CN114843215A - Chip testing device - Google Patents
Chip testing device Download PDFInfo
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- CN114843215A CN114843215A CN202210474417.6A CN202210474417A CN114843215A CN 114843215 A CN114843215 A CN 114843215A CN 202210474417 A CN202210474417 A CN 202210474417A CN 114843215 A CN114843215 A CN 114843215A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/6776—Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
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Abstract
The embodiment of the invention discloses a chip testing device, which comprises: the device comprises a rack, a testing area, a material preparing area, a sorting area, a feeding channel and a material returning channel are formed on the rack respectively, two ends of the feeding channel are communicated with inlets of the material preparing area and the testing area respectively, and two ends of the material returning channel are communicated with outlets of the sorting area and the testing area respectively; the feeding mechanism is configured to move in the feeding channel in a reciprocating mode so as to feed the chip to be tested in the material preparation area into the testing area; and the material taking mechanism is configured to be capable of moving in the material returning channel in a reciprocating mode so as to send the tested chips in the testing area back to the sorting area after the testing is finished. The scheme can realize that the chips to be tested are sent into the test area and the tested chips are taken out and sent back to the sorting area without intermission and waiting, the whole feeding, testing and material taking process is compact and smooth in connection, the problem of long time consumption caused by material taking due to waiting is eliminated, and the working efficiency of the chip testing equipment is greatly improved to a certain extent.
Description
Technical Field
The invention relates to the technical field of chip production, in particular to a chip testing device.
Background
The chip plays an important role as the control brain of electronic and electrical products, and as the technology level and the consumption level of people are continuously improved in recent years, the market demand for the chip is increasing. For chip manufacturers, in order to ensure the manufacturing quality of chips, the chips are usually tested and sorted periodically before being delivered from factories.
In order to improve the testing and sorting efficiency, chip testing equipment is commonly used in the industry to complete related work. The existing chip testing equipment only has a single working channel, namely, in the testing process, a chip to be tested is sent into a testing machine through a middle turntable and a testing carrier to be tested for detection, and the chip to be tested returns to the original path after being tested. In the process of detecting the last batch of chips, the middle rotary table and the test carrier are in a material receiving waiting state, and the next batch of chips to be detected can only be operated after the chips after the test are transferred to the subsequent sorting and other processes. The time consumption is long in the waiting process, and the working interval is long, so that the working efficiency of the chip testing equipment is influenced.
Disclosure of Invention
In view of this, the invention provides a chip testing device, which is used for solving the problems that in the prior art, the waiting time is long, the work is intermittent, and the work efficiency of the device is influenced.
To achieve one or a part of or all of the above or other objects, the present invention provides a chip testing apparatus, comprising:
the device comprises a rack, a testing area, a material preparing area, a sorting area, a feeding channel and a material returning channel are formed on the rack respectively, two ends of the feeding channel are communicated with inlets of the material preparing area and the testing area respectively, and two ends of the material returning channel are communicated with outlets of the sorting area and the testing area respectively;
the feeding mechanism is configured to move in the feeding channel in a reciprocating mode so as to feed the chips to be tested in the material preparation area into the testing area; and
and the material taking mechanism is configured to be capable of moving in the material returning channel in a reciprocating mode so as to return the tested chips in the testing area to the sorting area after the testing is finished.
In one embodiment, a testing machine is disposed in the testing area, the testing instrument includes a testing seat and a testing instrument, the testing seat is provided with a testing channel with two ends penetrating through the testing seat, two opposite ends of the testing channel are respectively butted with the inlet and the outlet of the testing area, and the testing instrument is disposed in the testing seat and used for testing a chip to be tested sent into the testing channel.
In one embodiment, the test channel has a plurality of test stations, and the test instrument includes a plurality of test probes, and the test probes are arranged in one-to-one correspondence with the test stations.
In one embodiment, the feeding mechanism comprises a feeding track and a feeding trolley, two ends of the feeding track are respectively connected with inlets of the material preparation area and the testing area, and the feeding trolley is movably arranged on the feeding track.
In one embodiment, the material taking mechanism comprises a material taking track and a material taking trolley, two ends of the material taking track are respectively connected with outlets of the sorting area and the testing area, and the material taking trolley is movably arranged on the material taking track.
In one embodiment, the chip testing apparatus further includes a test transfer mechanism, the test transfer mechanism includes a base, an X-axis moving unit, a Y-axis moving unit, a Z-axis lifting unit, and a transfer robot, the X-axis moving unit is disposed on the base, the Y-axis moving unit is disposed on the X-axis moving unit, the Z-axis lifting unit is disposed on the Y-axis moving unit, and the transfer robot is disposed on the Z-axis lifting unit.
In one embodiment, the feeding mechanism and the material taking mechanism further include a material taking and placing device, and the material taking and placing device includes:
a taking and placing rack;
the transverse movement module is arranged on the pick-and-place rack and used for outputting transverse movement power;
the longitudinal movement module is arranged on the transverse movement module and is used for outputting longitudinal movement power;
and the material taking and placing execution terminal is arranged on the longitudinal movement module and is used for executing the operation of transferring, taking and placing the chips to be tested between the material preparation area and the feeding trolley and the operation of transferring, taking and placing the tested chips between the sorting area and the material taking trolley.
In one embodiment, the material taking and placing execution terminal includes:
a fixed seat;
the self-adaptive seat plate is arranged below the fixed seat;
the rotary floating assembly is connected between the fixed seat and the adaptive seat plate so that the adaptive seat plate can adapt to the shape of a tray to realize adaptive rotation and telescopic floating; and
get and put the flitch, get put the flitch set up in the self-adaptation bedplate deviates from one side of fixing base, just get put the flitch with the cooperation is formed with the vacuum chamber between the self-adaptation bedplate, the vacuum chamber is used for communicating with outside vacuum apparatus, get to put the flitch and seted up a plurality of material holes of inhaling.
In one embodiment, the rotary floating component comprises a spherical body movably arranged between the fixed seat and the adaptive seat plate.
In one embodiment, the rotary floating assembly further comprises an elastic telescopic member connected between the fixed seat and the adaptive seat plate.
The embodiment of the invention has the following beneficial effects:
in the chip testing equipment of the scheme, a plurality of trays of whole chips to be tested are placed in the material preparation area, and empty trays are placed in the sorting area so as to be used for subsequently containing tested chips. During work, the feeding mechanism picks up the whole disc of chips to be tested in the material preparation area and moves the whole disc of chips to be tested close to the test area along the feeding channel, the chips to be tested are sent into the test area to carry out chip test work, and in the test process, the feeding mechanism can return to the material preparation area to pick up the next batch of chips to be tested; in the process, the tested chip after the test is finished is sent out of the test area and picked up by the material taking mechanism, the material taking mechanism moves to the sorting area along the material returning channel, and the tested chip is placed into an empty tray in the sorting area so as to be convenient for sorting operation; meanwhile, the feeding mechanism feeds the next batch of chips to be tested into the test area again for testing, and after the testing is finished, the material taking mechanism just returns to the test area to be ready for picking up the next batch of tested chips after the testing is finished, so that the previous operation is carried out until all chip testing work is finished. Compared with the prior art, the scheme is simultaneously provided with the feeding channel and the material returning channel, and the feeding mechanism and the material taking mechanism can respectively reciprocate in the corresponding feeding channel and the material returning channel, so that the non-intermittent and non-waiting chip to be tested is sent into the testing area, the tested chip is taken out and sent back to the sorting area, the whole feeding, testing and material taking process is compact and smooth in connection, the problem of long time consumption caused by waiting for material taking is solved, and the working efficiency of the chip testing equipment is greatly improved to a certain extent.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
Wherein:
fig. 1 is a schematic structural diagram of a chip testing apparatus according to an embodiment of the present invention;
FIG. 2 is a schematic structural view of the material taking and placing device in FIG. 1.
Description of reference numerals:
100. chip testing equipment; 10. a frame; 11. a test zone; 12. a material preparation area; 13. sorting the areas; 14. a feed channel; 15. a feed back channel; 20. a feeding mechanism; 21. a feeding track; 22. a feeding trolley; 30. a material taking mechanism; 31. a material taking track; 32. a material taking trolley; 40. a material taking and placing device; 41. a taking and placing rack; 42. a transverse movement module; 43. a longitudinal movement module; 44. taking and placing an executing terminal; 50. a testing machine.
Detailed Description
In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein.
In the description of the present invention, it is to be understood that the terms "central," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the invention and to simplify the description, and are not intended to indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and are not to be considered limiting of the invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature.
In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
Fig. 1 shows a chip testing apparatus 100 for performing performance testing and sorting operations after testing on a chip according to an embodiment of the present invention. The chip test apparatus 100 includes: a frame 10, a feeding mechanism 20 and a material taking mechanism 30. The rack 10 serves as a main bearing body of the multi-chip testing device 100 and is used for loading the fixed feeding mechanism 20 and the material taking mechanism 30, so that the device is compact in overall structure and high in integration degree. For example, in the present embodiment, the frame 10 includes a frame body, a shell plate, and a moving wheel. The frame main body is formed by welding or assembling metal structural members, and the metal structural members can be, but are not limited to, rectangular main bodies, circular main bodies and the like. The shell plate is fixed outside the frame main body in a screwing mode, a welding mode and the like, and the effects of protection, attractiveness and the like are achieved.
A testing area 11, a material preparing area 12, a sorting area 13, a feeding channel 14 and a material returning channel 15 are respectively formed on the rack 10, two ends of the feeding channel 14 are respectively communicated with inlets of the material preparing area 12 and the testing area 11, and two ends of the material returning channel 15 are respectively communicated with outlets of the sorting area 13 and the testing area 11; the feeding mechanism 20 is configured to move back and forth in the feeding channel 14 to feed the chip to be tested in the preparation area 12 into the testing area 11; the material taking mechanism 30 is configured to move back and forth in the material returning channel 15 to return the tested chips in the testing area 11 to the sorting area 13.
The material preparation area 12 is used for temporarily storing a loading tray containing chips to be tested. For example, the loading tray is a rectangular tray body, the upper surface of the loading tray is recessed to form a plurality of placing grooves arranged in a matrix structure, and each placing groove is used for placing one chip. The chips are orderly stored, and the chips to be tested can be conveniently taken out from the loading tray and placed back.
In summary, the implementation of the technical solution of the present embodiment has the following beneficial effects: in the chip testing apparatus 100 of the above-mentioned scheme, multiple trays of whole chips to be tested are placed in the material preparation area 12, and empty trays are placed in the sorting area 13 for subsequently containing tested chips. During operation, the feeding mechanism 20 picks up the whole disc of chips to be tested in the material preparation area 12, moves the whole disc of chips to be tested close to the test area 11 along the feeding channel 14, and sends the chips to be tested into the test area 11 for chip test operation, and during the test process, the feeding mechanism 20 can return to the material preparation area 12 to pick up the next batch of chips to be tested; in the process, the tested chips after the test are sent out of the test area 11 and picked up by the material taking mechanism 30, the material taking mechanism 30 moves to the sorting area 13 along the material returning channel 15, and the tested chips are placed into empty trays in the sorting area 13 so as to be sorted; meanwhile, the feeding mechanism 20 feeds the next batch of chips to be tested into the testing area 11 again for testing, and after the testing is completed, the material taking mechanism 30 just returns to the testing area 11 to be ready for picking up the next batch of tested chips after the testing is completed, and then the previous test is carried out until all chip testing work is finished. Compared with the prior art, the scheme is provided with the feeding channel 14 and the return channel 15 at the same time, and the feeding mechanism 20 and the material taking mechanism 30 can respectively reciprocate in the corresponding feeding channel 14 and the corresponding return channel 15, so that the chips to be tested can be fed into the test area 11 and the tested chips can be taken out and sent back to the sorting area 13 without intermission and waiting, the whole feeding, testing and material taking processes are compactly and smoothly linked, the problem of long time consumption caused by waiting for material taking is solved, and the working efficiency of the chip testing equipment 100 is greatly improved to a certain extent.
In some embodiments, the testing machine 50 is disposed in the testing area 11, the testing apparatus includes a testing seat and a testing apparatus, the testing seat is provided with a testing channel, two ends of the testing channel are disposed through the testing seat, two opposite ends of the testing channel are respectively connected with the inlet and the outlet of the testing area 11, and the testing apparatus is disposed in the testing seat for testing the chip to be tested sent into the testing channel. Therefore, the chip to be tested can directly enter the test channel from the inlet to participate in the test, the tested chip can directly move horizontally after the test and is sent out from the outlet, the moving path of the chip in the test machine 50 is short, and the moving efficiency is high.
Furthermore, the test channel is provided with a plurality of test stations, the test instrument comprises a plurality of test probes, and the test probes are arranged in one-to-one correspondence with the test stations. Therefore, multiple disks of chips to be tested can be fed in at one time, and multiple test probes can test the multiple disks of chips to be tested sequentially or simultaneously, so that the test efficiency of the test machine 50 is greatly improved. For example, in the present embodiment, the test probe employs a probe, and the probe is in contact with and conducted to a component such as a pin on a chip, so as to implement an electrical performance test.
With continued reference to fig. 1, in some embodiments, the feeding mechanism 20 includes a feeding rail 21 and a feeding trolley 22, two ends of the feeding rail 21 are respectively connected to the inlets of the material preparation area 12 and the testing area 11, and the feeding trolley 22 is movably disposed on the feeding rail 21. The material taking mechanism 30 comprises a material taking track 31 and a material taking trolley 32, two ends of the material taking track 31 are respectively connected with outlets of the sorting area 13 and the testing area 11, and the material taking trolley 32 is movably arranged on the material taking track 31. In this way, the feeding cart 22 can send the whole tray of chips to be tested into the testing machine 50 for testing, and after the testing is completed, the picking cart 32 can take out the whole tray of tested chips and send the whole tray back to the sorting area 13, so that the sorting device can perform sorting operation. The feeding trolley 22 and the material taking trolley 32 have good maneuverability, have high movement directivity under the guiding and limiting of the feeding track 21 and the material taking track 31, run stably and reliably, and prevent chips from displacing and even falling caused by vibration and the like in midway.
Furthermore, on the basis of any of the above embodiments, the chip testing apparatus 100 further includes a test transfer mechanism, the test transfer mechanism includes a base, an X-axis moving unit, a Y-axis moving unit, a Z-axis lifting unit, and a transfer robot, the X-axis moving unit is disposed on the base, the Y-axis moving unit is disposed on the X-axis moving unit, the Z-axis lifting unit is disposed on the Y-axis moving unit, and the transfer robot is disposed on the Z-axis lifting unit. When the test transfer mechanism works, the chip to be tested is taken out from the feeding trolley 22 and transferred to the test carrier in the test machine 50, and after the chip test is finished, the test transfer mechanism takes out the tested chip from the test carrier and transfers the tested chip to the material taking trolley 32, so that the reliable and rapid transfer of the whole disk of chips among different carriers is completed. Specifically, when transferring the chip to be tested and the tested chip, the transfer robot and the chip are aligned by the X-axis moving unit and the Y-axis moving unit, and then the Z-axis lifting unit drives the transfer robot to descend and grab the chip, for example, the transfer robot sucks the chip by vacuum. After the X-axis moving unit, the Y-axis moving unit and the Z-axis moving unit are linked, the transfer robot can complete alignment with the test carrier and the material-taking trolley 32 and release the chip.
Alternatively, the X-axis moving unit and the Y-axis moving unit may be, but not limited to, a power combination of a motor and a screw nut pair, a power combination of a motor and a rack-and-pinion module, a power combination of a motor and a scissors mechanism, a power combination of a motor and a pulley set, and the like, and are specifically selected according to actual needs as long as telescopic linear power can be output.
With reference to fig. 1 and fig. 2, in addition to any of the above embodiments, the feeding mechanism 20 and the material taking mechanism 30 further include a material taking and placing device 40, where the material taking and placing device 40 includes: a pick-and-place frame 41, a transverse movement module 42, a longitudinal movement module 43 and a pick-and-place execution terminal 44.
The transverse movement module 42 is arranged on the pick-and-place frame 41 and is used for outputting transverse movement power; the longitudinal movement module 43 is arranged on the transverse movement module 42 and is used for outputting longitudinal movement power; the pick-and-place executing terminal 44 is disposed on the longitudinal movement module 43 and is used for executing the transferring, picking and placing operations of the chips to be tested between the material preparing area 12 and the feeding trolley 22 and the chips to be tested between the sorting area 13 and the picking trolley 32.
In the scheme, the whole tray of chips to be tested is transferred to the feeding trolley 22 from the stack in the material preparation area 12, and the tested chips are transferred to the empty tray in the sorting area 13 from the material taking trolley 32, and the whole tray is grabbed and placed by the material taking and placing device 40. Specifically, in operation, the transverse movement module 42 drives the material taking and placing execution terminal 44 to move above the tray; the longitudinal movement module 43 drives the material taking and placing execution terminal 44 to descend and approach to the surface of the tray, and the material taking and placing execution terminal 44 sucks the whole tray of chips; the transverse movement module 42 and the longitudinal movement module 43 are linked to drive the material taking and placing execution terminal 44 to move to a specified height position above the middle turntable; the pick-and-place executing terminal 44 releases the entire disk of chips into the feeding trolley 22, so that the feeding trolley 22 sends the chips to be tested into the testing machine 50 for testing. In the process of returning the detected whole disc of chips to the empty tray in the sorting area 13 from the material taking trolley 32, the transverse movement module 42 drives the material taking and placing execution terminal 44 to move to the upper part of the middle turntable; the longitudinal movement module 43 drives the material taking and placing execution terminal 44 to descend and be close to the surface of the material taking trolley 32, and the material taking and placing execution terminal 44 sucks the whole tray of chips; the transverse movement module 42 and the longitudinal movement module 43 are linked to drive the material taking and placing execution terminal 44 to move to a specified height position above the tray; the pick and place terminal 44 releases the entire disk of chips into the empty tray. Compared with the prior art, the material taking and placing device 40 can achieve one-time taking, placing and transferring of the whole disc of chips, is not limited by structural arrangement and size limitation, ensures that the whole disc of chips is reliably taken and placed, and is favorable for guaranteeing production beat and production efficiency.
The material taking and placing execution terminal 44 includes: fixing base, self-adaptation bedplate, rotatory subassembly and get and put the flitch that floats. The self-adaptive seat plate is arranged below the fixed seat; the rotary floating assembly is connected between the fixed seat and the adaptive seat plate, so that the adaptive seat plate can adapt to the shape of the tray to realize adaptive rotation and telescopic floating; get and put the flitch set up in the self-adaptation bedplate deviates from one side of fixing base, just get put the flitch with the cooperation is formed with the vacuum chamber between the self-adaptation bedplate, the vacuum chamber is used for communicating with outside vacuum apparatus, get and put the flitch and seted up a plurality of material holes that inhale.
In use, the mounting base is coupled to a peripheral motion module (e.g., a transfer robot) that provides the power required to move the pick-and-place actuator terminal 44 in space. When the pick-and-place execution terminal 44 moves to a position above the tray and close to the height position of the chip, the external vacuum device is turned on, and the vacuum chamber is vacuumized, so that negative pressure suction is generated at the material suction hole, and the chip can be sucked and fixed to be taken out from the tray. Compared with the mode of arranging a plurality of suckers in the prior art, the material sucking holes are limited by small structural and spatial constraints, more material sucking holes can be machined on the material taking and placing plate theoretically, each material sucking hole can adsorb at least one chip respectively, so that the material taking and placing execution terminal 44 can take out all the chips placed on the tray once, and the material taking capacity is greatly improved.
In addition, because install rotatory subassembly that floats between fixing base and the self-adaptation bedplate, when the tray has shape defects such as unevenness or deformation warpage, rotatory subassembly that floats can make the shape change of self-adaptation bedplate adaptation tray and self-adaptation rotatory and flexible the floating to guarantee to get to put the flitch and can paste the flat tray all the time, guarantee that all inhale the material hole and can both keep effective actuation with the chip that corresponds, promote and get the material reliability, prevent that the chip is got and is put the inefficacy and influence equipment production beat and production efficiency.
In some embodiments, the rotary floating component comprises a spherical body movably arranged between the fixed seat and the adaptive seat plate. The spherical body has full freedom in space, such as all rotational freedom in X-axis direction, Y-axis direction and Z-axis direction, so that after the adaptive seat plate is connected with the fixed seat through the spherical body, the adaptive seat plate can have the capability of rotating in X-axis direction, Y-axis direction and Z-axis direction under the support of the spherical body, and further the material taking and placing plate can adapt to the shape of the tray to be always flat with the tray.
For example, in the present embodiment, a steel ball is used as the spherical body. The steel ball has high strength, small deformation amount caused by compression and good durability, and can ensure good rotary supporting capacity for the self-adaptive seat plate after being used for a long time. Of course, the spherical body in other embodiments may be made of other materials, which are not described herein.
Further, rotatory subassembly that floats still includes the elastic expansion piece, the elastic expansion piece connect in between fixing base and the self-adaptation bedplate. When the tray with the fluctuant shape change is faced, the elastic expansion piece can provide the expansion floating capacity of the self-adaptive seat plate, so that the material taking and placing plate can be self-adaptive to the shape change of the tray to keep flat with the tray, and the reliability of chip suction is improved. Optionally, in this embodiment, the elastic expansion member is a spring. In other embodiments, the elastic telescopic element may also be a member or device with elasticity, such as an elastic column or an elastic sheet.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (10)
1. A chip testing apparatus, comprising:
the device comprises a rack, a testing area, a material preparing area, a sorting area, a feeding channel and a material returning channel are formed on the rack respectively, two ends of the feeding channel are communicated with inlets of the material preparing area and the testing area respectively, and two ends of the material returning channel are communicated with outlets of the sorting area and the testing area respectively;
the feeding mechanism is configured to move in the feeding channel in a reciprocating mode so as to feed the chips to be tested in the material preparation area into the testing area; and
and the material taking mechanism is configured to be capable of moving in the material returning channel in a reciprocating mode so as to return the tested chips in the testing area to the sorting area after the testing is finished.
2. The chip testing apparatus according to claim 1, wherein a testing machine is disposed in the testing area, the testing machine includes a testing seat and a testing instrument, the testing seat defines a testing channel having two ends penetrating therethrough, two opposite ends of the testing channel are respectively connected to the inlet and the outlet of the testing area, and the testing instrument is disposed in the testing seat for testing a chip to be tested that is fed into the testing channel.
3. The chip testing apparatus according to claim 2, wherein the test channel has a plurality of test stations, and the test instrument includes a plurality of test probes, the test probes being arranged in one-to-one correspondence with the test stations.
4. The chip testing apparatus of claim 1, wherein the feeding mechanism comprises a feeding rail and a feeding trolley, two ends of the feeding rail are respectively connected with inlets of the material preparation area and the testing area, and the feeding trolley is movably arranged on the feeding rail.
5. The chip testing device according to claim 4, wherein the material taking mechanism comprises a material taking rail and a material taking trolley, two ends of the material taking rail are respectively connected with the outlets of the sorting area and the testing area, and the material taking trolley is movably arranged on the material taking rail.
6. The apparatus for testing chips of claim 1, further comprising a test transfer mechanism, wherein the test transfer mechanism comprises a base, an X-axis moving unit, a Y-axis moving unit, a Z-axis lifting unit, and a transfer robot, the X-axis moving unit is disposed on the base, the Y-axis moving unit is disposed on the X-axis moving unit, the Z-axis lifting unit is disposed on the Y-axis moving unit, and the transfer robot is disposed on the Z-axis lifting unit.
7. The chip testing apparatus according to claim 5, wherein the feeding mechanism and the picking mechanism each further comprise a pick-and-place device, and the pick-and-place device comprises:
a taking and placing rack;
the transverse movement module is arranged on the pick-and-place rack and used for outputting transverse movement power;
the longitudinal movement module is arranged on the transverse movement module and is used for outputting longitudinal movement power;
and the material taking and placing execution terminal is arranged on the longitudinal movement module and is used for executing the operation of transferring, taking and placing the chips to be tested between the material preparation area and the feeding trolley and the operation of transferring, taking and placing the tested chips between the sorting area and the material taking trolley.
8. The chip testing apparatus according to claim 7, wherein the pick-and-place material execution terminal includes:
a fixed seat;
the self-adaptive seat plate is arranged below the fixed seat;
the rotary floating assembly is connected between the fixed seat and the adaptive seat plate so that the adaptive seat plate can adapt to the shape of a tray to realize adaptive rotation and telescopic floating; and
get and put the flitch, get put the flitch set up in the self-adaptation bedplate deviates from one side of fixing base, just get put the flitch with the cooperation is formed with the vacuum chamber between the self-adaptation bedplate, the vacuum chamber is used for communicating with outside vacuum apparatus, get to put the flitch and seted up a plurality of material holes of inhaling.
9. The chip testing apparatus according to claim 8, wherein the rotary floating assembly includes a spherical body movably disposed between the fixed base and the adaptive seat plate.
10. The chip testing apparatus according to claim 9, wherein the rotary floating assembly further comprises an elastic expansion member connected between the fixed base and the adaptive seat plate.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210474417.6A CN114843215A (en) | 2022-04-29 | 2022-04-29 | Chip testing device |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202210474417.6A CN114843215A (en) | 2022-04-29 | 2022-04-29 | Chip testing device |
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