CN114885501B - Method for linearly controlling routing accuracy of PCB - Google Patents
Method for linearly controlling routing accuracy of PCB Download PDFInfo
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- CN114885501B CN114885501B CN202210354903.4A CN202210354903A CN114885501B CN 114885501 B CN114885501 B CN 114885501B CN 202210354903 A CN202210354903 A CN 202210354903A CN 114885501 B CN114885501 B CN 114885501B
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- 238000000034 method Methods 0.000 title claims abstract description 56
- 230000008602 contraction Effects 0.000 claims abstract description 43
- 238000004519 manufacturing process Methods 0.000 claims abstract description 8
- 230000003287 optical effect Effects 0.000 claims description 33
- 238000013461 design Methods 0.000 claims description 16
- 238000010586 diagram Methods 0.000 claims description 6
- 238000005553 drilling Methods 0.000 claims description 5
- 238000005259 measurement Methods 0.000 claims description 3
- 101150117538 Set2 gene Proteins 0.000 description 26
- 239000002699 waste material Substances 0.000 description 5
- 230000003203 everyday effect Effects 0.000 description 4
- 238000013519 translation Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000001788 irregular Effects 0.000 description 2
- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 101150104646 SET4 gene Proteins 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0008—Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
- Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
Abstract
The invention relates to a method for linearly controlling the routing accuracy of a PCB (printed Circuit Board), which is characterized in that a measuring center is arranged on a Panel, film points are respectively arranged at four corners of a process side of the Panel, then the whole expansion and contraction condition of the Panel is obtained by measuring the distance between a straight line formed by two film points on the same process side and the measuring center, and each Set in the Panel is repositioned and routed according to the whole expansion and contraction condition. The method for linearly controlling the routing accuracy of the PCB has the advantages of simple manufacturing process, high board utilization rate, high production efficiency, high routing accuracy and the like.
Description
Technical Field
The invention relates to the technical field of PCB routing, in particular to a method for linearly controlling PCB routing precision.
Background
With the updating and iteration of electronic products, new products have higher and higher requirements on the PCB, and the selling price of the traditional PCB is gradually reduced. Together with the rising price of raw materials in recent years, PCB manufacturers' profit margins are continually compressed. In order to save the cost and improve the utilization ratio of raw materials, the size of a working plate of a PCB manufacturer is continuously enlarged, and typesetting is also developed from the traditional method of irregular typesetting such as sequential gradual mixed arrangement, shape-returning spelling and the like. In such a case, considerable difficulties are brought to the expansion and contraction control of the PCB, and nondestructive correction and rework can be achieved through head piece inspection in the processes of circuit, welding prevention and the like. However, in the forming process, if the expansion and contraction gong belt is not properly stretched, the gong is easily generated on site such as deflection, small gong, large gong and the like, and furthermore, gong grooves are disqualified to generate scrapping, so that a great amount of waste is caused for production families.
Disclosure of Invention
The invention provides a method for linearly controlling the routing accuracy of the PCB, which has the advantages of simplified process, high efficiency and low cost.
In order to achieve the above object, the following technical solutions are adopted.
A method for linearly controlling the routing accuracy of a PCB (printed Circuit Board) comprises the steps of setting a measuring center on a Panel, respectively setting film points at four corners of a process edge of the Panel, measuring the distance between a straight line formed by two film points on the same process edge and the measuring center to obtain the overall expansion and contraction condition of the Panel, and repositioning each Set in the Panel and routing the Panel according to the overall expansion and contraction condition.
Further, the method for linearly controlling the routing accuracy of the PCB comprises the following steps,
s1: obtaining the expansion and contraction value of each Set, setting a measuring center, obtaining the standard spacing and the actual spacing of each Set, and comparing the actual spacing with the standard spacing to obtain the expansion and contraction value of each Set;
s2: stretching the gong belt data before gong, calculating and drawing a moving distance diagram of each Set in the Panel relative to the center Set according to the expansion and contraction value of each Set and the standard interval in the step S1;
s3: repeating the steps S1 and S2, continuously recording the expansion and contraction of each Set, the measured data and the moving distance map in the plate into a table, and finding that the moving distance of each Set, the distance from the measuring center Set and the overall expansion and contraction of the light spot are in positive correlation linear relation;
s4: the routing accuracy control is carried out, according to the measurement data, the expansion and contraction values and the moving distance map of each Set obtained in S1-S3, the moving distance of each Set is carried out, and the distance of relative movement is the largest, which is farthest from the measurement center Set; the nearest distance to the measuring center Set and the minimum distance of the relative movement;
s5: and (3) linearly controlling routing, namely setting film points at four corners of a process edge of the Panel, obtaining the overall expansion and contraction condition of each Set in the Panel by measuring the linear deviation between the standard position and the actual position of a straight line formed by two film points on the same process edge, repeating the step (S4), and routing after moving each Set to a proper position.
Further, the step S1 includes,
s1.1: typesetting of the Panel board, reading product design data in circuit board design software, typesetting and designing each Set in the product design data, and designing optical points for each Set to obtain an integral Panel board;
s1.2: obtaining Set standard spacing, namely selecting a Set as a measurement center, and obtaining the distance from a Set optical point of the measurement center to each Set optical point in the Panel to obtain each Set standard spacing;
s1.3: typesetting and designing a Panel board of Set optical points according to the step S1.1, manufacturing optical point holes of each Set in the step S1.1 on a circuit board before routing, and respectively designing film point holes at four corners of a process side of the circuit board to obtain a real object board comprising linear film point holes and each Set optical point hole;
s1.4: obtaining the actual distance of the Set, measuring the physical plate in the step S1.3, and obtaining the distance from the optical point of the Set of the measuring center to the optical point of each Set in the Panel to obtain the actual distance of each Set;
s1.5: and (3) acquiring the expansion and contraction ratio of each Set, and comparing the data acquired in the step S1.3 with the data acquired in the step S1.2 to obtain the expansion and contraction ratio of each Set deviating from the measuring center Set.
Further, the typesetting of the Panel in the step S1.1 is any one of forward typesetting, return typesetting or mixed typesetting.
Further, the film point holes are drilled synchronously in the drilling process.
Further, the optical spot holes are drilled simultaneously in the line making process.
Further, in the method for linearly controlling the routing accuracy of the PCB, when the actual spacing is smaller than the standard spacing, the board is contracted, and at the moment, the Set needs to be moved inwards to the measuring center; when the actual spacing is greater than the standard spacing, the plate appears to expand, at which point the Set needs to be moved outward away from the measurement center.
Further, the circuit board design software in the step S1.1 is generation 2000 software.
Further, the product design data is designed or made at the client or design end.
Compared with the prior art, the method for linearly controlling the routing precision of the PCB has the following beneficial effects:
firstly, the board utilization rate is high, and when the Panel board typesetting design is carried out, typesetting in various modes can be carried out, namely, in addition to the traditional sequential typesetting, the sets can be mixed-arranged, shape-returning-arranged and the like, and the boards are reasonably arranged according to the shape and the size of the sets and the size of the whole board, so that the whole board space can be reasonably utilized, and the board utilization rate is improved;
secondly, the routing accuracy is high, the whole expansion and contraction condition of each Set can be obtained through the Panel board by adopting the method for linearly controlling the PCB routing accuracy, the expansion and contraction condition of each Set is further obtained, the positions of each Set are further moved and adjusted, and after each Set is moved and adjusted to a proper position, routing programs are started again for routing to obtain each Set board, so that the routing tolerance is small, the accuracy is high, and the problems of deflection routing, routing and slot routing disqualification and the like can be effectively avoided;
thirdly, the rejection rate is low, 4000 square meters of PCBs are produced every day, the rejection rate of gong exposed copper is 0.12%, the rejection rate can be reduced by 4.8 square meters every day, the rejection rate is reduced by 4.8 x 30=144 square meters every month, the monthly waste reporting cost is reduced by 8.6 ten thousand yuan according to the average price of 600 yuan/square meter, the annual waste reporting cost is reduced by 103 ten thousand yuan, and the rejection cost is greatly reduced.
Drawings
FIG. 1 is a Panel board in-line layout I of a routing board in the prior art;
FIG. 2 is a Panel board inline layout II of a routing in the prior art;
FIG. 3 is a Panel board mixed layout diagram I adopting the method for linearly controlling the routing accuracy of the PCB of the invention;
fig. 4 is a Panel board mixed layout diagram two adopting the method for linearly controlling the routing accuracy of the PCB of the present invention;
FIG. 5 is a first illustration of a mix of film and optical points made in a method of linearly controlling PCB routing accuracy in accordance with the present invention;
fig. 6 is a second mixed layout diagram with film points and optical points manufactured in the method for linearly controlling the routing accuracy of the PCB.
Detailed Description
The method for linearly controlling the routing accuracy of the PCB according to the present invention will be described in further detail with reference to specific embodiments and drawings.
Referring to fig. 1 and 2, before the prior art PCB board is processed, sets 2 are sequentially arranged according to product design data to form a Panel board 1, and the typesetting design is suitable for regular boards with consistent sizes and shapes of the sets 2, and has a relatively good board utilization rate, but for irregular boards with consistent sizes and shapes of the sets 2, the parallel arrangement occupies a large whole board space, and the whole board utilization rate is low.
Referring to fig. 3 to 6, in a non-limiting embodiment of the present invention, a method for linearly controlling the routing accuracy of a PCB is provided, in which a measuring center is disposed on a Panel board 1, film points 6 are disposed at four corners of a process side 3 of the Panel board 1, and then an overall expansion and contraction condition of the Panel board 1 is obtained by measuring a distance between a straight line formed by two film points 6 on the same process side 3 and a measuring center, and each Set2 in the Panel board 1 is repositioned and routed according to the overall expansion and contraction condition.
Referring to fig. 3 to 6, the method of linearly controlling the accuracy of the routing of the PCB according to a non-limiting embodiment of the present invention, includes the steps of,
s1: obtaining the expansion and contraction value of each Set2, setting a measuring center, obtaining the standard spacing and the actual spacing of each Set2, and comparing the actual spacing with the standard spacing to obtain the expansion and contraction value of each Set 2;
s2: stretching the gong belt data before gong, calculating and drawing a moving distance diagram of each Set2 relative to the center Set in the Panel 1 according to the expansion and contraction values of each Set2 and the standard spacing in the step S1;
s3: repeating the steps S1 and S2, continuously recording the expansion and contraction of each Set2, the measured data and the moving distance map in the plate into a table, and finding that the moving distance of each Set2 and the distance from a measuring center Set4 and the whole expansion and contraction of an optical point 5 are in positive correlation linear relation;
s4: the routing accuracy control, according to the measurement data, the expansion and contraction value and the moving distance map of each Set2 obtained in S1-S3, the moving distance of each Set2, specifically, the farthest distance from the measuring center Set, the largest distance of the relative movement, is approximately equal to 1/4 of the actual distance between the two optical points 5 farthest from the same horizontal line; the nearest distance to the measuring center Set, the minimum distance of relative movement, approximately equal to 1/8 of the actual distance between the two optical points 5 furthest from the same horizontal line, and the like when more sets exist;
s5: and (3) linearly controlling routing, namely respectively setting film points 6 at four corners of a process side 3 of the Panel board 1, obtaining the overall expansion and contraction condition of each Set2 in the Panel board 1 by measuring the linear deviation between the standard position and the actual position of a straight line formed by the two film points 6 on the same process side 3, repeating the step (S4), and routing after moving each Set2 to a proper position.
Referring to fig. 3 to 6, in a non-limiting embodiment of the present invention, the step S1 includes,
s1.1: typesetting of the Panel board 1, reading product design data in circuit board design software, typesetting and designing each Set2 in the product design data, and designing optical points 5 for each Set2 to obtain the whole Panel board 1;
s1.2: acquiring a Set standard interval, namely selecting a Set as a measurement center, and acquiring the distance from a Set optical point 5 of the measurement center to each Set2 optical point 5 in the Panel to obtain each Set2 standard interval;
s1.3: setting and designing a Panel board 1 of a Set optical point 5 according to the step S1.1, manufacturing optical point 5 holes of each Set2 in the step S1.1 on a circuit board before routing, synchronously drilling the optical point 5 holes in a line manufacturing process, respectively designing film point 6 holes at four corners of a process side 3 of the circuit board, and synchronously drilling the film point 6 holes in a drilling manufacturing process to obtain a real object board comprising linear film point 6 holes and each Set2 optical point 5 hole;
s1.4: obtaining the actual distance of the Set, measuring the physical plate in the step S1.3, and obtaining the distance from the optical point 5 of the Set of the measuring center to the optical point 5 of each Set2 in the Panel to obtain the actual distance of each Set 2;
s1.5: and (3) acquiring the expansion and contraction ratio of each Set2, and comparing the data acquired in the step S1.3 with the data acquired in the step S1.2 to obtain the expansion and contraction ratio of each Set2 deviating from the measuring center Set.
Referring to fig. 3 to 6, in a non-limiting embodiment of the present invention, the typesetting of the Panel board 1 in the step S1.1 is any one of the inline typesetting, the zigzag typesetting or the mixed typesetting.
Referring to fig. 3 to 6, in a non-limiting embodiment of the present invention, in the method for linearly controlling the routing accuracy of the PCB, when the actual pitch is smaller than the standard pitch, the board is shrunk, and at this time, the Set needs to be moved inward toward the measurement center; when the actual spacing is greater than the standard spacing, the plate appears to expand, at which point the Set needs to be moved outward away from the measurement center.
Referring to fig. 3 to 6, in a non-limiting embodiment of the present invention, the circuit board design software in the step S1.1 is generation 2000 software.
Referring to fig. 3-6, in one non-limiting embodiment of the present invention, the product design data is designed or made at the client or design side.
Referring to fig. 5 and 6, in a non-limiting embodiment of the present invention, a standard value length and width x=573.2, y= 667.2, an actual measured value length and width x=573.114, and y= 666.886 are selected, and from the data, it is shown that the measured value < standard value, the board appears to be contracted, in this case, the Set needs to move inward toward the center, and the ratio of the measured value to the standard value is used as a collapsible coefficient, that is, the measured value/standard value=coefficient, in this embodiment, the coefficient is Set 5 bits after the decimal point and is used as a board collapsible stretch coefficient, for example, the X coefficient: 573.114/573.2 =0.99985, Y coefficient= 666.886/667.2 = 0.99953, and the value of Set translation is calculated according to the formula, according to typesetting number and direction, the maximum 3 columns in X direction, two columns on the left and right sides are selected as a group, symmetrical inward contraction (translation) amount= (measured value-standard value)/4= (573.114-573.2)/4= -0.022mm, the gong belt translates 0.022mm towards the middle along X direction to conduct gong, the middle 1 column does not need to move, and the maximum 4 rows are seen in Y direction, every 2 rows are up and down to form a group, and symmetrical inward contraction (translation) is achieved. Otherwise, when the measured value is larger than the standard value, the plate is expanded, and each Set2 is required to be translated outwards according to a specific coefficient, and gong and belt stretching data are synchronously adjusted.
Compared with the prior art, the method for linearly controlling the routing precision of the PCB has the following beneficial effects:
firstly, the board utilization rate is high, when the Panel board 1 typesetting design is carried out, various typesetting can be carried out, namely, besides the traditional sequential typesetting, the mixed typesetting, the shape-returning typesetting and the like can be carried out on each Set2, and the reasonable arrangement is carried out according to the shape and the size of each Set2 and the size of the whole board, so that the whole board space can be reasonably utilized, the board utilization rate is improved, and the board utilization rate is improved by more than 5%;
secondly, the routing efficiency is high, the precision is high, because the optical points 5 of different sets are not identical, and are not all on the same horizontal line, therefore, the method for linearly controlling the routing precision of the PCB can be used for effectively avoiding the problems of off-Set, small routing, unqualified routing and the like of routing and the like by arranging the film point 6 holes on the process side 3 of the Panel 1, realizing the whole expansion and contraction condition of the Panel 1, obtaining the expansion and contraction condition of each Set2, further moving and adjusting the position of each Set2, and starting a routing program to route the routing after moving and adjusting each Set2 to a proper position to obtain each Set 2;
thirdly, the rejection rate is low, 4000 square meters of PCBs are produced every day, the rejection rate of gong exposed copper is 0.12%, the rejection rate can be reduced by 4.8 square meters every day, the rejection rate is reduced by 4.8 x 30=144 square meters every month, the monthly waste reporting cost is reduced by 8.6 ten thousand yuan according to the average price of 600 yuan/square meter, the annual waste reporting cost is reduced by 103 ten thousand yuan, and the rejection cost is greatly reduced.
The foregoing examples are merely exemplary embodiments of the present invention, which are described in more detail and are not to be construed as limiting the scope of the invention. It should be noted that modifications and improvements can be made by those skilled in the art without departing from the spirit of the invention, and that these obvious alternatives fall within the scope of the invention.
Claims (8)
1. A method for linearly controlling the routing precision of a PCB is characterized in that: the method is that a measuring center is arranged on a Panel board, film points are respectively arranged at four corners of a process edge of the Panel board, then the whole expansion and contraction condition of the Panel board is obtained by measuring the distance between a straight line formed by two film points on the same process edge and the measuring center, each Set in the Panel board is repositioned and the board is turned according to the whole expansion and contraction condition,
s1: obtaining the expansion and contraction value of each Set, setting a measuring center, obtaining the standard spacing and the actual spacing of each Set, and comparing the actual spacing with the standard spacing to obtain the expansion and contraction value of each Set;
s2: stretching the gong belt data before gong, calculating and drawing a moving distance diagram of each Set in the Panel relative to the center Set according to the expansion and contraction value of each Set and the standard interval in the step S1;
s3: repeating the steps S1 and S2, continuously recording the expansion and contraction of each Set, the measured data and the moving distance map in the plate into a table, and finding that the moving distance of each Set, the distance from the measuring center Set and the overall expansion and contraction of the light spot are in positive correlation linear relation;
s4: the routing accuracy control is carried out, according to the measurement data, the expansion and contraction values and the moving distance map of each Set obtained in S1-S3, the moving distance of each Set is carried out, and the distance of relative movement is the largest, which is farthest from the measurement center Set; the nearest distance to the measuring center Set and the minimum distance of the relative movement;
s5: and (3) linearly controlling routing, namely setting film points at four corners of a process edge of the Panel, obtaining the overall expansion and contraction condition of each Set in the Panel by measuring the linear deviation between the standard position and the actual position of a straight line formed by two film points on the same process edge, repeating the step (S4), and routing after moving each Set to a proper position.
2. The method for linearly controlling the routing accuracy of a PCB according to claim 1, wherein the step S1 includes,
s1.1: typesetting of the Panel board, reading product design data in circuit board design software, typesetting and designing each Set in the product design data, and designing optical points for each Set to obtain an integral Panel board;
s1.2: obtaining Set standard spacing, namely selecting a Set as a measurement center, and obtaining the distance from a Set optical point of the measurement center to each Set optical point in the Panel to obtain each Set standard spacing;
s1.3: typesetting and designing a Panel board of Set optical points according to the step S1.1, manufacturing optical point holes of each Set in the step S1.1 on a circuit board before routing, and respectively designing film point holes at four corners of a process side of the circuit board to obtain a real object board comprising linear film point holes and each Set optical point hole;
s1.4: obtaining the actual distance of the Set, measuring the physical plate in the step S1.3, and obtaining the distance from the optical point of the Set of the measuring center to the optical point of each Set in the Panel to obtain the actual distance of each Set;
s1.5: and (3) acquiring the expansion and contraction ratio of each Set, and comparing the data acquired in the step S1.3 with the data acquired in the step S1.2 to obtain the expansion and contraction ratio of each Set deviating from the measuring center Set.
3. The method for linearly controlling the routing accuracy of the PCB according to claim 2, wherein the typesetting of the Panel in step S1.1 is any one of a inline typesetting, a zigzag typesetting, and a mixed typesetting.
4. A method of linearly controlling the accuracy of routing a PCB according to claim 3 wherein said film spot holes are drilled simultaneously during the drilling process.
5. A method of linearly controlling the accuracy of routing a PCB according to claim 3 wherein said optical spot holes are drilled simultaneously in a line making process.
6. Method for linearly controlling the routing accuracy of a PCB according to any one of claims 2 to 5,
when the actual spacing is smaller than the standard spacing, the plate is contracted, and at the moment, the Set needs to be moved inwards to the measuring center;
when the actual spacing is greater than the standard spacing, the plate appears to expand, at which point the Set needs to be moved outward away from the measurement center.
7. A method for linearly controlling the routing accuracy of a PCB according to claim 6, wherein the board design software in step S1.1 is genesis2000 software.
8. A method of linearly controlling the accuracy of PCB routing as claimed in claim 7 wherein the product design data is designed or made at the client or design end.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202210354903.4A CN114885501B (en) | 2022-04-06 | 2022-04-06 | Method for linearly controlling routing accuracy of PCB |
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| CN114885501B true CN114885501B (en) | 2023-12-29 |
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2022
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|---|---|---|---|---|
| JP2006303074A (en) * | 2005-04-19 | 2006-11-02 | Nec Toppan Circuit Solutions Inc | Method and device for manufacturing printed wiring board |
| CN103747617A (en) * | 2013-12-24 | 2014-04-23 | 广州兴森快捷电路科技有限公司 | PCB expansion compensation method |
| CN104244625A (en) * | 2014-09-19 | 2014-12-24 | 江西景旺精密电路有限公司 | Method for milling PCB without positioning holes |
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