CN114951967A - Ultrafast laser-based micro-through hole machining method and system - Google Patents
Ultrafast laser-based micro-through hole machining method and system Download PDFInfo
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- CN114951967A CN114951967A CN202110189586.0A CN202110189586A CN114951967A CN 114951967 A CN114951967 A CN 114951967A CN 202110189586 A CN202110189586 A CN 202110189586A CN 114951967 A CN114951967 A CN 114951967A
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- 238000000034 method Methods 0.000 title claims abstract description 65
- 238000003754 machining Methods 0.000 title claims description 83
- 238000012545 processing Methods 0.000 claims abstract description 444
- 238000005553 drilling Methods 0.000 claims abstract description 118
- 230000008569 process Effects 0.000 claims abstract description 53
- 238000003672 processing method Methods 0.000 claims abstract description 17
- 238000011065 in-situ storage Methods 0.000 claims abstract description 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 41
- 229910052802 copper Inorganic materials 0.000 claims description 41
- 239000010949 copper Substances 0.000 claims description 41
- 239000010410 layer Substances 0.000 claims description 31
- 238000007493 shaping process Methods 0.000 claims description 23
- 239000003365 glass fiber Substances 0.000 claims description 20
- 239000012790 adhesive layer Substances 0.000 claims description 14
- 230000003287 optical effect Effects 0.000 claims description 14
- 241001074085 Scophthalmus aquosus Species 0.000 claims description 6
- 239000003292 glue Substances 0.000 claims description 6
- 239000011521 glass Substances 0.000 claims description 4
- 238000009826 distribution Methods 0.000 claims description 3
- 235000019994 cava Nutrition 0.000 claims description 2
- 238000009713 electroplating Methods 0.000 abstract description 13
- 239000011148 porous material Substances 0.000 abstract 1
- 230000000694 effects Effects 0.000 description 17
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
- B23K26/384—Removing material by boring or cutting by boring of specially shaped holes
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0626—Energy control of the laser beam
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/073—Shaping the laser spot
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
- B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
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- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
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- Laser Beam Processing (AREA)
Abstract
The invention discloses a micro-through hole processing method and a system based on ultrafast laser, wherein the micro-through hole processing method based on ultrafast laser is characterized in that after a first processing area is positioned, an ultrafast laser is controlled to process a first rough drilling micro-blind hole in the first processing area according to rough drilling parameters; then, continuously processing the first rough drilling micro blind hole according to the fine drilling parameters to obtain a first fine drilling micro blind hole; then carrying out horizontal mirror image processing on the front processed document to obtain a back processed document; turning the plate to be processed on the motion control platform in situ, and positioning and aligning the reverse side processing area to a second processing area; processing a first rough drilling micro through hole at a position, opposite to the first fine drilling micro blind hole, on the second processing area according to rough drilling parameters; and then, continuously processing the first rough drilling micro through hole according to the fine drilling parameters to obtain a first waist-shaped micro through hole. The invention ensures the processing precision of front and back surfaces, obtains the waist-shaped micro through holes with the same front and back pore diameters, and improves the electroplating quality and efficiency.
Description
Technical Field
The invention relates to the field of laser processing, in particular to a method and a system for processing a micro through hole based on ultrafast laser.
Background
With the development of communication technology and the application of the internet of things, people have greatly improved the speed and efficiency requirements of information exchange, and therefore, the high-density interconnection of circuit boards becomes a new application direction, so that higher requirements are provided for the reduction of the hole diameter of a laser processing drill hole and the reduction of the hole distance. In the prior art, laser processing drilling has created a bottleneck, for example, for laser processing through holes, the through holes after laser processing drilling in the prior art often have the following problems: in the prior art, the through hole capable of being processed by laser is usually more than 100 microns, and the processing speed is slow, so that the processing efficiency is low; meanwhile, the laser processing quality of the through hole is poor, the phenomena of copper sputtering on the surface, glass fiber molten balls and glass fibers on the hole wall, residual glue at the hole bottom, side corrosion at the bottom, copper suspension at the hole opening, stripping and the like generally exist, and the problem of heat effect also exists; in addition, the problem that a front hole is large and a back hole is small is also easy to occur in the laser processing of the through hole in the prior art, and after the through hole is processed, when the front and the back of a plate are simultaneously electroplated, electroplating liquid is easy to influence the electroplating quality due to the existence of bubbles when flowing into the through hole, so the electroplating effect is poor, and the electroplating efficiency is low.
Disclosure of Invention
Therefore, it is necessary to provide a method and a system for processing a micro through hole based on ultrafast laser to solve the problems of inconsistent aperture of the front and back sides of the through hole, poor plating effect and low plating efficiency of a plate after the through hole is processed.
A micro-via processing method based on ultrafast laser comprises the following steps:
acquiring a front side processing document and processing parameters, wherein the front side processing document comprises a front side processing area; the machining parameters comprise rough drilling parameters and fine drilling parameters;
controlling a motion control platform provided with a plate to be processed to move until the front processing area is positioned and aligned to a first processing area of the plate to be processed;
controlling an ultrafast laser to emit pulse laser beams according to the rough drilling parameters, and focusing the laser beams to a first machining area after the laser beams are processed through an outer optical path so as to machine a first rough drilling micro blind hole in the first machining area;
controlling an ultrafast laser to emit a pulse type laser beam according to the fine drilling parameters so as to continuously process the first rough drilling micro blind hole to obtain a first fine drilling micro blind hole;
acquiring a back side processed document after the front side processed document is subjected to horizontal mirror image processing, wherein the back side processed document comprises a back side processed area which is arranged in a mirror image mode with the front side processed area;
after the plate to be processed is turned over on the motion control platform in situ through the mechanical arm, the motion control platform is controlled to move until the reverse side processing area is positioned and aligned to a second processing area which is arranged on the plate to be processed and is opposite to the first processing area;
controlling an ultrafast laser to emit pulse type laser beams according to the rough drilling parameters, and focusing the laser beams to a second processing area after the laser beams are processed by an external optical path so as to process a first rough drilling micro through hole on the second processing area at a position opposite to the first fine drilling micro blind hole;
and controlling an ultrafast laser to emit pulse laser beams according to the fine drilling parameters so as to continuously process the first rough drilling micro through hole and obtain a first waist-shaped micro through hole.
A micro-through hole processing system based on ultrafast laser comprises an ultrafast laser, a power adjusting assembly, a shaping assembly, a light splitting assembly, a beam expanding assembly, a galvanometer assembly and a control module, wherein the control module is connected with the ultrafast laser, the power adjusting assembly, the shaping assembly, the light splitting assembly, the beam expanding assembly and the galvanometer assembly; the control module is used for executing the ultrafast laser-based micro through hole machining method.
According to the method and the system for processing the micro-through hole based on the ultrafast laser, after a first processing area of a plate to be processed, which corresponds to the front processing area, is positioned, the ultrafast laser is controlled to process a first rough drilling micro-blind hole in the first processing area according to rough drilling parameters; then, controlling the ultrafast laser to continuously process the first rough-drilled micro blind hole according to the fine drilling parameters to obtain a first fine-drilled micro blind hole; then, carrying out horizontal mirror image processing on the front processed document to obtain a back processed document; turning the plate to be processed on the motion control platform in situ through a mechanical arm, and positioning and aligning the reverse side processing area to a second processing area on the plate to be processed; controlling the ultrafast laser to process a first rough drilling micro through hole at a position, opposite to the first fine drilling micro blind hole, on the second processing area according to rough drilling parameters; and controlling the ultrafast laser to continuously process the first rough drilling micro through hole according to the fine drilling parameters to obtain a first waist-shaped micro through hole.
In the invention, the front and back surfaces of the same waist-shaped micro-through hole (a first waist-shaped micro-through hole or a second waist-shaped micro-through hole, etc.) are respectively subjected to rough drilling and fine drilling through rough drilling parameters and fine drilling parameters, so that in the process of processing the same surface (the front surface or the back surface), firstly, the whole processing process of the same surface can be finished on the basis of one-time scanning alignment and focusing (in the whole single-surface processing process, the focus position and the processing point after focusing do not need to be moved or adjusted), secondly, the rough processing and the fine processing are respectively finished through laser beams with different powers (the rough drilling parameters and the fine drilling parameters respectively correspond to different powers), and in the fine processing process, the rough drilling micro-blind hole obtained by rough processing is further improved in effect and modified, so that the fine drilling micro-blind hole processing effect is better, and position precision errors caused by secondary repeated alignment do not exist in the rough processing and the fine processing processes, therefore, the processing roundness is ensured, and the overall alignment precision of the equipment is improved); the two guarantee conditions exist simultaneously, so that the finally obtained fine drilling micro blind hole or waist-shaped micro through hole does not have the phenomena of obvious copper splashing on the surface, glass fiber molten balls on the hole wall, glass fiber protrusion, hole bottom adhesive residue and bottom side corrosion, hole opening copper suspension, stripping and the like, has a good hole opening effect, and simultaneously has smaller heat effect. Meanwhile, when the front side and the back side are respectively processed, the processing document of the back side is determined in a horizontal mirror image processing mode, and the mechanical arm overturns the plate to be processed in situ without moving the original position of the plate to be processed, so that the processing precision of front side and back side processing is ensured; in addition, in the whole processing process of the front surface or the back surface, the processing can be finished on the basis of one-time scanning alignment and focusing, the speed of processing the micro blind holes or the waist-shaped micro through holes is greatly increased, and the processing precision is further ensured. In addition, the waist-shaped micro through hole with the same front and back hole diameters can be obtained on the front and back surfaces of the plate to be processed, and the waist-shaped micro through hole can effectively avoid the problem that the front surface hole is large and the back surface hole is small when a conventional laser drilling through hole is formed; meanwhile, the specific waist diameter of the waist-shaped micro through hole can provide better adhesive force for subsequent electroplating of the plate to be processed, and bubbles generated when electroplating liquid flows in can be avoided when the front side and the back side are simultaneously electroplated, so that the electroplating quality is influenced due to the bubbles, and the electroplating efficiency is improved.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the description of the embodiments of the present invention will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without inventive labor.
Fig. 1 is a schematic flow chart of a method for processing a micro via based on ultrafast laser according to an embodiment of the present invention.
Fig. 2 is a flowchart illustrating step S30 of the ultrafast laser-based micro via processing method according to an embodiment of the present invention.
Fig. 3 is a block diagram of an ultrafast laser based micro via processing system in accordance with an embodiment of the present invention.
Fig. 4 is a schematic diagram illustrating a comparison between a front side processed document and a back side processed document in the ultrafast laser based micro via hole processing method according to an embodiment of the present invention.
The reference numerals in the specification are as follows:
1. an ultrafast laser; 2. a power conditioning assembly; 3. a shaping component; 4. a light splitting component; 5. a beam expanding assembly; 6. a galvanometer component; 61. a galvanometer; 62. a focusing mirror.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the embodiment, as shown in fig. 1, the method for processing a micro via based on ultrafast laser includes the following steps:
s10, acquiring a front-side processing document A (shown in FIG. 4) and processing parameters, wherein the front-side processing document A comprises a front-side processing area a; the machining parameters include, but are not limited to, a hole diameter to be machined, a rough drilling parameter, a fine drilling parameter, a preset moving path mentioned later and the like; wherein the rough drilling parameters include, but are not limited to, a first machining power and a first machining duration; the fine drilling parameters comprise a second machining power and a second machining time; the first processing power is smaller than the second processing power, and the second processing time is longer than the first processing time.
S20, controlling the motion control platform provided with the plate to be processed to move until the front processing area a is positioned and aligned to the first processing area of the plate to be processed;
in one embodiment, the plate to be processed comprises a first surface copper layer, a glass fiber adhesive layer and a second surface copper layer which are sequentially connected; first thick brill blind hole that declines with first thin brill blind hole that declines all caves in and forms on first table copper layer and the fine glue film of glass, just first thick brill micro through hole with first waist type micro through hole pierces through first table copper layer, the fine glue film of glass and second table copper layer.
In the invention, as shown in fig. 3, the ultrafast laser-based micro-via processing system comprises an ultrafast laser 1, a power adjusting component 2, a shaping component 3, a light splitting component 4, a beam expanding component 5, a galvanometer component 6 and a frame with a movable motion control platform; at least two processing shafts are arranged on the frame, and each processing shaft is provided with a beam expanding assembly 5 and a galvanometer assembly 6 (the galvanometer assembly 6 comprises a galvanometer 61 for swinging the split light beams to scan and align and a focusing lens 62 for focusing the split light beams on processing points); the ultrafast laser 1, the power adjusting assembly 2, the shaping assembly 3 and the light splitting assembly 4 are all installed on the frame, and light splitting beams split by the light splitting assembly 4 are injected into the beam expanding assemblies 5 in a one-to-one correspondence mode. The plate to be processed is arranged on the motion control platform; the alignment of the front-side processing region a with the first processing region can also be substantially completed by controlling the movement of the motion control platform on the machine frame until the processing axes are aligned with the first processing region, so that the laser spots after the split beams are finally focused by the focusing lenses 62 on the processing axes can be irradiated on the first processing points in a one-to-one correspondence.
S30, controlling an ultrafast laser to emit pulse laser beams according to the rough drilling parameters, and focusing the laser beams to a first processing area after the laser beams are subjected to optical path processing through an external optical path so as to process a first rough drilling micro blind hole in the first processing area; optionally, the ultrafast laser is a picosecond green laser, and a wavelength of a laser beam emitted by the ultrafast laser is 515nm or 532 nm.
In one embodiment, the processing parameters further include a to-be-processed aperture, and preferably, the to-be-processed aperture is 20-60 μm. That is, in the present invention, the aperture of the waist-shaped micro-via (the first waist-shaped micro-via and the second waist-shaped micro-via) that can be finally processed is equal to the aperture to be processed, and the aperture of the fine-drilled micro-blind hole (the first fine-drilled micro-blind hole) is also equal to the aperture to be processed after processing on a single side (for example, after the front side is processed first). Understandably, in the present invention, after the start of the machining, first in step S30, the ultrafast laser 1 is emitted a laser beam having a first machining power by a control module of the ultrafast laser-based micro via machining system in preparation for entering the rough machining stage of the front surface.
Furthermore, the outer optical path comprises a shaping component, a light splitting component, a power adjusting component, a beam expanding component and a galvanometer component; alternatively, as shown in fig. 2, the step S30 includes:
s301, controlling an ultrafast laser to emit a pulse laser beam with Gaussian distribution of the first processing power; in the invention, the rough drilling parameters comprise a first machining power and a first machining time length; the short pulse laser beam with high power density can transmit great energy larger than the ablation energy width of the material to the plate to be processed in a short time, so that the processing points (hereinafter, a first processing point, a second processing point, a third processing point, a fourth processing point and the like) of the plate to be processed are melted and evaporated, meanwhile, the volume of the material in the hole is expanded sharply in the evaporation process, great vapor pressure is generated, the melted workpiece material can be pushed out of the hole, and the processing time (the first processing time, the second processing time and the like) of the focusing point determines the number of laser pulses received by the processing point on the surface of the plate to be processed, wherein the more pulses are accumulated, the more energy is accumulated, and the more material is melted and evaporated. Optionally, the plate to be processed comprises a first copper surface layer, a glass fiber adhesive layer and a second copper surface layer which are connected in sequence. The fine drilling of the micro blind holes (including the first fine drilling micro blind hole, the second fine drilling micro blind hole and the like in the following text) only needs to be formed on one of the surface copper layers (the first surface copper layer or the second surface copper layer) and the glass fiber adhesive layer.
S302, controlling a shaping component to shape the laser beam into a flat-top-like laser beam; in the invention, after a shaping component is arranged in an outer light path, after the laser beam is shaped into a flat-top-like laser beam, the laser beam is focused again, so that the energy distribution of the focused light spot is uniformly processed to form the flat-top-like laser beam with uniform energy and steep boundary, the bottom of the micro blind hole is more uniform, the laser processing threshold is widened, and the risk of ablating the bottom copper layer due to the overhigh central energy of the laser focused light spot is avoided.
S303, controlling a light splitting component to perform light splitting processing on the flattop-like laser beam, splitting the laser beam into at least two light splitting beams, and controlling the output power of the at least two light splitting beams to be equal through a power adjusting component; in the invention, the laser beam needs to be split, the laser beam is split into at least two (for example, two, three, four, etc.) split beams, and the power of each split beam is adjusted and balanced by the power adjusting assembly, that is, the output power (energy) of each split beam is equal, so that the plurality of first fine-drilled micro blind holes obtained by laser processing have the same size, depth, etc. Referring to fig. 3, after the beam splitting process is performed by the beam splitting assembly 4 in fig. 3, the laser beam is split into two split beams having equal energy. The split light beams of the light splitting assembly 4 are incident into the beam expanding assemblies 5 in a one-to-one correspondence manner.
The power adjusting component can be a slide motor which can carry out balance adjustment on the output power of the laser beam. Such as: when the first processing power is 20W, the splitting assembly splits the laser beam with the flat top into one 9W split beam and one 11W split beam (two split beams in total), and at this time, the power adjustment assembly needs to adjust and balance the power of the two split beams, so that the two split beams with the power of 10W are changed into two split beams.
S304, acquiring the beam diameter corresponding to the aperture to be processed, and controlling a beam expanding assembly to adjust the diameters of at least two split beams to be the beam diameter; understandably, after the light splitting, the light splitting beam is further required to be subjected to beam expanding or beam shrinking treatment (the treatment mode is determined to be beam expanding or beam shrinking according to the aperture requirement), so that the light splitting beam after final adjustment corresponds to the aperture to be processed which is finally required to be obtained, and a fine drilled micro blind hole (for example, a first fine drilled micro blind hole) with the aperture equal to the aperture to be processed is finally processed.
S305, focusing the adjusted at least two split light beams to at least two first processing points arranged on a first processing area at intervals through a galvanometer component, so as to obtain at least two first rough drilling micro blind holes after rough machining for a first machining duration is carried out on the positions corresponding to the at least two first processing points through the at least two split light beams corresponding to a first machining power. Understandably, the first rough drilling micro blind hole is concavely formed on the first surface copper layer and the glass fiber adhesive layer. Understandably, a plurality of first rough drilling micro blind holes after rough machining are arranged at intervals, the spacing distance can be preset, the spacing distance can be adjusted by aligning the machining shaft and the motion control platform, and the further adjustment can be carried out by the vibrating mirror assembly. In the present invention, the galvanometer assembly 6 includes a galvanometer 61 for performing split beam oscillation for scanning alignment and a focusing mirror 62 for focusing the split beam on a processing point.
S40, controlling an ultrafast laser to emit pulse laser beams according to the fine drilling parameters to continuously process the first rough-drilled micro blind hole to obtain a first fine-drilled micro blind hole; the fine drilling parameters comprise a second machining power and a second machining time length; the first processing power is smaller than the second processing power, and the second processing time is longer than the first processing time; optionally, the step S40 includes:
adjusting the output power of the laser beam emitted by an ultrafast laser from the first processing power to the second processing power; understandably, the adjustment of the output power of the laser beam emitted by the ultrafast laser from the first processing power to the second processing power represents the entering of a fine processing stage of the front side. The laser beam with the second processing power passes through the same outer light path as the laser beam with the first processing power, sequentially passes through the shaping component 3, the light splitting component 4, the beam expanding component 5, the galvanometer component 6 and the like, and then starts to irradiate the same first processing point of the first processing area for fine processing.
And performing second processing time-length fine processing on the at least two first rough drilling micro blind holes through at least two beams of the light splitting beams corresponding to second processing power to obtain at least two first fine drilling micro blind holes, wherein the aperture of each first fine drilling micro blind hole is equal to the aperture to be processed. Understandably, in the process that the laser beam with the second processing power passes through the outer light path, the shaping component 3, the beam splitting component 4, the beam expanding component 5, the galvanometer component 6 and the like are not moved or adjusted at all, that is, in the whole process of processing the first fine drilling micro blind hole of the first processing point on the front surface of the plate to be processed, the galvanometer component 6 only carries out scanning alignment and focusing once before rough processing, the secondary scanning contraposition and focusing are not carried out in the fine processing stage, therefore, the first processing power laser beam corresponding to the rough processing stage and the second processing power laser beam corresponding to the fine processing stage, the light beams are irradiated to the same first processing point through the same external light path which is not moved at all, so that position precision errors caused by secondary repeated alignment do not exist in the rough processing and the fine processing, and the processing roundness is ensured. In one embodiment, the first fine drilled blind via recess is formed on the first surface copper layer and the glass fiber adhesive layer.
In the front processing process of the plate to be processed, the laser power used in the processing stage of roughly processing the first rough drilled micro blind hole is high (first processing power), and the light emergent time in the processing process is short (first processing time length); on the contrary, the laser power used in the fine processing stage is small (second processing power), and the light extraction time in the processing process is long (second processing time); in this way, the first copper surface layer can be broken through the relatively high-power laser beam in the rough machining stage, the aperture size meeting the basic requirement is punched, and the first rough-drilled micro blind hole conforming to the basic hole pattern is obtained; furthermore, the hole pattern is further perfected on the basis of the first rough drilling micro blind hole of rough machining through the laser beam with relatively low power and light emitting time in the fine machining stage to obtain the first fine drilling micro blind hole, and the bottom aperture and the top aperture ratio of the first fine drilling micro blind hole meet the preset aperture requirement (in the fine machining process, the first rough drilling micro blind hole obtained by rough machining is further perfected in effect and modified, so that the machining effect of the micro blind hole is better, and in the whole front machining process, the position precision error caused by secondary repeated alignment does not exist in the rough machining and the fine machining process, so the machining roundness (effect) is ensured, and the overall alignment precision of the equipment is improved.
Preferably, in the present invention, the ratio of the bottom aperture of the first fine-drilled blind via located on the glass fiber adhesive layer to the top aperture located on the top surface of the first surface copper layer is 0.8. In one embodiment, the first processing power is 10-30 w; the second processing power is 7-20 w. Further, the first processing time is 30-100 mu s, and the second processing time is 60-150 mu s. Under the conditions of the power and the duration, the first fine-drilled micro blind hole with the aperture of 20-60 mu m can be finally obtained.
Further, the preferred configuration values of the above parameters can be obtained by practical operations as follows (in case the first skin layer is bright copper with a thickness of 1.5 μm, the overall thickness of the fiberglass glue layer is 50 μm, and the machined thickness of the first fine-drilled blind micro-vias of the front side is 25 μm):
when the aperture to be processed is 20 mu m, the first processing power is 12W, and the first processing time is 30 mu s; the second processing power is 8W; the second processing time is 60 mu s;
when the aperture to be processed is 30 mu m, the first processing power is 16W, and the first processing time is 50 mu s; the second processing power is 12W; the second processing time is 90 mus;
when the aperture to be processed is 40 mu m, the first processing power is 18W, and the first processing time is 70 mu s; the second processing power is 14W; the second processing time is 110 mus;
when the aperture to be processed is 50 mu m, the first processing power is 20W, and the first processing time is 80 mu s; the second processing power is 15W; the second processing time is 120 mu s;
when the aperture to be processed is 60 mu m, the first processing power is 22W, and the first processing time is 100 mu s; the second processing power is 16W; the second processing time period was 140 mus.
S50, acquiring a reverse side processed document B after the horizontal mirror image processing is carried out on the front side processed document A, wherein the reverse side processed document B comprises a reverse side processed region B which is arranged in a mirror image mode with the front side processed region a; that is, in the present embodiment, as shown in fig. 4, the front processing area a and the back processing area b are arranged in a mirror image, and the front processing area a corresponds to a first processing area of the front side of the plate material to be processed, and the back processing area b corresponds to a second processing area of the plate material to be processed.
S60, after the plate to be processed is turned over on site on the motion control platform through the manipulator, the motion control platform is controlled to move until the reverse side processing area b is positioned and aligned to a second processing area which is arranged on the plate to be processed and is opposite to the first processing area; the mechanical arm is in communication connection with the control module, is controlled by the control module and is used for overturning a plate to be processed which is arranged on the motion control platform, and after the plate to be processed is overturned on the motion control platform in situ, target holes (generally 4 target holes arranged at four corners of the plate to be processed) are arranged on the plate to be processed, the designed positions of the target holes have certain preset expansion and contraction values, CCD (charge coupled device) target grabbing can be carried out according to the expansion and contraction values to ensure the precision of target grabbing, and further the precise positioning when the motion control platform is controlled to move to the reverse side processing area b for positioning and the first processing area for aligning is ensured.
S70, controlling an ultrafast laser to emit pulse laser beams according to the rough drilling parameters, and focusing the laser beams to a second processing area after the laser beams are subjected to optical path processing through an external optical path so as to process a first rough drilling micro through hole on the second processing area at a position opposite to the first fine drilling micro blind hole; in one embodiment, the step S70 includes:
adjusting the output power of the laser beam emitted by an ultrafast laser from the second processing power to the first processing power; understandably, in step S60, after the in-situ turning and alignment are completed, the control module of the ultrafast laser-based micro via processing system controls the ultrafast laser to emit the laser beam again, and adjusts the laser beam emitted by the ultrafast laser 1 from the second processing power to the first processing power again, which indicates that the rough processing stage of the reverse side of the board to be processed has been started.
Focusing the adjusted at least two split beams onto at least two second processing points arranged on a second processing area at intervals through a galvanometer component, so as to obtain at least two first rough drilling micro-through holes after rough machining is carried out on the at least two split beams corresponding to the first processing power for the first processing time at positions corresponding to the at least two second processing points; the second processing point is arranged opposite to the first processing point. Understandably, the first rough drilling micro through hole penetrates through the first surface copper layer, the glass fiber adhesive layer and the second surface copper layer. Understandably, the first rough-drilled micro-via after rough machining is obtained by penetrating (irradiating by laser with first machining power) the original first fine-drilled micro-blind via from the second machining point of the back surface (the first machining point of the front surface is opposite to the second machining point of the back surface).
And S80, controlling the ultrafast laser to emit pulse laser beams according to the fine drilling parameters to continuously process the first rough drilling micro through hole to obtain a first waist-shaped micro through hole. In one embodiment, the step S80 includes:
adjusting the output power of the laser beam emitted by an ultrafast laser from the first processing power to the second processing power; understandably, the fine processing stage of the reverse side is entered after the output power of the laser beam emitted by the ultrafast laser is adjusted again from the first processing power to the second processing power. The laser beam with the second processing power passes through the same outer light path as the laser beam with the first processing power, sequentially passes through the shaping component 3, the light splitting component 4, the beam expanding component 5, the galvanometer component 6 and the like, and then starts to irradiate to a second processing point in the same second processing area for fine processing.
And performing second processing time-length fine processing on the at least two first rough drilling micro-through holes through at least two beams of the light splitting beams corresponding to second processing power to obtain at least two first waist-shaped micro-through holes, wherein the aperture of each first waist-shaped micro-through hole is equal to the aperture to be processed. Understandably, in the process that the laser beam with the second processing power passes through the outer light path, the shaping component 3, the beam splitting component 4, the beam expanding component 5, the galvanometer component 6 and the like are not moved or adjusted at all, that is, in the whole process of processing the first waist-shaped micro-through hole of which the back surface of the plate to be processed faces the second processing point, the galvanometer component 6 only carries out scanning alignment and focusing once before rough processing, the secondary scanning, alignment and focusing are not performed in the fine processing stage, so that the first processing power laser beam corresponding to the rough processing stage and the second processing power laser beam corresponding to the fine processing stage, the light is irradiated to the same second processing point through the same external light path which is not moved at all, so that position precision errors caused by secondary repeated alignment do not exist in the rough processing and the fine processing, and the processing roundness is ensured. Understandably, the first waist-shaped micro-through hole penetrates through the first surface copper layer, the glass fiber adhesive layer and the second surface copper layer.
In the reverse side processing process of the plate to be processed, the laser power used in the processing stage of roughly processing the first roughly-drilled micro-through hole is high (first processing power), and the light emergent time in the processing process is short (first processing time length); on the contrary, the laser power used in the first waist-shaped micro-via fine machining stage is small (second machining power), and the light emitting time in the machining process is long (second machining time); in this way, the second surface copper layer can be broken through the relatively high-power laser beam in the rough machining stage, the aperture size meeting the basic requirement is punched, and the first rough-drilled micro through hole conforming to the basic hole pattern is obtained; furthermore, the laser beam with relatively low power and light emitting time in the fine machining stage further perfects the hole pattern on the basis of the rough machined first rough drilled micro through hole to obtain a first waist-shaped micro through hole, and the top aperture and the waist diameter of the first waist-shaped micro-through hole meet the requirement of the preset aperture (in the fine processing process, further effect improvement and modification are carried out on the first rough drilling micro through hole obtained by rough machining, so that the first waist-shaped micro through hole has better machining effect, and because the position precision error caused by secondary repeated contraposition does not exist in the rough machining and the fine machining in the whole reverse machining process, therefore, the processing roundness (effect) is ensured, the overall alignment precision of the equipment is improved, and as the optimization, in the invention, the ratio of the waist diameter of the first waist-shaped micro through hole in the middle of the glass fiber adhesive layer to the top apertures of the second copper surface layer and the second copper surface layer is 0.8.
According to the ultrafast laser-based micro-through hole processing method and system, after the galvanometer component 6 is subjected to scanning alignment and focusing for once, multiple (at least two) split beams obtained by splitting the laser beams corresponding to the first processing power are used for sequentially completing the processing processes of roughly processing multiple (at least two) first roughly-drilled micro-blind holes and finely processing multiple (at least two) first finely-drilled micro-blind holes, and then after the galvanometer component 6 is subjected to scanning alignment and focusing for once, multiple split beams corresponding to the first processing power are used for sequentially completing the processing processes of roughly processing multiple first roughly-drilled micro-through holes and finely processing multiple first waist-shaped micro-through holes; in the invention, the front and back surfaces of the same waist-shaped micro through hole (such as a first waist-shaped micro through hole) are subjected to rough drilling and fine drilling respectively according to rough drilling parameters and fine drilling parameters, so that in the process of processing the same surface (front surface or back surface), firstly, the whole processing process of the same surface can be finished on the basis of one-time scanning alignment and focusing (in the whole single-surface processing process, the galvanometer component 6, the focal position after focusing and the processing point do not need to be moved or adjusted, and only the laser power needs to be changed through the power adjusting component 2), secondly, the rough processing and the fine processing are respectively finished through laser beams with different powers (the rough drilling parameters and the fine drilling parameters respectively correspond to different powers) respectively (in the fine processing process, the rough drilling micro blind hole obtained by rough processing is further improved and modified, so that the fine drilling micro blind hole processing effect is better, position precision errors caused by secondary repeated alignment do not exist in the rough machining process and the fine machining process, so that the machining roundness is ensured, and the overall alignment precision of the equipment is improved); the two guarantee conditions exist simultaneously, so that the finally obtained fine drilling micro blind hole or waist-shaped micro through hole does not have the phenomena of obvious copper splashing on the surface, glass fiber molten balls on the hole wall, glass fiber protrusion, hole bottom adhesive residue and bottom side corrosion, hole opening copper suspension, stripping and the like, has a good hole opening effect, and simultaneously has smaller heat effect.
Meanwhile, when the front side and the back side are respectively processed, the processing document B of the back side is determined in a horizontal mirror processing mode, the mechanical arm overturns the plate to be processed in situ, the original position of the plate to be processed is not moved, and the processing precision of front and back side processing is ensured; in addition, in the whole processing process of the front surface or the back surface, the processing can be completed on the basis of one-time scanning alignment and focusing, so that the speed of processing the micro blind holes or the waist-shaped micro through holes is greatly increased (the one-time scanning alignment and focusing process of the galvanometer component 6 needs about 360 microseconds, but the whole course of the rough processing and the fine processing of the single surface of the first waist-shaped micro through hole is only 120 microseconds), and the processing precision is further ensured. And the laser processing of a plurality of first fine drilling micro blind holes is synchronously carried out through a plurality of light splitting beams (at least two processing shafts are synchronously processed), so that the processing speed is further increased, and the processing efficiency is improved.
In addition, the waist-shaped micro through hole with the same front and back hole diameters can be obtained on the front and back surfaces of the plate to be processed, and the waist-shaped micro through hole can effectively avoid the problem that the front surface hole is large and the back surface hole is small when a conventional laser drilling through hole is formed; meanwhile, the special waist diameter of the waist-shaped micro-through hole can provide better adhesive force for subsequent electroplating of the plate to be processed, and bubbles generated when electroplating solution flows in can be avoided when the front side and the back side are simultaneously electroplated, so that the electroplating quality is influenced due to the existence of the bubbles, and the electroplating efficiency is improved.
Preferably, the ultrafast laser 1 is a picosecond green laser, and the wavelength of the laser beam emitted by the ultrafast laser 1 is 515nm or 532 nm. The picosecond green laser has the characteristics of short pulse width and high peak power, so that the light absorption rate of a copper layer on a plate to be processed is higher, blackening or browning pretreatment is not needed, the process is saved, the drilling efficiency is improved, the heat effect generated in the drilling process is reduced due to the high peak power, meanwhile, the picosecond green laser is used as ultrafast laser, the drilling aperture flexibility is stronger, and the picosecond green laser can be matched with the ultrafast laser to finally obtain the waist-shaped micro through hole with the diameter of 20-60 mu m.
In an embodiment, after the step S80, that is, after obtaining at least two first waist-shaped micro through holes, the method further includes:
acquiring a preset moving path, controlling the laser beam and the plate to be processed to move relatively according to the preset moving path, and respectively focusing at least two split beams onto at least two third processing points arranged on the second processing area at intervals through a galvanometer assembly; understandably, the moving paths can be set according to the number and arrangement of the kidney-shaped micro through holes which are actually required to be processed on the plate to be processed, and one preset moving path can correspond to one front processing area a and the opposite back processing area b. The first processing points, the first processing points and the third processing points are arranged at intervals. And controlling the at least two split beams to move relative to the plate to be processed according to the preset moving path, specifically, controlling the processing shafts on the rack to move relative to the motion control platform according to the preset moving path, so that the laser spots of the split beams finally scanned, aligned and focused by the galvanometer assemblies on the processing shafts can be irradiated on the third processing points in a one-to-one correspondence manner. In the invention, after the evaporation pan processes the first waist-shaped micro-through hole, firstly, the second waist-shaped micro-through hole is processed in the second processing area (namely, the reverse side) according to the preset moving path without turning, so that the positioning precision deviation caused by frequent turning is reduced, and meanwhile, the processing time is saved.
Adjusting the output power of the laser beam emitted by the ultrafast laser to the first processing power, and performing rough machining on the positions corresponding to the at least two third processing points for the first processing time duration through at least two beam splitting beams corresponding to the first processing power to obtain at least two second rough-drilled micro blind holes; that is, after focusing the laser spot corresponding to the split beam to the third processing point, the control module adjusts the output power of the laser beam emitted by the ultrafast laser 1 to the first processing power, so as to perform rough processing to obtain the second rough-drilled micro blind hole. Understandably, the second rough-drilled micro blind hole is concavely formed on the second surface copper layer and the glass fiber adhesive layer.
Adjusting the output power of the laser beam emitted by the ultrafast laser to the second processing power; understandably, after adjusting the output power of the laser beam to said second processing power, it represents entering a fine processing stage. And the laser beam with the second processing power still irradiates to a third processing point through the external optical path which is the same as the rough processing stage corresponding to the second rough drilling micro blind hole for fine processing. Understandably, in the process that the laser beam of the second processing power passes through the outer optical path, the shaping component 3, the light splitting component 4, the beam expanding component 5 and the galvanometer component 6 do not move or adjust at all, that is, the galvanometer component 6 only performs scanning alignment and focusing once before rough processing, and does not perform scanning alignment and focusing twice in the fine processing stage, so that the first processing power laser beam corresponding to the rough processing stage and the second processing power laser beam in the fine processing stage irradiate the same third processing point through the same outer optical path which is not moved at all, so that the position precision error caused by repeated alignment twice does not exist in the second rough processing and the fine processing of the back surface, and the processing roundness is ensured.
Performing fine machining on at least two second rough-drilled micro blind holes for a second machining duration through at least two beam splitting light beams corresponding to a second machining power to obtain at least two second fine-drilled micro blind holes, wherein the aperture of each second fine-drilled micro blind hole is equal to the aperture to be machined; the second fine-drilled micro blind hole is a micro blind hole which is consistent with the first fine-drilled micro blind hole in size and depth dimension. And the second fine-drilled micro blind hole is formed on the second surface copper layer and the glass fiber adhesive layer in a concave manner.
After the plate to be processed is turned over on the motion control platform in situ through the manipulator, the motion control platform is controlled to move until the front processing area a is positioned and aligned to the first processing area; that is, in the process of processing the second waist-shaped micro-through hole, the back side of the plate to be processed is processed firstly, the front side of the plate to be processed is processed, and in the subsequent processing process, all the waist-shaped micro-through holes in the front side processing area a and the back side processing area b are processed continuously according to the rule.
Adjusting the output power of the laser beam emitted by an ultrafast laser from the second processing power to the first processing power; understandably, after the in-situ turning and the alignment are completed, the control module of the ultrafast laser-based micro through hole machining system controls the ultrafast laser to emit the laser beam again, and adjusts the laser beam emitted by the ultrafast laser 1 from the second machining power to the first machining power, which indicates that the rough machining stage of the front surface of the plate to be machined is started again.
Focusing the adjusted at least two split beams onto at least two fourth processing points arranged at intervals on a first processing area through a galvanometer component, so as to obtain at least two second rough drilling micro-through holes after rough machining is carried out on the at least two split beams corresponding to the first processing power for the first processing time at positions corresponding to the at least two fourth processing points; the fourth processing point and the third processing point are arranged oppositely; understandably, the second rough drilling micro through hole penetrates through the first surface copper layer, the glass fiber adhesive layer and the second surface copper layer. Understandably, the rough-machined second rough-drilled micro-via is obtained by penetrating (irradiating) the original second fine-drilled micro-via from a fourth machining point on the front surface (the fourth machining point on the front surface is opposite to the third machining point on the back surface) through the laser with the first machining power.
Adjusting the output power of the laser beam emitted by an ultrafast laser from the first processing power to the second processing power; understandably, the fine machining phase of the front side is entered after the output power of the laser beam emitted by the ultrafast laser is adjusted again from the first machining power to the second machining power. The laser beam with the second processing power passes through the same outer light path as the laser beam with the first processing power, sequentially passes through the shaping component 3, the light splitting component 4, the beam expanding component 5, the galvanometer component 6 and the like, and then starts to irradiate to a fourth processing point which is the same as the second processing area to perform fine processing on the second waist-shaped micro through hole again.
And performing second processing time-length fine processing on the at least two second rough drilling micro through holes through at least two beams of the light splitting beams corresponding to second processing power to obtain at least two second waist-shaped micro through holes, wherein the aperture of each second waist-shaped micro through hole is equal to the aperture to be processed. Understandably, in the process that the laser beam with the second processing power passes through the outer light path, the shaping component 3, the beam splitting component 4, the beam expanding component 5, the galvanometer component 6 and the like are not moved or adjusted at all, that is, in the whole process of processing the second waist-shaped micro-through hole of which the front surface of the plate to be processed faces the fourth processing point, the galvanometer component 6 only carries out scanning alignment and focusing once before rough processing, the secondary scanning contraposition and focusing are not carried out in the fine processing stage, therefore, the first processing power laser beam corresponding to the rough processing stage and the second processing power laser beam corresponding to the fine processing stage, the light is irradiated to the same fourth processing point through the same external light path which is not moved at all, so that position precision errors caused by secondary repeated alignment do not exist in the rough processing and the fine processing, and the processing roundness is ensured. Understandably, the second waist-shaped micro-through hole penetrates through the first surface copper layer, the glass fiber adhesive layer and the second surface copper layer.
It is to be understood that, in the present invention, after the preset movement path corresponding to the front processing area a (and the back processing area b) has traveled to the last processing point and the processing of the waist-shaped micro through hole corresponding to the processing point is completed, the completion of the laser processing corresponding to the front processing area a and the back processing area b is automatically recognized, and the processing is stopped. Otherwise, the machining process is continued to advance along the preset moving path, and the waist-shaped micro through holes are continuously machined at the positions corresponding to the machining points on the preset moving path according to the circulation process.
It should be understood that, the sequence numbers of the steps in the foregoing embodiments do not imply an execution sequence, and the execution sequence of each process should be determined by its function and inherent logic, and should not constitute any limitation to the implementation process of the embodiments of the present invention.
In an embodiment, an ultrafast laser-based micro via processing system is provided, and the ultrafast laser-based micro via processing system corresponds to the ultrafast laser-based micro via processing method in the above embodiment one to one. As shown in fig. 3, the ultrafast laser-based micro via processing system includes an ultrafast laser 1, a power adjusting assembly 2, a shaping assembly 3, a beam splitting assembly 4, a beam expanding assembly 5, a galvanometer assembly 6, and a control module (not shown), where the control module is connected to the ultrafast laser 1, the power adjusting assembly 2, the shaping assembly 3, the beam splitting assembly 4, the beam expanding assembly 5, and the galvanometer assembly 6; the control module is used for executing the ultrafast laser-based micro through hole machining method. For specific definition of the control module of the ultrafast laser-based micro via processing system, reference may be made to the above definition of the ultrafast laser-based micro via processing method, which is not described herein again. The control module described above may be implemented in whole or in part by software, hardware, and combinations thereof. The control module can be embedded in a hardware form or independent from a processor in the computer device, and can also be stored in a memory in the computer device in a software form, so that the processor can call and execute operations corresponding to the modules.
In one embodiment, as shown in fig. 3, the ultrafast laser based micro via processing system further includes a frame having a movable motion control stage; the ultrafast laser 1, the power adjusting component 2, the shaping component 3, the light splitting component 4, the beam expanding component 5, the galvanometer component 6 and the control module are all arranged on the rack; and the plate to be processed is arranged on the motion control platform. Understandably, at least two processing shafts are arranged on the frame, and each processing shaft is provided with a beam expanding component 5 and a galvanometer component 6 (the galvanometer component 6 comprises a galvanometer 61 for swinging the split light beam to scan and align and a focusing mirror 62 for focusing the split light beam on a processing point); the ultrafast laser 1, the power adjusting assembly 2, the shaping assembly 3 and the light splitting assembly 4 are all installed on the rack, and light splitting beams split by the light splitting assembly 4 are correspondingly injected into the beam expanding assemblies 5 one by one. The plate to be processed is arranged on the motion control platform. The relative movement between the processing shafts on the frame and the motion control platform can be controlled to enable the processing shafts to be aligned with the plate to be processed, and then laser spots of the split light beams finally focused by the focusing lenses 62 on the processing shafts can be irradiated on processing points in a one-to-one correspondence mode.
The above-mentioned embodiments are only used for illustrating the technical solutions of the present invention, and not for limiting the same; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications and substitutions do not substantially depart from the spirit and scope of the embodiments of the present invention, and are intended to be included within the scope of the present invention.
Claims (10)
1. A micro through hole processing method based on ultrafast laser is characterized by comprising the following steps:
acquiring a front side processing document and processing parameters, wherein the front side processing document comprises a front side processing area; the machining parameters comprise rough drilling parameters and fine drilling parameters;
controlling a motion control platform provided with a plate to be processed to move until the front processing area is positioned and aligned to a first processing area of the plate to be processed;
controlling an ultrafast laser to emit pulse laser beams according to the rough drilling parameters, and focusing the laser beams to a first machining area after the laser beams are processed through an outer optical path so as to machine a first rough drilling micro blind hole in the first machining area;
controlling an ultrafast laser to emit a pulse type laser beam according to the fine drilling parameters so as to continuously process the first rough-drilled micro blind hole and obtain a first fine-drilled micro blind hole;
acquiring a back side processed document after the front side processed document is subjected to horizontal mirror image processing, wherein the back side processed document comprises a back side processed area which is arranged in a mirror image mode with the front side processed area;
after the plate to be processed is turned over on the motion control platform in situ through the mechanical arm, the motion control platform is controlled to move until the reverse side processing area is positioned and aligned to a second processing area which is arranged on the plate to be processed and is opposite to the first processing area;
controlling an ultrafast laser to emit pulse type laser beams according to the rough drilling parameters, and focusing the laser beams to a second processing area after the laser beams are processed by an external optical path so as to process a first rough drilling micro through hole on the second processing area at a position opposite to the first fine drilling micro blind hole;
and controlling an ultrafast laser to emit pulse type laser beams according to the fine drilling parameters so as to continuously process the first rough drilling micro through hole and obtain a first waist-shaped micro through hole.
2. The ultrafast laser based micro via processing method of claim 1, wherein the processing parameters further include a hole diameter to be processed, and the rough drilling parameters include a first processing power and a first processing time period; the outer light path comprises a shaping component, a light splitting component, a power adjusting component, a beam expanding component and a galvanometer component;
the control ultrafast laser sends pulsed laser beam according to the rough drilling parameter, focuses on first processing region through outer light path with laser beam after the light path is handled to at first processing region processing first rough drilling micro blind hole, includes:
controlling an ultrafast laser to emit a pulsed laser beam having a Gaussian distribution of the first processing power;
controlling a shaping assembly to shape the laser beam into a flat-top-like laser beam;
controlling a light splitting component to perform light splitting processing on the laser beam similar to the flat top, splitting the laser beam into at least two split light beams, and controlling the output power of the at least two split light beams to be equal through a power adjusting component;
acquiring the diameter of a light beam corresponding to the aperture to be processed, and controlling a beam expanding assembly to adjust the diameters of at least two beams of the split light beams to be the diameter of the light beam;
and focusing the adjusted at least two beams of split light beams onto at least two first processing points arranged on a first processing area at intervals through a galvanometer component, so as to obtain at least two first rough-drilled micro blind holes after rough processing for the first processing time length is carried out on the positions corresponding to the at least two first processing points through the at least two beams of split light beams corresponding to the first processing power.
3. The ultrafast laser based micro via processing method of claim 2, wherein the fine drilling parameters include a second processing power and a second processing time period; the first processing power is smaller than the second processing power, and the second processing time is longer than the first processing time;
the control ultrafast laser sends pulsed laser beam according to the fine drilling parameter in order to continue processing first rough drilling micro blind hole obtains first fine drilling micro blind hole, includes:
adjusting the output power of the laser beam emitted by an ultrafast laser from the first processing power to the second processing power;
and performing second processing time-length fine processing on the at least two first rough drilling micro blind holes through at least two beams of the light splitting beams corresponding to second processing power to obtain at least two first fine drilling micro blind holes, wherein the aperture of each first fine drilling micro blind hole is equal to the aperture to be processed.
4. The ultrafast laser based micro via processing method of claim 3, wherein the controlling the ultrafast laser to emit a pulsed laser beam according to the rough drilling parameters, and the pulsed laser beam is focused to a second processing region through an external optical path after being processed by the optical path, so as to process a first rough drilled micro via on the second processing region at a position opposite to the first fine drilled micro via, comprises:
adjusting the output power of the laser beam emitted by an ultrafast laser from the second processing power to the first processing power;
focusing the adjusted at least two split beams onto at least two second processing points arranged on a second processing area at intervals through a galvanometer component, so as to obtain at least two first rough drilling micro-through holes after rough machining is carried out on the at least two split beams corresponding to the first processing power for the first processing time at positions corresponding to the at least two second processing points; the second processing point is arranged opposite to the first processing point.
5. The ultrafast laser based micro via processing method of claim 4, wherein the controlling the ultrafast laser to emit a pulsed laser beam according to the fine drilling parameters to continue processing the first rough drilled micro via to obtain a first waist-shaped micro via comprises:
adjusting the output power of the laser beam emitted by an ultrafast laser from the first processing power to the second processing power;
and performing second processing time-length fine processing on the at least two first rough drilling micro-through holes through at least two beams of the light splitting beams corresponding to second processing power to obtain at least two first waist-shaped micro-through holes, wherein the aperture of each first waist-shaped micro-through hole is equal to the aperture to be processed.
6. The ultrafast laser based micro via hole processing method of claim 1, wherein the board to be processed comprises a first top copper layer, a glass fiber adhesive layer and a second top copper layer sequentially connected to each other; first thick brill blind hole that declines with first thin brill blind hole that declines all caves in and forms on first table copper layer and the fine glue film of glass, just first thick brill micro through hole with first waist type micro through hole pierces through first table copper layer, the fine glue film of glass and second table copper layer.
7. The ultrafast laser-based micro via hole processing method according to claim 1, wherein the aperture to be processed is 20 to 60 μm.
8. The ultrafast laser based micro via hole processing method of claim 1, wherein the first processing power is 10-30 w; the second processing power is 7-20 w; the first processing time is 30-100 mu s, and the second processing time is 60-150 mu s;
the ultrafast laser is a picosecond green laser, and the wavelength of a laser beam emitted by the ultrafast laser is 515nm or 532 nm.
9. The ultrafast laser based micro via processing method of claim 5, wherein after obtaining at least two first waist-shaped micro vias, the method further comprises:
acquiring a preset moving path, controlling the laser beam and the plate to be processed to move relatively according to the preset moving path, and respectively focusing at least two split beams onto at least two third processing points arranged on the second processing area at intervals through a galvanometer component;
adjusting the output power of the laser beam emitted by the ultrafast laser to the first processing power, and performing rough machining on the positions corresponding to the at least two third processing points for the first processing time duration through at least two beam splitting beams corresponding to the first processing power to obtain at least two second rough-drilled micro blind holes;
adjusting the output power of the laser beam emitted by the ultrafast laser to the second processing power;
performing fine machining on at least two second rough-drilled micro blind holes for a second machining duration through at least two beam splitting light beams corresponding to a second machining power to obtain at least two second fine-drilled micro blind holes, wherein the aperture of each second fine-drilled micro blind hole is equal to the aperture to be machined;
after the plate to be processed is turned over on the motion control platform in situ through the manipulator, the motion control platform is controlled to move until the front processing area is positioned and aligned to the first processing area;
adjusting the output power of the laser beam emitted by an ultrafast laser from the second processing power to the first processing power;
focusing the adjusted at least two split beams onto at least two fourth processing points arranged at intervals on a first processing area through a galvanometer component, so as to obtain at least two second rough drilling micro-through holes after rough machining is carried out on the at least two split beams corresponding to the first processing power for the first processing time at positions corresponding to the at least two fourth processing points; the fourth processing point and the third processing point are arranged oppositely;
adjusting the output power of the laser beam emitted by an ultrafast laser from the first processing power to the second processing power;
and performing second processing time-length fine processing on the at least two second rough drilling micro through holes through at least two beams of the light splitting beams corresponding to second processing power to obtain at least two second waist-shaped micro through holes, wherein the aperture of each second waist-shaped micro through hole is equal to the aperture to be processed.
10. A micro-through hole processing system based on ultrafast laser is characterized by comprising an ultrafast laser, a power adjusting component, a shaping component, a light splitting component, a beam expanding component, a galvanometer component and a control module, wherein the control module is connected with the ultrafast laser, the power adjusting component, the shaping component, the light splitting component, the beam expanding component and the galvanometer component; the control module is used for executing the ultrafast laser-based micro through hole machining method of any one of claims 1 to 9.
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| CN202110189586.0A CN114951967A (en) | 2021-02-19 | 2021-02-19 | Ultrafast laser-based micro-through hole machining method and system |
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| CN116652419A (en) * | 2023-06-13 | 2023-08-29 | 大辽激光科技(宁波)有限公司 | Blind hole machining method based on visual image |
| CN117102707A (en) * | 2023-10-23 | 2023-11-24 | 新沂合翎机械设备有限公司 | Micropore processing equipment and process for flexible circuit board |
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Country or region after: China Address after: 518000, Building 101, 1st floor, 2nd floor, 4th floor, 3rd floor, 7th floor, 1st floor, and 4th floor of Building 3, Dahua Laser Intelligent Manufacturing Center, No. 12 Chongqing Road, Heping Community, Fuhai Street, Bao'an District, Shenzhen City, Guangdong Province Applicant after: Shenzhen Han's CNC Technology Co.,Ltd. Address before: 518101 5 / F, 1 / 2 / F, 14 / F, 17 / F, No.3 Factory building, antuoshan hi tech Industrial Park, Xinsha Road, Shajing street, Bao'an District, Shenzhen City, Guangdong Province Applicant before: Shenzhen Han's CNC Technology Co.,Ltd. Country or region before: China |