CN114800969A - Device for accelerating polysulfide glue curing and use method thereof - Google Patents
Device for accelerating polysulfide glue curing and use method thereof Download PDFInfo
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- CN114800969A CN114800969A CN202210454123.7A CN202210454123A CN114800969A CN 114800969 A CN114800969 A CN 114800969A CN 202210454123 A CN202210454123 A CN 202210454123A CN 114800969 A CN114800969 A CN 114800969A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
- B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
- B29C35/04—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould using liquids, gas or steam
- B29C35/041—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould using liquids, gas or steam using liquids
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
- B29C35/007—Tempering units for temperature control of moulds or cores, e.g. comprising heat exchangers, controlled valves, temperature-controlled circuits for fluids
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- Health & Medical Sciences (AREA)
- Oral & Maxillofacial Surgery (AREA)
- Thermal Sciences (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The application relates to a device for accelerating polysulfide glue curing and a using method thereof. The device for accelerating the curing of the polysulfide glue comprises a bonding tool, a constant-temperature liquid supply assembly, a temperature sensor and a temperature controller. The bonding tool comprises an upper die and a lower die, the upper die and the lower die are assembled to form a die cavity, a liquid inlet pipeline communicated with the die cavity is arranged in the upper die, and a liquid outlet pipeline communicated with the die cavity is arranged in the lower die. The constant-temperature liquid supply assembly is connected with the liquid inlet pipeline and the liquid outlet pipeline. The temperature sensor is arranged in the die cavity and used for sensing the temperature of liquid in the die cavity. The temperature controller is electrically connected with the constant-temperature liquid supply assembly and the temperature sensor and is used for controlling the temperature of liquid in the cavity. The application provides the liquid that has the temperature for the die cavity through the liquid subassembly is supplied to the constant temperature, and these liquid are glued with the temperature transfer to polysulfide, so can improve the solidification rate of polysulfide glue, improve production efficiency greatly. And this application convenient operation, the practicality is strong.
Description
Technical Field
The present disclosure relates to curing devices, and particularly to a device for accelerating curing of polysulfide glue and a method for using the same.
Background
The polysulfide glue has excellent waterproof performance, and the polysulfide glue is coated on the edge of the glass, so that the permeation and erosion of water vapor can be reduced, and the service life of the glass is prolonged. When the polysulfide glue is bonded, under the environment of 10-30 ℃, the polysulfide glue needs to be cured for 72 hours, cured for 24 hours at 40 ℃ and cured for 4 hours at 70 ℃ to be completely cured and obtain the optimal bonding force.
In the process of implementing the application, the applicant finds that the polysulfide glue can be cured at a temperature of more than 70 ℃ so as to be accelerated, but if the laminated glass is placed in an environment of more than 70 ℃ for a long time, the glue layer of the glue layer can be softened or other defects are generated, and under the condition of contradiction between the two, the polysulfide glue is long in waiting time for curing in the production process, so that a mold is occupied for a long time, and the productivity is reduced.
Disclosure of Invention
The embodiment of the application provides a device for accelerating polysulfide glue curing and a using method thereof, so as to solve the problem that the time for waiting for curing in the polysulfide glue production process is long.
In order to solve the above technical problem, the present application is implemented as follows:
in a first aspect, a device for accelerating polysulfide glue curing is provided, which comprises a bonding tool, a constant-temperature liquid supply assembly, a temperature sensor and a temperature controller. The bonding tool is used for fixing the gluing piece and comprises an upper die and a lower die, the upper die and the lower die are assembled to form a die cavity, a liquid inlet pipeline communicated with the die cavity is arranged in the upper die, and a liquid outlet pipeline communicated with the die cavity is arranged in the lower die; the constant-temperature liquid supply assembly is used for supplying liquid into the die cavity and is connected with the liquid inlet pipeline and the liquid outlet pipeline; the temperature sensor is used for sensing the temperature of the liquid in the die cavity and is arranged in the die cavity; the temperature controller is used for controlling the liquid temperature in the control cavity, and the temperature controller is electrically connected with the constant-temperature liquid supply assembly and the temperature sensor.
In a first possible implementation manner of the first aspect, the constant-temperature liquid supply assembly includes a liquid supply part, a liquid inlet pipe and a liquid outlet pipe, the liquid supply part is connected to the liquid inlet pipe through the liquid inlet pipe, the electromagnetic valve is disposed on the liquid inlet pipe and the liquid outlet pipe, the liquid supply part is connected to the liquid outlet pipe through the liquid outlet pipe, and the temperature controller is electrically connected to the liquid supply part.
With reference to the first possible implementation manner of the first aspect, in a second possible implementation manner of the first aspect, the liquid supply part further includes a constant temperature water tank and an electromagnetic valve, the constant temperature water tank is connected to the liquid inlet pipe and the liquid outlet pipe, and the temperature controller is electrically connected to the electromagnetic valve.
In a third possible implementation manner of the first aspect, the bonding tool further comprises a locking member, and the locking member is used for locking the upper die and the lower die.
In a fourth possible implementation of the first aspect, the cross-section of the mold cavity is ㄈ -shaped.
In a fifth possible implementation manner of the first aspect, the liquid inlet pipe and the liquid outlet pipe use S-shaped metal pipes.
In a sixth possible implementation manner of the first aspect, a mounting hole is formed in the lower die, one end of the temperature sensor is located in the die cavity, and the other end of the temperature sensor is located in the mounting hole and connected with the temperature controller through an electric connection line.
In a seventh possible implementation form of the first aspect, the glue applied comprises laminated glass and a polysulfide glue, the polysulfide glue being applied to the laminated glass.
In a second aspect, there is provided a method for using the apparatus for accelerating the curing of polysulfide glue according to any one of the above first aspects, which comprises the following steps: placing the glue applying piece into a bonding tool, closing the upper die and the lower die, and locking, wherein the polysulfide glue of the glue applying piece is positioned in the die cavity; opening the temperature controller and the constant-temperature liquid supply assembly, wherein the constant-temperature liquid supply assembly supplies liquid to the die cavity in a circulating manner through the liquid inlet pipeline and the liquid outlet pipeline; and when the temperature sensor reaches the preset temperature, a feedback signal is sent to the temperature controller, the temperature controller controls the constant-temperature liquid supply assembly to stop circulating liquid supply, and the liquid is sealed in the mold cavity to cure the polysulfide glue.
In a first possible implementation manner of the second aspect, when the temperature of the liquid in the mold cavity is lower than the preset temperature, the temperature sensor sends another feedback signal to the temperature controller, and the temperature controller controls the constant-temperature liquid supply assembly to circularly supply liquid into the mold cavity.
Compared with the prior art, the application has the advantages that:
according to the device for accelerating polysulfide glue curing and the using method thereof, the constant-temperature liquid supply assembly is used for providing liquid with temperature for the mold cavity, and the liquid transfers the temperature to the polysulfide glue, so that the curing speed of the polysulfide glue can be improved, the production efficiency is greatly improved, and the problem of slow curing after the polysulfide glue is coated on laminated glass is solved. And this application convenient operation, the practicality is strong.
Drawings
The accompanying drawings, which are included to provide a further understanding of the application and are incorporated in and constitute a part of this application, illustrate embodiment(s) of the application and together with the description serve to explain the application and not to limit the application. In the drawings:
FIG. 1 is a schematic view of an apparatus for accelerating the cure of polysulfide glue in accordance with one embodiment of the present application;
fig. 2 is a flowchart illustrating the steps of a method for using an apparatus for accelerating the curing of polysulfide glue according to an embodiment of the present application.
Detailed Description
For curing in the polysulfide glue production process, the conventional solution is to put glass and a mold into an oven together, set the temperature at 40 ℃, keep the temperature for 48 hours, and cure the glass for a long time, or arrange an electric heating wire in a metal mold, heat and cure the glass, but because the metal is conductive, the electric leakage risk exists.
This application provides the liquid with the temperature for the die cavity through the constant temperature liquid supply subassembly, and these liquid transfer the temperature to on the polysulfide glue, so compare in traditional oven solidification mode speed faster, also safer than traditional heating wire heating.
To make the objects, technical solutions and advantages of the present application more clear, embodiments of the present application will be described in further detail below with reference to the accompanying drawings.
It should be noted that the terms "upper", "lower", "left", "right", and the like used in the embodiments of the present application are described in terms of the angles shown in the drawings, and should not be construed as limiting the embodiments of the present application. In addition, in this context, it will also be understood that when an element is referred to as being "on" or "under" another element, it can be directly on "or" under "the other element or be indirectly on" or "under" the other element via an intermediate element.
Please refer to fig. 1, which is a schematic diagram of an apparatus for accelerating polysulfide glue curing according to an embodiment of the present application; as shown in the figure, the device 1 for accelerating the curing of polysulfide glue comprises a bonding tool 2, a constant-temperature liquid supply assembly 3, a temperature sensor 4 and a temperature controller 5. The bonding tool 2 is used for fixing the gluing part S so as to cure the gluing part S. The bonding tool 2 includes an upper die 21 and a lower die 22. The upper mold 21 and the lower mold 22 are clamped to form a cavity 23. In the present embodiment, the bonding tool 2 further includes a locking member 24, and the locking member 24 is used for locking the upper mold 21 and the lower mold 22. The locking member 24 is constructed using a bolt and nut structure, but not limited thereto.
In one embodiment, the polysulfide glue S2 is coated on the upper and lower surfaces of the left side of the laminated glass S1, the polysulfide glue S2 and the laminated glass S1 form a glue applying part S, the laminated glass S1 is obliquely fixed on the lower mold 22, the upper mold 21 and the lower mold 22 are matched and the glue applying part S is fixed in a clamping manner, the upper mold 21 and the lower mold 22 are matched to form the mold cavity 23, the cross section of the mold cavity 23 is ㄈ -shaped, the polysulfide glue S2 is located in the mold cavity 23, and the locking part 24 locks the upper mold 21 and the lower mold 22, so that the glue applying part S is fixed.
A liquid inlet pipeline 211 communicated with the die cavity 23 is arranged in the upper die 21, a liquid outlet pipeline 221 communicated with the die cavity 23 is arranged in the lower die 22, and the liquid inlet pipeline 211 and the liquid outlet pipeline 221 are used for realizing circulating liquid supply for the die cavity 23. In this embodiment, the liquid inlet pipe 211 and the liquid outlet pipe 221 use S-shaped metal pipes, which are arranged to facilitate heating the upper mold 21 and the lower mold 22, and improve the heating efficiency, but not limited thereto.
The constant temperature liquid supply assembly 3 is used for supplying liquid into the mold cavity 23, and heating the polysulfide glue S2 through the liquid so as to increase the curing speed of the polysulfide glue S2. The constant-temperature liquid supply assembly 3 is connected with the liquid inlet pipeline 211 and the liquid outlet pipeline 221. In this embodiment, the constant temperature liquid supply assembly 3 includes a liquid supply member 31, a liquid inlet pipe 32 and a liquid outlet pipe 33, the liquid supply member 31 is connected to the liquid inlet pipe 211 through the liquid inlet pipe 32, and the liquid supply member 31 is connected to the liquid outlet pipe 221 through the liquid outlet pipe 33. The liquid supply member 31 supplies liquid into the mold cavity 23 sequentially through the liquid inlet pipe 32 and the liquid inlet pipeline 211, and the liquid in the mold cavity 23 flows back to the liquid supply member 31 sequentially through the liquid outlet pipeline 221 and the liquid outlet pipe 33.
As described above, in the present embodiment, the liquid supply member 31 includes the constant temperature water tank 311 and the solenoid valve 312. The constant temperature water tank 311 is connected to the liquid inlet pipe 32 and the liquid outlet pipe 33. The electromagnetic valve 312 is disposed on the liquid inlet pipe 32 and the liquid outlet pipe 33, and the electromagnetic valve 312 is used for controlling the on-off of the liquid inlet pipe 32 and the liquid outlet pipe 33.
Specifically, when the constant-temperature liquid supply assembly 3 supplies liquid into the mold cavity 23 and the electromagnetic valve 312 is powered on, the liquid inlet pipe 32 and the liquid outlet pipe 3 are in a passage state, and the constant-temperature water tank 311 circularly supplies liquid into the mold cavity 23; when the constant-temperature liquid supply assembly 3 stops supplying liquid into the die cavity 23 and the electromagnetic valve 312 is powered off, the liquid inlet pipe 32 and the liquid outlet pipe 3 are in an open circuit state, and the constant-temperature water tank 311 stops supplying liquid into the die cavity 23 in a circulating mode.
The temperature sensor 4 is used for sensing the temperature of the liquid in the mold cavity 23, and the temperature of the liquid in the mold cavity 23 is ensured to be kept in a constant temperature state through feedback of the temperature sensor 4. The temperature sensor 4 is disposed in the cavity 23. In the present embodiment, the lower mold 22 is provided with a mounting hole 222, one end of the temperature sensor 4 is located in the mold cavity 23, and the other end of the temperature sensor 4 is located in the mounting hole 222 and is connected to the temperature controller 5 through the electrical connection line 41.
Specifically, the temperature sensor 4 is placed in a mounting hole 222 reserved in the lower die 22 and attached to the lower die 22, a lower end electrical connection wire 41 of the temperature sensor 4 penetrates through the mounting hole 222 to be connected with the temperature controller 5, the temperature sensor 4 feeds back the sensed temperature to the temperature controller 5 through the electrical connection wire 41, and the temperature controller 5 controls the constant-temperature liquid supply assembly 3 according to the feedback signal.
The temperature controller 5 is used to control the temperature of the liquid in the mold cavity 23 to ensure that the polysulfide glue S2 cures at a constant temperature. The temperature controller 5 is electrically connected with the constant-temperature liquid supply component 3. In the present embodiment, the temperature controller 5 is electrically connected to the liquid supply member 31. Specifically, the temperature controller 5 is electrically connected to the electromagnetic valve 312, and the temperature controller 5 controls the liquid supply state of the constant temperature water tank 311 to the cavity 23 by controlling the on/off of the electromagnetic valve 312.
Referring to fig. 2 and also to fig. 1, fig. 2 is a flowchart illustrating steps of a method for using an apparatus for accelerating polysulfide glue curing according to an embodiment of the present application; as shown in the figure, the method 6 for using the apparatus for accelerating the curing of polysulfide glue includes the following steps 601 to 603. Wherein:
in step 601, the fixed sizing element S is installed. And placing the glue application piece S into the bonding tool 2, closing the upper die 21 and the lower die 22, and locking, wherein the polysulfide glue of the glue application piece S is positioned in the die cavity 23.
Specifically, the polysulfide glue S2 is coated on the upper and lower surfaces of the left side of the laminated glass S1, the polysulfide glue S2 and the laminated glass S1 form a sizing member S, then the laminated glass S1 is obliquely fixed on the lower mold 22, the upper mold 21 and the lower mold 22 are clamped to fix the sizing member S in a clamping manner, the polysulfide glue S2 is located in the mold cavity 23, and finally the locking member 24 locks the upper mold 21 and the lower mold 22.
Step 602, a liquid is circulated into the mold cavity 23. And opening the temperature controller 5 and the constant-temperature liquid supply assembly 3, and circularly supplying liquid to the mold cavity 23 by the constant-temperature liquid supply assembly 3 through the liquid inlet pipeline 211 and the liquid outlet pipeline 221 to heat the polysulfide glue S2.
Specifically, the temperature controller 5 and the constant temperature water tank 311 are opened, the electromagnetic valve 312 is powered on by the temperature controller 5, water or other liquid with temperature in the constant temperature water tank 311 sequentially passes through the liquid inlet pipe 32 and the liquid inlet pipeline 211 to supply liquid into the mold cavity 23, and the liquid temperature is preferably 70 ℃, but not limited thereto. The liquid in the mold cavity 23 flows back to the constant temperature water tank 311 through the liquid outlet pipe 221 and the liquid outlet pipe 33 in sequence, and the liquid heats the upper mold 21, the lower mold 22 and the polysulfide glue S2 in the flowing-out and flowing-in processes.
And step 603, stopping circulating liquid supply. And when the temperature sensor 4 reaches the preset temperature, sending a feedback signal to the temperature controller 5, and controlling the constant-temperature liquid supply assembly 3 to stop circulating liquid supply by the temperature controller 5, sealing the liquid in the mold cavity 23, and curing the polysulfide glue S2.
Specifically, after the temperature sensor 4 reaches the set temperature, the temperature sensor 4 feeds back to the temperature controller 5 through the electric connection line 41, after the temperature controller 5 receives a feedback signal, the electromagnetic valve 312 is powered off, the constant-temperature water tank 311 stops supplying liquid into the mold cavity 23, the liquid is sealed in the mold cavity 23, and the liquid transmits the temperature to the polysulfide glue S2, so that the curing speed of the polysulfide glue S2 is improved.
Further, when the temperature of the liquid in the mold cavity 23 is lower than the preset temperature, the temperature sensor 4 sends another feedback signal to the temperature controller 5, and the temperature controller 5 controls the constant-temperature liquid supply assembly 3 to circularly supply liquid into the mold cavity 23.
Specifically, after the temperature sensor 4 is lower than the set temperature, the temperature sensor 4 feeds back to the temperature controller 5 through the electrical connection line 41, after the temperature controller 5 receives another feedback signal, the temperature controller 5 energizes the electromagnetic valve 312, and the constant-temperature water tank 311 supplements the temperature to the liquid in the mold cavity 23 until the preset temperature is reached, the step 603 is repeated, and the process is repeated until the curing is completed.
In summary, the present application provides an apparatus for accelerating the curing of polysulfide glue and a method of using the same. The application provides the liquid that has the temperature for the die cavity through the constant temperature confession liquid subassembly, and these liquid transmit the temperature to the polysulfide glue, so can improve the curing speed of polysulfide glue, improve production efficiency greatly to solve the slow problem of solidification after coating the polysulfide glue coating on laminated glass. And this application convenient operation, the practicality is strong.
It should be noted that, in this document, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.
While the present embodiments have been described with reference to the accompanying drawings, it is to be understood that the invention is not limited to the precise embodiments described above, which are meant to be illustrative and not restrictive, and that various changes may be made therein by those skilled in the art without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (10)
1. An apparatus for accelerating the cure of polysulfide glue, comprising:
the bonding tool is used for fixing a glue applying piece and comprises an upper die and a lower die, the upper die and the lower die are assembled to form a die cavity, a liquid inlet pipeline communicated with the die cavity is arranged in the upper die, and a liquid outlet pipeline communicated with the die cavity is arranged in the lower die;
the constant-temperature liquid supply assembly is used for supplying liquid into the die cavity and is connected with the liquid inlet pipeline and the liquid outlet pipeline;
the temperature sensor is used for sensing the temperature of the liquid in the die cavity and is arranged in the die cavity;
and the temperature controller is used for controlling the temperature of the liquid in the die cavity, and is electrically connected with the constant-temperature liquid supply assembly and the temperature sensor.
2. The apparatus as claimed in claim 1, wherein the constant temperature liquid supply assembly includes a liquid supply member, a liquid inlet pipe and a liquid outlet pipe, the liquid supply member is connected to the liquid inlet pipe through the liquid inlet pipe, the liquid supply member is connected to the liquid outlet pipe through the liquid outlet pipe, and the temperature controller is electrically connected to the liquid supply member.
3. The apparatus as claimed in claim 2, wherein the liquid supply member further comprises a constant temperature water tank and an electromagnetic valve, the constant temperature water tank is connected to the liquid inlet pipe and the liquid outlet pipe, the electromagnetic valve is disposed on the liquid inlet pipe and the liquid outlet pipe, and the temperature controller is electrically connected to the electromagnetic valve.
4. The device for accelerating the curing of polysulfide glue according to claim 1, wherein said bonding tool further comprises a locking member, said locking member is used for locking said upper mold and said lower mold.
5. The apparatus for accelerating the cure of polysulfide glue of claim 1 wherein the cross-section of said mold cavity is ㄈ -shaped.
6. The apparatus for accelerating the curing of polysulfide glue of claim 1 wherein S-shaped metal lines are used for said liquid inlet line and said liquid outlet line.
7. The apparatus for accelerating the curing of polysulfide glue according to claim 1, wherein said lower mold has a mounting hole, one end of said temperature sensor is located in said mold cavity, and the other end of said temperature sensor is located in said mounting hole and connected to said temperature controller through an electrical connection line.
8. The apparatus for accelerating the cure of polysulfide glue of claim 1, wherein said applicator comprises a laminated glass and a polysulfide glue applied to said laminated glass.
9. Use of the device for accelerating the curing of polysulfide glue according to any of claims 1 to 8, characterized in that it comprises the following steps:
placing the gluing piece into the bonding tool, closing the upper die and the lower die, and locking, wherein the polysulfide glue of the gluing piece is positioned in the die cavity;
opening the temperature controller and the constant-temperature liquid supply assembly, wherein the constant-temperature liquid supply assembly supplies liquid to the cavity in a circulating manner through the liquid inlet pipeline and the liquid outlet pipeline;
and when the temperature sensor reaches a preset temperature, a feedback signal is sent to the temperature controller, the temperature controller controls the constant-temperature liquid supply assembly to stop circulating liquid supply, liquid is sealed in the die cavity, and the polysulfide glue is cured.
10. The method as claimed in claim 9, wherein when the temperature of the liquid in the mold cavity is lower than the preset temperature, the temperature sensor sends another feedback signal to the temperature controller, and the temperature controller controls the constant-temperature liquid supply assembly to circulate the liquid into the mold cavity.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN202210454123.7A CN114800969B (en) | 2022-04-27 | 2022-04-27 | Device for accelerating curing of polysulfide glue and application method thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202210454123.7A CN114800969B (en) | 2022-04-27 | 2022-04-27 | Device for accelerating curing of polysulfide glue and application method thereof |
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| CN114800969B CN114800969B (en) | 2023-07-28 |
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