CN114895587A - Microwave sensing control module - Google Patents
Microwave sensing control module Download PDFInfo
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- CN114895587A CN114895587A CN202210438384.XA CN202210438384A CN114895587A CN 114895587 A CN114895587 A CN 114895587A CN 202210438384 A CN202210438384 A CN 202210438384A CN 114895587 A CN114895587 A CN 114895587A
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B19/00—Programme-control systems
- G05B19/02—Programme-control systems electric
- G05B19/04—Programme control other than numerical control, i.e. in sequence controllers or logic controllers
- G05B19/042—Programme control other than numerical control, i.e. in sequence controllers or logic controllers using digital processors
- G05B19/0423—Input/output
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B20/00—Energy efficient lighting technologies, e.g. halogen lamps or gas discharge lamps
- Y02B20/40—Control techniques providing energy savings, e.g. smart controller or presence detection
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Abstract
The invention discloses a microwave sensing control module, which integrates main functional devices on the same PCB substrate, can create conditions for reducing the whole volume of an inductor, does not need to configure an independent power supply voltage stabilizer and a corresponding circuit for the inductor, and greatly simplifies the design circuit of the inductor; by adopting a mature CMOS process, fully utilizing a digital-analog hybrid technology, simultaneously integrating a microwave transceiver, a radar intermediate frequency amplification circuit, a signal processor and the like on a single chip, compared with the traditional radar sensing module, the sensor has good consistency and ultrahigh cost performance; the chip is defaulted to work in a 5.8GHz ISM frequency band, the frequency is flexible and configurable, and various interference problems can be effectively solved due to the integration of the self-adaptive calibration algorithm on the chip, so that the reliability and the practicability of the sensor are greatly improved; the chip is internally integrated with a signal processor which can directly output induction control signals, and a small number of components are matched at the periphery of the chip to form a complete microwave induction sensor; human control can be reduced.
Description
Technical Field
The invention relates to the technical field of multimedia processing, in particular to a microwave sensing control module.
Background
The microwave sensor is widely used for sensing detection in the fields of moving objects, liquid, gas flow and the like, microwave signals pass through a transmitting and receiving antenna device according to the Doppler principle to generate difference frequency signals, and the difference frequency signals are output by utilizing a frequency mixer to detect, so that the sensing detection of the moving objects, the liquid and the gas flow is realized, and the control purpose is achieved. The microwave sensor can work in an environment of-20-70 degrees, and has a wide temperature range and high induction sensitivity. The microwave sensor belongs to an independent electronic component, is a circuit module group comprising a circuit board and a microwave device, has larger appearance volume, can work only by designing an active peripheral circuit during use, is mostly present on the market in the form of a composition product at present, and has certain technical requirements on object movement induction signal processing due to higher frequency of microwave detection signals, so that the application of the microwave sensor is limited.
At present, the ubiquitous problem of current microwave inductor lies in: the main devices of the inductor, such as a microwave transmitter, a signal processor, a power supply voltage stabilizer and the like, are mainly subjected to device type selection, layout and structural design in a split mode; therefore, the complexity of the design circuit and the manufacturing process of the inductor can be greatly increased, the signal anti-interference capability is reduced, and the double-layer stacked PCB substrate is often adopted to carry out partition arrangement on each main device, so that the application range of the inductor is greatly limited due to overlarge volume and overhigh production cost of the product. In view of this, it is necessary to provide an improvement to the existing microwave inductors.
Disclosure of Invention
The invention aims to provide a microwave sensing control module which integrates main functional devices on the same PCB substrate, can create conditions for reducing the whole volume of an inductor, does not need to configure an independent power supply voltage stabilizer and a corresponding circuit for the inductor, and can effectively solve various simplified technical problems.
The utility model provides a microwave sensing control module group, includes the PCB board, the PCB board is 26mm 14 mm's rectangle structure setting, the integration of PCB board top layer has the circuit layer, circuit layer welding installs power module and a plurality of electronic component module, power module and electronic component module through integrated circuit with circuit layer electric connection, power module is located one side of circuit layer major diameter, the top of PCB board and be located around every electronic component module all fixed mounting have a corresponding a set of soldering tin of preventing to take off the subassembly, the electronic component module is including still set up microwave transmission receiving module, potentiometre, electrolytic capacitor and the first singlechip chip on the circuit layer; and the circuit of the circuit layer is optimally integrated on the first singlechip chip, and elements on the circuit layer are reduced through the control of the first singlechip chip so as to reduce the volume of the microwave sensing control module.
In the microwave sensing control module, the circuit layer has a laminated structure and comprises, from top to bottom, a top circuit layer, a first laminated layer, a first middle circuit layer, a core plate layer, a second middle circuit layer, a second laminated layer and a bottom circuit layer, wherein the first middle circuit layer, the core plate layer and the second middle circuit layer are printed circuit layers; the top layer circuit layer and the bottom layer circuit layer are anti-metal coating layers; the first pressing layer and the second pressing layer are adhesive layers.
In the microwave sensing control module, the power module is used for being electrically connected with an external power supply and supplying power to the electronic element module after processing voltage and current, and the power module comprises a relay and a voltage stabilizer, and a voltage stabilizing circuit electrically connected with the relay and the voltage stabilizer is used for supplying power to the microwave transmitting and receiving module, the potentiometer, the electrolytic capacitor, the first singlechip chip and the second singlechip chip.
In the microwave sensing control module, the power module, the potentiometer, the electrolytic capacitor, the first singlechip chip and the second singlechip chip are arranged on the front surface of the circuit layer; the back of the circuit layer is provided with the microwave transmitting and receiving module and the reference ground of the antenna group.
In the microwave sensing control module, the antenna group is arranged on the back surface of the first single chip, and the antenna group is connected with the first single chip through a wire, so that the receiving and transmitting isolation affects the bottom noise of the microwave transmitting and receiving module, and the antenna group is a double antenna arranged at intervals.
In the microwave sensing control module, the antenna group is a coil formed by winding a metal wire or formed by a conductive circuit on a printed circuit board, and the coil is used for receiving the radio frequency signal transmitted by the microwave transmitting and receiving module and transmitting signal data under the control of the first single chip microcomputer chip.
In the microwave sensing control module, the first single chip microcomputer chip includes a parameter configuration interface, the parameter configuration interface is used for configuring working parameters of the low-power microwave radar sensor, the parameter configuration interface includes a serial interface or a parallel interface, and the working parameters include an induction distance parameter and/or a switch delay time.
In the microwave sensing control module, the first single chip microcomputer chip and the second single chip microcomputer chip include digital-to-analog conversion and/or digital signal processing, so as to output the switch control signal after the sensing signal is subjected to the digital signal processing.
In the microwave sensing control module, two positioning holes are formed in two sides of the PCB.
The technical scheme has the following advantages or beneficial effects:
the microwave sensing control module integrates main functional devices on the same PCB substrate, can create conditions for reducing the whole volume of the inductor, does not need to configure an independent power supply voltage stabilizer and a corresponding circuit for the inductor, and greatly simplifies the design circuit of the inductor; the system adopts a mature CMOS process, fully utilizes a digital-analog hybrid technology, simultaneously integrates a microwave transceiver, a radar intermediate frequency amplification circuit, a signal processor and the like on a single chip, is a fully integrated SOC, and has good consistency and ultrahigh cost performance compared with the traditional radar sensing module; the chip is defaulted to work in a 5.8GHz ISM frequency band, the frequency is flexible and configurable, and various interference problems can be effectively solved due to the integration of the self-adaptive calibration algorithm on the chip, so that the reliability and the practicability of the sensor are greatly improved; the AT5815 integrates the LDO and adopts an ultra-low power consumption architecture, and because the power consumption is low and the wide voltage is supported, the power supply scheme directly adopts a battery for power supply and keeps a long-time standby state; the chip is internally integrated with a signal processor which can directly output induction control signals, and a small number of components are matched at the periphery of the chip to form a complete microwave induction sensor; human control can be reduced. The circuit has the advantages of simple structure, strong anti-interference capability, small volume, low manufacturing cost, and strong practical value and market popularization value.
Drawings
Fig. 1 is a schematic structural diagram of a microwave sensing control module according to the present invention;
FIG. 2 is a schematic structural diagram of the front side of the circuit layer of the present invention;
FIG. 3 is a schematic view of the reverse structure of the wiring layer of the present invention;
FIG. 4 is a schematic structural diagram of a front surface of a circuit layer according to another embodiment of the present invention;
fig. 5 is a schematic structural view of the reverse side of the wiring layer in another embodiment of the present invention.
Detailed Description
In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below.
With reference to fig. 1 to 3, a microwave sensing control module includes a PCB, the PCB is a 26mm × 14mm rectangular structure, a circuit layer 1 is integrated on a top layer of the PCB, a power module 2 and a plurality of electronic component modules 3 are welded on the circuit layer 1, the power module 2 and the electronic component modules 3 are electrically connected to the circuit layer 1 through an integrated circuit, the power module 2 is located on one side of a long diameter of the circuit layer 1, a corresponding set of solder-detachment prevention assemblies are fixedly mounted on a top of the PCB and around each electronic component module, and the electronic component modules 3 include a microwave transmitting and receiving module 31, a potentiometer, an electrolytic capacitor and a first monolithic chip 32, which are further disposed on the circuit layer 1; by optimally integrating the circuit of the circuit layer 1 onto the first single chip 32, the elements on the circuit layer 1 are reduced through the control of the first single chip 32, so as to reduce the volume of the microwave sensing control module.
By integrating main functional devices of the inductor on the same PCB substrate, conditions can be created for reducing the whole volume of the inductor, and the characteristic that a low-voltage linear voltage stabilizer is arranged in the microwave transmitting and receiving module is utilized, so that an independent power supply voltage stabilizer and a corresponding circuit are not required to be configured for the inductor, the design circuit of the inductor is greatly simplified, a sufficient arrangement space is provided for the microwave transmitting and receiving module on the PCB substrate, and the microwave transmitting and receiving module can obtain working voltage through the first single chip microcomputer chip 32, so that the unified management of the working power supply of the corresponding device is realized; based on this, the inductor of this embodiment completely avoids the microwave emitter, signal processing device and power regulator of traditional microwave inductor's main device because of adopting the structural layout mode of components of a whole that can function independently and easily increase the complexity of design circuit, the volume is too big and be difficult to reduce scheduling problem.
The electronic component module 3 further includes a delay unit electrically connected to the first single chip 32 for controlling the operation in a delayed manner.
The first monolithic chip 32 is electrically connected to the microwave transceiver module 31 to receive the microwave sensing signal and modulate the adjusting signal according to the microwave sensing signal, where the microwave transceiver module 31 may be a microwave antenna.
Further, in a preferred embodiment of the microwave sensing control module of the present invention, the circuit layer 1 is a laminated structure and includes, from top to bottom, a top circuit layer, a first lamination layer, a first middle circuit layer, a core board layer, a second middle circuit layer, a second lamination layer, and a bottom circuit layer, wherein the first middle circuit layer, the core board layer, and the second middle circuit layer are printed circuit layers; the top layer circuit layer and the bottom layer circuit layer are anti-metal coating layers; the first pressing layer and the second pressing layer are adhesive layers. The thickness of the top layer circuit layer is 0.035mm, the thickness of the first laminating layer is 0.2mm, the thickness of the first middle circuit layer is 0.0175mm, the thickness of the core layer is 1.065mm, the thickness of the second middle circuit layer is 0.0175mm, the thickness of the second laminating layer is 0.2mm, and the thickness of the bottom layer circuit layer is 0.035 mm. The first intermediate circuit layer, the core board layer and the second intermediate circuit layer form a copper-containing core board with the thickness of 1.1 mm.
Further, in a preferred embodiment of the microwave sensing control module of the present invention, the power module 2 is configured to be electrically connected to an external power source and to supply power to the electronic component module 3 after processing voltage and current, and the power module 2 includes a relay and a voltage regulator, and the microwave transmitting and receiving module 31, the potentiometer, the electrolytic capacitor, the first monolithic chip 32, and the second monolithic chip 33 are powered by a voltage regulator circuit electrically connected to the relay and the voltage regulator.
Further, in a preferred embodiment of the microwave sensing control module of the present invention, the front surface of the circuit layer 1 is provided with the power module 2, a potentiometer, an electrolytic capacitor, a first monolithic chip 32 and a second monolithic chip 33; the back of the circuit layer 1 is provided with the reference ground of the microwave transmitting and receiving module 31 and the antenna group 34.
The front side of the microwave sensing control module comprises a radar sensing chip, a transceiving antenna, a contact pin and the like, the back side of the microwave sensing control module is a reference ground of a microwave circuit and an antenna, the transceiving isolation degree has large influence on the radar bottom noise, the isolation degree between the transceiving antennas is considered particularly during layout, electromagnetic field simulation needs to be carried out on the miniaturized double-fed antenna aiming at the antenna isolation degree, in addition, a double-antenna form can be adopted under the condition that the size allows, and the distance between the transceiving antennas is pulled open as much as possible to ensure the optimization of the antenna performance.
Further, in a preferred embodiment of the microwave sensing control module of the present invention, an antenna group 34 is disposed on a back surface of the first single chip 32, and the antenna group 34 is connected to the first single chip 32 through a wire, and because the receiving and transmitting isolation affects the bottom noise of the microwave transmitting and receiving module 31, the antenna group 34 is a dual antenna that is disposed at an interval.
Further, in a preferred embodiment of the microwave sensing control module of the present invention, the antenna group is a coil wound by a metal wire or formed by a conductive circuit on a printed circuit board, and the coil is configured to receive the radio frequency signal transmitted by the microwave transmitting and receiving module 31 and send signal data under the control of the first monolithic chip 32.
In order to ensure the reception effect or reception intensity of the reflected wave signal, copper-clad shielding is not performed on the region corresponding to the antenna group 34 on the back surface of the circuit layer 1. Therefore, the reflected signals can be ensured to be effectively received by the antenna group 34 after passing through the circuit layer 1; in specific implementation, the line width and the waveform amplitude of the antenna group 34 can be properly widened, and the vias are densely distributed on the serpentine copper foil microstrip line, so as to improve the strength and the sensitivity of the sensing signal.
Further, in a preferred embodiment of the microwave sensing control module of the present invention, the integrated circuit includes an oscillating circuit, a harmonic suppression network, a mixing detection unit, a frequency selection module, and a signal processing unit, wherein the oscillating circuit has a power supply line and is configured to allow dc power supplied from the power supply line to generate an excitation current of a corresponding frequency; the harmonic suppression network comprises at least a high-frequency equivalent capacitor, wherein one end of the high-frequency equivalent capacitor is electrically connected to the oscillating circuit, the other end of the high-frequency equivalent capacitor is grounded so as to maintain the conducting state of the power supply line under direct current and allow the oscillating circuit to be powered by direct current from the power supply line, and at least one stage of LC filter network is formed by the electrical characteristics of the power supply line, which are equivalent to inductance, under the action of high-frequency excitation current and the harmonic suppression network, so that the conduction and radiation of the corresponding harmonic in the excitation current on the power supply line are suppressed in a manner that the power supply line filters the corresponding harmonic of the excitation current; wherein the antenna loop is electrically coupled to the oscillator circuit at the feed point of the radiation source, wherein when the oscillator circuit is powered by a dc current to generate an excitation current of a corresponding frequency, the antenna loop transmits a microwave beam in response to the excitation current and receives a corresponding echo formed by the microwave beam reflected by at least one object; wherein the mix detection unit is electrically coupled to the oscillation circuit and the antenna loop to output a Doppler intermediate frequency signal corresponding to a frequency difference between the excitation current and a corresponding echo of the microwave beam based on a Doppler effect principle; wherein the frequency selection module is coupled between the mixer-demodulation unit and the antenna loop to form a frequency selection network between the mixer-demodulation unit and the antenna loop, and the echo signal corresponding to the echo is frequency-selected by the frequency selection network and transmitted to the mixer-demodulation unit through the frequency selection module; the signal processing unit is electrically coupled to the mixed detection unit and includes a low-pass amplification module and a filtering module, wherein the signal processing unit receives the doppler intermediate frequency signal output by the mixed detection unit and outputs a fluctuation signal corresponding to a variation trend of the doppler intermediate frequency signal based on the amplification and filtering processing of the doppler intermediate frequency signal by the low-pass amplification module and the filtering module, and then a characteristic parameter of fluctuation in the fluctuation signal corresponds to a characteristic of an action of the object.
Preferably, the harmonic suppression network includes a plurality of high-frequency equivalent capacitors, wherein one end of each of the high-frequency equivalent capacitors is electrically connected to the power supply line of the oscillation circuit at intervals, and the other end of each of the high-frequency equivalent capacitors is grounded to form a circuit relationship in which the high-frequency equivalent capacitors are connected in parallel with each other through at least one section of the power supply line.
The oscillation circuit is a nonlinear load that inevitably generates harmonics corresponding to a multiple of a fundamental frequency in the excitation current due to a nonlinear relationship between a current flowing through the oscillation circuit and a voltage applied thereto when being supplied with a direct current, wherein a response of the antenna loop to the harmonics of the excitation current is suppressed due to a matching relationship of the antenna loop to the respective oscillation circuit to radiate the microwave beam corresponding to the fundamental frequency of the excitation current mainly in response to the fundamental frequency of the excitation current. However, since the line of the oscillation circuit is in a high impedance state and has a certain length under the action of the excitation current of high frequency, the line of the oscillation circuit can conduct the excitation current and be modulated by the excitation current to radiate microwaves corresponding to the frequency of the excitation current, including stray microwaves corresponding to harmonics of the excitation current, particularly higher harmonic radiation corresponding to higher harmonics of the excitation current that are liable to produce a modulating action on the corresponding line.
Further, in a preferred embodiment of the microwave sensing control module according to the present invention, the first single chip 32 includes a parameter configuration interface, the parameter configuration interface is configured to configure operating parameters of the low power consumption microwave radar sensor, the parameter configuration interface includes a serial interface or a parallel interface, and the operating parameters include an inductive distance parameter and/or a switching delay time.
Further, in a preferred embodiment of the microwave sensing control module according to the present invention, the first single chip 32 includes digital-to-analog conversion and/or digital signal processing, so as to output the switch control signal after performing digital signal processing on the sensing signal.
Furthermore, in another embodiment of the present invention, two positioning holes are disposed on two sides of the PCB.
The microwave sensing control module circuit is designed by adding a microwave sensing circuit module on the basis of a traditional driving power supply, wherein the sensor module is a moving object detector designed by utilizing the Doppler effect principle, converts sensed microwaves (physical signals) into electric signals (current), performs filtering amplification effect through an amplification circuit with adjustable amplification factor, feeds back the electric signals to a control circuit, and the control circuit analyzes the signals.
Microwave signals generated inside the chip are amplified and radiated out through an antenna, the signals are reflected when encountering objects in the air, when the objects are in a motion state, a certain frequency difference exists between the reflected signals and the transmitted signals, namely Doppler effect, the received reflected signals and the transmitted signals are mixed to obtain corresponding intermediate frequency signals, and the intermediate frequency signals are analyzed to reversely deduce the motion information of the objects, so that the sensing function is realized.
The device of this application embodiment uses amplifier circuit to carry out the enlarged filtering action to the microwave, makes under extreme place and the extreme condition, and faint microwave signal is unlikely to lose and can't be detected, has increased the stability and the reliability that detect, compares the reliability with traditional infrared induction feedback circuit and is higher. In addition, the microwave induction can penetrate through partial non-metal object induction, is particularly suitable for being hidden and installed inside an electric appliance, is wide in application range, and can be matched with various common electric appliances to form a microwave induction electric appliance.
The microwave sensing control module integrates main functional devices on the same PCB substrate, can create conditions for reducing the whole volume of the inductor, does not need to configure an independent power supply voltage stabilizer and a corresponding circuit for the inductor, and greatly simplifies the design circuit of the inductor; the system adopts a mature CMOS process, fully utilizes a digital-analog hybrid technology, simultaneously integrates a microwave transceiver, a radar intermediate frequency amplification circuit, a signal processor and the like on a single chip, is a fully integrated SOC, and has good consistency and ultrahigh cost performance compared with the traditional radar sensing module; the chip is defaulted to work in a 5.8GHz ISM frequency band, the frequency is flexible and configurable, and various interference problems can be effectively solved due to the integration of the self-adaptive calibration algorithm on the chip, so that the reliability and the practicability of the sensor are greatly improved; the AT5815 integrates the LDO and adopts an ultra-low power consumption architecture, and because the power consumption is low and the wide voltage is supported, the power supply scheme directly adopts a battery for power supply and keeps a long-time standby state; the chip is internally integrated with a signal processor which can directly output induction control signals, and a small number of components are matched at the periphery of the chip to form a complete microwave induction sensor; human control can be reduced. The circuit has the advantages of simple structure, strong anti-interference capability, small volume, low manufacturing cost, and strong practical value and market popularization value.
While the invention has been described with reference to a preferred embodiment, it will be understood by those skilled in the art that various changes in form and detail may be made therein without departing from the spirit and scope of the invention.
In the description of the present invention, it is to be understood that the terms "upper", "lower", "front", "rear", and the like, which indicate orientations or positional relationships, are based on the orientations or positional relationships shown in the drawings, are only for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the referred devices or elements must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention.
Claims (9)
1. The utility model provides a microwave sensing control module group, includes the PCB board, the PCB board is 26mm 14 mm's rectangle structure setting, a serial communication port, PCB board top layer integration has circuit layer (1), circuit layer (1) welding installation has power module (2) and a plurality of electronic component module (3), power module (2) and electronic component module (3) through integrated circuit with circuit layer (1) electric connection, power module (2) are located one side of circuit layer (1) major diameter, the top of PCB board and be located all fixed mounting around every electronic component module have a corresponding a set of soldering tin of preventing to take off the subassembly, electronic component module (3) including still set up microwave transmission receiving module (31), potentiometre, electrolytic capacitor and first singlechip chip (32) on circuit layer (1); by optimally integrating the circuit of the circuit layer (1) onto the first single chip (32), the elements on the circuit layer (1) are reduced through the control of the first single chip (32) so as to reduce the volume of the microwave sensing control module.
2. The microwave sensing control module according to claim 1, wherein the circuit layer (1) is a laminated structure and comprises a top circuit layer, a first laminated layer, a first middle circuit layer, a core layer, a second middle circuit layer, a second laminated layer and a bottom circuit layer from top to bottom, wherein the first middle circuit layer, the core layer and the second middle circuit layer are printed circuit layers; the top layer circuit layer and the bottom layer circuit layer are anti-metal coating layers; the first pressing layer and the second pressing layer are adhesive layers.
3. The microwave sensing control module according to claim 1, wherein the power module (2) is configured to be electrically connected to an external power source and process voltage and current to supply power to the electronic component module (3), and the power module (2) includes a relay and a voltage regulator, and a voltage regulator circuit electrically connected to the relay and the voltage regulator is configured to supply power to the microwave transceiver module (31), the potentiometer, the electrolytic capacitor, the first monolithic chip (32), and the second monolithic chip (33).
4. The microwave sensing control module according to claim 1, characterized in that the power module (2), the potentiometer, the electrolytic capacitor, the first monolithic chip (32) and the second monolithic chip (33) are arranged on the front surface of the circuit layer (1); the back of the circuit layer (1) is provided with the microwave transmitting and receiving module (31) and the reference ground of the antenna group (34).
5. The microwave sensing control module as claimed in claim 4, wherein an antenna group (34) is disposed on a back surface of the first single chip (32) and the antenna group (34) is connected to the first single chip (32) by a wire, and the antenna group (34) is a dual antenna arranged at intervals because the transceiver isolation has an influence on the bottom noise of the microwave transceiver module (31).
6. The microwave sensing control module according to claim 5, wherein the antenna group is a coil wound by a metal wire or formed by a conductive circuit on a printed circuit board, and the coil is used for receiving the radio frequency signal transmitted (31) by the microwave transmitting and receiving module and transmitting signal data under the control of the first single chip (32).
7. The microwave sensing control module according to claim 1, characterized in that the first one-chip microcomputer chip (32) comprises a parameter configuration interface for configuring operating parameters of the low power microwave radar sensor, the parameter configuration interface comprising a serial interface or a parallel interface, the operating parameters comprising a sensing distance parameter and/or a switching delay time.
8. The microwave sensing control module according to claim 1, characterized in that the first monolithic chip (32) comprises digital-to-analog conversion and/or digital signal processing to output the switch control signal after the digital signal processing of the sensing signal.
9. The microwave sensing control module as claimed in claim 1, wherein two positioning holes are provided on two sides of the PCB.
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| CN202210438384.XA CN114895587A (en) | 2022-04-25 | 2022-04-25 | Microwave sensing control module |
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| CN202210438384.XA CN114895587A (en) | 2022-04-25 | 2022-04-25 | Microwave sensing control module |
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