CN114833719A

CN114833719A - Loading jig, polishing device, 2.5D cover plate processing method and electronic equipment

Info

Publication number: CN114833719A
Application number: CN202210210716.9A
Authority: CN
Inventors: 王凯强; 董青; 张鑫
Original assignee: Honor Device Co Ltd
Current assignee: Honor Device Co Ltd
Priority date: 2022-03-03
Filing date: 2022-03-03
Publication date: 2022-08-02
Anticipated expiration: 2042-03-03
Also published as: CN114833719B

Abstract

The application discloses loading jig, polishing device, 2.5D cover plate machining method and electronic equipment, and relates to the technical field of machining. The loading jig is used for placing a substrate to be polished, the substrate comprises a plane area and a first region to be polished, the first region to be polished is located on one side of the plane area, the loading jig comprises a placing groove, a plurality of substrates are obliquely stacked in the placing groove, the substrate close to a first inner side wall in two adjacent substrates is defined to be a first substrate, the substrate far away from the first inner side wall in the two adjacent substrates is a second substrate, in the depth direction along the placing groove, the projection of the plane area of the first substrate on the bottom wall of the groove is a first projection, the projection of the first region to be polished of the first substrate on the bottom wall of the groove is a second projection, the projection of the second substrate on the bottom wall of the groove is a third projection, the first projection is located in the third projection, and the second projection is located outside the third projection.

Description

Loading jig, polishing device, 2.5D cover plate machining method and electronic equipment

Technical Field

The application relates to the technical field of electronic equipment, in particular to a processing method of a loading jig, a polishing device and a 2.5D cover plate and electronic equipment.

Background

With the increasing requirements of users on the appearance of electronic devices, 2.5D covers are generally used for camera covers, screen covers, and the like of electronic devices. The camera cover (such as a rear camera cover) has a great influence on camera imaging, especially, a PV value (difference between a peak and a trough of a mirror surface) has a key influence on the imaging of the mirror surface, the larger the PV value is, the more uneven the mirror surface is, the imaging resolving power of the camera is reduced, and user experience is influenced.

In the related art, the 2.5D cover plate is processed by a machining method of CNC processing → polishing processing on a turnover machine → flat grinding processing → light sweeping processing. The processing method has multiple processes, multiple feeding and discharging times and high reject ratio on the appearance of the cover plate. More importantly, the processing method has a great influence on the PV value of the 2.5D cover plate, the reject ratio is about 5%, so the lens factory generally delivers the products by means of fully inspecting the PV value, and the labor cost is high.

Disclosure of Invention

The embodiment of the application provides a loading jig, a polishing device, a processing method of a 2.5D cover plate and electronic equipment, and is used for solving the problem of high reject ratio of a PV value of the 2.5D cover plate.

In order to achieve the above purpose, the embodiment of the present application adopts the following technical solutions:

in a first aspect, the application provides a loading jig for placing a substrate to be polished, the substrate includes a planar region and a first region to be polished, the first region to be polished is located on one side of the planar region, the loading jig includes a placing groove, the placing groove is used for placing the substrate, the placing groove includes a groove bottom wall and a first inner side wall, the groove bottom wall is arranged opposite to an opening of the placing groove, the first inner side wall is connected to one end of the groove bottom wall, when the plurality of substrates are placed in the placing groove, the plurality of substrates are obliquely stacked in the placing groove, wherein, in a direction from the groove bottom wall to the opening, the substrates are inclined towards the first inner side wall, and the first region to be polished is located at one end of the substrate, which is far away from the groove bottom wall; the substrate close to the first inner side wall in the two adjacent substrates is defined as a first substrate, the substrate far away from the first inner side wall in the two adjacent substrates is defined as a second substrate, in the depth direction of the placing groove, the projection of the plane area of the first substrate on the groove bottom wall is a first projection, the projection of the first area to be polished of the first substrate on the groove bottom wall is a second projection, the projection of the second substrate on the groove bottom wall is a third projection, the first projection is located in the third projection, and the second projection is located outside the third projection.

In the loading fixture of the embodiment of the application, in the depth direction of the placing groove, the projection of the planar area of the first substrate on the groove bottom wall of the two adjacent substrates is located in the projection of the second substrate on the groove bottom wall, and the projection of the first area to be polished on the groove bottom wall of the first substrate is located outside the projection of the second substrate on the groove bottom wall, so that in the polishing process, the planar area of the first substrate can be shielded by the second substrate, and the second substrate can be prevented from shielding the first area to be polished, so that in the polishing process of the first area to be polished, the shielding of the planar area of the substrate can be realized without additionally adding parts, the planar area of the substrate is prevented from contacting with the polishing material, the influence of the polishing process on the PV value of the planar area can be effectively avoided, the structure is simple, the design is ingenious.

In a possible design manner of the first aspect, one of the plurality of substrates farthest from the first inner side wall is defined as a third substrate, the loading fixture further includes a shielding element, a projection of the shielding element on the bottom wall of the groove in the depth direction of the placement groove is a fourth projection, a projection of a planar area of the third substrate on the bottom wall of the groove is a fifth projection, a projection of the first area to be polished of the third substrate on the bottom wall of the groove is a sixth projection, the fifth projection is located in the fourth projection, and the sixth projection is located outside the fourth projection. In this way, the shielding piece can shield the plane area of one substrate farthest from the first inner side wall in the plurality of substrates.

In a possible design of the first aspect, a side edge of the third base plate close to the bottom wall of the groove is a first edge, and a side surface of the shielding member facing away from the bottom wall of the groove in the depth direction of the placement groove is not higher than the first edge. Like this, at the polishing in-process, can avoid the shielding piece to cause the interference to the polishing material, be favorable to improving polishing effect and polishing efficiency.

In a possible design of the first aspect, the loading fixture includes a first outer surface, and the placement groove is formed on the first outer surface. Specifically, the placement groove is formed by a portion of the first outer surface being recessed inward. Simple structure, processing is convenient, and because the standing groove directly forms on first surface, can avoid the whole relative tool removal that loads of standing groove for the position of base plate is more stable.

In a possible design manner of the first aspect, a containing groove is formed in the first outer surface, the containing groove is communicated with the containing groove, and the shielding piece is arranged in the containing groove. Like this, can firmly fix the shielding piece on loading the tool, and the dismouting of shielding piece of being convenient for to when the circumstances of damage such as wearing and tearing appear in the shielding piece, be convenient for change the shielding piece. In addition, with the shielding piece assembly in the storage tank, can avoid the shielding piece to occupy the space of placing in the standing groove to be favorable to increasing the quantity of the base plate in the standing groove, be favorable to improving polishing efficiency.

In a possible design manner of the first aspect, in the depth direction of the placement groove, the depth of the accommodation groove is h, the maximum thickness of the shielding piece is t, and the maximum thickness t of the shielding piece is less than or equal to the depth h of the accommodation groove. In this way, it is avoided that the side surface of the shield facing away from the bottom wall of the slot is higher than the first edge.

In a possible design manner of the first aspect, a side surface of the shielding member facing the third substrate includes an inclined surface, and the inclined surface extends from an end of the shielding member close to the first inner side wall toward a direction close to the bottom wall of the groove. Therefore, the shielding piece and the third substrate can be prevented from interfering while the shielding piece and the polishing material are prevented from interfering.

Like this, through fixing the both ends of shielding piece respectively in first recess and second recess, can avoid the shielding piece to deviate from a side surface of groove diapire and be higher than first edge, and can avoid the shielding piece to occupy the space of placing in the standing groove to be favorable to increasing the quantity of the base plate in the standing groove, be favorable to improving polishing efficiency.

In a possible design of the first aspect, the first inner side wall includes a slope surface, and when the substrate is placed in the placement groove, the substrate close to the first inner side wall abuts against the slope surface, and the slope surface extends obliquely in a direction away from the groove bottom wall in a direction from the groove bottom wall to the opening. Therefore, the substrate can be supported through the slope-shaped surface, the contact area between the substrate and the first inner side wall is increased, and the position stability of the substrate can be improved.

In a possible design manner of the first aspect, the first region to be polished forms a first arc surface after being polished, and the slope of the slope surface is equal to an included angle between a tangent line of the first arc surface and the plane area. Like this, when placing the base plate in the standing groove, can guarantee that first region orientation polishing material of treating polishes, the polishing material of being convenient for is to first region of treating polishing and is polished, and is convenient for control the radian of first cambered surface, improves the yield of 2.5D apron.

In one possible embodiment of the first aspect, the slope of the slope surface is 10 °.

In a possible design of the first aspect, the placement groove further includes a second inner side wall and a third inner side wall that are disposed opposite to each other in a width direction of the groove bottom wall. The second inner side wall and the third inner side wall can limit the substrate in the width direction of the groove bottom wall, and the substrate is prevented from flying out of the placing groove in the polishing treatment process.

In a possible embodiment of the first aspect, the groove bottom wall is provided with a step surface for supporting the substrate, and the step surface extends obliquely in a direction from the groove bottom wall to the opening, in a direction away from the groove bottom wall. One end of the substrate, which is far away from the first region to be polished, can be attached to the step surface, so that the inclination angle of the substrate can be controlled, the substrate can be limited by the step surface, the substrate is prevented from sliding towards the direction far away from the first inner side wall, and the position stability of the substrate can be improved.

In one possible embodiment of the first aspect, the step surface is parallel to the slope surface.

In a possible design of the first aspect, the number of the step surfaces may be plural, so that the number of the substrates accommodated in the placing groove can be increased, and the efficiency of the polishing process can be improved.

In a possible design manner of the first aspect, the loading jig further comprises a negative pressure cavity, the negative pressure cavity is located on one side of the groove bottom wall, which is away from the open opening, a first communicating hole communicated with the negative pressure cavity is arranged on the slope-shaped surface, and a second communicating hole communicated with the negative pressure cavity is arranged on the step surface. Thus, after the substrate is placed in the placing groove, the negative pressure cavity can be vacuumized, and the substrate is adsorbed on the slope surface and the step surface by using negative pressure.

In a possible design manner of the first aspect, an air exhaust pipeline is arranged on the device jig, one end of the air exhaust pipeline is communicated with the negative pressure cavity, and the other end of the air exhaust pipeline is communicated with the vacuumizing device.

In one possible embodiment of the first aspect, the vacuum chamber is formed on the loading fixture by CNC molding.

In one possible design of the first aspect, the cover is an acrylic. That is, the shielding member is made of acrylic material. The acrylic material has good wear resistance and low cost, and can prolong the service life of the shielding piece and reduce the cost.

In a possible embodiment of the first aspect, the shield can also be arranged obliquely in the receiving groove.

In a second aspect, the present application provides a polishing apparatus, comprising a chassis, a loading fixture and a turntable, wherein the loading fixture is fixedly connected to the chassis, and the loading fixture is the loading fixture in any one of the above-mentioned first aspect; the turntable is rotatably arranged on one side of the chassis, and the surface of one side of the turntable, which faces the chassis, is provided with polishing materials.

In a third aspect, the present application provides a method for processing a 2.5D cover plate, the method comprising:

step S100: providing a substrate, wherein the substrate comprises a plane area and a first area to be polished, which is positioned on one side of the plane area;

step S200: and shielding the plane area of the substrate, and polishing the first area to be polished to form a first cambered surface in the first area to be polished.

Therefore, in the process of polishing the first area to be polished, the plane area of the substrate can be prevented from contacting with the polishing material, and the influence of the polishing process on the PV value of the plane area can be effectively avoided.

In a possible design manner of the third aspect, after the polishing process is performed on the first region to be polished, the method further includes:

step S300: and performing light sweeping treatment on the polished substrate to eliminate boundary marks between the plane area and the first cambered surface.

In one possible design manner of the third aspect, the performing of the scanning process on the polished substrate includes: and (4) adopting a blanket to perform light sweeping treatment on the polished substrate.

In a possible design of the third aspect, the carpet has a hair length of 5mm to 15 mm.

In a possible design manner of the third aspect, the time of the scanning process is 500s to 1000 s.

In a possible design manner of the third aspect, the substrate further includes a second region to be polished, the second region to be polished and the first region to be polished are disposed on two sides of the planar region, and before the scanning processing is performed on the planar region and the first arc surface, the method further includes: step S201: and shielding the plane area of the substrate, and polishing the second area to be polished to form a second cambered surface in the second area to be polished.

In a possible design manner of the third aspect, the machining method includes:

step S200: shielding a plane area of the substrate, and polishing the first area to be polished to form a first cambered surface;

step S201: shielding the plane area of the substrate, and polishing the second area to be polished to form a second cambered surface in the second area to be polished;

In a possible design manner of the third aspect, blocking a planar area of the substrate includes: providing a loading jig according to any one of the above first aspect, wherein the loading jig is used to place a plurality of substrates in the placing groove of the device jig in an inclined manner. In the polishing treatment process, a plurality of substrates are obliquely stacked in the placing groove of the loading jig, the substrate (namely, the second substrate) far away from the first inner side wall in the two adjacent substrates can shield the plane area of the substrate (namely, the first substrate) close to the first inner side wall in the two adjacent substrates, the shielding of the plane area of the substrate is realized, and the first region to be polished can be exposed, so that the polishing treatment of the first region to be polished can be realized, meanwhile, the PV value of the plane area is prevented from being influenced, and the yield of the 2.5D cover plate can be improved.

In a fourth aspect, the present application provides a 2.5D cover plate, wherein the 2.5D cover plate is processed by the processing method of the 2.5D cover plate according to any one of the above technical solutions.

In one possible embodiment of the fourth aspect, the 2.5D cover is a camera cover.

In one possible embodiment of the fourth aspect, the 2.5D cover is a screen cover.

In one possible embodiment of the fourth aspect, the 2.5D cover plate is a 2.5D glass cover plate.

In a fifth aspect, the present application provides an electronic device comprising a 2.5D cover plate.

In a sixth aspect, the application provides a loading jig for placing a substrate to be polished, the substrate includes a planar area and a first region to be polished, the first region to be polished is located on one side of the planar area, the loading jig includes a placing groove and a shielding piece, the placing groove includes a groove bottom wall, and the substrate is obliquely placed in the placing groove;

the shielding piece is arranged on one side of the base plate far away from the bottom wall of the groove, in the depth direction along the placing groove, the projection of the shielding piece on the bottom wall of the groove is a fourth projection, the projection of the plane area of the base plate on the bottom wall of the groove is a fifth projection, the projection of the first area to be polished of the base plate on the bottom wall of the groove is a sixth projection, the fifth projection is positioned in the fourth projection, and the sixth projection is positioned outside the fourth projection.

It can be understood that, for the beneficial effects that can be achieved by the polishing apparatus of the second aspect, the processing method of the 2.5D cover plate of the third aspect, the 2.5D cover plate of the fourth aspect, the electronic device of the fifth aspect, and the loading fixture of the sixth aspect, reference may be made to the beneficial effects of the first aspect and any possible design manner thereof, and details are not repeated here.

Drawings

FIG. 1 is a side view of a 2.5D cover plate;

FIG. 2 is a flow chart of a method for manufacturing a 2.5D cover plate according to the prior art;

FIG. 3 is a perspective view of an original substrate in the processing method of FIG. 2;

FIG. 4 is a perspective view of a first blank resulting from processing the starting substrate shown in FIG. 3;

FIG. 5 is a side view of the first blank shown in FIG. 4;

FIG. 6 is a side view of a second blank member obtained after polishing the first blank member;

FIG. 7 is a schematic view showing a structure of a first polishing apparatus according to the prior art;

FIG. 8 is an enlarged view of the area A of FIG. 7;

FIG. 9 is a graph comparing the PV value of the first planar area of the 2.5D cover sheet processed by the processing method of FIG. 2 to the PV value of the first planar area of the starting substrate;

fig. 10 is a flowchart of a method for processing a 2.5D cover plate according to an embodiment of the present disclosure;

FIG. 11 is a perspective view of a substrate provided by some embodiments of the present application;

FIG. 12 is a side view of the substrate shown in FIG. 11;

fig. 13 is a perspective view of a loading fixture according to some embodiments of the present application;

fig. 14 is a schematic view illustrating a substrate placed in a placing slot of the loading jig shown in fig. 13 according to some embodiments of the present application;

fig. 15 is a schematic positional relationship diagram of a projection of the first substrate on the bottom wall of the placement groove and a projection of the second substrate on the bottom wall of the placement groove in the depth direction of the placement groove;

fig. 16 is a schematic view showing a positional relationship between a projection of the shield on the bottom wall of the placement groove and a projection of the third base plate on the bottom wall of the placement groove in the depth direction of the placement groove;

fig. 17 is an exploded view of the loading jig shown in fig. 13;

fig. 18 is a top view of the loading jig shown in fig. 13;

FIG. 19 is a cross-sectional view taken along line A-A of FIG. 18;

figure 20 is a perspective view of the shield of figure 17;

FIG. 21 is an enlarged view of the area B of FIG. 19;

fig. 22 is another exploded view of the loading jig shown in fig. 13;

fig. 23 is an assembled perspective view of a substrate and a loading jig according to another embodiment of the present application;

FIG. 24 is an exploded view of a polishing apparatus provided in accordance with certain embodiments of the present application;

FIG. 25 is a perspective view of a polishing head of the polishing apparatus shown in FIG. 24;

FIG. 26 is a flow chart of a method of manufacturing a 2.5D cover plate according to other embodiments of the present application;

FIG. 27 is an exploded view of a light sweeping device for sweeping a substrate according to some embodiments of the present application;

FIG. 28 is an exploded view of the carrier plate and the base of the light sweeping device shown in FIG. 27;

FIG. 29 is a graph comparing the PV values of the planar regions of the 2.5D cover sheet and the planar regions of the substrate processed in the processing method of FIG. 26;

FIG. 30 is a flow chart of a method of manufacturing a 2.5D cover plate according to other embodiments of the present application.

Reference numerals:

100. 2.5D cover plate;

10. an original substrate; 11. a first surface; 12. a second surface;

20. a first blank member; 21. a first planar region; 22. a first bevel region; 23. a second bevel area;

30. a second blank member; 31. a first cambered surface region; 32. a second arc surface region;

40. a first polishing device; 41. a first chassis; 42. a first turntable; 43. a first loading jig; 431. positioning a groove; 44. a first polishing material;

50. a substrate; 51. a planar region; 52. a first region to be polished; 53. a second region to be polished; 54. a third surface; 55. a fourth surface; 56. a third region; 50a, a third substrate; 501. a first edge;

60. loading a jig; 60a, a first outer surface; 60b, a second outer surface; 61. a placement groove; 611. a tank bottom wall; 612. a first inner side wall; 612a, a first communication hole; 613. an opening is formed; 614. a second inner side wall; 615. a third inner side wall; 616. a step surface; 616a, a second communication hole; 62. a containing groove; 622. a shield; 6221. an inclined surface; 63. a negative pressure chamber; 64. an opening part; 65. a sealing plate;

s1, first projection; s2, second projection; s3, third projection; s4, fourth projection; s5, fifth projection; s6, sixth projection;

80. an air exhaust pipeline;

90. a polishing device; 91. a chassis; 91a, a first end surface; 91b, a second end face; 911. retaining walls; 912. accommodating a tank; 92. a turntable; 921. a connecting portion; 93. polishing the material;

200. a light sweeping device;

201. a base; 201a, a third end surface; 201b, a fourth end face; 201c, a fixed groove; 201d, a first sawtooth;

202. hanging the plate;

203. a carrier plate; 203a, a second sawtooth; 203b, a positioning groove;

204. a blanket.

Detailed Description

In the embodiments of the present application, the terms "first", "second", "third", and "fourth" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implying any number of technical features indicated. Thus, features defined as "first", "second", "third" and "fourth" may explicitly or implicitly include one or more of the features.

In the embodiments of the present application, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.

In the embodiment of the present application, "and/or" is only one kind of association relationship describing an association object, and indicates that three relationships may exist, for example, a and/or B may indicate: a exists alone, A and B exist simultaneously, and B exists alone. In addition, the character "/" herein generally indicates that the former and latter related objects are in an "or" relationship.

With the increasing requirements of users on the appearance of electronic devices (mobile phones, tablet computers, and the like), camera covers (such as rear camera covers), screen covers, and the like of the electronic devices generally adopt 2.5D covers. Illustratively, the 2.5D cover plate is made of glass, acrylic, or the like. In the following examples, the 2.5D cover plate is a 2.5D glass cover plate, but this is not to be construed as limiting the present application.

Referring to fig. 1, fig. 1 is a side view of a 2.5D cover plate 100. The 2.5D cover plate 100 is formed by performing a curvature process on the edges of the flat glass, such that the middle of the 2.5D cover plate 100 is a flat surface and the edges are curved surfaces. That is, the edges of the 2.5D cover plate 100 transition to the center through a convex arc. Therefore, the center of the 2.5D cover plate protrudes out of the edge, so that the visual effects of the camera cover plate, the screen cover plate and the like are better, and the touch experience of a user can be improved.

Some parameters of the camera cover plate have great influence on camera imaging, especially, a PV value (difference value between a peak and a trough of the mirror surface) has a key influence on the imaging of the mirror surface, the larger the PV value is, the more uneven the mirror surface is, the worse the imaging resolving power of the camera is, and user experience is influenced.

However, in the prior art, during the processing of the 2.5D cover plate 100, the PV value of the planar portion of the 2.5D cover plate 100 is greatly affected, and specifically, the defect rate is high.

Referring to fig. 2, fig. 2 is a flowchart illustrating a method for manufacturing a 2.5D cover plate 100 according to the prior art. The 2.5D cover 100 may be a rear camera cover of an electronic device. Specifically, the processing method of the 2.5D cover plate 100 includes:

step S10: a raw substrate 10 is provided, and a first blank member 20 is obtained by subjecting the raw substrate 10 to a numerical control (CNC) machining process.

Referring to fig. 3, fig. 3 is a perspective view of an original substrate 10. The original substrate 10 is in the form of a flat plate. The original substrate 10 may be formed in an oval shape, a racetrack shape, a rectangular shape, a circular shape, etc. The original substrate 10 includes a first surface 11 and a second surface 12 opposite to the first surface. In step S10, both side edges of the first surface 11 of the original substrate 10 may be ground by a CNC processing process. Specifically, the tool of the CNC machining process is a conical grinding rod.

Referring to fig. 4-5, fig. 4 is a perspective view of a first blank member 20 obtained by processing the original substrate 10 shown in fig. 3, and fig. 5 is a side view of the first blank member 20 shown in fig. 4. First blank 20 includes a first planar area 21 and first 22 and second 23 beveled areas on either side of first planar area 21. In the direction from the first surface 11 to the second surface 12, the first slope region 22 extends obliquely toward a direction away from the first plane region 21, and the second slope region 23 extends obliquely toward a direction away from the first plane region 21.

In other embodiments, first blank 20 may also include only first planar area 21 and either first beveled area 22 or second beveled area 23 on one side of first planar area 21. In other embodiments, the first and second

sloped regions

22 and 23 may also be formed as convex curved surfaces.

Step S20: the first blank member 20 is subjected to polishing treatment to obtain a second blank member 30. Specifically, the first blank member 20 may be subjected to a polishing process on the first polishing apparatus 40. The purpose of this process is to polish the first sloped region 22 and the second sloped region 23, so that the first sloped region 22 is formed as a smooth first arc surface region 31 and the second sloped region 23 is formed as a smooth second arc surface region 32. Referring to fig. 6, fig. 6 is a side view of a second blank 30 obtained by polishing the first blank 20. The second blank 30 includes a first planar area 21 and first and second

cambered areas

31 and 32 located on either side of the first planar area 21.

Referring to fig. 7-8, fig. 7 is a schematic structural view of a first polishing apparatus 40 in the prior art, and fig. 8 is an enlarged view of a region a in fig. 7. The first polishing device 40 includes a first chassis 41 and a first rotating disk 42, which are oppositely disposed, the first chassis 41 is provided with a first loading fixture 43, and the first loading fixture 43 is provided with a positioning groove 431 for placing the first blank 20. The shape of the positioning slot 431 is adapted to the shape of the first blank member 20. The first rotary disk 42 is rotatably provided on one side of the first base disk 41 about an axis O1 perpendicular to the first blank member 20, and a first polishing material 44 is provided on a surface of the first rotary disk 42 facing the first base disk 41. The first polishing material 44 is a white buff added with a polishing liquid, and the polishing liquid is cerium oxide.

Specifically, when the first blank 20 is polished, the first flat area 21, the first inclined area 22, and the second inclined area 23 face the first turntable 42. During the polishing process, the first rotary disk 42 may be controlled to move toward the direction close to the first bottom disk 41, so that the first polishing material 44 contacts the first planar area 21, the first bevel area 22 and the second bevel area 23, and then the first rotary disk 42 may be controlled to rotate around the axis O1 to polish the first planar area 21, the first bevel area 22 and the second bevel area 23. The time of polishing treatment is 700s, and the yarn feeding amount is 0.01 mm-0.02 mm.

In this step, the first polishing material 44 polishes all of the first sloped region 22, the second sloped region 23, and the first flat region 21, and thus the PV value of the first flat region 21 is greatly affected, and the PV value is increased to 1.3 to 2.0. In the electronic device, the imaging standard of the camera requires that the PV value should be less than or equal to 0.8, and therefore, after the polishing process, the PV value of the first plane area 21 exceeds the imaging standard of the camera.

To reduce the PV value of the first planar area 21, please return to fig. 2, in step S20: after the first blank 20 is polished to obtain the second blank 30, the method for processing the 2.5D cover plate 100 further includes:

step S30: and performing flat grinding treatment on the second blank member 30 to obtain a third blank member. Specifically, the second blank member 30 is subjected to flat grinding treatment by using a red grinding leather (foamed material), wherein the flat grinding treatment time is 1500s, and the filament feeding amount is 0.01 mm-0.02 mm. The primary purpose of this process is to optimize the PV value of the first planar area 21 of the second blank 30. After the flat grinding process, the PV value of the majority of the third blank first planar areas 21 can be reduced to less than or equal to 0.5, but a portion of the third blank still has a PV value greater than 0.8. In addition, since the flat grinding process can only process the first plane area 21 of the second blank 30, the first arc area 31 and the second arc area 32 cannot be processed, and in the process of the flat grinding process, dust generated by the first plane area 21 falls to the first arc area 31 and the second arc area 32, which may cause the first arc area 31 and the second arc area 32 to be scratched by the dust.

On the basis, in order to repair the scratch of the first arc surface region 31 and the second arc surface region 32, please continue to refer to the processing method of the cover plate 100 of fig. 2, 2.5D, in step S30: after the flat grinding process is performed on the second blank 30 to obtain a third blank, the method further includes:

step S40: and (5) performing sweeping processing on the third blank by using a blanket to obtain the 2.5D cover plate 100. The time for the scanning process was 900 s. The main purpose of this process is to solve the problem that the scratch caused by the flat grinding process on the first arc surface region 31 and the second arc surface region 32 has little influence on the PV value of the first plane region 21.

Referring to fig. 9, fig. 9 is a graph comparing the PV value of the first planar area 21 of the 2.5D cover plate 100 processed by the processing method shown in fig. 2 with the PV value of the first planar area 21 of the original substrate 10. In FIG. 9, the abscissa represents the sample number and the ordinate represents the PV value. The solid black dots represent the PV values of the first planar area 21 of the original substrate 10, and the open black dots represent the PV values of the first planar area 21 of the 2.5D cover sheet 100. As can be seen from fig. 9, the PV value of the first planar region 21 of the 2.5D decking 100 formed by the above-described process is 0.9156 at most, 0.0478 at minimum and greater than 0.8 at maximum. Statistically, the average value of the PV values of the first planar area 21 of the 2.5D cover plate 100 processed by the above processing method is 0.312, and the average value of the PV values of the first planar area 21 of the original substrate 10 is 0.079. In actual production, the probability that the PV value of the first planar area 21 of the 2.5D cover plate 100 exceeds the standard value of 0.8 is about 5%.

The processing method of the 2.5D cover plate 100 has the following disadvantages: (1) the processing procedure is long, the procedures are multiple, the feeding and discharging times are multiple, and the appearance reject ratio is high; (2) in the processing process, the lower silk amount is large, and the risk of out-of-tolerance exists; (3) the PV value of the first plane area 21 is unstable, and the probability of exceeding the standard value of 0.8 in actual production is about 5%, so that the goods need to be inspected completely, and the labor cost is high.

In order to solve the above technical problems, simplify the processing method of the 2.5D cover plate 100, reduce the PV value of the planar area of the 2.5D cover plate 100, and improve the yield of the 2.5D cover plate 100, please refer to fig. 10, which is a flowchart of the processing method of the 2.5D cover plate 100 according to the embodiment of the present application.

Specifically, the processing method of the 2.5D cover plate 100 includes:

step S100: a substrate 50 is provided, the substrate 50 including a planar area 51 and a first region to be polished 52 located at one side of the planar area 51.

Referring to fig. 11-12, fig. 11 is a perspective view of a substrate 50 according to some embodiments of the present disclosure, and fig. 12 is a side view of the substrate 50 shown in fig. 11. The substrate 50 is generally racetrack shaped, but is not limited thereto. In other embodiments, the substrate 50 may be formed in a rectangular shape. The substrate 50 includes a third surface 54 and a fourth surface 55 opposite to each other. A planar region 51 and a first region to be polished 52 are formed on a third surface 54. The planar region 51 is located in the middle of the third surface 54. In some embodiments, the entire outer edge of the planar region 51 is spaced apart from the outer edge of the third surface 54. In other embodiments, a portion of the outer edge of the planar region 51 is spaced from the outer edge of the third surface 54 and another portion of the edge of the planar region 51 extends to the outer edge of the third surface 54. Illustratively, the shaded area shown in fig. 11 may be a planar area 51 in this embodiment. In other embodiments, the planar area 51 may be an area of the third surface 54 other than the area to be polished.

It is understood that the planar area 51 may include the entire area of the third surface 54 formed as a plane, or may include only a partial area of the third surface 54 formed as a plane.

In some embodiments, the first region to be polished 52 is formed as a bevel. Specifically, referring to fig. 11, the first region to be polished 52 extends obliquely in a direction from the third surface 54 to the fourth surface 55, and away from the planar region 51.

Illustratively, the first polishing area may be formed by grinding with a CNC machining process. The cutter in the CNC machining process is a conical grinding rod. Simple process and convenient processing. In other embodiments, the first region to be polished 52 may also be formed as a convex arc surface.

In some embodiments, referring to fig. 11, the substrate 50 further includes a second region to be polished 53, and the second region to be polished 53 is disposed on two sides of the planar region 51 opposite to the first region to be polished 52. The other area of the third surface 54 except for the first area to be polished 52, the second area to be polished 53, and the planar area 51 may be a third area 56. The third region 56 may be formed as a flat surface or a curved surface.

It is understood that in other embodiments, the planar area 51 may include the entire area between the first area to be polished 52 and the second area to be polished 53.

The structure and processing method of the second region to be polished 53 are the same as those of the first region to be polished 52, and will not be described again.

With continued reference to fig. 10, the method for processing the 2.5D cover plate 100 further includes: step S200: a planar area 51 of the substrate 50 is masked, and a first region to be polished 52 is subjected to polishing treatment. Thus, during the polishing process of the first region to be polished 52, the flat region 51 of the substrate 50 can be prevented from contacting the polishing material, and the influence of the polishing process on the PV value of the flat region 51 can be effectively avoided.

In some embodiments, masking the planar area 51 of the substrate 50 comprises: a loading jig 60 is provided, and a plurality of substrates 50 are obliquely stacked in a placing groove 61 of the loading jig 60. Referring to fig. 13, fig. 13 is a perspective view of a loading fixture 60 according to some embodiments of the present application. The loading jig 60 has a substantially rectangular parallelepiped shape. For convenience of the following description of the embodiments, an XYZ coordinate system is established for the loading jig 60. Specifically, the extending direction of the loading jig 60 in the longitudinal direction is defined as the X-axis direction, the extending direction of the loading jig 60 in the width direction is defined as the Y-axis direction, and the extending direction of the loading jig 60 in the height direction is defined as the Z-axis direction. It is understood that the coordinate system of the loading fixture 60 can be flexibly configured according to actual needs, and is not limited in detail herein.

The loading fixture 60 has a first outer surface 60a and a second outer surface 60b opposite to each other in the height direction. The loading jig 60 includes a placement groove 61. The placing groove 61 is formed on the first outer surface 60a of the loading jig 60, and specifically, the placing groove 61 is formed by a portion of the first outer surface 60a being recessed toward the second outer surface 60 b. The placement groove 61 includes a groove bottom wall 611 and a first inner side wall 612, and the first inner side wall 612 is connected to one end of the groove bottom wall 611. The groove bottom wall 611 is formed in an elongated shape. The longitudinal direction of the groove bottom wall 611 is parallel to the X-axis direction, and the width direction of the groove bottom wall 611 is parallel to the Y-axis direction. Specifically, the first inner sidewall 612 is connected to one end of the groove bottom wall 611 in the longitudinal direction. The placement groove 61 has an open mouth 613, and the open mouth 613 is disposed opposite to the groove bottom wall 611.

Referring to fig. 14, fig. 14 is a schematic view illustrating a substrate 50 disposed in a disposing slot 61 of a loading fixture 60 shown in fig. 13 according to some embodiments of the present disclosure. When the substrate 50 is placed in the placement groove 61, the substrate 50 is inclined toward the first inner side wall 612 in a direction from the groove bottom wall 611 to the opening 613, and the first region to be polished 52 is located at an end of the substrate 50 away from the groove bottom wall 611. In this way, the first region to be polished 52 is exposed, thereby facilitating the polishing process for the first region to be polished 52.

It is understood that one or more substrates 50 may be placed in the placement groove 61 obliquely. The term "plurality" in the present application means two or more. Referring to fig. 14, when a plurality of substrates 50 are placed in the placing groove 61, the plurality of substrates 50 may be stacked in the placing groove 61 in an inclined manner. The substrate 50 near the first inner sidewall 612 of the two adjacent substrates 50 is defined as a first substrate, and the substrate 50 far from the first inner sidewall 612 of the two adjacent substrates 50 is defined as a second substrate.

Referring to fig. 15, fig. 15 is a schematic positional relationship between a projection of the first substrate on the groove bottom wall 611 of the placement groove 61 and a projection of the second substrate on the groove bottom wall 611 of the placement groove 61 in the depth direction of the placement groove 61. In the depth direction along the placement groove 61, the projection of the planar region 51 of the first substrate on the groove bottom wall 611 is a first projection S1, the projection of the first region to be polished 52 of the first substrate on the groove bottom wall 611 is a second projection S2, the projection of the second substrate on the groove bottom wall 611 is a third projection S3, the first projection S1 is located inside the third projection S3, and the second projection S2 is located outside the third projection S3. That is, the first projection S2 is covered by the third projection S3, and the second projection S2 is not covered by the third projection S3. In this way, the planar area 51 of the first substrate can be blocked by the second substrate.

Specifically, an edge of the third projection S3 near the first inner sidewall 612 may be collinear with an edge of the first projection S1 near the first inner sidewall 612. In this way, the second substrate can be used to shield the planar area 51 of the first substrate, so that the planar area 51 of the first substrate can be shielded without adding additional components. Meanwhile, the first region to be polished 52 of the first substrate can be exposed, facilitating the polishing process for the first region to be polished 52. Simple structure and ingenious design.

Note that "the depth direction of the placement groove 61" described in the present application refers to a direction between the opening 613 of the placement groove 61 and the groove bottom wall 611, that is, a Z-axis direction shown in fig. 13.

On this basis, in order to block the planar region 51 of one of the plurality of substrates 50 farthest from the first inner sidewall 612, please refer to fig. 14, the one of the plurality of substrates 50 farthest from the first inner sidewall 612 is defined as a third substrate 50a, and the loading fixture 60 further includes a blocking member 622. Referring to fig. 16, fig. 16 is a schematic positional relationship diagram of a projection of the shielding member 622 on the groove bottom wall 611 of the placing groove 61 and a projection of the third substrate 50a on the groove bottom wall 611 of the placing groove 61 in the depth direction of the placing groove 61. In the depth direction of the placement groove 61, the projection of the shutter 622 on the groove bottom wall 611 is a fourth projection S4, the projection of the planar region 51 of the third substrate 50a on the groove bottom wall 611 is a fifth projection S5, the projection of the first region to be polished 52 of the third substrate 50a on the groove bottom wall 611 is a sixth projection S6, the fifth projection S5 is located inside the fourth projection S4, and the sixth projection S6 is located outside the fourth projection S4. That is, the fifth projection S5 is covered by the fourth projection S4, and the sixth projection S6 is not covered by the fourth projection S4.

Specifically, an edge of the fourth projection S4 near the first inner sidewall 612 may be collinear with an edge of the fifth projection S5 near the first inner sidewall 612. In this way, the plane area 51 of the third substrate 50a can be shielded by the shield 622, and the first region to be polished 52 of the third substrate 50a can be exposed, facilitating the polishing process for the first region to be polished 52.

In some embodiments, referring back to fig. 14, a side edge of the third substrate 50a close to the slot bottom wall 611 is the first edge 501, and a side surface of the shielding member 622 facing away from the slot bottom wall 611 in the depth direction of the placing slot 61 is not higher than the first edge 501. Like this, in the polishing process, can avoid shielding piece 622 to cause the interference to the polishing material, be favorable to improving polishing effect and polishing efficiency.

In some embodiments, referring to fig. 17, fig. 17 is an exploded view of the loading jig 60 shown in fig. 12. The first outer surface 60a is further provided with a receiving groove 62, and the receiving groove 62 is communicated with the placing groove 61. The receiving groove 62 is recessed from the first outer surface 60a toward the second outer surface 60 b. The shutter 622 may be disposed in the receiving groove 62. For example, the shielding member 622 may be fixed in the receiving groove 62 by screws.

Referring to fig. 17, in some embodiments, the shielding member 622 has a rectangular plate shape, and the length direction of the shielding member 622 is parallel to the Y-axis direction. The width direction of the shield 622 is parallel to the X-axis direction, and the thickness direction of the shield 622 is parallel to the Z-axis direction. Both ends of the shielding member 622 in the length direction may be fixedly coupled in the receiving groove 62 by screws. In this way, the shielding member 622 can be firmly fixed to the loading jig 60, and the shielding member 622 can be easily attached and detached, so that the shielding member 622 can be easily replaced when the shielding member 622 is damaged due to abrasion or the like. In addition, the shielding member 622 is assembled in the accommodating groove 62, so that the shielding member 622 can be prevented from occupying the accommodating space in the accommodating groove 61, thereby facilitating the increase of the number of the substrates 50 in the accommodating groove 61 and the improvement of the polishing efficiency.

Referring to fig. 17, in the depth direction of the placing groove 61, the depth of the receiving groove 62 is h, the maximum thickness of the shielding element 622 is t, and the maximum thickness t of the shielding element 622 is smaller than or equal to the depth h of the receiving groove 62. In this way, it is possible to prevent the side surface of the shielding member 622 away from the groove bottom wall 611 from being higher than the first edge 501, and it is possible to prevent the shielding member 622 from occupying the placing space in the placing groove 61, thereby facilitating the increase in the number of the substrates 50 in the placing groove 61 and the improvement in the polishing efficiency.

Referring to fig. 18 to 21, fig. 18 is a top view of the loading jig shown in fig. 13, fig. 19 is a cross-sectional view taken along a-a line in fig. 18, fig. 20 is a perspective view of the shielding member 622 shown in fig. 17, and fig. 21 is an enlarged view of a portion B in fig. 19. A side surface of the shutter 622 facing the third substrate 50a includes an inclined surface 6221, and the inclined surface 6221 extends from an end of the shutter 622 near the first inner side wall 612 toward a direction near the groove bottom wall 611. Thus, the shield 622 can be prevented from interfering with the third substrate 50a while the shield 622 is prevented from interfering with the polishing material.

Optionally, the shield 622 is acrylic. That is, the shielding member 622 is made of acrylic material. The acrylic material has good wear resistance and low cost, and can prolong the service life of the shielding piece 622 and reduce the cost. Of course, the present application is not limited thereto, and the shielding member 622 may also be a metal member (e.g., a stainless steel member, an aluminum alloy member), a glass member, or the like.

It is understood that, in some other embodiments, the shielding member 622 may be obliquely disposed in the placing groove 61, as long as the shielding member 622 can shield the planar area 51 of the substrate 50 farthest from the first inner sidewall 612 among the plurality of substrates 50.

On this basis, in order to improve the position stability of the substrate 50, referring to fig. 17-19, the first inner sidewall 612 includes a slope surface, and the substrate 50 can be attached to the slope surface. Specifically, in the direction from the groove bottom wall 611 to the opening 613, the slope surface extends obliquely toward a direction away from the groove bottom wall 611. In some embodiments, one end of the sloped surface is connected to the bottom wall 611, and the other end of the sloped surface extends to be flush with the opening 613 of the placement groove 61. That is, the entire inner surface of the first inner sidewall 612 is formed as a sloped surface. It is understood that in other embodiments, a portion of the first inner sidewall 612 may form a sloped surface.

Referring to fig. 17-19, the placement groove 61 further includes a second inner sidewall 614 and a third inner sidewall 615 opposite to each other in the width direction of the groove bottom wall 611. The second inner sidewall 614 and the third inner sidewall 615 may limit the substrate 50 in the width direction of the groove bottom wall 611, so as to prevent the substrate 50 from flying out of the placing groove 61 during the polishing process.

In some embodiments, the slope of the sloped surface is equal to the angle between the tangent to the first arc surface and the planar area 51. Illustratively, the slope of the sloped surface is 10 °. Thus, when the substrate 50 is placed in the placing groove 61, the first region to be polished 52 faces the polishing material, the polishing material can polish the first region to be polished 52 conveniently, the radian of the first cambered surface can be controlled conveniently, and the yield of the 2.5D cover plate 100 is improved.

On the basis of the above embodiment, please continue to refer to fig. 17-fig. 19, in order to facilitate positioning of the substrate 50, a step surface 616 is disposed on the groove bottom wall 611, and the step surface 616 is parallel to the slope surface. One end of the substrate 50 away from the first region to be polished 52 can be attached to the step surface 616, so that the tilt angle of the substrate 50 can be controlled conveniently, and the substrate 50 can be limited by the step surface 616, thereby preventing the substrate 50 from sliding in a direction away from the first inner sidewall 612, and facilitating the improvement of the position stability of the substrate 50.

Specifically, the step surface 616 may be plural, so that the number of the holding substrates 50 in the placing groove 61 can be increased, and the efficiency of the polishing process can be improved. Referring to fig. 19, ends of the step surfaces 616 away from the open port 613 are located on the same plane, and ends of the step surfaces 616 close to the open port 613 are also located on the same plane.

On the basis, in order to further improve the position stability of the substrate 50 and prevent the substrate 50 from shifting during the polishing process, please refer to fig. 19, a negative pressure chamber 63 is formed in the loading fixture 60. Referring to fig. 17 to 19, a first communicating hole 612a communicating with the negative pressure chamber 63 is formed on the slope surface, and a second communicating hole 616a communicating with the negative pressure chamber 63 is formed on the step surface 616. In this way, after the substrate 50 is placed in the placing groove 61, the negative pressure chamber 63 can be vacuumized, and the substrate 50 can be adsorbed on the slope surface and the step surface 616 by the negative pressure.

Specifically, an air exhaust pipeline 80 is arranged on the device jig, one end of the air exhaust pipeline 80 is communicated with the negative pressure cavity 63, and the other end of the air exhaust pipeline 80 is communicated with a vacuum pumping device (not shown).

In some embodiments, the sub-ambient pressure cavity 63 may be CNC molded on the loading fixture 60. Referring to fig. 22, fig. 22 is an exploded view of the loading jig 60 shown in fig. 13. During the machining process, an opening 64 may be formed in the sidewall of the loading fixture 60, and the negative pressure cavity 63 may be milled in the loading fixture 60 by a CNC machining process. In addition, in order to improve the sealing performance of the negative pressure chamber 63, a sealing plate 65 is provided at the opening 64, and the sealing plate 65 is hermetically connected to the side wall of the loading jig 60 to ensure the sealing performance of the negative pressure chamber 63. Illustratively, the sealing plate 65 is hermetically connected to the side wall of the loading jig 60 by screws. Thus, after the polishing process for the first region to be polished 52 is completed, the sealing plate 65 can be detached to release the air pressure in the negative pressure chamber 63, thereby facilitating the removal of the substrate 50 from the placing groove 61.

In some embodiments, the loading fixture 60 is made of bakelite, also called phenolic plastic.

In other embodiments, referring to fig. 23, fig. 23 is an assembled perspective view of a substrate 50 and a loading fixture 60 according to other embodiments of the present application. The loading jig 60 of the present embodiment is different from the loading jig 60 shown in fig. 14 in that the loading jig 60 of the present embodiment has only one placing position in the placing groove 61, that is, a substrate 50 can be placed in the placing groove 61, the substrate 50 abuts on the slope surface, and the shielding member 622 shields the planar area 51 of the substrate 50. The substrate 50 in this embodiment can be used as the third substrate 50a in the loading jig 60 shown in fig. 13.

In the embodiment of the application, by providing the loading jig 60, in the polishing process, the substrate 50 can be shielded only by placing the substrate 50 in the placing groove 61 of the loading jig 60, and the first region to be polished 52 can be exposed, so that the first region to be polished 52 can be polished, the PV value of the plane region 51 can be prevented from being affected, and the yield of the 2.5D cover plate 100 can be improved.

In some embodiments, referring to fig. 24, fig. 24 is an exploded view of a polishing apparatus 90 according to some embodiments of the present disclosure. The polishing apparatus 90 includes a base plate 91, a turntable 92 and the loading fixture 60. When the 2.5D cover plate 100 is processed, the first region to be polished 52 may be polished on the polishing apparatus 90.

Specifically, referring to fig. 25, fig. 25 is a perspective view of a bottom plate 91 of the polishing apparatus 90 shown in fig. 24. The bottom plate 91 has a cylindrical structure, and the bottom plate 91 has a first end surface 91a and a second end surface 91b opposite to each other in the axial direction. In some embodiments, an annular retaining wall 911 is disposed on the outer periphery of the first end surface 91a, a receiving groove 912 is defined between the retaining wall 911 and the first end surface 91a, and the loading jig 60 is mounted in the receiving groove 912. Illustratively, the loading fixture 60 is fixedly connected to the first end surface 91a by means of bonding, clipping, screwing, or the like. Like this, among the polishing treatment process, polishing dust can fall in holding tank 912, can avoid the dust to splash to the burnishing device 90 outside.

Optionally, the retaining wall 911 and the bottom plate 91 are of an integral structure. That is, the retaining wall 911 is integrally formed with the bottom plate 91. Thus, the processing process of the polishing apparatus 90 can be simplified, and the processing efficiency can be improved. It is understood that in other embodiments, the retaining wall 911 and the bottom plate 91 may be a split structure. Illustratively, the retaining wall 911 may be fixed to the base 91 by bonding, snapping, welding, screwing, or the like.

Referring to fig. 24, there are a plurality of loading jigs 60, and the loading jigs 60 may be disposed at intervals in the circumferential direction of the chassis 91. Specifically, the longitudinal direction of the loading jig 60 is perpendicular to the radial direction of the base plate 91. Thus, when the substrate 50 is placed on the loading jig 60 and the polishing process is performed on the substrate 50 by the polishing medium 93, the polishing medium 93 can sweep from one end in the width direction of the first region to be polished 52 to the other end in the width direction of the first region to be polished 53, which is advantageous for improving the polishing quality.

Referring to fig. 24, the turntable 92 is rotatably disposed on one side of the chassis 91 about its own axis O, and the turntable 92 is opposite to the first end surface 91a of the chassis 91. Illustratively, referring to fig. 24, the turntable 92 is disposed above the chassis 91. In other embodiments, the turntable 92 may also be disposed below the chassis 91. The turntable 92 has a cylindrical structure, and the outer diameter of the turntable 92 is equal to the outer diameter of the base plate 91. The surface of the turntable 92 facing the base plate 91 is provided with a polishing material 93. A connecting portion 921 for connecting a driving device is provided on a side surface of the turntable 92 facing away from the chassis 91. The drive means may drive the turntable 92 to rotate about its own axis, and the drive means may drive the turntable 92 to move toward and away from the chassis 91. It will be appreciated that the turntable 92 can be driven by the same drive means to rotate about its own axis and move towards and away from the chassis 91, or by different drive means to rotate about its own axis and move towards and away from the chassis 91, respectively.

In some embodiments, the polishing material 93 is a white buff with a polishing liquid, and the polishing liquid is cerium oxide. When the substrate 50 is polished, the substrate 50 is fixed on the base plate 91 and the planar area 51 of the substrate 50 is blocked, the turntable 92 is controlled to move toward the base plate 91 so that the polishing material 93 contacts the first area to be polished 52, and then the turntable 92 is controlled to rotate around its own central axis to polish the first area to be polished 52. The polishing time is 700s, the filament feeding amount is 0.01 mm-0.02 mm, and the rotating speed of the rotating disc 92 is 90 r/min-110 r/min.

After the polishing process for the first region to be polished 52 of the substrate 50 is completed, the first region to be polished 52 forms a smooth first curved surface. However, since the flat area 51 is blocked during the polishing process, a boundary mark may be generated between the first arc surface and the flat area 51. In order to eliminate the boundary mark between the first arc surface and the planar area 51, so that the transition between the planar area 51 and the first arc surface is more natural, and the appearance of the 2.5D cover plate 100 is more attractive, in some embodiments, please refer to fig. 26, and fig. 26 is a flowchart of a processing method of the 2.5D cover plate 100 according to another embodiment of the present application. In the processing method of this embodiment, after the polishing process for the first region to be polished 52 is completed, the method further includes:

step S300: the polished substrate 50 is subjected to a sweep process to eliminate a boundary mark between the first arc surface and the flat area 51.

Specifically, the carpet 204 may be used to perform a polishing process on the polished substrate 50. Referring to fig. 27, fig. 27 is an exploded view of a light scanning device 200 for scanning a substrate 50 according to some embodiments of the present disclosure. The light sweeping device 200 includes a base 201, an upper plate 202, and a carrier plate 203 for placing the substrate 50.

Referring to fig. 28, fig. 28 is an exploded view of the carrier plate 203 and the base 201 of the light sweeping device 200 shown in fig. 27. The base 201 has a cylindrical structure, and the base 201 has a third end surface 201a and a fourth end surface 201b opposite to each other in the axial direction. The third end surface 201a is provided with a fixing groove 201c, and the edge of the fixing groove 201c is provided with a first sawtooth 201 d. The carrier plate 203 has a substantially circular plate structure, the carrier plate 203 is fixed in the fixing groove 201c, and the outer edge of the carrier plate 203 is provided with second serrations 203a, and the second serrations 203a are engaged with the first serrations 201 d. The number of the loading plates 203 may be one or more, and the number of the loading plates 203 is the same as that of the fixing grooves 201 c. Illustratively, the carrier plate 203 is four in number.

Referring to FIG. 28, the carrier 203 has a positioning groove 203b, the substrate 50 is placed in the positioning groove 203b, and the planar area 51 and the first arc surface of the substrate 50 face the upper plate 202. The number of the positioning grooves 203b is plural, and the plural positioning grooves 203b may be arranged in an array. Thus, the arrangement of the positioning grooves 203b on the carrier plate 203 can be more compact, so that more positioning grooves 203b can be arranged in the limited area of the carrier plate 203, the number of the substrates 50 on the carrier plate 203 can be increased, and the light sweeping efficiency is improved.

The material of the carrier plate 203 is an epoxy plate, and the thickness can be 0.6 mm. Thus, the wear resistance of the carrier plate 203 can be improved, and the service life of the carrier plate 203 can be prolonged.

The upper plate 202 is rotatably provided on one side of the base 201 about its own axis, and the upper plate 202 is opposed to the third end face 201a of the base 201. The upper plate 202 is in a cylindrical structure, and the outer diameter of the upper plate 202 is equal to that of the base 201. The upper plate 202 is provided with a felt 204 on a side surface facing the base 201. Wherein, the polishing solution is provided on the felt 204. In some embodiments, the felt 204 has a hair length of 10mm to 15 mm. Illustratively, the felt 204 may have a hair length of 10mm, 11mm, 12mm, 13mm, 14mm, 15mm, and so forth. The felt 204 may be a polypropylene felt, which is inexpensive, wear resistant and corrosion resistant.

When the polishing treatment is performed on the substrate 50, the polished substrate 50 is placed in the positioning groove 203b on the carrier plate 203, the carrier plate 203 is fixed on the base 201, then the upper disc 202 is controlled to move toward the base 201, so that the planar area 51 of the felt 204 and the first arc surface are contacted, and then the upper disc 202 is controlled to rotate around its own central axis, so as to perform the polishing treatment on the side surface of the substrate 50 facing the felt 204. The time of the scanning treatment is 500 s-1000 s. Illustratively, the time of the scanning process is 500s, 600s, 700s, 800s, 900s, 1000s, and so on. Since the carpet 204 is used to perform the light scanning process on the polished substrate 50, the PV value of the planar area 51 is not greatly affected, and thus the PV value of the planar area 51 is not greatly changed after the light scanning process.

Referring to fig. 29, fig. 29 is a graph comparing the PV value of the flat area 51 of the 2.5D cover plate 100 processed by the processing method shown in fig. 26 with the PV value of the flat area 51 of the substrate 50. In FIG. 29, the abscissa represents the sample number and the ordinate represents the PV value. Solid black dots indicate the PV values of the planar region 51 of the substrate 50 and open black dots indicate the PV values of the planar region 51 of the 2.5D cover sheet 100. As can be seen from fig. 29, the PV value of the planar region 51 of the 2.5D cover plate 100 processed by the above processing method is 0.286 at the maximum, 0.056 at the minimum, and much less than 0.8 at the maximum. Meanwhile, through statistics, the average value of the PV values of the planar area 51 of the 2.5D cover plate 100 is 0.122, the average value of the PV values of the planar area 51 of the processed front cover plate is 0.038, the difference between the PV values and the PV values is 0.045, and the variation is not large and is much smaller than 0.8. From this, it is understood that the yield of the PV value of the 2.5D cover sheet 100 processed by the above processing method is 100%.

In summary, in the processing method of the 2.5D substrate 50 provided in the embodiment of the present application, only the region to be polished is polished during the polishing process, so that the PV value of the planar region 51 can be prevented from being affected, and on one hand, the process of performing flat grinding on the planar region 51 to repair the PV value of the planar region 51 in the related art can be omitted, so that the processing method is simplified, the feeding and discharging times are reduced, the probability of scratching the substrate 50 during the feeding and discharging process can be reduced, and the yield can be improved; on the other hand, the qualification rate of the PV value of the plane area 51 can reach 100%, and full inspection is not needed before delivery, so that the labor cost is saved.

In other embodiments, referring to fig. 30, fig. 30 is a flow chart of a method of processing a 2.5D cover plate 100 according to other embodiments of the present disclosure. The processing method in the present embodiment is different from the processing method shown in fig. 26 in that, in the present embodiment, in completion of step S200: the method for masking the planar area 51 of the substrate 50 and polishing the first region to be polished 52, further comprises: step S201: the plane area 51 of the substrate 50 is blocked, and the second area to be polished 53 is subjected to polishing treatment.

Specifically, after the polishing process for the first region to be polished 52 is completed, the substrate 50 is taken out from the loading fixture 60 and rotated by a certain angle, so that the second region to be polished 53 of the substrate 50 faces upward and is exposed, and the planar region 51 is shielded to perform the polishing process for the second region to be polished 53, so that the second region to be polished 53 forms a smooth second arc surface.

It is understood that the positions of step S200 and step S201 can be interchanged in the actual processing process. That is, in the processing, the planar area 51 may be shielded first, and after the polishing process is performed on the second region to be polished 53, the planar area 51 may be shielded, and the polishing process may be performed on the first region to be polished 52.

Since the flat area 51 is blocked during the polishing process, a boundary mark may be generated between the second arc surface and the flat area 51. When the substrate 50 after the polishing process is polished in step S300, the boundary mark between the first arc surface and the flat area 51 and the boundary mark between the second arc surface and the flat area 51 can be eliminated together. The process is simple and the processing efficiency is high.

In the description herein, particular features, structures, materials, or characteristics may be combined in any suitable manner in any one or more embodiments or examples.

Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present application, and not to limit the same; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions in the embodiments of the present application.

Claims

1. A loading jig is used for placing a substrate to be polished, and is characterized in that the substrate comprises a plane area and a first region to be polished, the first region to be polished is positioned on one side of the plane area, the loading jig comprises a placing groove, the placing groove comprises a groove bottom wall and a first inner side wall, the groove bottom wall is arranged opposite to an opening of the placing groove, the first inner side wall is connected to one end of the groove bottom wall, when a plurality of substrates are placed in the placing groove, the substrates are obliquely stacked in the placing groove, wherein the substrates are inclined towards the first inner side wall in the direction from the groove bottom wall to the opening, and the first region to be polished is positioned at one end of the substrate, which is far away from the groove bottom wall;

defining the substrate close to the first inner side wall in two adjacent substrates as a first substrate, defining the substrate far away from the first inner side wall in the two adjacent substrates as a second substrate, wherein in the depth direction of the placing groove, a projection of the planar area of the first substrate on the groove bottom wall is a first projection, a projection of the first region to be polished of the first substrate on the groove bottom wall is a second projection, a projection of the second substrate on the groove bottom wall is a third projection, the first projection is located in the third projection, and the second projection is located outside the third projection.

2. The loading fixture of claim 1, wherein a substrate farthest from the first inner side wall among the plurality of substrates is defined as a third substrate, the loading fixture further comprises a shielding member, a projection of the shielding member on the bottom wall of the groove in a depth direction of the placement groove is a fourth projection, a projection of the planar area of the third substrate on the bottom wall of the groove is a fifth projection, a projection of the first region to be polished of the third substrate on the bottom wall of the groove is a sixth projection, the fifth projection is located in the fourth projection, and the sixth projection is located outside the fourth projection.

3. The loading jig according to claim 2, wherein a side edge of the third base plate close to the bottom wall of the groove is a first edge, and a side surface of the shielding member facing away from the bottom wall of the groove in the depth direction of the placement groove is not higher than the first edge.

4. The loading fixture of claim 2 or 3, wherein the loading fixture includes a first outer surface, and the placement groove is formed on the first outer surface.

5. The loading jig of claim 4, wherein a containing groove is formed in the first outer surface, the containing groove is communicated with the placing groove, and the shielding piece is arranged in the containing groove.

6. The loading jig according to claim 2 or 3, wherein the shielding member is placed in the placement groove, and the shielding member is inclined toward the first inner side wall in a direction from the groove bottom wall to the open opening.

7. The loading jig according to any one of claims 1 to 3, wherein the first inner side wall includes a sloped surface against which the substrate close to the first inner side wall abuts, the sloped surface extending obliquely in a direction away from the bottom wall of the groove in a direction from the bottom wall of the groove to the open opening.

8. The loading fixture of claim 7, wherein the first region to be polished forms a first arc surface after being polished, and a slope of the sloped surface is equal to an included angle between a tangent of the first arc surface and the planar region.

9. The loading jig of claim 7, wherein the bottom wall of the groove is provided with a step surface for supporting the substrate, and the step surface extends obliquely in a direction away from the bottom wall of the groove in a direction from the bottom wall of the groove to the open mouth.

10. The loading jig of claim 9, wherein the step surface is parallel to the tapered surface.

11. The loading jig according to claim 10, further comprising a negative pressure cavity, wherein the negative pressure cavity is located on one side of the groove bottom wall facing away from the open opening, a first communication hole communicated with the negative pressure cavity is formed in the slope surface, and a second communication hole communicated with the negative pressure cavity is formed in the step surface.

12. A polishing apparatus, comprising:

a chassis;

a loading jig fixedly connected to the chassis, the loading jig being according to any one of claims 1-11;

the turntable is rotatably arranged on one side of the base plate, and a polishing material is arranged on the surface of one side, facing the base plate, of the turntable.

13. A processing method of a 2.5D cover plate is characterized by comprising the following steps:

providing a substrate, wherein the substrate comprises a plane area and a first area to be polished, which is positioned on one side of the plane area;

and shielding the plane area of the substrate, and polishing the first area to be polished to form a first arc surface in the first area to be polished.

14. The processing method according to claim 13, further comprising, after the polishing process is performed on the first region to be polished:

and performing light sweeping treatment on the polished substrate to eliminate boundary marks between the plane area and the first cambered surface.

15. The processing method according to claim 14, wherein the performing of the sweeping process on the substrate after the polishing process comprises: and adopting a blanket to perform light sweeping treatment on the polished substrate.

16. The processing method according to any one of claims 13 to 15, wherein the substrate further includes a second region to be polished provided on both sides of the plane area opposite to the first region to be polished, and before the performing of the scanning process on the substrate after the polishing process, further comprising:

step S201: and shielding the plane area of the substrate, and polishing the second area to be polished to form a second cambered surface in the second area to be polished.

17. The process of any one of claims 13 to 15, wherein masking the planar region of the substrate comprises:

providing a loading jig according to any one of claims 1 to 11, and obliquely stacking a plurality of substrates in a placing groove of the loading jig.

18. A 2.5D cover plate, characterized by being manufactured by the method of manufacturing a 2.5D cover plate according to any one of claims 13-17.

19. The 2.5D cover plate of claim 18, wherein the 2.5D cover plate is a camera cover plate.

20. An electronic device comprising the 2.5D cover sheet of claim 18 or 19.