CN114889327A - Electrostatic ink-jet printer nozzle and preparation method thereof - Google Patents
Electrostatic ink-jet printer nozzle and preparation method thereof Download PDFInfo
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- CN114889327A CN114889327A CN202210423716.7A CN202210423716A CN114889327A CN 114889327 A CN114889327 A CN 114889327A CN 202210423716 A CN202210423716 A CN 202210423716A CN 114889327 A CN114889327 A CN 114889327A
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- 238000002360 preparation method Methods 0.000 title description 6
- 239000007788 liquid Substances 0.000 claims abstract description 114
- 239000000758 substrate Substances 0.000 claims abstract description 98
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 76
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 76
- 239000010703 silicon Substances 0.000 claims abstract description 76
- 238000003860 storage Methods 0.000 claims abstract description 31
- 238000005507 spraying Methods 0.000 claims abstract description 19
- 238000000034 method Methods 0.000 claims description 35
- 230000008569 process Effects 0.000 claims description 33
- 239000011521 glass Substances 0.000 claims description 28
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 16
- 238000005530 etching Methods 0.000 claims description 15
- 235000012239 silicon dioxide Nutrition 0.000 claims description 8
- 239000000377 silicon dioxide Substances 0.000 claims description 8
- 238000004519 manufacturing process Methods 0.000 claims description 5
- 239000012528 membrane Substances 0.000 claims description 4
- 238000001259 photo etching Methods 0.000 description 15
- 238000005520 cutting process Methods 0.000 description 14
- 238000005516 engineering process Methods 0.000 description 9
- 238000001020 plasma etching Methods 0.000 description 6
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 6
- 239000002184 metal Substances 0.000 description 5
- 238000004544 sputter deposition Methods 0.000 description 5
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 4
- 238000004140 cleaning Methods 0.000 description 4
- 238000000151 deposition Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000007639 printing Methods 0.000 description 3
- 239000007921 spray Substances 0.000 description 3
- 230000009471 action Effects 0.000 description 2
- 229910052796 boron Inorganic materials 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
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- 229920002120 photoresistant polymer Polymers 0.000 description 2
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- 238000010586 diagram Methods 0.000 description 1
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- 230000005684 electric field Effects 0.000 description 1
- 238000007641 inkjet printing Methods 0.000 description 1
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14314—Structure of ink jet print heads with electrostatically actuated membrane
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1626—Manufacturing processes etching
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1631—Manufacturing processes photolithography
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1632—Manufacturing processes machining
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/164—Manufacturing processes thin film formation
Abstract
An electrostatic ink jet printer nozzle comprises a first silicon substrate and a second silicon substrate arranged above the first silicon substrate; one side of the second silicon substrate, which faces the first silicon substrate, is provided with a liquid storage tank; the first silicon substrate is provided with a liquid inlet channel communicated with the liquid storage pool to enable liquid to enter the liquid storage pool and a nozzle arranged at an interval with the liquid inlet channel to enable the liquid in the liquid storage pool to flow out; the liquid storage tank is also internally provided with a flow limiting part which divides the liquid storage tank into a liquid inlet area and a liquid spraying area; the flow limiting part is positioned between the liquid inlet channel and the nozzle; the flow limiting part is provided with a flow limiting channel for communicating liquid inlet with the liquid spraying area; a flow-limiting column is arranged on the flow-limiting channel; the flow limiting column protrudes towards the inner side of the flow limiting channel, so that the liquid inlet area of the flow limiting channel is larger than the liquid outlet area.
Description
Technical Field
The invention belongs to the technical field of micro-electro-mechanical system manufacturing, and particularly relates to an electrostatic ink-jet printer nozzle and a preparation method thereof.
Background
The droplet jet printing technology is a printing technology which generates a pressure difference between an ink chamber and the outside in a certain extrusion mode, so that the internal pressure of a nozzle is larger than the outside pressure, and ink is pushed out of the nozzle to generate tiny ink droplets.
In the electrostatic ink-jet printing head, ink can directly flow into each pressure cavity through the main ink channel, so that the pressure difference between the main ink channel and each pressure cavity is small, the driving force for the ink to enter the cavity from the main ink channel is small, and the conditions of backflow and crosstalk are easy to occur to the ink in the cavity.
In view of the above technical problems, improvements are needed.
Disclosure of Invention
The invention provides an electrostatic ink-jet printer nozzle and a preparation method thereof, aiming at the problems in the prior art.
In order to achieve the purpose, the invention adopts the following technical scheme:
an electrostatic ink jet printer nozzle comprises a first silicon substrate and a second silicon substrate arranged above the first silicon substrate; one side of the second silicon substrate, which faces the first silicon substrate, is provided with a liquid storage tank; the first silicon substrate is provided with a liquid inlet channel communicated with the liquid storage pool to enable liquid to enter the liquid storage pool and a nozzle arranged at an interval with the liquid inlet channel to enable the liquid in the liquid storage pool to flow out; the liquid storage tank is also internally provided with a flow limiting part which divides the liquid storage tank into a liquid inlet area and a liquid spraying area; the flow limiting part is positioned between the liquid inlet channel and the nozzle; the flow limiting part is provided with a flow limiting channel communicated with the liquid inlet area and the liquid spraying area; a flow limiting column is arranged on the flow limiting channel; the flow limiting column protrudes towards the inner side of the flow limiting channel, so that the liquid inlet area of the flow limiting channel is larger than the liquid outlet area.
As a preferred scheme, the flow limiting columns are distributed on two sides of the flow limiting channel in an array manner, the flow limiting columns are in a sawtooth shape, and the inclined planes of the sawtooth shape face to the liquid inlet area; the flow-limiting columns on two sides of the flow-limiting channel are arranged in a staggered mode.
As a preferred scheme, the flow limiting columns are distributed on two sides of the flow limiting channel in an array manner, and the flow limiting columns are arc-shaped; the flow-limiting columns on two sides of the flow-limiting channel are arranged in a staggered mode, and the inner sides of the arcs of the flow-limiting columns face the liquid spraying area.
Preferably, the flow restriction has a plurality of flow restriction passages.
Preferably, the liquid spraying area is divided into a plurality of chambers; the chambers correspond to the flow-limiting channels one to one.
Preferably, an ink jet assembly is further arranged in the liquid storage tank, and the ink jet assembly comprises a vibrating diaphragm arranged in the liquid inlet area and a fixed electrode arranged above the vibrating diaphragm and used for vibrating the vibrating diaphragm.
Preferably, the upper surface and the lower surface of the second silicon substrate are both provided with a silicon dioxide insulating layer.
The invention also provides a preparation method of the electrostatic ink-jet printer nozzle, which comprises the following steps:
s1, preparing a first silicon substrate; selecting a silicon substrate, and etching a liquid inlet channel and a nozzle on the lower surface of the first silicon substrate;
s2, preparing a second silicon substrate; selecting a silicon substrate, etching a liquid storage tank groove on the lower surface of the second silicon substrate, and etching a current limiting part in the liquid storage tank;
s3, preparing a glass substrate; selecting a glass substrate, and etching a fixed electrode groove on the lower surface of the glass substrate;
s4, mounting; bonding and mounting the first silicon substrate and the second silicon substrate by adopting silicon-silicon bonding treatment; and bonding and mounting the second silicon substrate and the glass substrate by adopting a silicon-glass bonding process.
Preferably, in step S2, the width of the groove of the vibrating diaphragm is about 200 μm and the thickness is about 5-50 μm; in the step S3, the length of the fixed electrode groove etched on the glass substrate is 3000-6000 μm, the width is 200-500 μm, and the depth is about 50-100 μm.
Compared with the prior art, the invention has the beneficial effects that: through set up the current-limiting post in the current-limiting passageway, make the velocity of flow of the liquid through the current-limiting passageway accelerate, increase the pressure differential of liquid inlet district and hydrojet district and then make liquid through the current-limiting passageway back according to Bernoulli's principle, under the effect of pressure differential, the condition of backward flow or crosstalk can not take place, and then has improved the printing quality of printer, has reduced the consumption of ink.
Drawings
FIG. 1 is a schematic plan view of an electrostatic ink jet printer head according to an embodiment of the invention;
FIG. 2 is a schematic view of an overall structure of an electrostatic inkjet printer head according to an embodiment of the invention;
FIG. 3 is a schematic view of a portion of a first silicon substrate of a showerhead of an electrostatic ink jet printer according to a first embodiment of the present invention;
FIG. 4 is a schematic view of a second silicon substrate of an electrostatic ink jet printer head according to a first embodiment of the present invention;
FIG. 5 is a schematic view of a glass substrate of a nozzle of an electrostatic ink jet printer according to a first embodiment of the present invention;
FIG. 6 is a flow chart of a first silicon substrate process for fabricating a showerhead of an electrostatic ink jet printer according to a first embodiment of the present invention;
FIG. 7 is a flow chart of a second silicon substrate fabrication process for a showerhead of an electrostatic ink jet printer according to a first embodiment of the present invention;
FIG. 8 is a flow chart of a process for manufacturing a glass substrate of a nozzle of an electrostatic ink jet printer according to a first embodiment of the present invention;
FIG. 9 is a schematic diagram of a final bonding of a nozzle of an electrostatic ink jet printer according to a first embodiment of the present invention;
wherein: 1. a first silicon substrate; 11. a liquid inlet channel; 12. a nozzle; 13. an upper electrode layer; a PZT piezoelectric layer; 15. a lower electrode layer; 2. a second silicon substrate; 21. a liquid storage tank; 22. a flow restriction portion; 23. vibrating the diaphragm; 24. a vibrating diaphragm electrode interface; 25. a vibrating membrane electrode layer; 26. a silicon dioxide insulating layer; 27. a silicon dioxide insulating layer; 3. a glass substrate; 31. a fixed electrode; 32. an electric connection port; 200. a liquid inlet zone; 201. a liquid spraying zone; 202. a flow-restricting passage; 203. a flow-limiting column; 40. an ink jet assembly.
Detailed Description
The embodiments of the present invention are described below with reference to specific embodiments, and other advantages and effects of the present invention will be easily understood by those skilled in the art from the disclosure of the present specification. The invention is capable of other and different embodiments and of being practiced or of being carried out in various ways, and its several details are capable of modification in various respects, all without departing from the spirit and scope of the present invention.
The first embodiment is as follows:
the electrostatic ink jet printer head of the present embodiment, as shown in fig. 1 to 5, includes a first silicon substrate 1, a second silicon substrate 2 disposed above the first silicon substrate 1, and a glass substrate 3 disposed above the second silicon substrate 2.
The first silicon substrate 1 is provided with an inlet channel 11 and a plurality of nozzles 12, a plurality of nozzles 12 can form a liquid spraying passage, and the liquid spraying passage array is positioned between the bonding surfaces of the first silicon substrate 1 and the second silicon substrate 2.
The lower surface of the second silicon substrate 2 is also provided with a reservoir 21 communicating with the liquid inlet channel 11 and a restrictor 22 disposed in the reservoir 21 for restricting the backflow of ink.
As shown in fig. 4, the liquid restriction portion 22 divides the liquid storage tank 21 into a liquid inlet area 200 and a liquid spraying area 201, the liquid restriction portion 22 further has a liquid restriction passage 202 communicating the liquid inlet area 200 and the liquid spraying area 201, liquid enters the liquid inlet area of the liquid storage tank 21 through the liquid inlet passage 11, flows to the liquid spraying area 201 through the liquid restriction passage 202 in the liquid restriction portion 22, and finally, the liquid exits from the liquid spraying area 201 through the nozzle 12.
The flow limiting channel 201 is internally provided with flow limiting columns 203 for increasing the flow rate of liquid passing through the flow limiting channel 201, the flow limiting columns 203 are distributed on two sides of the flow limiting channel 201 in an array mode, and the flow limiting columns 203 are in a sawtooth shape. The zigzag inclined surfaces of the flow restriction columns 203 face the liquid inlet area 200, and the layers of the flow restriction columns 203 on the two sides of the flow restriction channel 202 are staggered.
Through the staggered flow-limiting columns 203 on the two sides of the flow-limiting channel 201, the flow-limiting channel 201 forms a zigzag flow path, and the liquid inlet of the flow-limiting channel 201 is larger than the liquid outlet, so that the zigzag flow-limiting channel not only can play a role in blocking backflow, but also can further increase the pressure difference in the flow-limiting channel 201.
The liquid passes through the inclined plane on the flow limiting column 203, the travel of the liquid is increased under the condition that the flow is not changed, and then the flow rate of the liquid passing through the flow limiting channel 201 is increased, so that the liquid inlet area 200 and the liquid spraying area 201 generate pressure difference, and the liquid entering the liquid spraying area 201 through the flow limiting channel 202 cannot return and crosstalk under the action of the pressure difference.
The flow restriction portion 22 is provided with a plurality of flow restriction passages 202, each of which is provided with a flow restriction column 203. The liquid spray zone is divided into a plurality of chambers, each chamber corresponding to one of the restricted flow channels 202, and liquid can flow from the liquid inlet zone to different chambers through different restricted flow channels 202.
An ink jet assembly 40 is arranged above the liquid storage tank 21. The ink jet module 40 includes a diaphragm 23 capable of generating a suction force by being bent by a force and a fixed electrode 31 disposed above the diaphragm 23 to provide an electrostatic force thereto. The second silicon substrate 2 is further provided with a diaphragm electrode interface 24 and a diaphragm electrode 25 which are adapted to the diaphragm 23. The upper surface of the second silicon substrate is also provided with an insulating layer 27 of silicon dioxide.
As shown in fig. 3, a cutting head for cutting ink droplets is arranged below the first silicon substrate 1, the cutting head comprises an upper electrode layer 13 arranged on the first silicon substrate 1, a PZT piezoelectric layer 14 arranged below the upper electrode layer 13, and a lower electrode layer 15 embedded on the lower surface of the PZT piezoelectric layer, the inverse piezoelectric effect deformation direction of the PZT piezoelectric layer 14 is perpendicular to the electric field direction, and the PZT piezoelectric layer 14 wraps the two sides of the lower electrode layer 15.
As shown in fig. 5, the fixed electrode 31 is surrounded by the glass substrate 3, and the fixed electrode 31 is arranged on the lower surface of the glass substrate 3 in a wire array and connected to an external circuit through a contact port 32.
As shown in fig. 6 to 9, the method for manufacturing the electrostatic inkjet printer head of the embodiment includes the following steps:
s1, selecting a 4inch silicon substrate, transferring a liquid inlet channel and a nozzle pattern to the lower surface of the first silicon substrate 1 by adopting a photoetching process, and etching through the liquid inlet channel 11 and the nozzle area 12 by adopting a deep reactive ion etching technology;
s2, transferring the graph of the cutting head to the lower surface of the first silicon substrate 1 by adopting a photoetching process, and etching a groove of the cutting head by adopting a reactive ion etching technology to form a groove of about 10-100 mu m;
s3, depositing a layer of silicon dioxide on the lower surface of the first silicon substrate 1 by adopting a PECVD process;
s4, preparing an upper electrode layer 13 of the cutting head on the groove of the cutting head by adopting a photoetching process and a metal sputtering process;
s5, depositing PZT into the groove of the cutting head by adopting a photoetching process and a PECVD process to form a PZT piezoelectric layer 14;
s6, preparing a lower electrode layer 15 of the cutting head in the groove of the cutting head by adopting a photoetching process and a metal sputtering process, removing photoresist and cleaning a silicon wafer;
s7, selecting 4inch silicon substrates, transferring the pattern of the liquid storage pool 21 to the lower surface of the second silicon substrate 2 by adopting a photoetching process, and etching a groove of the liquid storage pool 21 by adopting a reactive ion etching technology, so that the width of the vibration diaphragm 23 is about 200-500 mu m, and the thickness is about 5-50 mu m;
s8, doping boron ions in the silicon wafer sheet on the liquid storage tank 21 by adopting a photoetching process and a concentrated boron diffusion process to prepare a vibrating diaphragm 23 of a boron-silicon film;
s9, transferring the pattern of the current limiting part 22 to the lower surface of the second silicon substrate 2 by adopting a photoetching process, and etching a groove of the current limiting part 22 by adopting a reactive ion etching technology;
s10, transferring the pattern of the vibrating diaphragm electrode 23 to the lower surface of the second silicon substrate 2 by adopting a photoetching process, and etching a groove of the vibrating diaphragm electrode 23 by adopting a reactive ion etching technology;
s11, preparing a vibrating diaphragm electrode 23 in a groove of the vibrating diaphragm electrode 23 by adopting a metal sputtering process;
s12, preparing a vibrating diaphragm electrode 25 on the lower surfaces of the groove of the liquid storage tank 21 and the groove of the current limiting part 22 by adopting a photoetching process and a metal sputtering process;
s13, depositing a silicon dioxide insulating layer 26 on the lower surface of the second silicon substrate 2 by adopting a photoetching process and a PECVD (plasma enhanced chemical vapor deposition) process; cleaning a silicon wafer;
s14, depositing a silicon dioxide insulating layer 27 on the upper surface of the second silicon substrate 2 by adopting a photoetching process and a PECVD (plasma enhanced chemical vapor deposition) process;
s15, selecting a 4inch glass substrate, transferring the pattern of the electrostatic electrode groove to the lower surface of the glass substrate 3 by adopting a photoetching process, and etching a groove of the fixed electrode 31 by adopting a reactive ion etching technology, wherein the length of the groove of the fixed electrode is 3000-6000 mu m, the width of the groove of the fixed electrode is 200-500 mu m, and the depth of the groove of the fixed electrode is about 20-50 mu m;
s16, transferring the pattern of the power connection port 32 to the lower surface of the glass substrate 3 by adopting a photoetching process, and etching the power connection port 32 by adopting a reactive ion etching technology;
s17, preparing a fixed electrode 31 and a lead array on the glass substrate 3 by adopting a photoetching process and a metal sputtering process, removing photoresist and cleaning the glass substrate 3;
s18, rinsing the upper surface of the first silicon substrate 1 and the lower surface of the second silicon substrate 2 by adopting hydrofluoric acid, and bonding the upper surface of the first silicon substrate 1 and the lower surface of the second silicon substrate 2 by adopting a silicon-silicon bonding process;
s19, rinsing the upper surface of the second silicon substrate 2 and the lower surface of the glass substrate 3 by adopting hydrofluoric acid, and bonding the upper surface of the second silicon substrate 2 and the lower surface of the glass substrate 3 by adopting a silicon-glass bonding process;
s20, cleaning and scribing to finish preparation.
When the printer nozzle works, the fixed electrode 31 receives voltage, the vibrating diaphragm 23 bends upwards under the action of electrostatic force, and ink is sucked; then the voltage of the fixed electrode 31 disappears, the vibrating diaphragm 23 resets, the extrusion ink is ejected, the cutting head starts to work after the ink is extruded, and when the ink drop speed reaches the maximum, the cutting head is deformed to push the nozzle 12 to cut the ink drops by utilizing the inverse piezoelectric effect, so that the generation of satellite ink drops is avoided; after the ink drop is ejected, the cutting head is opened and the next round of ink drop ejection is started.
The electrostatic ink-jet printer nozzle of the embodiment is additionally provided with the cutting head on the basis of the traditional ink-jet printer nozzle, avoids the generation of a long tail column in the ejection process of ink drops, can effectively control the volume of the ink drops and improve the ejection speed of the ink drops; meanwhile, the jagged current-limiting part is designed, ink backflow is prevented through the multiple current-limiting columns, crosstalk among nozzles is reduced, the size of the spray head can be further reduced under the condition of process permission, and the spray head is arranged more tightly.
The number of liquid ejecting passages in the array type liquid ejecting passages of this embodiment is not limited to the number shown in the first embodiment, and may be increased or decreased according to the actual application requirement.
Example two:
the difference between this embodiment and the first embodiment is that the flow-limiting column is circular arc, the inner side of the circular arc of the flow-limiting column faces the liquid-spraying area, and other specific structures are the same as those of the first embodiment.
The specific embodiments described herein are merely illustrative of the spirit of the invention. Various modifications or additions may be made to the described embodiments or alternatives may be employed by those skilled in the art without departing from the spirit or ambit of the invention as defined in the appended claims.
Claims (10)
1. An electrostatic ink-jet printer nozzle is characterized by comprising a first silicon substrate and a second silicon substrate arranged above the first silicon substrate; one side of the second silicon substrate, which faces the first silicon substrate, is provided with a liquid storage tank; the first silicon substrate is provided with a liquid inlet channel communicated with the liquid storage pool to enable liquid to enter the liquid storage pool and a nozzle arranged at an interval with the liquid inlet channel to enable the liquid in the liquid storage pool to flow out;
the liquid storage tank is also internally provided with a flow limiting part which divides the liquid storage tank into a liquid inlet area and a liquid spraying area; the flow limiting part is positioned between the liquid inlet channel and the nozzle; the flow limiting part is provided with a flow limiting channel communicated with the liquid inlet area and the liquid spraying area; a flow limiting column is arranged on the flow limiting channel; the flow limiting column protrudes towards the inner side of the flow limiting channel, so that the liquid inlet area of the flow limiting channel is larger than the liquid outlet area.
2. The electrostatic ink jet printer head of claim 1, wherein the flow restricting pillars are distributed in an array on both sides of the flow restricting channel, the flow restricting pillars are zigzag, and the slopes of the zigzag are directed toward the liquid inlet region; the flow-limiting columns on two sides of the flow-limiting channel are arranged in a staggered mode.
3. The electrostatic ink jet printer head of claim 1, wherein the flow restricting pillars are distributed in an array on both sides of the flow restricting channel, the flow restricting pillars being arc-shaped; the flow limiting columns on the two sides of the flow limiting channel are arranged in a staggered mode; the inner side of the circular arc of the flow limiting column faces the liquid spraying area.
4. The electrostatic ink jet printer head of claim 2 or 3 wherein said flow restrictor has a plurality of flow restricting passages.
5. The electrostatic ink jet printer head of claim 4, wherein said ejection area is divided into a plurality of chambers; the chambers correspond to the flow-limiting channels one to one.
6. An electrostatic ink jet printer head as claimed in claim 5, wherein an ink jet module is disposed in said reservoir, said ink jet module including a vibratable membrane disposed in said inlet region and a fixed electrode disposed above said vibratable membrane for vibrating said vibratable membrane.
7. The electrostatic ink jet printer head of claim 6, wherein a glass substrate is further disposed over said second silicon substrate, said fixed electrode being mounted on said glass substrate.
8. The electrostatic ink jet printer head of claim 7, wherein said second silicon substrate has an insulating layer of silicon dioxide on both the upper and lower surfaces.
9. A method of manufacturing a jet for an electrostatic ink jet printer according to claims 1 to 8, characterized in that it comprises the following steps:
s1, preparing a first silicon substrate; selecting a silicon substrate, and etching a liquid inlet channel and a nozzle on the lower surface of the first silicon substrate;
s2, preparing a second silicon substrate; selecting a silicon substrate, etching a liquid storage tank groove on the lower surface of the second silicon substrate, and etching a current limiting part in the liquid storage tank;
s3, preparing a glass substrate; selecting a glass substrate, and etching a fixed electrode groove on the lower surface of the glass substrate;
s4, mounting; bonding and mounting the first silicon substrate and the second silicon substrate by adopting silicon-silicon bonding treatment; and bonding and mounting the second silicon substrate and the glass substrate by adopting a silicon-glass bonding process.
10. The method as claimed in claim 9, wherein in step S2, the width of the groove of the vibrating diaphragm is about 200 μm and the thickness is about 5-50 μm; in the step S3, the length of the fixed electrode groove etched on the glass substrate is 3000-6000 μm, the width is 200-500 μm, and the depth is about 50-100 μm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210423716.7A CN114889327B (en) | 2022-04-21 | 2022-04-21 | Electrostatic inkjet printer nozzle and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210423716.7A CN114889327B (en) | 2022-04-21 | 2022-04-21 | Electrostatic inkjet printer nozzle and preparation method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN114889327A true CN114889327A (en) | 2022-08-12 |
| CN114889327B CN114889327B (en) | 2023-05-12 |
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| CN202210423716.7A Active CN114889327B (en) | 2022-04-21 | 2022-04-21 | Electrostatic inkjet printer nozzle and preparation method thereof |
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