CN114806492A - Flame-retardant adhesive tape applied to hot-press packaging of silicon-containing rubber frame and preparation method thereof - Google Patents
Flame-retardant adhesive tape applied to hot-press packaging of silicon-containing rubber frame and preparation method thereof Download PDFInfo
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- CN114806492A CN114806492A CN202210634291.4A CN202210634291A CN114806492A CN 114806492 A CN114806492 A CN 114806492A CN 202210634291 A CN202210634291 A CN 202210634291A CN 114806492 A CN114806492 A CN 114806492A
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- adhesive tape
- silicon
- flame
- retardant
- hot
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- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 title claims abstract description 41
- 239000002390 adhesive tape Substances 0.000 title claims abstract description 41
- 239000003063 flame retardant Substances 0.000 title claims abstract description 41
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 31
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 31
- 239000010703 silicon Substances 0.000 title claims abstract description 31
- 229920001971 elastomer Polymers 0.000 title claims abstract description 24
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 16
- 238000002360 preparation method Methods 0.000 title claims abstract description 11
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 22
- 238000001035 drying Methods 0.000 claims abstract description 16
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims abstract description 13
- 239000000853 adhesive Substances 0.000 claims abstract description 11
- 230000001070 adhesive effect Effects 0.000 claims abstract description 11
- 235000019400 benzoyl peroxide Nutrition 0.000 claims abstract description 8
- 239000011248 coating agent Substances 0.000 claims abstract description 7
- 238000000576 coating method Methods 0.000 claims abstract description 7
- 238000000034 method Methods 0.000 claims abstract description 7
- 239000004342 Benzoyl peroxide Substances 0.000 claims abstract description 6
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 claims abstract description 6
- ROBVLQBZPQQRTQ-UHFFFAOYSA-N [N].C1=CN=NN=C1 Chemical compound [N].C1=CN=NN=C1 ROBVLQBZPQQRTQ-UHFFFAOYSA-N 0.000 claims abstract description 6
- 150000003376 silicon Chemical class 0.000 claims abstract description 6
- 239000000126 substance Substances 0.000 claims abstract description 6
- 238000002156 mixing Methods 0.000 claims abstract description 4
- 239000012752 auxiliary agent Substances 0.000 claims description 20
- 239000003085 diluting agent Substances 0.000 claims description 18
- 239000003292 glue Substances 0.000 claims description 12
- 239000007788 liquid Substances 0.000 claims description 11
- 239000003973 paint Substances 0.000 claims description 8
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 6
- 238000003756 stirring Methods 0.000 claims description 6
- 239000002994 raw material Substances 0.000 claims description 5
- 239000002904 solvent Substances 0.000 claims description 5
- 239000000758 substrate Substances 0.000 claims description 5
- WRXCBRHBHGNNQA-UHFFFAOYSA-N (2,4-dichlorobenzoyl) 2,4-dichlorobenzenecarboperoxoate Chemical compound ClC1=CC(Cl)=CC=C1C(=O)OOC(=O)C1=CC=C(Cl)C=C1Cl WRXCBRHBHGNNQA-UHFFFAOYSA-N 0.000 claims description 3
- 238000006243 chemical reaction Methods 0.000 claims description 3
- 238000013329 compounding Methods 0.000 claims description 3
- 238000001816 cooling Methods 0.000 claims description 3
- 238000004132 cross linking Methods 0.000 claims description 3
- 238000003892 spreading Methods 0.000 claims description 3
- 239000007787 solid Substances 0.000 claims description 2
- 239000000463 material Substances 0.000 abstract description 8
- 238000007731 hot pressing Methods 0.000 abstract description 7
- 230000001680 brushing effect Effects 0.000 abstract description 5
- 229920002379 silicone rubber Polymers 0.000 abstract description 5
- 239000004964 aerogel Substances 0.000 abstract description 3
- 239000003921 oil Substances 0.000 abstract description 3
- 238000004080 punching Methods 0.000 abstract description 3
- 239000002253 acid Substances 0.000 abstract description 2
- 238000010008 shearing Methods 0.000 abstract description 2
- 241000233866 Fungi Species 0.000 abstract 1
- 239000003513 alkali Substances 0.000 abstract 1
- 230000009545 invasion Effects 0.000 abstract 1
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 244000043261 Hevea brasiliensis Species 0.000 description 1
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 1
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 229920002313 fluoropolymer Polymers 0.000 description 1
- 239000004811 fluoropolymer Substances 0.000 description 1
- 239000003205 fragrance Substances 0.000 description 1
- 230000002538 fungal effect Effects 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 238000010559 graft polymerization reaction Methods 0.000 description 1
- 239000003999 initiator Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920003052 natural elastomer Polymers 0.000 description 1
- 229920001194 natural rubber Polymers 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 229920001558 organosilicon polymer Polymers 0.000 description 1
- 239000007800 oxidant agent Substances 0.000 description 1
- 238000010525 oxidative degradation reaction Methods 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 229920001084 poly(chloroprene) Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229920000468 styrene butadiene styrene block copolymer Polymers 0.000 description 1
- 230000002195 synergetic effect Effects 0.000 description 1
- 239000011882 ultra-fine particle Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/04—Polysiloxanes
- C09J183/06—Polysiloxanes containing silicon bound to oxygen-containing groups
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2483/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/02—Flame or fire retardant/resistant
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Adhesive Tapes (AREA)
Abstract
The invention discloses a flame-retardant adhesive tape applied to hot-pressing packaging of a silicon-containing rubber frame and a preparation method thereof, and belongs to the technical field of adhesive tapes. The adhesive tape is prepared by mixing, coating and drying an organic silicon pressure-sensitive adhesive, benzoyl peroxide or 2, 4-dichloroperoxybenzoyl, a silicon-containing high-molecular oligomer, a modified silicon-containing high-molecular oligomer and a high-purity triazine nitrogen flame retardant, and can be directly hot-pressed and bonded with a silicon rubber frame and aerogel of an object to be pasted, so that the cost of brushing a treating agent and labor is reduced; tests show that the adhesive can still maintain good shearing performance and bonding performance when used at the temperature of more than 220 ℃, has chemical resistance (acid, alkali and oil) and biological (fungi) invasion resistance, and meets the ROHS instruction requirements. The adhesive tape preparation method provided by the invention reduces the product processing procedures, enables the product to be more attractive and elegant, can enable the client to implement a full-automatic process from feeding to punching, and saves materials and manual processing cost.
Description
Technical Field
The invention belongs to the technical field of adhesive tapes, and particularly relates to a flame-retardant adhesive tape applied to hot-press packaging of a silicon-containing rubber frame and a preparation method thereof.
Background
Materials used in the market at present can be subjected to hot pressing after manual brushing of a treating agent is needed, the manual cost of brushing of the treating agent is high, the automatic process cannot be realized, in addition, the hot pressing time is long after the existing materials are brushed with the treating agent, the materials need to be subjected to hot pressing for 16S, and the materials can be completely bonded with silicon rubber after being placed statically for 24 hours, so that the next punching process can be started. Therefore, the invention relates to a silicon-containing rubber frame hot-pressing packaged flame-retardant adhesive tape applied to heat insulation of a new energy battery and a preparation method thereof.
Disclosure of Invention
The invention aims to provide a flame-retardant adhesive tape applied to hot-pressing packaging of a silicon-containing rubber frame and a preparation method thereof, and aims to solve the problems in the background technology. In order to realize the purpose, the invention adopts the technical scheme that: a flame-retardant adhesive tape applied to hot-press packaging of a silicon-containing rubber frame comprises the following raw materials in percentage by weight:
38-65% of main rubber, 2-3% of vulcanizing agent, 27-45% of diluent, 2-3% of auxiliary agent F1, 5-8% of auxiliary agent F5 and 10-20% of flame retardant.
Specifically, the main adhesive is an organic silicon pressure-sensitive adhesive, the solid content of the organic silicon pressure-sensitive adhesive is 50% -60%, the organic silicon pressure-sensitive adhesive is composed of organic silicon polymer modified acrylic acid and organic silicon modified rubber pressure-sensitive adhesive, and compared with the traditional acrylate pressure-sensitive adhesive and rubber pressure-sensitive adhesive, the organic silicon pressure-sensitive adhesive has excellent chemical resistance, water resistance, oil resistance, solvent resistance, high temperature resistance, low temperature resistance, thermal degradation resistance, oxidative degradation resistance and other performances. The vulcanizing agent comprises benzoyl peroxide and 2, 4-dichloro benzoyl peroxide, and the chemical formulas of the two are respectively C14H10O4 and C14H6Cl4O 4. Benzoyl peroxide is the most widely used initiator in the adhesive industry, and is used for solvent polymerization of acrylate and vinyl acetate, and graft polymerization of chloroprene rubber, natural rubber, SBS and methyl methacrylate, and its chemical property is strong oxidant, very unstable, slightly soluble in water and methanol, and soluble in ethanol, ether and acetone.
Specifically, the diluent is acrylic paint diluent, is colorless transparent liquid, has special fragrance, is flammable and volatile liquid, can be mixed and dissolved with most organic solvents, and has good solubility. The assistant F1 is a silicon-containing high-molecular oligomer, and the assistant F5 is a modified silicon-containing high-molecular oligomer. The flame retardant is a high-purity triazine nitrogen flame retardant, has high nitrogen content, ultrafine particle size and excellent resin compatibility, conforms to Swedish regulations, and does not contain phosphorus. In a flame-retardant system, the flame retardant can be used as a gas source of an intumescent flame retardant, and can play a role in isolating oxygen and promoting char formation, thereby achieving a better flame-retardant synergistic effect. Specifically, the adhesive tape also comprises a substrate.
A flame-retardant adhesive tape applied to hot-press packaging of a silicon-containing rubber frame and a preparation method thereof comprise the following steps:
s1, mixing and dissolving a vulcanizing agent and a paint diluent according to the formula ratio, adding a main glue, stirring at the rotation speed of 1800 plus 3000 rpm for 8-15 minutes, adding an auxiliary agent F1 and an auxiliary agent F5 according to the formula ratio, carrying out a thermal crosslinking reaction for 8-12 minutes, and finally adding a flame retardant, and stirring for 5-8 minutes to obtain liquid glue;
s2, uniformly spreading the liquid glue on a substrate, drying the liquid glue to remove the solvent, wherein the drying temperature is 75-85 ℃, and the drying time is 4-8 minutes to obtain the adhesive tape;
s3, vulcanizing the adhesive tape at 165-204 ℃ for 4-7 min;
s4, cooling the vulcanized adhesive tape to 120-160 ℃, and then compounding the adhesive tape and a release film to keep the smoothness and transparency of the adhesive surface;
s5, directly coating a layer of adhesive tape with the thickness of 14-16 microns by a precision coating machine in a scraper mode, drying at the high temperature of 165-180 ℃, drying and curing at the machine speed of 20-50M/min, and storing at normal temperature.
Compared with the prior art, the adhesive tape produced by the invention does not need to be manually brushed with a treating agent, can be directly hot-pressed and bonded with the silicon rubber frame and the aerogel of the object to be adhered, and reduces the brushing treating agent and labor cost; the existing material brush treating agent can be completely bonded with the silicon rubber after being placed statically for 24 hours after being hot-pressed for 16S, but the material brush treating agent can be completed by hot pressing only for 6S and can be more and more tightly bonded with an object to be bonded; the temperature resistance range is wide, and the high-temperature-resistant adhesive can still maintain good shearing performance and bonding performance when used at the temperature of up to 220 ℃; a variety of surfaces can be bonded, including some low surface energy surfaces (e.g., silicones, fluoropolymers, polyolefins); moisture, weather (ozone, sunlight), chemical (acid, base, oil) and biological (fungal) attack resistance; and meets the ROHS instruction requirements. The adhesive tape preparation method provided by the invention reduces the product processing procedures, enables the product to be more attractive and elegant, can enable the client to implement a full-automatic process from feeding to punching, and saves materials and manual processing cost.
Detailed Description
In order that the invention may be more fully understood, reference will now be made to the following description. The present invention may be embodied in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
The technical solution of the present patent will be described in further detail with reference to the following embodiments.
Example 1
A flame-retardant adhesive tape applied to hot-press packaging of a silicon-containing rubber frame comprises the following raw materials in percentage by weight:
46% of main rubber, 2.65% of vulcanizing agent, 30.8% of diluent, 2.34% of auxiliary F1, 5.5% of auxiliary F5 and 12.71% of flame retardant. Wherein the main adhesive is organosilicon pressure sensitive adhesive, the vulcanizing agent is benzoyl peroxide, and the molecular formula is C14H10O 4. The diluent is acrylic paint diluent, the auxiliary agent F1 is silicon-containing high molecular oligomer, and the auxiliary agent F5 is modified silicon-containing high molecular oligomer. The flame retardant is a high-purity triazine nitrogen flame retardant.
A flame-retardant adhesive tape applied to hot-press packaging of a silicon-containing rubber frame and a preparation method thereof comprise the following steps:
s1, mixing and dissolving a vulcanizing agent and a paint diluent according to the formula ratio, adding a main glue, stirring at the rotating speed of 2000 r/min for 10 min, adding an auxiliary agent F1 and an auxiliary agent F5 according to the formula ratio, carrying out a thermal crosslinking reaction for 9min, and finally adding a flame retardant, and stirring for 6min to obtain liquid glue;
s2, uniformly spreading the liquid glue on a substrate, drying the liquid glue to remove the solvent, wherein the drying temperature is 75 ℃, and the drying time is 5 minutes to obtain the adhesive tape;
s3, vulcanizing the adhesive tape at 170 ℃ for 5 min;
s4, cooling the vulcanized adhesive tape to 130 ℃, and then compounding the adhesive tape and a release film to keep the smoothness and transparency of the adhesive surface;
s5, directly coating a layer of adhesive tape with the thickness of 14 microns by a precision coating machine in a scraper mode, drying at the high temperature of 165-180 ℃, drying and curing at the machine speed of 20-50M/min, and storing at normal temperature.
The produced adhesive tape can be directly hot-pressed and bonded with a silicon rubber frame and aerogel of an object to be adhered at 160 ℃ without manually brushing a treating agent, and can be hot-pressed and finished after 6S.
Example 2
A flame-retardant adhesive tape applied to hot-press packaging of a silicon-containing rubber frame comprises the following raw materials in percentage by weight:
48.6 percent of main rubber, 2.78 percent of vulcanizing agent, 29.6 percent of diluent, 2.31 percent of auxiliary F1, 5.3 percent of auxiliary F5 and 11.41 percent of flame retardant. Wherein the main adhesive is organosilicon pressure sensitive adhesive, the vulcanizing agent is benzoyl peroxide, and the molecular formula is C14H10O 4. The diluent is acrylic paint diluent, the auxiliary agent F1 is silicon-containing high molecular oligomer, and the auxiliary agent F5 is modified silicon-containing high molecular oligomer. The flame retardant is a high-purity triazine nitrogen flame retardant.
Example 3
A flame-retardant adhesive tape applied to hot-press packaging of a silicon-containing rubber frame comprises the following raw materials in percentage by weight:
50.6 percent of main rubber, 2.88 percent of vulcanizing agent, 28.1 percent of diluent, 2.21 percent of auxiliary agent F1, 5.6 percent of auxiliary agent F5 and 10.41 percent of flame retardant. Wherein the main adhesive is organosilicon pressure sensitive adhesive, the vulcanizing agent is 2, 4-dichloro benzoyl peroxide, and the molecular formula is C14H6Cl4O 4. The diluent is acrylic paint diluent, the auxiliary agent F1 is silicon-containing high molecular oligomer, and the auxiliary agent F5 is modified silicon-containing high molecular oligomer. The flame retardant is a high-purity triazine nitrogen flame retardant.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
The above embodiments are only for illustrating the invention and are not to be construed as limiting the invention, and those skilled in the art can make various changes and modifications without departing from the spirit and scope of the invention, therefore, all equivalent technical solutions also belong to the scope of the invention, and the scope of the invention is defined by the claims.
Claims (5)
1. The flame-retardant adhesive tape applied to hot-press packaging of the silicon-containing rubber frame is characterized in that: comprises the following raw materials in percentage by weight: 38-65% of main rubber, 2-3% of vulcanizing agent, 27-45% of diluent, 2-3% of auxiliary agent F1, 5-8% of auxiliary agent F5 and 10-20% of flame retardant.
2. The flame-retardant adhesive tape applied to the hot-press packaging of the silicon-containing rubber frame according to claim 1, wherein: the main adhesive is an organic silicon pressure-sensitive adhesive, and the solid content of the organic silicon pressure-sensitive adhesive is 50-60%; the vulcanizing agent comprises benzoyl peroxide and 2, 4-dichloro benzoyl peroxide, and the chemical formulas of the two are respectively C14H10O4 and C14H6Cl4O 4.
3. The flame-retardant adhesive tape applied to the hot-press packaging of the silicon-containing rubber frame according to claim 1, wherein: the diluent is acrylic paint diluent, the auxiliary agent F1 is a silicon-containing high-molecular oligomer, the auxiliary agent F5 is a modified silicon-containing high-molecular oligomer, and the flame retardant is a high-purity triazine nitrogen flame retardant.
4. The flame-retardant adhesive tape applied to the hot-press packaging of the silicon-containing rubber frame according to claim 1, wherein: also includes a substrate.
5. The flame-retardant adhesive tape applied to hot-press packaging of the silicon-containing rubber frame and the preparation method thereof according to any one of claims 1 to 4, wherein the flame-retardant adhesive tape comprises: the method comprises the following steps:
s1, mixing and dissolving a vulcanizing agent and a paint diluent according to the formula ratio, adding a main glue, stirring at the rotation speed of 1800 plus 3000 rpm for 8-15 minutes, adding an auxiliary agent F1 and an auxiliary agent F5 according to the formula ratio, carrying out a thermal crosslinking reaction for 8-12 minutes, and finally adding a flame retardant, and stirring for 5-8 minutes to obtain liquid glue;
s2, uniformly spreading the liquid glue on a substrate, drying the liquid glue to remove the solvent, wherein the drying temperature is 75-85 ℃, and the drying time is 4-8 minutes to obtain the adhesive tape;
s3, vulcanizing the adhesive tape at 165-204 ℃ for 4-7 min;
s4, cooling the vulcanized adhesive tape to 120-160 ℃, and then compounding the adhesive tape and a release film to keep the smoothness and transparency of the adhesive surface;
s5, directly coating a layer of adhesive tape with the thickness of 14-16 microns by a precision coating machine in a scraper mode, drying at the high temperature of 165-180 ℃, drying and curing at the machine speed of 20-50M/min, and storing at normal temperature.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210634291.4A CN114806492A (en) | 2022-06-07 | 2022-06-07 | Flame-retardant adhesive tape applied to hot-press packaging of silicon-containing rubber frame and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210634291.4A CN114806492A (en) | 2022-06-07 | 2022-06-07 | Flame-retardant adhesive tape applied to hot-press packaging of silicon-containing rubber frame and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114806492A true CN114806492A (en) | 2022-07-29 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210634291.4A Pending CN114806492A (en) | 2022-06-07 | 2022-06-07 | Flame-retardant adhesive tape applied to hot-press packaging of silicon-containing rubber frame and preparation method thereof |
Country Status (1)
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|---|---|
| CN (1) | CN114806492A (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105273667A (en) * | 2014-06-06 | 2016-01-27 | 上海晶华胶粘新材料股份有限公司 | High-temperature-resistant silicone-acrylate pressure-sensitive adhesive and preparation method thereof |
| CN108949048A (en) * | 2018-08-01 | 2018-12-07 | 深圳日高胶带新材料有限公司 | A kind of organic silicon flame-retardant pressure-sensitive tape and preparation method thereof |
-
2022
- 2022-06-07 CN CN202210634291.4A patent/CN114806492A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105273667A (en) * | 2014-06-06 | 2016-01-27 | 上海晶华胶粘新材料股份有限公司 | High-temperature-resistant silicone-acrylate pressure-sensitive adhesive and preparation method thereof |
| CN108949048A (en) * | 2018-08-01 | 2018-12-07 | 深圳日高胶带新材料有限公司 | A kind of organic silicon flame-retardant pressure-sensitive tape and preparation method thereof |
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