CN114932636A - Automatic sheet taking machine - Google Patents
Automatic sheet taking machine Download PDFInfo
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- CN114932636A CN114932636A CN202210471056.XA CN202210471056A CN114932636A CN 114932636 A CN114932636 A CN 114932636A CN 202210471056 A CN202210471056 A CN 202210471056A CN 114932636 A CN114932636 A CN 114932636A
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- fixing groove
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- 238000005520 cutting process Methods 0.000 claims abstract description 57
- 239000013078 crystal Substances 0.000 claims abstract description 54
- 230000002093 peripheral effect Effects 0.000 claims abstract description 48
- 239000000758 substrate Substances 0.000 claims abstract description 21
- 229910003460 diamond Inorganic materials 0.000 claims description 12
- 239000010432 diamond Substances 0.000 claims description 12
- 239000000110 cooling liquid Substances 0.000 claims description 6
- 235000012431 wafers Nutrition 0.000 abstract description 83
- 238000000926 separation method Methods 0.000 abstract description 4
- 238000002360 preparation method Methods 0.000 abstract description 2
- 239000000178 monomer Substances 0.000 description 7
- 239000002826 coolant Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000009434 installation Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
- B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0076—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
The invention discloses an automatic wafer taking machine, which can separate wafers formed by cutting crystal bars one by one and has high separation efficiency, and the technical scheme is as follows: comprises a fixing structure for fixing an external crystal support; the wafer cutting device comprises a fixed structure, and is characterized by further comprising a cutting assembly and a first driving assembly, wherein the first driving assembly is used for enabling the cutting assembly and the fixed structure to move relatively so as to enable the cutting assembly to cut the peripheral substrate, and belongs to the technical field of wafer preparation.
Description
Technical Field
The invention belongs to the technical field of wafer preparation, and particularly relates to an automatic wafer taking machine.
Background
The device for cutting and the cutting process of the crystal bar are shown in the patent publication No. CN 111976043A;
in practical application, the cutting process of the crystal bar is as follows: firstly, adhering a crystal bar on a resin substrate, and adhering the resin substrate on a crystal support; and fixing the crystal support on a cutting machine, and cutting the crystal bar into a plurality of wafers in a wire cutting mode.
The cut crystal bar is subjected to the next procedure to complete the piece taking work, and the piece taking work can be shown by a single crystal silicon rod positioning and piece taking mechanism disclosed in patent publication No. CN 215150678U; the bearing seat consists of a plurality of bearing monomers and is used for bonding the crystal bar, and after the crystal bar is cut, the bearing seat is decomposed into a plurality of bearing monomers so as to finish the work of taking the wafer; as can be seen from the attached drawings, one bearing monomer corresponds to a plurality of wafers; if the mode is adopted to separate the wafers one by one, one bearing monomer corresponds to one wafer, and in the prior art, the crystal bar has a certain length, so that the wafers are separated one by one through the scheme, a large number of bearing monomers are needed, and the more the number of the bearing monomers is, the more the operation of combining the bearing monomers into the bearing seat is, the more the production efficiency is affected.
Disclosure of Invention
The main objective of the present invention is to provide an automatic wafer picking machine, which can separate wafers formed by cutting a crystal bar one by one and has high separation efficiency.
According to a first aspect of the invention, an automatic wafer taking machine is provided, which comprises a fixing structure, a first wafer support and a second wafer support, wherein the fixing structure is used for fixing the external wafer support; the cutting device further comprises a cutting assembly and a first driving assembly, wherein the first driving assembly is used for enabling the cutting assembly and the fixing structure to move relatively so that the cutting assembly can cut the peripheral substrate.
In a specific embodiment of the invention, the fixing structure further comprises a frame, the fixing structure is a fixing groove arranged on the frame, one end of the fixing groove is an open end for inserting an external wafer holder, two opposite sides of the fixing groove are respectively provided with a clamping rod, and the clamping rods extend towards the length direction of the fixing groove to enable the fixing groove to form an i-shaped groove-shaped structure.
In a specific embodiment of the invention, the wafer support device further comprises a first locking member, wherein the first locking member is detachably connected to the fixing groove and used for locking the peripheral wafer support in the fixing groove.
In a specific embodiment of the present invention, the first driving assembly includes an electric sliding table disposed on the rack, and a mounting rack disposed on the electric sliding table;
the cutting assembly comprises a first guide wheel and a second guide wheel; the diamond wire is in a ring shape and wound on the first guide wheel and the second guide wheel; the first guide wheel is driven to rotate by a second driving assembly; the first guide wheel and the second guide wheel are rotatably arranged on the mounting frame.
In a specific embodiment of the invention, the first guide wheel, the second guide wheel and the diamond wire are matched to form a cutting plane; the first guide wheel is mounted on the mounting frame through a first adjusting structure, and the second guide wheel is mounted on the mounting frame through a second adjusting structure; the first adjusting structure is used for adjusting the distance between the first guide wheel and the fixing groove, and the second adjusting structure is used for adjusting the distance between the second guide wheel and the fixing groove, so that the distance between the cutting plane and the fixing groove can be adjusted.
In a specific embodiment of the invention, the first guide wheel and the second driving assembly are arranged on a mounting block, and the mounting block is connected to the mounting frame in a manner of sliding up and down; the first adjusting structure comprises a supporting piece, the supporting piece is positioned below the mounting block, and the supporting piece extends upwards to limit the mounting block to slide; the supporting part is arranged on the mounting rack in a clamping mode, so that the upward extending height of the supporting part is adjustable;
the second adjusting structure comprises a mounting column and a thread block, the thread block is fixedly connected to the mounting frame, and threads matched with the thread block are arranged on the mounting column; the second guide wheel is rotatably connected to the mounting column.
In a specific embodiment of the present invention, the mounting rack further comprises a cooling liquid output pipe, the cooling liquid output pipe is fixed on the mounting rack, and an output end of the cooling liquid output pipe is arranged towards the direction of the diamond wire.
In a specific embodiment of the invention, the wafer holding device further comprises a holding assembly, wherein the holding assembly comprises a mounting plate, a limiting groove is arranged on the mounting plate, and a wafer support block with a wafer support groove is placed in the limiting groove; the wafer bracket is arranged relative to the fixing groove; the mounting plate can be driven to approach or move away from the fixing groove by a third driving component.
In a specific embodiment of the invention, the wafer support device further comprises a clamping rod, wherein the clamping rod is driven by a fourth driving assembly to clamp the peripheral crystal bar in the wafer support groove; the fourth drive assembly is disposed on the mounting plate.
In a specific embodiment of the invention, two ends of the wafer bracket in the length direction are open ends; the device also comprises 2 clamping plates for limiting the external crystal bar in the wafer bracket; the clamping plates are arranged on the wafer support block through a third adjusting structure, so that the distance between the 2 clamping plates is adjustable.
In a specific embodiment of the present invention, the third adjustment structure comprises a mounting hole disposed on the wafer support block, the mounting hole extending along the length direction of the wafer support slot; still including setting up installation pole on the grip block, installation pole sliding connection just can pass through a second retaining member locking in the mounting hole.
One of the above technical solutions of the present invention has at least one of the following advantages or beneficial effects:
in practical application, the peripheral crystal bar is bonded on the peripheral substrate, the peripheral substrate is bonded on the peripheral crystal support, the cutting depth of linear cutting reaches the peripheral substrate to enable the peripheral crystal bar to be cut into a plurality of wafers, the peripheral crystal bar is fixed on the fixed structure after being cut into the plurality of wafers, the cutting assembly and the fixed structure are enabled to move relatively by the first driving assembly to enable the cutting assembly to cut the peripheral substrate, the wafers formed after the peripheral crystal bar is cut can be separated one by one, the separation efficiency is high, and the next process can be conveniently carried out.
Drawings
The invention is further described below with reference to the drawings and examples;
FIG. 1 is a schematic diagram of a crystal bar, a substrate and a crystal support;
FIG. 2 is a block diagram of an embodiment of the present invention;
fig. 3 is a front view of an embodiment of the present invention.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are illustrative only for the purpose of explaining the present invention, and are not to be construed as limiting the present invention.
In practical application, the peripheral crystal bar a is bonded on the peripheral substrate b, the peripheral substrate is bonded on the peripheral crystal support c, the cutting depth of linear cutting reaches a first position d on the peripheral substrate b so that the peripheral crystal bar a is cut into a plurality of wafers, and the peripheral crystal bar a is bonded on the peripheral substrate b after being cut; the structure diagram of the peripheral crystal bar a, the peripheral substrate b and the peripheral crystal support c is shown in figure 1, and the peripheral crystal bar a is cylindrical; the peripheral substrate b is in a long plate shape, a groove body matched with the peripheral crystal bar a is arranged on the peripheral substrate b, grooves for indicating cutting positions are further arranged on the peripheral substrate b, the grooves are respectively arranged on two opposite sides of the peripheral substrate b, and the grooves are the first positions d; the opposite two sides of the external crystal support c are provided with clamping grooves.
In order to separate the wafers generated after the external crystal bars are cut one by one, the following scheme is provided:
referring to fig. 2 to 3, an automatic wafer taking machine includes a fixing structure 1 for fixing an external wafer holder; the cutting device also comprises a cutting assembly 2 and a first driving assembly 3, wherein the first driving assembly 3 is used for enabling the cutting assembly 2 and the fixed structure 1 to generate relative movement so that the cutting assembly 2 can cut the peripheral substrate, wafers formed after the peripheral crystal bars are cut can be separated one by one, the separation efficiency is high, and the next process can be conveniently carried out;
specifically, when the cutting assembly 2 is used for cutting the peripheral substrate, the cutting position corresponds to the first position so that the wafers can be separated one by one.
In this embodiment, the fixing structure further includes a frame a, the fixing structure 1 is a fixing groove 11 disposed on the frame a, one end of the fixing groove 11 is an open end into which an external wafer holder is inserted, two opposite sides of the fixing groove 11 are both provided with a clamping rod 12, the clamping rod 12 extends in a length direction of the fixing groove 11 to enable the fixing groove 11 to form an i-shaped groove-shaped structure, and the clamping rod 12 is matched with a clamping groove of the external wafer holder to enable the external wafer holder to be stably fixed in the fixing groove 11;
the first locking piece 13 is detachably connected to the fixing groove 11 and used for locking the peripheral crystal support in the fixing groove 11, and the stability of the peripheral crystal support in the fixing groove 11 can be further enhanced by the arrangement of the first locking piece 13;
specifically, the first locking member 13 is a bolt, a threaded hole is formed in the side edge of the fixing groove 11, and the external crystal support is locked in the fixing groove 11 in a mode that the bolt penetrates through the threaded hole;
the first locking member 13 may also be a latch to lock the peripheral crystal support in the fixing groove 11 in a manner of pushing against the peripheral crystal support, which is not limited in this embodiment.
In this embodiment, the first driving assembly 3 can drive the cutting assembly 2 to move, so that the cutting assembly 2 and the fixed structure 1 generate relative movement; the fixed structure 1 can also be driven to move, so that the cutting assembly 2 and the fixed structure 1 generate relative movement; the cutting assembly 2 and the fixing structure 1 can also be driven to move at the same time, so that the cutting assembly 2 and the fixing structure 1 move relatively, which is not limited in this embodiment;
as a specific implementation of the embodiment, the first driving assembly 3 drives the cutting assembly 2 to move, so that the cutting assembly 2 and the fixed structure 1 generate relative movement;
specifically, the first driving assembly 3 includes a motor-driven slide table 31 provided on the frame a, and a mounting bracket 32 provided on the motor-driven slide table 31;
the cutting assembly 2 comprises a first guide wheel 21 and a second guide wheel 22; the diamond wire 23 is in a ring shape and wound on the first guide wheel 21 and the second guide wheel 22; the first guide wheel 21 is driven to rotate by a second driving assembly 24; the first guide wheel 21 and the second guide wheel 22 are rotatably arranged on the mounting frame 32; the cutting assembly 2 is driven to move in a way that the electric sliding table 31 drives the mounting frame 32 to move;
the second driving assembly 24 comprises a driving motor and a rotating shaft which are arranged on the mounting frame 32, the driving motor is in transmission connection with the rotating shaft in a V-belt transmission mode, and the first guide wheel 21 is rotatably connected to the rotating shaft;
an auxiliary guide rail 33 is further arranged on the rack A and used for assisting the mounting frame 32 to move, and the stability of the mounting frame 32 in moving is guaranteed.
In the present embodiment, the first guide wheel 21, the second guide wheel 22, and the diamond wire 23 cooperate to form a cutting plane; the first guide wheel 21 is mounted on the mounting frame 32 through a first adjusting structure 4, and the second guide wheel 22 is mounted on the mounting frame 32 through a second adjusting structure 5; the first adjusting structure 4 is used for adjusting the distance between a first guide wheel 21 and the fixing groove 11, and the second adjusting structure 5 is used for adjusting the distance between a second guide wheel 22 and the fixing groove 11, so that the distance between the cutting plane and the fixing groove 11 is adjustable;
specifically, the cutting plane is arranged parallel to the fixing groove 11, and the first adjusting structure 4 and the second adjusting structure 5 are arranged to finely adjust the distance between the cutting plane and the fixing groove 11, so that the cutting plane can be cut corresponding to the first position.
In practical application, the fixing groove 11 and the diamond wire 23 may be arranged up and down or left and right; in the embodiment, the fixing groove 11 and the diamond wire 23 are arranged up and down, the first guide wheel 21 and the second driving assembly 24 are arranged on a mounting block 25, and the mounting block 25 is connected to the mounting frame 32 in a manner of sliding up and down; in practice, the mounting block 25 slides down due to the effect of gravity; the first adjusting structure 4 comprises a supporting member 41, the supporting member 41 is located below the mounting block 25, and the supporting member 41 extends upwards to limit the sliding of the mounting block 25; the supporting member 41 is mounted on the mounting frame 32 in a clamping manner so that the upward extending height of the supporting member 41 is adjustable, when the upward extending height of the supporting member 41 needs to be adjusted, the supporting member 41 is released, the upward extending height of the supporting member 41 is manually adjusted, and the supporting member 41 is locked after the adjustment is completed, so that the distance between the first guide wheel 21 and the fixing groove 11 is finely adjusted;
a clamping block 42 is arranged on the mounting frame 32, and the supporting piece 41 is locked through the matching of a bolt and the clamping block 42; the support 41 is of a cylindrical configuration.
The second adjusting structure 5 comprises a mounting column 51 and a thread block 52, the thread block 52 is fixedly connected to the mounting frame 32, and the mounting column 51 is provided with threads matched with the thread block 52; the second guide wheel 22 is rotatably connected to the mounting column 51, and the distance between the second guide wheel 22 and the fixing groove 11 is adjusted through a thread structure;
the distance between the first guide wheel 21 and the fixing groove 11 in this embodiment refers to the distance between the top surface of the first guide wheel 21 and the bottom surface of the fixing groove 11; the distance between the second guide wheel 22 and the fixing groove 11 refers to the distance between the top surface of the second guide wheel 22 and the bottom surface of the fixing groove 11.
In this embodiment, the device further comprises a coolant output pipe 6, wherein the coolant output pipe 6 is fixed on the mounting rack 32, and the output end of the coolant output pipe 6 is arranged towards the direction of the diamond wire 23; specifically, the outlet end of the coolant delivery tube 6 is arranged toward the first position, and functions to cool the cutting position and the diamond wire 23.
In practical application, the cut wafer can be received by manual operation, for example, the wafer can be received by holding the backing plate by hand, but the labor intensity is high, and the wafer is dropped by mistake;
in this embodiment, a wafer is received by a holding assembly 7, the holding assembly 7 includes a mounting plate 71, a limiting groove is disposed on the mounting plate 71, and a wafer support block 72 with a wafer support slot is disposed in the limiting groove; the wafer brackets are arranged with respect to the holding grooves 11; the mounting plate 71 can be driven to move close to or away from the fixing groove 11 by a third driving assembly 73;
specifically, the third driving assembly 73 is a cylinder arranged on the frame a, an output end of the cylinder is connected to the mounting plate 71, and the mounting plate 71 is driven to approach or move away from the fixing groove 11 by the cylinder;
in practical use, when the external crystal support is installed on the fixing groove 11, the external crystal rods cut into a plurality of wafers are arranged in a suspended manner, at the moment, the third driving assembly 73 drives the installation plate 71 to be close to the fixing groove 11 so that the wafer support blocks 72 support the external crystal rods, after the external crystal rods are cut by the cutting assembly 2, the wafers are separated one by one and are supported by the wafer support blocks 72, the wafers are prevented from falling and being damaged, manual operation is replaced, and labor intensity can be reduced;
after the cutting is completed, the third driving unit 73 drives the mounting plate 71 away from the fixing groove 11 so as to take out the wafer carrier 72.
Preferably, the wafer support device further comprises a clamping rod 74, wherein the clamping rod 74 is driven by a fourth driving assembly 75 to clamp the peripheral crystal bar in the wafer support groove; the fourth drive assembly 75 is disposed on the mounting plate 71;
after the wafer support block 72 supports the peripheral crystal bar, the fourth driving assembly 75 drives the clamping rod 74 to act to clamp the peripheral crystal bar in the wafer support groove, so that the stability of the peripheral crystal bar is ensured, and the stability of the cut wafer can be ensured;
specifically, the clamping rods 74 extend along the length direction of the wafer bracket, the number of the clamping rods 74 is 2, the clamping rods 74 are respectively arranged at two sides of the length direction of the wafer bracket, and the fourth driving component 75 is used for driving the clamping rods 74 to rotate towards the direction of the wafer bracket so that the clamping rods 74 clamp the peripheral crystal bar in the wafer bracket; the fourth driving assembly 75 is an air cylinder, the clamping rod 74 is provided with a rotating block with a toothed structure, a telescopic rod of the air cylinder is provided with a rack structure, and the telescopic rod of the air cylinder extends to drive the rotating block to rotate, so that the clamping rod 74 is driven to rotate;
the clamping rod 74 can also clamp the external crystal rod in a translational manner, which is not limited in this embodiment.
In practical use, the lengths of the peripheral crystal bars are different, and in order to ensure the adaptability of the automatic wafer taking machine to the peripheral crystal bars with different lengths, in this embodiment, two ends of the wafer bracket in the length direction are open ends; the wafer support also comprises 2 clamping plates 76, wherein the clamping plates 76 are used for limiting the peripheral crystal bar in the wafer support groove, and the clamping plates 76 can enter and exit the wafer support groove from the open end of the wafer support groove; the holding plates 76 are mounted on the wafer support block 72 through a third adjusting structure 8, so that the distance between 2 holding plates 76 is adjustable, and the distance between 2 holding plates 76 is adjusted according to the length of the peripheral crystal bar to be cut actually.
Specifically, the third adjustment structure 8 includes a mounting hole 81 disposed on the wafer holder 72, the mounting hole 81 extending along the length of the wafer holder; the clamping device further comprises a mounting rod 82 arranged on the clamping plate 76, wherein the mounting rod 82 is slidably connected in the mounting hole 81 and can be locked by a second locking piece 83;
wherein, the mounting holes 81 are 2 respectively arranged at two sides of the wafer bracket, one mounting rod 82 is inserted from one end of the wafer supporting block 72, and the other mounting rod 82 is inserted from the other end of the wafer supporting block 72;
the clamping plate 76 is connected to a mounting bar 82 by a connecting bar, and the mounting holes 81 communicate with the wafer support slots for the connecting bar to pass through.
The second locking member 83 is a bolt or a jackscrew, a threaded hole is formed in the wafer support block 72, and the mounting rod 82 is locked on the wafer support block 72 through the bolt or the jackscrew.
In this embodiment, the wafer support block 72 is further provided with a handle to facilitate the taking and placing of the wafer support block 72.
While embodiments of the present invention have been shown and described, it will be understood by those of ordinary skill in the art that: various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.
Claims (11)
1. An automatic wafer taking machine is characterized by comprising a fixing structure (1) for fixing an external wafer support; the cutting device is characterized by further comprising a cutting assembly (2) and a first driving assembly (3), wherein the first driving assembly (3) is used for enabling the cutting assembly (2) and the fixing structure (1) to move relatively so that the cutting assembly (2) can cut the peripheral substrate.
2. The automatic wafer taking machine according to claim 1, further comprising a frame (a), wherein the fixing structure (1) is a fixing groove (11) provided on the frame (a), one end of the fixing groove (11) is an open end into which an external wafer holder is inserted, two opposite sides of the fixing groove (11) are provided with clamping rods (12), and the clamping rods (12) extend in a length direction of the fixing groove (11) to enable the fixing groove (11) to form an i-shaped groove-shaped structure.
3. The automatic wafer picker according to claim 2, further comprising a first locking member (13), wherein the first locking member (13) is detachably connected to the fixing groove (11) for locking the external wafer holder in the fixing groove (11).
4. The automatic sheet taking machine according to claim 2, wherein the first driving assembly (3) comprises an electric sliding table (31) arranged on the frame (A), and a mounting rack (32) arranged on the electric sliding table (31);
the cutting assembly (2) comprises a first guide wheel (21) and a second guide wheel (22); the diamond wire (23) is in a ring shape and wound on the first guide wheel (21) and the second guide wheel (22); the first guide wheel (21) is driven to rotate by a second driving component (24); the first guide wheel (21) and the second guide wheel (22) are rotatably arranged on the mounting frame (32).
5. The automatic piece taking machine as claimed in claim 4, wherein the first guide wheel (21), the second guide wheel (22) and the diamond wire (23) are matched to form a cutting plane; the first guide wheel (21) is mounted on the mounting frame (32) through a first adjusting structure (4), and the second guide wheel (22) is mounted on the mounting frame (32) through a second adjusting structure (5); the first adjusting structure (4) is used for adjusting the distance between a first guide wheel (21) and the fixing groove (11), and the second adjusting structure (5) is used for adjusting the distance between a second guide wheel (22) and the fixing groove (11), so that the distance between the cutting plane and the fixing groove (11) is adjustable.
6. The automatic pelleter according to claim 5, characterized in that the first guide wheel (21) and the second drive assembly (24) are arranged on a mounting block (25), and the mounting block (25) is connected to the mounting frame (32) in a manner that the mounting block can slide up and down; the first adjusting structure (4) comprises a support (41), the support (41) is positioned below the mounting block (25), and the support (41) extends upwards to limit the sliding of the mounting block (25); the supporting part (41) is installed on the mounting rack (32) in a clamping mode so that the height of the supporting part (41) extending upwards is adjustable;
the second adjusting structure (5) comprises a mounting column (51) and a thread block (52), the thread block (52) is fixedly connected to the mounting frame (32), and threads matched with the thread block (52) are arranged on the mounting column (51); the second guide wheel (22) is rotatably connected to the mounting column (51).
7. The automatic wafer taking machine according to claim 4, characterized by further comprising a cooling liquid outlet pipe (6), wherein the cooling liquid outlet pipe (6) is fixed on the mounting frame (32), and the outlet end of the cooling liquid outlet pipe (6) is arranged towards the diamond wire (23).
8. The automatic wafer taking machine as claimed in claim 1, further comprising a clamping assembly (7), wherein the clamping assembly (7) comprises a mounting plate (71), a limiting groove is arranged on the mounting plate (71), and a wafer supporting block (72) with a wafer supporting groove is placed in the limiting groove; the wafer carrier is arranged relative to the holding groove (11); the mounting plate (71) is movable toward and away from the fixing groove (11) by a third driving assembly (73).
9. The automatic wafer extractor as claimed in claim 8, further comprising a clamping rod (74), wherein the clamping rod (74) is driven by a fourth driving assembly (75) for clamping the peripheral crystal bar in the wafer bracket; the fourth drive assembly (75) is disposed on the mounting plate (71).
10. The automatic wafer taking machine as claimed in claim 8, wherein both ends of the wafer bracket in the length direction are open ends; the wafer support also comprises 2 clamping plates (76) used for limiting the external crystal bar in the wafer support groove; the clamping plates (76) are arranged on the wafer support block (72) through a third adjusting structure (8), so that the distance between 2 clamping plates (76) is adjustable.
11. The automatic wafer extractor as claimed in claim 10, wherein the third adjusting structure (8) comprises a mounting hole (81) provided on the wafer tray (72), the mounting hole (81) extending along a length direction of the wafer tray; the clamping device further comprises a mounting rod (82) arranged on the clamping plate (76), wherein the mounting rod (82) is connected in the mounting hole (81) in a sliding mode and can be locked through a second locking piece (83).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210471056.XA CN114932636B (en) | 2022-04-28 | 2022-04-28 | Automatic sheet taking machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210471056.XA CN114932636B (en) | 2022-04-28 | 2022-04-28 | Automatic sheet taking machine |
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| Publication Number | Publication Date |
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| CN114932636A true CN114932636A (en) | 2022-08-23 |
| CN114932636B CN114932636B (en) | 2023-10-24 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202210471056.XA Active CN114932636B (en) | 2022-04-28 | 2022-04-28 | Automatic sheet taking machine |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116587451A (en) * | 2023-06-21 | 2023-08-15 | 苏州博宏源机械制造有限公司 | Semiconductor wafer material processing device and method |
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| WO2021258558A1 (en) * | 2020-06-24 | 2021-12-30 | 纵达电器有限公司 | Automatic welding tool for circuit breaker coil assembly |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN116587451A (en) * | 2023-06-21 | 2023-08-15 | 苏州博宏源机械制造有限公司 | Semiconductor wafer material processing device and method |
| CN116587451B (en) * | 2023-06-21 | 2024-01-26 | 苏州博宏源机械制造有限公司 | Semiconductor wafer material processing device and method |
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| CN114932636B (en) | 2023-10-24 |
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