CN114804641B - Electromagnetic shielding glass fiber and rigid circuit board - Google Patents
Electromagnetic shielding glass fiber and rigid circuit board Download PDFInfo
- Publication number
- CN114804641B CN114804641B CN202210600387.9A CN202210600387A CN114804641B CN 114804641 B CN114804641 B CN 114804641B CN 202210600387 A CN202210600387 A CN 202210600387A CN 114804641 B CN114804641 B CN 114804641B
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- Prior art keywords
- electromagnetic shielding
- glass fiber
- oxide
- shielding glass
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- 239000003365 glass fiber Substances 0.000 title claims abstract description 61
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims abstract description 46
- 229910000859 α-Fe Inorganic materials 0.000 claims abstract description 37
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 28
- 229910001004 magnetic alloy Inorganic materials 0.000 claims abstract description 24
- 229910052742 iron Inorganic materials 0.000 claims abstract description 23
- JKWMSGQKBLHBQQ-UHFFFAOYSA-N diboron trioxide Chemical compound O=BOB=O JKWMSGQKBLHBQQ-UHFFFAOYSA-N 0.000 claims abstract description 16
- 239000000395 magnesium oxide Substances 0.000 claims abstract description 15
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 claims abstract description 15
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 claims abstract description 15
- 229910052810 boron oxide Inorganic materials 0.000 claims abstract description 14
- BRPQOXSCLDDYGP-UHFFFAOYSA-N calcium oxide Chemical compound [O-2].[Ca+2] BRPQOXSCLDDYGP-UHFFFAOYSA-N 0.000 claims abstract description 14
- 239000000292 calcium oxide Substances 0.000 claims abstract description 14
- ODINCKMPIJJUCX-UHFFFAOYSA-N calcium oxide Inorganic materials [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 claims abstract description 14
- FUJCRWPEOMXPAD-UHFFFAOYSA-N lithium oxide Chemical compound [Li+].[Li+].[O-2] FUJCRWPEOMXPAD-UHFFFAOYSA-N 0.000 claims abstract description 14
- 229910001947 lithium oxide Inorganic materials 0.000 claims abstract description 14
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims abstract description 14
- CHWRSCGUEQEHOH-UHFFFAOYSA-N potassium oxide Chemical compound [O-2].[K+].[K+] CHWRSCGUEQEHOH-UHFFFAOYSA-N 0.000 claims abstract description 14
- 229910001950 potassium oxide Inorganic materials 0.000 claims abstract description 14
- 239000000377 silicon dioxide Substances 0.000 claims abstract description 14
- KKCBUQHMOMHUOY-UHFFFAOYSA-N sodium oxide Chemical compound [O-2].[Na+].[Na+] KKCBUQHMOMHUOY-UHFFFAOYSA-N 0.000 claims abstract description 14
- 229910001948 sodium oxide Inorganic materials 0.000 claims abstract description 14
- 235000012239 silicon dioxide Nutrition 0.000 claims abstract description 9
- 239000002994 raw material Substances 0.000 claims abstract description 5
- 229910018605 Ni—Zn Inorganic materials 0.000 claims description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- 239000011889 copper foil Substances 0.000 claims description 5
- 239000011347 resin Substances 0.000 claims description 5
- 229920005989 resin Polymers 0.000 claims description 5
- 229910002546 FeCo Inorganic materials 0.000 claims description 3
- 238000009413 insulation Methods 0.000 description 5
- 230000008901 benefit Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 239000011358 absorbing material Substances 0.000 description 3
- 239000004744 fabric Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 230000006978 adaptation Effects 0.000 description 2
- NUJOXMJBOLGQSY-UHFFFAOYSA-N manganese dioxide Chemical compound O=[Mn]=O NUJOXMJBOLGQSY-UHFFFAOYSA-N 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 239000011701 zinc Substances 0.000 description 2
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- SZVJSHCCFOBDDC-UHFFFAOYSA-N ferrosoferric oxide Chemical compound O=[Fe]O[Fe]O[Fe]=O SZVJSHCCFOBDDC-UHFFFAOYSA-N 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- 238000009941 weaving Methods 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C13/00—Fibre or filament compositions
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C14/00—Glass compositions containing a non-glass component, e.g. compositions containing fibres, filaments, whiskers, platelets, or the like, dispersed in a glass matrix
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02A—TECHNOLOGIES FOR ADAPTATION TO CLIMATE CHANGE
- Y02A30/00—Adapting or protecting infrastructure or their operation
Abstract
The invention provides an electromagnetic shielding glass fiber, which comprises the following raw materials: 30-45 wt% of silicon dioxide; 25-30wt% of aluminum oxide; 1-5 wt% of boron oxide; 5-10wt% of calcium oxide; 7-10wt% of magnesium oxide; sodium oxide 0-3 wt%; 2-5 wt% of potassium oxide; 0-2 wt% of lithium oxide; 0.5 to 1 weight percent of iron-based soft magnetic alloy; 2-5 wt% of ferrite. The iron-based soft magnetic alloy and ferrite are introduced into the electromagnetic shielding glass fiber, and the ranges of the iron-based soft magnetic alloy and the ferrite are adjusted, so that the obtained electromagnetic shielding glass fiber has the characteristics of wide electromagnetic shielding range or high resistivity according to performance requirements.
Description
Technical Field
The invention relates to the technical field of electronic devices, in particular to an electromagnetic shielding glass fiber and a rigid circuit board.
Background
The glass fiber used for the rigid circuit board (PCB) at present is electronic-grade glass fiber insulating cloth, which is prepared by mixing silicon dioxide, aluminum oxide, boron trioxide, calcium oxide, magnesium oxide, sodium oxide, potassium oxide and lithium oxide according to different proportions, melting, making filaments, weaving and finally forming the glass fiber cloth. The glass fiber composition for PCB applications is approximately silica: 50-55 percent of aluminum oxide: 20-25% of boron oxide: 0-5 percent of calcium oxide: 10-15 percent of magnesium oxide: 10-15%, sodium oxide: 0-3 percent of potassium oxide: 0-5 percent of lithium oxide: 0 to 2 percent. The DK value of the glass fiber cloth is approximately between 4.8 and 5.5, and the DF is approximately between 0.001 and 0.004. The mechanical and electrical properties of the glass fiber meet the current PCB requirements, but the glass fiber is penetrated by electromagnetic signals.
The PCB is composed of glass fiber, resin and copper foil; wherein, the glass fiber plays a supporting and strengthening role, the resin plays a role of bonding and providing a certain DK and DF functions, and the copper foil bears the current or signal channel. The PCB performs the functions of signal interconnection between devices in the electronic device and carrying all the devices. With the commercial use of 5G and the advanced development of 6G, the frequency of signals transmitted between chips is increased from 8G to 16G or even more than 32G. These high frequency signals all need to pass through the circuit inside the PCB, and there is a power supply inside the PCB in addition to these high speed signals; this causes power clutter to interfere with the high frequency signal. While different lines transmit different high frequency signals that interfere with other lines in the vicinity.
To solve these interference problems, the PCB needs to add a large number of layers to isolate the power clutter during design, and also to pull apart a certain distance between different high-speed lines to avoid signal interference. Due to these improvements, the number of layers of the PCB becomes high and the wiring density of the PCB is greatly reduced.
Disclosure of Invention
The invention solves the technical problem of providing an electromagnetic shielding glass fiber which has the characteristics of wide electromagnetic shielding range and high resistivity.
In view of this, the application provides an electromagnetic shielding glass fiber, which comprises the following raw materials:
preferably, the iron-based soft magnetic alloy is selected from one or more of FeSiAl, feSi, feNi and FeCo.
Preferably, the ferrite is selected from one or two of Mn-Zn ferrite and Ni-Zn ferrite.
Preferably, the content of the iron-based soft magnetic alloy is 0.6 to 0.9 weight percent.
Preferably, the ferrite content is 2.5 to 4.0wt%.
Preferably, the content of the silicon dioxide is 32-40 wt%, and the content of the aluminum oxide is 26-28 wt%.
Preferably, the content of the boron oxide is 2-4wt%, and the content of the calcium oxide is 6-9wt%.
Preferably, the content of the magnesium oxide is 7.5-8.5 wt% and the content of the sodium oxide is 0.5-2.5 wt%.
Preferably, the electromagnetic shielding glass fiber contains 2.5 to 4.5 weight percent of potassium oxide and 0.5 to 1.5 weight percent of lithium oxide.
The application also provides a rigid circuit board which is prepared from electromagnetic shielding glass fibers, resin and copper foil, wherein the electromagnetic shielding glass fibers are the electromagnetic shielding glass fibers.
The application provides an electromagnetic shielding glass fiber, which comprises silicon dioxide, aluminum oxide, boron oxide, calcium oxide, magnesium oxide, sodium oxide, potassium oxide, lithium oxide, iron-based soft magnetic alloy and ferrite. The application introduces the iron-based soft magnetic alloy into the electromagnetic shielding glass fiber, is a magnetic loss wave-absorbing material, and has the advantage of wide electromagnetic shielding range; the ferrite has higher resistivity and can still keep good insulating property after being added into the glass fiber; therefore, the iron-based soft magnetic alloy and ferrite are introduced into the electromagnetic shielding glass fiber, and the ranges of the iron-based soft magnetic alloy and the ferrite are adjusted, so that the obtained electromagnetic shielding glass fiber has the characteristics of wide electromagnetic shielding range or high resistivity according to the service performance of a product, and the corresponding resistivity or electromagnetic shielding range is not affected.
Detailed Description
For a further understanding of the present invention, preferred embodiments of the invention are described below in conjunction with the examples, but it should be understood that these descriptions are merely intended to illustrate further features and advantages of the invention, and are not limiting of the claims of the invention.
In view of the problem that the glass fiber for the PCB in the prior art cannot simultaneously consider electromagnetic shielding and insulation, the application provides the electromagnetic shielding glass fiber, which can not only bear all functions of the existing glass fiber, but also provide electromagnetic shielding functions by introducing the iron-based soft magnetic alloy and ferrite. Specifically, the embodiment of the invention discloses an electromagnetic shielding glass fiber, which comprises the following raw materials:
in the electromagnetic shielding glass fiber provided by the application, the iron-based soft magnetic alloy is specifically selected from one or more of FeSiAl, feSi, feNi and FeCo, and the iron-based soft magnetic alloy is derived from commercial products. The iron-based soft magnetic alloy is a magnetic loss wave absorbing material, the resistance value is more than 80 megaohms, and the reflection loss can reach-20 DB within the range of 2-28 GHZ; the method has the characteristic of wide electromagnetic shielding range, but the resistance value of the iron-based soft magnetic alloy is low, and the risk of reducing the insulation performance of the PCB exists due to the excessive addition amount. The content of the iron-based soft magnetic alloy is 0.5 to 2wt%, more specifically, the content of the soft magnetic alloy is 0.5wt%, 0.6wt%, 0.7wt%, 0.8wt%, 0.9wt%, 1.0wt%, 1.2wt%, 1.5wt%, 1.8wt%, 2.0wt%, 2.3wt% or 2.5wt%.
The ferrite is specifically selected from one or two of Mn-Zn ferrite and Ni-Zn ferrite, and is derived from commercial products; the ferrite is an additive which is sintered by using various oxides and is manufactured into micro powder, the granularity is 1-8 microns, and the component proportion of the ferrite in the ferrite can be specifically 80% of ferroferric oxide, 4% of manganese dioxide, 5% of boron oxide, 3% of zinc oxide and 8% of magnesium oxide. The resistivity of the ferrite reaches more than 100 megaohms, and the glass fiber still has enough good insulating property after being added can be completely ensured. The ferrite has higher magnetic permeability when facing high-frequency radiation, and electromagnetic waves are easy to enter and attenuate rapidly, so that the electromagnetic shielding effect is achieved, but the frequent range of the electromagnetic waves which can be shielded by the ferrite is narrower than that of the iron-based soft magnetic alloy. The ferrite content is 1.5wt%, 1.6wt%, 1.8wt%, 2.0wt%, 2.5wt%, 2.8wt%, 3.0wt%, 3.2wt%, 3.5wt%, 3.7wt%, 3.9wt%, 4.1wt%, 4.6wt% or 4.9wt%.
In the application, when the content of the iron-based soft magnetic alloy is too high, the insulativity of the glass fiber is reduced, and the problem of electric leakage is easy to occur; the ferrite has a poor shielding effect at a certain frequency when the content is too high, for example, the shielding performance is good at a high frequency of more than 10GHZ, but the shielding effect is very poor for 50HZ power supply noise.
In the electromagnetic shielding glass fiber provided by the application, the silicon dioxide, the aluminum oxide, the boron oxide, the calcium oxide, the magnesium oxide, the sodium oxide, the potassium oxide and the lithium oxide are used as fluxing agents, the content of the silicon dioxide is 30-45 wt%, the content of the aluminum oxide is 25-30 wt%, the content of the boron oxide is 1-5%, the content of the calcium oxide is 5-10 wt%, the content of the magnesium oxide is 7-10%, the content of the sodium oxide is 0-3%, the content of the potassium oxide is 2-5%, and the content of the lithium oxide is 0-2%; more specifically, the content of the silicon dioxide is 32 to 40wt%, the content of the aluminum oxide is 26 to 28wt%, the content of the boron oxide is 2 to 4wt%, the content of the calcium oxide is 6 to 9wt%, the content of the magnesium oxide is 7.5 to 8.5wt%, the content of the sodium oxide is 0.5 to 2.5wt%, the content of the potassium oxide is 2.5 to 4.5wt%, and the content of the lithium oxide is 0.5 to 1.5wt%.
The preparation method comprises the steps of mixing the raw materials, crushing, and obtaining the electromagnetic shielding glass fiber after the preparation process of the crushed particles which are below 5mm and are well known to the person skilled in the art.
The application also provides a rigid circuit board which is prepared from electromagnetic shielding glass fibers, resin and copper foil, wherein the electromagnetic shielding glass fibers are the electromagnetic shielding glass fibers in the scheme.
The application provides an electromagnetic shielding glass fiber, which comprises silicon dioxide, aluminum oxide, boron oxide, calcium oxide, magnesium oxide, sodium oxide, potassium oxide, lithium oxide, iron-based soft magnetic alloy and ferrite. The application introduces the iron-based soft magnetic alloy into the electromagnetic shielding glass fiber, is a magnetic loss wave-absorbing material, and has the advantage of wide electromagnetic shielding range; the ferrite has higher resistivity and can still keep good insulating property after being added into the glass fiber; therefore, the iron-based soft magnetic alloy and ferrite are introduced into the electromagnetic shielding glass fiber, and the ranges of the iron-based soft magnetic alloy and the ferrite are adjusted, so that the obtained electromagnetic shielding glass fiber has the characteristics of wide electromagnetic shielding range or high resistivity according to the service performance of a product, and the corresponding resistivity or electromagnetic shielding range is not affected, and the performance requirement of the product can still be met.
In order to further understand the present invention, the electromagnetic shielding glass fiber provided by the present invention is described in detail below with reference to the following examples, and the scope of protection of the present invention is not limited by the following examples.
Example 1
Silica: 30-45%; aluminum oxide: 25-30%; boron oxide: 1-5%; calcium oxide: 5-10%; magnesium oxide: 7-9%; sodium oxide: 0-3%; potassium oxide: 2-5%; lithium oxide: 0-2%; feSiAl 0.8%; when the Ni-Zn ferrite is 1.5%, the Ni-Zn ferrite is suitable for the environment with low signal rate, large power supply noise and high insulation performance requirement, such as the electronic equipment for medical instruments.
Example 2
Silica: 30-45%; aluminum oxide: 25-30%; boron oxide: 1-5%; calcium oxide: 5-10%; magnesium oxide: 7-9%; sodium oxide: 0-3%; potassium oxide: 2-5%; lithium oxide: 0-2%; fesai 2%; 2.5% of Ni-Zn ferrite is suitable for computers.
Example 3
In order to solve the signal interference problem, a PCB with more than 20 layers is generally designed to ensure that stratum is used as shielding signal interference between no signal layer or between the signal layer and the power supply; after the electromagnetic shielding glass fiber is used, as the glass fiber has a shielding function, only 8 layers of signals and 2 layers of power and 2 layers of ground=12 layers are needed. The method is a simple calculation mode for effect benefit. In actual design, the glass fiber has a shielding function, so that the thickness of the PCB can be greatly reduced, and the wiring difficulty of the high-speed signal line is greatly reduced.
In the use example described in the above embodiment 3, if the PCB is a product with low signal rate, large power noise and high insulation performance requirement, such as a medical instrument, the following composition ratio of the electromagnetic shielding glass fiber is applicable: silica: 43.2%; aluminum oxide: 30%; boron oxide: 3%; calcium oxide: 9%; magnesium oxide: 7%; sodium oxide: 0.5%; potassium oxide: 4%; lithium oxide: 1%; feSiAl 0.8%; when the Ni-Zn ferrite is 1.5%, the Ni-Zn ferrite is suitable for the environment with low signal rate, large power supply noise and high insulation performance requirement, such as the electronic equipment for medical instruments.
For example, if the PCB is a product with high signal rate, such as a computer or a switch, the composition ratio of the electromagnetic shielding glass fiber is as follows: silica: 42%; aluminum oxide: 28%; boron oxide: 4%; calcium oxide: 7.5%; magnesium oxide: 8%; sodium oxide: 1.7%; potassium oxide: 4.3%; lithium oxide: 0% of the total weight of the composition; fesai 2%; 2.5% of Ni-Zn ferrite.
The above description of the embodiments is only for aiding in the understanding of the method of the present invention and its core ideas. It should be noted that it will be apparent to those skilled in the art that various modifications and adaptations of the invention can be made without departing from the principles of the invention and these modifications and adaptations are intended to be within the scope of the invention as defined in the following claims.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (10)
1. An electromagnetic shielding glass fiber comprises the following raw materials:
2. the electromagnetic shielding glass fiber of claim 1, wherein the iron-based soft magnetic alloy is selected from one or more of FeSiAl, feSi, feNi and FeCo.
3. The electromagnetic shielding glass fiber according to claim 1, wherein the ferrite is selected from one or both of Mn-Zn ferrite and Ni-Zn ferrite.
4. The electromagnetic shielding glass fiber according to claim 1, wherein the content of the iron-based soft magnetic alloy is 0.6-0.9 wt%.
5. The electromagnetic shielding glass fiber according to claim 1, wherein the ferrite is contained in an amount of 2.5 to 4.0wt%.
6. The electromagnetic shielding glass fiber according to claim 1, wherein the content of the silicon dioxide is 32-40 wt%, and the content of the aluminum oxide is 26-28 wt%.
7. The electromagnetic shielding glass fiber according to claim 1, wherein the content of the boron oxide is 2-4 wt% and the content of the calcium oxide is 6-9 wt%.
8. The electromagnetic shielding glass fiber according to claim 1, wherein the content of the magnesium oxide is 7.5-8.5 wt% and the content of the sodium oxide is 0.5-2.5 wt%.
9. The electromagnetic shielding glass fiber according to claim 1, wherein the content of the potassium oxide is 2.5-4.5 wt% and the content of the lithium oxide is 0.5-1.5 wt%.
10. A rigid circuit board prepared from electromagnetic shielding glass fiber, resin and copper foil, wherein the electromagnetic shielding glass fiber is the electromagnetic shielding glass fiber according to any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210600387.9A CN114804641B (en) | 2022-05-30 | 2022-05-30 | Electromagnetic shielding glass fiber and rigid circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210600387.9A CN114804641B (en) | 2022-05-30 | 2022-05-30 | Electromagnetic shielding glass fiber and rigid circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN114804641A CN114804641A (en) | 2022-07-29 |
| CN114804641B true CN114804641B (en) | 2023-05-19 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202210600387.9A Active CN114804641B (en) | 2022-05-30 | 2022-05-30 | Electromagnetic shielding glass fiber and rigid circuit board |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6197470A (en) * | 1984-10-17 | 1986-05-15 | 鐘淵化学工業株式会社 | Magnetic fiber |
| CN1781864A (en) * | 2004-11-30 | 2006-06-07 | 中国科学院理化技术研究所 | Magnetic glass fiber and its preparing method |
| CN104152105A (en) * | 2014-08-08 | 2014-11-19 | 太仓派欧技术咨询服务有限公司 | Glass fiber cotton with wave absorption property |
| CN114071872A (en) * | 2021-11-18 | 2022-02-18 | Oppo广东移动通信有限公司 | Circuit board assembly, preparation method thereof and electronic equipment |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2509753A (en) * | 2013-01-14 | 2014-07-16 | Bae Systems Plc | Ferrite Fibre Composites |
-
2022
- 2022-05-30 CN CN202210600387.9A patent/CN114804641B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6197470A (en) * | 1984-10-17 | 1986-05-15 | 鐘淵化学工業株式会社 | Magnetic fiber |
| CN1781864A (en) * | 2004-11-30 | 2006-06-07 | 中国科学院理化技术研究所 | Magnetic glass fiber and its preparing method |
| CN104152105A (en) * | 2014-08-08 | 2014-11-19 | 太仓派欧技术咨询服务有限公司 | Glass fiber cotton with wave absorption property |
| CN114071872A (en) * | 2021-11-18 | 2022-02-18 | Oppo广东移动通信有限公司 | Circuit board assembly, preparation method thereof and electronic equipment |
Non-Patent Citations (1)
| Title |
|---|
| 高性能软磁吸波材料的研究进展;王杰;《电子元件与材料》;第40卷(第10期);第975-962页 * |
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| CN114804641A (en) | 2022-07-29 |
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