CN114839548A - Information acquisition device and battery module - Google Patents
Information acquisition device and battery module Download PDFInfo
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- CN114839548A CN114839548A CN202210476410.8A CN202210476410A CN114839548A CN 114839548 A CN114839548 A CN 114839548A CN 202210476410 A CN202210476410 A CN 202210476410A CN 114839548 A CN114839548 A CN 114839548A
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/36—Arrangements for testing, measuring or monitoring the electrical condition of accumulators or electric batteries, e.g. capacity or state of charge [SoC]
- G01R31/385—Arrangements for measuring battery or accumulator variables
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K13/00—Thermometers specially adapted for specific purposes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M10/00—Secondary cells; Manufacture thereof
- H01M10/42—Methods or arrangements for servicing or maintenance of secondary cells or secondary half-cells
- H01M10/48—Accumulators combined with arrangements for measuring, testing or indicating the condition of cells, e.g. the level or density of the electrolyte
- H01M10/482—Accumulators combined with arrangements for measuring, testing or indicating the condition of cells, e.g. the level or density of the electrolyte for several batteries or cells simultaneously or sequentially
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M10/00—Secondary cells; Manufacture thereof
- H01M10/42—Methods or arrangements for servicing or maintenance of secondary cells or secondary half-cells
- H01M10/48—Accumulators combined with arrangements for measuring, testing or indicating the condition of cells, e.g. the level or density of the electrolyte
- H01M10/486—Accumulators combined with arrangements for measuring, testing or indicating the condition of cells, e.g. the level or density of the electrolyte for measuring temperature
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
- H01M50/50—Current conducting connections for cells or batteries
- H01M50/569—Constructional details of current conducting connections for detecting conditions inside cells or batteries, e.g. details of voltage sensing terminals
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
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Abstract
The invention provides an information acquisition device and a battery module, wherein the information acquisition device comprises: a circuit board; the acquisition chip is electrically connected with the circuit board and is suitable for contacting with the sampling carrier and used for acquiring the temperature of the sampling carrier. From this, when the sampling carrier is a plurality of, through set up information acquisition device on a plurality of sampling carriers respectively to with a plurality of information acquisition device series connection in proper order, compare with prior art, on the basis of the temperature of gathering a plurality of sampling carriers simultaneously, information acquisition device has higher commonality, and can make information acquisition device's design cost reduce, thereby can reduce the cost of setting up information acquisition device on the sampling carrier.
Description
Technical Field
The invention relates to the technical field of batteries, in particular to an information acquisition device and a battery module with the same.
Background
In the correlation technique, the information acquisition device is used for gathering the temperature of sampling carrier, when the sampling carrier is arranged a plurality ofly, the temperature of a plurality of sampling carriers need be gathered simultaneously to the information acquisition device, the designer need be according to the information acquisition device of the different styles of every kind of sampling carrier design of the mode of arrangement of sampling carrier, not only cause the commonality of information acquisition device lower, still can cause the design cost of information acquisition device too big, thereby can increase and set up the required cost of information acquisition device on the sampling carrier.
Disclosure of Invention
In view of this, the present invention is directed to an information collecting device, which can collect temperatures of a plurality of sampling carriers simultaneously, has higher versatility, and can reduce the design cost of the information collecting device, so as to reduce the cost for installing the information collecting device on the sampling carriers.
In order to achieve the purpose, the technical scheme of the invention is realized as follows:
an information acquisition apparatus includes: a circuit board; the collection chip, the collection chip with the circuit board electricity is connected, the collection chip is suitable for with the contact of sampling carrier and be used for gathering the temperature of sampling carrier.
In some examples of the invention, the collection chip has a temperature-collection region adapted to be in contact with the sample carrier.
In some examples of the invention, the circuit board is provided with a mounting hole, and the acquisition chip is mounted in the mounting hole.
In some examples of the invention, the side of the collection chip for contacting the sample carrier is provided with a heat conducting layer.
In some examples of the invention, the thermally conductive layer is configured as a thermally conductive adhesive layer.
In some examples of the present invention, the information collecting apparatus further includes: the voltage acquisition part is electrically connected with the circuit board, and the voltage acquisition part is used for being electrically connected with the sampling carrier to acquire the voltage of the sampling carrier.
In some examples of the present invention, the voltage collecting part is configured as a metal sheet.
In some examples of the invention, the side of the circuit board that is intended to be in contact with the sample carrier is provided with an adhesive portion.
In some examples of the present invention, the information collecting device further includes a communication input terminal and a communication output terminal, and both the communication input terminal and the communication output terminal are electrically connected to the circuit board.
Compared with the prior art, the information acquisition device has the following advantages:
according to the information acquisition device, when the number of the sampling carriers is multiple, the information acquisition devices are respectively arranged on the sampling carriers and are sequentially connected in series, compared with the prior art, the information acquisition device can realize accurate temperature measurement of the sampling carriers, and the information acquisition devices can simultaneously acquire the temperatures of the sampling carriers, so that the detection range of the information acquisition device can be enlarged, meanwhile, the number of the information acquisition devices can be matched with the number of the sampling carriers by increasing or reducing the number of the information acquisition devices, the information acquisition device can be matched with the sampling carriers of different models for use, so that the universality of the information acquisition device can be improved, and the production cost and the design cost of the information acquisition device can be reduced.
Another objective of the present invention is to provide a battery module.
In order to achieve the purpose, the technical scheme of the invention is realized as follows:
a battery module includes: a plurality of cells; the battery cell comprises an information acquisition device, wherein the information acquisition device is the information acquisition device, and the information acquisition device is matched and assembled with the battery cell.
Compared with the prior art, the advantages of the battery module and the information acquisition device are the same, and are not described again.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate an embodiment of the invention and, together with the description, serve to explain the invention and not to limit the invention. In the drawings:
fig. 1 is a schematic diagram of an information acquisition apparatus according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of a communication input according to an embodiment of the present invention;
FIG. 3 is a schematic diagram of a communication output according to an embodiment of the present invention;
FIG. 4 is a schematic diagram of a plurality of information acquisition devices connected in series in sequence by electrical connection lines according to an embodiment of the present invention;
FIG. 5 is a schematic diagram of a first embodiment of a sampling circuit according to the present invention;
FIG. 6 is a schematic diagram of a plurality of sampling circuits according to a first embodiment of the present invention connected in series;
FIG. 7 is a schematic diagram of a plurality of sampling circuits according to a second embodiment of the present invention connected in series;
FIG. 8 is a schematic diagram of two information acquisition devices connected by an electrical connection line according to an embodiment of the present invention;
fig. 9 is a schematic view of a battery module according to an embodiment of the invention.
Description of reference numerals:
a battery module 1000;
an information acquisition device 100; a battery cell 200; an electrical connection wire 300; a noise reduction feature 400;
a wiring board 10; a mounting hole 101;
an acquisition chip 20; a voltage acquisition unit 30; a communication input 40; a communication output 50.
Detailed Description
It should be noted that the embodiments and features of the embodiments may be combined with each other without conflict.
The present invention will be described in detail below with reference to the embodiments with reference to the attached drawings.
As shown in fig. 1 to 9, an information collecting apparatus 100 according to an embodiment of the present invention includes: a circuit board 10 and an acquisition chip 20. In which the surface of the circuit board 10 may be etched, in some specific embodiments, the circuit board 10 may be a printed circuit board 10, but the present invention is not limited thereto, and for example, the circuit board 10 may also be a flexible circuit board. Preferably, the circuit board 10 may be configured as a flexible circuit board, and the flexibility of the flexible circuit board is higher, which may facilitate the information acquisition device 100 to be installed in the battery module 1000.
The acquisition chip 20 is electrically connected to the circuit board 10, specifically, the acquisition chip 20 has a plurality of pins, and the circuit board 10 may be correspondingly provided with a plurality of soldering points, and the plurality of soldering points are all connected to the circuit on the surface of the circuit board 10. A plurality of pins of collection chip 20 can respectively with the welding point welded connection that corresponds to can make circuit board 10 link together with collection chip 20, and collection chip 20 can switch on through the circuit on welding point and circuit board 10 surface, and then can realize the technological effect that collection chip 20 is connected with circuit board 10 electricity.
Meanwhile, the acquisition chip 20 is adapted to be in contact with the sampling carrier and for acquiring the temperature of the sampling carrier. The temperature sensor can be integrated in the acquisition chip 20, and through contacting the acquisition chip 20 with the sampling carrier, the temperature sensor can change the temperature of the sampling carrier into an electric signal, and the acquisition chip 20 can acquire the temperature of the sampling carrier according to the electric signal sent by the temperature sensor. It should be noted that in some embodiments, the collection chip 20 may be in direct contact with the surface of the sample carrier to collect the temperature of the sample carrier, for example, the collection chip 20 may be attached to the surface of the sample carrier. In other embodiments, the acquisition chip 20 may be in indirect contact with the surface of the sampling carrier to acquire the temperature of the sampling carrier, for example, a heat conducting medium may be disposed between the acquisition chip 20 and the surface of the sampling carrier, the heat conducting medium may transfer heat between the acquisition chip 20 and the sampling carrier, and the acquisition chip 20 may acquire the temperature of the sampling carrier according to the temperature of the heat conducting medium.
Furthermore, the circuit board 10 may further be provided with a plurality of component connection sites, and the plurality of component connection sites are all connected with the circuit on the surface of the circuit board 10. The component connection site may mount electronic components, which may include but are not limited to: resistance, electric capacity etc. through gathering chip 20, circuit board 10 and electronic component cooperation, can make the surface of circuit board 10 form the sampling circuit, for example circuit board 10, electronic component and gather chip 20 cooperation can form the sampling circuit shown in figure 5, through set up the sampling circuit on information acquisition device 100, information acquisition device 100 can gather the temperature of sampling carrier according to the sampling demand.
Further, when the sampling carrier is a plurality of, information acquisition device 100 can be provided with a plurality ofly correspondingly, a plurality of information acquisition device 100 are used for detecting the temperature of the sampling carrier that corresponds respectively, thereby the modularization design of information acquisition device 100 has been realized, the designer can set up the information acquisition device 100 that corresponds quantity according to the quantity of sampling carrier, the designer is when setting up the temperature of information acquisition device 100 in order to gather the sampling carrier, the designer need not design information acquisition device 100 in addition for the sampling carrier of different models according to the quantity and the mode of arranging of sampling carrier.
Moreover, a plurality of information collecting devices 100 may be connected in communication, preferably, a plurality of information collecting devices 100 may be connected in series in sequence, and fig. 7 is a sampling circuit after two information collecting devices 100 are connected in series in some specific embodiments of the present invention. Further, a plurality of information acquisition devices 100 can be electrically connected with an analysis device after being connected in series, and the analysis device can simultaneously analyze the temperature data acquired by the plurality of information acquisition devices 100, so that whether the temperature of the sampling carrier is abnormal can be judged.
Therefore, when the number of the sampling carriers is plural, the information acquisition devices 100 are respectively arranged on the plurality of sampling carriers, and the plurality of information acquisition devices 100 are sequentially connected in series in communication, compared with the prior art, on the basis of simultaneously acquiring the temperatures of the plurality of sampling carriers, the information acquisition devices 100 have higher universality, the design cost of the information acquisition devices 100 can be reduced, and the cost for arranging the information acquisition devices 100 on the sampling carriers can be reduced.
In some embodiments of the present invention, the collection chip 20 has an temperature collection region adapted to be in contact with a sample carrier. Wherein, the temperature collection area can be disposed on one side of the collection chip 20 facing the sampling carrier, the temperature sensor can be integrated in the temperature collection area, and the heat generated by the sampling carrier can be transferred to the temperature collection area by contacting the temperature collection area with the sampling carrier. After the heat of the sampling carrier is transferred to the temperature acquisition area, the temperature sensor can generate a temperature signal, and the acquisition chip 20 can acquire the temperature of the sampling carrier after receiving the temperature signal of the temperature sensor.
It should be noted that, in some embodiments of the present invention, the temperature sensor may be separately disposed on the circuit board 10, and when the collecting chip 20 is mounted on the circuit board 10, the temperature sensor and the collecting chip 20 may be in communication connection, and at this time, the temperature collecting area may be located on the circuit board 10, and by contacting the circuit board 10 with the sampling carrier, the collecting chip 20 may collect the temperature of the sampling carrier through the temperature sensor disposed on the circuit board 10.
In some embodiments of the present invention, as shown in fig. 1, the wiring board 10 may be provided with a mounting hole 101, and the acquisition chip 20 may be mounted in the mounting hole 101. The mounting hole 101 may penetrate through the circuit board 10 in the thickness direction of the circuit board 10, and when the pickup chip 20 is mounted on the circuit board 10, the temperature pickup area may be disposed opposite to the mounting hole 101. When the capture chip 20 is adapted to be in direct contact with the sample carrier, the temperature capture region may pass through the mounting hole 101 and then contact the sample carrier, thereby allowing the capture chip 20 to capture the temperature of the sample carrier.
When the acquisition chip 20 is suitable for indirect contact with a sampling carrier, a heat conducting medium may be filled in the mounting hole 101, the heat conducting medium may be air or a substance with strong heat conducting capability, and the heat conducting medium may also be a heat conducting structure such as a heat pipe. When the heat-conducting medium is filled in the mounting hole 101, the heat-conducting medium can contact with the sampling carrier, and the heat-conducting medium can contact with the temperature acquisition region, so that the heat on the surface of the sampling carrier can be transmitted to the temperature acquisition region through the heat-conducting medium, and the temperature of the sampling carrier can be acquired by the acquisition chip 20. Therefore, the mounting hole 101 can avoid a temperature acquisition area or a heat conducting medium, so that the acquisition chip 20 can be ensured to be in contact with a sampling carrier, and the accuracy of data acquisition of the information acquisition device 100 can be improved.
In some embodiments of the present invention, the side of the acquisition chip 20 for contact with the sample carrier may be provided with a thermally conductive layer. That is, the collection chip 20 and the sampling carrier may be in indirect contact, and the heat conducting medium between the collection chip 20 and the sampling carrier may be a heat conducting layer. The heat-conducting layer can be filled in mounting hole 101, also can understand, mounting hole 101 can be used for dodging the heat-conducting layer to can guarantee that the heat-conducting layer can contact with gathering chip 20, heat-conducting layer and sampling carrier homoenergetic, and then can make the heat-conducting layer conduct the heat of sampling carrier to the temperature acquisition district so that gather the temperature of sampling carrier by chip 20.
Further, the heat-conducting layer can be constructed into the heat-conducting glue layer, the heat-conducting layer can adopt the heat-conducting glue material promptly, the heat-conducting glue has good heat conductivity, and the heat-conducting glue has certain mobility, the heat-conducting glue can be filled uniformly between collection chip 20 and the sampling carrier, and between heat-conducting glue and the collection chip 20, all laminate closely between heat-conducting glue and the sampling carrier, between heat-conducting glue and the collection chip 20, the area of contact between heat-conducting glue and the sampling carrier is bigger, the heat that the sampling carrier produced easily conducts to collection chip 20 through the heat-conducting glue, thereby can make collection chip 20 can be fast, accurately acquire the temperature of sampling carrier.
In some embodiments of the present invention, as shown in fig. 1, 4, and 8, the information collecting apparatus 100 may further include: the voltage acquisition part 30, the voltage acquisition part 30 can be used to be electrically connected with the sampling carrier to acquire the voltage of the sampling carrier. When the sampling carrier is an electric device or an electric storage device, the voltage acquisition unit 30 is provided in the information acquisition device 100, so that the information acquisition device 100 can acquire the voltage of the sampling carrier, and the functionality of the information acquisition device 100 can be increased. It should be noted that the voltage collecting part 30 may be connected to a current input end or a current output end of the electric device, or the voltage collecting part 30 may be connected to a current input end or a current output end of the electric storage device.
And, voltage acquisition portion 30 can be connected with circuit board 10 electricity, specifically speaking, voltage acquisition portion 30 can be connected with the circuit on circuit board 10 electricity, and then can make voltage acquisition portion 30 and install collection chip 20 on circuit board 10 electricity and be connected, through collection chip 20, circuit board 10 and electronic component cooperation, after voltage acquisition portion 30 gathers the voltage of sampling carrier, collection chip 20 can generate the voltage signal of sampling carrier, and sampling circuit can send the voltage signal who gathers to analytical equipment, and analytical equipment can be according to the voltage signal analysis sampling carrier's voltage whether unusual.
In addition, when the acquisition chip 20, the circuit board 10 and the electronic component cooperate to form a circuit as shown in fig. 5, the information acquisition device 100 may further be configured to calculate an internal resistance of the sampling carrier, and the information acquisition device 100 may generate an internal resistance signal of the sampling carrier, and the analysis device may determine the aging condition of the sampling carrier according to the internal resistance of the sampling carrier after receiving the internal resistance signal of the sampling carrier.
Further, when the acquisition chip 20, the circuit board 10 and the electronic component cooperate to form a circuit as shown in fig. 5, the information acquisition device 100 can also be used to equalize the voltage of the sampling carrier, so that the voltage of the sampling carrier can be kept within a proper working voltage range, and the service life of the sampling carrier can be effectively prolonged.
In some embodiments of the present invention, the voltage collecting part 30 may be configured as a metal sheet, wherein the metal has good conductive performance, and the metal sheet has low resistance, and the use of the metal sheet to collect the voltage of the sampling carrier may improve the sampling precision of the information collecting apparatus 100. Specifically, the voltage collecting part 30 may be configured as an aluminum sheet, a nickel sheet, a copper sheet, or the like, the voltage collecting part 30 may be connected to the circuit board 10 by soldering, and the voltage collecting part 30 may be connected to the current input terminal or the current output terminal of the sampling carrier by soldering, so that it may be ensured that the voltage collecting part 30 is reliably connected between the circuit board 10 and the sampling carrier. Of course, in other embodiments of the present invention, the voltage collecting part 30 and the circuit board 10, and the voltage collecting part 30 and the sampling carrier may be connected by fasteners, which may be bolts, etc., and this arrangement also ensures that the voltage collecting part 30 is reliably connected between the circuit board 10 and the sampling carrier.
In some embodiments of the present invention, a side of the circuit board 10 for contacting with the sampling carrier may be provided with an adhesive portion, that is, a side of the circuit board 10 away from the sampling carrier 20 may be provided with an adhesive portion, wherein a surface of the adhesive portion is flat, and the adhesive portion is adapted to a surface shape of the sampling carrier, and the adhesive portion may be in adhesive fit with a surface of the sampling carrier, in some embodiments, the adhesive portion may be a double-sided tape, one side of the double-sided tape may be in adhesive fit with the circuit board 10, and the other side of the double-sided tape may be in adhesive fit with the sampling carrier, so that the information collecting device 100 may be reliably mounted on the sampling carrier.
However, the present invention is not limited thereto, for example, in other embodiments, the bonding portion may be replaced by glue, and by applying glue on the side of the circuit board 10 for contacting with the sampling carrier and pressing the circuit board 10 and the sampling carrier into fit, the technical effect of reliably mounting the information acquisition device 100 on the sampling carrier can be achieved. Of course, in other embodiments, the adhesive portion may be replaced by a soldering portion, and the circuit board 10 may be mounted on the sampling carrier by soldering.
In some embodiments of the present invention, as shown in fig. 1-3 and 8, the information collecting apparatus 100 may further include a communication input 40 and a communication output 50, and both the communication input 40 and the communication output 50 are electrically connected to the circuit board 10. Wherein the communication input 40 and the communication output 50 may each include a plurality of electrical connection sites, each of which is in electrical communication with one of the circuits in the wiring board 10. And the number of electrical connection bits of the communication input terminal 40 is the same as that of the communication output terminal 50, for example, in the embodiment shown in fig. 8, the number of electrical connection bits of the communication input terminal 40 and that of the communication output terminal 50 are both set to five.
Further, the electrical connection line 300 may be connected between the communication output terminal 50 of the nth information acquisition device 100 and the communication input terminal 40 of the (n + 1) th information acquisition device 100, where n is an integer greater than 0. The plurality of information collection devices 100 are sequentially connected by using the plurality of electrical connection lines 300, so that the technical effect that the plurality of information collection devices 100 are sequentially connected in series can be achieved, and the electrical connection lines 300 can serially connect the sampling circuits of the plurality of information collection devices 100, so that the sampling circuits of the plurality of information collection devices 100 can transmit sampled voltage signals, temperature signals, internal resistance signals and the like to the analysis device through the serial circuit.
Further, in some embodiments, the communication input end 40 and the electrical connection line 300 may be connected together through a plug port and a plug terminal, and the communication output end 50 and the electrical connection line 300 may be connected together through a plug port and a plug terminal, that is, the communication input end 40 and the electrical connection line 300, and the communication output end 50 and the electrical connection line 300 are in plug fit, in other embodiments, as shown in fig. 8, a welding portion may be disposed between the communication input end 40 and the electrical connection line 300, and a welding portion may be disposed between the communication output end 50 and the electrical connection line 300, and a welding portion may be disposed between the communication input end 40 and the electrical connection line 300, and a welding portion may be disposed between the communication output end 50 and the electrical connection line 300. This arrangement makes it possible to reliably connect the communication input terminal 40 to the electrical connection line 300 and the communication output terminal 50 to the electrical connection line 300.
Further, when a plurality of electric cores 200 are connected in series, the arrangement direction between any two adjacent electric cores 200 is opposite, the setting position of the information acquisition device 100 on each electric core 200 is the same, and any two adjacent information acquisition devices 100 are arranged in a staggered manner, the information acquisition device 100 arranged on one side of the battery module 1000 is of an A-type structure, the information acquisition device 100 arranged on the other side of the battery module 1000 is of a B-type structure, the A-type structure and the B-type structure are of mirror image structures, when the electric connection line 300 is connected between the two information acquisition devices 100, the arrangement can avoid the intersection between the electric connection lines 300, so that the signal interference between the electric connection lines 300 can be reduced, and the sampling quality of the information acquisition device 100 can be improved.
In some embodiments of the present invention, the length dimension of the circuit board 10 is L, and satisfies the following relation: l is more than or equal to 10mm and less than or equal to 30mm, and the width dimension of the circuit board 10 is W, so that the relation is satisfied: w is more than or equal to 10mm and less than or equal to 30mm, for example, as the information acquisition device 100 shown in FIG. 8, the length dimension of the information acquisition device 100 is 19.6mm, and the width dimension of the information acquisition device 100 is 17.94 mm. Set up to 10mm ~ 30mm through the length dimension with circuit board 10, and the width dimension of circuit board 10 sets up to 10mm ~ 30mm, when guaranteeing that the circuit of etching does not mutually interfere in circuit board 10, can reduce the radial dimension of circuit board 10 effectively to can reduce the occupation space of information acquisition device 100 on the sampling carrier, and then can make information acquisition device 100 set up in the sampling carrier more easily.
According to some specific embodiments of the present invention, a noise reduction component 400 such as a transformer may be disposed between the first information collection device 100 and the analysis device and/or between the last information collection device 100 and the analysis device, and the noise reduction component 400 may reduce a noise signal between the information collection device 100 and the analysis device, so as to avoid data analysis abnormality of the analysis device caused by a large deviation between data received by the analysis device and actual data.
The battery module 1000 according to the embodiment of the present invention includes: a plurality of electric cores 200 and information acquisition device 100, a plurality of electric cores 200 can arrange in proper order, can be connected through the busbar electricity between the electric core 200. The information collecting device 100 may be the information collecting device 100 of the above embodiment, that is, the Battery cell 200 may be used as a sampling carrier, the information collecting device 100 may collect the temperature and the voltage of the Battery cell 200, the Battery module 1000 may further include a BMS (Battery Management System — Battery Management System), the analyzing device of the above embodiment may be the BMS of the Battery module 1000, after the temperature data and the voltage data of the Battery cell 200 collected by the information collecting device 100 are transmitted to the BMS, the BMS may analyze the temperature data and the voltage data of the Battery cell 200, so as to determine whether the temperature and the voltage of the Battery cell 200 are abnormal, and further, the probability of overheat damage and overvoltage damage of the Battery module 1000 may be reduced.
In addition, when the acquisition chip 20, the circuit board 10 and the electronic component cooperate to form a sampling circuit as shown in fig. 5, the BMS may also calculate the internal resistance of the battery cell 200 through the sampling circuit, and further, when the BMS analyzes the voltage abnormality of the battery cell 200, the BMS may also equalize the voltage of the battery cell 200 through the sampling circuit of the information acquisition device 100 corresponding to the abnormal battery cell 200, so that the voltage of the battery cell 200 may be maintained within an appropriate operating voltage interval.
And, information acquisition device 100 and electric core 200 cooperate the assembly, specifically speaking, information acquisition device 100's circuit board 10 can be provided with the bonding portion, the bonding portion can set up in the one side that is used for with the contact of sampling carrier of circuit board 10, when the casing temperature of electric core 200 keeps the same or similar with the temperature of electric core 200, the bonding portion can bond the cooperation with the casing of electric core 200, that is to say, information acquisition device 100 can bond on the casing of electric core 200, information acquisition device 100 can be through the casing temperature of collection electric core 200 in order to obtain the temperature of electric core 200. In other specific embodiments, when the temperature of the bus bar of the battery cell 200 is the same as or similar to the temperature of the battery cell 200, the bonding portion may be in bonding fit with the bus bar of the battery cell 200, and the information acquisition device 100 may acquire the temperature of the battery cell 200 by acquiring the temperature of the bus bar of the battery cell 200.
Further, when the casing of electric core 200 includes that insulating casing body and metal inner casing constitute, insulating casing body can be provided with dodge the hole, and information acquisition device 100 can install in mounting hole 101, and information acquisition device 100 can contact with the metal inner casing to can make information acquisition device 100 gather the temperature of electric core 200 more accurately.
Further, when electric core 200 is a plurality of, information acquisition device 100 can correspond and be provided with a plurality ofly, a plurality of information acquisition device 100 are used for detecting the temperature of corresponding electric core 200 respectively, thereby the modularized design of information acquisition device 100 has been realized, the designer can set up the information acquisition device 100 that corresponds quantity according to the quantity of electric core 200, the designer is when setting up the temperature of information acquisition device 100 in order to gather electric core 200, the designer need not design information acquisition device 100 in addition according to the quantity of electric core 200 and the mode of arranging.
Moreover, a plurality of information collecting devices 100 may be connected in communication, preferably, a plurality of information collecting devices 100 may be connected in series in sequence, and fig. 7 is a sampling circuit after two information collecting devices 100 are connected in series in some embodiments of the present invention. Further, a plurality of information acquisition devices 100 can be connected with the BMS electricity after establishing ties, and the BMS can be simultaneously to the temperature data of a plurality of information acquisition devices 100 collection carry out the analysis to can judge whether the temperature of battery module 1000, every electric core 200's temperature is unusual in the battery module 1000.
Further, when the circuit material etched on the circuit board 10 is a copper material and the bus bar material between the battery cells 200 is an aluminum material, the voltage collecting part 30 may be constructed as a nickel plate, that is, the voltage collecting part 30 may be made of a nickel material, wherein the chemical property of the nickel material is between the aluminum material and the copper material, and the conductivity of the nickel plate is better, by disposing the nickel plate between the bus bar and the circuit board 10, under the condition that the voltage collecting part 30 can accurately collect the voltage of the battery cells 200, electrochemical corrosion does not easily occur between the nickel plate and the copper circuit, between the nickel plate and the aluminum bus bar, so that the service life of the voltage collecting part 30 can be effectively prolonged.
According to the sampling circuit provided by the embodiment of the invention, the sampling circuit comprises a plurality of sub-sampling circuits, the sampling circuit is provided with the acquisition chip 20, and the sampling circuit can have multiple functions by matching the acquisition chip 20 with the plurality of sub-sampling circuits. Specifically, the capture chip 20 may include a plurality of pins, and in the embodiment shown in fig. 5, the capture chip 20 may include 20 pins, and the 20 pins of the capture chip 20 may be electrically connected to the circuits inside the capture chip 20, respectively. In the width direction of the acquisition chip 20, 10 pins may be respectively disposed on two sides of the acquisition chip 20, and the 10 pins may be sequentially spaced along the length direction of the acquisition chip 20, and the invention will be described below by taking fig. 5 as an example.
In the sampling circuit, the first pin, the twentieth pin, the eleventh pin and the twelfth pin can be all constructed as VSS pins, the first pin can be connected with the twentieth pin through a sub-sampling circuit, the sub-sampling circuit connected with the first pin and the twentieth pin can be grounded, the eleventh pin can be connected with the twelfth pin through a sub-sampling circuit, the sub-sampling circuit connected with the first pin and the twentieth pin can be grounded, and a designer can debug the acquisition chip through the sub-sampling circuit connected with the first pin and the twentieth pin and the sub-sampling circuit connected with the first pin and the twentieth pin, so that the acquisition chip can acquire the voltage and/or the temperature of the battery core according to a preset instruction.
Further, in the sampling circuit, the second pin may be configured as a VDR pin, the third pin may be configured as a VSW pin, the second pin may be connected to the third pin through the sub-sampling circuit, an MOS transistor may be disposed between the electrical core 200 and the third pin, a G pole of the MOS transistor is connected to the third pin, an S pole of the MOS transistor is grounded, a D pole of the MOS transistor is connected to the third pin, the D pole of the MOS transistor is further connected to a resistor, the other end of the resistor is connected to a sixteenth pin and a seventeenth pin, and the sampling circuit may measure the internal resistance of the electrical core 200 with different gain effects by matching the second pin, the third pin and the MOS transistor.
Further, in the sampling circuit, the fourth pin may be configured as a VCLg pin, the fifth pin may be configured as a VCLm pin, the sixteenth pin may be configured as a VCHm pin, the seventeenth pin may be configured as a VCHg pin, the fourth pin and the fifth pin may be grounded, and the sixteenth pin and the seventeenth pin may further be connected to the positive post of the electrical core 200, through the cooperation of the fifth pin and the sixteenth pin, the sampling circuit may detect the voltage of the electrical core 200, and through the cooperation of the fourth pin and the seventeenth pin, the sub-sampling circuit connected to the fourth pin and the seventeenth pin may assist in detecting the voltage of the electrical core 200, so that the acquisition chip 20 may verify the acquired voltage of the electrical core 200, and further, the sampling accuracy of the information acquisition device 100 may be further improved.
Further, as shown in fig. 5, a sixth pin may be configured as a VSS pin, a fifteenth pin may be configured as a VBAT pin, the sixth pin may be connected to the negative pole of the battery cell 200, and the fifteenth pin may be connected to the positive pole of the battery cell 200, and through the cooperation of the sixth pin and the fifteenth pin, the sub-sampling circuit connected to the sixth pin and the fifteenth pin may supply power to the acquisition chip 20, so as to ensure that the acquisition chip 20 works normally.
Further, the seventh pin may be configured as a DIOBOTp/MOSI pin, the eighth pin may be configured as a DIOBOTn/SCK pin, the fourteenth pin may be configured as a diopopp pin, and the thirteenth pin may be configured as a diopopn pin, as shown in fig. 5, the seventh pin may be connected to the fourteenth pin of the acquisition chip 20 in the upstream information acquisition device 100, and the eighth pin may be connected to the thirteenth pin of the acquisition chip 20 in the upstream information acquisition device 100.
Correspondingly, the fourteenth pin may be connected to a seventh pin of the acquisition chip 20 in the downstream information acquisition device 100, the thirteenth pin may be connected to an eighth pin of the acquisition chip 20 in the downstream information acquisition device 100, and the seventh pin, the eighth pin, the thirteenth pin, and the fourteenth pin are respectively matched with a pin corresponding to the acquisition chip 20 in the adjacent information acquisition device 100, and signal transmission may be performed between any two adjacent information acquisition devices 100 through a sub-sampling circuit connected to the seventh pin and the fourteenth pin and a sub-sampling circuit connected to the eighth pin and the thirteenth pin, so that the plurality of information acquisition devices 100 may transmit the acquired temperature data and/or voltage data to the analysis device step by step along a serial path of the plurality of information acquisition devices 100.
Further, as shown in fig. 5, the ninth pin may be configured as an SPI _ en pin, the ninth pin may be connected to the seventh pin, and the ninth pin may be connected to the eighth pin, and diodes may be disposed between the ninth pin and the seventh pin, and between the ninth pin and the eighth pin, and the diodes may protect the corresponding sub-sampling circuits, so that the corresponding sub-sampling circuits may be prevented from being damaged by overload under a high-power condition. Meanwhile, when the information acquisition device 100 is connected with the analysis device, the ninth pin may be connected to a high level, and may adjust the operating mode of the SPI. When the information collecting device 100 is disposed between two information collecting devices 100, the ninth pin may be disposed to be grounded.
Further, as shown in fig. 5, the tenth pin may be configured as a MISO pin, and the tenth pin may be disposed in the air. I.e. the tenth pin is not connected to the sampling circuit. Further, the eighteenth pin may be configured as a VHP pin, the eighteenth pin may be connected to the positive post of the battery cell 200, and a capacitor may be connected between the eighteenth pin and the positive post of the battery cell 200, and when the acquisition chip 20 detects the internal resistance of the battery cell 200 in the high gain mode, the eighteenth pin may filter the internal resistance signal, so as to improve the sampling accuracy of the acquisition chip 20 on the internal resistance of the battery cell.
Furthermore, the thirteenth pin and the fourteenth pin can be grounded after being connected with diodes, and the diodes can be used for protecting the corresponding sub-sampling circuits, so that the corresponding sub-sampling circuits can be prevented from being damaged by overload under a high-power working condition. Further, the nineteenth pin may be configured as a VBAT _ FIL pin, the nineteenth pin may be grounded after being connected to the capacitor, and the sub-sampling circuit connected to the nineteenth pin may be configured to filter the power supplied to the acquisition chip 20, so that the working stability of the acquisition chip 20 may be improved.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents, improvements and the like that fall within the spirit and principle of the present invention are intended to be included therein.
Claims (10)
1. An information acquisition apparatus, comprising:
a wiring board (10);
gather chip (20), gather chip (20) with circuit board (10) electricity is connected, gather chip (20) be suitable for with the sampling carrier contact and be used for gathering the temperature of sampling carrier.
2. The information acquisition device according to claim 1, characterized in that said acquisition chip (20) has an temperature acquisition zone adapted to be in contact with said sampling support.
3. The information acquisition device according to claim 1, wherein the circuit board (10) is provided with a mounting hole (101), and the acquisition chip (20) is mounted to the mounting hole (101).
4. The information acquisition device according to any one of claims 1 to 3, wherein a side of the acquisition chip (20) for contacting the sample carrier is provided with a heat conducting layer.
5. The information acquisition device according to claim 4, wherein the thermally conductive layer is configured as a thermally conductive adhesive layer.
6. The information acquisition apparatus according to claim 1, further comprising: voltage acquisition portion (30), voltage acquisition portion (30) with circuit board (10) electricity is connected, voltage acquisition portion (30) be used for with the sampling carrier electricity is connected in order to gather sampling carrier voltage.
7. The information acquisition apparatus according to claim 6, wherein the voltage acquisition portion (30) is configured as a metal sheet.
8. The information acquisition device according to claim 1, wherein a side of the circuit board (10) for contacting the sample carrier is provided with an adhesive portion.
9. The information acquisition device according to claim 1, further comprising a communication input (40) and a communication output (50), wherein the communication input (40) and the communication output (50) are both electrically connected to the wiring board (10).
10. A battery module is characterized by comprising
A plurality of cells (200);
an information acquisition device (100), wherein the information acquisition device (100) is the information acquisition device according to any one of claims 1 to 9, and the information acquisition device (100) is matched and assembled with the battery core (200).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210476410.8A CN114839548A (en) | 2022-04-29 | 2022-04-29 | Information acquisition device and battery module |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210476410.8A CN114839548A (en) | 2022-04-29 | 2022-04-29 | Information acquisition device and battery module |
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| CN114839548A true CN114839548A (en) | 2022-08-02 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117054904A (en) * | 2023-10-11 | 2023-11-14 | 深圳市万联新能科技有限公司 | Inspection device and system for fuel cell |
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2022
- 2022-04-29 CN CN202210476410.8A patent/CN114839548A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117054904A (en) * | 2023-10-11 | 2023-11-14 | 深圳市万联新能科技有限公司 | Inspection device and system for fuel cell |
| CN117054904B (en) * | 2023-10-11 | 2024-01-12 | 深圳市万联新能科技有限公司 | Inspection device and system for fuel cell |
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