CN114806462A - Photocurable hot melt adhesive with good adhesion to polar substrates and preparation method thereof - Google Patents

Photocurable hot melt adhesive with good adhesion to polar substrates and preparation method thereof Download PDF

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Publication number
CN114806462A
CN114806462A CN202110070152.9A CN202110070152A CN114806462A CN 114806462 A CN114806462 A CN 114806462A CN 202110070152 A CN202110070152 A CN 202110070152A CN 114806462 A CN114806462 A CN 114806462A
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Prior art keywords
parts
melt adhesive
hydrogenated
styrene
polar substrates
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CN202110070152.9A
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Chinese (zh)
Inventor
赵凤艳
曹阳
韩方方
刘涛
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Weldtone Xiamen Technology Co Ltd
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Weldtone Xiamen Technology Co Ltd
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Priority to CN202110070152.9A priority Critical patent/CN114806462A/en
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J125/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Adhesives based on derivatives of such polymers
    • C09J125/02—Homopolymers or copolymers of hydrocarbons
    • C09J125/04—Homopolymers or copolymers of styrene
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J153/00—Adhesives based on block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
    • C09J153/02—Vinyl aromatic monomers and conjugated dienes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J157/00—Adhesives based on unspecified polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds
    • C09J157/02—Copolymers of mineral oil hydrocarbons
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J191/00—Adhesives based on oils, fats or waxes; Adhesives based on derivatives thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00—Properties
    • C08L2201/08—Stabilised against heat, light or radiation or oxydation
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
    • C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2312/00—Crosslinking
    • C08L2312/06—Crosslinking by radiation

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

A photo-curable hot melt adhesive with good bonding performance to polar substrates and a preparation method thereof are disclosed, the photo-curable reaction group is introduced on the basis of the traditional SBC hot melt adhesive, so that the adhesive can react after UV illumination to obtain a certain cross-linked network elastomer, the high temperature resistance and high humidity resistance of the adhesive are greatly improved, meanwhile, non-hydrogenated resin is adopted more, the adhesive can be used for structural bonding of most of electronic devices, and the adhesive is particularly suitable for bonding of polar substrates and is suitable for various occasions with high requirements.

Description

Photocurable hot melt adhesive with good adhesion to polar substrates and preparation method thereof
Technical Field
The invention relates to the field of adhesives, in particular to a light-curable hot-melt adhesive with good adhesion to polar substrates and a preparation method thereof.
Background
The traditional SBC rubber hot melt adhesive is formed by simply and physically mixing an SBC elastomer, petroleum resin, tackifying resin and a plasticizer, can obtain the hot melt adhesive with certain initial strength by formula adjustment, and is widely applied to the industries of labels, adhesive tapes, packaging and the like. But because no chemical crosslinking exists in the system, the performance of the system is poor under severe weather conditions such as high temperature or high humidity; and due to the existence of non-polar bonds in the molecular chain, the pressure-sensitive colloid system is poor in adhesion performance to polar substrates.
Disclosure of Invention
The invention aims to provide a photocurable hot melt adhesive with good bonding property on polar substrates and a preparation method thereof.
In order to achieve the above purpose, the solution of the invention is:
the light-curable hot melt adhesive for bonding polar substrates well comprises the following raw materials in parts by weight:
Figure BDA0002905720750000011
further, the non-hydrogenated SBC rubber polymer is one or a mixture of styrene-isoprene-styrene, styrene-butadiene-styrene, styrene-isoprene/butadiene, and vinyl-terminated styrene-butadiene-styrene.
Further, the non-hydrogenated terminal vinyl polybutadiene or non-hydrogenated terminal isoprene rubber is a liquid rubber with at least one terminal group having a vinyl functional group.
Further, the non-hydrogenated synthetic resin is one or a mixture of several of non-hydrogenated carbon five petroleum resin, carbon nine petroleum resin, carbon five/carbon nine petroleum resin and styrene resin.
Furthermore, the tackifying resin is rosin, rosin derivatives, terpene resin or one or a mixture of terpene resin derivatives.
Further, the photo-free radical initiator is one or a mixture of 2,4,6 (trimethyl benzoyl) diphenyl phosphine oxide, 4-dimethylaminobenzoic acid isooctyl ester and 2, 4-diethylthioxanthone.
Further, the plasticizer is one of naphthenic oils.
Further, the antioxidant is one or more of tetra [ beta- (3, 5-di-tert-butyl-4-hydroxyphenyl) propionic acid ] pentaerythritol ester, tri [2, 4-di-tert-butylphenyl ] phosphite and beta- (3, 5-di-tert-butyl-4-hydroxyphenyl) propionic acid n-octadecyl ester.
A method for preparing a photocurable hot melt adhesive with good bonding property to polar substrates comprises the following steps:
step one, adding 20-40 parts of non-hydrogenated SBC rubber polymer, 0-35 parts of plasticizer and 0.2-1 part of antioxidant into a reactor, then heating to 140-170 ℃, stirring until all materials are molten, and stabilizing the reaction for 15 min;
under the stirring condition, adding 5-10 parts of non-hydrogenated terminal vinyl polybutadiene or non-hydrogenated terminal isoprene rubber, 0-20 parts of tackifying resin, 25-55 parts of non-hydrogenated synthetic resin and 0.2-1 part of photo-free radical initiator, stirring for 30min, defoaming, filling into an opaque rubber tube, and sealing and packaging;
the parts of the components are parts by weight.
The patent introduces photocurable reaction group on the basis of traditional SBC hot melt adhesive for the adhesive can take place the reaction after UV illumination and obtain certain crosslinked network elastomer, has improved its high temperature resistant and high wet performance greatly, adopts non-hydrogenated resin simultaneously, can be used to the structure bonding of most of electron devices, is particularly useful for the bonding of polarity substrate, is fit for the occasion of various high requirements.
Detailed Description
The following detailed description of the embodiments of the present invention is intended to be illustrative, and not to be construed as limiting the invention.
Example 1
Adding 20 parts of styrene-butadiene-styrene, 15 parts of plasticizer and 0.2 part of tris [2, 4-di-tert-butylphenyl ] phosphite into a reactor, heating to 140-170 ℃, stirring until all materials are molten, and stabilizing the reaction for 15 min; then, under the stirring condition, 10 parts of non-hydrogenated vinyl terminated polybutadiene liquid rubber, 10 parts of terpene resin, 45 parts of non-hydrogenated styrene resin and 0.2 part of 2,4,6 (trimethylbenzoyl) diphenyl phosphine oxide are added, stirred for 30min, and finally defoamed, filled into an opaque rubber tube, sealed and stored.
Example 2
Adding 30 parts of styrene-isoprene-styrene, 25 parts of plasticizer and 0.5 part of tetra [ beta- (3, 5-di-tert-butyl-4-hydroxyphenyl) propionic acid ] pentaerythritol ester into a reactor, heating to 140-170 ℃, stirring until all materials are molten, and stabilizing the reaction for 15 min; then, under the stirring condition, 5 parts of non-hydrogenated vinyl-terminated polybutadiene liquid rubber, 15 parts of rosin, 35 parts of non-hydrogenated carbon penta petroleum resin and 0.5 part of 2, 4-diethyl thioxanthone are added, stirred for 30min, and finally defoamed, filled into an opaque rubber tube, sealed and stored.
Example 3
Adding 30 parts of vinyl-terminated styrene-butadiene-styrene, 35 parts of plasticizer and 1 part of tris [2, 4-di-tert-butylphenyl ] phosphite into a reactor, heating to 140-170 ℃, stirring until all materials are molten, and stabilizing the reaction for 15 min; then, under the stirring condition, 5 parts of non-hydrogenated vinyl terminated polybutadiene liquid rubber, 35 parts of non-hydrogenated styrene resin and 0.2 part of 2,4,6 (trimethylbenzoyl) diphenyl phosphine oxide are added, stirred for 30min, and finally defoamed, filled into an opaque rubber tube, sealed and stored.
Example 4
Adding 40 parts of styrene-isoprene and 1 part of tris [2, 4-di-tert-butylphenyl ] phosphite into a reactor, heating to 140-170 ℃, stirring until all materials are molten, and stabilizing the reaction for 15 min; then, under the stirring condition, 10 parts of non-hydrogenated vinyl-terminated polybutadiene liquid rubber, 45 parts of non-hydrogenated carbon nonapetroleum resin, 20 parts of terpene resin and 0.2 part of 2,4,6 (trimethylbenzoyl) diphenyl phosphine oxide are added, stirred for 30min, and finally defoamed, filled into an opaque rubber tube, sealed and stored.
Example 5
Adding 40 parts of non-hydrogenated styrene-butadiene-styrene with vinyl at the end, 15 parts of plasticizer and 1 part of tris [2, 4-di-tert-butylphenyl ] phosphite into a reactor, heating to 140-170 ℃, stirring until all materials are molten, and stabilizing the reaction for 15 min; then, under the stirring condition, 5 parts of non-hydrogenated vinyl-terminated polybutadiene liquid rubber, 35 parts of non-hydrogenated styrene resin, 5 parts of rosin and 0.5 part of isooctyl 4-dimethylaminobenzoate are added, stirred for 30min, defoamed, filled into an opaque rubber tube, and sealed and preserved.
Comparative example 1
Adding 20 parts of styrene-ethylene-styrene, 15 parts of plasticizer and 0.2 part of tetra [ beta- (3, 5-di-tert-butyl-4-hydroxyphenyl) propionic acid ] pentaerythritol ester into a reactor, heating to 140-170 ℃, stirring until all materials are molten, and stabilizing the reaction for 15 min; then, under the stirring condition, adding 20 parts of rosin and 45 parts of styrene resin, stirring for 30min, finally defoaming, filling into an opaque rubber tube, and sealing and storing; is a traditional SBC rubber hot melt adhesive.
Comparative example 2
Adding 20 parts of hydrogenated SBC rubber polymer, 15 parts of plasticizer and 0.2 part of tetra [ beta- (3, 5-di-tert-butyl-4-hydroxyphenyl) propionic acid ] pentaerythritol ester into a reactor, heating to 140-170 ℃, stirring until all materials are molten, and reacting stably for 15 min; then, under the condition of stirring, adding 10 parts of hydrogenated vinyl-terminated polybutadiene liquid rubber, 10 parts of tackifying resin, 45 parts of hydrogenated styrene resin and 0.2 part of isooctyl 4-dimethylaminobenzoate photo-radical initiator, stirring for 30min, finally defoaming, filling into an opaque rubber tube, sealing and storing.
Comparative example 3
Adding 20 parts of partially hydrogenated SBC rubber polymer, 15 parts of plasticizer and 0.2 part of tetra [ beta- (3, 5-di-tert-butyl-4-hydroxyphenyl) propionic acid ] pentaerythritol ester into a reactor, heating to 140-170 ℃, stirring until all materials are molten, and reacting stably for 15 min; then, under the stirring condition, 10 parts of partially hydrogenated vinyl-terminated polybutadiene liquid rubber, 10 parts of rosin, 45 parts of partially hydrogenated styrene resin and 0.2 part of isooctyl 4-dimethylaminobenzoate are added, stirred for 30min, defoamed, filled into an opaque rubber tube, and sealed and preserved.
The parts mentioned in the above comparative examples and examples are parts by weight.
The samples obtained in comparative examples 1-3 and examples 1-5 were subjected to the following performance tests, the specific test methods were as follows:
1. the viscosity test adopts a Brookfield rotational viscometer, the tested sample is preheated for 10min at 170 ℃, the completely preheated sample is poured into a sample cup, the sample cup is fixed in a heater, the position is adjusted to ensure that a rotor on the viscometer is positioned at the center of the tested sample in the sample cup, the temperature of the heater is adjusted, the rotor and the tested sample are kept constant in the sample cup for 10min, the temperature of the sample is ensured to be stable at 170 ℃, and the temperature of the sample is within +/-1 ℃ of the specified temperature; the temperature is kept constant at 170 ℃, the rotor is opened, and after rotating for 20min, the viscosity data at this time is read, wherein the viscosity unit is 'cps'.
2. And (3) testing the thrust strength:
1) testing of initial thrust strength of UV curing: dispensing a tested sample adhesive on the surface of a substrate by a table type dispenser, then placing the substrate into an ultraviolet irradiation instrument for curing, bonding two substrates together by using a substrate mold, controlling the thickness of the adhesive to be 0.15mm and the weight of the adhesive to be 0.05 +/-0.003 g, maintaining the pressure by using a force of 2kg, placing the substrate in an environment with the temperature of 23 +/-2 ℃ and the relative humidity of 50 +/-5 ℃ for 5min for initial time, testing by using a three-pin universal testing machine until the initial time is up, loading a sample by using a clamp of the testing machine at the moving speed of 10mm/min, and recording the maximum load and bonding area of the sample damaged by thrust;
2) testing the final thrust strength Mpa: the method comprises the following steps of dispensing a tested sample adhesive on the surface of a substrate by a table type dispenser, then placing the substrate into an ultraviolet irradiation instrument for curing, bonding two substrates together by using a substrate mold, controlling the thickness of the adhesive to be 0.15mm and the weight of the adhesive to be 0.05 +/-0.003 g, maintaining the pressure by using a 2kg force, placing the substrate in an environment with the temperature of 23 +/-2 ℃ and the relative humidity of 50 +/-5 ℃ for 48 hours for final curing, testing by using a three-throw universal testing machine when the time is up, loading a sample by a clamp of the testing machine at the moving speed of 10mm/min, and recording the maximum load and the bonding area of the thrust damage of the sample.
The sample preparation is carried out by using a table-type dispensing machine, and a glue line track is drawn on the surface of the base material through the movement of X, Y, Z in the three-axis movement direction;
the UV curing is carried out by adopting a professional ultraviolet irradiation instrument and setting the irradiation intensity of ultraviolet light to be 1000mw/cm 2 UV。
3. Dupont ball impact test:
dispensing a tested sample adhesive on the surface of a substrate by a table type dispenser, then placing the substrate into an ultraviolet irradiation instrument for curing, bonding two substrates together by using a substrate mold, controlling the thickness of the adhesive to be 0.15mm and the weight of the adhesive to be 0.05 +/-0.003 g, maintaining the pressure by using 2kg of force, placing the substrate in an environment with the temperature of 23 +/-2 ℃ and the relative humidity of 50 +/-5 ℃ for 48 hours for final curing, placing the cured substrate into a DuPont ball impact tester, and recording the impact times of the tested sample when the substrate is peeled off under the conditions of 200g and 70 mm.
4. High temperature and high humidity aging test:
and (3) curing the tested sample for 48h (the curing process is the same as that of the DuPont falling ball impact test), aging the sample in an Aisbeck constant-temperature and constant-humidity box, aging the sample in the Aisbeck constant-temperature and constant-humidity box for 72h, taking out the tested sample, and testing the aged strength of the sample by adopting a normal-temperature pushing method. The test selects two environmental conditions for aging, wherein one environmental condition is that the temperature is 85 ℃ and the humidity is 85 percent; another environmental condition is a temperature of 60 ℃ and a humidity of 90%.
In each of the above tests, adhesion tests were conducted primarily on three more commonly used combinations of polar substrates, PC/PC, PA/PA, and PBT/PBT.
The test data are collated to obtain the following tables I to III:
table one: comparison of viscosity test and thrust Strength test of comparative examples 1 to 3 and examples 1 to 5
Figure BDA0002905720750000051
As can be seen from the test data in Table I, the test data of examples 1-5 have the following characteristics compared with comparative examples 1-3:
1. the viscosity is improved to some extent, but within a reasonable range, the use of the product is not influenced;
2. after UV curing, the initial thrust strength of the examples 1-5 after bonding of the polar substrate is obviously improved; the final strength of 48 hours is obviously improved compared with comparative examples 1-3, and further shows that the bonding effect of the polar material is obviously improved.
Table two: DuPont ball impact test comparison of comparative examples 1-3 and examples 1-5
Figure BDA0002905720750000061
As can be seen from the test data in Table II, the DuPont falling ball impact achieved in examples 1-5 is much higher than that achieved in comparative example 1 and slightly better than that achieved in comparative examples 2-3 for polar substrates, which indicates that the products obtained in the present invention have excellent adhesion effect and are not easy to peel.
Table three: comparison of high temperature and high humidity aging test between comparative examples 1 to 3 and examples 1 to 5
Figure BDA0002905720750000062
As noted in the comparison of the data in Table III, the adhesive strength of the polar substrates in examples 1-5 is much improved compared to that in comparative examples 1-3 (especially, comparative example 1 is the conventional SBC rubber hot melt adhesive), and the adhesive strength is significantly improved when PA/PA, PC/PC or PBT/PBT is used as the adhesive substrate.
The above description is only an embodiment of the present invention, and is not intended to limit the design of the present invention, and all equivalent changes made according to the design key of the present invention fall within the protection scope of the present invention.
In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention, and that variations, modifications, substitutions and alterations can be made to the above embodiments by those of ordinary skill in the art within the scope of the present invention.

Claims (9)

1. The light-curable hot melt adhesive for bonding polar substrates is characterized by comprising the following raw materials in parts by weight:
Figure FDA0002905720740000011
2. a photocurable hot-melt adhesive with good adhesion to polar substrates as set forth in claim 1, wherein: the non-hydrogenated SBC rubber polymer is one or a mixture of styrene-isoprene-styrene, styrene-butadiene-styrene, styrene-isoprene/butadiene and styrene-butadiene-styrene with vinyl ends.
3. A photocurable hot melt adhesive with good adhesion to polar substrates as set forth in claim 1, wherein: the non-hydrogenated terminal vinyl polybutadiene or non-hydrogenated terminal isoprene rubber is liquid rubber with at least one terminal group having vinyl functional group.
4. A photocurable hot-melt adhesive with good adhesion to polar substrates as set forth in claim 1, wherein: the non-hydrogenated synthetic resin is one or a mixture of several of non-hydrogenated carbon five petroleum resin, carbon nine petroleum resin, carbon five/carbon nine petroleum resin and styrene resin.
5. A photocurable hot-melt adhesive with good adhesion to polar substrates as set forth in claim 1, wherein: the tackifying resin is rosin, rosin derivatives, terpene resin or one or a mixture of terpene resin derivatives.
6. A photocurable hot-melt adhesive with good adhesion to polar substrates as set forth in claim 1, wherein: the photo-free radical initiator is one or a mixture of 2,4,6 (trimethyl benzoyl) diphenyl phosphine oxide, 4-dimethyl isooctyl aminobenzoate and 2, 4-diethyl thioxanthone.
7. A photocurable hot-melt adhesive with good adhesion to polar substrates as set forth in claim 1, wherein: the plasticizer is one of naphthenic oils.
8. A photocurable hot-melt adhesive with good adhesion to polar substrates as set forth in claim 1, wherein: the antioxidant is one or more of tetra [ beta- (3, 5-di-tert-butyl-4-hydroxyphenyl) propionic acid ] pentaerythritol ester, tri [2, 4-di-tert-butylphenyl ] phosphite and beta- (3, 5-di-tert-butyl-4-hydroxyphenyl) propionic acid n-octadecyl ester.
9. A method for preparing a photocurable hot melt adhesive with good bonding property to polar substrates is characterized by comprising the following steps:
step one, adding 20-40 parts of non-hydrogenated SBC rubber polymer, 0-35 parts of plasticizer and 0.2-1 part of antioxidant into a reactor, then heating to 140-170 ℃, stirring until all materials are molten, and stabilizing the reaction for 15 min;
under the stirring condition, adding 5-10 parts of non-hydrogenated terminal vinyl polybutadiene or non-hydrogenated terminal isoprene rubber, 0-20 parts of tackifying resin, 25-55 parts of non-hydrogenated synthetic resin and 0.2-1 part of photo-free radical initiator, stirring for 30min, defoaming, filling into an opaque rubber tube, and sealing and packaging;
the parts of the components are parts by weight.
CN202110070152.9A 2021-01-19 2021-01-19 Photocurable hot melt adhesive with good adhesion to polar substrates and preparation method thereof Withdrawn CN114806462A (en)

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01141969A (en) * 1987-11-30 1989-06-02 Sunstar Giken Kk Ultraviolet-curable hot melt adhesive composition
KR20130063938A (en) * 2011-12-07 2013-06-17 제일모직주식회사 Photo-curable adhesive composition and display device comprising the same
CN103958628A (en) * 2011-11-14 2014-07-30 汉高美国知识产权有限责任公司 Adhesive compositions
CN107699172A (en) * 2017-09-22 2018-02-16 广东能辉新材料科技有限公司 Photocuring hot-fusible pressure-sensitive adhesive

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01141969A (en) * 1987-11-30 1989-06-02 Sunstar Giken Kk Ultraviolet-curable hot melt adhesive composition
CN103958628A (en) * 2011-11-14 2014-07-30 汉高美国知识产权有限责任公司 Adhesive compositions
KR20130063938A (en) * 2011-12-07 2013-06-17 제일모직주식회사 Photo-curable adhesive composition and display device comprising the same
CN107699172A (en) * 2017-09-22 2018-02-16 广东能辉新材料科技有限公司 Photocuring hot-fusible pressure-sensitive adhesive

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