CN1148798C - Locating ring for chip carrier - Google Patents
Locating ring for chip carrier Download PDFInfo
- Publication number
- CN1148798C CN1148798C CNB01112105XA CN01112105A CN1148798C CN 1148798 C CN1148798 C CN 1148798C CN B01112105X A CNB01112105X A CN B01112105XA CN 01112105 A CN01112105 A CN 01112105A CN 1148798 C CN1148798 C CN 1148798C
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- CN
- China
- Prior art keywords
- locating ring
- grinding
- chip carrier
- present
- lapping liquid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The present invention relates to a positioning ring for a wafer carrier, which is formed by high molecular polymer containing abradant material. The positioning ring is rubbed with a grinding pad, and then the abradant material contained in the positioning ring is released. The positioning ring is convenient to position, and prevents grinding liquid from generating the condensation phenomenon. Simultaneously, the present invention can shorten the change time of the grinding liquid and simplify the integral grinding operation, and thus, the present invention has reduced cost and enhanced production capacity.
Description
The present invention relates to the locating ring (retaining ring) of a kind of chip carrier (wafer carrier), the locating ring of the chip carrier of particularly a kind of cmp (CMP) device usefulness.
As shown in Figure 1, existing chemical mechanical polishing device mainly includes a grinding plate (polishing plate) 1, that is used for carrying out wafer grinding and is layed in grinding pad (polishingpad) 2 on this grinding plate, in order to catch by the chip carrier 3 of grinding wafers 5, in order to supply with the lapping liquid feed mechanism 4 of lapping liquid 6.
As shown in Figure 1, this chip carrier 3 mainly comprises a grinding head (polish head) 31, reaches a pressuring shaft (spindle) 32.Again, as shown in Figure 2, this grinding head 31 is by a grinding head body (polish headbody) 311, one adsorbed film (membrane) 312, reaches 313 formations of a locating ring (retaining ring).As shown in Figure 3, existing locating ring 313 is formed by Teflon mostly, but since higher by the locating ring hardness that Teflon constituted, therefore, when using this kind locating ring 313, must make wafer 5 little being exposed to outside the locating ring 313, to avoid injuring grinding pad 2.Because this kind locating ring 313 must make wafer 5 little dew in use, therefore, very inconvenience on the location, particularly in use for some time, locating ring 313 produces distortion slightly mostly, so will make wafer 5 more difficult location.
For addressing the above problem, recently, the insider brings into use one by poly-sulfuration dimethylbenzene (polyphenylene-sulfide, hereinafter to be referred as PPS) formed locating ring 313, because the hardness of this kind locating ring 313 is lower, therefore, when using this kind locating ring 313, need not consider the relation that is provided with of 313 of wafer 5 and locating rings especially, because can wear away with the friction of grinding pad 2 when exposing by the formed locating ring 313 of PPS, in other words, when utilizing this kind locating ring 313 to fix wafer 5, will be comparatively convenient.
Yet above-mentioned PPS locating ring 313 though it can promote the convenience on the location, still, can not produce for the integral grinding operation and simplify effect.Therefore, how to keep the convenience of location, can simplify the integral grinding operation again is an important topic in fact.At this, so-called grinding operation comprises that locating ring is changed operation, lapping liquid is changed operation etc.
Also have, though the composition of existing lapping liquid 6 because of the different needs of wafer surface composition difference to some extent, still, generally speaking, it mainly comprises grinding agent material (abrasive), deionized water (DI water), chemical solvent or oxidant etc.Because existing lapping liquid 6 all contains the grinding agent material, therefore, when it circulates in (not being shown among the figure) such as pipelines of lapping liquid feed mechanism 4 for a long time, be easy to produce the phenomenon of condensing, thereby make polishing particles excessive, consequently scratch wafer 5 when grinding.Therefore, how to avoid causing the wafer scratch to be another important topic in fact because of the particle that the cohesion of grinding agent material forms.
The object of the present invention is to provide a kind of locating ring of locating conveniently and can avoid the chip carrier of lapping liquid generation coacervation.
Another object of the present invention is to provide a kind of lapping liquid that shortens to change the time, simplify the integral grinding operation, thereby reduce cost, improve the locating ring of the chip carrier of production capacity.
The object of the present invention is achieved like this, and a kind of locating ring of chip carrier promptly is provided, in order to a wafer orientation on a chip carrier, wherein: this locating ring is formed by a high molecular polymer that contains the grinding agent material.
By locating ring of the present invention, then can be when grinding, by the friction of locating ring and grinding pad, thereby the grinding agent material that it is contained disengages, and so, lapping liquid adds the grinding agent material again with not needing, so, do not have the problem that in the pipeline of lapping liquid feed mechanism, produces the phenomenon of condensing yet.
In addition,, then can directly change locating ring of the present invention, and need not as changing lapping liquid as existing, and cleaning the pipeline of lapping liquid feed mechanism if when only needing to change the grinding agent material.Even must change lapping liquid, and when cleaning the pipeline of lapping liquid feed mechanism, also produce because of not having coacervation in its lapping liquid feed mechanism, therefore, change, can be quicker during cleaning.In view of the above, then can shorten lapping liquid greatly changes the time, simplifies the integral grinding operation, to reduce cost, to improve production capacity.
Below in conjunction with accompanying drawing, describe embodiments of the invention in detail, wherein:
Fig. 1 is the key diagram of the part formation of existing chemical mechanical polishing device;
Fig. 2 is the critical piece exploded view of the chip carrier of existing chemical mechanical polishing device;
Fig. 3 is the cut-away section end view of existing chip carrier;
Fig. 4 A is an embodiment key diagram of the locating ring of chip carrier of the present invention;
Fig. 4 B is the upward view shown in Fig. 4 A.
Below will specify preferred embodiment of the present invention according to Fig. 4 A, Fig. 4 B.What will illustrate earlier before specifying preferred embodiment of the present invention is that for the facility on illustrating, the figure number major part in the present embodiment is continued to use above-mentioned figure number.
Shown in Fig. 4 A and Fig. 4 B, the locating ring 313 of chip carrier 3 of the present invention ' be in order to a wafer 5 is positioned on the chip carrier 3.This locating ring 313 ' formed by a high molecular polymer (polymer) that contains the grinding agent material.In the present embodiment, in order to form this locating ring 313 ' the grinding agent material can be SiO
2, Al
2O
3, or CeO
2Deng.
By locating ring 313 of the present invention ', then can be when grinding, by of the friction of this locating ring 313 ' ring with grinding pad 2, thereby the grinding agent material that it is contained disengages, so, lapping liquid adds the grinding agent material again with not needing, so, do not have the problem that in the pipeline of lapping liquid feed mechanism 4, produces the phenomenon of condensing yet.
In addition, if when only needing to change the grinding agent material, then can directly change locating ring 313 of the present invention ', and need not as changing lapping liquid as existing, and cleaning the pipeline of lapping liquid feed mechanism 4.Even must change lapping liquid, and when cleaning the pipeline of lapping liquid feed mechanism 4, also produce because of not having coacervation in its lapping liquid feed mechanism 4, therefore, change, can be quicker during cleaning.In view of the above, then can shorten lapping liquid greatly and change the time, simplify the integral grinding operation, thereby reduce cost, improve production capacity.
In the detailed description of above-mentioned preferred embodiment; the specific embodiment that is proposed is only in order to be easy to illustrate technology contents of the present invention; and be not with narrow sense of the present invention be limited among this embodiment; in the situation that does not exceed spirit of the present invention and following claim protection range, can make many variations and implement.
Claims (4)
1. the locating ring of a chip carrier, in order to a wafer orientation on a chip carrier, it is characterized in that:
This locating ring comprises that one contains the high molecular polymer of grinding agent material.
2. the locating ring of chip carrier as claimed in claim 1, wherein this grinding agent material is SiO
2
3. the locating ring of chip carrier as claimed in claim 1, wherein this grinding agent material is Al
2O
3
4. the locating ring of chip carrier as claimed in claim 1, wherein this grinding agent material is CeO
2
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB01112105XA CN1148798C (en) | 2001-03-28 | 2001-03-28 | Locating ring for chip carrier |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB01112105XA CN1148798C (en) | 2001-03-28 | 2001-03-28 | Locating ring for chip carrier |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1377070A CN1377070A (en) | 2002-10-30 |
| CN1148798C true CN1148798C (en) | 2004-05-05 |
Family
ID=4659196
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB01112105XA Expired - Fee Related CN1148798C (en) | 2001-03-28 | 2001-03-28 | Locating ring for chip carrier |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1148798C (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7699688B2 (en) * | 2006-11-22 | 2010-04-20 | Applied Materials, Inc. | Carrier ring for carrier head |
| US20100225011A1 (en) * | 2009-03-06 | 2010-09-09 | Taiwan Semiconductor Manufacturing Company, Ltd. | System and Method for Integrated Circuit Fabrication |
-
2001
- 2001-03-28 CN CNB01112105XA patent/CN1148798C/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| CN1377070A (en) | 2002-10-30 |
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| C19 | Lapse of patent right due to non-payment of the annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |