CN114892248B - Electroplating clamp - Google Patents
Electroplating clamp Download PDFInfo
- Publication number
- CN114892248B CN114892248B CN202210619171.7A CN202210619171A CN114892248B CN 114892248 B CN114892248 B CN 114892248B CN 202210619171 A CN202210619171 A CN 202210619171A CN 114892248 B CN114892248 B CN 114892248B
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- conductive
- wafer
- bearing
- component
- ring
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- 238000009713 electroplating Methods 0.000 title claims abstract description 39
- 238000007789 sealing Methods 0.000 claims abstract description 63
- 230000007246 mechanism Effects 0.000 claims abstract description 41
- 238000002788 crimping Methods 0.000 claims abstract description 24
- 238000003825 pressing Methods 0.000 claims abstract description 13
- 230000006835 compression Effects 0.000 claims abstract description 7
- 238000007906 compression Methods 0.000 claims abstract description 7
- 230000002093 peripheral effect Effects 0.000 claims description 24
- 210000004907 gland Anatomy 0.000 claims description 20
- 238000007747 plating Methods 0.000 claims description 17
- 230000000149 penetrating effect Effects 0.000 claims description 8
- 239000003792 electrolyte Substances 0.000 claims description 6
- 230000005684 electric field Effects 0.000 claims description 5
- 229910021645 metal ion Inorganic materials 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 238000003754 machining Methods 0.000 abstract description 2
- 239000000306 component Substances 0.000 description 46
- 239000007788 liquid Substances 0.000 description 6
- 230000009471 action Effects 0.000 description 5
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000008358 core component Substances 0.000 description 1
- 230000000881 depressing effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/06—Suspending or supporting devices for articles to be coated
- C25D17/08—Supporting racks, i.e. not for suspending
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/12—Semiconductors
Abstract
The application relates to the technical field of electrochemical machining in chip manufacturing, in particular to an electroplating clamp. The electroplating clamp comprises a sealing conductive mechanism and a bearing conductive mechanism; the bearing conductive mechanism comprises a bearing component provided with a wafer positioning groove; the sealing conductive mechanism comprises a first sealing component, a crimping component and an annular conductive elastic piece, the annular conductive elastic piece is arranged around the wafer positioning groove, the inner ring of the annular conductive elastic piece extends into the wafer positioning groove and is suspended relative to the wafer positioning groove, and the crimping component is arranged on the annular conductive elastic piece in a pressing mode and is provided with a through hole; the first seal assembly includes at least a first seal member; the compression joint assembly is detachably connected with the bearing assembly, so that the first sealing component is pressed between the annular conductive elastic sheet and the wafer. The electroplating clamp realizes the upgrading of the wafer in a conductive manner from point contact to surface contact, remarkably improves the conductive uniformity of the wafer, and can improve the current density uniformity and the product yield of the front surface of the wafer by effective sealing.
Description
Technical Field
The application relates to the technical field of electrochemical machining in chip manufacturing, in particular to an electroplating clamp.
Background
In the chip manufacturing process, the wafer surface needs to be electroplated to form a metal layer. Wafer electroplating is one of the key links in the semiconductor manufacturing process, and is characterized in that a wafer is placed in electroplating liquid, negative voltage is connected to the wafer as a cathode, positive voltage is connected to a soluble or insoluble anode, and metal ions in the electroplating liquid are deposited on the surface of the wafer under the action of an electric field.
The wafer electroplating clamp is a core component of electroplating equipment, and the electric conduction uniformity and the tightness of the wafer electroplating clamp directly influence the plating thickness uniformity and the product yield of the wafer.
At present, the wafer electroplating clamp on the market has poor conductive uniformity, and non-sealing type positioning is adopted for the wafer, so that the back surface (surface needing to be electroplated) and the front surface (surface needing to be electroplated) of the wafer are always kept in contact with the plating solution at the same time when the wafer is electroplated, and the problems of current density uniformity on the front surface of the wafer, damage to the pattern on the back surface of the wafer and the like are caused due to the electric field shunt phenomenon, so that the product yield is lower.
Disclosure of Invention
The purpose of the application is to provide an electroplating clamp to solve the technical problem that the thickness uniformity of a wafer plating layer and the yield of a product are in a lower level in the prior art to a certain extent.
The application provides an electroplating clamp, which comprises a sealing conductive mechanism and a bearing conductive mechanism;
the bearing conductive mechanism comprises a bearing component, and the bearing component is provided with a wafer positioning groove matched with the wafer;
the sealing conductive mechanism comprises a first sealing component, a crimping component and an annular conductive elastic piece, wherein the annular conductive elastic piece is arranged around the wafer positioning groove, an inner ring of the annular conductive elastic piece stretches into the wafer positioning groove and is suspended relative to the wafer positioning groove, and the crimping component is pressed on the annular conductive elastic piece and is provided with a through hole corresponding to the wafer positioning groove;
the first sealing component at least comprises a first sealing member arranged on the crimping component corresponding to the edge of the through hole;
the crimping assembly is detachably connected with the bearing assembly, so that the first sealing member is pressed between the annular conductive elastic sheet and the wafer.
In the above technical solution, further, the sealed conductive mechanism further includes a plurality of fastening connectors and a plurality of elastic compression columns;
the annular conductive elastic sheet comprises an inner ring part and an outer ring part, wherein the inner ring of the outer ring part is connected with the outer ring of the inner ring part, the outer ring part is connected with the bearing assembly through a plurality of fastening connectors, one end of each elastic pressing column is connected with the crimping assembly, the other end of each elastic pressing column is abutted to the inner ring part, and the inner ring part bends towards the bottom of the wafer positioning groove relative to the outer ring part.
In any of the above solutions, further, the load-bearing conductive mechanism further includes a second sealing component and a conductive component;
the conductive component is arranged in the bearing component in a penetrating way, one end of the conductive component is exposed relative to the bearing component, and the other end of the conductive component is electrically connected with the annular conductive elastic sheet;
the second sealing component is arranged at the connection gap between the conductive component and the bearing component.
In any of the above technical solutions, further, the bearing assembly includes a cylindrical bearing body and a locking pin, where the locking pin is disposed on a peripheral sidewall of the bearing body;
the crimping assembly comprises a cylindrical connecting sleeve and a gland part provided with the through hole, the gland part is connected with the top end opening of the connecting sleeve, a locking chute is arranged on the inner peripheral side wall of the connecting sleeve, the first end of the locking chute is communicated with one end, far away from the gland part, of the connecting sleeve, and the second end of the locking chute is inclined unidirectionally towards the gland part along the circumferential direction of the connecting sleeve;
the locking pin slides into the locking chute through the first end of the locking chute, and the connecting sleeve and the bearing main body can be locked by relatively rotating the bearing assembly and the connecting sleeve, so that the gland part presses the top of the bearing assembly.
In any of the above technical solutions, further, the plating jig further includes a guide pin telescopically disposed on the bearing body, and a guide groove adapted to the guide pin is formed on an inner peripheral side wall of the connection sleeve;
when the guide pin is aligned with the guide slot, the locking pin is aligned with the first end of the locking chute.
In any of the above solutions, further, the carrier body includes a locking ring, a carrier plate, and a chuck stacked in sequence;
the locking pin is arranged on the peripheral side wall of the locking ring, the chuck is deviated from the surface of the bearing disc to form the top of the bearing main body, and the guide pin is arranged on the peripheral side wall of the chuck.
In any of the above technical solutions, further, the conductive component includes a conductive connection block, a conductive sheet, and a conductive column;
the bearing plate is provided with a mounting ring and a positioning ring, the positioning ring is sleeved on the outer side of the mounting ring at intervals, the bearing plate is provided with a power connection hole communicated with the hollow part of the mounting ring, the conductive connecting block is arranged in the power connection hole of the mounting ring, and the top of the conductive connecting block extends out of the bearing plate through the power connection hole;
the conductive column penetrates through the chuck, the bottom end of the conductive column is electrically connected with the top end of the conductive connecting block through the conductive sheet, and the top end of the conductive column is in contact with the annular conductive elastic sheet and forms electrical connection;
the number of the conductive posts is multiple, the conductive posts are distributed at intervals along the circumferential direction of the outer ring part, and the conductive posts are electrically connected with the conductive connecting blocks through the conductive sheets.
In any of the above technical solutions, further, the plating jig further includes a mounting plate mechanism, where the mounting plate mechanism includes a fixed plate, a rotating plate sleeved on the fixed plate, a first positioning pin provided on the rotating plate, and a second positioning pin provided on the fixed plate;
the locking ring is detachably sleeved on the outer side of the positioning ring, a first positioning pin hole is formed in the locking ring, and the first positioning pin hole and the first positioning pin are correspondingly spliced so that the locking ring is detachably connected with the rotating disk;
the positioning ring is provided with a second positioning pin hole, and the second positioning pin hole and the second positioning pin are correspondingly inserted in a plugging manner, so that the bearing disc is detachably connected with the fixed disc.
In any of the foregoing aspects, further, the second seal assembly includes a third seal member, a fourth seal member, a fifth seal member, a sixth seal member, and a seventh seal member;
the conductive connecting block comprises a first small-diameter section and a large-diameter section, the large-diameter section is connected to the top end of the first small-diameter section, the mounting disc mechanism further comprises a mounting disc and a centering sleeve, the fixing disc is provided with a centering through hole, the centering sleeve is arranged in the centering through hole in a penetrating mode, and the top end of the centering sleeve is arranged on the first small-diameter section in a sleeved mode and is abutted to the shoulder of the large-diameter section;
the third sealing member is connected between the bottom edge of the large-diameter section and the inner peripheral side wall of the mounting ring;
the fourth sealing member is arranged between the outer peripheral side wall of the large-diameter section and the inner peripheral side wall of the mounting ring;
the conductive connecting block further comprises a second small-diameter section, the second small-diameter section is connected to the top end of the large-diameter section, a centering groove is formed in the bottom surface of the chuck, the second small-diameter section is inserted into the centering groove, and the fifth sealing member is arranged between the second small-diameter section and the centering groove;
the sixth sealing component is arranged at the joint surface of the chuck and the bearing disc;
the seventh sealing component is arranged at the bottom of the wafer positioning groove.
In any of the foregoing aspects, further the first seal assembly further comprises a second seal member;
the second sealing member is disposed between a top edge of the carrier body and the capping portion.
Compared with the prior art, the beneficial effects of this application are:
the electroplating fixture comprises a sealing conductive mechanism and a bearing conductive mechanism. The bearing assembly of the bearing conductive mechanism fixes the wafer through the wafer positioning groove, when the compression joint assembly of the sealing conductive mechanism is compressed in place with the bearing assembly, the front surface of the wafer is exposed through the through hole of the compression joint assembly so as to be convenient for contacting electroplating liquid, meanwhile, the inner ring of the annular conductive elastic sheet stretches into the wafer positioning groove and forms an annular contact surface on the front surface of the wafer in the wafer positioning groove, and the annular conductive elastic sheet is used for connecting the negative electrode, so that metal ions in the electroplating liquid are deposited on the front surface of the wafer through the action of an electric field, and compared with the electroplating clamp in the prior art, the electroplating clamp realizes the upgrading from point contact to surface contact in a wafer conductive mode, and the conductive uniformity of the wafer is remarkably improved.
In addition, the first sealing mechanism of the sealing conductive mechanism at least comprises a first sealing component pressed between the annular conductive elastic piece and the wafer, so that electroplating liquid can be prevented from penetrating into the back surface of the wafer through the contact position between the annular conductive elastic piece and the wafer, the phenomenon of electric field shunt is avoided, the uniformity of current density of the front surface of the wafer can be accurately controlled and improved, the back surface pattern of the wafer can be effectively prevented from being damaged, and the product yield is further effectively improved.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings that are needed in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present application, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic view of a first structure of an electroplating fixture according to an embodiment of the present disclosure;
FIG. 2 is a schematic view of a second structure of an electroplating fixture according to an embodiment of the present disclosure;
FIG. 3 is a schematic view of a third structure of an electroplating fixture according to an embodiment of the present disclosure;
FIG. 4 is a cross-sectional view of FIG. 3 at section A-A;
FIG. 5 is a cross-sectional view of FIG. 3 at section B-B;
FIG. 6 is a fourth schematic view of an electroplating clamp (with the gland assembly omitted) according to an embodiment of the present application;
FIG. 7 is a fifth schematic view of an electroplating clamp (with the gland assembly and chuck omitted) provided in an embodiment of the present application;
fig. 8 is a schematic structural diagram of a conductive component of the plating jig according to the embodiment of the present application;
FIG. 9 is a first schematic structural view of a gland assembly of an electroplating clamp provided in an embodiment of the present application;
FIG. 10 is a second schematic structural view of a capping assembly of an electroplating clamp provided in an embodiment of the present application;
FIG. 11 is a first schematic structural view of a chuck of an electroplating fixture according to an embodiment of the present application;
FIG. 12 is a second schematic view of a chuck of the plating jig according to the embodiment of the present application;
FIG. 13 is a schematic view of a carrier plate of an electroplating fixture according to an embodiment of the present disclosure;
fig. 14 is a schematic structural view of a locking ring of an electroplating clamp according to an embodiment of the present application.
Reference numerals:
1-a first seal assembly; 10-a first sealing member; 11-a second sealing member; a 2-crimp assembly; 20-connecting the sleeve; 21-a gland part; 22-locking sliding grooves; 23-a guide groove; 30-annular conductive spring pieces; 300-an inner ring portion; 301-an outer ring portion; 31-fastening a connector; 32-an elastic compression column; 4-a carrier assembly; 40-chuck; 400-wafer positioning grooves; 41-a carrier tray; 410-guide pins; 411-positioning ring; 412-mounting ring; 42-locking ring; 420-locking pin; 6-a second seal assembly; 60-a third sealing member; 61-fourth sealing member; 62-a fifth sealing member; 63-a sixth sealing member; 64-seventh sealing members; 7-a conductive component; 70-conductive connection blocks; 71-conductive sheets; 72-conducting columns; 8-a mounting plate mechanism; 80-rotating the disc; 81-fixing plates; 82-centering sleeve; 83-a first locating pin; 84-a second locating pin; 85-a third locating pin; 9-wafer.
Detailed Description
The following description of the embodiments of the present invention will be made apparent and fully in view of the accompanying drawings, in which some, but not all embodiments of the invention are shown. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
In the description of the present invention, it should be noted that the directions or positional relationships indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. are based on the directions or positional relationships shown in the drawings, are merely for convenience of describing the present invention and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present invention will be understood in specific cases by those of ordinary skill in the art.
Example 1
Referring to fig. 1-14, embodiments of the present application provide an electroplating fixture including a sealed conductive mechanism, a load-bearing conductive mechanism, and a mounting plate mechanism 8.
Hereinafter, the above-described components of the plating jig will be specifically described.
The carrying and conducting mechanism provided in this embodiment is used for carrying and installing the wafer 9, and the carrying and conducting mechanism includes a carrying component 4, and the carrying component 4 is formed with a wafer positioning slot 400 adapted to the wafer 9, so that the carrying of the wafer 9 by the carrying component 4 can be realized by placing the wafer 9 in the wafer positioning slot 400.
The sealed conductive mechanism comprises a first sealing component 1, a crimping component 2 and an annular conductive spring piece 30, wherein the annular conductive spring piece 30 is arranged around the wafer positioning groove 400, an inner ring of the annular conductive spring piece 30 stretches into the wafer positioning groove 400 and is suspended relative to the wafer positioning groove 400, the crimping component 2 is arranged on the annular conductive spring piece 30 in a pressing mode and is provided with a through hole corresponding to the wafer positioning groove 400, so that the wafer 9 can be limited in the wafer positioning groove 400 through the crimping component 2, the front surface (surface to be coated) of the wafer 9 is exposed through the through hole of the crimping component 2 so as to be convenient for contacting electroplating liquid, the annular conductive spring piece 30 can be pressed towards the wafer 9 through the crimping component 2, annular contact is formed between the annular conductive spring piece 30 and the front surface of the wafer 9, the annular conductive spring piece 30 is used for connecting a negative electrode, uniform conduction of electrolyte on the front surface of the wafer 9 of the negative electrode phase is realized through the annular conductive spring piece 30, the conductive mode is upgraded from point contact to surface contact, and thickness uniformity of the front surface of the wafer 9 is improved.
The first sealing assembly 1 comprises at least a first sealing member 10 arranged at the crimp assembly 2 in correspondence of the edge of the through hole; the crimping assembly 2 is detachably connected with the bearing assembly 4, so that the first sealing member 10 is tightly pressed between the annular conductive elastic sheet 30 and the wafer 9, that is, a gap between the annular conductive elastic sheet 30 and the wafer 9 can be sealed through the first sealing member 10, electrolyte on the front face of the wafer 9 is prevented from leaking through the gap between the annular conductive elastic sheet 30 and the wafer 9, the electrolyte is prevented from contacting with other surfaces of the wafer 9 except for the front face, a shunting phenomenon is prevented from occurring, the uniformity of the stability of the current of the front face coating film of the wafer 9 is further improved, and the uniformity of the thickness of the front face coating film of the wafer 9 is further improved.
In an alternative to this embodiment, the sealed conductive mechanism further comprises a plurality of fastening connectors 31 and a plurality of resilient press studs 32.
The annular conductive elastic sheet 30 comprises an inner ring portion 300 and an outer ring portion 301, wherein an inner ring of the outer ring portion 301 is connected with an outer ring of the inner ring portion 300, the outer ring portion 301 is connected with the bearing assembly 4 through a plurality of fastening connecting pieces 31, specifically, a first fastening connecting hole is formed in the bearing assembly 4, a second fastening connecting hole corresponding to the first fastening connecting hole is formed in the outer ring portion 301, and the fastening connecting pieces 31 penetrate through the first fastening connecting hole and the second fastening connecting hole to enable the annular conductive elastic sheet 30 to be connected with the bearing assembly 4.
One end of the plurality of elastic pressing columns 32 is connected with the pressing assembly 2, the other end of the plurality of elastic pressing columns 32 is abutted against the inner ring part 300, so that the inner ring part 300 bends towards the bottom of the wafer positioning groove 400 relative to the outer ring part 301, and therefore, when the pressing assembly 2 is installed to the bearing assembly 4, the inner ring part 300 can be contacted with the wafer 9 under the pressing action of the elastic pressing columns 32, and the annular conductive elastic sheet 30 is contacted with the front surface of the wafer 9 through the inner ring part 300.
Alternatively, the plurality of elastic pressing posts 32 are uniformly spaced apart in the circumferential direction of the wafer positioning groove 400.
Alternatively, the fastening connection 31 is a bolt or screw or the like.
In an alternative to this embodiment, the load-bearing conductive mechanism further comprises a second seal assembly 6 and a conductive assembly 7.
The conductive component 7 is arranged on the bearing component 4 in a penetrating way, one end of the conductive component 7 is exposed relative to the bearing component 4, the other end of the conductive component 7 is electrically connected with the annular conductive elastic sheet 30, so that an external negative electrode is electrically connected with the annular conductive elastic sheet 30 through the conductive component 7, that is, the external negative electrode is communicated with the annular conductive elastic sheet 30 through the conductive component 7, and conduction is realized between the external negative electrode and the annular conductive elastic sheet 30.
The second sealing component 6 is arranged at the connection gap between the conductive component 7 and the bearing component 4, so that leakage of electrolyte through the gap between the conductive component 7 and the bearing component 4 is avoided, normal conductive function of the conductive component 7 is avoided, and the phenomenon that the electrolyte leaked at the position causes shunt can be avoided.
In an alternative of this embodiment, the bearing assembly 4 includes a cylindrical bearing body and a locking pin 420, where the locking pin 420 is disposed on a peripheral sidewall of the bearing body.
The crimping assembly 2 comprises a cylindrical connecting sleeve 20 and a gland part 21 provided with a through hole, the gland part 21 is connected to the top end opening of the connecting sleeve 20, a locking chute 22 is provided on the inner peripheral side wall of the connecting sleeve 20, a first end of the locking chute 22 is communicated with one end of the connecting sleeve 20 far away from the gland part 21, and a second end of the locking chute 22 is inclined unidirectionally towards the gland part 21 along the circumferential direction of the connecting sleeve 20.
The locking pin 420 is slid into the locking slide groove 22 via the first end of the locking slide groove 22, and by relatively rotating the carrier assembly 4 and the connecting sleeve 20, the connecting sleeve 20 can be locked with the carrier body and the capping portion 21 can be made to press against the top of the carrier assembly 4.
In an alternative of this embodiment, the plating jig further includes a guide pin 410 provided on the carrier body, and a guide groove 23 adapted to the guide pin 410 is provided on an inner peripheral side wall of the connection sleeve 20, and the guide groove 23 extends along an axial direction of the connection sleeve 20.
When the guide pin 410 is aligned with the guide slot 23, the locking pin 420 is aligned with the first end of the locking chute 22. Thus, by aligning the guide pin 410 with the guide slot 23 and depressing the coupling sleeve 20 toward the carrier body, the guide pin 410 extends into the guide slot 23 to stop rotation of the coupling sleeve 20 while the locking pin 420 extends into the first end of the locking chute 22.
In an alternative to this embodiment, as shown in fig. 12 to 14, the carrier body includes a locking ring 42, a carrier plate 41, and a chuck 40, which are sequentially stacked.
The locking pin 420 is disposed on the outer peripheral sidewall of the locking ring 42, the chuck 40 is opposite to the surface of the carrying disc 41 to form the top of the carrying body, the guide pin 410 is disposed on the outer peripheral sidewall of the chuck 40, the wafer positioning groove 400 is disposed in the middle of the chuck 40 and penetrates through the chuck 40, so that the wafer 9 is supported by the carrying disc 41, and the wafer 9 is radially limited by the chuck 40.
Therefore, the guide pin 410 on the chuck 40 is firstly butted with the guide groove 23 on the connecting sleeve 20, the locking pin 420 on the locking ring 42 is butted with the first end of the locking chute 22 on the connecting sleeve 20 by rotating the locking ring 42, then the locking ring 42 is continuously rotated, the locking pin 420 slides along the locking chute 22 and pulls down the connecting sleeve 20, meanwhile, the guide pin 410 slides up in the guide groove 23, the connecting sleeve 20 can only move up and down without rotating due to the guiding action of the guide pin 410 and the guide groove 23, until the locking pin 420 slides to the second end of the locking chute 22 along the locking chute 22, the locking of the connecting sleeve 20 is realized under the friction action between the locking pin 420 and the locking chute 22, and the gland part 21 is pulled down to compress the wafer 9 after the connecting sleeve 20 is locked.
In an alternative to this embodiment, the conductive assembly 7 includes a conductive connection block 70, a conductive sheet 71, and a conductive post 72.
As shown in fig. 14, the bearing plate 41 is provided with a mounting ring 412 and a positioning ring 411, the positioning ring 411 is sleeved on the outer side of the mounting ring 412 at intervals, the bearing plate 41 is provided with a power connection hole penetrating through the hollow part of the mounting ring 412, as shown in fig. 5, 6, 8 and 9, the conductive connection block 70 is arranged in the power connection hole of the mounting ring 412, the top of the conductive connection block 70 extends out of the bearing plate 41 through the power connection hole, and the bottom of the conductive connection block 70 is used for connecting the negative electrode.
As shown in fig. 5, 6, 8 and 9, the conductive post 72 is inserted into the chuck 40, the bottom end of the conductive post 72 is electrically connected with the top end of the conductive connection block 70 through the conductive sheet 71, and the top end of the conductive post 72 is in contact with the annular conductive spring 30 to form an electrical connection, so that the current of the negative electrode is sequentially transmitted to the annular conductive spring 30 through the conductive connection block 70, the conductive sheet 71 and the conductive post 72.
In this embodiment, the number of the conductive posts 72 is plural, the plurality of conductive posts 72 are arranged at intervals along the circumferential direction of the outer ring portion 301, and the plurality of conductive posts 72 are electrically connected with the conductive connection block 70 through the plurality of conductive pieces 71, so as to improve the uniformity of current transmission to the annular conductive spring 30.
In an alternative of this embodiment, as shown in fig. 5, the plating jig further includes a mounting plate mechanism 8, and the mounting plate mechanism 8 includes a fixed plate 81, a rotating plate 80 rotatably sleeved on the fixed plate 81, a first positioning pin 83 provided on the rotating plate 80, and a second positioning pin 84 provided on the fixed plate 81.
The locking ring 42 is detachably sleeved on the outer side of the positioning ring 411, and the locking ring 42 is provided with a first positioning pin hole which is correspondingly inserted with the first positioning pin 83, so that the locking ring 42 is detachably connected with the rotating disk 80.
The positioning ring 411 is provided with a second positioning pin hole, and the second positioning pin hole and the second positioning pin 84 are correspondingly inserted and connected, so that the bearing plate 41 and the fixed plate 81 can be detachably connected.
Optionally, the fixing plate 81 is provided with a third positioning pin 85 for plugging with a third positioning pin hole on the working platform, so that the fixing plate is fixed on the working platform.
Specifically, the assembly process of the electroplating clamp is as follows: the rotary plate 80 is first rotatably sleeved on the outer side of the fixed plate 81, and then the fixed plate 81 is fixed to the equipment deck plate using the plating jig by means of the third positioning pins 85, whereby both the fixed plate 81 and the rotary plate 80 are mounted on the equipment deck plate.
The wafer is placed in the wafer positioning groove 400, the bearing body is aligned with the second positioning pin 84 of the fixed disk 81 through the second positioning pin hole on the positioning ring 411, so that the chuck 40 is fixedly arranged with the fixed disk 81, at the same time, the rotating disk 80 is rotated, so that the first positioning pin 83 on the rotating disk 80 is aligned with the first positioning pin hole on the locking ring 42, the locking ring 42 can follow up with the rotating disk 80, after the positioning pin and the positioning pin hole are all aligned, the guide groove 23 of the crimping assembly 2 is aligned with the guide pin 410 of the chuck of the bearing body, then the rotating disk 80 is rotated, the rotating disk 80 drives the locking ring 42 and the locking pin 420 thereon to slide along the locking chute 22 of the connecting sleeve 20, so that the assembly of the electroplating clamp can be completed after the locking of the crimping assembly 2 is pulled down until the locking of the crimping assembly 2 is completed.
The electroplating clamp is easy to assemble and disassemble, and the bearing guide mechanism and the sealing guide mechanism can form reliable sealing connection in an assembled state, so that high-uniformity conduction of the wafer 9 is ensured.
In an alternative of the present embodiment, the second sealing assembly 6 includes a third sealing member 60, a fourth sealing member 61, a fifth sealing member 62, a sixth sealing member 63, and a seventh sealing member 64.
Wherein, the conductive connection block 70 comprises a first small diameter section and a large diameter section, the large diameter section is connected to the top end of the first small diameter section, the mounting plate mechanism further comprises a mounting plate and a centering sleeve 82, the fixing plate is provided with a centering through hole, the centering sleeve 82 is arranged in the centering through hole in a penetrating way, and the top end of the centering sleeve 82 is sleeved on the first small diameter section and is abutted to the shoulder of the large diameter section.
The third seal member 60 is connected between the bottom edge of the large diameter section and the inner peripheral sidewall of the mounting ring 412.
The fourth seal member 61 is provided between the outer peripheral side wall of the large diameter section and the inner peripheral side wall of the mount ring 412.
The conductive connection block 70 further includes a second small-diameter section connected to the top end of the large-diameter section, a centering groove is formed in the bottom surface of the chuck 40, the second small-diameter section is inserted into the centering groove, and the fifth sealing member 62 is disposed between the second small-diameter section and the centering groove.
The sixth sealing member 63 is disposed at the mating surface of the chuck 40 and the carrier 41.
The seventh sealing member 64 is disposed at the bottom of the wafer positioning groove 400.
In an alternative to this embodiment, the first seal assembly 1 further comprises a second seal member 11, the second seal member 11 being disposed between the top edge of the carrier body and the capping portion 21.
Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present invention, and not for limiting the same; although the invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some or all of the technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit of the invention. Furthermore, those skilled in the art will appreciate that while some embodiments herein include some features but not others included in other embodiments, combinations of features of different embodiments are meant to be within the scope of the invention and form different embodiments. For example, any of the claimed embodiments can be used in any combination. The information disclosed in this background section is only for enhancement of understanding of the general background of the invention and should not be taken as an acknowledgement or any form of suggestion that this information forms the prior art already known to a person skilled in the art.
Claims (7)
1. An electroplating clamp is characterized by comprising a sealing conductive mechanism and a bearing conductive mechanism;
the bearing conductive mechanism comprises a bearing component, and the bearing component is provided with a wafer positioning groove matched with a wafer;
the sealing conductive mechanism comprises a first sealing component, a crimping component and an annular conductive elastic piece, wherein the annular conductive elastic piece is arranged around the wafer positioning groove, an inner ring of the annular conductive elastic piece stretches into the wafer positioning groove and is suspended relative to the wafer positioning groove, and the crimping component is pressed on the annular conductive elastic piece and is provided with a through hole corresponding to the wafer positioning groove;
the first sealing component at least comprises a first sealing member which is arranged on the crimping component corresponding to the edge of the through hole;
the crimping assembly is detachably connected with the bearing assembly, so that the first sealing member is pressed between the annular conductive elastic sheet and the wafer;
the front surface of the wafer is exposed through the through hole of the compression joint assembly to contact the electroplating solution, and the annular conductive elastic sheet and the front surface of the wafer in the wafer positioning groove form an annular contact surface, so that metal ions in the electroplating solution are deposited on the front surface of the wafer;
the first sealing component seals a gap between the annular conductive elastic sheet and the wafer, so that the electrolyte is prevented from contacting other surfaces of the wafer except the front surface, and the phenomenon of accompanying electric field shunting is avoided;
the sealed conductive mechanism further comprises a plurality of fastening connectors and a plurality of elastic compression columns;
the annular conductive elastic sheet comprises an inner ring part and an outer ring part, the inner ring of the outer ring part is connected with the outer ring of the inner ring part, the outer ring part is connected with the bearing assembly through a plurality of fastening connectors, one ends of a plurality of elastic pressing columns are connected with the crimping assembly, and the other ends of the elastic pressing columns are abutted against the inner ring part so that the inner ring part bends towards the bottom of the wafer positioning groove relative to the outer ring part;
the bearing conductive mechanism further comprises a second sealing component and a conductive component;
the conductive component is arranged in the bearing component in a penetrating way, one end of the conductive component is exposed relative to the bearing component, and the other end of the conductive component is electrically connected with the annular conductive elastic sheet;
the second sealing component is arranged at a connecting gap between the conductive component and the bearing component;
the bearing assembly comprises a cylindrical bearing main body and a locking pin, and the locking pin is arranged on the outer peripheral side wall of the bearing main body;
the crimping assembly comprises a cylindrical connecting sleeve and a gland part provided with the through hole, the gland part is connected with the top end opening of the connecting sleeve, a locking chute is formed in the inner peripheral side wall of the connecting sleeve, a first end of the locking chute is communicated with one end, far away from the gland part, of the connecting sleeve, and a second end of the locking chute is inclined unidirectionally towards the gland part along the circumferential direction of the connecting sleeve;
the locking pin slides into the locking chute through the first end of the locking chute, and the connecting sleeve and the bearing main body can be locked by relatively rotating the bearing assembly and the connecting sleeve, so that the gland part presses the top of the bearing assembly.
2. The plating jig according to claim 1, further comprising a guide pin provided to the bearing body, the inner peripheral side wall of the connecting sleeve being provided with a guide groove adapted to the guide pin;
when the guide pin is aligned with the guide slot, the locking pin is aligned with the first end of the locking chute.
3. The plating jig according to claim 2, wherein the carrier body comprises a locking ring, a carrier plate, and a chuck stacked in order;
the locking pin is arranged on the peripheral side wall of the locking ring, the chuck is deviated from the surface of the bearing disc to form the top of the bearing main body, and the guide pin is arranged on the peripheral side wall of the chuck.
4. The plating jig according to claim 3, wherein the conductive assembly comprises a conductive connection block, a conductive sheet, and a conductive post;
the bearing plate is provided with a mounting ring and a positioning ring, the positioning ring is sleeved on the outer side of the mounting ring at intervals, the bearing plate is provided with a power connection hole communicated with the hollow part of the mounting ring, the conductive connecting block is arranged in the power connection hole of the mounting ring, and the top of the conductive connecting block extends out of the bearing plate through the power connection hole;
the conductive column penetrates through the chuck, the bottom end of the conductive column is electrically connected with the top end of the conductive connecting block through the conductive sheet, and the top end of the conductive column is in contact with the annular conductive elastic sheet and forms electrical connection;
the number of the conductive posts is multiple, the conductive posts are distributed at intervals along the circumferential direction of the outer ring part, and the conductive posts are electrically connected with the conductive connecting blocks through the conductive sheets.
5. The plating jig according to claim 4, further comprising a mounting plate mechanism including a fixed plate, a rotating plate rotatably sleeved on the fixed plate, a first positioning pin provided on the rotating plate, and a second positioning pin provided on the fixed plate;
the locking ring is detachably sleeved on the outer side of the positioning ring, a first positioning pin hole is formed in the locking ring, and the first positioning pin hole and the first positioning pin are correspondingly spliced so that the locking ring is detachably connected with the rotating disk;
the positioning ring is provided with a second positioning pin hole, and the second positioning pin hole and the second positioning pin are correspondingly inserted in a plugging manner, so that the bearing disc is detachably connected with the fixed disc.
6. The plating jig of claim 5, wherein the second seal assembly comprises a third seal member, a fourth seal member, a fifth seal member, a sixth seal member, and a seventh seal member;
the conductive connecting block comprises a first small-diameter section and a large-diameter section, the large-diameter section is connected to the top end of the first small-diameter section, the mounting disc mechanism comprises a mounting disc and a centering sleeve, the fixing disc is provided with a centering through hole, the centering sleeve is arranged in the centering through hole in a penetrating mode, and the top end of the centering sleeve is arranged on the first small-diameter section in a sleeved mode and is abutted to the shoulder of the large-diameter section;
the third sealing member is connected between the bottom edge of the large-diameter section and the inner peripheral side wall of the mounting ring;
the fourth sealing member is arranged between the outer peripheral side wall of the large-diameter section and the inner peripheral side wall of the mounting ring;
the conductive connecting block further comprises a second small-diameter section, the second small-diameter section is connected to the top end of the large-diameter section, a centering groove is formed in the bottom surface of the chuck, the second small-diameter section is inserted into the centering groove, and the fifth sealing member is arranged between the second small-diameter section and the centering groove;
the sixth sealing component is arranged at the joint surface of the chuck and the bearing disc;
the seventh sealing component is arranged at the bottom of the wafer positioning groove.
7. The plating jig of claim 1, wherein the first seal assembly further comprises a second seal member disposed between a top edge of the carrier body and the gland portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210619171.7A CN114892248B (en) | 2022-06-01 | 2022-06-01 | Electroplating clamp |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210619171.7A CN114892248B (en) | 2022-06-01 | 2022-06-01 | Electroplating clamp |
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| CN114892248A CN114892248A (en) | 2022-08-12 |
| CN114892248B true CN114892248B (en) | 2024-01-26 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202210619171.7A Active CN114892248B (en) | 2022-06-01 | 2022-06-01 | Electroplating clamp |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN116575098B (en) * | 2023-07-11 | 2023-09-19 | 深圳市星国华先进装备科技有限公司 | Data recording processing device for wafer processing |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1326016A (en) * | 2000-04-27 | 2001-12-12 | 新光电气工业株式会社 | Local electroplating system |
| CN201459271U (en) * | 2009-05-19 | 2010-05-12 | 上海新阳半导体材料股份有限公司 | Clamp for electroplating wafer |
| CN206283083U (en) * | 2016-11-24 | 2017-06-27 | 番禺得意精密电子工业有限公司 | Conducting slip ring |
| CN208455094U (en) * | 2018-05-29 | 2019-02-01 | 苏州亚硕新能源有限公司 | Wafer electroplating fixture sealing conducting ring |
| CN210325712U (en) * | 2019-08-22 | 2020-04-14 | 邱晓明 | Conductive elastic sheet of wafer clamp |
| CN210481542U (en) * | 2019-08-07 | 2020-05-08 | 成都海威华芯科技有限公司 | Sealing upper cover suitable for wafer single-side electroplating process |
| CN111394776A (en) * | 2020-04-07 | 2020-07-10 | 中国电子科技集团公司第十三研究所 | Self-locking hanger for double-sided electroplating of wafer |
| CN112008313A (en) * | 2020-08-04 | 2020-12-01 | 奇瑞汽车股份有限公司 | Clamp switching device |
| CN114351225A (en) * | 2021-03-18 | 2022-04-15 | 青岛惠芯微电子有限公司 | Electroplating hanger and electroplating device |
-
2022
- 2022-06-01 CN CN202210619171.7A patent/CN114892248B/en active Active
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1326016A (en) * | 2000-04-27 | 2001-12-12 | 新光电气工业株式会社 | Local electroplating system |
| CN201459271U (en) * | 2009-05-19 | 2010-05-12 | 上海新阳半导体材料股份有限公司 | Clamp for electroplating wafer |
| CN206283083U (en) * | 2016-11-24 | 2017-06-27 | 番禺得意精密电子工业有限公司 | Conducting slip ring |
| CN208455094U (en) * | 2018-05-29 | 2019-02-01 | 苏州亚硕新能源有限公司 | Wafer electroplating fixture sealing conducting ring |
| CN210481542U (en) * | 2019-08-07 | 2020-05-08 | 成都海威华芯科技有限公司 | Sealing upper cover suitable for wafer single-side electroplating process |
| CN210325712U (en) * | 2019-08-22 | 2020-04-14 | 邱晓明 | Conductive elastic sheet of wafer clamp |
| CN111394776A (en) * | 2020-04-07 | 2020-07-10 | 中国电子科技集团公司第十三研究所 | Self-locking hanger for double-sided electroplating of wafer |
| CN112008313A (en) * | 2020-08-04 | 2020-12-01 | 奇瑞汽车股份有限公司 | Clamp switching device |
| CN114351225A (en) * | 2021-03-18 | 2022-04-15 | 青岛惠芯微电子有限公司 | Electroplating hanger and electroplating device |
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| CN114892248A (en) | 2022-08-12 |
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