the Y-axis according to the present invention;
FIG. 8B is a schematic view of the test board rotating along its X-axis in another method for aligning the X-axis and the Y-axis according to the present invention;
FIG. 9 is a schematic view of another configuration position of the calibration module according to the present invention.
Description of the reference numerals
10. A laser processing machine; 12. Processing a galvanometer; 15. A correction module; 40. A robot arm;
41. a clamping member; 42. A test board; 44. A probe; 45. A sensor;
48. a clamping position controller; 50, a photographic focal length determining device;
52. a camera; 54. A comparator; 55. A control processor;
60. a laser processing controller; 70, a vertical coordinate calibrator;
100. the laser illumination range; 151. A void; 200. An L-shaped path;
421. an upper flat plate; 422. A two-dimensional trench.
Detailed Description
The invention will now be described in detail with reference to the drawings, wherein like reference numerals designate like elements throughout the several views.
Referring to fig. 1 to 9, a laser processing system for rapidly positioning a robot arm to a three-dimensional coordinate system according to the present invention is shown, which includes the following components:
a laser processing machine 10 for emitting a laser beam for processing, such as marking. In operation, the laser beam emitted by each laser processing machine 10 may be projected onto a workpiece (not shown) to present a pattern processed by the laser beam on the workpiece. Each laser processing machine 10 is provided with a processing galvanometer 12 for moving to a required position in the X, Y, Z axis direction to project laser light for processing.
A laser processing controller 60, the laser processing controller 60 is connected to the laser processing machine 10. The laser processing controller 60 is used for receiving coordinate data to be processed and controlling the corresponding laser processing machine 10 to perform a desired processing operation on the workpiece.
A calibration module 15, the calibration module 15 is installed outside the processing galvanometer 12 of the laser processing machine 10. The laser processing controller 60 stores the relative position relationship between the calibration module 15 and the processing galvanometer 12, and the laser processing controller 60 can convert the relative position relationship into the processing position coordinates of the processing galvanometer 12. The calibration module 15 can be located below, in front of, behind, to the left of, or to the right of the machining galvanometer 12. As shown in fig. 1, when the calibration module 15 is located below the processing galvanometer 12, a hollow 151 is located at the center of the calibration module 15, and the hollow 151 is aligned below the processing galvanometer 12, so that the laser emitted from the processing galvanometer 12 can be projected onto an object to be processed through the hollow 151. When the calibration module 15 is located at the front, rear, left or right of the machining galvanometer 12, the calibration module 15 and the machining galvanometer 12 are located at the same horizontal plane. Fig. 9 shows the calibration module 15 to the right of the machining galvanometer 12.
As shown in fig. 2, three retractable probes 44 are mounted on the lower surface of the calibration module 15, each probe 44 has a sensitivity and is of a retractable structure, the retractable range can be 10mm, and the minimum resolution during the retractable can be 0.001 mm. As shown in fig. 4, the three probes 44 are located at both ends and corners of an L-shaped path 200. Wherein the corners of the L-shaped path 200 are right angles. Each probe 44 is mounted with a sensor 45 for sensing the compressed length of each probe 44.
A robot 40, the robot 40 comprising a holding member 41, wherein the holding member 41 is used for holding a workpiece during operation, so that the processing galvanometer 12 of the laser processing machine 10 can project laser onto the workpiece. During testing, the robot 40 uses the clamping member 41 to clamp a test board 42 for determining the level. Wherein the upper surface of the test board 42 is a relatively flat upper plate 421. After the test plate 42 is used to determine the level, the robot 40 is used to hold a workpiece. As shown in fig. 3, the robot 40 further includes a clamping position controller 48 for adjusting the clamping position of the robot 40.
Before testing, the tips of the probes 44 are adjusted so that the tips of the three probes 44 are located on the same horizontal plane, and the calibration module 15 is also located on the horizontal plane.
A control processor 55 is connected to the sensor 45 of each probe 44 and the grip position controller 48 of the robot 40.
During testing, the robot 40 uses the clamping member 41 to clamp the testing board 42, and the testing board 42 is close to the three probes 44 on the lower surface of the calibration module 15. The three probes 44 are suitably retracted upward by the test plate 42, and the sensor 45 of each probe 44 senses the compressed length of each probe 44 and transmits the compressed length of each probe 44 to the control processor 55.
Since the tips of the three probes 44 are already aligned in the same horizontal plane before testing. Therefore, when the compression length of each probe 44 is consistent, it means that the upper plate 421 of the test board 42 is located on a horizontal plane.
When the compressed length of each probe 44 is not consistent, the control processor 55 converts the compressed length into the angle that needs to be adjusted by the clamping member 41 of the robot 40, and transmits the calculated angle to the clamping position controller 48, so as to adjust the robot 40 to the corresponding clamping position, thereby changing the angle at which the clamping member 41 clamps the test board 42. Then, the robot 40 uses the clamping member 41 to clamp the testing board 42, and the testing board 42 is close to the lower surface of the calibration module 15, and the above-mentioned testing and angle adjustment are repeated until the compression lengths of the three probes 44 are the same when they are abutted, which indicates that the testing board 42 is on the horizontal plane.
As shown in fig. 1, the upper plate 421 of the upper surface of the testing board 42 has a two-dimensional groove 422, and the orientation of the testing board 42 is adjusted such that the coordinates of the horizontal plane of the testing board 42 overlap the coordinates of the machining galvanometer 12 when all of the three probes 44 fall into the two-dimensional groove 422.
Wherein the three probes 44 do not contact the two-dimensional groove 422 when the horizontal plane of the test board 42 is measured, but the horizontal plane is determined by using the plane of the upper plate 421 located outside the two-dimensional groove 422. When the test board 42 is determined to be in the horizontal plane through the above-mentioned tests, the three probes 44 of the calibration module 15 are aligned with the two-dimensional groove 422 by moving the test board 42 by the robot 40 so that two probes 44 of the three probes 44 fall into one side of the two-dimensional groove 422, and slowly moving or rotating the test board 42 by the robot 40 so that the other probe 44 of the three probes 44 falls into the other side of the two-dimensional groove 422. This completes the alignment action. The purpose of this operation is to allow the test plate 42 to not only remain in a horizontal plane, but its horizontal plane coordinates can also overlap the coordinates of the machining galvanometer 12. Preferably, the two-dimensional trenches 422 are all the same depth, so that when three probes 44 are all dropped into the two-dimensional trench 422, they are aligned with the X and Y coordinates.
The two-dimensional trench 422 in this embodiment is an L-shaped trench, but is not limited to this type, and any type of two-dimensional trench 422 may be used, and the position of the probe is set to correspond to the two-dimensional trench 422, so as to achieve the purpose of aligning the X coordinate and the Y coordinate.
As shown in fig. 8A and 8B, another operation for aligning the X axis and the Y axis is proposed in the present application, in which the coordinates of the test board 42 are aligned with the coordinates of the robot 40, so that the robot 40 can obtain the coordinate position of the test board 42. Then, the robot 40 is translated in a non-rotating manner, so that the test board 42 just touches the three probes 44 of the calibration module 15 at the same time (as shown in fig. 8A), and a first plane formed by the vertexes of the three probes 44 is recorded; the test plate 42 is then rotated through an angle along its X-axis (as shown in fig. 8B) and the same operation is performed such that the test plate 42 just touches the three probes 44 of the calibration module 15 at the same time, and the second plane formed by the apexes of the three probes 44 is recorded. Calculating the intersection of the first plane and the second plane to obtain the X-axis of the test board 42 observed at the calibration module 15; by rotating the test plate 42 about its own Y-axis in the same manner, the Y-axis of the test plate 42 as viewed at the calibration module 15 can also be obtained. Therefore, the calibration module 15 can obtain the X-axis and Y-axis of the test board 42, and the X-axis and Y-axis of the test board 42 can be compared with the X-axis and Y-axis of the calibration module 15 to obtain the coordinate difference between the two. The difference is then input to the robot 40 for compensation or computational compensation at the programming end of the laser 10. For the sake of accuracy, the method of calculating the compensation value may perform the operation of determining the coordinates of the X-axis and the Y-axis and the difference calculation for a plurality of times, and average the calculated values for compensation.
As shown in fig. 5, a vertical coordinate calibrator 70 is further included, the vertical coordinate calibrator 70 is in signal connection with the robot 40 for calibrating the vertical coordinate, so that the test board can be located at the focus of the laser projection. After determining the horizontal plane and the horizontal plane coordinates of the test board 42, the vertical coordinate calibrator 70 memorizes the positioning of the robot 40 at this position and corrects the vertical coordinate so that the test board 42 can be located at the focus of the laser projection for achieving the best projection effect.
As shown in fig. 6, the vertical coordinate calibration device 70 includes a focus distance determining device 50 for determining the distance between the machining galvanometer 12 and the test board 42. The device 50 includes a camera 52 for capturing an image of the test board 42, and a comparator 54 connected to the camera 52, wherein the camera 52 inputs the projected image into the comparator 54.
The focus is determined by moving the test board 42 held by the robot 40 up and down along the laser emitting path to stay at different positions, then the processing galvanometer 12 projects laser light onto the test board 42, and by moving the test board 42 up and down along the laser emitting path, the camera 52 is used to capture images of the test board 42 at different positions, and the images are inputted into the comparator 54. The comparator 54 calculates the laser illumination range 100 of the laser projected on the test board 42 in the image. Fig. 7A to 7C show the laser irradiation range 100 projected by the laser on the test board 42 at different height positions. As shown in fig. 7C, when the illumination range 100 of the projected laser reaches the minimum, the height of the test board 42 is the position of the focal point, and the distance between the focal point and the laser emitting point in the processing galvanometer 12 is calculated as the focal length. The workpiece can therefore be placed at this height for the best machining effect when actually performing laser machining operations.
The device has the advantages that the horizontal direction of the test board clamped by the mechanical arm can be quickly positioned, the test board can be aligned to the coordinate of the processing galvanometer of the laser processing machine in the horizontal direction, and the focal length and the focus of the processing galvanometer are determined by the shooting focal length determining device. Therefore, when an object is machined, the horizontal position of the test board measured by the scheme can be applied, the coordinate of the test board in the horizontal position can be aligned, and the focal length and the focal point of the machining galvanometer can be adjusted to the required position very quickly, so that a workpiece clamped by the mechanical arm can be precisely machined by laser during actual work.
It should be apparent that the described embodiments are only some of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be obtained by a person skilled in the art without making any creative effort based on the embodiments in the present invention, belong to the protection scope of the present invention.

Claims (13)

1. A laser machining system for rapidly positioning a robotic arm to a three-dimensional coordinate system, comprising:
a laser processing machine, which is used for emitting laser beams to process; wherein each laser processing machine is provided with a processing galvanometer which is used for moving to a required position in the direction of X, Y, Z axis so as to project laser;
the laser processing controller is connected with the laser processing machine; the laser processing controller is used for receiving coordinate data to be processed and controlling a corresponding laser processing machine so as to carry out required processing operation on the workpiece;
the correction module is arranged outside the processing galvanometer of the laser processing machine; the laser processing controller stores the relative position relation between the correction module and the processing galvanometer and can convert the relative position relation into the processing position coordinate of the processing galvanometer; the lower surface of the correction module is provided with three probes which are telescopic structures; the layout surfaces of the three probes form a two-dimensional plane; during testing, the needle points of the three probes are positioned on the same horizontal plane, and the correction module is also positioned on the horizontal plane;
the mechanical arm comprises a clamping piece, the clamping piece is used for clamping a workpiece, and a processing galvanometer of the laser processing machine can project laser on the workpiece; during testing, the robot uses the clamping member to clamp a testing board for determining the horizontal plane; wherein the upper surface of the test board is a flat upper plate; and
when in test, the mechanical arm uses the clamping piece to clamp the test board, and the test board is close to the three probes on the lower surface of the correction module; the three probes are pressed by the test board and contract upwards; the angle of the clamping piece of the mechanical arm is adjusted by applying the compression length of each probe, the angle of the clamping piece for clamping the test board is changed, and the test and the angle adjustment are repeated until the compression lengths of the three probes are the same when the three probes are abutted, so that the test board is shown to be on the horizontal plane.
2. The laser machining system for rapidly positioning a robot to a three-dimensional coordinate system as claimed in claim 1, wherein each of the probes is mounted with a sensor for sensing a compressed length of each of the probes.
3. The laser machining system for rapidly positioning a robot to a three-dimensional coordinate system as claimed in claim 2, wherein the laser machining system further comprises a control processor; the mechanical arm also comprises a clamping position controller, and the clamping position controller is used for adjusting the clamping position of the mechanical arm; the control processor is connected with the sensor of each probe and the clamping position controller of the mechanical arm;
wherein during testing, when the three probes are abutted by the test board, the sensor of each probe senses the compression length of each probe and transmits the compression length of each probe to the control processor; when the compression length of each probe is consistent, the upper flat plate of the test plate is positioned on the horizontal plane;
when the compressed lengths of the probes are not consistent, the control processor converts the compressed lengths into angles required to be adjusted by the clamping piece of the mechanical arm, and transmits the calculated angles to the clamping position controller, so that the mechanical arm is adjusted to a corresponding clamping position, and the angle of the clamping piece for clamping the test board is changed; then, the robot arm uses the clamping member to clamp the test board, and the test board is close to the lower surface of the calibration module, and the above-mentioned testing and angle adjustment are repeated until the compression lengths of the three probes are the same when the three probes are abutted, which indicates that the test board is on the horizontal plane.
4. The system of claim 1, wherein the three probes are located at two ends and at a corner of an L-shaped path, the corner of the L-shaped path being a right angle.
5. The system of claim 1, wherein the upper plate of the upper surface of the test board has a two-dimensional groove, and the three probes are oriented such that the three probes all fall into the two-dimensional groove to indicate that the coordinates of the horizontal plane of the test board overlap the coordinates of the processing galvanometer.
6. The laser machining system of claim 5, wherein the two-dimensional grooves are all the same depth, and when three probes fall into the two-dimensional grooves, it indicates that the X and Y coordinates are aligned.
7. The laser machining system for rapidly positioning a robot to a three-dimensional coordinate system as claimed in claim 5, wherein the two-dimensional groove is an L-shaped groove.
8. The laser machining system of claim 1 further comprising a vertical coordinate aligner in signal communication with the robot, the vertical coordinate aligner for aligning vertical coordinates such that the test plate is in focus of the laser projection.
9. The laser machining system of claim 8, wherein the vertical coordinate aligner includes a focus determining device for determining a distance between the machining galvanometer and the test plate; the camera focal length determining device comprises a camera and a comparator, wherein the camera is used for shooting the image of the test board, the comparator is connected with the camera, and the camera inputs the projected image into the comparator; when the test board clamped by the mechanical arm moves up and down along the laser ejection path, so that the laser illumination range measured by the image input by the camera reaches the minimum, the height of the test board is the position of the focus at the moment, and the distance between the focus and the laser ejection point in the processing galvanometer is calculated to be the focal length.
10. The laser machining system of claim 1, wherein the robot arm is configured to align the coordinate of the test board with the coordinate of the robot arm during the alignment of the X-axis and the Y-axis, such that the robot arm obtains the coordinate position of the test board; then, the mechanical arm is translated in a non-rotating mode, so that the test board just touches three probes of the correction module at the same time, and a first plane formed by the vertexes of the three probes is recorded; then the test board rotates an angle along the X axis of the test board, the same operation is carried out, so that the test board just touches three probes of the correction module at the same time, and a second plane formed by the vertexes of the three probes is recorded; calculating the intersection line of the first plane and the second plane to obtain the X axis of the test board observed at the calibration module; rotating the test plate about its own Y-axis in the same manner, also resulting in the Y-axis of the test plate as viewed at the calibration module; so the calibration module obtains the X axis and the Y axis of the test board, and compares the X axis and the Y axis of the test board with the X axis and the Y axis of the calibration module to obtain the coordinate difference of the two; then, the difference is inputted to the robot for compensation or calculated compensation at the program end of the laser processing machine.
11. The laser machining system of claim 10, wherein the operations of determining the coordinates of the X-axis and the Y-axis and the difference calculation are performed a plurality of times, and the plurality of times of calculation are averaged to compensate.
12. The system of claim 1, wherein the module is located below, in front of, behind, to the left of, or to the right of the machining galvanometer.
13. The system of claim 1, wherein the calibration module is located below the machining galvanometer, and the calibration module has a hollow at a center thereof, the hollow being aligned below the machining galvanometer such that the laser emitted by the machining galvanometer can be projected onto the object to be machined through the hollow.
CN202110188514.4A 2021-02-19 2021-02-19 Laser processing system capable of quickly positioning mechanical arm to three-dimensional coordinate system Pending CN114952043A (en)

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