CN114841391A - Module degradation packaging method, computer equipment and computer readable storage medium - Google Patents
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Abstract
The invention provides a module degradation packaging method, computer equipment and a computer readable storage medium. The method includes determining a first separable value y for two or more parts 1 (ii) a Determining the packaging volume y of two or more parts 2 (ii) a Determining the volume ratio y of two or more parts to their respective assemblies 3 (ii) a Determining a priority value x for modular degradation packaging for two or more parts, wherein the priority value is determined based on the first split value, the volume ratio, and the package volume, x = y 1 *y 2 *y 3 (ii) a To be provided withAnd carrying out module degradation packaging on the parts with the priority values reaching the priority value threshold.
Description
Technical Field
The invention relates to the field of automobiles, in particular to the field of automobile part packaging.
Background
Automobile manufacturers often purchase a large number of parts from various suppliers, transport the parts to a final assembly plant, and then perform further manufacturing. With this demand increasing, the traditional packaging method encounters a certain bottleneck. Therefore, a convenient and efficient packaging method is needed.
Disclosure of Invention
To solve or at least alleviate one or more of the above problems, the following technical solutions are provided.
According to one aspect of the invention, a modular degradation packaging method is provided. The method includes determining a first separable value y for two or more parts 1 (ii) a Determining the packaging volume y of the two or more parts 2 (ii) a Determining the volume ratio y of the two or more parts to their respective assemblies 3 (ii) a Determining a priority value x for modular degradation packaging for the two or more parts, wherein the priority value is determined from the first separable value, the volumetric ratio, and the package volume:
x=y 1 *y 2 *y 3 ；
and carrying out module degradation packaging on the parts with the priority values reaching the priority value threshold.
Optionally, the method further comprises determining a second separable value for the two or more parts; and the priority value is also determined based on the second split value.
Optionally, the method further comprises determining a rate of bending of the two or more parts; and the priority value is also determined according to the bending rate.
Optionally, the method further comprises determining a cut-off rate for the two or more parts; and the priority value is also determined according to the truncation ratio.
Optionally, the method further comprises determining a nesting rate of the two or more parts; and the priority value is also determined according to the nesting rate.
Optionally, the method further comprises determining a loading rate for two or more packaging means; and selecting a packaging mode with higher loading rate from the two or more packaging modes to carry out the module degradation packaging.
Optionally, the method further comprises determining a transport distance matrix; determining a modular transport matrix; and the priority value is further determined from a product of the transport distance matrix and the modular transport matrix.
According to another aspect of the invention, a computer device is provided. The computer device includes a processor and a memory. The above modular depacketizing method is implemented when a computer program stored on the memory is run on the processor.
According to yet another aspect of the invention, a computer-readable storage medium is proposed, on which a computer program is stored. The above modular depacketizing method is implemented when the computer program is run on a processor.
The module degradation packaging method, the computer equipment and the computer readable storage medium provided by the invention are used for systematically analyzing the design, composition, production process and the like of parts, excavating the opportunity of module degradation packaging, and improving the loading rate and the transportation efficiency.
Drawings
The above and other objects and advantages of the present invention will become more fully apparent from the following detailed description taken in conjunction with the accompanying drawings in which:
FIG. 1 illustrates a modular overpack method 1000 according to one embodiment of the invention;
fig. 2 illustrates a computer device 2000 according to an embodiment of the invention.
Detailed Description
It is to be understood that the term "vehicle" or other similar term as used herein includes motor vehicles in general, such as passenger vehicles (including sport utility vehicles, buses, trucks, etc.), various commercial vehicles, boats, planes, etc., and includes hybrid vehicles, electric vehicles, plug-in hybrid electric vehicles, etc. A hybrid vehicle is a vehicle having two or more power sources, such as gasoline powered and electric vehicles.
It is also noted that the terms first, second and the like in the description and in the claims of the present invention are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. Furthermore, the terms "comprises" and "comprising," and similar referents, are intended to mean non-exclusive inclusion, unless otherwise specifically indicated.
Hereinafter, exemplary embodiments according to the present invention will be described in detail with reference to the accompanying drawings.
FIG. 1 illustrates a modular overpack method. Wherein, in step S101, a first separable value for each part is determined. The first split value may be determined by the composition of the part. For example, when the part is integrally formed, its first detachable value is 0; when the part is an integrally formed main body and is subjected to post-processing, the first detachable value is 1; when the part is a two-piece body or a plurality of sub-parts, the first detachable value is 2.
In step S102, the packaging volume for each part is determined. The package volume may also be a stepped value of the actual package volume. For example, when the packing volume of the part is less than 0.001m 3 When so, the value is 0; when the packaging volume of the part is 0.001m 3 ，0.01m 3 ) When the value is 0.5; when the packaging volume of the part is [0.01m ] 3 ，0.05m 3 ) When the value is 1.0; when the packaging volume of the part is 0.05m 3 ，0.1m 3 ) When the value is 1.5; when the packaging volume of the part is more than 0.1m 3 When it is used, the value is 2.0.
In step S103, the volume ratio of parts to their respective assemblies is determined. The volume ratio may be obtained by the following formula:
the volume ratio may also be a value after the actual volume ratio is stepped. When the volume ratio is more than 1.5, the value is 0; the value is 1 when the volume ratio is (1.0, 1.5), 2 when the volume ratio is (0.75, 1.0), 3 when the volume ratio is (0.5, 0.75), 4 when the volume ratio is (0.25, 0.5), and 5 when the volume ratio is (0, 0.25).
At step S104, a module degradation package priority value is determined for each part based on the determined first split value, package volume, and volume ratio.
In one embodiment, assume that the first split value is y 1 The packaging volume is y 2 Volume ratio of y 3 Then the priority value x of the module degradation package is:
x=y 1 *y 2 *y 3 。
in step S105, the parts that reach the priority threshold are subjected to module degradation packaging, i.e., the original packaging module is disassembled and packaged with a smaller module. For example, parts that are originally packaged in units of assembly pieces are split into smaller modules for packaging. For example, a component originally packaged in units of a certain number of components is divided into smaller modules and packaged.
In one embodiment, a second separable value y for each part may also be determined 4 . The determination of the module degradation package priority value x for each part should also be based on a second split value. For example, x = y 1 *y 2 *y 3 *y 4 。
The second split value may be determined by the part process. For example, when a part is finished by a single process, its second split value is 0; when the part is determined by the quality engineer and the supplier to be not detachable, the second detachable value is 1; when the part is deemed not detachable only by the supplier, the second split value is 2; when no quality engineer confirms the record and no historical supplier split charging case exists, the second split value is 3; when no quality engineer confirms the record of the part and a historical supplier split charging case exists, the second split value is 4; when the part is requested by the quality engineer to be dispensed all locally and there are historical supplier dispensing cases, the second split value is 5.
In another embodiment, the rate of bending y of each part may also be determined 5 . The priority value of the module degradation package is determined for each part according to the bending rate. For example, x = y 1 *y 2 *y 3 *y 5 。
In another embodiment, the cutoff y for each part may also be determined 6 . And determining the priority value of the module degradation package for each part according to the truncation ratio. For example, x = y 1 *y 2 *y 3 *y 6 。
In another embodiment, the nesting rate y of each part may also be determined 7 . The priority value of the module degradation package is determined for each part according to the nesting rate. For example, x = y 1 *y 2 *y 3 *y 7 。
In another embodiment, determining a transport distance matrix D and a modular transport matrix E is also included. The priority value of the module degradation package is determined for each part according to the product of the transport distance matrix and the modular transport matrix. For example, x = y 1 *y 2 *y 3 *D*E。
Alternatively, when m suppliers, n final assembly plants, the transport distance matrix may be:
D=
。
wherein,
is the distance from the mth supplier to the nth final assembly plant. The distance may also be a value after the actual distance has been stepped. For example,when the distance value is less than or equal to 5, the value is 0; when the distance value is (5, 50)]When the value is 1; when the distance value is (50,100)]When the value is 2; when the distance value is (100,500)]When the value is 3; when the distance value is (500, 1000)]When the value is 4; when the distance value is more than 1000, the value is 5.
At this point, the modular transport matrix may be:
E=
。
wherein,
is the split factor from the mth supplier to the nth final assembly plant. Coefficient of split charging
Can be calculated by the following formula:
wherein A is the procurement cost of the part,
price A after subpackaging-price A before subpackaging, including factors such as investment of subpackaging plants, cost of self-transportation logistics and the like;
b is the logistics cost of the part,
price B before subpackaging-price B before subpackaging.
Optionally, if both supplier and purchase confirm that the split optimization does not affect the part and mold costs, z = 0; if the supplier originally promises to establish a split charging plant and finally only uses the split charging plant as a warehouse, z =1 and the push is required to be continued; if the joint procurement pushes the supplier management layer to be unsuccessful multiple times, then z > 1.
In yet another embodiment, the loading rate for each package may also be determined. And the packaging mode with higher loading rate is selected from the packaging modes for module degradation packaging.
For example, the thickness of the vibration isolation foam needs to be increased due to other problems of a roof lining board of a certain vehicle type, and the size of the part is large, so that the packaging loading rate is directly reduced, and the transportation cost is increased. The separation of the headliner foam and the headliner into assembly suppliers is a packaging method with a higher loading rate than conventional methods.
For example, the center channel plate of the floor, the center channel plate of some vehicle types are provided with brackets, and the center channel plate of some vehicle types is not provided with brackets. Transferring the carriers to adjacent component assemblies is a packaging method that has a higher loading rate than conventional methods.
For example, the difference between the design of the inner plate of the threshold of a certain vehicle type and the project of the vehicle type of the prior generation is larger, the connection mode of the inner plate of the threshold and the B column reinforcement is changed after the communication with engineers related to engineering design and quality is carried out, the transportation volume of single parts is reduced, and the method is a packaging method with higher loading rate compared with the traditional method.
In yet another embodiment, the packaging mode can be optimized, and recyclable packages with high loading rate can be selected.
For example, enclose before a certain motorcycle type and give sound insulation and fill up, estimate the packing scheme and load five for special work or material rest, through horizontal contrast current project packing scheme and packing engineer verification, optimize seven pieces for the standard case, when increasing the loading quantity, save because of redesign and the cost of input work or material rest.
For example, due to the fact that the shipping address of caliper parts of a certain vehicle type is far away in supply, the initial supplier quotes and transports the parts by adopting a paper box, then the parts are packaged, analyzed and comprehensively compared, the supplier is pushed to change the paper box into the surrounding plate box for transportation, the packaging loading rate is improved, and meanwhile the total packaging investment cost is greatly reduced.
Alternatively, logistics cost analysis can also be made based on existing project and supplier layout. Specifically, the method comprises the following steps: first, the shipment address distribution of the potential supplier of the part is screened from the supplier address database. And secondly, selecting an optimal shipment address from the address distribution by combining the optimal direction of degradation of the part module. And finally, using the cost analysis result as an input for selecting a transportation scheme, and selecting an optimal scheme.
For example, in a certain vehicle type grid assembly supply production first base, because the grid decoration strips need to be electroplated, the grid assembly can only be delivered from Ningbo, so that the freight cost is increased, after optimization, a supplier puts the grid body near the production base to a general assembly plant for production, and transports the decoration strips to the general assembly plant, so that the total logistics cost is obviously reduced. And then, analyzing the transportation cost of the split parts by referring to a logistics strategy.
For example, the sealing strip of a certain vehicle type is delivered from a place in Hubei province and communicated with a supplier management layer to be delivered in a park, a supplier establishes an assembly plant in the park and plans related processes, the delivery distance is shortened by 140 kilometers after optimization, parts are assembled nearby, and the supply chain cost is greatly reduced.
Optionally, the screening of key parts can be performed in advance, and then the module degradation packaging method is performed. The method is characterized in that a part of key parts with subpackage optimization opportunities are found out through certain screening indexes. Specifically, the method comprises the following steps: firstly, screening is carried out through a plurality of data sources such as a bill of materials of an existing vehicle type, a logistics mode planning flow in a product project starting stage, part fixed-point information and the like. Secondly, the method of the pareto method is used for screening and analyzing parts which are high in logistics cost, large in single-part packaging volume, long in transportation distance and high in use frequency in various vehicle types. Finally, the parts are classified and summarized according to five dimensions of the automobile body, the exterior trim, the chassis, the interior trim and the air conditioner electronics to form a key part list as shown in table 1.
TABLE 1 Key parts List index Table
| Name of part | Cost of logistics | Packaging volume | Distance of transport | Frequency of use | Potential level of optimization |
| Tail door lower veneer assembly | Height of | Big (a) | Far away | Height of | Five stars per high |
| Rear inner plate of vehicle body | Height of | Big (a) | Far away | Height of | Five stars per high |
| Rear end decorative panel assembly | Height of | Big (a) | Far away | Height of | Five stars per high |
| Front and rear bumper assembly | Height of | Big (a) | Near to | Height of | Four stars/higher |
| Vehicle bottom rear side longitudinal beam assembly | Height of | Big (a) | Near to | Height of | Four stars/higher |
| Rear floor front plate | Height of | Big (a) | Near to | Height of | Four stars/higher |
| Headlamp harness | Height of | Small | Far away | Height of | Four stars/higher |
| Vehicle body door lock column decorative plate assembly | Height of | Small | Near to | Height of | Three stars/middle |
| Grid assembly | Height of | Big (a) | Near to | High (a) | Three stars/middle |
| … | … | … | … | … | … |
Fig. 2 illustrates a computer device 2000 according to an embodiment of the invention. As shown in fig. 2, the computer device 2000 includes a memory 210 and a processor 220. The computer device 2000 also includes a computer program stored on the memory 210 and executable on the processor 220. The processor 220 may implement the control logic of the present invention by executing a computer program.
The control logic of the present invention may also be embodied on a computer readable storage medium as a computer program, the computer program being embodied by a processor or the like. Examples of computer readable storage media include, but are not limited to, ROM, RAM, optical disks, magnetic tape, floppy disks, flash drives, smart cards, and optical data storage devices. The computer readable storage medium can also be distributed over network coupled computer systems.
The module degradation packaging scheme provided by the invention carries out systematic analysis on the design, composition, production process and the like of parts, digs the opportunity of module degradation packaging, and improves the loading rate and the transportation efficiency.
Although only a few embodiments of the present invention have been described in detail above, those skilled in the art will appreciate that the present invention may be embodied in many other forms without departing from the spirit or scope thereof. Accordingly, the present examples and embodiments are to be considered as illustrative and not restrictive, and various modifications and substitutions may be made therein without departing from the spirit and scope of the present invention as defined by the appended claims.
Claims (9)
1. A method for degrading and packaging a module is characterized by comprising
Determining a first value of separation y for two or more parts 1 ；
Determining the packaging volume y of the two or more parts 2 ；
Determining the volume ratio y of the two or more parts to their respective assemblies 3 ；
Determining a priority value x for modular degradation packaging for the two or more parts, wherein the priority value is determined from the first detachability value, the volume ratio, and the packaging volume:
x=y 1 *y 2 *y 3 (ii) a And
and carrying out module degradation packaging on the part with the priority value reaching the priority value threshold value.
2. The modular degradation packaging method of claim 1, further comprising
Determining a second separable value for the two or more parts; and
the priority value is also determined based on the second split value.
3. The modular degradation packaging method of claim 1, further comprising
Determining the bending rate of the two or more parts; and
the priority value is also determined in accordance with the bend rate.
4. The modular degradation packaging method of claim 1, further comprising
Determining a cut-off rate for the two or more parts; and
the priority value is also determined according to the truncation ratio.
5. The modular degradation packaging method of claim 1, further comprising
Determining a nesting rate of the two or more parts; and
the priority value is also determined based on the nesting rate.
6. The modular degradation packaging method of claim 1, further comprising
Determining the loading rate of two or more packaging modes; and
and selecting a packaging mode with higher loading rate from the two or more packaging modes to carry out the module degradation packaging.
7. The modular degradation packaging method of claim 1, further comprising
Determining a transport distance matrix;
determining a modular transport matrix; and
the priority value is also determined from a product of the transport distance matrix and the modular transport matrix.
8. A computer device comprising a processor and a memory, characterized in that the module depacketizing method of any one of claims 1 to 7 is implemented when a computer program stored on the memory is run on the processor.
9. A computer-readable storage medium, on which a computer program is stored, characterized in that the module degradation wrapping method of any one of claims 1 to 7 is implemented when the computer program is run on a processor.
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