CN114879435B - Projector with a light source for projecting light - Google Patents

Abstract

The invention relates to a projector, which comprises a shell, a light machine, a circuit board, a first heat radiating device and a first fan, wherein the light machine, the circuit board, the first heat radiating device and the first fan are arranged in the shell. The circuit board is arranged above the optical machine and is an electronic element. The first heat dissipation device comprises a first heat radiator, a first heat conduction pipe and a first heat conduction substrate, wherein the first heat conduction substrate is arranged on the circuit board and is in thermal connection with the electronic element. The first heat conduction pipe is in heat conduction connection with the first heat conduction substrate, one end, far away from the first heat conduction substrate, of the first heat conduction pipe is enclosed outside the periphery of the circuit board, and the first radiator is arranged at one end, far away from the first heat conduction substrate, of the first heat conduction pipe. The first fan is arranged below the optical machine and is used for driving cooling air entering the shell through the air inlet to flow through the first heat dissipation device and be discharged from the air outlet. Therefore, the problem of heat dissipation of the electronic element can be solved under the condition that the first fan is far away from the electronic element and other parts are blocked.

Description

Projector with a light source for projecting light

Technical Field

The present disclosure relates to projection technology, and in particular, to a projector.

Background

A projector is a device capable of projecting video, images, characters, and the like onto a screen to display them, and is widely used in houses, offices, schools, movie theatres, and the like.

Electronic components, such as chips, etc., are an important component of projectors. As electronic components become more powerful, heat dissipation requirements become higher. Meanwhile, the volume and portability of the projector are higher and higher for consumers, the stacking of the internal structure of the projector is more and more compact, the situation that a fan is far away from an electronic element and other parts are blocked between the fan and the electronic element often occurs, and therefore the heat dissipation difficulty of the electronic element is increased.

Disclosure of Invention

Based on this, it is necessary to provide a projector capable of effectively solving the problem of heat dissipation of electronic components; in addition, the volume of the projector can be reduced.

The projector is characterized by comprising a shell, a light machine, a circuit board, a first heat dissipation device and a first fan, wherein the light machine, the circuit board, the first heat dissipation device and the first fan are arranged in the shell;

The circuit board is arranged above the optical machine and is provided with an electronic element;

The first heat dissipation device comprises a first heat radiator, a first heat conduction pipe and a first heat conduction substrate, wherein the first heat conduction substrate is arranged on the circuit board and is in heat conduction connection with the electronic element; the first heat conduction pipe is in heat conduction connection with the first heat conduction substrate, one end, far away from the first heat conduction substrate, of the first heat conduction pipe is arranged on the outer side of the periphery of the circuit board in a surrounding mode, and the first radiator is arranged at one end, far away from the first heat conduction substrate, of the first heat conduction pipe;

the shell is provided with an air inlet and an air outlet, the air inlet is positioned above the circuit board, and the air outlet is positioned below the optical machine;

The first fan is arranged below the optical machine and is used for driving cooling air flow entering the shell through the air inlet hole to flow through the first heat radiating device and be discharged from the air outlet hole.

In one embodiment, the electronic component is disposed on a side of the circuit board away from the optical machine; the first heat conduction substrate is arranged on one side of the electronic element far away from the circuit board and is in heat conduction connection with the electronic element; the first heat conduction pipe is arranged on one side of the first heat conduction substrate far away from the electronic element and is in heat conduction connection with the first heat conduction substrate.

In one embodiment, the first heat conduction pipe comprises a first pipe body and a second pipe body connected with the first pipe body, and the first pipe body is in contact with the first heat conduction substrate; the second pipe body is arranged on the outer side of the periphery of the circuit board in a surrounding mode, and the first radiator is arranged on one side, facing the optical machine, of the second pipe body.

In one embodiment, the first heat-conducting pipe further comprises an arc-shaped third pipe body, and two ends of the third pipe body are respectively connected with the first pipe body and the second pipe body, so that the first heat-conducting pipe is L-shaped.

In one embodiment, the projector further comprises a first sound box, wherein the first sound box is arranged on one side of the optical machine; the first sound box is arranged below the second pipe body and is arranged at intervals with the second pipe body, and the first radiator is arranged between the second pipe body and the first sound box.

In one embodiment, the first radiator includes a plurality of first radiating fins, the plurality of first radiating fins are arranged at intervals along the length direction of the second tube body, and a first airflow channel is formed between two adjacent first radiating fins.

In one embodiment, the housing includes a top case, a bottom case, and a side wall, where the top case, the bottom case, and the side wall enclose to form a housing cavity, the circuit board, the optical engine, the first heat dissipation device, and the first fan are all disposed in the housing cavity, the air inlet is disposed at the top of the top case, and the air outlet is disposed at the side wall; the first fan is provided with a first air inlet and a first air outlet, the first air inlet faces the air inlet hole and is communicated with the air inlet hole, and the first air outlet faces the air outlet hole and is communicated with the air outlet hole.

In one embodiment, a projection lens is connected to one side of the optical machine, an optical modulator is arranged in the optical machine, a second heat dissipation device is arranged on one side of the optical machine away from the projection lens, and the second heat dissipation device is thermally connected with the optical modulator; the projector also comprises a light source device, wherein the light source device is connected to the lower side of the optical machine and protrudes out of one side of the optical machine away from the projection lens; the projector also comprises a second fan, the second fan is positioned above the light source device, the second fan is arranged on one side, far away from the optical machine, of the second heat radiating device, the second fan is provided with a second air inlet and a second air outlet which are oppositely arranged, and the second air outlet faces the second heat radiating device.

In one embodiment, the projector further includes a third heat dissipating device, where the third heat dissipating device includes a third radiator, a third heat conducting pipe, and a third heat conducting substrate, where the third heat conducting substrate is disposed on the light source device and is in heat conducting connection with the light source device, the third heat conducting pipe is in heat conducting connection with the third heat conducting substrate, and the third radiator is disposed on one end of the third heat conducting pipe far away from the third heat conducting substrate and is located between the first air outlet and the air outlet.

In one embodiment, the projector further comprises a first bracket, a second bracket and a third bracket which are stacked in sequence along the top to the bottom of the shell, the circuit board is installed above the first bracket, the optical machine is installed between the first bracket and the second bracket, and the first fan is installed between the second bracket and the third bracket; the projector also comprises a low-frequency loudspeaker which is arranged below the third bracket

The above projector, when in operation, the electronic component generates heat. Because the electronic component is thermally connected with the first heat conduction substrate, the first heat conduction substrate is in heat conduction connection with the first heat conduction pipe, and therefore heat of the electronic component is conducted to the first heat conduction substrate and then conducted to the first heat conduction pipe. Because the phase change material is filled in the first heat conduction pipe, when one end of the first heat conduction pipe connected with the first heat conduction substrate is heated, the phase change material absorbs heat and is vaporized, and steam moves along the first heat conduction pipe to one end far away from the first heat conduction substrate so as to transfer heat to the first radiator. The first fan rotates to generate negative pressure, so that air outside the shell enters the shell through the air inlet, and the air forms cooling air flow under the action of the first fan. The first fan blows cooling air flow to the first radiator, the cooling air flow takes away heat on the first radiator, and then the temperature of one end of the first heat conduction pipe far away from the first heat conduction substrate is reduced, so that steam at one end of the first heat conduction pipe far away from the first heat conduction substrate is liquefied, and liquefied liquid returns to one end of the first heat conduction pipe connected with the first heat conduction substrate again. The phase change material in the first heat conduction pipe is continuously vaporized and liquefied, and the heat of the electronic element is transmitted from one end of the first heat conduction pipe to the other end, so that the heat dissipation problem of the electronic element can be effectively solved even if the first fan is far away from the electronic element and other parts are blocked. In addition, the circuit board is arranged above the optical machine, one end of the first heat conduction pipe, which is far away from the first heat conduction substrate, is enclosed outside the periphery of the circuit board, the first radiator is arranged at one end of the first heat conduction pipe, which is far away from the first heat conduction substrate, so that the space between the circuit board and the optical machine can be reasonably utilized, the space utilization rate is improved, and the size of the projector is reduced.

Drawings

The accompanying drawings, which are included to provide a further understanding of the application and are incorporated in and constitute a part of this specification, illustrate embodiments of the application and together with the description serve to explain the application.

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for the description of the embodiments will be briefly described below, and it is apparent that the drawings in the following description are only some embodiments of the present invention, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

FIG. 1 is a schematic diagram of a projector according to an embodiment of the invention;

Fig. 2 is a structural exploded view of the projector shown in fig. 1;

FIG. 3 is a schematic view of the internal structure of the projector shown in FIG. 2;

fig. 4 is a structural exploded view of the internal structure of the projector shown in fig. 3;

FIG. 5 is a schematic diagram showing a first heat dissipating device of the projector shown in FIG. 1 mounted on a circuit board;

Fig. 6 is a structural exploded view of a first heat sink of the projector shown in fig. 5.

Reference numerals illustrate: 10. a housing; 11. a top shell; 111. an air inlet hole; 12. a bottom case; 13. a sidewall; 131. an assembly port; 14. a rear case; 141. an air outlet hole; 20. a light machine; 21. a second heat sink; 22. a third heat sink; 221. a third heat sink; 222. a third heat conduction pipe; 223. a third heat conductive substrate; 30. a circuit board; 31. an electronic component; 32. a first fixing hole; 40. a first heat sink; 41. a first heat conductive substrate; 411. a second fixing hole; 42. a first heat conduction pipe; 421. a first tube body; 422. a second tube body; 423. a third tube body; 43. a first heat sink; 50. a first fan; 60. a first sound box; 70. a second fan; 80. a first bracket; 81. a second bracket; 82. a third bracket; 90. a low frequency speaker.

Detailed Description

In order that the above objects, features and advantages of the invention will be readily understood, a more particular description of the invention will be rendered by reference to the appended drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. The present invention may be embodied in many other forms than described herein and similarly modified by those skilled in the art without departing from the spirit of the invention, whereby the invention is not limited to the specific embodiments disclosed below.

Referring to fig. 1 to 4, a projector according to an embodiment of the invention includes a housing 10, and a light engine 20, a circuit board 30, a first heat dissipating device 40 and a first fan 50 disposed in the housing 10. The circuit board 30 is disposed above the optical machine 20, and the circuit board 30 is provided with electronic components 31. The first heat dissipating device 40 includes a first heat sink 43, a first heat conductive pipe 42, and a first heat conductive substrate 41, where the first heat conductive substrate 41 is disposed on the circuit board 30 and is thermally connected to the electronic component 31. The first heat conducting tube 42 is in heat conducting connection with the first heat conducting substrate 41, and one end, far away from the first heat conducting substrate 41, of the first heat conducting tube 42 is surrounded on the outer side of the periphery of the circuit board 30. The first heat sink 43 is disposed at an end of the first heat conductive pipe 42 away from the first heat conductive substrate 41. The housing 10 is provided with an air inlet 111 and an air outlet 141, the air inlet 111 is located above the circuit board 30, and the air outlet 141 is located below the optical machine 20. The first fan 50 is disposed below the optical engine 20, and the first fan 50 is configured to drive the cooling airflow entering the housing 10 through the air inlet 111 to flow through the first heat dissipating device 40 and be discharged from the air outlet 141.

Alternatively, the first heat conductive substrate 41 is an aluminum substrate or a copper substrate. The first heat-conducting substrate 41 is closely matched with the electronic element 31; or the first heat-conducting substrate 41 is provided with heat-conducting silicone grease, and the heat-conducting silicone grease is in close fit with the electronic component 31, so that the first heat-conducting substrate 41 and the electronic component 31 are in heat-conducting connection.

Optionally, the circuit board 30 is a main board, the electronic element 31 is a main control chip, and the main control chip is used for processing input image signals, connecting wireless signals, and the like; the main board is also provided with a printed circuit and various input interfaces, wherein the input interfaces comprise an earphone/sound output interface, a USB interface, a DC power supply interface and the like. Of course, the circuit board 30 may be a power board, and the electronic component 31 may be a power control chip.

The circuit board 30 is provided with a main control chip or a power control chip, and other heating elements such as a capacitor. Under the action of the first fan 50, the cooling air flow entering the casing 10 through the air inlet 111 can also flow through the circuit board 30, so as to dissipate heat of other heating elements such as capacitors on the circuit board 30.

Optionally, the first fan 50 is a vortex fan, which has advantages of small volume, high pressure, and fast wind speed. Of course, in other embodiments, the first fan 50 may be another type of fan, but not limited thereto.

The above projector, in operation, generates heat from the electronic component 31. Since the electronic component 31 is thermally connected to the first heat conductive substrate 41, the first heat conductive substrate 41 is thermally connected to the first heat conductive pipe 42, so that the heat of the electronic component 31 is firstly transferred to the first heat conductive substrate 41 and then transferred to the first heat conductive pipe 42. Since the first heat conductive pipe 42 is filled with the phase change material, when one end of the first heat conductive pipe 42 connected to the first heat conductive substrate 41 is heated, the phase change material absorbs heat and evaporates, and the steam moves along the first heat conductive pipe 42 to one end far away from the first heat conductive substrate 41 to transfer heat to the first heat sink 43. The first fan 50 rotates to generate negative pressure, so that air outside the housing 10 enters the housing 10 through the air inlet 111, and the air forms cooling air flow under the action of the first fan 50. The first fan 50 blows cooling air flow to the first radiator 43, the cooling air flow takes away heat on the first radiator 43, and further the temperature of one end of the first heat conduction pipe 42 far away from the first heat conduction substrate 41 is reduced, so that steam at one end of the first heat conduction pipe 42 far away from the first heat conduction substrate 41 is liquefied, and the liquefied liquid returns to one end of the first heat conduction pipe 42 connected with the first heat conduction substrate 41 again. The phase change material in the first heat conducting pipe 42 is continuously vaporized and liquefied, and the heat of the electronic element 31 is transmitted from one end of the first heat conducting pipe 42 to the other end, so that the heat dissipation problem of the electronic element 31 can be effectively solved even if the first fan 50 is far away from the electronic element 31 and other parts are blocked. In addition, the circuit board 30 is disposed above the optical engine 20, one end of the first heat-conducting tube 42 away from the first heat-conducting substrate 41 is disposed on the outer side of the periphery of the circuit board 30, and the first heat radiator 43 is disposed on one end of the first heat-conducting tube 42 away from the first heat-conducting substrate 41, so that the space between the circuit board 30 and the optical engine 20 can be reasonably utilized, the space utilization rate can be improved, and the size of the projector can be reduced.

In one embodiment, referring to fig. 3 and 4, the electronic component 31 is disposed on a side of the circuit board 30 remote from the optical machine 20. The first heat-conducting substrate 41 is disposed on a side of the electronic component 31 away from the circuit board 30, and is in heat-conducting connection with the electronic component 31. The first heat conducting tube 42 is disposed on a side of the first heat conducting substrate 41 away from the electronic component 31, and is in heat conducting connection with the first heat conducting substrate 41. In the working process of the projector, the optical engine 20 generates heat, so that the electronic component 31, the first heat conducting substrate 41 and the first heat conducting pipe 42 are arranged on one side of the circuit board 30 away from the optical engine 20, thus the influence of the heat generated by the optical engine 20 on the electronic component 31 can be effectively reduced, and the heat dissipation efficiency of the electronic component 31 is improved.

Further, referring to fig. 5 and 6, the first heat conductive pipe 42 includes a first pipe 421 and a second pipe 422 connected to the first pipe 421, and the first pipe 421 is in contact with the first heat conductive substrate 41. Alternatively, the first tube 421 is extended along the length direction of the first heat conductive substrate 41. The second tube 422 is disposed around the outer side of the periphery of the circuit board 30, and the first heat sink 43 is disposed on a side of the second tube 422 facing the optical machine 20. In this way, the length of the first heat pipe 42 is extended, and the heat dissipation area of the first heat sink 43 is increased, thereby improving the heat dissipation efficiency of the electronic component 31.

Further, the first heat conductive pipe 42 further includes an arc-shaped third pipe body 423, and two ends of the third pipe body 423 are respectively connected with the first pipe body 421 and the second pipe body 422, so that the first heat conductive pipe 42 is L-shaped. Thus, the first heat-conducting pipe 42 is simple in structure and convenient to produce and process. In addition, the first heat sink 43 is far from the first tube 421, so that heat conducted to the first tube 421 is prevented from affecting the heat dissipation efficiency of the first heat sink 43.

In the present embodiment, referring to fig. 5, the electronic component 31 is disposed along the length direction of the circuit board 30, and the first heat conductive substrate 41 is disposed along the length direction of the circuit board 30. The first heat conductive pipe 42 includes a first pipe 421 and a second pipe 422 connected to the first pipe 421, where the first pipe 421 extends along the length direction of the circuit board 30 and contacts the first heat conductive substrate 41; the second tube 422 extends along the width direction of the circuit board 30 and is disposed around the outer side of the periphery of the circuit board 30. The first heat sink 43 is disposed on a side of the second pipe 422 facing the optical machine 20.

Further, referring to fig. 3, 4 and 5, the projector further includes a first speaker 60, and the first speaker 60 is disposed on one side of the optical machine 20. The first sound box 60 is disposed below the second tube 422 and spaced from the second tube 422. The first radiator 43 is disposed between the second tube 422 and the first speaker 60. In this way, the first sound box 60 is disposed below the first tube 421 and spaced from the second tube 422 to form a receiving space, and the first radiator 43 is disposed in the receiving space, so as to reasonably utilize the space between the first sound box 60 and the second tube 422, improve the space utilization, and facilitate reducing the volume of the projector.

Still further, the projector further includes a second speaker disposed on the other side of the optical engine 20. In this way, the first sound box 60 and the second sound box play sound from two sides of the optical machine 20, so that the stereo perception of the sound played by the projector is improved, the internal space of the shell 10 can be reasonably utilized, the space utilization rate is improved, and the size of the projector is reduced.

In one embodiment, referring to fig. 4 and 5, the first heat sink 43 includes a plurality of first heat dissipation fins, and the plurality of first heat dissipation fins are disposed at intervals along the length direction of the second tube 422, and a first air flow channel is formed between two adjacent first heat dissipation fins. Alternatively, the first heat sink 43 may be provided between the circuit board 30 and the housing 10; or the first heat sink 43 may be provided between the optical machine 20 and the housing 10. The direction of the first air flow channel intersects the longitudinal direction of the second tube 422. When the projector works, heat of the electronic component 31 is conducted to the first radiating fins through the first heat conducting base plate 41 and the first heat conducting pipe 42, and under the action of the first fan 50, cooling air flows from the air inlet 111 to the first radiating fins, so that the heat of the first radiating fins is taken away, and the temperature of the electronic component 31 is reduced. In this way, the plurality of first heat dissipation fins are disposed along the length direction of the second tube 422, so that the heat dissipation area of the first heat sink 43 can be increased, and the heat dissipation efficiency of the electronic component 31 can be effectively improved.

Of course, in other embodiments, the first radiator 43 may also be a condensing radiator or the like.

In one embodiment, referring to fig. 5 and 6, the projector further includes a fixture. The circuit board 30 is provided with a first fixing hole 32, the first heat conducting substrate 41 is correspondingly provided with a second fixing hole 411, and the first heat conducting substrate 41 passes through the first fixing hole 32 and the second fixing hole 411 through the fixing piece at the same time so as to be detachably mounted on the circuit board 30. Thus, the first heat-conducting substrate 41 can be fixed on the circuit board 30, so that the first heat-conducting substrate 41 is prevented from moving relative to the electronic component 31, and the heat dissipation effect of the electronic component 31 is ensured. In addition, the first heat conducting substrate 41 is detachably mounted on the circuit board 30 through the fixing piece, so that the first heat conducting substrate 41 and the circuit board 30 can be detached, and maintenance is convenient.

Alternatively, the first fixing hole 32 and the second fixing hole 411 are threaded, and the fixing member is a screw, a bolt, or the like.

In one embodiment, referring to fig. 1 and 2, the housing 10 includes a top case 11, a bottom case 12, and a side wall 13, where the top case 11, the bottom case 12, and the side wall 13 enclose a housing cavity, and the circuit board 30, the optical engine 20, the first heat dissipation device 40, and the first fan 50 are all disposed in the housing cavity. The air inlet 111 is provided at the top of the top case 11, and the air outlet 141 is provided at the side wall 13. The first fan 50 has a first air inlet and a first air outlet, and the first air inlet faces the air inlet 111 and is communicated with the air inlet 111. The first air outlet faces the air outlet 141 and communicates with the air outlet 141. When the projector works, the first fan 50 is started, the cooling air flow enters the accommodating cavity from the air inlet 111 of the top shell 11 under the action of the first fan 50 and is blown to the first heat conducting substrate 41, the first heat conducting pipe 42 and the first radiator 43 so as to dissipate heat of the first heat conducting substrate 41, the first heat conducting pipe 42 and the first radiator 43, and then the air flow after heat exchange is discharged from the air outlet 141 of the side wall 13. Since the circuit board 30 is disposed on the top of the optical engine 20, in the present embodiment, the air inlet 111 is disposed on the top of the top case 11, so that the cooling air is directly blown to the first heat conductive substrate 41, the first heat conductive pipe 42 and the first heat sink 43 through the air inlet 111, thereby improving the heat dissipation efficiency of the electronic component 31.

Specifically, the first fan 50 further has a third air inlet, and the third air inlet is located on a side of the first fan 50 facing away from the optical engine 20 and is opposite to the first air inlet. The first fan 50 sucks the cooling air flow through the first air inlet and the third air inlet which are respectively arranged on the upper side surface and the lower side surface, so that the flow speed of the cooling air flow can be improved, and the heat dissipation efficiency can be improved.

The number, shape, etc. of the air inlet 111 and the air outlet 141 may be set according to actual requirements, and are not particularly limited herein. In the present embodiment, the air inlet 111 is a circular hole, and a plurality of air inlet 111 are arranged in a ring shape and are disposed around the circuit board 30; the air outlet holes 141 are bar-shaped holes, and a plurality of air outlet holes 141 are arranged at intervals along the circumferential direction of the side wall 13.

Specifically, the side wall 13 is provided with a fitting opening 131 communicating with the housing chamber. The housing 10 further includes a rear case 14, and the rear case 14 is mounted to the fitting opening 131. The air outlet 141 is provided in the rear case 14. In this way, the rear case 14 can be detached from the side wall 13, facilitating maintenance of the circuit board 30, the optical machine 20, the first fan 50, etc. in the housing 10.

Further, referring to fig. 3, a projection lens is connected to one side of the optical machine 20. The optical machine 20 is internally provided with an optical modulator, one side of the optical machine 20 away from the projection lens is provided with a second heat dissipation device 21, and the second heat dissipation device 21 is thermally connected with the optical modulator. The projector further comprises a light source device connected to the lower side of the light machine 20, and the light source device protrudes out of the side of the light machine 20 away from the projection lens. The projector further comprises a second fan 70, wherein the second fan 70 is located above the light source device, and the second fan 70 is arranged on one side, away from the optical machine 20, of the second heat dissipation device 21. The second fan 70 has a second air inlet and a second air outlet which are oppositely arranged, and the second air outlet faces the second heat dissipating device 21. In operation of the projector, the light modulator generates heat and transfers the heat to the second heat sink 21. At this time, the second fan 70 rotates to generate negative pressure, and air entering the housing 10 through the air inlet 111 forms a cooling air flow under the action of the second fan 70. The second fan 70 blows cooling air flow to the second heat dissipation device 21, the cooling air flow takes away heat on the second heat dissipation device 21, heat dissipation of the light modulator is achieved, and the air flow after heat exchange is sucked by the first air inlet and/or the third air inlet of the first fan 50 and finally discharged out of the casing 10 from the air outlet hole 141. In this way, the cooling air flow blown by the second fan 70 can better dissipate heat from the optical modulator. In addition, the second fan 70 is disposed in the space enclosed by the light source device and the second heat dissipating device 21, so as to reasonably utilize the internal space of the housing 10, improve the space utilization, and facilitate reducing the volume of the projector.

The lower side of the optical engine 20 refers to the side of the optical engine 20 near the first fan 50.

It should be noted that, the first fan 50 is further configured to drive the cooling air flow entering the housing 10 to flow through the optical engine 20 and the projection lens, so as to dissipate heat of the optical engine 20 and the projection lens.

Optionally, the light modulator is DMD, LCos, LCD screens, which is not limited thereto.

Specifically, referring to fig. 3, the second heat dissipation device 21 includes a plurality of second heat dissipation fins disposed at intervals, and a second airflow channel is formed between two adjacent second heat dissipation fins, where one end of the second airflow channel faces the second fan 70, and the other end faces the light modulator.

Further, the projector further includes a third heat sink 22. The third heat sink 22 is thermally coupled to the light source device. When the projector works, the light source device generates heat and transmits the heat to the third heat dissipation device 22, and the third heat dissipation device 22 dissipates heat to reduce the temperature of the light source device.

Optionally, referring to fig. 3 and 4, the third heat dissipating device 22 includes a third heat sink 221, a third heat conducting tube 222, and a third heat conducting substrate 223, where the third heat conducting substrate 223 is disposed on the light source device and is in heat conducting connection with the light source device, the third heat conducting tube 222 is in heat conducting connection with the third heat conducting substrate 223, and the third heat sink 221 is disposed at one end of the third heat conducting tube 222 away from the third heat conducting substrate 223 and is located between the first air outlet and the air outlet hole 141. The cooling air flow discharged from the first air outlet of the first fan 50 passes through the third radiator 221 to take away the heat transferred from the light source device to the third radiator 221, so as to radiate the light source device, and finally the cooling air flow is discharged from the air outlet 141 to the outside of the housing. It should be noted that, the heat dissipation principle of the third heat dissipation device 22 can refer to the heat dissipation principle of the first heat dissipation device 40, and will not be described herein.

Specifically, the third heat sink 221 may also include a plurality of third heat dissipating fins disposed at intervals along the top-to-bottom direction of the housing 10 (i.e., the height direction of the housing 10), and a third air flow channel is formed between two adjacent third heat dissipating fins. It is understood that the plurality of third heat dissipating fins may be disposed at intervals along other directions, such as a length direction of the first air outlet of the first fan 50, a circumferential direction of the housing 10, and the like.

In one embodiment, referring to fig. 3, the projector further includes a first bracket 80, a second bracket 81, and a third bracket 82 stacked in order along the top to bottom of the housing 10. The circuit board 30 is mounted above the first bracket 80, the optical engine 20 is mounted between the first bracket 80 and the second bracket 81, and the first fan 50 is mounted between the second bracket 81 and the third bracket 82. In this way, by providing the first bracket 80, the second bracket 81 and the third bracket 82, the circuit board 30 is disposed above the first bracket 80, the optical machine 20 is disposed between the first bracket 80 and the second bracket 81, and the first fan 50 is disposed between the second bracket 81 and the third bracket 82, so that the stability of the circuit board 30, the optical machine 20 and the first fan 50 can be improved.

Further, referring to fig. 3, the projector further includes a low frequency speaker 90, and the low frequency speaker 90 is mounted below the third bracket 82. In this way, the low-frequency speaker 90 is mounted below the third bracket 82, so that the circuit board 30, the optical engine 20, the first fan 50 and the low-frequency speaker 90 are stacked along the top to the bottom of the housing 10, the stacking is compact, the lateral space of the projector is saved, and meanwhile, the brightness of the projector is not affected; at the same time, the stability of the installation of the low-frequency speaker 90 can also be improved.

In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the device or element being referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present invention.

Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In the description of the present invention, the meaning of "plurality" means at least two, for example, two, three, etc., unless specifically defined otherwise.

In the present invention, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly, through intermediaries, or both, may be in communication with each other or in interaction with each other, unless expressly defined otherwise. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art according to the specific circumstances.

In the present invention, unless expressly stated or limited otherwise, a first feature "up" or "down" a second feature may be the first and second features in direct contact, or the first and second features in indirect contact via an intervening medium. Moreover, a first feature being "above," "over" and "on" a second feature may be a first feature being directly above or obliquely above the second feature, or simply indicating that the first feature is level higher than the second feature. The first feature being "under", "below" and "beneath" the second feature may be the first feature being directly under or obliquely below the second feature, or simply indicating that the first feature is less level than the second feature.

It will be understood that when an element is referred to as being "fixed" or "disposed" on another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like are used herein for illustrative purposes only and are not meant to be the only embodiment.

The technical features of the above-described embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above-described embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.

The above examples illustrate only a few embodiments of the invention, which are described in detail and are not to be construed as limiting the scope of the invention. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the invention, which are all within the scope of the invention. Accordingly, the scope of protection of the present invention is to be determined by the appended claims.

Claims (10)

1. The projector is characterized by comprising a shell, and an optical engine, a circuit board, a light source device, a first heat dissipation device, a first fan and a second fan which are arranged in the shell;

The circuit board is arranged above the optical machine, and an electronic element is arranged on one side of the circuit board away from the optical machine;

The first heat dissipation device comprises a first heat radiator, a first heat conduction pipe and a first heat conduction substrate, and the first heat conduction substrate is arranged on one side of the electronic element far away from the circuit board and is in heat conduction connection with the electronic element; the first heat conduction pipe is arranged on one side, far away from the electronic element, of the first heat conduction substrate, the first heat conduction pipe is in heat conduction connection with the first heat conduction substrate, one end, far away from the first heat conduction substrate, of the first heat conduction pipe is arranged on the outer side of the periphery of the circuit board in a surrounding mode, and the first radiator is arranged on one end, far away from the first heat conduction substrate, of the first heat conduction pipe;

the shell is provided with an air inlet and an air outlet, the air inlet is positioned above the circuit board, and the air outlet is positioned below the optical machine;

the first fan is arranged below the optical machine and is used for driving cooling air flow entering the shell through the air inlet hole to flow through the first heat radiating device and be discharged from the air outlet hole;

one side of the optical machine is connected with a projection lens, an optical modulator is arranged in the optical machine, a second heat dissipation device is arranged on one side of the optical machine, which is far away from the projection lens, and the second heat dissipation device is in thermal connection with the optical modulator;

the light source device is connected to the lower side of the optical machine and protrudes out of one side of the optical machine away from the projection lens;

The second fan is located the top of light source device, just the second fan is located the second heat abstractor is kept away from one side of ray apparatus, the second fan has second air intake and the second air outlet of relative setting, the second air outlet orientation the second heat abstractor, the second fan is used for driving and gets into through the fresh air inlet the cooling air current in the casing flows through the second heat abstractor is followed by the first fan is inhaled and is followed the apopore discharges.

2. The projector according to claim 1, wherein the first heat conduction pipe includes a first pipe body and a second pipe body connected to the first pipe body, the first pipe body being in contact with the first heat conduction substrate; the second pipe body is arranged on the outer side of the periphery of the circuit board in a surrounding mode, and the first radiator is arranged on one side, facing the optical machine, of the second pipe body.

3. The projector according to claim 2, wherein the first heat pipe further comprises an arc-shaped third pipe body, and two ends of the third pipe body are respectively connected with the first pipe body and the second pipe body, so that the first heat pipe is L-shaped.

4. The projector of claim 2, further comprising a first speaker disposed on one side of the light engine; the first sound box is arranged below the second pipe body and is arranged at intervals with the second pipe body, and the first radiator is arranged between the second pipe body and the first sound box.

5. The projector according to claim 2, wherein the first radiator includes a plurality of first heat radiating fins arranged at intervals along a length direction of the second tube body, and a first air flow passage is formed between two adjacent first heat radiating fins.

6. The projector according to any one of claims 1 to 5, wherein the housing includes a top case, a bottom case, and a side wall, the top case, the bottom case, and the side wall are enclosed to form a housing cavity, the circuit board, the optical engine, the first heat dissipating device, and the first fan are all disposed in the housing cavity, the air inlet is disposed at a top of the top case, and the air outlet is disposed at the side wall; the first fan is provided with a first air inlet and a first air outlet, and the first air inlet faces the air inlet hole and is communicated with the air inlet hole; the first air outlet faces the air outlet hole and is communicated with the air outlet hole.

7. The projector of claim 6 further comprising a third heat sink, the third heat sink comprising a third heat sink, a third heat pipe, and a third heat conductive substrate, the third heat conductive substrate being disposed on the light source device and in heat conductive connection with the light source device, the third heat pipe being in heat conductive connection with the third heat conductive substrate, the third heat sink being disposed at an end of the third heat pipe remote from the third heat conductive substrate and between the first air outlet and the air outlet.

8. The projector according to any one of claims 1 to 5, wherein the second heat dissipating device includes a plurality of second heat dissipating fins arranged at intervals, and a second air flow channel is formed between two adjacent second heat dissipating fins, one end of the second air flow channel faces the second fan, and the other end faces the light modulator.

9. The projector of any of claims 1 to 5, further comprising a first bracket, a second bracket, and a third bracket stacked in order along a top to a bottom of the housing, the circuit board is mounted above the first bracket, the light engine is mounted between the first bracket and the second bracket, and the first fan is mounted between the second bracket and the third bracket.

10. The projector of claim 9, further comprising a low frequency speaker mounted below the third mount.