CN114850483B - Device and method for rapidly and efficiently screening uniform solder balls - Google Patents
Device and method for rapidly and efficiently screening uniform solder balls Download PDFInfo
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- CN114850483B CN114850483B CN202210462024.3A CN202210462024A CN114850483B CN 114850483 B CN114850483 B CN 114850483B CN 202210462024 A CN202210462024 A CN 202210462024A CN 114850483 B CN114850483 B CN 114850483B
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- 229910000679 solder Inorganic materials 0.000 title claims abstract description 79
- 238000012216 screening Methods 0.000 title claims abstract description 61
- 238000000034 method Methods 0.000 title claims abstract description 27
- 239000002184 metal Substances 0.000 claims abstract description 68
- 238000002360 preparation method Methods 0.000 claims abstract description 61
- 238000001816 cooling Methods 0.000 claims abstract description 38
- 230000008569 process Effects 0.000 claims abstract description 10
- 230000000087 stabilizing effect Effects 0.000 claims description 52
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 32
- 239000007788 liquid Substances 0.000 claims description 22
- 238000003860 storage Methods 0.000 claims description 20
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims description 17
- 229910052757 nitrogen Inorganic materials 0.000 claims description 16
- 238000002844 melting Methods 0.000 claims description 13
- 230000008018 melting Effects 0.000 claims description 13
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 10
- 238000010438 heat treatment Methods 0.000 claims description 10
- 239000001301 oxygen Substances 0.000 claims description 10
- 229910052760 oxygen Inorganic materials 0.000 claims description 10
- 239000007789 gas Substances 0.000 claims description 9
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 claims description 9
- 230000008859 change Effects 0.000 claims description 7
- 229910001338 liquidmetal Inorganic materials 0.000 claims description 4
- 239000003507 refrigerant Substances 0.000 claims description 3
- 238000007873 sieving Methods 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 238000004100 electronic packaging Methods 0.000 abstract 1
- 239000011859 microparticle Substances 0.000 abstract 1
- 238000002474 experimental method Methods 0.000 description 7
- 238000000926 separation method Methods 0.000 description 5
- 230000001276 controlling effect Effects 0.000 description 4
- 238000007711 solidification Methods 0.000 description 4
- 230000008023 solidification Effects 0.000 description 4
- 238000011161 development Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000002923 metal particle Substances 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 230000007363 regulatory process Effects 0.000 description 2
- 235000019483 Peanut oil Nutrition 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000000368 destabilizing effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- 125000003827 glycol group Chemical group 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000000312 peanut oil Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F9/00—Making metallic powder or suspensions thereof
- B22F9/02—Making metallic powder or suspensions thereof using physical processes
- B22F9/06—Making metallic powder or suspensions thereof using physical processes starting from liquid material
- B22F9/08—Making metallic powder or suspensions thereof using physical processes starting from liquid material by casting, e.g. through sieves or in water, by atomising or spraying
- B22F9/082—Making metallic powder or suspensions thereof using physical processes starting from liquid material by casting, e.g. through sieves or in water, by atomising or spraying atomising using a fluid
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F9/00—Making metallic powder or suspensions thereof
- B22F9/02—Making metallic powder or suspensions thereof using physical processes
- B22F9/06—Making metallic powder or suspensions thereof using physical processes starting from liquid material
- B22F9/08—Making metallic powder or suspensions thereof using physical processes starting from liquid material by casting, e.g. through sieves or in water, by atomising or spraying
- B22F9/082—Making metallic powder or suspensions thereof using physical processes starting from liquid material by casting, e.g. through sieves or in water, by atomising or spraying atomising using a fluid
- B22F2009/0824—Making metallic powder or suspensions thereof using physical processes starting from liquid material by casting, e.g. through sieves or in water, by atomising or spraying atomising using a fluid with a specific atomising fluid
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F9/00—Making metallic powder or suspensions thereof
- B22F9/02—Making metallic powder or suspensions thereof using physical processes
- B22F9/06—Making metallic powder or suspensions thereof using physical processes starting from liquid material
- B22F9/08—Making metallic powder or suspensions thereof using physical processes starting from liquid material by casting, e.g. through sieves or in water, by atomising or spraying
- B22F9/082—Making metallic powder or suspensions thereof using physical processes starting from liquid material by casting, e.g. through sieves or in water, by atomising or spraying atomising using a fluid
- B22F2009/0848—Melting process before atomisation
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F9/00—Making metallic powder or suspensions thereof
- B22F9/02—Making metallic powder or suspensions thereof using physical processes
- B22F9/06—Making metallic powder or suspensions thereof using physical processes starting from liquid material
- B22F9/08—Making metallic powder or suspensions thereof using physical processes starting from liquid material by casting, e.g. through sieves or in water, by atomising or spraying
- B22F9/082—Making metallic powder or suspensions thereof using physical processes starting from liquid material by casting, e.g. through sieves or in water, by atomising or spraying atomising using a fluid
- B22F2009/0888—Making metallic powder or suspensions thereof using physical processes starting from liquid material by casting, e.g. through sieves or in water, by atomising or spraying atomising using a fluid casting construction of the melt process, apparatus, intermediate reservoir, e.g. tundish, devices for temperature control
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F9/00—Making metallic powder or suspensions thereof
- B22F9/02—Making metallic powder or suspensions thereof using physical processes
- B22F9/06—Making metallic powder or suspensions thereof using physical processes starting from liquid material
- B22F9/08—Making metallic powder or suspensions thereof using physical processes starting from liquid material by casting, e.g. through sieves or in water, by atomising or spraying
- B22F9/082—Making metallic powder or suspensions thereof using physical processes starting from liquid material by casting, e.g. through sieves or in water, by atomising or spraying atomising using a fluid
- B22F2009/0896—Making metallic powder or suspensions thereof using physical processes starting from liquid material by casting, e.g. through sieves or in water, by atomising or spraying atomising using a fluid particle transport, separation: process and apparatus
Abstract
The invention discloses a device and a method for screening uniform solder balls rapidly and efficiently. The device is suitable for high-frequency and high-quality preparation of micro solder balls for electronic packaging and the balling and screening of other metal micro particles based on jet disturbance technology. Comprises a uniform metal droplet preparation device, a cooling balling system and an automatic screening system. The method is simple and easy, avoids the secondary screening process and saves the production cost.
Description
Technical Field
The invention relates to the field of solder ball production equipment, in particular to a device and a method for rapidly and efficiently screening uniform solder balls.
Background
The uniform solder ball is an indispensable important material in advanced packaging, and can be used to replace pins in an IC element packaging structure, so as to meet the requirements of electrical interconnection and mechanical connection. The development of BGA (ball grid array) and CSP (wafer level package) packages has complied with the trend of technology development and met the needs of people for electronics to be short, small, lightweight, and thin. However, when the uniform solder balls are prepared by using the jet disturbance technology, the collected solder balls comprise non-uniform metal solder balls generated in the initial stage of solder ball preparation and the final stage of solder ball preparation, and the non-satisfactory solder balls are required to be screened out by the later stage of multi-stage screening, so that the solder ball preparation process is increased to a certain extent, the solder ball preparation cost is increased, and therefore, the device for screening out the non-uniform solder balls generated in the initial stage and the later stage of solder ball preparation in the solder ball preparation process is provided, and the device has important value and significance.
Chinese patent CN110842209a discloses a device for preparing uniform metal particles by differential pressure regulation and electromagnetic disturbance, which implements a method for preparing uniform metal particles by non-contact direct-drive and continuous injection technology, and the solder balls in the device are formed into balls in peanut oil, and no solder ball separation device is involved. Chinese patent CN1899732a discloses a method and apparatus for preparing precision solder balls, in which a piezoelectric exciter is used to generate vibration exciting metal jet and break the metal jet into uniform droplets to prepare uniform particles, the broken uniform droplets enter special solidification forming equipment, in which solidification liquid can control the temperature gradient and solidification speed of solidification process, so that the metal droplets are solidified to form solder balls with high roundness, but the apparatus does not involve solder ball screening, and cannot accurately screen out inferior solder balls generated due to unstable equipment during the preparation of equipment in the production process.
The existing ball forming cooling device for preparing the solder balls by using the jet disturbance technology mostly forms balls in specific media, has long ball forming interval, does not have a separation and screening function, cannot timely separate good and bad solder balls, influences the ball forming efficiency, can only be realized by means of multiple screening in the later stage, increases the solder ball preparation process to a certain extent, and improves the solder ball preparation cost. Therefore, how to develop a device and a method for fast and efficiently screening uniform solder balls is a problem to be solved by those skilled in the art.
Disclosure of Invention
The invention aims to provide a device and a method for rapidly and efficiently screening uniform solder balls, which solve the problems that most of the existing ball forming cooling devices in the preparation of solder balls by using a jet disturbance technology are formed in specific media, the ball forming interval is long, the separation and screening functions are not provided, the good and bad solder balls cannot be separated in time, the ball forming efficiency is affected, the ball forming can only be realized by means of multiple screening in the later stage, the preparation process of the solder balls is increased to a certain extent, and the preparation cost of the solder balls is increased.
In order to solve the technical problems, the invention adopts the following technical scheme:
the invention relates to a device for rapidly and efficiently screening uniform solder balls, which comprises a uniform metal droplet preparation device and a rapid cooling tube, wherein melting heating coils are arranged on two sides of the uniform metal droplet preparation device, a temperature sensor is arranged in the uniform metal droplet preparation device, the melting heating coils and the temperature sensor are electrically connected with an intelligent PID temperature controller, a balling cavity is arranged at the lower end of the uniform metal droplet preparation device, a nozzle of the uniform metal droplet preparation device extends into the balling cavity, the upper end of the rapid cooling tube extends into the balling cavity and is matched with the nozzle, a cooler is arranged on the rapid cooling tube, the cooler is connected with a refrigerator, a screening switch is arranged at the lower end of the rapid cooling tube, and a balling storage bin and a inferior ball storage bin are arranged at the lower end of the screening switch.
Furthermore, observation windows are arranged on two sides of the balling cavity.
Further, the device also comprises a pneumatic control system, wherein the pneumatic control system comprises a nitrogen tank, a pressure stabilizing tank and a PLC integrated control system, the nitrogen tank is connected with the pressure stabilizing tank through a pipeline, a miniature electric valve is arranged on a connecting pipeline of the nitrogen tank and the pressure stabilizing tank, the pressure stabilizing tank is connected with the uniform metal droplet preparation device through a pipeline, and a precise gas pressure stabilizing valve is arranged on a connecting pipeline of the pressure stabilizing tank and the uniform metal droplet preparation device; the upper end of the uniform metal droplet preparation device is provided with a second air pressure sensor, the bottom of the uniform metal droplet preparation device is provided with a pressure sensor, the surge tank is provided with first air pressure, and the first air pressure sensor, the second air pressure sensor, the miniature electric valve and the precise air pressure stabilizing valve are electrically connected with the PLC integrated control system.
Further, the balling cavity is connected with a vacuum pump and an oxygen content analyzer.
Further, the screening switch is electrically connected with the PLC integrated control system.
Further, the refrigerant of the refrigerator is glycol, and the rapid cooling pipe is at constant temperature of-20 ℃.
The method for screening the uniform solder balls by adopting the device for screening the uniform solder balls rapidly and efficiently comprises the following steps of:
s1, reducing oxygen content in a balling environment:
firstly, a miniature electric valve and a precise gas pressure stabilizing valve are opened, a vacuum pump is utilized to vacuumize a uniform metal droplet preparation device, a pressure stabilizing tank, a balling cavity and a connecting pipeline, and when the readings of a first gas pressure sensor and a second gas pressure sensor reach-99.99 kPa, the vacuum pump is closed; then, the nitrogen tank is utilized to inflate the interiors of the uniform metal droplet preparation device, the pressure stabilizing tank and the balling cavity, when the air pressure in the whole device reaches 0kPa, the miniature electric valve is closed, and the above processes are repeated for a plurality of times, so that the oxygen content in the interiors of the uniform metal droplet preparation device, the pressure stabilizing tank and the balling cavity is reduced to below 300 ppm;
s2, setting a melting temperature:
the metal in the uniform metal droplet preparation device is melted into liquid metal through a melting heating coil, a temperature sensor and an intelligent PID temperature controller, and the temperature fluctuation amplitude is smaller than 1 ℃ through multiple times of adjustment of the intelligent PID temperature controller, so that the requirement of the device is met;
s3, applying pneumatic control parameters:
the air control system consists of a nitrogen tank, a miniature electric valve, a pressure stabilizing tank, an air pressure sensor, a precise air pressure stabilizing valve and a PLC integrated control system, wherein the adjusting process comprises coarse adjustment and fine adjustment, the coarse adjustment is to indirectly control the air pressure in the pressure stabilizing tank through the on-off of the miniature electric valve controlled by the PLC in the PLC integrated control system, the adjusting process is to close the miniature electric valve by the PLC when an air pressure signal obtained by the sensor is consistent with a signal set by the PLC, and the closing time of the electromagnetic valve is required, so that the pressure value obtained in the pressure stabilizing tank is slightly larger than the set air pressure, the air pressure in the pressure stabilizing tank is not greatly different from the air pressure required by the free liquid level in the uniform metal droplet preparation device 1, and then the air in the pressure stabilizing tank is slowly flushed into the uniform metal droplet preparation device through the precise air pressure stabilizing valve, so that the purpose of precisely controlling the air pressure is achieved;
s4, applying a balling parameter:
controlling the end head of a jet liquid column to break through a jet disturbance technology to form uniform micro-droplets, opening a solder ball collecting switch, enabling the uniform micro-droplets to enter a cooling area related to a cooler, solidifying the uniform micro-droplets into balls in the cooling area, wherein the cooling area related to the cooler is generated by a refrigerator and liquid glycol filled in the refrigerator, and the glycol is circularly filled into the cooler at a set temperature of-20 ℃ so that the temperature of a rapid cooling pipe is kept at-20 ℃; the screening switch is connected with the PLC integrated control system, and is opened to the inferior ball storage bin in the period of T1, and is opened to the ball storage bin when the pressure change curve in the PLC integrated control system, which displays uniform metal droplet preparation device, is in linear stable change when the pressure change curve exceeds T1; and setting a pressure threshold, detecting the content of liquid in the uniform metal droplet preparation device through a pressure sensor, and when the liquid level is too low, disturbing the jet flow, wherein the uniformity of the prepared solder balls is poor, and a screening switch guides the inferior ball storage bin to be opened, so that the qualified solder balls with regular shapes and uniform sizes are cooled and collected.
Compared with the prior art, the invention has the beneficial technical effects that:
according to the device and the method for rapidly and efficiently screening the uniform solder balls, after the solder balls are prepared by a jet disturbance technology, the cooling separation device and the screening switch are additionally arranged, so that the solder balls with poor uniformity in the early and later stages of the experiment are conveyed to the inferior ball storage bin, and the uniform solder balls in the stable period of the experiment are conveyed to the ball storage bin. The uneven metal solder balls generated in the initial stage of solder ball preparation and the final stage of solder ball preparation are accurately screened out by reasonably adjusting the pressure in the uniform metal droplet preparation device and the screening switching time of the cooler, so that secondary screening is avoided, the production cost is saved, the effect of quickly and efficiently balling solder balls with the diameter of less than 0.3mm and automatically screening the solder balls is optimal, and the problems that the quality solder balls cannot be timely separated, the ball making efficiency is influenced and the implementation can only be realized by means of multiple screening in the later stage in the prior art are effectively solved.
Drawings
The invention is further described with reference to the following description of the drawings:
fig. 1 is a schematic diagram of an apparatus for rapid and efficient screening of uniform solder balls according to the present invention.
Reference numerals illustrate: 1. a homogeneous metal droplet generator; 2. a melting heating coil; 3. a temperature sensor; 4. an intelligent PID temperature controller; 5. a balling cavity; 6. an observation window; 7. an oxygen content analyzer; 8. a nitrogen tank; 9. a miniature electric valve; 10. a surge tank; 11. a first air pressure sensor; 12. a precision gas pressure stabilizing valve; 13. a PLC integrated control system; 14. a vacuum pump; 15. a second air pressure sensor; 16. a rapid cooling tube; 17. a collection switch; 18. a cooler; 19. a screening switch; 20. a balling storage bin; 21. a bad ball storage bin; 22. a freezer; 23. a pressure sensor.
Detailed Description
As shown in fig. 1, an apparatus for rapid and efficient screening of uniform solder balls includes a uniform metal droplet generator 1 and a rapid cooling tube 16.
The two sides of the uniform metal droplet generator 1 are provided with melting heating coils 2, a temperature sensor 3 is arranged in the uniform metal droplet generator 1, and the melting heating coils 2 and the temperature sensor 3 are electrically connected with an intelligent PID temperature controller 4.
The lower end of the uniform metal droplet generator 1 is provided with a balling cavity 5, and two sides of the balling cavity 5 are provided with observation windows 6.
The nozzle of the uniform metal droplet generator 1 extends into the balling chamber 5, the upper end of the rapid cooling pipe 16 extends into the balling chamber 5 and is matched with the nozzle, a cooler 18 is arranged on the rapid cooling pipe 16, the cooler 18 is connected with a refrigerator 22, the refrigerant of the refrigerator 22 is glycol, and the rapid cooling pipe 16 is at a constant temperature of-20 ℃.
The lower end of the quick cooling pipe 16 is provided with a screening switch 19, and the lower end of the screening switch 19 is provided with a ball storage bin 20 and a bad ball storage bin 21. The screening switch 19 is electrically connected with the PLC integrated control system 13.
The device comprises a nitrogen tank 8, a pressure stabilizing tank 10 and a PLC integrated control system 13, wherein the nitrogen tank 8 is connected with the pressure stabilizing tank 10 through a pipeline, a miniature electric valve 9 is arranged on a connecting pipeline of the nitrogen tank 8 and the pressure stabilizing tank 10, the pressure stabilizing tank 10 is connected with the uniform metal droplet preparation device 1 through a pipeline, and a precise gas pressure stabilizing valve 12 is arranged on a connecting pipeline of the pressure stabilizing tank 10 and the uniform metal droplet preparation device 1; the upper end of the uniform metal droplet preparation device 1 is provided with a second air pressure sensor 15, the bottom of the uniform metal droplet preparation device 1 is provided with a pressure sensor 23, the surge tank 10 is provided with a first air pressure 11, and the first air pressure sensor 11, the second air pressure sensor 15, the pressure sensor 23, the miniature motor valve 9 and the precise air surge valve 12 are electrically connected with the PLC integrated control system 13.
The balling chamber 5 is connected with a vacuum pump 14 and an oxygen content analyzer 7.
The principle of the invention is as follows: after the solder balls are prepared by the jet disturbance technology, a cooling separation device is additionally arranged, the liquid glycol is cooled by a refrigerator 22, and is circularly poured into a cooler 18, so that the temperature in a ball rapid cooling pipe 16 is kept at about-20 ℃ and the solder ball droplets are rapidly cooled into solder ball particles. A screening switch 19 is additionally arranged at the bottom end of the quick cooling pipe 16, the screening switch 19 is connected with the PLC integrated control system 13, and the screening of the solder balls is realized by controlling the switching time through the PLC integrated control system 13, wherein the screening and removing of the solder balls comprise unqualified solder balls caused by insufficient air pressure in the early stage of the experiment and unqualified solder balls caused by low liquid level and insufficient stability in the uniform metal droplet preparation device 1 in the later stage of the experiment; the early-stage unqualified solder balls are screened out by setting the time T1 for guiding the start screening switch 19 to the inferior ball storage bin 21, the experiment after T1 enters a stable period, and the screening switch 19 is automatically guided to the ball storage bin 20; a pressure threshold value is set when the liquid level in the uniform metal droplet generator 1 is low, and the pressure threshold value is detected by a pressure sensor 23 and transmitted to the PLC integrated control system 13 to control a screening switch 19 to screen off the unqualified solder balls in the later stage. Finally, the accurate elimination of the solder balls comprises unqualified solder balls caused by insufficient air pressure in the early stage of the experiment and unqualified solder balls caused by low liquid level and insufficient stability in the uniform metal droplet preparation device 1 in the later stage of the experiment.
The action process of the invention is as follows:
s1, reducing oxygen content in a balling environment:
firstly, a miniature electric valve 9 and a precise gas pressure stabilizing valve 12 are opened, a vacuum pump 14 is utilized to vacuumize a uniform metal droplet preparation device 1, a pressure stabilizing tank 10, a balling cavity 5 and a connecting pipeline, and when the readings of a first air pressure sensor 11 and a second air pressure sensor 15 reach-99.99 kPa, the vacuum pump 14 is closed; then, the nitrogen tank 8 is utilized to charge the inside of the uniform metal droplet preparation device 1, the pressure stabilizing tank 10 and the balling cavity 5, when the air pressure in the whole device reaches 0kPa, the micro electric valve 9 is closed, and the above process is repeated for a plurality of times, so that the oxygen content in the uniform metal droplet preparation device 1, the pressure stabilizing tank 10 and the balling cavity 5 is reduced to below 300 ppm;
s2, setting a melting temperature:
the metal in the uniform metal droplet preparation device 1 is melted into liquid metal through the melting heating coil 2, the temperature sensor 3 and the intelligent PID temperature controller 4, and the temperature fluctuation amplitude is smaller than 1 ℃ through multiple times of adjustment of the intelligent PID temperature controller 4, so that the requirement of the device is met;
s3, applying pneumatic control parameters:
the pneumatic control system consists of a nitrogen tank 8, a miniature electric valve 9, a pressure stabilizing tank 10, a pneumatic pressure sensor 11, a precise pneumatic pressure stabilizing valve 12 and a PLC integrated control system 13, wherein constant pneumatic pressure is applied to the free liquid level so that liquid metal in the uniform metal droplet preparation device 1 is jetted from a nozzle outlet to form a jet liquid column, the stable pneumatic pressure is applied to the free liquid level, the regulating process comprises coarse regulation and fine regulation, the coarse regulation is that the pneumatic pressure in the pressure stabilizing tank 10 is indirectly controlled by controlling the on-off of the miniature electric valve 9 through the PLC in the PLC integrated control system 13, the regulating process is that when a pneumatic pressure signal acquired by the sensor is consistent with a signal set by the PLC, the PLC sends out a signal to close the miniature electric valve 9, and the closing time of the electromagnetic valve needs to ensure that the acquired pneumatic pressure value in the pressure stabilizing tank 10 is slightly greater than the set pneumatic pressure, the pneumatic pressure in the pressure stabilizing tank 10 is not greatly different from the pneumatic pressure required by the free liquid level in the uniform metal droplet preparation device 1, and then the pneumatic pressure in the pressure stabilizing tank 10 is slowly flushed into the uniform metal droplet preparation device 1 through the precise pneumatic pressure stabilizing valve 12, so that the purpose of precise control is achieved;
s4, applying a balling parameter:
the method for generating uniform disturbance comprises the steps of piezoelectric disturbance, electromagnetic disturbance, mechanical vibration and the like, opening a solder ball collecting switch 17, enabling the uniform droplets to enter a cooling area involved in a cooler 18, solidifying the uniform droplets into balls in the cooling area, enabling a cooling area involved in the cooler 18 to be generated by a refrigerator 22 and liquid glycol in the refrigerator 22, circularly filling the cooling area into the cooler 18 at the temperature of-20 ℃ and enabling the temperature of a quick cooling pipe 16 to be constant at-20 ℃; the screening switch 19 is connected with the PLC integrated control system 13, and in the period of T1, the screening switch 19 is opened to the inferior ball storage bin 21, and when the pressure change curve in the PLC integrated control system 13 displays uniform metal droplet generator 1 to be in linear stable change when the pressure exceeds T1, the screening switch 19 is opened to the ball storage bin 20; and setting a pressure threshold value, detecting the content of liquid in the uniform metal droplet generator 1 through the pressure sensor 23, and when the liquid level is too low, destabilizing jet disturbance, wherein the uniformity of the prepared solder balls is poor, and the screening switch 19 guides the inferior ball storage bin 21 to be opened so as to realize cooling and collecting qualified solder balls with regular shapes and uniform sizes.
The above embodiments are only illustrative of the preferred embodiments of the present invention and are not intended to limit the scope of the present invention, and various modifications and improvements made by those skilled in the art to the technical solutions of the present invention should fall within the protection scope defined by the claims of the present invention without departing from the design spirit of the present invention.
Claims (4)
1. A method for screening uniform solder balls based on a device for screening uniform solder balls rapidly and efficiently is characterized by comprising the following steps: the method comprises the following steps:
s1, reducing oxygen content in a balling environment:
firstly, a miniature electric valve (9) and a precise gas pressure stabilizing valve (12) are opened, a vacuum pump (14) is utilized to vacuumize a uniform metal droplet preparation device (1), a pressure stabilizing tank (10), a balling cavity (5) and a connecting pipeline, and when the readings of a first air pressure sensor (11) and a second air pressure sensor (15) reach-99.99 kPa, the vacuum pump (14) is closed; then, the nitrogen tank (8) is utilized to inflate the interiors of the uniform metal droplet preparation device (1), the pressure stabilizing tank (10) and the balling cavity (5), when the air pressure in the whole device reaches 0kPa, the miniature electric valve (9) is closed, and the above processes are repeated for a plurality of times, so that the oxygen content in the interiors of the uniform metal droplet preparation device (1), the pressure stabilizing tank (10) and the balling cavity (5) is reduced to below 300 ppm;
s2, setting a melting temperature:
the metal in the uniform metal droplet preparation device (1) is melted into liquid metal through the melting heating coil (2), the temperature sensor (3) and the intelligent PID temperature controller (4), and the temperature fluctuation amplitude is smaller than 1 ℃ through multiple times of adjustment of the intelligent PID temperature controller (4), so that the requirement of the device is met;
s3, applying pneumatic control parameters:
the air control system consists of a nitrogen tank (8), a miniature electric valve (9), a pressure stabilizing tank (10), a first air pressure sensor (11) and a second air pressure sensor (15), a precise air pressure stabilizing valve (12) and a PLC integrated control system (13), wherein the adjusting process comprises coarse adjustment and fine adjustment, the coarse adjustment is to indirectly control the air pressure in the pressure stabilizing tank (10) through controlling the on-off state of the miniature electric valve (9) by the PLC in the PLC integrated control system (13), the adjusting process is to enable the PLC to send out a signal to close the miniature electric valve (9) when an air pressure signal obtained by the sensor is consistent with a signal set by the PLC, and the air pressure value obtained in the pressure stabilizing tank (10) is slightly larger than the set air pressure because the closing time of an electromagnetic valve is needed, at the moment, the air pressure in the pressure stabilizing tank (10) is not greatly different from the air pressure required by the free liquid level in the uniform metal droplet preparation device (1), and then the air in the uniform metal droplet preparation device (1) is slowly flushed into the uniform metal by the precise air pressure stabilizing valve (12), so that the control air pressure is accurately achieved;
s4, applying a balling parameter:
the jet flow liquid column end is controlled to be broken to form uniform micro-droplets by a jet flow disturbance technology, a solder ball collecting switch (17) is opened, the uniform micro-droplets enter a cooling area related to a cooler (18), the uniform micro-droplets are solidified into balls in the cooling area, a cooling area related to the cooler (18) is generated by a refrigerator (22) and liquid glycol filled in the refrigerator, the glycol is circularly filled into the cooler (18) at the set temperature of-20 ℃, and the temperature of a quick cooling pipe (16) is kept at-20 ℃; the screening switch (19) is connected with the PLC integrated control system (13), and in the period of T1, the screening switch (19) is opened to the inferior ball storage bin (21), and when the pressure change curve in the PLC integrated control system (13) displays uniform metal droplet preparation device 1 to be in linear stable change when the pressure exceeds T1, the screening switch (19) is opened to the ball storage bin (20); setting a pressure threshold, detecting the content of liquid in the uniform metal droplet generator (1) through a pressure sensor (23), and when the liquid level is too low, performing jet disturbance to be unstable, wherein the uniformity of the prepared solder balls is poor, and guiding a bad ball storage bin (21) to be opened by a screening switch (19), so as to realize cooling and collecting qualified solder balls with regular shapes and uniform sizes;
the device for rapidly and efficiently screening uniform solder balls comprises a uniform metal droplet preparation device (1) and a rapid cooling tube (16), wherein melting heating coils (2) are arranged on two sides of the uniform metal droplet preparation device (1), a temperature sensor (3) is arranged in the uniform metal droplet preparation device (1), the melting heating coils (2) and the temperature sensor (3) are electrically connected with an intelligent PID temperature controller (4), a balling cavity (5) is arranged at the lower end of the uniform metal droplet preparation device (1), a nozzle of the uniform metal droplet preparation device (1) extends into the balling cavity (5), the upper end of the rapid cooling tube (16) extends into the balling cavity (5) and is matched with the nozzle, a cooler (18) is arranged on the rapid cooling tube (16), the cooler (18) is connected with a freezer (22), a balling switch (19) is arranged at the lower end of the rapid cooling tube (16), and a balling bin (20) and a bad storage bin (21) are arranged at the lower end of the sieving switch (19). The device comprises a nitrogen tank (8), a pressure stabilizing tank (10) and a PLC integrated control system (13), wherein the nitrogen tank (8) is connected with the pressure stabilizing tank (10) through a pipeline, a miniature electric valve (9) is arranged on a connecting pipeline of the nitrogen tank (8) and the pressure stabilizing tank (10), the pressure stabilizing tank (10) is connected with the uniform metal droplet preparation device (1) through a pipeline, and a precise gas pressure stabilizing valve (12) is arranged on a connecting pipeline of the pressure stabilizing tank (10) and the uniform metal droplet preparation device (1); the upper end of the uniform metal droplet generator (1) is provided with a second air pressure sensor (15), the bottom of the uniform metal droplet generator (1) is provided with a pressure sensor (23), the surge tank (10) is provided with a first air pressure sensor (11), and the first air pressure sensor (11), the second air pressure sensor (15), the pressure sensor (23), the miniature motor valve (9) and the precise air surge valve (12) are electrically connected with the PLC integrated control system (13); the screening switch (19) is electrically connected with the PLC integrated control system (13).
2. The method for screening uniform solder balls based on the rapid and efficient device for screening uniform solder balls according to claim 1, wherein: and observation windows (6) are arranged on two sides of the balling cavity (5).
3. The method for screening uniform solder balls based on the rapid and efficient device for screening uniform solder balls according to claim 1, wherein: the balling cavity (5) is connected with a vacuum pump (14) and an oxygen content analyzer (7).
4. The method for screening uniform solder balls based on the rapid and efficient device for screening uniform solder balls according to claim 1, wherein: the refrigerant of the refrigerator (22) is glycol, and the rapid cooling pipe (16) is at a constant temperature of-20 ℃.
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