CN114944430B - Thermal coupling structure for infrared detector and chip assembly method - Google Patents

Thermal coupling structure for infrared detector and chip assembly method Download PDF

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Publication number
CN114944430B
CN114944430B CN202210430637.9A CN202210430637A CN114944430B CN 114944430 B CN114944430 B CN 114944430B CN 202210430637 A CN202210430637 A CN 202210430637A CN 114944430 B CN114944430 B CN 114944430B
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chip
socket
coupling structure
thermal coupling
transition plate
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CN114944430A (en
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不公告发明人
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Beijing Zhichuang Xinyuan Technology Co ltd
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Beijing Zhichuang Xinyuan Technology Co ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/02002—Arrangements for conducting electric current to or from the device in operations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/024—Arrangements for cooling, heating, ventilating or temperature compensation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/08—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof in which radiation controls flow of current through the device, e.g. photoresistors
    • H01L31/09—Devices sensitive to infrared, visible or ultraviolet radiation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Photometry And Measurement Of Optical Pulse Characteristics (AREA)

Abstract

The invention provides a thermal coupling structure for an infrared detector and a chip assembly method, wherein the thermal coupling structure comprises the following components: cooling; the PCB transition plate is arranged on the cold stage; the chip bearing assembly is arranged on the PCB transition plate and used for mounting a chip; the chip bearing assembly comprises: the socket is arranged on the PCB transition plate; a tube shell arranged in the socket; the socket is provided with an inner pin, the tube shell is provided with an outer pin, and when the tube shell is pressed into the socket, the outer pin of the tube shell is in contact conduction with the inner pin of the socket. The cold platform includes the flexible platform that has flexible function, and flexible platform is through flexible all the time with the bottom conflict contact of tube. Aiming at the problem of overlarge thermal stress caused by uneven stress of the screw-fixed ceramic substrate on a liquid nitrogen metal Dewar cold stage, the invention uniformly distributes the stress by using a compression joint mode, and solves the problems of electric signal disconnection and chip splintering caused by ceramic lead substrate fracture.

Description

Thermal coupling structure for infrared detector and chip assembly method
Technical Field
The invention relates to the technical field of chip packaging, in particular to a thermal coupling structure for an infrared detector and a chip assembly method.
Background
With the development of infrared detectors, in the development and production processes of refrigeration type infrared detectors, the evaluation and screening of chip performance is one of essential links in the development and production processes of refrigeration type infrared detectors, and as the working temperature of infrared detectors is usually 80K, in order to ensure the working temperature of infrared detectors, compared with the traditional integrated circuit packaging, the chip packaging of refrigeration type infrared detectors is in a dewar vacuum environment, and a proper low-temperature working environment and corresponding electrical and optical interfaces are provided for detector chips.
The related art thermal coupling structure is that an infrared detector chip is bonded on a ceramic lead substrate, then the ceramic lead substrate is fixed on a liquid nitrogen metal Dewar cold stage through a screw, and a pin of the detector chip is led out to the ceramic lead substrate and a liquid nitrogen metal Dewar wiring terminal through ultrasonic bonding.
However, the ceramic lead substrate is fixed on the liquid nitrogen metal dewar cooling stage by screws, which easily causes the problems of non-solid contact between the ceramic lead substrate and the cooling stage, uneven stress and overlarge thermal stress, and in severe cases, the ceramic lead substrate is broken, which causes the disconnection of electrical signals and chip cracking.
In other words, the thermal coupling structure suffers from uneven stress and excessive thermal stress.
Disclosure of Invention
Aiming at the problems in the prior art, the invention provides a thermal coupling structure for an infrared detector and a chip assembly method, which solve the problems of uneven stress and overlarge thermal stress of the thermal coupling structure.
The invention relates to a thermal coupling structure for an infrared detector, which comprises: cooling; the PCB transition plate is arranged on the cold platform; the chip bearing assembly is arranged on the PCB transition plate and used for mounting a chip; the chip bearing assembly comprises: the socket is arranged on the PCB transition plate; a tube shell arranged in the socket; the socket is provided with an inner pin, the tube shell is provided with an outer pin, and when the tube shell is pressed into the socket, the outer pin of the tube shell is in contact conduction with the inner pin of the socket. The cold platform includes the flexible platform that has flexible function, and flexible platform is through flexible all the time with the bottom conflict contact of tube.
In one embodiment, the socket is provided with a mounting cavity, the inner pins are provided on an inner wall surface of the mounting cavity, and the outer pins are provided on an outer circumferential surface of the case. In this embodiment, the internal face of installation cavity all sets up the inner pin, and the outer peripheral face of tube all is provided with outer pin. This increases the contact area of the inner leads with the outer leads. Thereby ensuring that the socket and the shell are connected and conducted. Thereby ensuring that the thermal coupling structure can function properly.
In one embodiment, the package is provided with a core cavity in which the chip is mounted.
In one embodiment, a wire bond pad is disposed on the package and is disposed at the opening of the core cavity.
In one embodiment, the bottom of the socket is provided with a welding pin, the PCB transition plate is provided with a jack, and the welding pin is plugged in the jack.
In one embodiment, the PCB transition plate is provided with a connecting pin, and the connecting pin is used for connecting a connecting plug-in unit of the cold stage.
In one embodiment, still include fixed frame and connecting piece, fixed frame can pass the cab apron with chip carrier assembly and PCB and compress tightly on the cold platform, and the connecting piece can be fixed frame on the cold platform.
In one embodiment, the up end of tube is provided with the boss, and cold platform is provided with the connecting hole, and fixed frame includes: the inner wall of the frame body is provided with a crimping piece; one end of the connecting arm is connected with the outer wall of the frame body, and the other end of the connecting arm is provided with a through hole; when the frame body is sleeved on the periphery of the boss, the through hole is aligned to the connecting hole, the crimping piece is crimped on the boss, and the connecting piece is arranged in the through hole and the connecting hole in a penetrating mode.
In one embodiment, the PCB transition plate is provided with a first avoidance hole, the socket is provided with a second avoidance hole, and the cold stage further comprises: a fixed table; one end of the elastic compression piece is connected with the fixed platform; the other end of the elastic compression piece is connected with the telescopic table; wherein, flexible platform can be in proper order from first dodge the hole and the second dodge the hole and stretch out and contradict the contact with the bottom of tube, and the elasticity compression piece is in compression state this moment. In this embodiment, the elastic compression part has a buffering function, and the expansion table is prevented from being in rigid contact with the pipe shell while the expansion table is ensured to be in close contact with the pipe shell. Thereby ensuring that the cold plate is in close contact and flexible contact with the pipe shell. And then avoided the problem that the tube damaged because of with cold platform rigid contact and the unable close contact of tube and cold platform leads to the chip can't drop to operating temperature and the performance homogeneity that arouses reduces.
The invention also provides a chip assembling method, which adopts the thermal coupling structure and comprises the following steps:
step one, assembling a chip bearing assembly;
secondly, mounting the chip bearing assembly on a PCB transition plate;
thirdly, mounting the chip in the chip bearing assembly;
connecting the chip and the chip bearing assembly through ultrasonic bonding;
and fifthly, mounting the chip bearing assembly, the chip and the PCB transition plate on a cold stage.
The features mentioned above can be combined in various suitable ways or replaced by equivalent features as long as the object of the invention is achieved.
Compared with the prior art, the thermal coupling structure for the infrared detector and the chip assembly method provided by the invention at least have the following beneficial effects:
1. the socket and the tube shell are arranged, and the connection and conduction between the tube shell and the socket are completed by the insertion and matching of the tube shell and the socket, so that the times of ultrasonic bonding procedures in the related technology are reduced, the field installation process of the thermal coupling structure is simplified, and the working efficiency of the thermal coupling structure is improved.
2. Aiming at the problem of overlarge thermal stress caused by uneven stress of the ceramic substrate fixed by the screw on the liquid nitrogen metal Dewar cold stage, the stress is uniformly distributed by using a compression joint mode (the telescopic stage is always in compression joint with the bottom of the tube shell), and the problems of electrical signal disconnection and chip splintering caused by ceramic lead substrate fracture are solved.
3. Aiming at the problem of incomplete contact caused by fixing the ceramic substrate on the liquid nitrogen metal Dewar cold stage by the screw, the crimping position is limited at a certain height by the crimping limiting device, so that the bottom surface of the tube shell is in close contact, and the problem of performance uniformity reduction caused by incapability of reducing to the working temperature is avoided.
Drawings
The invention will be described in more detail hereinafter on the basis of embodiments and with reference to the accompanying drawings. Wherein:
FIG. 1 shows a schematic structural view of a thermal coupling structure for an infrared detector of the present invention (cold stage not shown);
FIG. 2 shows a schematic structural diagram of the chip carrier assembly of FIG. 1;
FIG. 3 is a perspective view of the socket of FIG. 2;
FIG. 4 shows a schematic view of a solder pin attached to a PCB transition plate below the interposer of FIG. 2;
FIG. 5 shows a schematic structural view of the PCB transition plate of FIG. 1;
figure 6 shows a schematic perspective view of the fixed frame of figure 1;
FIG. 7 shows a schematic structural view of the cold station of FIG. 1;
FIG. 8 is a schematic view (from above) of the PCB transition plate of FIG. 1 assembled at an angle to a chip carrier assembly;
FIG. 9 is a schematic view of another angle of assembly of the PCB transition plate and the chip carrier assembly of FIG. 1 (front view);
FIG. 10 is a schematic diagram showing the assembly of the chip carrier assembly of FIG. 1 with a chip;
FIG. 11 is a schematic diagram showing the assembly of the chip carrier assembly, chip and PCB transition plate of FIG. 1;
FIG. 12 shows a schematic of the structure of a chip of the present invention;
fig. 13 shows a perspective view of the cartridge of fig. 2;
fig. 14 shows a schematic view of the construction of the cartridge of fig. 2.
In the drawings, like parts are provided with like reference numerals. The drawings are not to scale.
Reference numerals:
10. cooling; 11. a fixed table; 12. an elastic compression member; 13. a telescopic table; 20. a PCB transition plate; 21. a jack; 22. a connecting pin; 23. a first avoidance hole; 30. a chip carrier assembly; 31. a socket; 311. an inner pin; 312. a second avoidance hole; 313. welding pins; 32. a pipe shell; 321. an outer pin; 322. a core cavity; 323. a wire bond pad; 324. a boss; 40. a fixing frame; 41. a frame body; 411. a crimping member; 42. a connecting arm; 43. a connecting cylinder; 100. a chip; 101. a photoelectric conversion chip; 102. a read-out circuit leading-out terminal bonding pad; 103. and a readout circuit module.
Detailed Description
The invention will be further explained with reference to the drawings.
The chip 100 in the present invention refers to an infrared detector chip, and includes a photoelectric conversion chip 101, a readout circuit terminal pad 102, and a readout circuit module 103. The readout circuit leading-out terminal pads 102 are disposed on the left and right sides of the photoelectric conversion chip 101. The external shape of the infrared detector chip is rectangular (see fig. 12).
It should be noted that the cooling stage 10 of the present invention is a liquid nitrogen metal dewar cooling stage.
As shown in fig. 1, the present invention provides a thermal coupling structure for an infrared detector, which includes a cold stage 10, a PCB transition plate 20, and a chip carrier assembly 30.
The chip carrier assembly 30 includes a socket 31 and a package 32. The socket 31 is provided with inner pins 311 and the package 32 is provided with outer pins 321, the outer pins 321 of the package 32 being in contact with the inner pins 311 of the socket 31 when the package 32 is pressed into the socket 31. The cooling table 10 includes a telescopic table 13 having a telescopic function, and the telescopic table 13 is always in contact with the bottom of the pipe case 32 by being telescopic.
In the above arrangement, the socket 31 and the case 32 are provided, and the connection and conduction between the case 32 and the socket 31 are completed by the insertion and matching of the case 32 and the socket 31, so that the number of ultrasonic bonding processes in the related art is reduced, the field installation process of the thermal coupling structure is simplified, and the working efficiency of the thermal coupling structure is improved.
Aiming at the problem of overlarge thermal stress caused by uneven stress of a screw-fixed ceramic substrate on a liquid nitrogen metal Dewar cold stage in the related art, the stress is uniformly distributed by using a compression joint mode (the telescopic stage 13 is always pressed at the bottom of the tube shell 32), and the problems of electrical signal disconnection and chip splintering caused by ceramic lead substrate fracture are solved.
Aiming at the problem of incomplete contact caused by fixing the ceramic substrate on a liquid nitrogen metal Dewar cold stage by screws in the related art, the crimping position is limited at a certain height by the crimping limiting device, so that the bottom surface of the tube shell is in close contact, and the problem of performance uniformity reduction caused by incapability of reducing to the working temperature is avoided.
It should be noted that, when the thermal coupling structure is installed on site in the related art, the infrared detector chip circuit and the ceramic lead substrate are required to be ultrasonically bonded, and the ceramic lead substrate and the liquid nitrogen metal dewar terminal are required to be ultrasonically bonded (i.e., two times of ultrasonic bonding are required to be completed). The thermal coupling structure of the present invention only needs to complete one ultrasonic bonding of the chip 100 and the package 32.
Specifically, as shown in fig. 2, in one embodiment, chip carrier assembly 30 is rectangular in shape.
Specifically, as shown in fig. 5, in one embodiment, the PCB transition plate 20 is a circular disk.
Specifically, as shown in fig. 1 to 4, in one embodiment, the socket 31 is provided with a mounting cavity, the inner pin 311 is provided on an inner wall surface of the mounting cavity, and the outer pin 321 is provided on an outer circumferential surface of the package case 32.
In the above arrangement, the inner wall surfaces of the mounting cavities are provided with the inner pins 311, and the outer peripheral surfaces of the tube shells 32 are provided with the outer pins 321. This increases the contact area of the inner leads 311 and the outer leads 321. Thereby ensuring that the socket 31 and the housing 32 are connected in conduction. Thereby ensuring that the thermal coupling structure can function properly.
Specifically, as shown in fig. 13 and 14, in one embodiment, the package 32 is provided with a core cavity 322, and the chip 100 is mounted in the core cavity 322.
Specifically, as shown in fig. 10 and 11, in one embodiment, the bottom of the core cavity 322 is provided with a chip placement position, and the chip 100 is adhered to the chip placement position.
Specifically, as shown in fig. 13 and 14, in one embodiment, a wire bond pad 323 is disposed on the package 32, the wire bond pad 323 being disposed at the opening of the core cavity 322.
In the above arrangement, the provision of the wire bonding pad 323 ensures ultrasonic bonding of the package 32 to the chip 100, thereby ensuring that the package 32 is electrically connected to the chip 100. Thereby ensuring that the thermal coupling structure can function properly.
Specifically, as shown in fig. 3 to 5, in one embodiment, the bottom of the socket 31 is provided with soldering pins 313, the pcb transition plate 20 is provided with insertion holes 21, and the soldering pins 313 are inserted into the insertion holes 21.
Specifically, as shown in fig. 4, in one embodiment, the bottom of the socket 31 is provided with a plurality of soldering pins 313, and the plurality of soldering pins 313 are distributed in a matrix.
It should be noted that the soldering pins 313 are provided to facilitate the soldering and conduction between the socket 31 and the PCB transition plate 20, and only one soldering is required, and no repeated soldering is required subsequently.
Specifically, as shown in FIG. 5, in one embodiment, the receptacles 21 are distributed in a matrix. Are respectively arranged at the left and right sides of the circle center of the PCB transition plate 20.
Specifically, as shown in fig. 5, in one embodiment, the PCB transition plate 20 is provided with a connection pin 22, and the connection pin 22 is used for connecting a connection plug-in of the cold stage 10.
Specifically, as shown in fig. 1 and 6, in one embodiment, the thermal coupling structure further includes a fixing frame 40 and a connecting member, the fixing frame 40 can press the chip carrier assembly 30 and the PCB transition plate 20 against the cold stage 10, and the connecting member can fix the fixing frame 40 on the cold stage 10.
In the above arrangement, the fixing frame 40 and the connecting member are used cooperatively to realize the pressing and fixing of the chip carrier assembly 30 and the PCB transition plate 20 on the cold stage 10. This prevents the chip carrier assembly 30 and the PCB transition plate 20 from coming off the cold stage 10, and realizes the anti-loose function of the thermal coupling structure. Thereby ensuring that the thermal coupling structure can function properly.
Specifically, as shown in fig. 6, 13 and 14, in one embodiment, the upper end surface of the case 32 is provided with a boss 324, the cold stage 10 is provided with a connection hole, and the fixing frame 40 includes a frame body 41 and a connection arm 42. Wherein, the inner wall of the frame body 41 is provided with a crimping piece 411, one end of the connecting arm 42 is connected with the outer wall of the frame body 41, and the other end is provided with a through hole; when the frame body 41 is sleeved on the periphery of the boss 324, the through hole is aligned with the connecting hole, the crimping piece 411 can be crimped on the boss 324, and the connecting piece penetrates through the through hole and the connecting hole.
Specifically, in one embodiment, the connecting holes are threaded holes, and the connecting pieces are screws.
Specifically, as shown in fig. 6, in one embodiment, frame 41 is a square ring.
Specifically, as shown in FIG. 6, in one embodiment, the number of connecting arms 42 is four, disposed at the midpoint of the four sides of the quad ring.
Specifically, as shown in fig. 6, in one embodiment, the fixing frame 40 further includes four connecting cylinders 43, and the through holes of the connecting cylinders 43 are concentrically arranged with the through holes of the connecting arms 42. The screw is threaded through the connecting arm 42 and the connecting cylinder 43 in turn to be screwed with the threaded hole.
Specifically, as shown in fig. 3 to 5, in one embodiment, the PCB transition plate 20 is provided with a first avoidance hole 23, the socket 31 is provided with a second avoidance hole 312, and the cold stage 10 further includes a fixing stage 11 and an elastic compression member 12. Wherein, the one end of elasticity compression spare 12 is connected with fixed station 11, and flexible platform 13 is connected with the other end of elasticity compression spare 12, and flexible platform 13 can stretch out from first dodging hole 23 and second dodging hole 312 in proper order and contradict the contact with the bottom of tube 32, and elasticity compression spare 12 is in compression state this moment.
In the above arrangement, the elastic compression member 12 has a buffer function, so as to ensure the close contact between the telescopic stage 13 and the pipe housing 32 and avoid the rigid contact between the telescopic stage 13 and the pipe housing 32. Thereby ensuring intimate and flexible contact of the cold plate 10 with the enclosure 32. Further, the problem of damage of the package 32 due to rigid contact with the cooling stage 10 and the problem of performance uniformity reduction caused by the fact that the chip 100 cannot be cooled to the working temperature due to the fact that the package 32 cannot be in close contact with the cooling stage 10 are avoided.
Specifically, as shown in fig. 7, in one embodiment, the elastic compression member 12 employs a compression spring.
The invention also provides a chip assembly method, which adopts the thermal coupling structure and comprises the following steps (refer to fig. 1, 8 to 11):
step one, assembling a chip bearing assembly;
secondly, mounting the chip bearing assembly on a PCB transition plate;
thirdly, mounting the chip in the chip bearing assembly;
connecting the chip and the chip bearing assembly through ultrasonic bonding;
and fifthly, mounting the chip bearing assembly, the chip and the PCB transition plate on a cold stage.
An embodiment of the present invention is described below with reference to fig. 1 to 14:
the invention provides a thermal coupling structure for testing, which comprises an LCC (Chinese full name: leadless Chip Carrier, english full name: lead Chip Carrier) ceramic packaging tube shell (tube shell 32), a PLCC socket (socket 31), an LCC fixing frame (fixing frame 40) and a cold stage structure (cold stage 10).
The LCC ceramic packaging tube shell is of a chip carrier packaging structure, a chip placing area is arranged in an upper core cavity, the periphery of the outer side of the core cavity is designed into a lead bonding pad 323, and outer pins 321 of the tube shell are led out from the periphery of a packaging body. The PLCC socket (Chinese full name: plastic Chip Carrier with lead wire, english full name: plastic Leaded Chip Carrier) is a standard component welded through a plate, the shape is square, inner pins 311 are led out from four sides of a package, and the center position is hollow and used for being coupled with a liquid nitrogen metal Dewar cold stage and an infrared detector Chip. The PLCC socket is welded to the PCB transition plate 20, a liquid nitrogen metal Dewar tube pin lead is directly fixed on the PCB transition plate 20 through tin soldering, the periphery of the chip 100 is exposed in the middle, and the fixing frame 40 is used for pressing and fixing the LCC ceramic packaging tube arranged in the PLCC socket on the Dewar cold stage. The center of the cold table 10 is provided with a cylinder (a telescopic table 13) with the diameter of 10mm, a compression spring is arranged on the cylinder, and the end face of the cold table 10 is provided with a PCB transition plate 20 and a threaded hole for fixing an LCC fixing frame.
Specifically, the assembly method of the thermal coupling structure is as follows:
the LCC ceramic packaging tube shell is installed with the PLCC socket;
mounting the PLCC socket provided with the LCC ceramic packaging tube shell on a PCB transition plate, and communicating and fixing by using solder paste;
fixing an infrared detector chip in a bonding area of the LCC ceramic package through an adhesive;
correspondingly connecting the bonding pad of the leading-out end of the reading circuit with the bonding area of the LCC ceramic packaging tube shell through ultrasonic bonding;
mounting a compression spring on a cold stage;
the screw hole site of the fixed frame of LCC on the cab apron is aligned with mounting hole (screw hole) position on the dewar cold bench with PCB, place the fixed frame of LCC on the LCC ceramic package tube shell, put into fixed frame screw hole all around with the screw, adopt diagonal direction to screw up four screws respectively in cold bench threaded hole, the fixed frame of LCC pushes down the LCC ceramic package tube shell all around in the screwing up process, make compression spring butt to the up end of the bellied cylinder platform of cold bench, make LCC ceramic package tube shell bottom surface and cylinder platform up end contact.
The invention solves the problems of ceramic lead substrate fracture, electrical signal disconnection, chip splintering and the like caused by overlarge thermal stress in the conventional structural mode, and simultaneously reduces one ultrasonic bonding by using the LCC ceramic packaging tube shell and the PLCC socket, thereby improving the batch operation efficiency.
In the description of the present invention, it is to be understood that the terms "upper", "lower", "bottom", "top", "front", "back", "inner", "outer", "left", "right", and the like, are used in the orientations and positional relationships indicated in the drawings, which are based on the orientations and positional relationships indicated in the drawings, and are used for convenience of description and simplicity of description, but do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, are not to be construed as limiting the present invention.
Although the invention herein has been described with reference to particular embodiments, it is to be understood that these embodiments are merely illustrative of the principles and applications of the present invention. It is therefore to be understood that numerous modifications may be made to the illustrative embodiments and that other arrangements may be devised without departing from the spirit and scope of the present invention as defined by the appended claims. It should be understood that features described in different dependent claims and herein may be combined in ways different from those described in the original claims. It is also to be understood that features described in connection with individual embodiments may be used in other described embodiments.

Claims (10)

1. A thermal coupling structure for an infrared detector, comprising:
cooling;
the PCB transition plate is arranged on the cold stage;
the chip bearing assembly is arranged on the PCB transition plate and used for mounting a chip;
the chip carrier assembly comprises:
the socket is arranged on the PCB transition plate;
a cartridge disposed within the socket;
the socket is provided with an inner pin, the tube shell is provided with an outer pin, and when the tube shell is pressed into the socket, the outer pin of the tube shell is in contact conduction with the inner pin of the socket; the cold platform comprises a telescopic platform with a telescopic function, and the telescopic platform is always in contact with the bottom of the pipe shell in an abutting mode through stretching.
2. The thermal coupling structure for an infrared detector according to claim 1, wherein the socket is provided with a mounting cavity, the inner pin is provided on an inner wall surface of the mounting cavity, and the outer pin is provided on an outer peripheral surface of the tube case.
3. The thermal coupling structure for an infrared detector according to claim 2, wherein said package is provided with a core cavity, said chip being mounted in said core cavity.
4. The thermal coupling structure for the infrared detector, according to claim 3, wherein a wire bonding pad is disposed on the case, and the wire bonding pad is disposed at the opening of the core cavity.
5. The thermal coupling structure for the infrared detector according to claim 1, wherein a soldering pin is disposed at a bottom of the socket, and a plug hole is disposed on the PCB transition plate, and the soldering pin is plugged in the plug hole.
6. The thermal coupling structure for an infrared detector according to claim 1, wherein the PCB transition plate is provided with a connection pin for connecting a connection plug-in of the cold stage.
7. The thermal coupling structure for an infrared detector according to claim 1, further comprising a fixing frame capable of pressing the chip carrier assembly and the PCB transition plate against the cold stage, and a connecting member capable of fixing the fixing frame against the cold stage.
8. The thermal coupling structure for an infrared detector according to claim 7, wherein the upper end surface of the case is provided with a boss, the cold stage is provided with a connection hole, and the fixing frame comprises:
the inner wall of the frame body is provided with a crimping piece;
one end of the connecting arm is connected with the outer wall of the frame body, and the other end of the connecting arm is provided with a through hole;
when the frame body is sleeved on the periphery of the boss, the through hole is aligned to the connecting hole, the crimping piece is in crimping connection with the boss, and the connecting piece penetrates through the through hole and the connecting hole.
9. The thermal coupling structure for an infrared detector according to claim 1, wherein the PCB transition plate is provided with a first avoidance hole, the socket is provided with a second avoidance hole, the cold stage further comprises:
a fixed table;
one end of the elastic compression piece is connected with the fixed table, and the other end of the elastic compression piece is connected with the telescopic table;
the telescopic table can sequentially extend out of the first avoidance hole and the second avoidance hole to be in contact with the bottom of the tube shell in an abutting mode, and at the moment, the elastic compression piece is in a compression state.
10. A chip assembly method, characterized in that it employs the thermal coupling structure of any one of claims 1 to 9, comprising the steps of:
step one, assembling a chip bearing assembly;
secondly, mounting the chip bearing assembly on a PCB transition plate;
thirdly, installing a chip in the chip bearing assembly;
connecting the chip and the chip bearing assembly through ultrasonic bonding;
and fifthly, mounting the chip bearing assembly, the chip and the PCB transition plate on a cold stage.
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